JP6323066B2 - Electronics - Google Patents

Description

  The present invention relates generally to an electronic device, and more specifically to an electronic device having a structure in which a sealing resin is provided in a case body that houses an electronic component.

  With respect to conventional electronic devices, for example, Japanese Patent Laid-Open No. 9-92105 discloses an electronic device and a manufacturing method thereof for the purpose of filling a case with a resin in a short time (Patent Document 1). ).

  In the proximity sensor as an electronic device disclosed in Patent Document 1, a groove for air outflow is formed in a coil case provided on the front surface of the proximity sensor. An opening is formed in the clamp portion that holds the cord behind the base metal fitting. By keeping the proximity sensor at a low pressure and injecting resin from the opening formed in the clamp part, the resin is filled in the case in a short time.

JP-A-9-92105

  As disclosed in Patent Document 1 described above, a structure in which a sealing resin is provided in a case body of a proximity sensor is known. The case body is formed with a through hole used when the case body is filled with resin.

  However, when trying to achieve stress damage caused by sealing resin on electronic parts, etc. using low-hardness resin, sealing resin is used because low-hardness resin generally has a large coefficient of linear expansion. There is a possibility that the battery expands in a high temperature environment and jumps out of the closed case body through the through hole. In this case, the appearance of the proximity sensor is impaired by the sealing resin jumping out of the case body. In addition, there is a concern that the sealing resin that has jumped out of the case body may be mixed into the usage environment of the proximity sensor as a foreign substance, or the sealing performance in the case body due to the sealing resin may be impaired and the water resistance performance of the proximity sensor may be reduced. Also occurs.

  Accordingly, an object of the present invention is to solve the above-described problems and to provide an electronic device that suppresses the ejection of the sealing resin from the case body.

An electronic device according to one aspect of the present invention is provided in a case body that forms an internal space that accommodates an electronic component, and in the internal space so as to seal the electronic component, and is at least 90 × 10 ⁻⁶ / ° C. And a resin part having a linear expansion coefficient. The case body is formed with a through hole that allows communication between the internal space and the external space outside the case body. The electronic device further includes a closing portion provided to close the through hole. The blocking portion is a movable member that is disposed in the internal space so as to overlap the through hole and is provided in contact with the resin portion. The movable member is fitted into the case body so that a gap is formed between the movable member and the case body in the internal space.
The electronic device according to another aspect of the present invention is provided in the internal space so as to seal the electronic component, and a case body that forms the internal space that accommodates the electronic component, and has an electric space of 90 × 10 ⁻⁶ / ° C. or higher. And a resin part having a linear expansion coefficient. The case body is formed with a through hole that allows communication between the internal space and the external space outside the case body. The electronic device further includes a closing portion provided to close the through hole.

  According to the electronic device configured as described above, by providing the closing portion so as to close the through hole, the resin forming the resin portion can be prevented from jumping out to the external space through the through hole.

  Preferably, the case body is formed from a resin material different from the resin portion. The blocking portion is formed from the same resin as the resin material forming the case body.

  According to the electronic device configured as described above, by providing the closing portion that deforms the case body and closes the through hole, it is possible to prevent the resin from jumping out from the case body to the external space.

  Preferably, the case body has an outer surface facing the external space. The blocking portion is provided at a position recessed from the outer surface toward the inner space. Preferably, the case body has an outer surface facing the external space. The blocking portion is provided at a position protruding from the outer surface toward the external space.

  According to the electronic apparatus configured as described above, the case is provided by a blocking portion provided at a position recessed from the outer surface of the case body toward the internal space or a position protruding from the outer surface of the case body toward the external space. The resin can be prevented from jumping out from the body to the external space.

  Preferably, the case body includes a case main body portion and a cover body portion formed of a resin material different from the resin portion. The case main body is formed with a through-hole that allows communication between the internal space inside the case main body and the external space outside. A through-hole is formed in the cover body portion so as to overlap with the through-hole and communicates between the internal space inside the case main body portion and the external space outside. The closing part is formed from the same resin as the resin material forming the cover body part.

  According to the electronic device configured as described above, the cover body portion is deformed to provide the closing portion that closes the through hole, thereby preventing the resin from jumping out from the case body to the external space.

  Preferably, the closing portion is an adhesive sheet that is bonded to the case body so as to close the through hole and is formed of a resin.

  According to the electronic device configured as described above, by providing the adhesive sheet so as to close the through hole, it is possible to prevent the resin from jumping out from the case body to the external space.

  Preferably, the adhesive sheet is welded to the case body. According to the electronic apparatus configured as described above, the pressure-sensitive adhesive sheet can be more firmly fixed to the case body.

  Preferably, the closing portion is a movable member that is disposed in the internal space so as to overlap the through hole and is provided in contact with the resin portion. The movable member is fitted into the case body so that a gap is formed between the movable member and the case body in the internal space.

  According to the electronic device configured as described above, at the time of manufacturing the electronic device, after the resin is filled into the case body, the movable member is displaced from the through hole as the resin filled in the case body contracts. The resin can be prevented from jumping out from the inside of the case into the external space by being moved to a position overlapping with the through hole.

  Preferably, the electronic device further includes a ring cord drawn from the case body. The ring cord includes a cable and a ring member. The cable has a core wire and a covering material that covers the core wire, and the core wire extends from the longitudinal end of the covering material toward the electronic component and is electrically connected to the electronic component. A ring member is formed so that the edge part of a coating | covering material may be covered by injection molding. The movable member is a ring member. According to the electronic apparatus configured as described above, it is possible to prevent the resin from jumping out from the case body to the external space by using the ring member as the movable member.

  Preferably, the movable member is a connector member provided with pins for external connection of the electronic device. According to the electronic apparatus configured as described above, it is possible to prevent the resin from jumping out of the case body to the external space by using the connector member as the movable member.

Electronics in accordance with another aspect of the present invention, a case forming an inner space for accommodating the electronic components, seal the electronic parts, and provided so as to fill the interior space, 90 × 10 ^{- And} a resin part having a linear expansion coefficient of ⁶ / ° C. or higher. The case body has an inner surface that defines an internal space. The case body has a concave shape that is recessed from the inner surface, and the resin gate portion used when filling the internal space with resin, the internal space, and the external space outside the case body communicate with each other, and the resin A communication hole opening in the gate portion is formed. The communication hole has an opening area equal to or smaller than an area corresponding to a circle of φ0.8 mm.
An electronic device according to still another aspect of the present invention is provided so as to seal a case body that forms an internal space that accommodates an electronic component, and to fill the internal space. ^And a resin part having a linear expansion coefficient of ⁻⁶ / ° C. or higher. The case body is formed with a through hole that allows communication between the internal space and the external space outside the case body. The electronic device further includes a closing portion provided so as to partially close the through hole. The blocking portion is a movable member that is disposed in the internal space so as to partially overlap the through hole and is provided in contact with the resin portion. The movable member is fitted into the case body so that a gap is formed between the movable member and the case body in the internal space. The opening surface of the through hole that overlaps with the resin portion has an opening area equal to or smaller than the area corresponding to a circle of φ0.8 mm.
An electronic device according to yet another aspect of the present invention is provided in a case body that forms an internal space for housing an electronic component, and the internal space so as to seal the electronic component, and is 90 × 10 ⁻⁶ / ° C. or higher. And a resin part having a linear expansion coefficient. The case body is formed with a through hole that allows communication between the internal space and the external space outside the case body. The electronic device further includes a closing portion provided so as to partially close the through hole. The blocking portion communicates from the external space to the internal space and has an opening area equal to or smaller than an area corresponding to a circle of φ0.8 mm.

  According to the electronic apparatus configured as described above, by providing the through hole with a closing portion having an opening area equal to or less than an area corresponding to a circle of φ0.8 mm, the resin forming the resin portion can jump out to the external space. It can be effectively suppressed.

  As described above, according to the present invention, it is possible to provide an electronic device that suppresses the ejection of the sealing resin from the case body.

It is sectional drawing which shows the electronic device in Embodiment 1 of this invention. It is sectional drawing which expands and shows the range enclosed by the dashed-two dotted line II in FIG. It is sectional drawing which shows the process of providing the blockage | closure structure of the resin gate part in FIG. It is sectional drawing which shows the modification of the obstruction | occlusion structure of the resin gate part in FIG. FIG. 5 is a cross-sectional view illustrating a process of providing a resin gate portion closing structure in FIG. 4. FIG. 5 is another cross-sectional view showing a step of providing a resin gate portion closing structure in FIG. 4. It is another sectional drawing which shows the process of providing the closure structure of the resin gate part in FIG. It is sectional drawing which shows the modification of the electronic device in FIG. It is sectional drawing which shows the example which applied the obstruction | occlusion structure of the resin gate part with which the electronic device in FIG. 1 is provided to the square photoelectric sensor. It is sectional drawing which shows the example which applied the obstruction | occlusion structure of the resin gate part with which the electronic device in FIG. 8 is provided to the square photoelectric sensor. It is sectional drawing which shows the example which applied the obstruction | occlusion structure of the resin gate part with which the electronic device in FIG. 1 is provided to the cable type proximity sensor. It is sectional drawing which shows the example which applied the obstruction | occlusion structure of the resin gate part with which the electronic device in FIG. 8 is provided to the connector type proximity sensor. In the electronic device in Embodiment 2 of this invention, it is sectional drawing which shows the process of providing the obstruction | occlusion part of the resin gate part. It is a top view which shows the process of providing the obstruction | occlusion part of the resin gate part in FIG. It is sectional drawing which shows the electronic device in Embodiment 3 of this invention. FIG. 16 is a plan view of a closing structure of a resin gate portion included in the electronic device in FIG. 15. It is sectional drawing which shows the example which applied the obstruction | occlusion structure of the resin gate part with which the electronic device in FIG. 15 is provided to the square photoelectric sensor. FIG. 16 is a cross-sectional view illustrating an example in which the resin gate portion closing structure included in the electronic device in FIG. 15 is applied to another rectangular photoelectric sensor. It is sectional drawing which shows the example which applied the obstruction | occlusion structure of the resin gate part with which the electronic device in FIG. 15 is provided to the cable type proximity sensor. FIG. 16 is a cross-sectional view illustrating an example in which a closing structure of a resin gate portion included in the electronic device in FIG. 15 is applied to a connector type proximity sensor. It is sectional drawing which shows the electronic device in Embodiment 4 of this invention. FIG. 22 is a cross-sectional view illustrating a process of providing a resin gate portion closing structure included in the electronic device in FIG. 21. It is sectional drawing which shows the example which applied the obstruction | occlusion structure of the resin gate part with which the electronic device in FIG. 21 is provided to the cable type photoelectric sensor. FIG. 24 is a cross-sectional view showing a step of providing a resin gate portion closing structure in FIG. 23. It is sectional drawing which shows the example which applied the obstruction | occlusion structure of the resin gate part with which the electronic device in FIG. 21 is provided to the connector type photoelectric sensor. FIG. 26 is a cross-sectional view showing a step of providing a resin gate portion closing structure in FIG. 25. It is sectional drawing which shows the example which applied the obstruction | occlusion structure of the resin gate part with which the electronic device in FIG. 21 is provided to the cable type proximity sensor. FIG. 28 is a cross-sectional view showing a step of providing a resin gate portion closing structure in FIG. 27. It is sectional drawing which shows the example which applied the obstruction | occlusion structure of the resin gate part with which the electronic device in FIG. 21 is provided to the connector type proximity sensor. FIG. 30 is a cross-sectional view showing a step of providing a resin gate portion closing structure in FIG. 29. It is sectional drawing which shows the obstruction | occlusion structure of the resin gate part with which the electronic device in Embodiment 5 of this invention is provided. It is sectional drawing which shows the modification of the obstruction | occlusion structure of the resin gate part in FIG. FIG. 32 is a cross-sectional view showing another modified example of the resin gate portion closing structure in FIG. 31. 10 is a table showing the relationship between the size of the resin gate portion, whether or not resin can be filled into the case body, and the amount of resin popping out in a comparative example in which the closed portion is not provided in the resin gate portion. 5 is a table showing the relationship between the size of a resin gate portion and the amount of resin popping out in Examples and Comparative Examples in which the resin gate portion is partially closed. It is a perspective view which shows the proximity sensor in Embodiment 6 of this invention. FIG. 37 is an exploded view of the proximity sensor in FIG. 36. It is sectional drawing which shows the proximity sensor along the XXXVIII-XXXVIII line | wire in FIG. It is sectional drawing which shows the proximity sensor along the XXXIX-XXXIX line | wire in FIG. It is a figure which shows the 1st process of the manufacturing method of the proximity sensor in FIG. It is a figure which shows the 2nd process of the manufacturing method of the proximity sensor in FIG. It is a figure which shows the 3rd process of the manufacturing method of the proximity sensor in FIG. It is a figure which shows the 4th process of the manufacturing method of the proximity sensor in FIG. It is a figure which shows the 5th process of the manufacturing method of the proximity sensor in FIG. It is a figure which shows the 6th process of the manufacturing method of the proximity sensor in FIG. It is a perspective view which shows the proximity sensor in Embodiment 7 of this invention. FIG. 47 is an exploded view of the proximity sensor in FIG. 46. It is sectional drawing which shows the proximity sensor along the XLVIII-XLVIII line | wire in FIG. It is a perspective view which shows the proximity sensor in Embodiment 8 of this invention. FIG. 50 is an exploded view of the proximity sensor in FIG. 49. It is sectional drawing which shows the proximity sensor along the LI-LI line | wire in FIG. It is a perspective view which shows the proximity sensor in Embodiment 9 of this invention. FIG. 53 is an exploded view of the proximity sensor in FIG. 52. FIG. 53 is a cross-sectional view showing a proximity sensor along the line LIV-LIV in FIG. 52.

Embodiments of the present invention will be described with reference to the drawings. In the drawings referred to below, the same or corresponding members are denoted by the same reference numerals.

(Embodiment 1)
1 is a cross-sectional view showing an electronic apparatus according to Embodiment 1 of the present invention. 2 is an enlarged cross-sectional view of a range surrounded by a two-dot chain line II in FIG.

  With reference to FIG. 1 and FIG. 2, the electronic device in this Embodiment is various industrial electronic devices used in a factory or a research facility.

  For example, the electronic device in the present embodiment is a detection sensor for detecting the approach or presence of a detection target. Examples of the detection sensor include a proximity sensor, a photoelectric sensor, a fiber sensor (a sensor in which an optical fiber is combined with a photoelectric sensor), and a smart sensor (a sensor in which analysis and information processing capabilities are added to the proximity sensor and the photoelectric sensor). .

  The electronic device in this embodiment includes a case body 501, a resin portion 531, and a closing portion 521. The case body 501 has a housing shape that forms the internal space 530. Case body 501 has an outer surface 502 facing a space (external space) outside case body 501. The shape of the case body 501 is not particularly limited, and may be, for example, a cylindrical shape or a square shape.

  Case body 501 is formed of resin. The case body 501 is made of a resin different from the resin material forming the resin portion 531. Case body 501 is formed of a thermoplastic resin. Examples of the thermoplastic resin include a polybutylene terephthalate resin or a polycarbonate resin.

  The case body 501 accommodates an electronic component (not shown). An electronic component is a component necessary for the operation of an electronic device or a component that assists the function of the electronic device. For example, a transistor, a diode, a resistor, a capacitor, an IC (Integrated Circuit), or a substrate on which these are mounted It is.

  The resin portion 531 fills the internal space 530 so as to seal the electronic component. The resin portion 531 is provided in the case body 501 as a sealing resin.

The resin part 531 has a linear expansion coefficient of 90 × 10 ⁻⁶ / ° C. or more. The resin part 531 may have a linear expansion coefficient of 100 × 10 ⁻⁶ / ° C. or more and 300 × 10 ⁻⁶ / ° C. or less. The resin portion 531 may be either a thermoplastic resin or a thermosetting resin.

  When using a thermoplastic resin as the resin part 531, as an example, at least one selected from the group consisting of polyolefin, polyester and polyamide is used. The thermoplastic resin may contain various additives such as a flame retardant, an organic / inorganic filler, a plasticizer, a colorant, and an antioxidant.

Whole of the internal space 530 may be filled with a resin having a linear expansion coefficient of more than 90 × ^{10 -6} / ℃, the linear expansion coefficient of the part 90 × ^{10 -6} / ℃ more interior space 530 The remaining portion of the internal space 530 may be filled with another resin. Even in the latter case, the resin having a linear expansion coefficient of 90 × 10 ⁻⁶ / ° C. or more is provided so as to fill at least a region adjacent to a resin gate portion 511 described later in the internal space 530.

  The case body 501 is formed with a resin gate portion 511 as a through hole. The resin gate portion 511 is formed to communicate between the internal space 530 and the external space. The resin gate portion 511 is formed so as to communicate with the internal space 530 from the external space. The resin gate portion 511 is formed so as to penetrate the wall surface of the case body 501 from the external space and reach the internal space 530.

  The opening shape of the resin gate portion 511 (the opening shape of the resin gate portion 511 when the case body 501 is cut in a plane orthogonal to the penetration direction of the resin gate portion 511) is not particularly limited, but typically, It is circular. The resin gate part 511 preferably has an opening area equal to or larger than an area corresponding to a circle of φ1 mm. In the manufacturing process of the electronic device in this embodiment, when the resin portion 531 is provided in the case body 501, the resin is filled into the internal space 530 through the resin gate portion 511.

  The closing part 521 is provided so as to close the resin gate part 511. In the present embodiment, the closing portion 521 is provided so as to completely close the resin gate portion 511. The internal space 530 and the external space communicated by the resin gate portion 511 are shielded by the closing portion 521.

  The closing part 521 is formed from the same resin as the resin material forming the case body 501. The closing part 521 is provided by deforming the case body 501 so as to close the resin gate part 511 by heating.

  The closing part 521 is provided at a position recessed from the outer surface 502 of the case body 501 toward the internal space 530. The case body 501 has a stepped portion 503. The step 503 is provided with a step that is recessed toward the inner space 530 with respect to the outer surface 502 of the case body 501. When the outer surface 502 is viewed from the front, the stepped portion 503 includes the resin gate portion 511 and has a larger area than the resin gate portion 511. The blocking part 521 is provided in the step part 503.

  3 is a cross-sectional view showing a process of providing a resin gate portion closing structure in FIG. With reference to FIGS. 2 and 3, in the present embodiment, after filling resin into case body 501, heating iron 542 is pressed around resin gate portion 511. At this time, the case body 501 is deformed so as to close the resin gate portion 511, thereby providing the closing portion 521 shown in FIG. Along with the heating by the iron 542, the case body 501 is provided with a step portion 503 that is recessed from the outer surface 502 to the inner space 530 side.

  The heating temperature of the case body 501 differs depending on the resin material forming the case body 501, but is, for example, 300 ° C. or higher. The area of the heating surface of the iron 542 is larger than the opening area of the resin gate portion 511.

  According to such a configuration, it is possible to prevent the resin from jumping out from the inside of the case body 501 to the external space in a high temperature environment by providing the closing portion 521 that deforms the case body 501 and closes the resin gate portion 511. .

  Next, a closed structure of the resin gate portion in FIG. 2 and various modifications of the electronic device in FIG. 1 will be described.

  FIG. 4 is a cross-sectional view showing a modification of the closing structure of the resin gate portion in FIG. 5 to 7 are cross-sectional views showing a process of providing a resin gate portion closing structure in FIG. With reference to FIGS. 4 to 7, in the present modification, the blocking portion 521 is provided at a position protruding from the outer surface 502 of the case body 501 toward the external space. The closing part 521 is provided in the case body 501 so as to close the resin gate part 511 at the position of the opening surface of the resin gate part 511 on the outer surface 502.

  In order to provide the closing part 521 in this modification, the case body 501 provided with the rib-like part 504 is used. The rib-shaped portion 504 is provided so as to protrude from the outer surface 502 into a rib shape. The rib-like portion 504 is provided along the outer edge of the opening surface of the resin gate portion 511 on the outer surface 502. For example, when the resin gate portion 511 has a circular opening surface, the rib-shaped portion 504 is provided to extend circumferentially along the outer edge of the opening surface of the resin gate portion 511.

  The shape of the rib-shaped portion 504 is not particularly limited as long as it is a convex shape protruding from the outer surface 502. The rib-shaped portion 504 may have, for example, a triangular cross-sectional shape as shown in FIG. 5, a semicircular cross-sectional shape as shown in FIG. It may have a square cross-sectional shape as shown in FIG.

  After filling the case body 501 with a resin, a heating iron is pressed against the periphery of the resin gate portion 511. At this time, the rib-like portion 504 protruding from the outer surface 502 is deformed so as to close the resin gate portion 511, thereby providing the closing portion 521 shown in FIG.

  According to such a configuration, it is possible to prevent the resin from jumping out from the inside of the case body 501 to the external space in a high temperature environment by providing the closing portion 521 that deforms the case body 501 and closes the resin gate portion 511. . In this modification, furthermore, the thermal deterioration of the resin portion 531 can be effectively suppressed when the closing portion 521 is formed. Thereby, the sealing performance fall of the resin part 531 can be suppressed and the quality of an electronic device can be improved.

  FIG. 8 is a cross-sectional view showing a modification of the electronic device in FIG. Referring to FIG. 8, the electronic device according to this modification includes a case body 506 and a closing portion 522 instead of the case body 501 and the closing portion 521 in FIG. 1. The case body 506 is configured by combining a case main body 505 and a cover body 541.

  The case body 505 has a housing shape that forms the internal space 530. The case body 505 has an inner surface 507 that defines the internal space 530. The case main body 505 is made of metal. Case body 505 is made of, for example, iron, iron alloy, stainless steel, aluminum alloy, zinc, or brass. The shape of the case body 505 is not particularly limited, and may be, for example, a cylindrical shape or a square shape.

  The cover body part 541 is provided in the internal space 530. The cover body portion 541 is provided along the inner surface 507 of the case main body portion 505. The cover body portion 541 is provided so as to overlap with a later-described through-hole 512 formed in the case main body portion 505.

  The cover body part 541 is made of resin. The cover body part 541 is made of a resin different from the resin material forming the resin part 531. The cover body part 541 is formed from a thermoplastic resin. Examples of the thermoplastic resin include a polybutylene terephthalate resin or a polycarbonate resin.

  A through-hole 512 is formed in the case main body 505. The through-hole 512 is provided so as to communicate between the internal space 530 and the external space. The through-hole 512 is provided so as to reach the cover body portion 541 from the external space. The through-hole 512 is provided so as to communicate between the external space and a resin gate portion 513 described later. The opening shape of the through-hole 512 is not particularly limited, but is typically circular. The through hole 512 has an opening area larger than that of the resin gate portion 513.

  In this modification, a resin gate part 513 as a through hole is formed in the cover body part 541. The resin gate portion 513 is provided in the same form as the resin gate portion 511 in FIG. The resin gate portion 513 is provided so as to overlap the through hole 512. In this modification, when the resin part 531 is provided in the case body 506, the resin is filled into the internal space 530 through the resin gate part 513.

  The closing part 522 is provided so as to close the resin gate part 513. In the present embodiment, the closing portion 522 is provided so as to completely close the resin gate portion 513. The internal space 530 and the external space communicated by the resin gate portion 513 are shielded by the closing portion 522.

  The closing part 522 is formed from the same resin as the resin material forming the cover body part 541. The closing part 522 is provided by deforming the cover body part 541 so as to close the resin gate part 513 by heating. The closing part 522 may have the same structure as the closing part 521 shown in FIG. 2, or may have the same structure as the closing part 521 shown in FIG.

  According to such a configuration, the cover body portion 541 is deformed to provide the closing portion 522 that closes the resin gate portion 513, thereby preventing the resin from jumping out from the case body 506 to the external space in a high temperature environment. it can.

  In this modification, the case main body 505 is formed of metal, but the case main body 505 may be formed of resin.

  Next, an example in which the resin gate portion closing structure provided in the electronic device in FIGS. 1 and 8 is applied to various electronic devices will be described.

  FIG. 9 is a cross-sectional view illustrating an example in which the resin gate portion closing structure included in the electronic device in FIG. 1 is applied to a rectangular photoelectric sensor. FIG. 10 is a cross-sectional view illustrating an example in which the closed structure of the resin gate portion included in the electronic device in FIG. 8 is applied to a rectangular photoelectric sensor.

  9, the photoelectric sensor includes a rectangular resin case 501A corresponding to the case body 501 in FIG. 1, a substrate 551, a light receiving unit 552, a light emitting unit 553, a lens 554, a display provided on the resin case 501A. The LED 556 and the cable (or connector) 555, and the resin portion 531 that fills the resin case 501A so as to seal the substrate 551, the light receiving portion 552, the light emitting portion 55, and the like. A closing portion 521 is provided so as to close the resin gate portion 511 formed in the resin case 501A.

  Referring to FIG. 10, the photoelectric sensor corresponds to metal case 505B corresponding to case body 505 constituting case body 506 in FIG. 8 and cover body 541 constituting case body 506 in FIG. The resin cover 541B, the substrate 551, the light receiving unit 552, the light emitting unit 553, the lens 554, the display LED 556, and the cable (or connector) 555, the substrate 551, the light receiving unit 552, the light emitting unit 553, and the like provided on the metal case 505B are sealed. And a resin portion 531 that fills the metal case 505B so as to stop. A closing portion 522 is provided so as to close the resin gate portion 513 formed on the resin cover 541B.

  FIG. 11 is a cross-sectional view illustrating an example in which the resin gate portion blocking structure included in the electronic device in FIG. 1 is applied to a cable-type proximity sensor. FIG. 12 is a cross-sectional view illustrating an example in which the resin gate portion blocking structure included in the electronic device in FIG. 8 is applied to a connector-type proximity sensor.

  Referring to FIG. 11, the proximity sensor is mounted on a cylindrical resin clamp 501C corresponding to case body 501 in FIG. 1, substrate 561 and ring cord 564 provided on resin clamp 501C, substrate 561 and the substrate. And a resin portion 531 that fills the resin clamp 501C so as to seal the electronic component. The ring cord 564 includes a cable 563 drawn out from the resin clamp 501C to the external space, and a ring member 562 provided so as to cover the end of the cable 563 inside the resin clamp 501C. A closing portion 521 is provided so as to close the resin gate portion 511 formed in the resin clamp 501C.

  Referring to FIG. 12, the proximity sensor corresponds to base metal fitting 505D corresponding to case body 505 constituting case body 506 in FIG. 8 and cover body 541 constituting case body 506 in FIG. The light emitting unit cover 541D, the substrate 561 and the receptacle 565 provided on the base metal 505D, and the resin part 531 filling the base metal 505D so as to seal the substrate 561 and the electronic components mounted on the substrate are included. The receptacle 565 is provided as a connector member having pins for external connection of the proximity sensor. A closing portion 522 is provided so as to close the resin gate portion 513 formed on the light emitting portion cover 541D.

  According to the electronic device according to the first embodiment of the present invention described above, the resin that forms the resin portion 531 in a high-temperature environment is formed by providing various closing portions so as to close the resin gate portion. Jumping out to the outside space through the part can be prevented. Thereby, the situation where the external appearance of the electronic device from which the resin protruded is regarded as a defective product can be avoided. In addition, there is a concern that the sealing resin that protrudes into the external space may be mixed as a foreign substance in the usage environment of the electronic device, or that the sealing performance in the case body by the sealing resin is impaired and the water resistance performance of the electronic device may be reduced. Can be eliminated.

(Embodiment 2)
The resin gate portion closing structure included in the electronic device according to the second embodiment of the present invention has the same shape as the resin gate portion closing structure described in the first embodiment. In the first embodiment, the closed portion is provided using a heating iron, whereas in the present embodiment, the closed portion is provided by laser irradiation.

  FIG. 13 is a cross-sectional view showing a step of providing a blocking portion for the resin gate portion in the electronic device according to Embodiment 2 of the present invention. FIG. 14 is a plan view showing a step of providing a closed portion of the resin gate portion in FIG.

  Referring to FIGS. 13 and 14, in this embodiment, after filling case body 501 with resin, laser light is emitted from laser head 571 toward resin gate portion 511. At this time, the laser beam is scanned so that a region 572 having an area larger than the resin gate portion 511 around the resin gate portion 511 is an irradiation region. Although the output of a laser beam changes with resin materials which form the case body 501, it is 10 W or more, for example.

  Referring also to FIG. 2, the case body 501 is deformed so as to close the resin gate portion 511 by irradiation with laser light, thereby providing the closing portion 521. Corresponding to the irradiation region of the laser beam, the case body 501 is provided with a stepped portion 503 that is recessed from the outer surface 502 to the inner space 530 side.

  In the present embodiment, the resin gate portion closing structure shown in FIG. 2 is taken as a representative example, and the process of providing the resin gate portion closing portion has been described. However, the resin gate portion closing portion shown in FIG. The same laser light irradiation process is also applied to the structure and the closed structure of the resin gate portion included in the electronic device in FIG.

  An example in which the closed structure of the resin gate portion included in the electronic device in the present embodiment is applied to various electronic devices is the same as the example described with reference to FIGS. 9 to 12 in the first embodiment.

  According to the electronic device according to the second embodiment of the present invention described above, the same effects as those described in the first embodiment can be obtained.

(Embodiment 3)
15 is a sectional view showing an electronic apparatus according to Embodiment 3 of the present invention. FIG. 16 is a plan view of a resin gate portion closing structure included in the electronic device in FIG. 15. The electronic device in the present embodiment is different from the electronic device in the first embodiment in the resin gate portion closing structure. Hereinafter, the description of the overlapping structure will not be repeated.

  Referring to FIGS. 15 and 16, the electronic device in the present embodiment has a case body 507 and an adhesive sheet 581 instead of case body 501 and closing portion 521 in FIG. 1.

  Case body 507 is formed of resin or metal. In the case body 507, a resin gate portion 514 corresponding to the resin gate portion 511 in FIG. 1 is formed.

  The adhesive sheet 581 is formed from a resin. The adhesive sheet 581 has adhesiveness on one surface thereof, and is bonded to the case body 507 so as to close the resin gate portion 514 from the external space. The adhesive sheet 581 is bonded to the outer surface 508 of the case body 507.

  The adhesive sheet 581 has an area larger than the opening area of the resin gate portion 514 in the plan view. The shape of the pressure-sensitive adhesive sheet 581 is not particularly limited as long as it can close the resin gate portion 514, but typically has a shape corresponding to the opening shape of the resin gate portion 514. When the resin gate part 514 has a circular opening shape of φ1 mm or more, the adhesive sheet 581 preferably has a circular shape of φ2 mm or more. The pressure-sensitive adhesive sheet 581 may be a nameplate seal indicating the type of electronic device.

  In the present embodiment, an adhesive sheet 581 is further welded to the case body 507. The adhesive sheet 581 is welded to the case body 507 by scanning the laser beam along the outer edge of the adhesive sheet 581.

  According to such a configuration, by providing the adhesive sheet 581 so as to block the resin gate portion 514, it is possible to prevent the resin from jumping out from the inside of the case body 507 to the external space in a high temperature environment.

  Next, an example in which the resin gate portion blocking structure included in the electronic device in FIG. 15 is applied to various electronic devices will be described.

  FIG. 17 is a cross-sectional view illustrating an example in which the resin gate portion closing structure included in the electronic device in FIG. 15 is applied to a rectangular photoelectric sensor. FIG. 18 is a cross-sectional view illustrating an example in which the resin gate portion closing structure included in the electronic device in FIG. 15 is applied to another rectangular photoelectric sensor.

  Referring to FIG. 17, the photoelectric sensor includes a rectangular resin case 507E corresponding to the case body 507 in FIG. 15, and a substrate 551, a light receiving unit 552, a light emitting unit 553, a lens 554, a display provided on the resin case 507E. The LED 556 and the cable (or connector) 555, and the resin portion 531 that fills the resin case 507E so as to seal the substrate 551, the light receiving portion 552, the light emitting portion 55, and the like. An adhesive sheet 581 is provided so as to close the resin gate portion 514 formed in the resin case 507E.

  Referring to FIG. 18, the photoelectric sensor includes a rectangular metal case 507F corresponding to the case body 507 in FIG. 15, and a substrate 551, a light receiving unit 552, a light emitting unit 553, a lens 554, a display provided on the metal case 507F. The LED 556 and the cable (or connector) 555, and the resin portion 531 that fills the metal case 507F so as to seal the substrate 551, the light receiving portion 552, the light emitting portion 55, and the like. An adhesive sheet 581 is provided so as to close the resin gate portion 514 formed on the metal case 507F.

  FIG. 19 is a cross-sectional view showing an example in which the resin gate blockage structure included in the electronic device in FIG. 15 is applied to a cable-type proximity sensor. FIG. 20 is a cross-sectional view showing an example in which the closing structure of the resin gate portion included in the electronic device in FIG. 15 is applied to a connector type proximity sensor.

  Referring to FIG. 19, the proximity sensor includes a resin clamp 507G corresponding to case body 507 in FIG. 15, a substrate 561 and a ring cord 564 provided on resin clamp 507G, and an electronic device mounted on substrate 561 and the substrate. And a resin portion 531 that fills the resin clamp 507G so as to seal the component. The ring cord 564 includes a cable 563 drawn out from the resin clamp 507G to the external space, and a ring member 562 provided so as to cover the end of the cable 563 inside the resin clamp 507G. An adhesive sheet 581 is provided so as to close the resin gate portion 514 formed on the resin clamp 507G.

  Referring to FIG. 20, the proximity sensor includes a base metal fitting 507H corresponding to the case body 507 in FIG. 15, a substrate 561 and a receptacle 565 provided on the base metal fitting 507H, and an electronic component mounted on the substrate 561 or the substrate. And a resin portion 531 that fills the base metal fitting 507H. The receptacle 565 is provided as a connector member having pins for external connection of the proximity sensor. An adhesive sheet 581 is provided so as to close the resin gate portion 514 formed on the base metal fitting 507H.

  According to the electronic device according to the third embodiment of the present invention configured as described above, the same effects as those described in the first embodiment can be obtained.

(Embodiment 4)
FIG. 21 is a cross-sectional view showing an electronic apparatus according to Embodiment 4 of the present invention. FIG. 22 is a cross-sectional view illustrating a process of providing a resin gate portion closing structure included in the electronic device in FIG. The electronic device in the present embodiment is different from the electronic device in the first embodiment in the resin gate portion closing structure. Hereinafter, the description of the overlapping structure will not be repeated.

  Referring to FIGS. 21 and 22, the electronic device in the present embodiment has a case body 509 and a movable member 586 instead of case body 501 and closing portion 521 in FIG. 1.

  In the present embodiment, case body 509 is made of resin or metal. In the case body 509, a resin gate portion 515 corresponding to the resin gate portion 511 in FIG. 1 is formed. When the resin part 531 is provided in the case body 509, the resin is filled into the internal space 530 through the resin gate part 515.

  An insertion port 510 is formed in the case body 509. The insertion port 510 is provided so as to communicate with the internal space 530 from the external space. The insertion port 510 has a shape into which the movable member 586 can be inserted.

  The movable member 586 is made of resin or metal. The movable member 586 is inserted into the insertion port 510. The movable member 586 may be inserted into the insertion port 510 from the inner space 530 side, or may be inserted into the insertion port 510 from the outer space side. The movable member 586 extends from the internal space 530 to the external space through the insertion port 510. The movable member 586 is provided in contact with the resin portion 531 in the internal space 530.

  The movable member 586 is provided so as to close the resin gate portion 515 in the internal space 530. The movable member 586 can move between a position where the resin gate portion 515 is closed and a position shifted from the resin gate portion 515 with respect to the case body 509 in a state where the resin portion 531 is not provided in the internal space 530. Is provided. The movable member 586 is fitted to the case body 509 so as to provide a minute gap between the movable member 586 and the case body 509 in the internal space 530. The size of the gap is determined in consideration of the viewpoint of preventing the resin from entering the gap. As an example, the gap has a size of 0.5 mm or less.

  The movable member 586 is not particularly limited, but is, for example, an external connection component for electrically connecting the internal space 530 and the external space.

  In this embodiment, before filling the case body 509 with the resin, the movable member 586 is inserted into the insertion port 510 and fixed at a position displaced from the resin gate portion 515 using a jig or the like. Then, the resin is filled into the internal space 530 through the resin gate portion 515 while the position of the movable member 586 is fixed. After the resin is filled, the fixing of the movable member 586 by the jig is released. As the resin filled in the internal space 530 contracts as the temperature decreases, the movable member 586 is moved from a position displaced from the resin gate portion 515 to a position where the resin gate portion 515 is closed. Accordingly, a closed structure in which the resin gate portion 515 is closed by the movable member 586 in FIG. 21 can be obtained.

  According to such a configuration, by providing the movable member 586 so as to close the resin gate portion 515, it is possible to prevent the resin from jumping out from the case body 509 to the external space in a high temperature environment.

  Next, examples in which the resin gate portion blocking structure included in the electronic device in FIG. 21 is applied to various electronic devices will be described.

  FIG. 23 is a cross-sectional view illustrating an example in which the resin gate portion blocking structure included in the electronic device in FIG. 21 is applied to a cable-type photoelectric sensor. 24 is a cross-sectional view showing a step of providing a resin gate portion closing structure in FIG.

  23 and 24, the photoelectric sensor includes a resin case 509I corresponding to the case body 509 in FIG. 21, and a substrate 551, a light receiving unit 552, a light emitting unit 553, a lens 554, provided in the resin case 509I. The display LED 556 and the ring cord 593, and the resin portion 531 that fills the resin case 509I so as to seal the substrate 551, the light receiving portion 552, the light emitting portion 553, and the like. The ring cord 593 includes a cable 592 drawn out from the resin case 509I to the external space, and a ring member 591 provided so as to cover the end of the cable 592 inside the resin case 509I. The ring member 591 is provided so as to close the resin gate portion 515 formed in the resin case 509I.

  FIG. 25 is a cross-sectional view illustrating an example in which the closing structure of the resin gate portion included in the electronic device in FIG. 21 is applied to a connector type photoelectric sensor. FIG. 26 is a cross-sectional view showing a step of providing a resin gate portion closing structure in FIG.

  Referring to FIGS. 25 and 26, the photoelectric sensor includes a resin case 509J corresponding to the case body 509 in FIG. 21, and a substrate 551, a light receiving unit 552, a light emitting unit 553, a lens 554, provided in the resin case 509J. The display LED 556 and the receptacle 594, and the resin portion 531 that fills the resin case 509J so as to seal the substrate 551, the light receiving portion 552, the light emitting portion 553, and the like. The receptacle 594 is provided as a connector member having pins for external connection of the photoelectric sensor. The receptacle 594 is provided so as to close the resin gate portion 515 formed in the resin case 509J.

  FIG. 27 is a cross-sectional view showing an example in which the closing structure of the resin gate portion included in the electronic device in FIG. 21 is applied to a cable type proximity sensor. FIG. 28 is a cross-sectional view showing a step of providing a resin gate portion closing structure in FIG.

  27 and 28, the proximity sensor is mounted on resin clamp 509K corresponding to case body 509 in FIG. 21, substrate 561 and ring cord 564 provided on resin clamp 509K, substrate 561 and the substrate. And a resin portion 531 that fills the resin clamp 509K so as to seal the electronic component. The ring cord 564 includes a cable 563 drawn out from the resin clamp 509K to the external space, and a ring member 562 provided so as to cover the end of the cable 563 inside the resin clamp 509K. The ring member 562 is provided so as to close the resin gate portion 515 formed in the resin clamp 509K.

  FIG. 29 is a cross-sectional view showing an example in which the closing structure of the resin gate portion included in the electronic device in FIG. 21 is applied to a connector type proximity sensor. 30 is a cross-sectional view showing a step of providing a resin gate portion closing structure in FIG.

  29 and 30, the proximity sensor is mounted on the base metal 509L corresponding to the case body 509 in FIG. 21, the board 561 and the receptacle 565 provided on the base metal 509L, and the board 561 or the board. And a resin portion 531 filling the base metal fitting 509L so as to seal the electronic component. The receptacle 565 is provided as a connector member having pins for external connection of the proximity sensor. The receptacle 565 is provided so as to close the resin gate portion 515 formed on the base metal fitting 509L.

  According to the thus configured electronic apparatus in the fourth embodiment of the present invention, the same effects as those described in the first embodiment can be obtained.

(Embodiment 5)
FIG. 31 is a cross-sectional view showing a closed structure of a resin gate portion provided in an electronic device according to Embodiment 5 of the present invention. FIG. 32 is a cross-sectional view showing a modified example of the closing structure of the resin gate portion in FIG. FIGS. 31 and 32 correspond to FIGS. 2 and 4 in the first embodiment, respectively. The electronic device in the present embodiment is different from the electronic device in the first embodiment in the resin gate portion closing structure. Hereinafter, the description of the overlapping structure will not be repeated.

  Referring to FIG. 31 and FIG. 32, in the electronic apparatus in the present embodiment, a closing portion 521 is provided so as to partially close resin gate portion 511. That is, a communication hole 516 that communicates from the external space to the internal space 530 is formed in the closing portion 521. The communication hole 516 has an opening area equal to or smaller than an area corresponding to a circle of φ0.8 mm. The resin gate portion 511 preferably has an opening area equal to or larger than an area corresponding to a circle of φ1.0 mm.

  According to such a configuration, even if the resin gate portion 511 is partially closed by the closing portion 521, the case body can be obtained by setting the opening area to be equal to or smaller than the area corresponding to a circle of φ0.8 mm. It is possible to effectively suppress the resin from jumping out from the inside to the external space.

  FIG. 33 is a cross-sectional view showing another modified example of the resin gate portion closing structure in FIG. 31. The structure in which the resin gate part is partially closed to an area corresponding to a circle of φ0.8 mm can be applied to the various resin gate part closing structures described in the first to second and fourth embodiments. . As an example thereof, FIG. 33 shows a structure in which the resin gate portion 515 is partially closed to an area corresponding to a circle of φ0.8 mm by the movable member 586.

  Next, an embodiment for confirming the operational effects achieved by the resin gate portion closing structure in FIG. 31 will be described.

  First, in a comparative example in which the blocking portion 521 is not provided in the resin gate portion 511, the relationship between the size of the resin gate portion 511, whether or not the case body 501 can be filled, and the amount of resin popping out was confirmed. In this comparative example, the opening shape of the resin gate portion 511 is circular, and the size of the resin gate portion 511 is changed in the range of φ0.3 mm to φ1.5 mm. Heating was performed for 24 hours so as to be in an environment of 70 ° C., and then the amount of resin popping out from the case body 501 was measured at 10 locations using an optical microscope.

  FIG. 34 is a table showing the relationship between the size of the resin gate portion, whether or not the resin can be filled into the case body, and the amount of resin popping out in a comparative example in which the closed portion is not provided in the resin gate portion.

  In FIG. 34, the case where the resin can be filled into the case body is indicated as X determination, and the case where it is not possible is indicated as Y determination. When handling the sensor, for example, when it is attached to equipment, there is a scene where the operator touches the sensor and the popped out resin falls off. In FIG. 34 and FIG. 35 to be described later, the case where the resin pop-out amount is 1.0 mm or less is determined to be a length that does not tear off (does not fall off) even in such a scene. The case where both the average pop-out amount and the maximum pop-out amount of the resin are 1.0 mm or less is determined as A, and the average pop-out amount of the resin is 1.0 mm or less, but the maximum pop-out amount of the resin exceeds 1.0 mm. B determination was made, and the case where both the average and maximum pop-out amounts of the resin exceeded 1.0 mm was shown as C determination.

  Referring to FIG. 34, when the size of resin gate portion 511 is φ0.3 mm and φ0.5 mm, the case body 501 could not be filled with resin. On the other hand, when the size of the resin gate portion 511 is φ1.0 mm and φ1.5 mm, the resin can be filled into the case body 501, but the resin pop-out phenomenon becomes remarkable.

  Next, the size of the resin gate portion 511 was set to φ1 mm, and the resin gate portion 511 was partially closed by the closing portion 521 within a range of φ0.5 mm to φ0.9 mm, and the amount of the resin protruding was confirmed.

  FIG. 35 is a table showing the relationship between the size of the resin gate portion and the amount of resin popping out in Examples and Comparative Examples in which the resin gate portion is partially closed.

  Referring to FIG. 35, in Comparative Example 5 in which the resin gate portion 511 was partially closed to φ0.9 mm, the average amount of resin popped out was 1.0 mm, but there was also resin with a pop-out amount exceeding 1.0 mm. . On the other hand, in Examples 1 to 3 in which the resin gate portion 511 was partially blocked to φ0.8 mm or less, the pop-out amount of any resin could be suppressed to a value of 1.0 mm or less where the resin was not torn.

  According to the electronic device according to the fifth embodiment of the present invention described above, the same effects as those described in the first embodiment can be obtained.

(Embodiment 6)
In the sixth to ninth embodiments, a more specific structure of the proximity sensor to which the resin gate portion closing structure described in the first to fifth embodiments is applied will be described.

  FIG. 36 is a perspective view showing a proximity sensor according to Embodiment 6 of the present invention. FIG. 37 is an exploded view of the proximity sensor in FIG. FIG. 38 is a cross-sectional view showing the proximity sensor along the line XXXVIII-XXXVIII in FIG. 36. FIG. 39 is a cross-sectional view showing the proximity sensor along the line XXXIX-XXXIX in FIG.

  Referring to FIGS. 36 to 39, proximity sensor 910 in the present embodiment is an inductive proximity sensor that generates a magnetic field in a detection region to detect the approach or presence of a detection target. The detection target detected by the proximity sensor 910 is a conductive object. The detection target detected by the proximity sensor 910 is typically a magnetic metal such as iron, but may be a nonmagnetic metal such as copper or aluminum.

  The proximity sensor 910 in this embodiment is a cable type that uses a cable for external connection of the proximity sensor. Proximity sensor 910 has a size of M12, and is smaller in diameter than proximity sensor 930 and proximity sensor 940 in Embodiments 8 and 9 described later.

  First, the overall configuration of the proximity sensor 910 will be described. The proximity sensor 910 as a whole has an external appearance that extends in a cylindrical shape along the virtual central axis 102. The proximity sensor 910 includes a detection coil unit 210, a front cover 20, a printed circuit board 50, a base metal fitting 60, a clamp 80, and a ring cord 70.

  The detection coil unit 210 is provided as a detection unit that detects the approach or presence of a detection target. The detection coil unit 210 generates a magnetic field. The detection coil unit 210 is provided on the front end side of the proximity sensor 910 that faces the detection region. The detection coil unit 210 is configured by combining the core body 40, the electromagnetic coil 36, the coil spool 30, and the coil pin 46.

  The core body 40 is made of a material having good high frequency characteristics, for example, ferrite. The core body 40 has a function of enhancing the coil characteristics of the detection coil unit 210 and concentrating the magnetic flux in the detection region. The electromagnetic coil 36 is a coil wire and is wound around the core body 40. The electromagnetic coil 36 is wound around the central axis 102. That is, the central axis 102 is also the winding central axis of the electromagnetic coil 36.

  The coil spool 30 is made of an electrically insulating resin. The coil spool 30 is provided so as to be interposed between the core body 40 and the electromagnetic coil 36 wound around the core body 40.

  The coil pin 46 is made of a conductive metal. The coil pin 46 is supported by the coil spool 30. The coil pin 46 extends from the detection coil unit 210 toward the printed circuit board 50 and is connected to the printed circuit board 50 at the extended portion. The tip of the electromagnetic coil 36 drawn from the outer periphery of the coil spool 30 is wound around the root of the coil pin 46 extending from the detection coil unit 210. The electromagnetic coil 36 and the printed board 50 are electrically connected to each other via a coil pin 46.

  The detection coil unit 210 is accommodated in the front cover 20. The front cover 20 is made of resin. The front cover 20 is made of a thermoplastic resin. The front cover 20 is made of, for example, PBT (polybutylene terephthalate). The front cover 20 is provided as a front end cover that houses the detection coil unit 210. The front cover 20 closes the front end of the base metal fitting 60 having a cylindrical shape. The front cover 20 is mainly provided to shield and protect the detection coil unit 210 from the external atmosphere.

  The front cover 20 has a bottomed cylindrical shape. The front cover 20 extends in a cylindrical shape around the central axis 102 and is closed at one end and opened at the other end. The end surface on the closed end side of the front cover 20 constitutes a detection surface of the proximity sensor 910.

  The printed circuit board 50 has a flat plate shape. The printed circuit board 50 extends with the axial direction of the central axis 102 as the longitudinal direction. Various types of electronic components (not shown) such as transistors, diodes, resistors, and capacitors are mounted on the printed circuit board 50. A light emitting diode is mounted on the printed circuit board 50 as a light emitting unit for notifying the detection state.

  The base metal fitting 60 is provided as a main body case that houses electronic components such as transistors, diodes, resistors, and capacitors. The base metal fitting 60 outlines the proximity sensor 910 on the outer periphery of the central shaft 102. The base metal fitting 60 has a shape extending in a cylindrical shape around the central axis 102. The base metal fitting 60 is opened at both ends extending along the central axis 102. The front cover 20 is fixed to the base metal fitting 60 by being inserted inside one open end of the base metal fitting 60.

  The base metal fitting 60 is made of metal. A screw used when fixing the proximity sensor 910 to an external facility is formed on the outer peripheral surface of the base metal fitting 60. Proximity sensor 910 in the present embodiment is a so-called shield type proximity sensor, and metal base fitting 60 is arranged on the outer periphery of detection coil unit 210.

  The clamp 80 is provided as a connection member connected to the base metal fitting 60 from the rear end side of the proximity sensor 910. The clamp 80 is connected to the rear end of the base metal fitting 60 having a cylindrical shape. The clamp 80 is inserted inside the rear end of the base metal fitting 60. The clamp 80 is integrated with the base metal fitting 60 and extends in a cylindrical shape around the central axis 102. The base metal fitting 60 and the clamp 80 constitute a cylindrical case 310 that extends in a cylindrical shape around the central axis 102. The cylindrical case 310 accommodates the printed circuit board 50 and electronic components mounted on the printed circuit board 50.

  The light emitting diode mounted on the printed circuit board 50 is positioned inside the clamp 80. The clamp 80 is made of resin. The clamp 80 is formed of a transparent or translucent resin so that the light emission of the light emitting diode can be visually recognized from the outside of the proximity sensor 910. The clamp 80 is made of, for example, a polyamide resin.

  The ring cord 70 is electrically connected to the printed circuit board 50 inside the cylindrical case 310. The ring cord 70 is pulled out from the rear end side of the cylindrical case 310. The ring cord 70 is provided as a rear end cover that closes the rear end of the cylindrical case 310.

  The ring cord 70 has a cable 71 and a ring member 72. The cable 71 includes a core wire 71p and a covering material 71q that covers the core wire 71p. The core wire 71p extends from the longitudinal end of the covering material 71q toward the printed circuit board 50 and is electrically connected to the printed circuit board 50. Yes. The ring member 72 is provided so as to cover the end of the cable 71 inside the cylindrical case 310 by injection molding. The ring member 72 is provided in order to ensure the bondability between a resin portion 120 (described later) provided in the cylindrical case 310 and the cable 71. The ring member 72 is made of, for example, PBT (polybutylene terephthalate). The cable 71 is covered with, for example, polyvinyl chloride.

  A resin portion 120 is provided inside the cylindrical case 310 by resin filling. The resin part 120 is provided so as to fill a space in the cylindrical case 310. The resin portion 120 is provided so as to fill a space surrounded by the cylindrical case 310 and the front cover 20 and the ring cord 70 that close the front and rear ends thereof. The resin part 120 is provided so as to seal the detection coil part 210 accommodated in the front cover 20 and the printed circuit board 50 and electronic components accommodated in the cylindrical case 310.

The resin part 120 includes a thermosetting resin part 121 that seals the detection coil part 210 with a thermosetting resin, and a thermoplastic resin part 122 that seals the printed circuit board 50 and electronic components with a thermoplastic resin. The thermosetting resin portion 121 and the thermoplastic resin portion 122 are provided so as to form a boundary inside the front cover 20 indicated by a one-dot chain line 101 in FIGS. 38 and 39. The thermoplastic resin part 122 has a linear expansion coefficient of 90 × 10 ⁻⁶ / ° C. or more. As the thermoplastic resin, at least one selected from the group consisting of polyolefin, polyester and polyamide is used. The thermoplastic resin may contain various additives such as a flame retardant, an organic / inorganic filler, a plasticizer, a colorant, and an antioxidant. An epoxy resin is typically used as the thermosetting resin.

  The resin part 120 is not limited to the above-described divided structure, and may have a structure in which the detection coil part 210, the printed board 50, and the electronic component are collectively sealed with a thermoplastic resin.

  In the proximity sensor 910 in the present embodiment, a resin gate portion 912 is formed in the clamp 80, and a closing portion 911 is provided so as to close the resin gate portion 912.

  Next, as a representative example of the proximity sensor manufacturing method according to the sixth to ninth embodiments, steps of the proximity sensor manufacturing method according to the present embodiment will be described. 40 to 45 are views showing the steps of the manufacturing method of the proximity sensor in FIG.

  Referring to FIG. 40, first, sub-assembly 116 including detection coil unit 210 and printed circuit board 50 is assembled. Specifically, the core body 40 and the coil spool 30 around which the electromagnetic coil 36 is wound are combined, and the printed board 50 is connected to the core body 40. By soldering the tip of the coil pin 46 onto the surface of the printed board 50, the electromagnetic coil 36 and the printed board 50 are electrically connected.

  With reference to FIG. 41, next, the front cover 20 is assembled to the subassembly 116. Specifically, first, a thermosetting resin is injected into the front cover 20 as a primary casting resin. Next, by inserting the subassembly 116 into the front cover 20, the detection coil unit 210 and a part of the printed circuit board 50 are immersed in the thermosetting resin in the front cover 20. The thermosetting resin in the front cover 20 is cured by heating.

  With reference to FIG. 42, next, the ring cord 70 is assembled to the subassembly 116. Specifically, the tip of the cable of the ring cord 70 is soldered on the surface of the printed board 50.

  Next, referring to FIG. 43, the base metal fitting 60 is assembled to the front cover 20. Specifically, the ring cord 70 and the printed circuit board 50 are sequentially passed from the front end side of the base metal fitting 60, and the front cover 20 is press-fitted inside the base metal fitting 60.

  Next, referring to FIG. 44, the clamp 80 is assembled to the base metal fitting 60. Specifically, the ring cord 70 is passed from the front end side of the clamp 80, and the clamp 80 is press-fitted inside the base metal fitting 60. Then, the base metal fitting 60 and the clamp 80 are fixed using fixing means such as dents, caulking, adhesion, or welding. Note that the step of fixing the base metal fitting 60 and the clamp 80 may be performed after the subsequent secondary resin filling step.

  Referring to FIG. 45, next, a thermoplastic resin as a secondary resin is filled into a cylindrical case 310 composed of the base metal fitting 60 and the clamp 80. More specifically, the assembly 117 obtained in the previous step is set in a mold using a positioning jig. High temperature resin is injected into the cylindrical case 310 through the resin gate 912.

  By curing the thermoplastic resin, the printed circuit board 50 and various electronic components in the cylindrical case 310 are resin-sealed. Thereafter, the resin gate 912 is closed. Through the above steps, the proximity sensor 910 in FIG. 36 is completed.

(Embodiment 7)
FIG. 46 is a perspective view showing a proximity sensor according to Embodiment 7 of the present invention. 47 is an exploded view of the proximity sensor in FIG. FIG. 48 is a cross-sectional view showing the proximity sensor along the line XLVIII-XLVIII in FIG. 46. The proximity sensor according to the present embodiment basically has the same structure as that of the proximity sensor according to the sixth embodiment. Hereinafter, the description of the overlapping structure will not be repeated.

  46 to 48, proximity sensor 920 in the present embodiment is a connector type that uses a connector for external connection of the proximity sensor. Proximity sensor 920 has a size of M12, and is smaller in diameter than proximity sensor 930 and proximity sensor 940 in Embodiments 8 and 9 described later.

  The proximity sensor 920 includes a detection coil unit 210, a front cover 20, a printed circuit board 50, a base metal fitting 60, a light emitting unit cover 90, a harness 150, a receptacle 160, and a resin unit 120.

  The light emitting unit cover 90 has a cylindrical shape centered on the central axis 102 and is inserted into the base metal fitting 60. The light emitting unit cover 90 is made of resin. The light emitting unit cover 90 is formed of a transparent or translucent resin so that light emitted from the light emitting diode can be visually recognized from the outside of the proximity sensor 920. The light emitting unit cover 90 is formed of a resin that can transmit light from the light emitting diode.

  The receptacle 160 is provided so as to close the opening end on the rear end side of the base metal fitting 60. Receptacle 160 is provided as a connector cover having pins 161 for external connection of proximity sensor 920. The harness 150 is provided as a wiring member that electrically connects the printed circuit board 50 and the pins 161 of the receptacle 160 in the base metal fitting 60.

  In the proximity sensor 920 in the present embodiment, a resin gate portion 912 is formed in the base metal fitting 60, and a closing portion 911 is provided so as to close the resin gate portion 912.

(Embodiment 8)
FIG. 49 is a perspective view showing a proximity sensor according to Embodiment 8 of the present invention. FIG. 50 is an exploded view of the proximity sensor in FIG. FIG. 51 is a cross-sectional view showing the proximity sensor along the line LI-LI in FIG. The proximity sensor according to the present embodiment basically has the same structure as that of the proximity sensor according to the sixth embodiment. Hereinafter, the description of the overlapping structure will not be repeated.

  49 to 51, proximity sensor 930 in the present embodiment is a cable type that uses a cable for external connection of the proximity sensor. Proximity sensor 930 has a size of M30, and has a larger diameter than that of proximity sensor 910 and proximity sensor 920 in the sixth and seventh embodiments.

  The proximity sensor 930 includes a detection coil unit 210, a front cover 20, a printed board 50, a base metal fitting 60, a flow control member 430, a clamp 80, and a ring cord 70.

  In the present embodiment, since the proximity sensor 930 has a large diameter size, the clamp 80 has a shape that decreases in diameter from the front end side to the rear end side of the proximity sensor.

  The flow control member 430 is accommodated in the cylindrical case 310. The flow control member 430 appropriately controls the resin flow in the cylindrical case 310 during resin filling to provide the resin portion 120, relieves stress remaining in the cylindrical case 310 after resin sealing, and controls the bubble position. Is provided to do.

  In the proximity sensor 930 in the present embodiment, a resin gate portion 912 is formed on the clamp 80, and a closing portion 911 is provided so as to close the resin gate portion 912.

(Embodiment 9)
FIG. 52 is a perspective view showing a proximity sensor according to Embodiment 9 of the present invention. 53 is an exploded view of the proximity sensor in FIG. 54 is a cross-sectional view showing the proximity sensor along the line LIV-LIV in FIG. The proximity sensor according to the present embodiment basically has the same structure as that of the proximity sensor according to the sixth embodiment. Hereinafter, the description of the overlapping structure will not be repeated.

  52 to 54, proximity sensor 940 in the present embodiment is a connector type that uses a connector for external connection of the proximity sensor. Proximity sensor 940 has a size of M30, and has a large diameter compared to proximity sensor 910 and proximity sensor 920 in the sixth and seventh embodiments.

  The proximity sensor 940 includes a detection coil unit 210, a front cover 20, a printed circuit board 50, a base metal fitting 60, a flow control member 430, a light emitting unit cover 90, a harness 150, a receptacle 160, and a resin unit 120. Have

  In the present embodiment, since the proximity sensor 940 has a large diameter size, the base metal fitting 60 has a shape that decreases in diameter from the front end side to the rear end side of the proximity sensor.

  The flow control member 430 is accommodated in the base metal fitting 60. The flow control member 430 appropriately controls the resin flow in the base metal fitting 60 during resin filling for providing the resin portion 120, relieves stress remaining in the base metal fitting 60 after resin sealing, and controls the bubble position. Is provided to do.

  The light emitting unit cover 90 has a cylindrical shape centered on the central axis 102 and is inserted into the base metal fitting 60. The light emitting unit cover 90 is made of resin. The light emitting unit cover 90 is made of a transparent or translucent resin so that light emitted from the light emitting diode can be visually recognized from the outside of the proximity sensor 940. The light emitting unit cover 90 is formed of a resin that can transmit light from the light emitting diode.

  The receptacle 160 is provided so as to close the opening end on the rear end side of the base metal fitting 60. Receptacle 160 is provided as a connector cover having pins 161 for external connection of proximity sensor 940. The harness 150 is provided as a wiring member that electrically connects the printed circuit board 50 and the pins 161 of the receptacle 160 in the base metal fitting 60.

  In the proximity sensor 940 in the present embodiment, a resin gate portion 912 is formed on the base metal fitting 60, and a closing portion 911 is provided so as to close the resin gate portion 912.

  The embodiment disclosed this time should be considered as illustrative in all points and not restrictive. The scope of the present invention is defined by the terms of the claims, rather than the description above, and is intended to include any modifications within the scope and meaning equivalent to the terms of the claims.

  The present invention is mainly applied to an electronic device having a structure in which a sealing resin is provided in a case body.

  20 Front cover, 30 Coil spool, 36 Electromagnetic coil, 40 Core body, 46 Coil pin, 50 Printed circuit board, 60, 505D, 507H, 509L Base fitting, 70, 564, 593 Ring cord, 71, 563, 592 Cable, 72, 562,591 Ring member, 80 clamp, 90,541D Light emitting part cover, 102 central shaft, 116 subassembly, 117 assembly, 120,531 resin part, 121 thermosetting resin part, 122 thermoplastic resin part, 150 harness, 160 , 565, 594 receptacle, 161 pin, 210 detection coil section, 501, 506, 507, 509 case body, 310 cylindrical case, 430 flow control member, 501A, 507E, 509I, 509J resin case, 501C, 507G , 509K Resin clamp, 502,508 Outer surface, 503 Stepped portion, 504 Rib-shaped portion, 505 Case main body, 505B, 507F Metal case, 507 Inner surface, 510 Insertion port, 511, 513, 514, 515, 912 Resin gate Part, 512 through-hole, 516 communication hole, 521, 522, 911 closed part, 530 internal space, 541 cover body part, 541B resin cover, 542 iron, 551, 561 substrate, 552 light receiving part, 553 light emitting part, 554 lens, 556 Display LED, 571 Laser head, 581 Adhesive sheet, 586 Movable member, 910, 920, 930, 940 Proximity sensor.

Claims (5)

A case body forming an internal space for accommodating electronic components;
A resin portion provided in the internal space so as to seal the electronic component, and having a linear expansion coefficient of 90 × 10 ⁻⁶ / ° C. or more;
The case body is formed with a through hole that allows communication between the internal space and an external space outside the case body,
A closing portion provided to close the through hole ;
The closing portion is a movable member that is disposed in the internal space so as to overlap the through hole and is provided in contact with the resin portion,
The electronic device , wherein the movable member is fitted to the case body so that a gap is formed between the movable member and the case body in the internal space . A ring cord that is pulled out from the case body;
The ring cord is
A cable having a core wire and a covering material covering the core wire, the core wire extending from an end portion in the longitudinal direction of the covering material toward the electronic component and electrically connected to the electronic component;
A ring member formed to cover the end of the covering material by injection molding,
Said movable member, said a ring member, an electronic device according to claim 1. The electronic device according to claim 1 , wherein the movable member is a connector member including a pin for external connection of the electronic device. A case body forming an internal space for accommodating electronic components;
The electronic component is sealed, and is provided so as to fill the inner space, and a resin part having a linear expansion coefficient of more than 90 × 10 -6 ^/ ℃,
The case body has an inner surface that defines the internal space,
In the case body,
The resin having a concave shape that is recessed from the inner surface, and communicating between the resin gate portion used when filling the resin into the internal space, the internal space, and the external space outside the case body, A communication hole is formed in the gate portion,
The communication hole has an opening area equal to or less than an area corresponding to a circle of φ0.8 mm. A case body forming an internal space for accommodating electronic components;
90 × 10 is provided so as to seal the electronic component and fill the internal space. ^-6 With a resin part having a linear expansion coefficient of at least
The case body is formed with a through hole that allows communication between the internal space and an external space outside the case body,
A closing portion provided to partially close the through hole;
The closing part is a movable member that is disposed in the internal space so as to partially overlap the through hole and is provided in contact with the resin part,
The movable member is fitted to the case body so that a gap is formed between the movable member and the case body in the internal space.
The opening surface of the through hole that overlaps with the resin portion has an opening area equal to or less than an area corresponding to a circle of φ0.8 mm.

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