JPH0982850A - Semiconductor package device and manufacture thereof - Google Patents

Abstract

PROBLEM TO BE SOLVED: To make it possible to simplify significantly the structure of a semiconductor package device and a process of manufacturing the device in a chip-sized package having a size roughly equal with that of a semiconductor chip. SOLUTION: For example, bump electrodes 21 are respectively connected with electrode pads 12 on the surface of a semiconductor chip 11 via apertures 14 formed in a protective film 13. A filmy resin sheet 31 is bonded to the surface of the chip 11 excluding the electrodes 21. In such a way, a semiconductor package device is formed into a constitution, wherein the surface only of the chip 11 is packaged with the sheet 31 and a mounting of the chip 11 is made possible on a printed circuit board which is formed by a surface down manner.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a semiconductor package device mounted on a printed circuit board by, for example, surface down and a method for manufacturing the same, and particularly to a chip size package (chip scale package) having a size substantially equal to a chip. It is also used for).

[0002]

2. Description of the Related Art Conventionally, a method using a transfer molding method has been known as a method for obtaining a semiconductor package device having a size substantially equal to that of a semiconductor chip, that is, a so-called chip size package (for example, a transfer molding method). M.Yasunaga, et.al, “ChipScale Package (CSP), A
Lightly Dressed LSI Chip ”, Proceedings of 1994
IEEE / CPMT Int'l Electronics Technology Symposium,
pp.169-176,1994).

FIG. 7 schematically shows a manufacturing process of a chip size package by the above-mentioned transfer molding method. First, the terminals 4 are formed on the respective pads 3 exposed from the protective film 2 on the surface of the semiconductor chip 1 (FIG. 8A).

After that, the upper and lower sides of the semiconductor chip 1 are sandwiched by a mold 5, and the cavity 6 of the mold 5 is filled with the melted molding resin 6 (FIG. 2B). At this time, the surface of the terminal 4 is exposed on the surface of the resin 6.

After the resin 6 is cured, the resin 6 is taken out from the mold 5 and, if necessary, electrodes 7 for external connection are formed on the terminals 4, respectively, to obtain a desired chip size package. Is obtained ((c) in the figure).

However, in the packaging of semiconductor chips, the packaging is originally required only on the surface of the chip. Nevertheless, in the case of the conventional chip size package described above, the back side of the chip is also covered with the resin. For this reason, extra cost is required, which causes a rise in the price of the chip size package.

Further, in the case of the transfer molding method, a plurality of steps such as preheating, melting, injecting (filling), final heating and curing of the resin are required, and there is a problem that the steps are complicated.

[0008]

As described above, in the related art, since the back surface of the semiconductor chip is also packaged, there is a problem that the cost is extra and the manufacturing process is complicated. It was

Therefore, the present invention provides a semiconductor package device which is smaller in size without lowering reliability, and which can be manufactured at low cost and can be manufactured easily, and a manufacturing method thereof. Has an aim.

[0010]

In order to achieve the above object, in a semiconductor package device of the present invention, a semiconductor chip, an external connection terminal connected to an electrode on the surface of the semiconductor chip, The film-shaped resin sheet is provided so as to cover only the surface of the semiconductor chip, excluding the external connection terminals.

Further, in the method of manufacturing a semiconductor package device according to the present invention, a film-shaped resin sheet having openings formed at the electrode positions of the semiconductor chip is bonded so as to cover only the surface of the semiconductor chip. And a step of connecting the external connection terminal to the electrode of the semiconductor chip through the opening after curing the film-shaped resin sheet.

Further, in the method of manufacturing a semiconductor package device of the present invention, a step of adhering a film-shaped resin sheet so as to cover only the surface of the semiconductor chip, and after curing the film-shaped resin sheet A step of forming an opening at the electrode position of the semiconductor chip on the resin sheet, and a step of connecting an external connection terminal to the electrode of the semiconductor chip through the opening.

Further, in the method of manufacturing a semiconductor package device according to the present invention, the step of connecting the external connection terminal to the electrode on the surface of the semiconductor chip and the step of projecting the external connection terminal are carried out so that the semiconductor It comprises a step of adhering a film-shaped resin sheet only to the surface of the chip and a step of curing the film-shaped resin sheet.

According to the semiconductor package device and the method of manufacturing the same of the present invention, the semiconductor chip is used as a part of the package, and only the portion required for packaging is covered with the resin sheet. As a result, a semiconductor package device integrated with a semiconductor chip and having a size substantially equal to that of the chip can be realized more simply and inexpensively.

[0015]

BEST MODE FOR CARRYING OUT THE INVENTION Embodiments of the present invention will be described below with reference to the drawings. FIG. 1 shows a schematic configuration of a chip size package according to the first embodiment of the present invention.

That is, in this chip size package, the protruding electrodes 21 are connected to the electrode pads 12 on the surface of the semiconductor chip 11, respectively. Then, except for the protruding electrode 21, only the surface of the semiconductor chip 11 is covered with the film-shaped resin sheet 31.

The semiconductor chip 11 has a plurality of electrode pads 12 on its surface. A protective film 13 is provided on the surface of the semiconductor chip 11. Openings 14 are formed on the electrode pads 12 of the protective film 13, and the electrode pads 12 are exposed through the openings 14.

The protruding electrode 21 is made of a conductive material such as a metal film, and is formed on the surface of the resin sheet 31.
Each of them constitutes a planar pad type external connection terminal 22.

The resin sheet 31 is a sealing material for packaging only the surface of the semiconductor chip 11, and is, for example, an epoxy resin, a biphenyl resin, a phenol resin, a silicone resin, a polyester resin, or the like. Is used.

Next, a method of manufacturing the above chip size package will be described. FIG. 2 schematically shows a manufacturing method (second embodiment of the present invention) of a chip size package according to the first embodiment of the present invention.

First, a film-shaped resin sheet 31 having a size substantially equal to the area of the semiconductor chip 11 is adhered to the surface of the semiconductor chip 11 (FIG. 3A). The bonding method here will be described later.

At the time of bonding, the resin sheet 31
Is heated and cured, and the surface of the semiconductor chip 11 is packaged ((b) in the figure). Then, the openings 3 are formed in the resin sheet 31 on each electrode pad 12 of the semiconductor chip 11.
2 is formed ((c) in the figure). Then, a conductive material is embedded in the opening 32 to form the protruding electrode 21 and the external connection terminal 22 connected to the electrode pad 12.

The protruding electrodes 21 and the external connection terminals 22 are formed by, for example, printing a conductive material or forming a conductive material on the entire surface of the resin sheet 31 and patterning it.

Thus, the semiconductor chip 1 shown in FIG.
A chip size package having a size substantially equal to 1 is completed. FIG. 3 schematically shows a method of adhering the resin sheet 31 to the surface of the semiconductor chip 11.

For example, the semiconductor chip 11 is fixed in the recess 43 formed by the lower mold 41 and the upper mold 42. Then, on the surface of the semiconductor chip 11, the resin sheet 31
Set.

In this state, while heating the plunger 44, the plunger 44 is lowered in the direction of the arrow shown in the drawing, and the resin sheet 31 is pressed against the surface of the semiconductor chip 11 and hardened. As a result, only the surface of the semiconductor chip 11 is covered with the resin sheet 31 and packaged. In this case, since the semiconductor chip itself is used as a part of the package and only the surface of the chip is packaged, it is possible to inexpensively package with a small amount of resin.

Further, since the portion requiring the minimum packaging can be surely packaged, the reliability is not impaired. Moreover, since a simple method of adhering the film-shaped resin sheet 31 is used, the steps of packaging can be greatly simplified.

Further, since there is no sealing material around the semiconductor chip 11, size reduction can be achieved, and higher density mounting on the printed circuit board becomes possible. Next, another embodiment of the present invention will be schematically described.

FIG. 4 shows an outline of a manufacturing method (third embodiment of the present invention) of a chip size package according to the first embodiment of the present invention. First, a film-shaped resin sheet 31 having a size substantially equal to the surface area of the semiconductor chip 11 is prepared, and an opening 32 is formed at a portion of the semiconductor chip 11 where each electrode pad 12 is in contact ((a) of the same figure).

Next, the resin sheet 31 is adhered to the surface of the semiconductor chip 11 by the method described above, for example. Then, at the time of the bonding, the resin sheet 31 is heated and cured to package the surface of the semiconductor chip 11 (FIG. 2B).

After that, a conductive material is embedded in the opening 32 of the resin sheet 31 on each electrode pad 12 of the semiconductor chip 11 to form the protruding electrode 21 and the external connection terminal 22 connected to the electrode pad 12. To do.

In this way, the chip size package having substantially the same size as the semiconductor chip 11 shown in FIG. 1 is also completed by the manufacturing method according to the third embodiment of the present invention.

FIG. 5 schematically shows a manufacturing method (fourth embodiment of the present invention) of a chip size package according to the first embodiment of the present invention. First, the protruding electrodes 21 are formed on the electrode pads 12 of the semiconductor chip 11 (FIG. 10A).

Next, on the surface of the semiconductor chip 11, a film-shaped resin sheet 31 having a size substantially equal to its area is formed.
Glue. Then, at the time of bonding, the resin sheet 31
Is heated and cured, and the surface of the semiconductor chip 11 is packaged ((b) in the figure).

In this case, the thickness of the resin sheet 31 is made thinner than the height of the protruding electrodes 21. As a result, the protruding electrode 21 breaks through the resin sheet 31 during bonding,
It is projected on the surface of the resin sheet 31.

After that, if necessary, the resin sheet 3
An external connection terminal 22 is formed on the surface of 1. In this way, the chip size package having a size substantially equal to that of the semiconductor chip 11 shown in FIG. 1 is also completed by the manufacturing method according to the fourth embodiment of the present invention.

FIG. 6 shows a schematic structure of a chip size package according to the fifth embodiment of the present invention. That is, in this chip size package, the projecting electrode 21 directly connected to the electrode pad 12 on the surface of the semiconductor chip 11 and the projecting electrode 2 connected via the electrode 51.
1'and only the surface of the semiconductor chip 11 excluding the protruding electrodes 21 and 21 'is covered with a film-shaped resin sheet 31.

Each of the protruding electrodes 21 and 21 'is formed by forming the external connection terminal 22 on the surface of the resin sheet 31. With such a configuration, the same effect as that of the chip size package according to the first embodiment of the present invention described above can be expected, and, for example, the opening 1 of the protective film (first protective film) 13 can be expected.
The electrode 5 for leading out a part of the electrode pad 12 exposed from 4
1 and the electrode 51 is exposed by providing the opening 16 in the second protective film 15 so that the protruding electrode 21 ′ and the external connection terminal 22 can be arranged at arbitrary positions. Become.

Further, in this case, since the protruding electrode 21 'and the external connection terminal 22 can be arranged at arbitrary positions, the restriction on the formation position of the electrode pad 12 on the surface of the semiconductor chip 11 is relaxed. become able to.

In the case of the chip size package according to the fifth embodiment of the present invention, only the step of forming the electrode 51, the second protective film 15 and the like is added, and the above-described embodiment of the present invention is performed. It can be easily manufactured by a process substantially similar to the chip size package according to the first embodiment.

As described above, the semiconductor chip is used as a part of the package, and only the part that needs to be packaged is covered with the resin sheet. That is,
Only the surface of the semiconductor chip is packaged with a resin sheet. As a result, a semiconductor package device integrated with a semiconductor chip and having a size substantially equal to that of the chip can be realized more simply and inexpensively. Therefore, it is possible to reduce the size, reduce the price, and simplify the manufacturing without lowering the reliability.

In each of the above-described embodiments of the present invention, the case where the external connection terminal is a flat pad type has been described, but the present invention is not limited to this, and may be, for example, a ball shape. The shape is not subject to any restrictions. Of course, various modifications can be made without departing from the scope of the present invention.

[0043]

As described above in detail, according to the present invention, a semiconductor package device which is smaller in size without sacrificing reliability and which can be manufactured at low cost and can be manufactured easily. And the manufacturing method for the same can be provided.

[Brief description of drawings]

FIG. 1 is a sectional view showing a schematic configuration of a chip size package according to a first embodiment of the invention.

FIG. 2 is a sectional view schematically showing a method of manufacturing a chip size package according to the second embodiment of the invention.

FIG. 3 is a sectional view schematically showing a main part of a method of manufacturing a chip size package.

FIG. 4 is a sectional view schematically showing a method of manufacturing a chip size package according to the third embodiment of the present invention.

FIG. 5 is a sectional view schematically showing a method for manufacturing a chip size package according to the fourth embodiment of the present invention.

FIG. 6 is a sectional view showing a schematic configuration of a chip size package according to a fifth embodiment of the present invention.

FIG. 7 is shown to explain the prior art and its problems;
FIG. 6 is a schematic cross-sectional view of a method for manufacturing a chip size package.

[Explanation of symbols]

11 ... Semiconductor chip, 12 ... Electrode pad, 13 ... Protective film (first protective film), 14, 16, 32 ... Opening, 15 ... Protective film (second protective film), 21, 21 '... Projection electrode, 22
... external connection terminals, 31 ... film-shaped resin sheet, 5
1 ... Electrode.

Claims (4)

[Claims] 1. A semiconductor chip, an external connection terminal connected to an electrode on the surface of the semiconductor chip, and a film-like film provided so as to cover only the surface of the semiconductor chip excluding the external connection terminal. A semiconductor package device comprising a resin sheet. 2. A step of adhering a film-shaped resin sheet having an opening formed at an electrode position of a semiconductor chip so as to cover only the surface of the semiconductor chip, and after curing the film-shaped resin sheet. And a step of connecting an external connection terminal to an electrode of the semiconductor chip through the opening. 3. A step of adhering a film-shaped resin sheet so as to cover only the surface of the semiconductor chip, and curing the film-shaped resin sheet, and then opening the resin sheet at an electrode position of the semiconductor chip. And a step of connecting an external connection terminal to the electrode of the semiconductor chip through the opening, the method for manufacturing a semiconductor package device. 4. A step of connecting an external connection terminal to an electrode on the surface of a semiconductor chip, and a step of adhering a film-shaped resin sheet only to the surface of the semiconductor chip such that the external connection terminal is projected. And a step of curing the film-shaped resin sheet, the method for manufacturing a semiconductor package device.