JPH0989930A - Contact for electronic equipment and its manufacture - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a stable and long-life contact by covering the contact part of a base body made of Va or Via group metal or their metal alloy, with gas-phase-synthesized diamond, and by covering the outer surface of the covered contact part with metal. SOLUTION: A W-needle-like body 5 is formed of high-purity W wire having a diameter of about 0.25mm with no crack, cut and processed at its front end part. Then, it is washed and introduced into a CVD device so as to form a diamond clad 6 over the front end part of the body 5 by gas-phase synthesization. The clad 6 has a thickness of about 3 to 10μm, and is then formed over its outer surface with an Ni clad 7 having a thickness of about 3 to 5μm by electroless plating. Thus formed needle-like body 5 can be used by being bent. Even though the front end face of the clad 7 is worn so as to expose the clad 6 after using, the clad 6 can also sufficiently break the oxide film so that the clad 7 at one side surface carried out electrical conduction. The clad 6 is hard, highly wear-resistant and stable, and can perform long-life probing. Further, the completely same effects as that obtained by W can be obtained even with the use of Mo or Cr of Va group or Ta, Mb or V of VIa group.

Description

Detailed Description of the Invention

[0001]

TECHNICAL FIELD The present invention relates to an IC / LSI, for example.
The present invention relates to a probe for a continuity test of a chip, a contact for electronic equipment used as a contact jig for mediating a chip and a tester.

[0002]

2. Description of the Related Art FIG. 4 shows an example of a W-made probe pin 1 having a pin tip surface diameter A of 50 μm, a polished tapered portion B of 3000 μm, a bending angle C of 103 °, and a pin diameter D of 250 μm.
m.

FIG. 5A shows an example of the continuity test using the probe pin 1. The tip portion A of the probe pin 1 attached to the epoxy probe card substrate 2 is L.
Many bonding pads 4 provided on the SI die 3
, And breaks the oxide film on the electrode surface to conduct electricity. In order to break this oxide film, the probe pin 1 has a tip A
Until they come into contact with each other, they are relatively moved as shown by the arrow in FIG. 5B.

Touch-down such as contact, movement, and detachment is repeatedly performed, and there is a problem that stable brobbing cannot be obtained due to adhesion of aluminum chips to the tip portion A and abrasion of the tip portion A.

[0005]

The above problem is further urgent because the number of pins is increased and the bonding pad pitch is reduced in accordance with the high integration of the LSI and the reduction in size and weight of the package. In order to prevent abrasion, it is considered that diamond fine particles are attached to the tip of the pin by Ni plating, or a contact method that does not rely on the pin type is considered, but this is not enough at the end, and it is a stable and long-life contactor. Is required.

[0006]

The present invention is a material having a required strength both in the conventional pin type brobbing and in the contactor having a protruding contact portion other than the pin type, and It has been reached as a result of trial production by selecting a material that can be coated with diamond by the phase synthesis method, and has the following features.

At least a contact portion of a needle-shaped or plate-shaped substrate made of a Va or V1a single metal or an alloy thereof is provided with a diamond coating by a vapor phase synthesis method, and the outer surface of the coating is provided. It is a contactor provided with a metal coating.

Another feature is that the diamond coating is not made solid and a part of the metal coating on the outer surface is directly adhered to the substrate.

One of the features is that the base is needle-shaped and is used as a probe card pin.

Still another feature is, as a method of manufacturing the above-mentioned contactor, a step of charging a substrate into a microwave CVD apparatus to apply a diamond coating, and a metal plating on the outer surface of the diamond coating. And the step of applying.

[0011]

BEST MODE FOR CARRYING OUT THE INVENTION

EXAMPLE FIG. 1 is a side view of a W needle-shaped body 5 produced by cutting a W line. D is a diameter, L is a length, B is a tapered tip portion length, θ is a tip angle, and A is a tip angle. It is the tip surface diameter. 7 is a diamond coating 6 formed by the vapor phase synthesis method described later.
Is a Ni coating deposited by electroless plating.

The dimensions of each part of the W needle-shaped body 5 are as shown in Table 1. A W wire having a diameter of 0.25 mm and a purity of 100% was applied to an ultrasonic flaw detector to confirm that there were no cracks, and then cut.
It was manufactured by performing tip processing.

[0013]

[Table 1]

The surface roughness of this W needle 5 is 0.2 μmR.
At about a, this was thoroughly washed, charged into a CVD apparatus, and its tip was coated with diamond 6 under the following conditions. The charging was performed by inserting a large number of the W needle-shaped bodies 5 into a perforated holding plate made of Si with the tip end facing upward and holding it.

Equipment used Hot filament CVD equipment Microwave CVD equipment (the number of needles charged) 400 to 600 100 H ₂ flow rate 1000 CCM 200 CCM CH ₄ flow rate 12 CCM ₂ CCM pressure 100 Torr 30 Torr substrate temperature 900 ° C. 900 ° C. holding time 7 Time 7 hours

The diamond coating 6 thus formed has a thickness of 3
˜10 μm, a Ni coating 7 is formed on the outer surface by electroless plating as shown in FIG.
˜5 μm thick.

The coated needle-shaped body 5 thus formed is used after being bent into the same shape as the probe card pin shown in FIG. FIG. 2B shows a state in which the tip surface of the Ni coating 7 is worn and the diamond coating 6 is exposed by use. Even in this shape, the oxide film can be sufficiently broken on the exposed surface, and conduction can be performed by the Ni coating 7 on the side surface portion. Moreover, the exposed surface is hard to be attached with aluminum scraps and is hard and has excellent abrasion resistance, so that long-life and stable blobbing can be performed.

FIG. 3A shows the formation of the diamond coating 6.
The coating is not made solid at the stage of initial nucleation, a gap of about 3 μm is left between fine diamond particles, and a Ni coating 7 is applied thereon. Therefore, the Ni coating 7 is partially W
It is directly attached to the needle-shaped body 5.

FIG. 3B shows a state in which it is used and worn similarly to FIG. 2B, and it has the features that abrasion resistance is maintained and conductivity is good due to the coexistence of fine diamond particles and Ni coating.

The W needles have sufficient strength, and if the surface is clean, the diamond can be easily coated by the vapor phase synthesis method without any special surface treatment. Moreover, the formed coating adheres firmly, and due to the strength of W and the wear resistance of the diamond coating, it does not cause deformation or damage,
The coating provides the required conduction.

As shown in Table 2, this effect can be expected also in high melting point metals of the same kind as W, such as Mo and Cr in the Va group and in the VIa groups of Ta, Nb, and V. The other metals of the Va group and the VIa group or alloys thereof can be used.

[0022]

[Table 2]

Although the coating metal is Ni in the embodiment,
Since it is applied to maintain conductivity, other metals such as Ti-Pt-Au and Ti, which have better conductivity, can be used, and the coating method can be selected accordingly.
At the trial production stage, the microwave method seemed to be more suitable than the hot filament method for obtaining a fine diamond coating. Note that diamond-like carbon may be included in diamond.

[0024]

According to the present invention, it is possible to easily provide a contactor having a long service life and stable probing.

[Brief description of drawings]

FIG. 1 is a side view showing the shape and dimensions of a W needle-shaped body of an example.

2A is an enlarged view of a side cross-section of the tip end portion of FIG. 1, and FIG. 2B is a drawing explaining a state in which the tip end portion of A is worn.

FIG. 3A is an enlarged view of a side cross section of a tip end portion of an embodiment different from FIG. 2, and FIG.

FIG. 4 is a side view illustrating an example of a conventional probe card pin.

5A is a schematic diagram illustrating an example of a continuity test using the pins of FIG. 4, and B is a partially enlarged view thereof.

[Explanation of symbols]

1 Probe card pin 2 Epoxy probe card substrate 3 LSI die 4 Bonding pad 5 W needle-shaped body 6 Diamond coating 7 Ni coating A W Tip surface diameter of needle-shaped body (tip surface diameter of probe card pin) B W Needle-shaped body Tapered length C Bend angle of probe card pin D W Needle diameter (diameter of probe card pin) L W Needle length

Claims (4)

[Claims] 1. A substrate made of a Va or VIa single metal or an alloy thereof, at least a contact portion is coated with diamond by a vapor phase synthesis method, and an outer surface of the coating is provided with a metal coating. A contactor for electronic equipment, which is characterized in that 2. The contact according to claim 1, wherein the diamond coating is not solid and the metal coating on the outer surface of the coating is partially adhered directly to the substrate. 3. The contactor according to claim 1, wherein the substrate is a probe card pin. 4. The method according to claim 1, further comprising a step of loading the substrate into a microwave CVD apparatus to apply a diamond coating, and a step of applying a metal plating to the outer surface of the diamond coating. Or the method of manufacturing the contactor according to 3.