JPH0992105A - Electronic apparatus and manufacture thereof, proximity sensor and manufacture thereof, and coil case - Google Patents

Abstract

PROBLEM TO BE SOLVED: To fill up a case with a resin in a short time in a proximity sensor. SOLUTION: A groove for discharging air is formed in a coil case 7 provided on a front surface of a proximity sensor. An aperture 43 is provided at a clamp part 9 to hold a cord 10 on the back side of a base metal 8. The proximity sensor 1 is kept at a low pressure, and a resin is injected from the aperture 43 at the clamp part 9, thereby the resin can be filled into the case 7 in a short time.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electronic device, and more particularly to an electronic device characterized by a structure for filling a resin, a method for manufacturing the same, a coil case and a proximity sensor, and a method for manufacturing the same.

[0002]

2. Description of the Related Art FIG. 34 is a sectional view showing an example of a conventional high frequency oscillation type proximity sensor. In the conventional proximity sensor 201, a core 202 is provided with an annular groove, and a coil 204 held by a coil spool 203 is embedded in the groove. The core 202 is held on the front surface of a resin coil case 205 as shown in the drawing, and these are housed in a metal case 206. An electronic circuit unit 207 includes an oscillation circuit including the coil 204 and a signal processing unit that detects a decrease in the amplitude of the oscillation, and is mounted on the printed board 208. Then, the coil 204 is mounted on the printed circuit board 208.
After connecting the coil case 20 to stabilize the performance
5, the core 202 side is filled with the primary filling resin 209.
Further, in order to improve the environment resistance, the case of the proximity sensor is filled with the epoxy resin 210. At the time of filling the epoxy resin 210, the resin heated to a high temperature is filled using, for example, a syringe. And the clamp portion 21
1 holds the cord 212 to form a proximity sensor. There is also a case where the proximity sensor is formed by integrally molding a thermoplastic resin without casting and sealing the resin in the case.

[0003]

However, such conventional electronic equipment such as a proximity sensor requires preparation such as stirring of the resin to be injected, and the filling resin is injected into the case using a syringe or the like. However, since it shrinks when cured, it is necessary to refill the shrinked portion with resin. Therefore, there are drawbacks that the number of working steps is large and the curing time is about 1 hour. Furthermore, in the case of integrally molding using a thermoplastic resin, there is a drawback that the injection pressure at the time of molding is high and the internal parts may be damaged.

The present invention has been made by paying attention to the above-mentioned conventional problems, and by performing low-pressure injection molding using a thermosetting resin, electronic devices and proximity devices which can solve such problems can be obtained. An object is to provide a coil case used for a sensor and a proximity sensor.

[0005]

The invention according to claim 1 of the present application is an electronic device in which a case is filled with an electronic component and a resin, wherein the case has a resin injection port on one end side and the other end. It is characterized in that the side has a passage for communicating the inside and outside of the case.

According to a second aspect of the present invention, the electronic component is housed, the case has a resin injection port at one end and an opening at the other end, and the case is covered so that the inside and outside of the case communicate with each other. And a lid portion having a passage for allowing the passage.

According to a third aspect of the present invention, a case having an electronic component housed therein, a resin injection port at one end side and an opening at the other end side, and a resin filled inside the case are provided. A lid covering the opening of the case, and a passage is provided between the case and the lid for communicating the inside and outside of the case.

In the invention of claim 4 of the present application, the case is a cylindrical body having openings at both ends, and the case has a clamp portion attached to the opening on one end side and the opening on the other end side of the case. The lid part is attached, and the clamp part has a through hole for penetrating a cord and a resin injection port for injecting resin into the case.

According to a fifth aspect of the present invention, there is provided a tubular case,
While holding the coil housed at one end of the tubular case, a coil case having an air outflow groove provided between the tubular case and the tubular case, and holding a cord provided at the other end of the tubular case, And a clamp part having an opening for resin filling.

According to a sixth aspect of the present invention, there is provided a tubular case,
While holding the coil housed at one end of the tubular case, a coil case having an air outflow groove provided between the tubular case and the tubular case, and holding a cord provided at the other end of the tubular case, A clamp part having an opening for resin filling, a printed circuit board on which an oscillation circuit fixed to the coil case and connected to the coil is mounted, and a shield film enclosing the printed circuit board are provided. It is characterized in that an opening is provided near the coil case.

According to a seventh aspect of the present invention, an electronic component is formed by housing an electronic component and filling a resin into a case having a resin injection port at one end and a passage communicating the inside and outside of the case at the other end. A method of manufacturing a device, comprising a step of exhausting air in the case from the passage to reduce the pressure in the case,
Injecting resin into the case from the resin injection port,
It is characterized by having.

The invention according to claim 8 of the present application is a method of manufacturing an electronic device, wherein electronic parts are housed, and a case having a resin injection port at one end and an opening at the other end is filled with resin. , A step of mounting the lid so that there is a gap in the opening of the case for air outflow with the case, a step of discharging air from the gap to lower the pressure in the case, and the inside of the case from the resin injection port And a step of injecting a resin into the resin.

According to a ninth aspect of the present invention, a coil case having an air outflow groove is attached to one end of the tubular case, a cord is held at the other end of the tubular case, and an opening for resin filling is provided. A proximity sensor is configured by attaching a clamp part having the proximity sensor, holding the proximity sensor in a mold to reduce the pressure in the cylindrical case, and injecting resin from a resin filling opening of the clamp part It is characterized in that the inside is filled with a resin.

According to a tenth aspect of the present invention, the primary filling resin is poured into the coil case in a state where the electronic component including the coil is housed in the coil case, and after the primary filling resin is solidified, the coil case is tubular. Attach it to one end of the case,
While holding the cord at the other end of the tubular case, a clamp part having an opening for resin filling is attached to form a proximity sensor, and the proximity sensor is held in a mold to move the inside of the tubular case. It is characterized in that the proximity sensor is filled with resin by setting a low pressure and injecting the resin from the resin filling opening of the clamp portion.

The invention of claim 11 of the present application is a cylindrical member with a bottom, which corresponds to a first linear projection intermittently provided on the outer peripheral surface thereof and a projection of the first linear projection. A second linear protrusion having an air outflow groove formed at an interrupted position and connecting intermittently.

The invention of claim 12 of the present application is characterized in that a groove for resin accumulation is formed between the first and second linear projections.

[0017]

1 is an assembly configuration diagram of a proximity sensor according to a first embodiment of the present invention, and FIG. 2 is a vertical sectional view thereof. As shown in these figures, in the proximity sensor 1 according to the present embodiment, an annular groove is formed in a core 2, and a coil 4 wound around a coil spool 3 has a core 2 inside.
It is stored in the annular groove of. An elongated printed board 5 is connected to the back surface of the core 2 as shown in the drawing, and a shield film 6 covering the oscillation circuit portion of the printed board 5 is provided. The core 2 is housed in the coil case 7. The coil case 7 is a bottomed cylindrical member made of resin. On the inner peripheral portion of the coil case 7, there is formed a protrusion as shown in the drawing, which will be described later. The coil case 7 is housed in the base metal fitting 8. The base metal fitting 8 is a metal cylindrical case having an opening on both sides with a thread groove formed on the outer circumference, and a clamp portion 9 is attached to the back surface thereof. The clamp portion 9 is a resin member and holds the cord 10.

Next, the coil case 7 will be described in more detail. The coil case 7 is a side view in FIG. 3A, and FIG.
Fig. 4 is a longitudinal sectional view thereof, Fig. 4 is a sectional view taken along line AA, and Fig. 5 is a sectional view thereof.
As shown in the enlarged cross-sectional view taken along the line B, this is a cylindrical member having a U-shaped cross section with the front surface covered. Then, as shown in the drawing, first linear projections 21a to 21d for preventing resin leakage are provided on the inner peripheral surface accommodated in the metal case 8. The linear protrusions 21a to 21d for preventing resin leakage are linear protrusions which are intermittently formed at four locations and are formed so as to substantially cover the circumference of the coil case 7. The second linear projection 22a for preventing resin leakage having a length shorter than this is centered on a portion where the linear projections 21a to 21d are further cut out inside thereof.
~ 22d are provided. First and second linear protrusions 21a to
The notched portions of 21d and 22a to 22d become air outflow grooves. Further, projections 23a to 23d having an arcuate cross-section and having the same height as the projections 23a to 23d are provided at the cut-out intermediate positions of the linear projections 21a to 21d. Furthermore, the linear protrusion 22
Protrusions 24a to 24d having an arc-shaped cross section and having the same height as the protrusions 24a to 24d are provided at intermediate positions of a to 22d. When the coil case 7 is press-fitted into the base metal fitting 8, these arc-shaped projections 23a to 23d and 24a to 24d are used to form the coil case 7.
This is to keep the shaft coaxial so that it does not tilt so that the air outflow grooves are not uneven. As shown in FIGS. 3 (a) and 3 (b), the opening end of the coil case 7 has a notch 25a in which only the portions not corresponding to the linear protrusions 22a to 22d are inwardly cut as shown. ~ 25
d. When the coil case 7 is housed in the base metal fitting 8, the innermost portion of the coil case 7 comes into contact with the boundary portion where the wall thickness of the tip of the base metal fitting is slightly thinned and stops. Therefore, the notches 25a to 25d are provided to secure the outflow path of air when the coil case 7 is housed in the base metal fitting 8. Here, an intermediate portion between the linear protrusions 21a to 21d and the linear protrusions 22a to 22d is a groove 26 for resin accumulation.
It has become. Linear protrusions 21a to 21d and 22a to 2
As shown in the enlarged cross-sectional view taken along the line BB of FIG. 3 (a) in FIG.
The inner wall thickness of ~ 22d is configured to be thick.

As shown in FIG. 4, the coil case 7 is inwardly inwardly from the front surface of the proximity sensor inside the cylinder at an angle of 45 ° at the cutout portions of the linear projections 21a to 21d and the intermediate portion thereof. Eight ribs 27a-2 parallel to the cylinder axis
7h is provided. These ribs 27a to 27h are provided to hold the core 2 coaxially with the coil case 7. Further, as shown in FIG. 4, cross-shaped linear protrusions 28a to 28d are provided on the inside of the front surface of the coil case 7.

Next, the detailed structure of the clamp portion 9 will be described with reference to FIGS. The clamp part 9 is shown in FIG.
7A is a front view, FIG. 7B is a side view, FIG. 7A is a bottom view, FIG. 7B is a back view, and FIG. 8 is a longitudinal sectional view. A portion of the clamp portion 9 embedded in the base metal fitting 8 is configured as a cylindrical portion 31 having an outer diameter substantially equal to the inner diameter of the base metal fitting 8, and two strip-shaped projections 32 are provided inside thereof. A flange portion 33 is provided behind it. The rear portion of the flange portion 33 has a substantially semi-conical shape so that the cross section thereof has a substantially triangular shape as shown in FIG.
4 is provided, and a cord holding portion 35 that elastically holds the cord 10 is provided behind it. Code holding unit 35
Is an elongated slit-shaped opening 36 formed at predetermined intervals. The cross section of the cord holding portion 35 is shown in FIG.
As shown in FIGS. 7A and 7B, the cord 10 has an inner diameter corresponding to the outer shape of the cord 10.

Now, the cylindrical portion 3 to be inserted into the base metal fitting 8
As shown in the sectional view of FIG. 8, a guide groove 37 and a taper portion 38 for guiding both ends of the printed circuit board 5 of the proximity sensor are formed on the inner surface of 1. A substrate holding groove 39 is provided on the innermost side of the tapered portion 38. Substrate holding groove 39
Has a width approximately equal to the thickness of the printed circuit board 5 and has linear protrusions 40 formed as shown. The linear protrusion 40 is deformed when the printed circuit board 5 is inserted,
The printed circuit board 5 is fixed. Printed circuit board 5
While being held in the substrate holding groove 39, one surface thereof faces the inner surface of the light guide section 34. At this position of the printed board 5, a display element 41 such as a light emitting diode is provided.
Will be implemented. Printed circuit board 5 on which display element 41 is mounted
When is mounted in the substrate holding groove 39 via the guide groove 37, the upper surface of the display element 41 substantially comes into contact with the inner surface of the light guide portion 34. Even if there is a gap between them, the display element 41
By swelling the transparent resin 42 on the upper surface of the display element 41 in advance as shown in FIG. 8, the light of the display element 41 is guided to the light guide section 34 through the transparent resin 42 and directly or reflected from the light guide section 34. The light is reflected by the surface 34a and emitted to the outside.

As shown in the rear view of FIG. 7A, the clamp portion 9 has an enlarged lateral diameter of the flange portion 33, and an opening 43 is provided inwardly toward the rear surface.
An edge 44 is formed around the opening 43 as shown in FIG. 6 (b). This opening 43 is an opening for injecting a filling resin described later from the outside.

FIG. 9 is a perspective view showing a ring cord attached to the end of the cord 10. The cord 10 is composed of a two-wire or three-wire cable, and either of them is connected to the printed circuit board 5 by a proximity sensor. At this time, if two or three cables are directly drawn from the cord 10, there is a problem that the resin may enter the coating of the cord 10 when the resin is filled, and the diameter of the cord may expand. . This becomes a problem particularly in the case of the three-wire cable type cord shown in FIG. 9 (d) because the resin easily penetrates between the cables. In order to solve this problem, a ring cord is attached to the end of the cord 10 in this embodiment. The ring cord 45, as shown in FIG.
A ring cord 45, which is a resin having a shape corresponding to the shape of the ring cord holding portion 35a of the clamp portion 9, is integrally formed on the end portion of the cord 10 as shown in FIG. 9B. . In this way, the cord 10 to which the ring cord 45 is attached is housed in the cord attaching portion 35 having a step on the back surface of the clamp portion 10 as shown in FIG. 2, and the cord 10 can be reliably prevented from falling off. Become. Further, when the respective cables are pulled out from the ring cord 45 with respect to the cord 10, even in the case of a three-wire type, the three cables are aligned with the mounting positions of the printed circuit board 5, for example, FIG.
It is possible to select an arbitrary position and shape, such as paralleling as shown in (c).

FIG. 10A is an assembly view showing the core 2 housed in the coil case 7 and the coil 4 wound around the coil spool 3, and FIG. 10B is a view seen from the opposite direction. As shown in these figures, the core 2 is formed with an annular groove, and through holes 2a and 2b are provided on the back surface thereof.
The leads 4a and 4b at both ends of the coil are penetrated from the ends of the coil spool through the through holes 2a and 2b, and are connected to an oscillation circuit on a printed circuit board (not shown).

Next, the manufacturing process of the proximity sensor according to this embodiment will be described. The coil 4 wound around the coil spool 3 is stored in the annular groove of the core 2 in advance. Then, the leads 4a and 4b at both ends of the coil 4 are connected to the printed circuit board 5, and the shield film 6 is attached to the printed circuit board 5.
Wrap. Next, in this state, the core 2 is housed in the coil case 7, and is preliminarily filled with the epoxy-based coil portion sealing resin 51 in advance in order to stabilize the coil characteristics. Next, the cord 10 is passed through the base metal fitting 8 and the clamp portion 9, and the terminal of the cord 10 is connected to a predetermined portion of the printed board 5. Next, the coil case 7 is housed in the base metal fitting 8. Then, the upper surface of the display element 41 of the printed board 5 is covered with the transparent resin 42 as described above,
The clamp portion 9 is housed in the inner wall of the base metal fitting 8 so as to be inserted into the guide groove 37 and the holding groove 39 to form a proximity sensor. By doing so, the display element 41 comes into contact with the light guide portion 34 of the clamp portion 9 via the transparent resin 42.

The proximity sensor thus constructed is housed in a mold to be in a vacuum state. By doing so, the inside of the proximity sensor is provided with linear projections 22a to 22d and 21a to 22a of the coil case 7.
Air is sucked to the outside through the air outflow groove in the gap 21d, and the pressure inside the proximity sensor also drops. In this state, the high temperature filling resin is injected from the opening 43 of the clamp portion 9 at a low pressure, for example, 5 to 20 atmospheres. In this way, the filling resin hits the printed circuit board 5, is then filled in the case, and spreads over the entire case. At this time, the proximity sensor can be configured in a short time by selecting the mold temperature to an appropriate value. At this time, the air flows between the linear projections 21a to 21d and 22a to 22d in the direction of arrow C in FIG. 3, but the resin injected at low pressure hits the linear projections 21a to 21d, and as shown in FIG. Since the filling material is collected in the collecting groove 26, the filling material can be retained in the base metal fitting 8 without leaking out of the coil case 7. In this way, the manufacturing time can be significantly shortened and the price can be reduced.

Next, a proximity sensor according to the second embodiment of the present invention will be described. 11 is an assembly configuration diagram of the proximity sensor according to the second embodiment, and FIG. 12 is a vertical sectional view thereof. As shown in these drawings, the clamp portion 61 of the present embodiment is a substantially conical member having an opening at the center as shown in FIG. 11, and the base metal fitting 8 side has a diameter equal to its inner diameter. Is smaller, and the inner diameter of the cord holding portion 62 at the rear end of the proximity sensor is smaller than that of the cord 10. An opening 63 is provided on the side wall of the clamp portion 61. Other configurations are the same as those of the first embodiment.

FIG. 13A is a diagram showing the process of filling the filling resin 52 through the opening 63 of the clamp portion 61 in the second embodiment. As described above, the coil case of the proximity sensor 60 is filled with the primary filling resin for sealing the coil portion indicated by X, and is then held in the mold at a pressure close to vacuum. Then, as the resin indicated by the mark is filled from the opening 63 of the clamp portion 61, air is sucked from the gap of the coil case 7, and accordingly, the filled resin 52 sequentially enters the proximity sensor, as shown in FIG. ), (B) and (c) are filled with resin. At this time, since the inner diameter of the cord holding portion 62 of the clamp portion 61 is the same as that of the cord 10, the resin does not leak from the gap between the cords, and the filling resin 52 can be filled in the case.

Next, a third embodiment of the present invention will be described. The proximity sensor according to the third embodiment is provided with an opening in the shield film 6 so that the resin can be reliably filled. If the shield film 6 is not provided with an opening when the diameter of the proximity sensor is small or the like, it is conceivable that air that cannot be escaped will remain in the region sandwiched between the coil sealing resin and the shield film 6 as shown in FIG. . Therefore, the shield film 6 is provided with an opening, and the other parts are the same as those in the second embodiment.

FIG. 15 is an assembly configuration diagram of the proximity sensor 70 according to the third embodiment, and FIG. 16A is a development view showing an example of a shield film 71 used in this proximity sensor. The shield film 71 is made of a substantially rectangular flexible substrate, and a hairpin pattern 72 is formed on one surface thereof. A projecting portion 73 is provided at one end thereof, and the end portions 74a and 74b of the pattern 72 are provided.
Are formed. Two openings 75a and 75b are provided in the central portion of the conductive pattern of the shield film 71. A double-sided adhesive portion 76 is provided on the right end of the rectangular substrate. Such a shield film 71 is curved so as to wrap the printed circuit board 5 as shown in FIG. 16B, and one end thereof is wrapped and bonded in the area of the double-sided adhesive portion 76. The shield film is wound so that the pair of openings 75a and 75b are located at positions corresponding to both ends of the printed circuit board 5. This can reduce the influence on the electronic circuit section on the printed circuit board 5.

FIG. 17 is a diagram showing a state when resin is filled in the proximity sensor according to the third embodiment configured as described above. When the resin is injected from the opening 63 while the proximity sensor is kept in vacuum as shown in the figure, the resin is sequentially filled from the vicinity of the clamp portion 61.
As shown in (b) and (c), the resin is the coil portion sealing resin 5
1 filling section is reached. At this time, since the through holes 75a and 75b are provided in the shield film 71, air does not remain in the portion sandwiched between the shield film 71 and the printed circuit board 5, and the void is filled with the resin. . This improves the environment resistance of the proximity sensor. Further, like the first embodiment, the resin filling operation can be performed extremely easily and reliably in a short time.

In the third embodiment described above, two openings are formed in the shield film, but at least one opening is formed.
The same effect can be obtained by providing two openings.

Next, a fourth embodiment of the present invention will be described with reference to FIGS. In this embodiment, as shown in FIG. 18, in the proximity sensor according to the first embodiment, the linear protrusions 21a to 21a are formed on the outer circumference of the coil case 7A.
21d, 22a-22d and protrusions 23a-23d, 24a
24d is not provided, but the outer peripheral surface is flat. The notches 25a to 25d are formed in the opening of the coil case as in the first embodiment. In the present embodiment, the coil case 7A is formed so that only its outer peripheral surface is slightly elliptical as shown in FIGS. Then, as shown in the cross-sectional view in the minor axis direction of FIG. 19, the inner peripheral surface of the base metal fitting 8 is circular, so that narrow void portions are formed on both sides thereof. In this embodiment, the void portion is used as a discharge passage for discharging the air in the case. In this way, as in each of the above-described embodiments, when the resin is filled through the opening, air can be discharged through the gap between the coil case 7A and the inner circumference of the base metal fitting 8, so that the case can be filled with the resin. it can. In this embodiment, the outer peripheral surface of the coil case 7A is formed in an elliptical shape as shown in FIG. 20 (a), but this is a perfect circle, and the base metal member 8A is formed as shown in FIG. 20 (b). The inner peripheral surface of may be formed in an elliptical shape. Also in this case, since a gap is formed between the coil case 7A 'and the base metal fitting 8A, air can be discharged from this gap. In this embodiment, this gap is the maximum portion, for example, 0.1 mm to 0.01 mm, and is a gap that allows air to pass through but resin does not easily pass through.

Next, a fifth embodiment of the present invention will be described with reference to FIGS. In the present embodiment, the first
In the proximity sensor according to the embodiment of the present invention, the linear protrusions 21a to 21d, 22a to 22 are provided on the outer circumference of the coil case 7B.
The outer peripheral surface is made flat without providing d or the protrusions 23a to 23d and 24a to 24d. A plurality of through holes 81a to 81d are provided in the edge portion of the tip of the coil case 7B. The number of through holes is not limited to four, and any number may be used, and it is sufficient if the structure is such that the inside and outside of the coil case 7B penetrate. FIG. 22 is a cross-sectional view of the proximity sensor of this embodiment, in which the coil case is not pre-filled with the primary filling resin 51, the core is housed in the coil case, and the core metal 8 is housed in the base metal fitting 8 in proximity. Keep the whole sensor vacuum and open the opening 43
Inject more resin. Then, the air remaining in the case is discharged to the outside from the inner walls of the core 2 and the coil case 7B through the through holes 81a to 81d, and the resin is filled in the case. By doing so, each member in the case can be held at a predetermined position, and the proximity sensor can be configured airtight.

Next, a sixth embodiment of the present invention will be described with reference to FIGS. The proximity sensor according to the present embodiment is a non-shield type proximity sensor, and has a shape in which the coil case 7C projects outside the base metal fitting 8. Therefore, the coil case 7C is similar to the first embodiment in that the linear protrusions 21a to 21d, 22a to 21a.
Although it has 22d etc. as it is, these protrusions are formed near the base metal fitting 8 side. Then, as shown in FIG. 24, in the base metal fitting 8, the recess for holding the inner end surface of the coil case 7C is formed closer to the opening side than in the first embodiment. This makes it possible to fix the coil case 7C to the front opening of the base metal fitting 8 and fill the resin through the opening 43. Also in this embodiment, the air remaining in the case passes through the gap between the coil case 7C and the base metal fitting 8 and is discharged, so that the resin 52 is discharged inside the case.
Can be filled with.

Next, a seventh embodiment of the present invention will be described with reference to FIGS. This embodiment is a non-shield type proximity sensor in which the coil case 7D is not filled with the primary filling resin in advance, but the case is filled with the same resin. In this case, as shown in FIG. 25, the coil case 7D does not need to be provided with a linear protrusion or the like, and a plurality of through holes 82a to 82d are provided at positions close to the front surface thereof. Then, the core is inserted into the coil case 7D, and the printed circuit board and the shield film are attached and fixed to the tip of the base metal fitting 8 as shown in FIG. Then, as in the other embodiments, resin is filled through the opening 43. Then, the air remaining in the case passes through the gap between the coil case 7D and the core 2 and is discharged from the through holes 82a to 82d, so that the case can be filled with resin.

Next, an eighth embodiment will be described with reference to FIGS. 27 and 28. Since the proximity sensor of this embodiment is an unshielded proximity sensor, the coil case 7E
Does not have the linear protrusions 21a to 21d, 22a to 22d, etc., but has through holes 83a to 83d on the outer periphery near the opening. Also in this case, the coil case is attached to the outer peripheral portion of the base metal fitting 8 as shown in FIG. The coil case is previously filled with the primary filling resin 51, and the through holes 83a to 83d are formed on the side of the base metal fitting 8 outside the portion filled with the resin. By doing so, the coil case 7E is attached to the base metal fitting 8, and the other metal parts are mounted in the base metal fitting to fill the resin through the opening 43, thereby filling the resin in the case to form the proximity sensor. .

Next, a ninth embodiment of the present invention will be described with reference to FIG. In this embodiment, assuming that a general electronic device 100 is configured by housing an electronic component 102 in a case 101, a resin injection port 103 is provided at one end of the case 101 and an air flow passage 104 is provided at the other end. To provide. Then, the entire electronic device 101 is evacuated or low pressure, and the resin is injected from the resin injection port 103. In this way, the injected resin quickly enters the case and is easily filled in the case and around electronic components. Here, the air flow passage 104 is preferably provided at a portion symmetrical to the resin injection port of the case 101, for example, at a position symmetrical to the longitudinal direction of the case 101 if the case 101 is a cylindrical type or a rectangular parallelepiped. That is, the resin injection port 103 is the end of the portion of the case where the resin is to be injected, and the other end where the air flow passage 104 is provided is as far as possible from the resin injection port, or when viewed from the center of the case It is a part facing or in the vicinity thereof. Further, the number of the air flow passages 104 is not limited to one, and
You may provide in multiple numbers as shown to (b). In this way, the resin can be spread to every corner in the case 101 by providing the passages in each part. Further, if the pressure in the case can be reduced to a level close to a vacuum when the pressure is reduced, the resin can be sufficiently spread no matter where the air flow passage is provided.

FIG. 30 is a perspective view showing an example of an electronic device 110 according to the tenth embodiment of the present invention. In this embodiment, a case 111 having a rectangular parallelepiped shape and an opening at the top is formed.
A printed circuit board 112 having an electronic circuit section mounted therein is housed therein. Then, the printed board 112 causes the code 113
Is connected and is taken out from the cord take-out port 114. A lid 115 that covers the opening of the case 111 is provided. The lid 115 has a passage 116 for discharging air.
Is provided. It is assumed that the passage 116 is provided with a large number of fine openings 117 as shown in the sectional view of FIG. This passage 116 is used for discharging the air in the case from the passage when the resin is filled from the cord taking-out port 114 for taking out the cord and reducing the pressure. It is desirable that the passage 116 for discharging the air is a fine hole having a size that makes it difficult for the resin to pass through, though the air easily circulates.
As shown in FIG. 30 (b), for example, the structure may be tapered and widened inside the case, or it may be a simple through hole. Then, the case 111 is filled with resin through the cord outlet 114. Alternatively, a filling inlet for injecting resin may be provided on the lid side, and a passage for discharging air may be used on the case side. Further, in this embodiment, the cord outlet 11
Although the resin is injected from No. 4, it goes without saying that the cord outlet and the resin injection port may be provided independently.

FIG. 31 is a diagram showing the structure of an electronic device according to the eleventh embodiment of the present invention. In this figure, as in the tenth embodiment, in the electronic device 120, a printed board 122 is housed in a case 121 having a rectangular parallelepiped shape and an opening at the top, and a cord 123 is taken out from a cord taking-out port 124. In this embodiment, a plurality of notches 125a to 125d are provided on the upper opening side of the case 121 as shown. And the notch 125 of the lid 126 covering the upper opening
Arc-shaped notches 127a to 127d are provided in the portions facing a to 125d, respectively. This way the lid 126
Is attached to the case 121 to seal the inside of the case, and when the entire case is vacuumed or depressurized, air can be discharged from the cutout portion. And the cord outlet 124
When the resin is injected from the inside, the air remaining in the case is discharged from this passage, so that the case can be filled with the resin. In this case the notches 125, 12
7 may be provided only on the case 121 or only on the lid 126.

FIG. 32 is a diagram showing the structure of an electronic device 130 according to the twelfth embodiment of the present invention. In this embodiment, the case 131 is a rectangular parallelepiped case, an opening is provided in the upper surface, and the printed circuit board 132 is housed inside. The cord 13 connected to the printed circuit board 132
3 is taken out from the cord take-out port 134. In this embodiment, a linear protrusion 135 is provided on the edge of the opening of the case 131. That is, as shown in an enlarged view in FIG. 32B, a linear protrusion 135 is formed at a portion where the side surface of the lid comes into contact, and the linear protrusion 135 is intermittently formed to form a gap. In this way, when the lid 136 is attached, the lid 136
Although the linear projections come into contact with the linear projections, but the air flows in the portions where the linear projections are interrupted, this gap can be used as an air discharge port. The opening of the case 131 has an inner periphery provided with a protrusion projecting inward by the thickness of the lid 136, and the lid 136 is fixed to the opening of the case. Here, as shown in FIG. 32C, a groove 137 is formed on the inner wall of the case instead of the linear protrusion 135.
May be provided, and the depth L of the groove 137 may be equal to or larger than the thickness of the lid 136. In this case, air can be discharged from this groove.

FIG. 33 is a diagram showing the structure of an electronic device according to the thirteenth embodiment. In the thirteenth embodiment, a linear protrusion is provided on the lid side. That is, in the electronic device 140 of the present embodiment, the case 141 is a rectangular parallelepiped case, an opening is provided on the upper surface, and the printed circuit board 142 is housed inside the opening. Then, the cord 143 connected to the printed board is taken out from the cord take-out port 144. As shown in the enlarged view of FIG. 33B, the lid 145 is provided with a linear protrusion 146 on its side wall, and the linear protrusion 146 is provided with a plurality of intermittent portions. Also in this case, when the lid 145 is attached to the opening of the case, the interrupted portion of the linear protrusion 146 can be used as a passage for discharging air. Further, as shown in FIG. 33 (c), the lid 145
A groove 147 may be intermittently provided in the groove and used as a passage for discharging air.

The electronic devices described in the ninth to thirteenth embodiments are various electronic devices in which a case is filled with resin and electronic parts are mounted inside the case, for example, not only a proximity sensor but also a photoelectric sensor. It can be applied to various electronic devices such as an ultrasonic sensor, a limit switch, a micro switch, an SSR, and a data carrier having a memory for non-contact data transmission.

[0044]

As described in detail above, according to the inventions of claims 1 to 10 of the present application, when the electronic device or the proximity sensor is filled with the resin, the proximity sensor is kept at a low pressure from the opening. By injecting the resin at a low pressure, the resin can be surely filled in the case. In this case, since the resin is solidified in a short time, the number of working steps is reduced and the manufacturing time can be shortened significantly. In the invention of claim 6,
By providing an opening in the shield film that covers the printed circuit board, it is possible to reliably fill the resin. According to the eleventh and twelfth aspects of the invention, it is possible to provide a coil case suitable for filling the resin into the case at a low pressure.

[Brief description of drawings]

FIG. 1 is an assembly configuration diagram of a proximity sensor according to a first embodiment of the present invention.

FIG. 2 is a vertical sectional view of a proximity sensor according to the present embodiment.

3A is a side view of a coil case of the proximity sensor according to the present embodiment, and FIG. 3B is a vertical sectional view thereof.

FIG. 4 is a cross-sectional view taken along the line AA of the coil case according to the present embodiment.

FIG. 5 is a cross-sectional view taken along line BB of the coil case according to the present embodiment.

FIG. 6A is a front view of a clamp portion according to the present embodiment, and FIG. 6B is a side view thereof.

7A is a bottom view of the clamp portion according to the present embodiment, and FIG. 7B is a rear view thereof.

FIG. 8 is a vertical sectional view of a clamp portion according to the present embodiment.

9A is a perspective view showing a cord, FIG. 9B is a perspective view showing a ring cord according to the present embodiment, FIG.
(D) is the front view.

10A and 10B are assembly diagrams of a core and a coil housed in a coil case.

FIG. 11 is an assembly configuration diagram of a proximity sensor according to a second embodiment of the present invention.

FIG. 12 is a vertical sectional view of the proximity sensor according to the present embodiment.

FIG. 13 is a diagram showing a resin filling state when the proximity sensor according to the second embodiment is filled with resin.

FIG. 14 is a diagram showing a state in which a resin is not completely filled in the second embodiment.

FIG. 15 is an assembly configuration diagram of a proximity sensor according to a third embodiment of the present invention.

FIG. 16 (a) is a development view of a shield film, (b).
FIG. 6 is a cross-sectional view of a proximity sensor wound with a shield film.

FIG. 17 is a diagram showing a state in which resin is filled in the proximity sensor according to the third embodiment.

FIG. 18 is an assembly configuration diagram of a proximity sensor according to a fourth embodiment of the present invention.

FIG. 19 is a vertical sectional view of the proximity sensor according to the present embodiment.

FIG. 20 is a sectional view of a coil case and a base metal fitting according to the present embodiment.

FIG. 21 is an assembly configuration diagram of a proximity sensor according to a fifth embodiment of the present invention.

FIG. 22 is a vertical sectional view of the proximity sensor according to the present embodiment.

FIG. 23 is an assembly configuration diagram of a proximity sensor according to a sixth embodiment of the present invention.

FIG. 24 is a vertical sectional view of the proximity sensor according to the present embodiment.

FIG. 25 is an assembly configuration diagram of a proximity sensor according to a seventh embodiment of the present invention.

FIG. 26 is a vertical sectional view of the proximity sensor according to the present embodiment.

FIG. 27 is an assembly configuration diagram of a proximity sensor according to an eighth embodiment of the present invention.

FIG. 28 is a vertical sectional view of the proximity sensor according to the present embodiment.

29A is a sectional view of an electronic device according to a ninth embodiment of the present invention, and FIG. 29B is a diagram showing another example.

30A is an assembly configuration diagram of an electronic device according to a tenth embodiment of the present invention, and FIG. 30B is a cross-sectional view of a lid portion thereof.

FIG. 31 is an assembly configuration diagram of an electronic device according to an eleventh embodiment of the present invention.

FIG. 32 is an assembly configuration diagram of an electronic device according to a twelfth embodiment of the present invention.

FIG. 33 is an assembly configuration diagram of an electronic device according to a thirteenth embodiment of the present invention.

FIG. 34 is a sectional view showing an example of a conventional proximity sensor.

[Explanation of symbols]

1, 60, 70 Proximity sensor 2 Core 3 Coil spool 4 Coil 5 Printed circuit board 6,71 Shield film 7, 7A, 7B, 7C, 7D, 7E Coil case 8 Base metal fitting 9,60 Clamp member 10 Code 21a-21d 1st Linear protrusions 22a to 22d second linear protrusions 23a to 23d, 24a to 24d protrusions 25a to 25d notch portion 26 resin leak prevention groove 31 cylindrical portion 32 band-shaped protrusion 33 flange portion 34 light guide portion 34a reflective surface 35 Code holding part 36 Opening 37 Guide groove 38 Tapered part 39 Substrate holding groove 40, 135, 146 Linear protrusion 41 Display element 43 Opening 45 Ring code 61 Cylindrical part 62 Code holding part 63, 103 Resin injection port 72 Pattern 73 Projection part 74a, 74b terminal 75a, 75b opening 76 double-sided adhesive portion 8 a-81d, 82a-82d, 83a-83d Through hole 100,110,120,130,140 Electronic device 104 Air flow passage 101,111,121,131,141 Case 115,126,136,145 Lid 116 Passage 125, 127 Notch

 ─────────────────────────────────────────────────── ─── Continuation of the front page (72) Kyoji Kitamura, 10 Hanazono Dodo-cho, Ukyo-ku, Kyoto City, Kyoto Prefecture Omron Co., Ltd. Inside Muron Co., Ltd. (72) Inamichika Nii, 10 Hanazono Dodo-cho, Ukyo-ku, Kyoto-shi, Kyoto Omron Co., Ltd. (72) Inventor Satoshi Noda 10 Odoron-cho, Hanazono-cho, Ukyo-ku, Kyoto City, Kyoto Prefecture Omron Corporation

Claims (12)

[Claims] 1. An electronic device in which a case is filled with an electronic component and a resin, wherein the case has a resin injection port at one end and a passage for communicating the inside and outside of the case at the other end. An electronic device characterized by. 2. A case that accommodates an electronic component and has a resin injection port at one end and an opening at the other end side; and a lid part having a passage that covers the opening of the case and communicates the inside and outside of the case. An electronic device comprising: 3. A case having an electronic component housed therein, having a resin injection port at one end side and an opening at the other end side, a resin filled inside the case, and an opening of the case. An electronic device comprising: a lid, and a passage that connects the inside and the outside of the case is provided between the case and the lid. 4. The case is a tubular body having openings at both ends, the case has a clamp portion attached to an opening on one end side, and the lid portion attached to an opening on the other end side of the case. The electronic device according to claim 2 or 3, wherein the clamp portion includes a through hole through which the cord penetrates and a resin injection port through which resin is injected into the case. 5. A tubular case, a coil case housed at one end of the tubular case to hold a coil, and an air outflow groove provided between the tubular case and the tubular case; A proximity sensor, which is provided at an end, holds a cord, and has a clamp part having an opening for resin filling. 6. A tubular case, a coil case housed at one end of the tubular case to hold a coil, and an air outflow groove provided between the tubular case and the tubular case; A clamp part that is provided at an end and holds a cord and that has an opening for resin filling, a printed circuit board on which an oscillator circuit fixed to the coil case and connected to the coil is mounted, and a shield film that wraps the printed circuit board And a proximity sensor having an opening provided in the vicinity of the coil case of the shield film. 7. A method of manufacturing an electronic device, which is configured such that an electronic component is housed, and a resin is filled in a case having a resin injection port at one end and a passage for communicating the inside and outside of the case at the other end. Discharging the air in the case from the passage to reduce the pressure in the case, and injecting resin into the case from the resin injection port,
A method for manufacturing an electronic device, comprising: 8. A method of manufacturing an electronic device, which is configured such that an electronic component is housed, a resin injection port is provided at one end, and a resin is filled in a case having an opening at the other end. A step of attaching a lid body so as to have a gap for air outflow between them, a step of discharging air from the gap to lower the pressure in the case, and a step of injecting resin into the case from the resin injection port. ,
A method for manufacturing an electronic device, comprising: 9. A coil case having an air outflow groove is attached to one end of the tubular case, a cord is held at the other end of the tubular case, and a clamp portion having an opening for resin filling is attached to be close to the coil case. A sensor is configured to hold the proximity sensor in a mold to reduce the pressure in the cylindrical case, and to inject the resin from the resin filling opening of the clamp part to fill the proximity sensor with the resin. A method for manufacturing a proximity sensor, comprising: 10. A primary filling resin is poured into the coil case in a state where an electronic component including a coil is housed in the coil case, and after the primary filling resin is solidified, the coil case is attached to one end of a tubular case, A cord is held at the other end of the tubular case and a clamp part having an opening for resin filling is attached to form a proximity sensor, and the proximity sensor is held in a mold to reduce the pressure inside the tubular case. A method for manufacturing a proximity sensor, wherein the proximity sensor is filled with the resin by injecting the resin from the resin filling opening of the clamp portion. 11. A bottomed tubular member, wherein a first linear projection intermittently provided on the outer peripheral surface thereof, and an air outflow groove at a position corresponding to the projection of the first linear projection. And a second linear protrusion that is intermittent and formed. 12. The coil case according to claim 11, wherein a groove for resin accumulation is formed between the first and second linear protrusions.