JP3411981B2 - Terminal block for surface mounting, surface mounting board, and power supply device using the same - Google Patents

Terminal block for surface mounting, surface mounting board, and power supply device using the same

Info

Publication number
JP3411981B2
JP3411981B2 JP16654997A JP16654997A JP3411981B2 JP 3411981 B2 JP3411981 B2 JP 3411981B2 JP 16654997 A JP16654997 A JP 16654997A JP 16654997 A JP16654997 A JP 16654997A JP 3411981 B2 JP3411981 B2 JP 3411981B2
Authority
JP
Japan
Prior art keywords
mounting
connection terminal
terminal block
terminal pin
surface mounting
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP16654997A
Other languages
Japanese (ja)
Other versions
JPH113738A (en
Inventor
正文 桑原
雅広 滝田
喜一 田中
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shindengen Electric Manufacturing Co Ltd
Origin Electric Co Ltd
Sanken Electric Co Ltd
Original Assignee
Shindengen Electric Manufacturing Co Ltd
Origin Electric Co Ltd
Sanken Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shindengen Electric Manufacturing Co Ltd, Origin Electric Co Ltd, Sanken Electric Co Ltd filed Critical Shindengen Electric Manufacturing Co Ltd
Priority to JP16654997A priority Critical patent/JP3411981B2/en
Publication of JPH113738A publication Critical patent/JPH113738A/en
Application granted granted Critical
Publication of JP3411981B2 publication Critical patent/JP3411981B2/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

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  • Multi-Conductor Connections (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)

Description

【発明の詳細な説明】Detailed Description of the Invention

【0001】[0001]

【発明の属する技術分野】本発明は、例えば電源装置の
外部回路接続用の接続端子を表面実装回路基板上に実装
するための表面実装用端子台の技術に関する。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a surface mounting terminal block technology for mounting, for example, a connection terminal for connecting an external circuit of a power supply device on a surface mounting circuit board.

【0002】[0002]

【従来の技術】従来より、例えばアルミニウム等の金属
板の一面に絶縁被膜を被覆して、その上に回路パターン
を形成し、その表面に電気部品をはんだ付けするように
した表面実装基板が用いられている。
2. Description of the Related Art Conventionally, a surface mount board has been used in which an insulating film is coated on one surface of a metal plate such as aluminum, a circuit pattern is formed on the surface, and electric parts are soldered to the surface. Has been.

【0003】このような表面実装基板においては、外部
の他の回路と接続する接続端子ピンを搭載するに際し、
通常の絶縁性基板におけるような固定接続手段、すなわ
ち基板の回路パターン部に差込貫通孔を設け、ここに接
続ピンを挿入して仮固定したのち、基板の裏面において
はんだ付けする手段は採用することができない。
On such a surface mount board, when mounting a connection terminal pin for connecting to another external circuit,
A fixed connection means such as in a normal insulating board, that is, a means of providing a through hole in a circuit pattern portion of the board, inserting a connection pin therein and temporarily fixing it, and then soldering on the back surface of the board is adopted. I can't.

【0004】そこで、このような表面実装基板の表面に
外部回路接続用の端子ピンを容易確実に実装するため、
本出願人は釘頭状の先端形状を有する接続端子ピンを表
面実装基板に垂直にはんだ付けするようにした表面実装
用端子台をすでに提案している(実開平4−13336
2号公報参照)。
Therefore, in order to easily and surely mount terminal pins for connecting an external circuit on the surface of such a surface mount board,
The present applicant has already proposed a surface mounting terminal block in which a connection terminal pin having a nail-shaped tip shape is vertically soldered to a surface mounting substrate (Actually Published Unexamined Utility Model Application No. 4-13336).
No. 2).

【0005】[0005]

【発明が解決しようとする課題】ところで、上述の従来
の表面実装用端子台を用いて表面実装基板の表面に接続
端子ピンを実装する場合には、クリームはんだを印刷塗
布した表面実装基板の接続端子ランドに接続端子ピンを
立てて仮固定し、リフローソルダリングによってはんだ
付けを行うようにしているが、その際に接続端子ピン及
び表面実装基板が熱膨張、熱収縮して変形するため、印
刷されたはんだの量だけでは接続端子ピンに付くはんだ
の量が十分でなく、接続端子ピンの引張強度が不足した
り、耐久性を十分に満足させることができない。このた
め、従来は、印刷後さらにディスペンサー等によっては
んだの量を増やさなければならず、その結果、作業時間
が増大するとともに、はんだの量にばらつきが生じて信
頼性が不十分になるという課題があった。
By the way, when mounting the connection terminal pins on the surface of the surface mounting board using the above-mentioned conventional surface mounting terminal block, the connection of the surface mounting board printed with cream solder is applied. The connection terminal pins are erected and temporarily fixed on the terminal land, and soldering is performed by reflow soldering.However, at that time, the connection terminal pins and the surface mounting board are deformed by thermal expansion and contraction. The amount of the applied solder is not sufficient to attach the solder to the connection terminal pin, and the tensile strength of the connection terminal pin is insufficient or the durability cannot be sufficiently satisfied. Therefore, conventionally, it is necessary to further increase the amount of solder by a dispenser or the like after printing, and as a result, the work time increases, and there is a problem that the amount of solder varies and the reliability becomes insufficient. there were.

【0006】本発明は、このような従来の技術の課題を
解決するためになされたもので、表面実装基板に対して
少ないはんだ量で接続端子ピンを確実にはんだ付けする
ことができる表面実装用端子台を提供するとともに、信
頼性の高い表面実装基板及びこれを用いた電源装置を提
供することを目的とするものである。
The present invention has been made in order to solve the problems of the prior art as described above, and is capable of reliably soldering the connection terminal pins to the surface mounting substrate with a small amount of solder. An object of the present invention is to provide a terminal block, a highly reliable surface mount substrate, and a power supply device using the same.

【0007】[0007]

【課題を解決するための手段】上記目的を達成するため
になされた請求項1記載の発明は、外部回路接続用の接
続端子ピンを回路基板の表面に実装するための表面実装
用端子台であって、上記接続端子ピンは、棒状の線材を
屈曲させることによりその実装側端部に略コ字状の湾曲
部が設けられるとともに該湾曲部の先端部に直線状の取
付部が形成され、該接続端子ピンが絶縁性の支持台に複
数配列されていることを特徴とする表面実装用端子台で
ある。
The invention according to claim 1 made in order to achieve the above object is a surface mounting terminal block for mounting connection terminal pins for external circuit connection on the surface of a circuit board. Therefore, the above-mentioned connection terminal pin is a rod-shaped wire.
By bending, a substantially U-shaped curved portion is provided at the mounting side end portion, and a linear mounting portion is formed at the tip of the curved portion, and a plurality of the connection terminal pins are arranged on an insulating support base. The surface mounting terminal block is characterized in that

【0008】請求項1記載の発明の場合、接続端子ピン
の実装側端部に略コ字状の湾曲部が設けられていること
から、はんだ付けの際、接続端子ピンが熱膨張、熱収縮
したときに、この湾曲部が撓み、またねじれることにな
り、その結果、接続端子ピンに生ずる変形応力が吸収さ
れ、これを低減することができる。したがって、請求項
1記載の発明によれば、クリームはんだを印刷塗布した
後さらにディスペンサー等によってはんだの量を増やす
必要がない。
According to the first aspect of the present invention, since the mounting side end portion of the connection terminal pin is provided with the substantially U-shaped curved portion, the connection terminal pin undergoes thermal expansion and thermal contraction during soldering. When this happens, the curved portion bends and twists, and as a result, the deformation stress generated in the connection terminal pin is absorbed, and this can be reduced. Therefore, according to the first aspect of the invention, it is not necessary to further increase the amount of solder by a dispenser or the like after the cream solder is applied by printing.

【0009】また、接続端子ピンの湾曲部の先端部に直
線状の取付部が形成されていることから、この取付部と
プリント配線基板との接触面積を大きく確保することが
でき、はんだ付けによる取付強度が向上する。
Further, since the linear mounting portion is formed at the tip of the curved portion of the connection terminal pin, it is possible to secure a large contact area between the mounting portion and the printed wiring board. The mounting strength is improved.

【0010】この場合、請求項2記載の発明のように、
請求項1記載の発明において、接続端子ピンの外部回路
と接続するための接続部が、取付部と直交する方向に延
びる軸部の先端部に設けられていることも効果的であ
る。
In this case, as in the invention described in claim 2,
In the invention according to claim 1, it is also effective that the connecting portion for connecting to the external circuit of the connecting terminal pin is provided at the tip portion of the shaft portion extending in the direction orthogonal to the mounting portion.

【0011】請求項2記載の発明によれば、はんだ付け
の際、接続端子ピンが熱膨張、熱収縮したときに、接続
端子ピンに生ずる変形応力を湾曲部が十分に吸収してこ
れを低減することができる。
According to the second aspect of the present invention, when the connecting terminal pin is thermally expanded and contracted during soldering, the bending portion sufficiently absorbs the deformation stress generated in the connecting terminal pin, thereby reducing the deformation stress. can do.

【0012】また、請求項3記載の発明のように、請求
項1又は2のいずれか1項記載の発明において、各接続
端子ピンの湾曲部が、当該接続端子ピンの配列方向に沿
う方向に向けて湾曲形成されていること、特に請求項4
記載の発明のように、同一方向に湾曲するように形成さ
れていることも効果的である。
[0012] Further, like the invention according to claim 3, in the invention according to any one of claims 1 and 2, the curved portion of each connection terminal pin extends in a direction along the arrangement direction of the connection terminal pin. It is formed so as to be curved toward, especially claim 4.
It is also effective to be formed so as to be curved in the same direction as in the described invention.

【0013】請求項3又は4記載の発明によれば、接続
端子ピンの湾曲部が当該接続端子ピンの配列方向に沿っ
て整列するため、不要な突出部分がなく、表面実装用端
子台の実装面積を小さくすることができる。
According to the third or fourth aspect of the invention, since the curved portions of the connection terminal pins are aligned along the arrangement direction of the connection terminal pins, there is no unnecessary protruding portion, and the surface mounting terminal block is mounted. The area can be reduced.

【0014】さらに、請求項5記載の発明のように、請
求項1乃至4のいずれかに記載の発明において、接続端
子ピンに、複数の湾曲部が設けられていることも効果的
である。
Further, like the invention described in claim 5, in the invention described in any one of claims 1 to 4, it is also effective that the connection terminal pin is provided with a plurality of curved portions.

【0015】請求項5記載の発明によれば、はんだ付け
の際に接続端子ピンに生ずる変形応力が複数の湾曲部に
分散されるので、かかる変形応力をより一層吸収して低
減することができる。
According to the fifth aspect of the present invention, since the deformation stress generated in the connection terminal pins during soldering is dispersed in the plurality of curved portions, the deformation stress can be absorbed and reduced further. .

【0016】一方、請求項6記載の発明は、金属製の基
体を有する回路基板の表面に、請求項1乃至請求項5の
いずれか1項記載の表面実装用端子台が実装されている
ことを特徴とする表面実装基板である。
On the other hand, the invention according to claim 6 is that the surface mounting terminal block according to any one of claims 1 to 5 is mounted on a surface of a circuit board having a metal base. Is a surface mount substrate.

【0017】請求項6記載の発明によれば、はんだ付け
に伴う温度変化によって回路基板が大きく熱膨張、熱収
縮した場合であっても、これにあわせて湾曲部が変形す
るため、その変形応力を吸収することができる。
According to the sixth aspect of the invention, even if the circuit board undergoes a large thermal expansion or thermal contraction due to a temperature change caused by soldering, the bending portion is deformed in accordance with the thermal expansion and contraction. Can be absorbed.

【0018】また、請求項7記載の発明は、金属製の基
体を有する回路基板の入力及び出力部分に、請求項1乃
至5のいずれか1項記載の表面実装用端子台が実装され
ていることを特徴とする電源装置である。
According to a seventh aspect of the present invention, the surface mounting terminal block according to any one of the first to fifth aspects is mounted on the input and output portions of the circuit board having a metal base. It is a power supply device characterized in that.

【0019】請求項7記載の発明によれば、外部回路へ
の接続の際の熱変形に強く、信頼性の高いコンパクトな
構成の電源装置が得られる。
According to the invention described in claim 7, it is possible to obtain a power supply device having a compact structure which is highly resistant to thermal deformation at the time of connection to an external circuit and has high reliability.

【0020】[0020]

【発明の実施の形態】以下、添付図面を参照して本発明
の好ましい実施の形態を詳細に説明する。図1は、本発
明の実施の形態による表面実装用端子台を使用した電源
装置の一例を示す分解斜視図である。図1に示すよう
に、この電源装置1は、種々の電気部品が実装される部
品実装領域2aを有する長方形状の回路基板としてのプ
リント配線基板2と、後述する表面実装用端子台3と、
実装された電気部品を覆うためのケース4とから構成さ
れる。
BEST MODE FOR CARRYING OUT THE INVENTION Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings. FIG. 1 is an exploded perspective view showing an example of a power supply device using a surface mounting terminal block according to an embodiment of the present invention. As shown in FIG. 1, the power supply device 1 includes a printed wiring board 2 as a rectangular circuit board having a component mounting area 2a on which various electric components are mounted, a surface mounting terminal block 3 described later,
And a case 4 for covering the mounted electric parts.

【0021】プリント配線基板2は、長方形状の板状の
金属基体上に、例えばガラス−エポキシ樹脂層が形成さ
れたものであり、その縁部を除いた部品実装領域2a
に、図示しない配線パターンが形成され電源等の電気部
品の実装されるようになっている。そして、プリント配
線基板2の四隅には、表面実装用端子台3を固定するた
めの孔部2bが設けられている。また、プリント配線基
板2の一対の短縁部には、後述する接続端子ピン6に対
応する接続パターン2cが形成され、プリント配線基板
2の各短縁部に、それぞれ同一の構成を有する表面実装
用端子台3が取り付けられるようになっている。
The printed wiring board 2 is, for example, a glass-epoxy resin layer formed on a rectangular plate-shaped metal substrate, and the component mounting area 2a excluding the edge portion thereof.
In addition, a wiring pattern (not shown) is formed to mount an electric component such as a power supply. Holes 2b for fixing the surface mounting terminal block 3 are provided at the four corners of the printed wiring board 2. Further, a connection pattern 2c corresponding to a connection terminal pin 6 to be described later is formed on a pair of short edge portions of the printed wiring board 2, and each short edge portion of the printed wiring board 2 has the same surface mounting structure. The terminal block 3 for is attached.

【0022】図2は、表面実装用端子台3の全体構成を
示す正面図であり、図3(a)(b)は、表面実装用端
子台3に設けられる接続端子ピン6の全体構成を示すも
ので、図3(a)は正面図、図3(b)は側面図であ
る。
FIG. 2 is a front view showing the overall configuration of the surface mounting terminal block 3, and FIGS. 3A and 3B show the overall configuration of the connection terminal pins 6 provided on the surface mounting terminal block 3. 3A is a front view and FIG. 3B is a side view.

【0023】図2に示すように、表面実装用端子台3
は、例えばプラスチックの射出成形により形成される絶
縁性の基台部5と、同基台部5の支持部5aに等間隔に
圧入された複数の接続端子ピン6とから構成されてい
る。
As shown in FIG. 2, the surface mounting terminal block 3
Is composed of, for example, an insulating base portion 5 formed by injection molding of plastic, and a plurality of connection terminal pins 6 press-fitted at equal intervals into a support portion 5a of the base portion 5.

【0024】基台部5は、接続端子ピン6を支持するた
めの長尺の支持部5aを有し、その両端部に脚部5bが
一体的に設けられている。そして、基台部5の両側の脚
部5bの下部には、プリント配線基板2の四隅に設けら
れた孔2bと嵌合する位置決め突起5cが設けられて
いる。また、両脚部5bの側面には、プリント配線基板
2に対して基台部5を係止するための係止部材50が設
けられている。
The base portion 5 has an elongated support portion 5a for supporting the connection terminal pins 6, and leg portions 5b are integrally provided at both ends thereof. Then, the bottom of both sides of the leg portions 5b of the base portion 5, a positioning projection 5c is provided to the hole 2b and the fitting provided on the four corners of the printed circuit board 2. Further, locking members 50 for locking the base portion 5 to the printed wiring board 2 are provided on the side surfaces of the both leg portions 5b.

【0025】一方、基台部5の両脚部5bの間には、支
持部5a及び脚部5bと一体的にリブ5dが形成され、
これにより支持部5aの下方に空間が形成されるように
なっている。
On the other hand, a rib 5d is integrally formed between the support portion 5a and the leg portion 5b between the both leg portions 5b of the base portion 5,
As a result, a space is formed below the support portion 5a.

【0026】図3(a)(b)に示すように、接続端子
ピン6は、例えば銅や真鍮等の導電率の高い金属材料か
らなり、太く(直径0.8mm以上)短い棒状の線材を
屈曲させることにより形成される。本実施の形態におい
ては、接続端子ピン6の実装側(図中下側)端部に略コ
字状の湾曲部6bが設けられ、この湾曲部6bの先端部
に、プリント配線基板2と平行にはんだ付けされる直線
状の取付部6aが形成されている。
As shown in FIGS. 3 (a) and 3 (b), the connection terminal pin 6 is made of a metal material having a high conductivity, such as copper or brass, and is a thick (shorter than 0.8 mm) short rod-shaped wire. It is formed by bending. In the present embodiment, a substantially U-shaped curved portion 6b is provided at the mounting side (lower side in the figure) end of the connection terminal pin 6, and the tip of this curved portion 6b is parallel to the printed wiring board 2. A linear mounting portion 6a to be soldered to is formed.

【0027】一方、湾曲部6bの外部回路接続側(図中
上側)端部には、取付部6aに対して垂直方向に延びる
軸部6cが設けられている。
On the other hand, a shaft portion 6c extending in a direction perpendicular to the mounting portion 6a is provided at the end portion of the curved portion 6b on the external circuit connection side (upper side in the drawing).

【0028】また、軸部6cの中程にはつぶれ部6dが
形成され、接続端子ピン6を上記基台部5に圧入したと
きに容易に抜けることがないようになっている。そし
て、軸部6cの先端部には、外部の他の回路と接続する
ための接続部6eが設けられている。
Further, a crushed portion 6d is formed in the middle of the shaft portion 6c so that the connection terminal pin 6 is not easily removed when it is press-fitted into the base portion 5. A connecting portion 6e for connecting to another external circuit is provided at the tip of the shaft portion 6c.

【0029】図2に示すように、各接続端子ピン6は、
基台部5の支持部5aの長手方向、すなわち、当該接続
端子ピン6の配列方向に向って湾曲部6bが向けられた
状態で支持部5aに圧入固定される。この場合、接続端
子ピン6の湾曲部6bは、それぞれ同一方向に向けられ
ている。また、接続端子ピン6は、その軸部6cが基台
部5の支持部5a長手方向に対して直交するように支持
部5aに固定されている。
As shown in FIG. 2, each connection terminal pin 6 is
The support portion 5a of the base portion 5 is press-fitted and fixed to the support portion 5a in a state where the curved portion 6b is oriented in the longitudinal direction, that is, in the arrangement direction of the connection terminal pins 6. In this case, the curved portions 6b of the connection terminal pins 6 are oriented in the same direction. Further, the connecting terminal pin 6 is fixed to the support portion 5a such that its shaft portion 6c is orthogonal to the longitudinal direction of the support portion 5a of the base portion 5.

【0030】なお、接続端子ピン6は、その取付部6a
の下面が基台部5の脚部5bの下部より若干上方に位置
するように固定され、これにより接続端子ピン6をプリ
ント配線基板に実装した場合に接続パターン2cとの
間に若干の隙間が形成されるようになっている。
The connection terminal pin 6 has a mounting portion 6a.
Is fixed so that its lower surface is located slightly above the lower portion of the leg portion 5b of the base 5, so that when the connection terminal pin 6 is mounted on the printed wiring board 2 , a slight gap is formed between the connection terminal pin 6 and the connection pattern 2c. Are formed.

【0031】このような構成を有する本実施の形態の表
面実装用端子台3をプリント配線基板2に実装する場合
には、プリント配線基板2の接続パターン2c上にクリ
ームはんだを印刷塗布し、基台部5の両脚部5bの下部
の位置決め突起5cをプリント配線基板2の四隅の孔部
2bに嵌合する。これにより、接続端子ピン6の取付部
6aと、プリント配線基板2の接続パターン2c上のク
リームはんだとが接触した状態で表面実装用端子台3が
プリント配線基板2上に仮固定される。
When the surface mounting terminal block 3 of the present embodiment having such a structure is mounted on the printed wiring board 2, cream solder is printed on the connection pattern 2c of the printed wiring board 2 to form a base. The positioning protrusions 5c at the bottoms of both legs 5b of the base 5 are fitted into the holes 2b at the four corners of the printed wiring board 2. As a result, the surface mounting terminal block 3 is temporarily fixed on the printed wiring board 2 in a state where the mounting portion 6a of the connection terminal pin 6 and the cream solder on the connection pattern 2c of the printed wiring board 2 are in contact with each other.

【0032】そして、その状態で表面実装用端子台3を
図示しないリフロー炉内に導入し、所定の温度で加熱し
てリフローソルダリングを行うことにより、表面実装用
端子台3の接続端子ピン6の取付部6aがプリント配線
基板2の接続パターン2cにはんだ付けされ、上述の構
成を有する電源装置1が得られる。
Then, in this state, the surface mounting terminal block 3 is introduced into a reflow furnace (not shown) and heated at a predetermined temperature for reflow soldering, whereby the connection terminal pins 6 of the surface mounting terminal block 3 are connected. The mounting portion 6a of 1 is soldered to the connection pattern 2c of the printed wiring board 2 to obtain the power supply device 1 having the above configuration.

【0033】このようにして得られた電源装置1は、図
示しない外部回路の接続端子に対して各接続端子ピン6
の接続部6eをはんだ付けすることにより、種々の装置
の外部回路に対する電気的な接続が行われる。
The power supply device 1 obtained in this manner has the connection terminal pins 6 for the connection terminals of an external circuit (not shown).
By soldering the connecting portion 6e of the above, electrical connection to external circuits of various devices is performed.

【0034】以上述べたように本実施の形態において
は、接続端子ピン6の実装端部側に略コ字状の湾曲部6
bが設けられていることから、外部回路へのはんだ付け
の際、接続端子ピン6が熱膨張、熱収縮したときに、こ
の湾曲部6bが撓み、またねじれることによって、接続
端子ピン6に生ずる変形応力が吸収され、これを低減す
ることができる。
As described above, in the present embodiment, the substantially U-shaped curved portion 6 is provided on the mounting end side of the connection terminal pin 6.
Since b is provided, when the connection terminal pin 6 is thermally expanded and contracted during soldering to an external circuit, the curved portion 6b is bent and twisted, so that the connection terminal pin 6 is formed. The deformation stress is absorbed and can be reduced.

【0035】特に、本実施の形態の場合、取付部6aに
対して軸部6cが垂直方向に延びるように構成されてい
ることから、はんだ付けの際、接続端子ピン6が熱膨
張、熱収縮したときに、接続端子ピン6に生ずる変形応
力を湾曲部6bが十分に吸収してこれを低減することが
できる。
In particular, in the case of the present embodiment, since the shaft portion 6c is configured to extend in the vertical direction with respect to the mounting portion 6a, the connection terminal pin 6 undergoes thermal expansion and thermal contraction during soldering. At this time, the bending stress generated in the connection terminal pin 6 can be sufficiently absorbed by the bending portion 6b and reduced.

【0036】また、接続端子ピン6の湾曲部6bの先端
部に直線状の取付部6aが形成されていることから、こ
の取付部6aとプリント配線基板2との接触面積を大き
く確保することができ、これによりはんだ付けによる取
付強度を向上させることができる。
Further, since the linear mounting portion 6a is formed at the tip of the curved portion 6b of the connecting terminal pin 6, it is possible to secure a large contact area between the mounting portion 6a and the printed wiring board 2. Therefore, the mounting strength by soldering can be improved.

【0037】このように、本実施の形態によれば、はん
だ付けに伴う温度変化によって大きく熱膨張、熱収縮す
る金属製の基体を有するプリント配線基板2を用いた場
合であっても、これにあわせて湾曲部6bが変形するこ
とによって、その変形応力を吸収することができ、これ
により従来のようにはんだを増量する必要がなく、少な
いはんだ量で確実にはんだ付けをすることができる。そ
の結果、はんだの増量工程を省略して作業時間を短縮す
ることができるとともに、はんだ量のばらつきを回避し
て信頼性を向上させることができる。
As described above, according to the present embodiment, even when the printed wiring board 2 having the metal base body that greatly expands and contracts due to the temperature change caused by soldering is used, By the deformation of the curved portion 6b at the same time, the deformation stress can be absorbed, so that it is not necessary to increase the amount of solder as in the conventional case, and the soldering can be reliably performed with a small amount of solder. As a result, it is possible to shorten the working time by omitting the step of increasing the amount of solder, and to improve the reliability by avoiding variations in the amount of solder.

【0038】さらに、本実施の形態の場合、各接続端子
ピン6の湾曲部6bが、当該接続端子ピン6の配列方向
に沿って同一方向に湾曲形成されていることから、接続
端子ピン6の湾曲部6bが当該接続端子ピン6の配列方
向に沿って整列され、このため不要な突出部分がなく、
表面実装用端子台の実装面積を小さくすることができ、
コンパクトな電源装置1が得られる。
Further, in the case of the present embodiment, since the curved portion 6b of each connection terminal pin 6 is curved in the same direction along the arrangement direction of the connection terminal pin 6, the connection terminal pin 6 has a curved shape. The curved portions 6b are aligned along the arrangement direction of the connection terminal pins 6, so that there is no unnecessary protruding portion,
The mounting area of the surface mounting terminal block can be reduced,
A compact power supply device 1 can be obtained.

【0039】図4(a)は、本発明の実施の形態に係る
接続端子ピン6における取付部6aとはんだの界面の相
当応力を示すもので、図4(b)は、従来の接続端子ピ
ン106における取付部106aとはんだの界面の相当
応力を示すものである。ここで、図4(a)(b)に示
すグラフは、それぞれの各界面要素部分における応力解
析結果を示すものである。
FIG. 4A shows the equivalent stress at the interface between the mounting portion 6a and the solder in the connection terminal pin 6 according to the embodiment of the present invention, and FIG. 4B shows the conventional connection terminal pin. The equivalent stress at the interface between the mounting portion 106a and the solder at 106 is shown. Here, the graphs shown in FIGS. 4A and 4B show the results of stress analysis in the respective interface element portions.

【0040】図4(a)(b)に示すように、湾曲部6
bを有する本実施の形態の接続端子ピン6の場合は、従
来の釘頭形状の接続端子ピン106に比べ、取付部6a
とはんだ7との各界面要素の部分において相当応力が小
さくなっており、特に、最大の相当応力の値は、約半分
になっていることが理解される。
As shown in FIGS. 4A and 4B, the curved portion 6
In the case of the connection terminal pin 6 of the present embodiment having b, as compared with the conventional nail-head-shaped connection terminal pin 106, the mounting portion 6a
It is understood that the equivalent stress is small at the interface elements between the solder 7 and the solder 7, and in particular, the maximum equivalent stress value is about half.

【0041】このように、本発明によれば、はんだ付け
の際に接続端子ピン6に生ずる曲げ応力及びねじり応力
を十分に吸収することができることが判明した。
As described above, according to the present invention, it has been found that the bending stress and the torsion stress generated in the connection terminal pin 6 during soldering can be sufficiently absorbed.

【0042】なお、本発明は上述の実施の形態に限られ
ることなく、種々の変更を行うことができる。例えば、
上述の実施の形態においては、棒状の線材を用いて接続
端子ピンを作製するようにしたが、本発明はこれに限ら
れず、例えば板状の部材を用いて接続端子ピンを作製す
ることもできる。
The present invention is not limited to the above-mentioned embodiment, and various modifications can be made. For example,
In the above-described embodiment, the connection terminal pin is manufactured by using the rod-shaped wire, but the present invention is not limited to this, and the connection terminal pin can be manufactured by using, for example, a plate-shaped member. .

【0043】また、上述の実施の形態においては、金属
材料を主体とする基板の表面に表面実装用端子台を実装
する場合について説明したが、本発明はこれに限られ
ず、例えば樹脂等の材料からなる基板についても適用し
うるものである。ただし、本発明は、熱による膨張・収
縮の大きい金属等の材料を主体とする基板の表面に表面
実装用端子台を実装する場合に特に有効なものである。
In the above embodiment, the case where the surface mounting terminal block is mounted on the surface of the substrate mainly made of a metal material has been described, but the present invention is not limited to this, and a material such as resin is used. It is also applicable to a substrate made of. However, the present invention is particularly effective when the surface mounting terminal block is mounted on the surface of a substrate mainly made of a material such as a metal that greatly expands and contracts due to heat.

【0044】図5(a)は、本発明の他の実施の形態に
係る接続端子ピンの全体構成を示すものであり、また、
図5(b)は、図5(a)に示す接続端子ピンにおける
取付部とはんだの界面の相当応力を示すものである。図
5(a)において、上記実施の形態と対応する部分につ
いては同一の符号を付してその詳細な説明を省略する
と、本実施の形態の接続端子ピンは、例えば打ち抜き加
工によって作製されるもので、2つの湾曲部6b、6f
が連続的に略S字状に形成され、実装側の湾曲部6bの
先端部に直線状の取付部6aが形成されている。一方、
外部回路接続側には、上記実施の形態と同様の軸部6c
が設けられている。
FIG. 5A shows the overall structure of the connection terminal pin according to another embodiment of the present invention.
FIG. 5B shows the equivalent stress at the interface between the mounting portion and the solder in the connection terminal pin shown in FIG. 5A. In FIG. 5A, parts corresponding to those in the above embodiment are designated by the same reference numerals, and detailed description thereof will be omitted. The connection terminal pin of this embodiment is manufactured by, for example, punching. Then, the two curved portions 6b and 6f
Are continuously formed into a substantially S-shape, and a linear mounting portion 6a is formed at the tip of the bending portion 6b on the mounting side. on the other hand,
A shaft portion 6c similar to that of the above-described embodiment is provided on the external circuit connection side.
Is provided.

【0045】以上の構成を有する本実施の形態によれ
ば、はんだ付けの際に接続端子ピン6に生ずる変形応力
が2つの湾曲部6b、6fに分散されるので、かかる変
形応力をより一層吸収して低減することができる。この
ことは、図5(b)に示すように、取付部6aとはんだ
7との各界面要素の部分における相当応力が、図4
(a)に示す湾曲部6bが1つの上記実施の形態の場合
に比べてより一層小さくなっていることからも理解され
る。
According to the present embodiment having the above-mentioned structure, the deformation stress generated in the connection terminal pin 6 at the time of soldering is dispersed in the two curved portions 6b and 6f, so that the deformation stress is further absorbed. Can be reduced. This means that, as shown in FIG. 5B, the equivalent stress in each interface element portion between the mounting portion 6a and the solder 7 is as shown in FIG.
It can also be understood from the fact that the curved portion 6b shown in (a) is smaller than that in the case of one of the above embodiments.

【0046】[0046]

【発明の効果】以上説明したように本発明の表面実装用
端子台によれば、外部回路へのはんだ付けの際、接続端
子ピンに生ずる変形応力を低減することができ、しか
も、はんだ付けに伴う温度変化によって大きく変形する
金属基板を用いた場合であっても、その変形応力を低減
することができるので、従来のようにはんだを増量する
必要がなく、回路基板に対して少ないはんだ量で接続端
子ピンを確実にはんだ付けをすることができる。その結
果、本発明によれば、はんだの増量工程を省略して作業
時間を短縮することができるとともに、はんだ量のばら
つきを回避して信頼性を向上させることができ、高品質
の表面実装基板及び電源装置を提供することができる。
As described above, according to the surface mounting terminal block of the present invention, it is possible to reduce the deformation stress generated in the connection terminal pins when soldering to an external circuit, and moreover, in soldering. Even when using a metal substrate that is significantly deformed due to temperature changes, the deformation stress can be reduced, so there is no need to increase the amount of solder as in the past, and a small amount of solder can be used for the circuit board. The connection terminal pins can be reliably soldered. As a result, according to the present invention, it is possible to omit the step of increasing the amount of solder to shorten the working time, avoid variations in the amount of solder, and improve reliability, and to provide a high quality surface mount board. And a power supply device can be provided.

【図面の簡単な説明】[Brief description of drawings]

【図1】本発明の実施の形態による表面実装用端子台を
使用した電源装置の一例を示す分解斜視図
FIG. 1 is an exploded perspective view showing an example of a power supply device using a surface mounting terminal block according to an embodiment of the present invention.

【図2】同実施の形態における表面実装用端子台の全体
構成を示す正面図
FIG. 2 is a front view showing the overall configuration of the surface mounting terminal block according to the embodiment.

【図3】(a):同実施の形態の接続端子ピンの全体構
成を示す正面図 (b):同実施の形態の接続端子ピン
の全体構成を示す側面図
FIG. 3A is a front view showing the overall configuration of the connection terminal pin of the same embodiment, and FIG. 3B is a side view showing the overall configuration of the connection terminal pin of the same embodiment.

【図4】(a):同実施の形態に係る接続端子ピンにお
ける取付部とはんだの界面の相当応力を示す説明図
(b):従来の接続端子ピンにおける取付部とはんだの
界面の相当応力を示す説明図
FIG. 4A is an explanatory diagram showing equivalent stress at an interface between a mounting portion and a solder in the connection terminal pin according to the embodiment.
(B): Explanatory diagram showing the equivalent stress at the interface between the mounting portion and the solder in the conventional connection terminal pin

【図5】(a):本発明の他の実施の形態に係る接続端
子ピンの全体構成を示す正面図 (b):図5(a)に
示す接続端子ピンにおける取付部とはんだの界面の相当
応力を示す説明図
5A is a front view showing the overall structure of a connection terminal pin according to another embodiment of the present invention. FIG. 5B is a diagram showing the interface between the mounting portion and the solder in the connection terminal pin shown in FIG. 5A. Explanatory diagram showing equivalent stress

【符号の説明】[Explanation of symbols]

1…電源装置 2…プリント配線基板(回路基板)
2a…部品実装領域2b…孔部 2c…接続パター
3…表面実装用端子台 4…ケース5…基台部
5a…支持部 5b…脚部 5c…位置決め突
起 6…接続端子ピン 6a…取付部 6b…湾
曲部 6c…軸部 6d…つぶれ部 6e…接続
1 ... Power supply device 2 ... Printed wiring board (circuit board)
2a ... Component mounting area 2b ... Hole portion 2c ... Connection pattern
Down 3 ... surface mount terminal block 4 ... Case 5 ... base portion 5a ... support portion 5b ... leg 5c ... positioning projection 6 ... connection terminal pins 6a ... attachment portion 6b ... curved portion 6c ... shaft portion 6d ... crushed portion 6e … Connection

───────────────────────────────────────────────────── フロントページの続き (72)発明者 滝田 雅広 埼玉県飯能市南町10番13号 新電元工業 株式会社飯能工場内 (72)発明者 田中 喜一 埼玉県新座市北野三丁目6番3号 サン ケン電気株式会社内 (56)参考文献 特開 平6−231840(JP,A) 実開 平4−133362(JP,U) 実開 平6−5137(JP,U) (58)調査した分野(Int.Cl.7,DB名) H01R 4/02 H01R 12/04 H01R 43/02 ─────────────────────────────────────────────────── ─── Continuation of the front page (72) Inventor Masahiro Takita 10-13 Minamimachi, Hanno City, Saitama Prefecture Shindengen Industrial Co., Ltd. Hanno factory (72) Inventor Kiichi Tanaka 3-6-3 Kitano, Niiza City, Saitama Prefecture Sanken Electric Co., Ltd. (56) Reference Japanese Unexamined Patent Publication No. 6-231840 (JP, A) Actual development 4-133362 (JP, U) Actual development 6-5137 (JP, U) (58) Fields investigated (Int.Cl. 7 , DB name) H01R 4/02 H01R 12/04 H01R 43/02

Claims (7)

(57)【特許請求の範囲】(57) [Claims] 【請求項1】外部回路接続用の接続端子ピンを回路基板
の表面に実装するための表面実装用端子台であって、 上記接続端子ピンは、棒状の線材を屈曲させることによ
その実装側端部に略コ字状の湾曲部が設けられるとと
もに該湾曲部の先端部に直線状の取付部が形成され、 該接続端子ピンが絶縁性の支持台に複数配列されている
ことを特徴とする表面実装用端子台。
1. A surface mounting terminal block for mounting a connection terminal pin for connecting an external circuit on a surface of a circuit board, wherein the connection terminal pin is formed by bending a rod-shaped wire rod.
Ri mounting portion straight is formed on the distal end of the curved portion with the curved portion of the substantially U-shaped are provided on the mounting side end, the connecting terminal pins are arrayed in the support base of insulating A surface mount terminal block characterized in that
【請求項2】接続端子ピンの外部回路と接続するための
接続部が、取付部と直交する方向に延びる軸部の先端部
に設けられていることを特徴とする請求項1記載の表面
実装用端子台。
2. The surface mounting according to claim 1, wherein a connecting portion for connecting the connecting terminal pin to an external circuit is provided at a tip portion of a shaft portion extending in a direction orthogonal to the mounting portion. Terminal block for.
【請求項3】各接続端子ピンの湾曲部が、当該接続端子
ピンの配列方向に沿う方向に向けて湾曲形成されている
ことを特徴とする請求項1又は2のいずれか1項記載の
表面実装用端子台。
3. The surface according to claim 1, wherein the curved portion of each connection terminal pin is curved and formed in a direction along the arrangement direction of the connection terminal pins. Mounting terminal block.
【請求項4】各接続端子ピンの湾曲部が、同一方向に湾
曲するように形成されていることを特徴とする請求項3
記載の表面実装用端子台。
4. The curved portion of each connection terminal pin is formed so as to be curved in the same direction.
Surface mount terminal block described.
【請求項5】接続端子ピンに、複数の湾曲部が設けられ
ていることを特徴とする請求項1乃至4のいずれか1項
記載の表面実装用端子台。
5. The surface mounting terminal block according to claim 1, wherein the connecting terminal pin is provided with a plurality of curved portions.
【請求項6】金属製の基体を有する回路基板の表面に、
請求項1乃至請求項5のいずれか1項記載の表面実装用
端子台が実装されていることを特徴とする表面実装基
板。
6. A surface of a circuit board having a metal base,
A surface-mounting board, on which the surface-mounting terminal block according to any one of claims 1 to 5 is mounted.
【請求項7】金属製の基体を有する回路基板の入力及び
出力部分に、請求項1乃至5のいずれか1項記載の表面
実装用端子台が実装されていることを特徴とする電源装
置。
7. A power supply device characterized in that the surface mounting terminal block according to any one of claims 1 to 5 is mounted on the input and output portions of a circuit board having a metal base.
JP16654997A 1997-06-09 1997-06-09 Terminal block for surface mounting, surface mounting board, and power supply device using the same Expired - Fee Related JP3411981B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP16654997A JP3411981B2 (en) 1997-06-09 1997-06-09 Terminal block for surface mounting, surface mounting board, and power supply device using the same

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP16654997A JP3411981B2 (en) 1997-06-09 1997-06-09 Terminal block for surface mounting, surface mounting board, and power supply device using the same

Publications (2)

Publication Number Publication Date
JPH113738A JPH113738A (en) 1999-01-06
JP3411981B2 true JP3411981B2 (en) 2003-06-03

Family

ID=15833336

Family Applications (1)

Application Number Title Priority Date Filing Date
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Country Status (1)

Country Link
JP (1) JP3411981B2 (en)

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002344230A (en) * 2001-05-11 2002-11-29 Furukawa Electric Co Ltd:The Small-sized antenna
JP3848300B2 (en) * 2003-05-28 2006-11-22 株式会社アドバンテスト connector
JP4384073B2 (en) * 2005-03-17 2009-12-16 第一電子工業株式会社 Manufacturing method of electronic parts

Also Published As

Publication number Publication date
JPH113738A (en) 1999-01-06

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