JP3411981B2 - Terminal block for surface mounting, surface mounting board, and power supply device using the same - Google Patents

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a surface mounting terminal block technology for mounting, for example, a connection terminal for connecting an external circuit of a power supply device on a surface mounting circuit board.

[0002]

2. Description of the Related Art Conventionally, a surface mount board has been used in which an insulating film is coated on one surface of a metal plate such as aluminum, a circuit pattern is formed on the surface, and electric parts are soldered to the surface. Has been.

On such a surface mount board, when mounting a connection terminal pin for connecting to another external circuit,
A fixed connection means such as in a normal insulating board, that is, a means of providing a through hole in a circuit pattern portion of the board, inserting a connection pin therein and temporarily fixing it, and then soldering on the back surface of the board is adopted. I can't.

Therefore, in order to easily and surely mount terminal pins for connecting an external circuit on the surface of such a surface mount board,
The present applicant has already proposed a surface mounting terminal block in which a connection terminal pin having a nail-shaped tip shape is vertically soldered to a surface mounting substrate (Actually Published Unexamined Utility Model Application No. 4-13336).
No. 2).

[0005]

By the way, when mounting the connection terminal pins on the surface of the surface mounting board using the above-mentioned conventional surface mounting terminal block, the connection of the surface mounting board printed with cream solder is applied. The connection terminal pins are erected and temporarily fixed on the terminal land, and soldering is performed by reflow soldering.However, at that time, the connection terminal pins and the surface mounting board are deformed by thermal expansion and contraction. The amount of the applied solder is not sufficient to attach the solder to the connection terminal pin, and the tensile strength of the connection terminal pin is insufficient or the durability cannot be sufficiently satisfied. Therefore, conventionally, it is necessary to further increase the amount of solder by a dispenser or the like after printing, and as a result, the work time increases, and there is a problem that the amount of solder varies and the reliability becomes insufficient. there were.

The present invention has been made in order to solve the problems of the prior art as described above, and is capable of reliably soldering the connection terminal pins to the surface mounting substrate with a small amount of solder. An object of the present invention is to provide a terminal block, a highly reliable surface mount substrate, and a power supply device using the same.

[0007]

The invention according to claim 1 made in order to achieve the above object is a surface mounting terminal block for mounting connection terminal pins for external circuit connection on the surface of a circuit board. Therefore, the above-mentioned connection terminal pin is a rod-shaped wire.
By bending, a substantially U-shaped curved portion is provided at the mounting side end portion, and a linear mounting portion is formed at the tip of the curved portion, and a plurality of the connection terminal pins are arranged on an insulating support base. The surface mounting terminal block is characterized in that

According to the first aspect of the present invention, since the mounting side end portion of the connection terminal pin is provided with the substantially U-shaped curved portion, the connection terminal pin undergoes thermal expansion and thermal contraction during soldering. When this happens, the curved portion bends and twists, and as a result, the deformation stress generated in the connection terminal pin is absorbed, and this can be reduced. Therefore, according to the first aspect of the invention, it is not necessary to further increase the amount of solder by a dispenser or the like after the cream solder is applied by printing.

Further, since the linear mounting portion is formed at the tip of the curved portion of the connection terminal pin, it is possible to secure a large contact area between the mounting portion and the printed wiring board. The mounting strength is improved.

In this case, as in the invention described in claim 2,
In the invention according to claim 1, it is also effective that the connecting portion for connecting to the external circuit of the connecting terminal pin is provided at the tip portion of the shaft portion extending in the direction orthogonal to the mounting portion.

According to the second aspect of the present invention, when the connecting terminal pin is thermally expanded and contracted during soldering, the bending portion sufficiently absorbs the deformation stress generated in the connecting terminal pin, thereby reducing the deformation stress. can do.

[0012] Further, like the invention according to claim 3, in the invention according to any one of claims 1 and 2, the curved portion of each connection terminal pin extends in a direction along the arrangement direction of the connection terminal pin. It is formed so as to be curved toward, especially claim 4.
It is also effective to be formed so as to be curved in the same direction as in the described invention.

According to the third or fourth aspect of the invention, since the curved portions of the connection terminal pins are aligned along the arrangement direction of the connection terminal pins, there is no unnecessary protruding portion, and the surface mounting terminal block is mounted. The area can be reduced.

Further, like the invention described in claim 5, in the invention described in any one of claims 1 to 4, it is also effective that the connection terminal pin is provided with a plurality of curved portions.

According to the fifth aspect of the present invention, since the deformation stress generated in the connection terminal pins during soldering is dispersed in the plurality of curved portions, the deformation stress can be absorbed and reduced further. .

On the other hand, the invention according to claim 6 is that the surface mounting terminal block according to any one of claims 1 to 5 is mounted on a surface of a circuit board having a metal base. Is a surface mount substrate.

According to the sixth aspect of the invention, even if the circuit board undergoes a large thermal expansion or thermal contraction due to a temperature change caused by soldering, the bending portion is deformed in accordance with the thermal expansion and contraction. Can be absorbed.

According to a seventh aspect of the present invention, the surface mounting terminal block according to any one of the first to fifth aspects is mounted on the input and output portions of the circuit board having a metal base. It is a power supply device characterized in that.

According to the invention described in claim 7, it is possible to obtain a power supply device having a compact structure which is highly resistant to thermal deformation at the time of connection to an external circuit and has high reliability.

[0020]

BEST MODE FOR CARRYING OUT THE INVENTION Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings. FIG. 1 is an exploded perspective view showing an example of a power supply device using a surface mounting terminal block according to an embodiment of the present invention. As shown in FIG. 1, the power supply device 1 includes a printed wiring board 2 as a rectangular circuit board having a component mounting area 2a on which various electric components are mounted, a surface mounting terminal block 3 described later,
And a case 4 for covering the mounted electric parts.

The printed wiring board 2 is, for example, a glass-epoxy resin layer formed on a rectangular plate-shaped metal substrate, and the component mounting area 2a excluding the edge portion thereof.
In addition, a wiring pattern (not shown) is formed to mount an electric component such as a power supply. Holes 2b for fixing the surface mounting terminal block 3 are provided at the four corners of the printed wiring board 2. Further, a connection pattern 2c corresponding to a connection terminal pin 6 to be described later is formed on a pair of short edge portions of the printed wiring board 2, and each short edge portion of the printed wiring board 2 has the same surface mounting structure. The terminal block 3 for is attached.

FIG. 2 is a front view showing the overall configuration of the surface mounting terminal block 3, and FIGS. 3A and 3B show the overall configuration of the connection terminal pins 6 provided on the surface mounting terminal block 3. 3A is a front view and FIG. 3B is a side view.

As shown in FIG. 2, the surface mounting terminal block 3
Is composed of, for example, an insulating base portion 5 formed by injection molding of plastic, and a plurality of connection terminal pins 6 press-fitted at equal intervals into a support portion 5a of the base portion 5.

The base portion 5 has an elongated support portion 5a for supporting the connection terminal pins 6, and leg portions 5b are integrally provided at both ends thereof. Then, the bottom of both sides of the leg portions 5b of the base portion 5, a positioning projection 5c is provided to the hole 2b and the fitting provided on the four corners of the printed circuit board 2. Further, locking members 50 for locking the base portion 5 to the printed wiring board 2 are provided on the side surfaces of the both leg portions 5b.

On the other hand, a rib 5d is integrally formed between the support portion 5a and the leg portion 5b between the both leg portions 5b of the base portion 5,
As a result, a space is formed below the support portion 5a.

As shown in FIGS. 3 (a) and 3 (b), the connection terminal pin 6 is made of a metal material having a high conductivity, such as copper or brass, and is a thick (shorter than 0.8 mm) short rod-shaped wire. It is formed by bending. In the present embodiment, a substantially U-shaped curved portion 6b is provided at the mounting side (lower side in the figure) end of the connection terminal pin 6, and the tip of this curved portion 6b is parallel to the printed wiring board 2. A linear mounting portion 6a to be soldered to is formed.

On the other hand, a shaft portion 6c extending in a direction perpendicular to the mounting portion 6a is provided at the end portion of the curved portion 6b on the external circuit connection side (upper side in the drawing).

Further, a crushed portion 6d is formed in the middle of the shaft portion 6c so that the connection terminal pin 6 is not easily removed when it is press-fitted into the base portion 5. A connecting portion 6e for connecting to another external circuit is provided at the tip of the shaft portion 6c.

As shown in FIG. 2, each connection terminal pin 6 is
The support portion 5a of the base portion 5 is press-fitted and fixed to the support portion 5a in a state where the curved portion 6b is oriented in the longitudinal direction, that is, in the arrangement direction of the connection terminal pins 6. In this case, the curved portions 6b of the connection terminal pins 6 are oriented in the same direction. Further, the connecting terminal pin 6 is fixed to the support portion 5a such that its shaft portion 6c is orthogonal to the longitudinal direction of the support portion 5a of the base portion 5.

The connection terminal pin 6 has a mounting portion 6a.
Is fixed so that its lower surface is located slightly above the lower portion of the leg portion 5b of the base 5, so that when the connection terminal pin 6 is mounted on the printed wiring board 2 , a slight gap is formed between the connection terminal pin 6 and the connection pattern 2c. Are formed.

When the surface mounting terminal block 3 of the present embodiment having such a structure is mounted on the printed wiring board 2, cream solder is printed on the connection pattern 2c of the printed wiring board 2 to form a base. The positioning protrusions 5c at the bottoms of both legs 5b of the base 5 are fitted into the holes 2b at the four corners of the printed wiring board 2. As a result, the surface mounting terminal block 3 is temporarily fixed on the printed wiring board 2 in a state where the mounting portion 6a of the connection terminal pin 6 and the cream solder on the connection pattern 2c of the printed wiring board 2 are in contact with each other.

Then, in this state, the surface mounting terminal block 3 is introduced into a reflow furnace (not shown) and heated at a predetermined temperature for reflow soldering, whereby the connection terminal pins 6 of the surface mounting terminal block 3 are connected. The mounting portion 6a of 1 is soldered to the connection pattern 2c of the printed wiring board 2 to obtain the power supply device 1 having the above configuration.

The power supply device 1 obtained in this manner has the connection terminal pins 6 for the connection terminals of an external circuit (not shown).
By soldering the connecting portion 6e of the above, electrical connection to external circuits of various devices is performed.

As described above, in the present embodiment, the substantially U-shaped curved portion 6 is provided on the mounting end side of the connection terminal pin 6.
Since b is provided, when the connection terminal pin 6 is thermally expanded and contracted during soldering to an external circuit, the curved portion 6b is bent and twisted, so that the connection terminal pin 6 is formed. The deformation stress is absorbed and can be reduced.

In particular, in the case of the present embodiment, since the shaft portion 6c is configured to extend in the vertical direction with respect to the mounting portion 6a, the connection terminal pin 6 undergoes thermal expansion and thermal contraction during soldering. At this time, the bending stress generated in the connection terminal pin 6 can be sufficiently absorbed by the bending portion 6b and reduced.

Further, since the linear mounting portion 6a is formed at the tip of the curved portion 6b of the connecting terminal pin 6, it is possible to secure a large contact area between the mounting portion 6a and the printed wiring board 2. Therefore, the mounting strength by soldering can be improved.

As described above, according to the present embodiment, even when the printed wiring board 2 having the metal base body that greatly expands and contracts due to the temperature change caused by soldering is used, By the deformation of the curved portion 6b at the same time, the deformation stress can be absorbed, so that it is not necessary to increase the amount of solder as in the conventional case, and the soldering can be reliably performed with a small amount of solder. As a result, it is possible to shorten the working time by omitting the step of increasing the amount of solder, and to improve the reliability by avoiding variations in the amount of solder.

Further, in the case of the present embodiment, since the curved portion 6b of each connection terminal pin 6 is curved in the same direction along the arrangement direction of the connection terminal pin 6, the connection terminal pin 6 has a curved shape. The curved portions 6b are aligned along the arrangement direction of the connection terminal pins 6, so that there is no unnecessary protruding portion,
The mounting area of the surface mounting terminal block can be reduced,
A compact power supply device 1 can be obtained.

FIG. 4A shows the equivalent stress at the interface between the mounting portion 6a and the solder in the connection terminal pin 6 according to the embodiment of the present invention, and FIG. 4B shows the conventional connection terminal pin. The equivalent stress at the interface between the mounting portion 106a and the solder at 106 is shown. Here, the graphs shown in FIGS. 4A and 4B show the results of stress analysis in the respective interface element portions.

As shown in FIGS. 4A and 4B, the curved portion 6
In the case of the connection terminal pin 6 of the present embodiment having b, as compared with the conventional nail-head-shaped connection terminal pin 106, the mounting portion 6a
It is understood that the equivalent stress is small at the interface elements between the solder 7 and the solder 7, and in particular, the maximum equivalent stress value is about half.

As described above, according to the present invention, it has been found that the bending stress and the torsion stress generated in the connection terminal pin 6 during soldering can be sufficiently absorbed.

The present invention is not limited to the above-mentioned embodiment, and various modifications can be made. For example,
In the above-described embodiment, the connection terminal pin is manufactured by using the rod-shaped wire, but the present invention is not limited to this, and the connection terminal pin can be manufactured by using, for example, a plate-shaped member. .

In the above embodiment, the case where the surface mounting terminal block is mounted on the surface of the substrate mainly made of a metal material has been described, but the present invention is not limited to this, and a material such as resin is used. It is also applicable to a substrate made of. However, the present invention is particularly effective when the surface mounting terminal block is mounted on the surface of a substrate mainly made of a material such as a metal that greatly expands and contracts due to heat.

FIG. 5A shows the overall structure of the connection terminal pin according to another embodiment of the present invention.
FIG. 5B shows the equivalent stress at the interface between the mounting portion and the solder in the connection terminal pin shown in FIG. 5A. In FIG. 5A, parts corresponding to those in the above embodiment are designated by the same reference numerals, and detailed description thereof will be omitted. The connection terminal pin of this embodiment is manufactured by, for example, punching. Then, the two curved portions 6b and 6f
Are continuously formed into a substantially S-shape, and a linear mounting portion 6a is formed at the tip of the bending portion 6b on the mounting side. on the other hand,
A shaft portion 6c similar to that of the above-described embodiment is provided on the external circuit connection side.
Is provided.

According to the present embodiment having the above-mentioned structure, the deformation stress generated in the connection terminal pin 6 at the time of soldering is dispersed in the two curved portions 6b and 6f, so that the deformation stress is further absorbed. Can be reduced. This means that, as shown in FIG. 5B, the equivalent stress in each interface element portion between the mounting portion 6a and the solder 7 is as shown in FIG.
It can also be understood from the fact that the curved portion 6b shown in (a) is smaller than that in the case of one of the above embodiments.

[0046]

As described above, according to the surface mounting terminal block of the present invention, it is possible to reduce the deformation stress generated in the connection terminal pins when soldering to an external circuit, and moreover, in soldering. Even when using a metal substrate that is significantly deformed due to temperature changes, the deformation stress can be reduced, so there is no need to increase the amount of solder as in the past, and a small amount of solder can be used for the circuit board. The connection terminal pins can be reliably soldered. As a result, according to the present invention, it is possible to omit the step of increasing the amount of solder to shorten the working time, avoid variations in the amount of solder, and improve reliability, and to provide a high quality surface mount board. And a power supply device can be provided.

[Brief description of drawings]

FIG. 1 is an exploded perspective view showing an example of a power supply device using a surface mounting terminal block according to an embodiment of the present invention.

FIG. 2 is a front view showing the overall configuration of the surface mounting terminal block according to the embodiment.

FIG. 3A is a front view showing the overall configuration of the connection terminal pin of the same embodiment, and FIG. 3B is a side view showing the overall configuration of the connection terminal pin of the same embodiment.

FIG. 4A is an explanatory diagram showing equivalent stress at an interface between a mounting portion and a solder in the connection terminal pin according to the embodiment.
(B): Explanatory diagram showing the equivalent stress at the interface between the mounting portion and the solder in the conventional connection terminal pin

5A is a front view showing the overall structure of a connection terminal pin according to another embodiment of the present invention. FIG. 5B is a diagram showing the interface between the mounting portion and the solder in the connection terminal pin shown in FIG. 5A. Explanatory diagram showing equivalent stress

[Explanation of symbols]

1 ... Power supply device 2 ... Printed wiring board (circuit board)
2a ... Component mounting area 2b ... Hole portion 2c ... Connection pattern
Down 3 ... surface mount terminal block 4 ... Case 5 ... base portion 5a ... support portion 5b ... leg 5c ... positioning projection 6 ... connection terminal pins 6a ... attachment portion 6b ... curved portion 6c ... shaft portion 6d ... crushed portion 6e … Connection

─────────────────────────────────────────────────── ─── Continuation of the front page (72) Inventor Masahiro Takita 10-13 Minamimachi, Hanno City, Saitama Prefecture Shindengen Industrial Co., Ltd. Hanno factory (72) Inventor Kiichi Tanaka 3-6-3 Kitano, Niiza City, Saitama Prefecture Sanken Electric Co., Ltd. (56) Reference Japanese Unexamined Patent Publication No. 6-231840 (JP, A) Actual development 4-133362 (JP, U) Actual development 6-5137 (JP, U) (58) Fields investigated (Int.Cl. ⁷ , DB name) H01R 4/02 H01R 12/04 H01R 43/02

Claims (7)

(57) [Claims] 1. A surface mounting terminal block for mounting a connection terminal pin for connecting an external circuit on a surface of a circuit board, wherein the connection terminal pin is formed by bending a rod-shaped wire rod.
Ri mounting portion straight is formed on the distal end of the curved portion with the curved portion of the substantially U-shaped are provided on the mounting side end, the connecting terminal pins are arrayed in the support base of insulating A surface mount terminal block characterized in that 2. The surface mounting according to claim 1, wherein a connecting portion for connecting the connecting terminal pin to an external circuit is provided at a tip portion of a shaft portion extending in a direction orthogonal to the mounting portion. Terminal block for. 3. The surface according to claim 1, wherein the curved portion of each connection terminal pin is curved and formed in a direction along the arrangement direction of the connection terminal pins. Mounting terminal block. 4. The curved portion of each connection terminal pin is formed so as to be curved in the same direction.
Surface mount terminal block described. 5. The surface mounting terminal block according to claim 1, wherein the connecting terminal pin is provided with a plurality of curved portions. 6. A surface of a circuit board having a metal base,
A surface-mounting board, on which the surface-mounting terminal block according to any one of claims 1 to 5 is mounted. 7. A power supply device characterized in that the surface mounting terminal block according to any one of claims 1 to 5 is mounted on the input and output portions of a circuit board having a metal base.