JPH10100458A - Thermal head and production thereof - Google Patents
Thermal head and production thereofInfo
- Publication number
- JPH10100458A JPH10100458A JP25792996A JP25792996A JPH10100458A JP H10100458 A JPH10100458 A JP H10100458A JP 25792996 A JP25792996 A JP 25792996A JP 25792996 A JP25792996 A JP 25792996A JP H10100458 A JPH10100458 A JP H10100458A
- Authority
- JP
- Japan
- Prior art keywords
- glass plate
- head substrate
- thermal head
- head
- adhesive layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Electronic Switches (AREA)
Abstract
Description
【０００１】[0001]
【発明の属する技術分野】この発明は、ファクシミリ、
プリンタ等に使用されるサーマルヘッド及びその製造方
法に関連する。The present invention relates to a facsimile,
The present invention relates to a thermal head used for a printer or the like and a method for manufacturing the same.
【０００２】[0002]
【従来の技術】従来の一般的なサーマルヘッドは、アル
ミナセラミックスなどからなる絶縁基板の上に熱伝導率
の低い材質で保温層を形成し、その上に記録用発熱体と
電極を形成した構成となっている。しかしながら、従来
のサーマルヘッドの構成では、記録初期は印字濃度が低
く見た目に薄いのに対し、ある程度使用するとサーマル
ヘッドの温度が平衡化するため、印字濃度が一定にな
る。このため、印刷初期と印刷開始後一定時間経過した
状態とでは印刷濃度が一定でなく、良好な印刷物が得ら
れない問題がある。この問題は、印字濃度の安定性が重
要な要因であるカラー印刷では特に重要である。前記の
ような従来のサーマルヘッドを有する問題点を解決する
ものとして、例えば、特開平７−５２４３０号公報に
は、高速で高画質の印字が可能となると共に寿命と信頼
性を向上できるサーマルヘッドが開示されている。この
サーマルヘッドは、ＰＴＣで形成されたヘッド基板と、
ヘッド基板の記録用発熱体の表面側に並んで配置された
一対の補助発熱用電極と、ヘッド基板と補助発熱体とを
覆う絶縁体と、絶縁体の上にライン上に形成された記録
用発熱体と、記録用発熱体に接続された記録用電極対
と、記録用発熱体と、記録用電極対とを覆う保護層とを
備えている。このサーマルヘッドのヘッド基板は、Ｂａ
ＴｉＯ3系ＰＴＣセラミックス材料で形成され、ヘッド
基板の上に表面平滑性の優れたガラス層で被覆して、絶
縁体を形成すると共に、絶縁体の上に記録用発熱体及び
電極層を形成している。2. Description of the Related Art A conventional general thermal head has a structure in which a heat insulating layer is formed of a material having low thermal conductivity on an insulating substrate made of alumina ceramic or the like, and a recording heating element and electrodes are formed thereon. It has become. However, in the configuration of the conventional thermal head, the print density is low at the beginning of recording and the print density is low, but when used to some extent, the temperature of the thermal head is equilibrated and the print density is constant. For this reason, there is a problem that the print density is not constant between the initial printing and the state where a certain time has elapsed after the start of printing, and a good printed matter cannot be obtained. This problem is particularly important in color printing where stability of print density is an important factor. As a solution to the above-mentioned problems with the conventional thermal head, for example, Japanese Patent Application Laid-Open No. 7-52430 discloses a thermal head capable of printing at high speed with high image quality and improving the life and reliability. Is disclosed. This thermal head includes a head substrate formed of PTC,
A pair of auxiliary heating electrodes arranged side by side on the surface side of the recording heating element of the head substrate, an insulator covering the head substrate and the auxiliary heating element, and a recording element formed on the insulator on a line. A heating element, a recording electrode pair connected to the recording heating element, a protective layer covering the recording heating element, and the recording electrode pair are provided. The head substrate of this thermal head is Ba
It is formed of a TiO 3 -based PTC ceramic material, and is coated with a glass layer having excellent surface smoothness on the head substrate to form an insulator, and a recording heating element and an electrode layer are formed on the insulator. ing.
【０００３】[0003]
【発明が解決しようとする課題】しかしながら、前記公
報のサーマルヘッドに使用されるＢａＴｉＯ3系ＰＴＣ
セラミックスは、１２３×１０-7／℃と大きい線膨張係
数を有するため、この線膨張係数と同等のガラス材の種
類が少ない。また、この条件を満足するガラスの使用に
際し、ペースト状のガラス粉末を被覆する方法では、熱
処理中に発生する微細な気泡又はボイドを除去すること
が難しいため、研磨処理の有無に拘わらず、０.０１μ
ｍ以下の表面粗さを満足することは難しい。このため、
ヘッド基板と補助発熱体とを覆う絶縁体は、製造工程を
考慮すると、ＰＴＣを構成するＢａＴｉＯ3系セラミッ
クス材料の線膨張係数１２３×１０-7／℃に近い線膨張
係数を有するガラス材料を使用することが難しいという
問題がある。このため、記録用発熱体等を形成するため
に必要な表面粗さ０.０１μｍ以下の表面平滑性をガラ
ス質の絶縁体に与えることはできなかった。更に、Ｂａ
ＴｉＯ3系ＰＴＣセラミックスの線膨張係数に近い線熱
膨張係数を有するガラスとして知られているガラスは、
補助発熱用電極と化学的に反応しやすいという問題があ
る。従って、従来ではサーマルヘッドを製造する場合
に、線膨張係数、表面粗さ又は補助発熱用電極との化学
的安定性のいずれかを犠牲にして製造するしかなく、そ
のためサーマルヘッドの耐久性及び製造歩留まりが極め
て悪かった。そこで、この発明はＢａＴｉＯ3系ＰＴＣ
セラミックス基板を使用し、耐久性及び製造歩留まりを
向上できるサーマルヘッド及びその製造方法を提供する
ことを目的とする。However, the BaTiO 3 -based PTC used in the thermal head disclosed in the above publication is known.
Since ceramics have a large linear expansion coefficient of 123 × 10 −7 / ° C., there are few types of glass materials equivalent to this linear expansion coefficient. Further, when using glass satisfying this condition, it is difficult to remove fine bubbles or voids generated during the heat treatment by the method of coating the paste-like glass powder. .01μ
It is difficult to satisfy a surface roughness of less than m. For this reason,
As an insulator covering the head substrate and the auxiliary heating element, a glass material having a linear expansion coefficient of about 123 × 10 −7 / ° C. of a BaTiO 3 ceramic material constituting PTC is used in consideration of a manufacturing process. There is a problem that it is difficult to do. For this reason, it was not possible to give the glassy insulator the surface smoothness required for forming a recording heating element or the like with a surface roughness of 0.01 μm or less. Furthermore, Ba
Glasses known as glasses having a linear thermal expansion coefficient close to the linear expansion coefficient of TiO 3 -based PTC ceramics include:
There is a problem that it easily reacts chemically with the auxiliary heating electrode. Therefore, conventionally, when manufacturing a thermal head, there is no other way but to sacrifice either the linear expansion coefficient, the surface roughness, or the chemical stability with the auxiliary heating electrode. The yield was extremely poor. Therefore, the present invention provides a BaTiO 3 -based PTC.
It is an object of the present invention to provide a thermal head using a ceramic substrate and capable of improving durability and production yield, and a method for producing the same.
【０００４】[0004]
【課題を解決するための手段】この発明によるサーマル
ヘッドは、ＢａＴｉＯ3系ＰＴＣセラミックスで形成さ
れたヘッド基板と、ヘッド基板に固定された補助発熱用
電極と、０.０１μｍ以下の表面粗さ及び９５×１０-7
／℃〜１５０×１０-7／℃の線膨張係数を有するガラス
板と、ガラス板に取り付けられた記録用発熱体と、ヘッ
ド基板とガラス板との間に配置されヘッド基板とガラス
板とを固着する接着材層とを備えている。この発明の実
施態様では、ガラス板は１１０×１０-7／℃〜１４０×
１０-7／℃の線膨張係数を有する。補助発熱用電極はヘ
ッド基板と接着材層との間又は接着材層とは反対側のヘ
ッド基板の底面に固着される。接着材層は化学的に補助
発熱用電極と反応しない。この発明によるサーマルヘッ
ドの製造方法は、ＢａＴｉＯ3系ＰＴＣセラミックスで
形成されたヘッド基板に補助発熱用電極を固定する工程
と、０.０１μｍ以下の表面粗さ及び９５×１０-7／℃
〜１５０×１０-7／℃の線膨張係数を有するガラス板と
ヘッド基板との間に接着材層を配置して基板組立体を形
成する工程と、基板組立体を加熱炉に配置して接着材層
を溶融し固化させる工程と、ガラス板に記録用発熱体を
取り付ける工程とを含む。ガラス板とヘッド基板との間
に補助発熱用電極を配置して基板組立体を形成する工程
又は接着材層とは反対側のヘッド基板の底面に補助発熱
用電極を固着する工程を含んでもよい。A thermal head according to the present invention comprises a head substrate formed of BaTiO 3 -based PTC ceramics, an auxiliary heating electrode fixed to the head substrate, and a surface roughness of 0.01 μm or less. 95 × 10 -7
A glass plate having a linear expansion coefficient of / ° C. to 150 × 10 −7 / ° C., a heating element for recording attached to the glass plate, and a head substrate and the glass plate disposed between the head substrate and the glass plate An adhesive layer to be fixed. In an embodiment of the present invention, the glass plate is 110 × 10 −7 / ° C. to 140 ×
It has a linear expansion coefficient of 10 -7 / ° C. The auxiliary heating electrode is fixed between the head substrate and the adhesive layer or on the bottom surface of the head substrate opposite to the adhesive layer. The adhesive layer does not chemically react with the auxiliary heating electrode. The method for manufacturing a thermal head according to the present invention includes a step of fixing an auxiliary heating electrode to a head substrate formed of BaTiO 3 -based PTC ceramics, a surface roughness of 0.01 μm or less, and 95 × 10 −7 / ° C.
A step of arranging an adhesive layer between a glass plate having a linear expansion coefficient of about 150 × 10 -7 / ° C. and a head substrate to form a substrate assembly, and arranging the substrate assembly in a heating furnace for bonding A step of melting and solidifying the material layer; and a step of attaching a recording heating element to the glass plate. The method may include a step of forming a substrate assembly by disposing an auxiliary heating electrode between the glass plate and the head substrate, or a step of fixing the auxiliary heating electrode to a bottom surface of the head substrate opposite to the adhesive layer. .
【０００５】０.０１μｍ以下の表面粗さ及び９５×１
０-7／℃〜１５０×１０-7／℃の線膨張係数を有するガ
ラス板を接着材層によりヘッド基板に固着するため、表
面粗さが小さくかつヘッド基板の線膨張係数に近い線膨
張係数のガラス板を使用することができる。[0005] Surface roughness of less than 0.01 µm and 95 × 1
Since a glass plate having a linear expansion coefficient of 0 -7 / ° C to 150 × 10 -7 / ° C is fixed to the head substrate with an adhesive layer, the surface expansion is small and the linear expansion coefficient is close to the linear expansion coefficient of the head substrate. Glass plate can be used.
【０００６】[0006]
【発明の実施の形態】以下、この発明によるサーマルヘ
ッドの実施形態を図１及び図２について説明する。この
発明によるサーマルヘッドは、ＢａＴｉＯ3系ＰＴＣセ
ラミックスで形成されたヘッド基板１と、ヘッド基板１
に固定された補助発熱用電極２と、０.０１μｍ以下の
表面粗さ及び９５×１０-7／℃〜１５０×１０-7／℃の
線膨張係数、好適には１１０×１０-7／℃〜１４０×１
０-7／℃の線膨張係数を有するガラス板３と、ガラス板
３に取り付けられた記録用発熱体４と、ヘッド基板１と
ガラス板３との間に配置されヘッド基板１とガラス板３
とを固着する接着材層５とを備えている。本発明に使用
されるガラス板３としては、例えば、日本電気硝子株式
会社製「マイクロスペーサＭＬ−０５（商品名）」又は
「マイクロスペーサＭＬ−５１２（商品明）」として販
売されている９５×１０-7／℃〜１５０×１０-7／℃の
線膨張係数を有するガラス材料により形成され、研磨加
工により０.０１μｍ以下の表面粗さに形成されたもの
が挙げられる。上記のガラスは二酸化珪素（Ｓｉ
Ｏ2）、酸化マグネシウム（ＭｇＯ）、酸化硼素（Ｂ2Ｏ
3）及び酸化アルミニウム（Ａｌ2Ｏ3）を主成分とする
ものである。補助発熱用電極にニッケル（Ｎｉ）を使用
し接着材層に特殊の樹脂を使用すると、ニッケルが接着
材に化学的に反応してガスを発生し発泡する場合がある
が、接着材層５は化学的に補助発熱用電極２と反応しな
い材料が使用される。この発明によるサーマルヘッドの
製造の際に、まず、ＢａＴｉＯ3系ＰＴＣセラミックス
で形成されたヘッド基板１に補助発熱用電極２を固定す
る。次に、０.０１μｍ以下の表面粗さ及び９５×１０
-7／℃〜１５０×１０-7／℃の線膨張係数を有するガラ
ス板３とヘッド基板１との間に補助発熱用電極２を挟持
する状態で接着材層５を配置して基板組立体を形成す
る。具体的には、ヘッド基板１上に接着材層５を構成す
る補助発熱用電極２と反応しない粉末を被覆し、その上
にガラス板３を載せ、熱処理により接着固化させて、接
着材層５でヘッド基板１上にガラス板３を貼り合わせ
る。その後、基板組立体を加熱炉に配置して接着材層５
を溶融し固化させる。続いて、ガラス板３に記録用発熱
体４を取り付ける。０.０１μｍ以下の表面粗さ及び９
５×１０-7／℃〜１５０×１０-7／℃の線膨張係数を有
するガラス板３を接着材層５によりヘッド基板１に固着
するため、表面粗さが小さく所望の表面平滑性を備えか
つヘッド基板１の線膨張係数に近い線膨張係数のガラス
板３を使用することができる。DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of a thermal head according to the present invention will be described below with reference to FIGS. The thermal head according to the present invention includes a head substrate 1 made of BaTiO 3 -based PTC ceramics,
And an auxiliary heating electrode 2 fixed to a surface roughness of 0.01 μm or less and a linear expansion coefficient of 95 × 10 −7 / ° C. to 150 × 10 −7 / ° C., preferably 110 × 10 −7 / ° C. ~ 140 × 1
A glass plate 3 having a linear expansion coefficient of 0 −7 / ° C., a recording heating element 4 attached to the glass plate 3, and a head substrate 1 and a glass plate 3 disposed between the head substrate 1 and the glass plate 3.
And an adhesive layer 5 for fixing the above. The glass plate 3 used in the present invention is, for example, 95 × sold as “Micro Spacer ML-05 (trade name)” or “Micro Spacer ML-512 (trade name)” manufactured by NEC Corporation. Examples thereof include those formed of a glass material having a linear expansion coefficient of 10 −7 / ° C. to 150 × 10 −7 / ° C. and having a surface roughness of 0.01 μm or less by polishing. The above glass is made of silicon dioxide (Si
O 2 ), magnesium oxide (MgO), boron oxide (B 2 O)
3 ) and aluminum oxide (Al 2 O 3 ) as main components. If nickel (Ni) is used for the auxiliary heating electrode and a special resin is used for the adhesive layer, nickel may chemically react with the adhesive to generate gas and foam, but the adhesive layer 5 A material that does not chemically react with the auxiliary heating electrode 2 is used. When manufacturing the thermal head according to the present invention, first, the auxiliary heating electrode 2 is fixed to the head substrate 1 formed of BaTiO 3 -based PTC ceramics. Next, a surface roughness of 0.01 μm or less and 95 × 10
A substrate assembly in which the adhesive layer 5 is disposed in a state where the auxiliary heating electrode 2 is sandwiched between the glass plate 3 having a linear expansion coefficient of −7 / ° C. to 150 × 10 −7 / ° C. and the head substrate 1 To form Specifically, the head substrate 1 is coated with a powder that does not react with the auxiliary heating electrode 2 constituting the adhesive layer 5, a glass plate 3 is placed thereon, and the adhesive is solidified by heat treatment. To bond the glass plate 3 on the head substrate 1. Thereafter, the substrate assembly is placed in a heating furnace and the adhesive layer 5 is formed.
Is melted and solidified. Subsequently, the recording heating element 4 is attached to the glass plate 3. Surface roughness of less than 0.01 μm and 9
Since the glass plate 3 having a linear expansion coefficient of 5 × 10 −7 / ° C. to 150 × 10 −7 / ° C. is fixed to the head substrate 1 by the adhesive layer 5, the surface roughness is small and the desired surface smoothness is provided. In addition, a glass plate 3 having a linear expansion coefficient close to that of the head substrate 1 can be used.
【０００７】本実施形態の作用効果を列挙すれば次の通
りである。 ［１］ ヘッド基板１とガラス板３との線膨張係数が近
似するため、加熱時にヘッド基板１に反りが発生しな
い。 ［２］ 接着材層５が補助発熱用電極２と化学的に反応
しないため、補助発熱用電極２が劣化しない。 ［３］ 極めて良好なサーマルヘッドを歩留まり良く得
られる。 ［４］ ガラス板の表面粗度が小さいため、紙材等の記
録媒体をサーマルヘッドに対して相対的に円滑に移動す
ることができる。 本実施形態では、ガラス板３とヘッド基板１との間に補
助発熱用電極２を挟持する状態で接着材層５を配置して
基板組立体を形成する例を示したが、補助発熱用電極２
を接着材層５とは反対側のヘッド基板１の底面に固着し
てもよい。The operation and effect of this embodiment are as follows. [1] Since the linear expansion coefficients of the head substrate 1 and the glass plate 3 are close to each other, the head substrate 1 does not warp during heating. [2] Since the adhesive layer 5 does not chemically react with the auxiliary heating electrode 2, the auxiliary heating electrode 2 does not deteriorate. [3] An extremely good thermal head can be obtained with good yield. [4] Since the surface roughness of the glass plate is small, a recording medium such as a paper material can be moved relatively smoothly with respect to the thermal head. In the present embodiment, the example has been described in which the substrate layer is formed by disposing the adhesive layer 5 with the auxiliary heating electrode 2 sandwiched between the glass plate 3 and the head substrate 1. 2
May be fixed to the bottom surface of the head substrate 1 on the side opposite to the adhesive layer 5.
【０００８】[0008]
【実施例】自己温度制御可能で且つ正の抵抗温度係数を
有する感温素子（ＰＴＣ）材料を用いて、成形・焼成に
より縦５０mm、横５０mm、厚さ０.６mmのヘッド基板１
を作製する。ヘッド基板１上に、全体的又は部分的に発
熱させる補助発熱用電極２を銀（Ａｇ）、ニッケル（Ｎ
ｉ）又はアルミニウム（Ａｌ）等の金属で形成する。そ
の後、補助発熱用電極２と化学的に反応しない接着材層
５をヘッド基板１上に印刷する。接着材層５は、ＢａＴ
ｉＯ3系セラミックスで構成されるヘッド基板１の線膨
張係数１２３×１０-7／℃を含む範囲で線膨張係数９５
×１０-7／℃〜１５０×１０-7／℃を有するガラス粉末
をペースト化したガラス接着剤、例えば日本電気硝子株
式会社の磁気ヘッド封着ガラス「ＳＢ−５２４（商品
名）」又は「ＳＢ−６０１（商品名）」を使用できる。
このガラス接着剤は、二酸化珪素（ＳｉＯ2）、酸化マ
グネシウム（ＭｇＯ）及び酸化アルミニウム（Ａｌ
2Ｏ3）を主成分とし、成分中に酸化硼素（Ｂ2Ｏ3）を含
まない。次に、ガラス板３をヘッド基板１に貼り合わ
せ、熱処理する。ガラス板３は、ヘッド基板１の線膨張
係数と近似した線膨張係数９５×１０-7／℃〜１５０×
１０-7／℃を有する。得られたサーマルヘッドは、０.
０５mm／幅５０mm以下の反りで、ガラス３の表面粗さ
０.００８μｍを実現できる。DESCRIPTION OF THE PREFERRED EMBODIMENTS A head substrate 1 having a length of 50 mm, a width of 50 mm and a thickness of 0.6 mm is formed by molding and firing using a temperature-sensitive element (PTC) material which can control its own temperature and has a positive temperature coefficient of resistance.
Is prepared. On the head substrate 1, an auxiliary heating electrode 2 for generating heat entirely or partially is formed of silver (Ag), nickel (N
i) or a metal such as aluminum (Al). Thereafter, an adhesive layer 5 that does not chemically react with the auxiliary heating electrode 2 is printed on the head substrate 1. The adhesive layer 5 is made of BaT
A linear expansion coefficient of 95 × 10 −7 / ° C. for the head substrate 1 made of iO 3 ceramics is 95.
× 10 -7 / ℃ ~150 × 10 -7 / ℃ glass adhesive glass powder to make a paste with, for example, Nippon Electric magnetic head sealing glass Inc. "SB-524 (trade name)" or "SB -601 (product name) ".
This glass adhesive is made of silicon dioxide (SiO 2 ), magnesium oxide (MgO) and aluminum oxide (Al
2 O 3 ) as a main component and does not contain boron oxide (B 2 O 3 ). Next, the glass plate 3 is bonded to the head substrate 1 and heat-treated. The glass plate 3 has a linear expansion coefficient of approximately 95 × 10 −7 / ° C. to 150 ×
10 −7 / ° C. The resulting thermal head is
The glass 3 can have a surface roughness of 0.008 μm with a warp of not more than 05 mm / width of 50 mm or less.
【０００９】[0009]
【発明の効果】前記のように、この発明によるサーマル
ヘッドは、ヘッド基板とガラス板との線膨張係数が近似
するため、使用時に加熱されても機械的変形が小さい。
また、接着材層が補助発熱用電極と化学的に反応しない
ため、補助発熱用電極が劣化しない。このため、サーマ
ルヘッドの寿命が延長され、極めて良好なサーマルヘッ
ドを歩留まり良く得られる。また、ガラス板の表面粗度
が小さいため、使用時に記録媒体をサーマルヘッドに対
して相対的に円滑に移動することができる。As described above, in the thermal head according to the present invention, the linear expansion coefficients of the head substrate and the glass plate are close to each other, so that the mechanical deformation is small even when heated during use.
Further, since the adhesive layer does not chemically react with the auxiliary heating electrode, the auxiliary heating electrode does not deteriorate. For this reason, the life of the thermal head is extended, and an extremely good thermal head can be obtained with good yield. Further, since the surface roughness of the glass plate is small, the recording medium can be moved relatively smoothly with respect to the thermal head during use.
【図１】 この発明によるサーマルヘッドの断面図FIG. 1 is a cross-sectional view of a thermal head according to the present invention.
【図２】 図１のサーマルヘッドの平面図FIG. 2 is a plan view of the thermal head of FIG. 1;
１・・ヘッド基板、 ２・・補助発熱用電極、 ３・・
ガラス板、 ４・・記録用発熱体、 ５・・接着材層、1. Head substrate, 2. Auxiliary heating electrode, 3.
Glass plate, 4 .... heating element for recording, 5 .... adhesive layer,
Claims (8)
成されたヘッド基板と、ヘッド基板に固定された補助発
熱用電極と、 ０.０１μｍ以下の表面粗さ及び９５×１０-7／℃〜１
５０×１０-7／℃の線膨張係数を有するガラス板と、 ガラス板に取り付けられた記録用発熱体と、 ヘッド基板とガラス板との間に配置されヘッド基板とガ
ラス板とを固着する接着材層とを備えたことを特徴とす
るサーマルヘッド。1. A head substrate formed of BaTiO 3 -based PTC ceramics, an auxiliary heating electrode fixed to the head substrate, a surface roughness of 0.01 μm or less, and a surface roughness of 95 × 10 -7 / ° C.
A glass plate having a linear expansion coefficient of 50 × 10 −7 / ° C., a heating element for recording attached to the glass plate, and an adhesive disposed between the head substrate and the glass plate to fix the head substrate and the glass plate together A thermal head comprising a material layer.
×１０-7／℃の線膨張係数を有する請求項１に記載のサ
ーマルヘッド。2. The glass plate is 110 × 10 −7 / ° C. to 140 ° C.
The thermal head according to claim 1, which has a coefficient of linear expansion of × 10 -7 / ° C.
との間又は接着材層とは反対側のヘッド基板の底面に固
着された請求項１に記載のサーマルヘッド。3. The thermal head according to claim 1, wherein the auxiliary heating electrode is fixed between the head substrate and the adhesive layer or on the bottom surface of the head substrate opposite to the adhesive layer.
応しない請求項１に記載のサーマルヘッド。4. The thermal head according to claim 1, wherein the adhesive layer does not chemically react with the auxiliary heating electrode.
成されたヘッド基板に補助発熱用電極を固定する工程
と、 ０.０１μｍ以下の表面粗さ及び９５×１０-7／℃〜１
５０×１０-7／℃の線膨張係数を有するガラス板とヘッ
ド基板との間に接着材層を配置して基板組立体を形成す
る工程と、 基板組立体を加熱炉に配置して接着材層を溶融し固化さ
せる工程と、 ガラス板に記録用発熱体を取り付ける工程とを含むこと
を特徴とするサーマルヘッドの製造方法。5. A step of fixing an auxiliary heating electrode to a head substrate made of BaTiO 3 -based PTC ceramics, comprising: a surface roughness of 0.01 μm or less, and a surface roughness of 95 × 10 −7 / ° C. to 1 ° C.
Disposing an adhesive layer between a glass plate having a linear expansion coefficient of 50 × 10 −7 / ° C. and a head substrate to form a substrate assembly; and disposing the substrate assembly in a heating furnace to form an adhesive. A method for manufacturing a thermal head, comprising: a step of melting and solidifying a layer; and a step of attaching a recording heating element to a glass plate.
×１０-7／℃の線膨張係数を有する請求項５に記載のサ
ーマルヘッドの製造方法。6. The glass plate is 110 × 10 −7 / ° C. to 140.
The method for producing a thermal head according to claim 5, wherein the thermal head has a linear expansion coefficient of 10-7 / C.
用電極を配置して基板組立体を形成する工程又は接着材
層とは反対側のヘッド基板の底面に補助発熱用電極を固
着する工程を含む請求項５に記載のサーマルヘッドの製
造方法。7. A process for forming a substrate assembly by disposing an auxiliary heating electrode between a glass plate and a head substrate, or fixing the auxiliary heating electrode to a bottom surface of the head substrate opposite to the adhesive layer. The method for manufacturing a thermal head according to claim 5, comprising a step.
応しない請求項５に記載のサーマルヘッドの製造方法。8. The method according to claim 5, wherein the adhesive layer does not chemically react with the auxiliary heating electrode.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP25792996A JP3606688B2 (en) | 1996-09-30 | 1996-09-30 | Thermal head and manufacturing method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP25792996A JP3606688B2 (en) | 1996-09-30 | 1996-09-30 | Thermal head and manufacturing method thereof |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH10100458A true JPH10100458A (en) | 1998-04-21 |
| JP3606688B2 JP3606688B2 (en) | 2005-01-05 |
Family
ID=17313165
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP25792996A Expired - Fee Related JP3606688B2 (en) | 1996-09-30 | 1996-09-30 | Thermal head and manufacturing method thereof |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP3606688B2 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109397884A (en) * | 2017-08-17 | 2019-03-01 | 罗姆股份有限公司 | Thermal printing head |
-
1996
- 1996-09-30 JP JP25792996A patent/JP3606688B2/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109397884A (en) * | 2017-08-17 | 2019-03-01 | 罗姆股份有限公司 | Thermal printing head |
| CN109397884B (en) * | 2017-08-17 | 2020-10-16 | 罗姆股份有限公司 | Thermal print head |
Also Published As
| Publication number | Publication date |
|---|---|
| JP3606688B2 (en) | 2005-01-05 |
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