JPH0982866A - Hybrid integrated circuit device - Google Patents
Hybrid integrated circuit deviceInfo
- Publication number
- JPH0982866A JPH0982866A JP7256819A JP25681995A JPH0982866A JP H0982866 A JPH0982866 A JP H0982866A JP 7256819 A JP7256819 A JP 7256819A JP 25681995 A JP25681995 A JP 25681995A JP H0982866 A JPH0982866 A JP H0982866A
- Authority
- JP
- Japan
- Prior art keywords
- housing
- integrated circuit
- substrate
- contact
- hybrid integrated
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
Landscapes
- Coupling Device And Connection With Printed Circuit (AREA)
Abstract
Description
【０００１】[0001]
【産業上の利用分野】この発明は、混成集積回路装置に
おける基板へのリード端子の接続構造に関するものであ
る。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a lead terminal connection structure to a substrate in a hybrid integrated circuit device.
【０００２】[0002]
【従来の技術】従来の混成集積回路装置に於いては、図
７に示す様に、混成集積回路基板１０１の端部に、端部
がコ字状１０５ａに形成されたクリップ状のリードピン
１０５が半田付けされている。そして電源モジュール等
では基板１０１に取り付けられたリードピン１０５の先
端がハウジング１０４を介してマザーボード１０６に半
田付けされている。この様に、リードピン１０５はその
両端部が基板１０１とマザーボード１０６にそれぞれ半
田付けされているため、この装置が熱の影響を受けた場
合、基板１０１とマザーボード１０６の熱に対する影響
の受け方の相違により、両者の受けた影響の差がリード
ピン１０５に集中してしまうこととなっていた。そのた
め従来は、リードピン１０５基部に撓み吸収のための湾
曲部１０５ｂを設けていた（類似の構造は特開昭６３−
２８０５２号参照）。2. Description of the Related Art In a conventional hybrid integrated circuit device, as shown in FIG. 7, a clip-shaped lead pin 105 having a U-shaped end 105a is formed at an end of a hybrid integrated circuit board 101. It is soldered. In the power supply module or the like, the tips of the lead pins 105 attached to the substrate 101 are soldered to the motherboard 106 via the housing 104. In this way, since both ends of the lead pin 105 are soldered to the board 101 and the mother board 106 respectively, when this device is affected by heat, the difference in the way the board 101 and the mother board 106 are affected by heat. However, the difference between the influences of the two is concentrated on the lead pin 105. Therefore, conventionally, a curved portion 105b for absorbing bending is provided at the base of the lead pin 105 (a similar structure is disclosed in Japanese Patent Laid-Open No. 63-
28052).
【０００３】[0003]
【発明が解決しようとする課題】しかしながら、湾曲部
１０５ｂを設けて熱ストレスの影響を小さくするように
したものの、湾曲部１０５ｂ上方のリードピン１０５が
長いため変形し易く、組み付け時に複数のリードピン１
０５，１０５，・・の姿勢が揃え難くなってリードピン
１０５，１０５，・・のハウジング１０４への挿通作業
性が悪くなるという問題点があった。また、不揃い変形
を起こした場合、それを矯正しようとして半田付け部に
クラックを発生させてしまう事もあった。However, although the curved portion 105b is provided to reduce the effect of thermal stress, the lead pin 105 above the curved portion 105b is long and is easily deformed, so that a plurality of lead pins 1 can be assembled.
There is a problem that the postures of the lead pins 105, 105, ... Are difficult to align and the workability of inserting the lead pins 105, 105 ,. In addition, when the irregular deformation occurs, cracks may be generated in the soldered portion in an attempt to correct it.
【０００４】又、クリップ状のリードピン１０５を基板
に半田付けするにはディップ工法を用いる必要があり、
これは電子素子類１０２，１０２，・・・を半田付けす
るリフロー工法とは別の工法であるため、生産性が悪く
ならざるを得なかった。この発明は、上記従来の問題に
鑑みて成されたもので、熱ストレスに強く、生産性の良
い混成集積回路装置を提供するものである。Further, in order to solder the clip-shaped lead pin 105 to the substrate, it is necessary to use the dip method.
Since this is a construction method different from the reflow construction method of soldering the electronic elements 102, 102, ..., The productivity must be deteriorated. The present invention has been made in view of the above conventional problems, and provides a hybrid integrated circuit device that is resistant to thermal stress and has good productivity.
【０００５】[0005]
【課題を解決するための手段】請求項１記載の発明で
は、ハウジングと、ハウジングの底部に配置した基板
と、基板上に載置した電子素子と、該基板上に載置した
可撓性を有する接点と、ハウジングに支持され前記可撓
性接点に当接するリードピンとからなることを特徴とし
ている。According to a first aspect of the present invention, there are provided a housing, a substrate arranged at the bottom of the housing, an electronic element mounted on the substrate, and a flexibility mounted on the substrate. And a lead pin supported by the housing and in contact with the flexible contact.
【０００６】請求項２記載の発明では、可撓性接点は、
基板への接合片と、リードピンとの接触片と、接合片と
接触片を結ぶ連結片とを有する導電性の板材からなるこ
とを特徴としている。According to the second aspect of the invention, the flexible contact comprises:
It is characterized in that it is made of a conductive plate material having a joining piece to the substrate, a contact piece with the lead pin, and a connecting piece connecting the joining piece and the contact piece.
【０００７】[0007]
【実施例】図１乃至図４はこの発明の第１実施例を示す
もので、１は基板、２，２，・・は基板上に半田付けさ
れた電子素子、３，３，・・は同じく基板１上に半田付
けされた可撓性接点、４はハウジング、５，５，・・は
ハウジングに装着されたリードピン、６はマザーボード
である。1 to 4 show a first embodiment of the present invention, in which 1 is a substrate, 2, 2, ... Are electronic elements soldered on the substrate, 3, 3 ,. Similarly, flexible contacts soldered on the substrate 1, 4 is a housing, 5, 5, ... Are lead pins mounted on the housing, and 6 is a mother board.
【０００８】基板１は、アルミニウム等の金属板からな
り、表面にアルミナ（Ａｌ2Ｏ3）等の絶縁層１１、及び
この絶縁層１１上部の導電路１２を有している。導電路
１２には、電子素子２，２，・・及び可撓性接点３，
３，・・が半田付けされている。The substrate 1 is made of a metal plate of aluminum or the like, and has an insulating layer 11 of alumina (Al 2 O 3 ) or the like on the surface and a conductive path 12 above the insulating layer 11. The conductive path 12 includes electronic elements 2, 2, ...
3, ... are soldered.
【０００９】可撓性接点３，３，・・は、銅系合金の薄
板材を略Ｓ字状に形成し、下面を基板１への接合片３
１、上面を後述のリードピン５，５，・・との接触片３
２、接合片３１と接触片３２との間を結ぶ部材を上下方
向に撓む連結片３３としている。また接合片３１と接触
片３２の両端部を折り返した折り返し片３４，３５を形
成し、接合片３１と接触片３２との剛性を上げて互いに
平行な平面状の上下面を構成している。The flexible contacts 3, 3, ... Form a thin plate material of a copper-based alloy in a substantially S-shape, and the lower surface thereof is a joining piece 3 to the substrate 1.
1, the contact piece 3 on the upper surface with the lead pins 5, 5, ...
2. A member that connects the joining piece 31 and the contact piece 32 is used as a connecting piece 33 that bends in the vertical direction. Further, folding pieces 34 and 35 are formed by folding back both ends of the joining piece 31 and the contact piece 32, and the rigidity of the joining piece 31 and the contact piece 32 is increased to form flat upper and lower surfaces parallel to each other.
【００１０】リードピン５，５，・・は、可撓性接点
３，３，・・と同様の銅系合金等の導電材料で形成され
た端子で、その中央部をハウジング４に圧入支持し、下
端部５１を上記可撓性接点の接触片３２に連なる折り返
し片３５に接触させ、上端部５２をマザーボード６に半
田付けされている。The lead pins 5, 5, ... Are terminals made of a conductive material such as copper alloy similar to the flexible contacts 3, 3 ,. The lower end portion 51 is brought into contact with the folding piece 35 connected to the contact piece 32 of the flexible contact, and the upper end portion 52 is soldered to the mother board 6.
【００１１】ハウジング４は、６−６ナイロン等のプラ
スチックからなる断面コ字状の部材で、両自由端部近傍
の対抗面４１，４１に基板１を保持する係止部４３，４
３を有していると共に、対抗面４１，４１を結ぶ接続片
４２には、可撓性接点３，３，・・対応位置にリードピ
ン５，５，・・を挿通する孔４４，４４，・・を形成し
てある。The housing 4 is a member made of plastic such as 6-6 nylon and having a U-shaped cross section. The housing 4 holds the board 1 on the opposing surfaces 41, 41 near both free ends.
3, the connecting piece 42 connecting the opposing surfaces 41, 41 has holes 44, 44, ... For inserting the lead pins 5, 5, ..・ Has been formed.
【００１２】上記構成の混成集積回路装置は、導電路１
２が形成された基板１上に電子素子２，２，・・と共に
可撓性接点３，３，・・を載置し、リフロー工法により
電子素子２，２，・・と可撓性接点３，３，・・を基板
１に同時に半田付けする。一方、ハウジング４にはリー
ドピン５，５，・・を圧入し、その後ハウジング４の対
抗面４１，４１を広げて係止部４３，４３に基板１を挿
入することにより、リードピン５，５，・・の下端部が
可撓性接点３，３，・・の接触片３２，３２，・・に連
なる折り返し片３５，３５，・・に当接し、両者が導通
する。その後、リードピン５，５，・・の先端５２，５
２，・・を、マザーボード６に半田付けする。The hybrid integrated circuit device having the above-mentioned structure is provided with a conductive path 1.
.. and flexible contacts 3, 3, .. are mounted together with the electronic elements 2, 2, ... On the substrate 1 on which the electronic elements 2, 2 ,. , 3, ... Are simultaneously soldered to the substrate 1. On the other hand, the lead pins 5, 5, ... Are pressed into the housing 4, and then the opposing surfaces 41, 41 of the housing 4 are expanded to insert the substrate 1 into the locking portions 43, 43. The lower end portion of * contacts the folding pieces 35, 35, ... connected to the contact pieces 32, 32, ... of the flexible contacts 3, 3, ..., so that both are electrically connected. After that, the tips 52, 5 of the lead pins 5, 5, ...
2, ... Solder to the mother board 6.
【００１３】そして、この混成集積回路装置が熱を受け
た場合、基板１とマザーボード６の影響をそれぞれに半
田付けされたリードピン５，５，・・が受ける事になる
が、リードピン５，５，・・の下端部が当接する可撓性
接点３，３，・・は、接触片３２，３２，・・に連なる
折り返し片３５，３５，・・での接触を維持したまま連
結片３３，３３，・・が上下方向に撓むので、可撓性接
点３，３，・・、リードピン５，５，・・の半田付け部
に無理な力が加わる事によるクラックが発生することが
ない。When the hybrid integrated circuit device receives heat, the lead pins 5, 5, ... Soldered to the substrate 1 and the mother board 6, respectively, are affected. ··································· s flexible contacts 3,3 ,. Since the ..., ... Bend in the vertical direction, cracks do not occur due to an excessive force being applied to the soldered portions of the flexible contacts 3, 3 ,.
【００１４】図５に示すものは、この発明の第２実施例
で、上記第１実施例の可撓性接点３がＳ字状であったも
のを、Σ状としたものであり、この実施例の場合も、上
記実施例と同様接合片３１ａ、接触片３２ａ、連結片３
３ａにより同様の作用効果を有する。尚この実施例で
は、連結片３３ａがク字状に形成され第１実施例に比べ
変曲部が多くなっているのでより上下方向に撓み易い。FIG. 5 shows a second embodiment of the present invention, in which the flexible contact 3 of the first embodiment, which has an S shape, is changed to a Σ shape. Also in the case of the example, the joining piece 31a, the contact piece 32a, and the connecting piece 3 are the same as in the above embodiment.
3a has the same effect. In this embodiment, since the connecting piece 33a is formed in a square shape and the number of inflection portions is larger than that in the first embodiment, it is easier to bend in the vertical direction.
【００１５】図６に示すものは、この発明の第３実施例
で、上記第１実施例の可撓性接点３がＳ字状であったも
のを、コ字状としたものである。この実施例の場合は、
リードピン５，５，・・に負荷が加わった時、連結片３
３ｂが直接撓むのではなく、接触片３２ｂがその基部よ
り撓む事となる。従って、熱の影響を受けた場合リード
ピン５，５，・・と接触片３２ｂとの成す角度が変化す
ることとなるが、これにより、接触片３２ｂに形成され
る表面酸化膜が破られるいわゆるワイピング効果を奏す
ることが出来る。FIG. 6 shows a third embodiment of the present invention in which the flexible contact 3 of the first embodiment is S-shaped but is U-shaped. In this example,
When load is applied to the lead pins 5, 5, ...
The contact piece 32b does not bend directly, but the contact piece 32b bends from its base. Therefore, when affected by heat, the angle formed by the lead pins 5, 5, ... And the contact piece 32b changes, which causes the surface oxide film formed on the contact piece 32b to be broken. It can produce an effect.
【００１６】[0016]
【発明の効果】請求項１の発明では、基板上に載置した
可撓性を有する接点と、ハウジングに支持され前記可撓
性接点に当接するリードピンとから構成したので、混成
集積回路装置が熱の影響を受けた場合でも、可撓性接点
の変形によりそれぞれの半田付け部に無理な力が加わる
事を防止出来、もって半田付け部のクラックの発生を防
止できる。又、可撓性接点とリードピンとが別部品で構
成されているため、基板には突出したリードピンが存在
せず、外力によるリードピンの変形を防止する事が出
来、基板のハウジングへの組み付け作業性も向上する。
更に、可撓性接点自身は小さな部品として構成されるの
で、基板に対し電子部品と同様に載置し、同時にリフロ
ー工法での半田付けが出来るので作業性が向上すると共
に、電子部品と共に自動組付も容易となる。According to the first aspect of the present invention, since the flexible contact is mounted on the substrate and the lead pin supported by the housing is in contact with the flexible contact, the hybrid integrated circuit device can be realized. Even when affected by heat, it is possible to prevent an unreasonable force from being applied to each soldering portion due to the deformation of the flexible contacts, and thus to prevent cracking of the soldering portion. In addition, since the flexible contact and the lead pin are configured as separate parts, there is no protruding lead pin on the board, and it is possible to prevent deformation of the lead pin due to external force, and workability of assembling the board to the housing. Also improves.
Furthermore, since the flexible contact itself is configured as a small component, it can be placed on the substrate in the same manner as an electronic component, and at the same time soldering by the reflow method can be performed, improving workability and automatically assembling with electronic components. Attaching becomes easy.
【００１７】請求項２の発明では、可撓性接点を、基板
への接合片と、リードピンとの接触片と、接合片と接触
片を結ぶ連結片とを有する導電性の１枚の板材から構成
してあるので、構造が簡単で、性能の安定した生産性の
良い装置が得られる。According to the second aspect of the invention, the flexible contact is made of a single conductive plate member having a joining piece to the substrate, a contact piece with the lead pin, and a connecting piece connecting the joining piece and the contact piece. Since it is configured, a device having a simple structure, stable performance, and good productivity can be obtained.
【図１】この発明の１実施例を示す一部破断正面図であ
る。FIG. 1 is a partially cutaway front view showing an embodiment of the present invention.
【図２】図１におけるハウジングの構成を示す斜視図で
ある。FIG. 2 is a perspective view showing a configuration of a housing in FIG.
【図３】図１における基板の構成を示す斜視図である。FIG. 3 is a perspective view showing a configuration of a substrate in FIG.
【図４】図１における可撓性接点の構成を示す斜視図で
ある。FIG. 4 is a perspective view showing a configuration of a flexible contact in FIG.
【図５】この発明における可撓性接点の第２実施例を示
す正面図である。FIG. 5 is a front view showing a second embodiment of the flexible contact according to the present invention.
【図６】この発明における可撓性接点の第３実施例を示
す正面図である。FIG. 6 is a front view showing a third embodiment of the flexible contact according to the present invention.
【図７】従来の混成集積回路装置を示す一部破断正面図
である。FIG. 7 is a partially cutaway front view showing a conventional hybrid integrated circuit device.
１ 基板 ２ 電子素子 ３ 可撓性接点 ４ ハウジング ５ リードピン ６ マザーボード ３１，３１ａ，３１ｂ 接合片 ３２，３２ａ，３２ｂ 接触片 ３３，３３ａ，３３ｂ 連結片 DESCRIPTION OF SYMBOLS 1 board 2 electronic element 3 flexible contact 4 housing 5 lead pin 6 motherboard 31, 31a, 31b joining piece 32, 32a, 32b contact piece 33, 33a, 33b connecting piece
Claims (2)
した基板と、基板上に載置した電子素子と、該基板上に
載置した可撓性を有する接点と、ハウジングに支持され
前記可撓性接点に当接するリードピンとからなることを
特徴とする混成集積回路装置。1. A housing, a substrate disposed on the bottom of the housing, an electronic element mounted on the substrate, flexible contacts mounted on the substrate, and the flexible member supported by the housing. A hybrid integrated circuit device comprising: a lead pin that abuts a contact.
ドピンとの接触片と、接合片と接触片を結ぶ連結片とを
有する導電性の板材からなることを特徴とする請求項１
記載の混成集積回路装置。2. The flexible contact is made of a conductive plate material having a joining piece to the substrate, a contact piece with the lead pin, and a connecting piece connecting the joining piece and the contact piece. 1
A hybrid integrated circuit device as described.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7256819A JPH0982866A (en) | 1995-09-08 | 1995-09-08 | Hybrid integrated circuit device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7256819A JPH0982866A (en) | 1995-09-08 | 1995-09-08 | Hybrid integrated circuit device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0982866A true JPH0982866A (en) | 1997-03-28 |
Family
ID=17297880
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP7256819A Pending JPH0982866A (en) | 1995-09-08 | 1995-09-08 | Hybrid integrated circuit device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0982866A (en) |
-
1995
- 1995-09-08 JP JP7256819A patent/JPH0982866A/en active Pending
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