JPH0990306A - Substrate drying nozzle - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a substrate drying nozzle constituted in such a manner that the uniform substrate drying free from unequal drying by using general materials, such as stainless steel, is made possible and the efficient drying under a low pressure is made possible. SOLUTION: This substrate drying nozzle consists of a gas supplying port, a first buffer chamber 5, a second buffer chamber 7 having a gas throttling means 6 and flow regulating means 8 and a slit-like injection port 9.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a nozzle for injecting a gas to dry a glass substrate for a liquid crystal panel, a printed circuit board or the like.

[0002]

2. Description of the Related Art A glass substrate for liquid crystal and a printed circuit board are chemically treated and then washed with pure water and dried with air.
Alternatively, a gas such as nitrogen is jetted from a nozzle to dry the substrate. This drying method is commonly called an air knife drying method.

As the size of the substrate is increased to 500 × 600 mm, the length of the drying nozzle is also 600 to 700 mm.
Therefore, it becomes difficult to uniformly inject the gas over the entire width of the substrate.

In order to uniformly dry the substrate, the pressure of the gas applied to the drying nozzle is increased, the number of drying nozzles is increased to two, or the slit width of the injection port is narrowed to several tens of microns. We are trying to solve the problem by changing the injection angle.

[0005]

However, increasing the gas pressure not only increases the gas consumption, but also increases the gas consumption.
There was a defect that particles in the apparatus were scattered and reattached to the substrate to deteriorate the drying quality of the substrate.

Further, in order to narrow the slit width to 30 to 50 μm, there is a defect that materials such as ceramics and sapphire, which are difficult to process, must be used because accuracy cannot be ensured with materials such as general stainless steel. It was

Further, this type of drying nozzle has a defect that a slight change in slit width leads to uneven drying.

An object of the present invention is to make it possible to uniformly dry a substrate by using a material such as general stainless steel, and to dry the substrate efficiently at a low pressure. Is to provide.

Another object of the present invention is to provide a substrate drying nozzle capable of high quality drying without particle adhesion.

[0010]

To achieve the above object, the present invention comprises a gas supply port, a first buffer chamber, a second buffer chamber provided with a gas throttle means and a rectifying means, and a slit-shaped jet port. It is characterized by

[0011]

DESCRIPTION OF THE PREFERRED EMBODIMENTS The present invention will be described below with reference to the drawings.

FIG. 1 is a schematic perspective view showing the arrangement of the drying nozzles. The substrate 1 is conveyed in the direction 2 in a horizontal state by using a rotating roller (not shown) or the like.

The drying nozzles 3 are arranged close to both the front and back surfaces of the wet substrate, and spray gas to dry the substrate. Clean dry air or nitrogen is used as the gas.

FIG. 2 is a vertical sectional view of the substrate drying nozzle of the present invention, FIG. 3 is a side view thereof, and FIG. 4 is a perspective view of a corrugated plate serving as the gas rectifying means of the present invention.

The drying nozzle 2 is divided into 12 and 13 and is abutted by screws 14. The compressed gas for drying is supplied from the supply port 4, introduced into the first buffer chamber 5, once throttled by the throttle gap 6, and then the second buffer chamber 7
At the same time, the pressure is equalized again, and at the same time, the gas is jetted from the slit-shaped jet port 9 by being straightened by the straightening plate 8.

By providing the corrugated plate shown in FIG. 4 in the second buffer chamber 7, the gas is uniformly ejected from the ejection port 9 and uniform substrate drying is possible.

In the conventional drying nozzle, the slit width of the injection port 9 had to be 30 to 50 μm in order to perform uniform drying, but in the present invention, the aperture gap 6 and the second gap.
Since the slit width of the injection port 9 can be increased to 0.08 to 0.15 mm by adding the buffer chamber 7 and the rectifying plate 8 of (1), general stainless steel can be used.

By fixing the height 10 of the corrugated plate 8 to be larger than or equal to the width 11 of the second buffer chamber 7, the corrugated plate 8 is fixed inside the second buffer chamber 7. As a result, stable gas rectification is performed.

Further, since the gas is uniformly jetted over the entire width of the substrate by the straightening plate, the pressure of the gas is 1.5 to 1.5.
It has become possible to reduce it from 2.0 kgf / cm ² to 0.5 kgf / cm ² . In addition, not only the gas use efficiency was improved due to the reduced pressure, but also the generation of particles was reduced and the drying quality was improved.

[0020]

As described above, the present invention has the following effects.

The substrate can be uniformly and evenly dried, and efficiently dried with a gas having a low pressure and a small flow rate. In addition, high quality drying with less particle adhesion can be obtained.

[Brief description of drawings]

FIG. 1 is a schematic perspective view showing an arrangement state of a drying nozzle of the present invention.

FIG. 2 is a vertical sectional view of a substrate drying nozzle of the present invention.

FIG. 3 is a side view of the substrate drying nozzle of the present invention.

FIG. 4 is a perspective view of a corrugated plate that serves as gas rectifying means of the present invention.

[Explanation of symbols]

1 ... Substrate, 2 ... Substrate transport direction, 3 ... Drying nozzle, 4 ...
Supply port, 5 ... First buffer chamber, 6 ... Restriction gap, 7 ... Second buffer chamber, 8 ... Straightening plate, 9 ... Injection port, 10 ... Height of corrugated plate 8, 11 ... Width of buffer chamber 7 , 14 ... screws.

Claims (3)

[Claims] 1. A nozzle for injecting a gas to dry a substrate, comprising a gas supply port, a first buffer chamber, a second buffer chamber provided with a gas throttle means and a rectifying means, and a slit-shaped jet port. Characteristic substrate drying nozzle. 2. The substrate drying nozzle according to claim 1, wherein the rectifying means is a corrugated plate. 3. The substrate drying nozzle according to claim 2, wherein the height 10 of the corrugated plate is larger than or equal to the width 11 of the second buffer chamber.