JPH0982828A - Vacuum sealed device and its manufacture - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a compact vacuum sealed device and its manufacturing method at low cost having excellent operational element characteristics. SOLUTION: An operation element 4 and a communication path 8 are provided on an element substrate 3 while a cover member 6 is junctioned with the upper side of the element substrate 3. The cover member 6 is provided with recessions 17 and 16, besides, an actuator valve 13 composed of a beam part 11 whose base terminal side is fix-supported on the peripheral surface and valve closing surface 12 connecting to the front end of the beam part 11 and opposing to an outer side aperture part 9 is provided on the peripheral surface of the recession 16. In the state of valve closing surface 12 not blocking the outer side aperture part 9, the space 7 containing the operation element 4 is vacuum-exhausted from the communication path 8. Later, the space between the actuator valve 13 and the element substrate 3 is impressed with voltage to make the beam part 11 bent-deformed by static electricity for making the valve closing surface 12 block the outer side aperture part 9 so that the element substrate 3 in such a state may be heated to melt-junction the contact surface between the valve closing surface 12 and the element substrate 3 by the eutectic reaction producing no gas at all.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a vacuum sealed device manufactured by using a micromachining technique and a manufacturing method thereof.

[0002]

2. Description of the Related Art As is well known, in recent years, very fine vibration elements such as gyros and resonators using micromachining technology and actuators have been manufactured. In order to prevent deterioration of operating characteristics due to air damping,
For example, measures have been taken to avoid deterioration of operating characteristics due to the air damping, which is housed in a vacuum space in a package formed by joining a base and a lid member.
The one in which the operating element is housed in the vacuum space in the package as described above is known as a vacuum sealed device.

[0003]

By the way, various methods have been proposed as a method for sealing a space accommodating an operating element in a vacuum state. For example, in an exhaust chamber in a vacuum state (for example, a vacuum state (a state where the pressure is low, for example, 0.1 Pa or less) where the operating characteristics of the operating element are good) in the vacuum device, a base provided with the operating element and a lid member There has been proposed a method of joining and using solder to seal the space inside the package in a vacuum state. However, in this method, even when the base and the lid member are joined in a vacuum state where the operating characteristics of the operating element are good, gas is generated from the solder at the time of joining,
A part of this gas is sealed in the package, and the vacuum state in the package becomes worse than the vacuum state in which the operation characteristics are good. Therefore, there is a problem that the operating characteristics of the operating element are deteriorated due to the damping action of the gas.

Therefore, in order to improve the vacuum state in the package, a method of accommodating a getter material that adsorbs gas in the package together with the operating element has also been proposed. With this method, the vacuum condition in the package becomes very good, but the work of accommodating the getter material in each package is required, which is time-consuming, that is, the number of manufacturing steps increases and mass productivity is lost. Therefore, the price of the product becomes expensive. Further, there is a problem that the package becomes large in size because the getter material is accommodated therein.

The present invention has been made to solve the above problems, and an object thereof is to improve the vacuum state of the accommodation space in which the operating element is accommodated and to avoid the deterioration of the operating characteristics of the operating element due to damping. Moreover, it is to provide an inexpensive and small-sized vacuum sealing device and a manufacturing method thereof.

[0006]

In order to achieve the above object, the present invention has the following constitution as means for solving the problem. That is, the first invention of the vacuum-sealed device is such that an operating element is formed on a surface of an element substrate, and a lid member is joined to a surface of the element substrate on which the operating element is formed to form a package. A vacuum sealing device in which the operating element is housed in a package vacuum space formed in a bonding boundary region of a lid member. In the vacuum sealing device, a communication path is formed to connect the vacuum space and the outside. An actuator valve having a beam portion at least one end of which is fixedly supported by the package in the vicinity of the outer opening of the communication passage, and a valve closing surface which is connected to the beam portion and faces the outer opening. Is provided, and the external opening is closed by the valve closing surface of the actuator valve in an operating state in which the beam portion of the actuator valve is flexibly deformed toward the external opening side. And a means for solving the problems.

The second invention of the vacuum sealed device is
The operating element is formed on the surface of the element substrate, the lid member is joined to the surface of the element substrate on which the operating element is formed to form a package, and the vacuum inside the package formed in the junction boundary region between the element substrate and the lid member. In a vacuum sealing device in which the operating element is housed in a space, a communication passage that communicates the inside of the vacuum space with the outside is formed in the vacuum sealing device, and the communication passage is provided in the vicinity of an outside opening. An actuator valve having a beam portion, at least one end of which is fixedly supported by the package, and a valve closing surface, which is connected to the beam portion and faces the external opening, is provided, and the beam portion of the actuator valve is external. And a means for solving the above-mentioned problem in a configuration in which the outer side opening is closed to the valve closing surface of the actuator valve by a joint that does not generate gas in an operating state in which the side opening side is flexibly deformed. To have.

Further, the third invention of the vacuum sealing device, which constitutes the second invention of the above-mentioned vacuum sealing device, includes gas-free bonding, melt bonding by eutectic reaction of contact surfaces, and eutectic reaction. As a means for solving the above-mentioned problems, it is possible to use any one of fusion bonding other than the above, a physical and chemical reaction caused by cleaning the contact surface, and a diffusion reaction caused by heating. There is.

Further, a fourth aspect of the vacuum sealing device is the formation of the external opening of the communication passage, which constitutes the first, second, or third aspect of the vacuum sealing device, and the actuator valve. Means for solving the above-mentioned problems by providing electrostatic drive means between which the beam portion of the actuator valve is flexibly deformed by electrostatic force by voltage application to press the valve closing surface to the external opening. I am trying.

Further, in a fifth invention of the vacuum sealing device, the material of one side of the element substrate and the cover member constituting the first or second or third or fourth invention of the above vacuum sealing device is Si. And the other side is made of a material of either glass or Si, and the sixth invention of the vacuum sealing device is the first or second or the second vacuum sealing device. The operating element housed in the package of the third, fourth, or fifth invention is a vibrating element, which serves as means for solving the above problems.

Further, in the method for manufacturing a vacuum sealed device according to the present invention, a lid member is joined to the substrate surface of the element substrate on which the operating element is formed to form a package, and a junction boundary between the element substrate and the lid member is formed. In a method of manufacturing a vacuum-sealed device in which the operating element is housed in a package vacuum space formed in a region, the vacuum is applied to at least one joint surface of an element substrate having an operating element formed on an element substrate surface and a lid member. A concave portion to be a space is formed, and a communication passage that communicates the inside of the vacuum space with the outside is formed in the bonding surface region on one side of the element substrate and the lid member. An actuator operation gap is formed on at least one of the formation surface of the opening and the actuator formation surface of the mating partner opposite to the formation surface. An actuator valve formed by connecting a valve closing surface facing the opening and a beam supporting the same is formed by fixing at least one end of the beam, and the substrate surface on which the operating element of the element substrate is formed. The lid member is joined to the package by anodic bonding to form a package, and then the air in the vacuum space in the package is evacuated through a communication path in a vacuum, and then the beam portion of the actuator valve is formed in a vacuum. The above problem is solved by a configuration in which the valve closing surface is flexibly deformed to close the outer side opening of the communication passage and the valve closing surface and the surface on which the outer side opening is formed are joined by a gas-free joining method. As a means.

Further, in the method for manufacturing a vacuum sealed device of the present invention, the gas-free bonding method is performed by fusion bonding, bonding by a physical or chemical reaction generated by cleaning the contact surface, and heating. One of bonding by diffusion reaction, bonding the valve closing surface and the surface forming the external opening of the communication passage, and then sealing the bonding portion with a film of vapor deposition or sputtering, The closing surface and the surface forming the external opening of the communicating passage are joined by heating the contact surface of the joining, and the melting reaction of the melting joining between the valve closing surface and the surface forming the external opening of the communicating passage is performed by the Au-Si joint. Crystallization reaction, and the material on one side of the element substrate and the lid member is Si
It is also a characteristic means for solving the problem that the other side is made of either one of glass and Si.

In the invention of the above structure, the vacuum sealing device is provided with a communication passage for communicating the space in which the operating element is housed with the outside, and air in the element housing space is evacuated from the communication passage in vacuum. The element housing space is evacuated by evacuation. Then, in a vacuum, the beam portion of the actuator valve is flexibly deformed to close the outer side opening of the communication passage with the valve closing surface, and the valve closing surface and the outer side opening forming surface are Bonding is performed by utilizing a melting reaction such as a crystallization reaction, a physical or chemical reaction generated by cleaning the contact surface, or a bonding reaction such as a diffusion reaction. Then, if necessary, the joint is sealed with a vapor-deposited or sputtered film to further firmly seal the joint.

As described above, the outer side opening of the communication passage is closed by the bonding reaction of the contact surface at the valve closing surface of the actuator valve, and the element housing space is sealed in a vacuum state, whereby the bonding reaction is performed. Since it can be considered that no gas is generated, the deterioration of the vacuum state of the operating element housing space due to the gas generated from solder as in the past is avoided, and the operating element housing space is considered to have good operating characteristics. It is possible to provide a vacuum-sealed device that can be sealed in the following vacuum state and that has excellent operating characteristics of the operating element.

Further, as described above, since the operating element accommodating space is sealed in a good vacuum state, a getter material for adsorbing gas and improving the vacuum state as shown in the conventional example is used. Since it is not necessary to store it in the operating element housing space, the vacuum sealing device can be downsized by the size of the getter material. In addition, since the getter material accommodation work can be omitted, the labor and the number of manufacturing steps can be reduced, leading to mass production of products,
The price of the product becomes cheap.

[0016]

Embodiments of the present invention will be described below with reference to the drawings. FIG. 1 shows the main configuration of a vacuum sealed device 1 according to this embodiment. This vacuum sealing device 1 is an actuator valve having a lid member 6 formed of a glass substrate, an operating element 4, an element substrate 3 on which the operating element 4 is formed, a beam portion 11 and a valve closing surface 12. It has 13 and an electrostatic drive means 14.

In the figure, an operating element (a vibrating element such as a gyro or a resonator in the illustrated example) 4 is formed on the surface side of an element substrate 3 made of single crystal silicon (Si) by using a micromachining technique. On the upper side of the element forming surface of the element substrate 3, a lid member 6 having a recess 17 formed in a region facing the operating element 4 is joined by anodic bonding to form a package. By the recess 17 of the lid member 6,
As shown in (b) of the same figure, a housing space 7 for the operating element 4 is formed in the joint boundary region between the lid member 6 and the element substrate 3, and this space 7 shows excellent operating characteristics of the operating element 4. It is sealed in a vacuum.

Further, a concave portion 16 communicating with the outside is formed on the surface of the lid member 6 facing the element substrate, and a space portion communicating with the outside in the joint boundary region between the lid member 6 and the element substrate 3 is formed by the concave portion 16. 23 are composed. The communication path 8 that connects the space 23 and the accommodation space 7 for the operating element 4 is formed by the element substrate 3
It is provided in. The outer opening 9 of the communication passage 8 is closed by a valve closing surface 12 of an actuator valve 13 made of gold (Au), silicon (Si), aluminum (Al) or the like. When the valve closing surface 12 is gold (Au), the valve closing surface 12 and the substrate surface of the element substrate 3 contacting the valve closing surface 12 are made of gold (Au) and silicon (S).
It is melt-bonded by the eutectic reaction of i). Further, when other materials are used for the valve closing surface 12, they are joined by utilizing a melting reaction, a physical or chemical reaction caused by cleaning the contact surface, or a diffusion reaction caused by heating. ing.

As shown in FIG. 3A, the valve closing surface 12 is provided on the tip side of the cantilever-shaped beam portion 11, and the base end side of the beam portion 11 is the bottom surface of the recess 16 of the lid member 6. The beam portion 11 is connected to the outside opening 9 as shown in FIG.
It is in an operating state in which it is flexed and deformed to the side. The base end side of the beam portion 11 is provided with a lid member 6 via a conductor pattern 19 shown in FIG.
Is electrically connected to a through hole 21 provided in the. Also, an electrode pattern 25 that is conductively connected to the through hole 21.
Is formed on the front surface side of the lid member 6. An external voltage applying means (not shown) is applied to the actuator valve 13 by the conductor pattern 19, the through hole 21, and the electrode pattern 25.
An electrostatic drive means 14 for electrically connecting the above is constituted. In the figure, 18 is a conductor pattern for driving the operating element 4, and 20 is a conductive pattern for electrically connecting the conductor pattern 18 to an external driving means (not shown) to drive the operating element 4. It is a through hole.

A method of manufacturing the vacuum sealed device 1 having the above structure will be described below. The manufacturing procedure is roughly described in FIG.
3 (c), the element substrate 3 on which the operating element 4, the communication path 8 and the like are formed, and the recess 17, as shown in FIG. 3 (d),
16 and the lid member 6 provided with the actuator valve 13 and the like are separately produced, and the element substrate 3 and the lid member 6 are bonded to each other to form the accommodation space 7 for the operating element 4 as shown in FIG. 4B. The vacuum sealing device 1 is manufactured by sealing in a vacuum state.

The detailed manufacturing method will be described below. In the element substrate 3, first, as shown in FIG. 2A, a groove 27 for forming the communication passage 8 is formed on the surface side of the substrate 26 of single crystal silicon (Si) by etching using a KOH solution or the like. Formed by. Next, as shown in (b) of the same figure, a silicon substrate 28 is laid over the groove forming surface side of the substrate 26, and the substrate 28
The element substrates 3 are formed by heating the substrates to join the substrates 26 and 28. Thereafter, if necessary, the surface side of the element substrate 3 (substrate 28) is polished to reduce the thickness of the substrate 28 portion. Then, as shown in (c) of the figure, the operating element 4 is formed on the surface side of the element substrate 3 by using a micromachining technique, and the groove is formed by etching such as RIE (Reactive Ion Etching). Through holes 29A and 29B penetrating through 27 are opened to form the communication passage 8. Further, a conductor pattern 18 is provided.

In the lid member 6, first, as shown in FIG.
As shown in FIG. 3, a concave portion 17 facing the operating element 4 and a concave portion 16 facing the external opening 9 of the communication passage 8 are formed on the surface of the glass substrate 30 by etching using an HF solution or the like. Next, as shown in (b) of the figure, a through hole 31 for forming the through holes 20 and 21 is opened by a laser beam such as a carbon dioxide gas laser, and as shown in (c) of the figure, the recess 16 is formed. A sacrificial layer 32 made of ZnO or the like is formed on the bottom surface of the valve, and then gold (Au) that becomes the valve closing surface 12 and its beam portion 11 is formed.
A layer of silicon, silicon (Si), aluminum (Al), or the like is provided. Then, after that, as shown in (d) of the figure, the sacrificial layer 32 is removed by etching, and the actuator valve is removed.
Form 13.

The element substrate 3 and the lid member 6 manufactured as described above are superposed on each other as shown in FIG. 4 (a) and bonded by the anodic bonding method to form a package. At the time of joining using this anodic joining method, the electric potentials of the element substrate 3 and the actuator valve 13 are set to be equal to each other, and the valve closing surface is closed.
It is prevented that 12 blocks the outside opening 9 of the communication passage 8. After the above anodic bonding, a conductor film 34 is provided on the inner peripheral surface of the through hole 31 provided in the lid member 6 by vapor deposition or the like to form a through hole.
20 and 21 are formed, and an electrode pattern 25 that is electrically connected to the through hole 21 is formed on the surface side of the lid member 6.

After that, the above-mentioned package is installed in an exhaust chamber of a vacuum apparatus, and external voltage applying means (not shown) is applied to the electrode pattern 25 and a terminal portion (not shown) provided on the element substrate 3.
Then, the exhaust chamber is placed in a vacuum state (for example, 0.1 Pa or less) in which the operating element 4 exhibits excellent operating characteristics, and the air in the element housing space 7 is evacuated from the communication passage 8. At this time, in order to sufficiently exhaust the gas adsorbed on the element substrate 3 and the lid member 6, it is desirable to evacuate the element housing space 7 while heating the package.

Then, after the element housing space 7 is completely evacuated, a voltage is applied between the actuator valve 13 and the element substrate 3 while the exhaust chamber of the vacuum device is kept vacuum. Then, due to the electrostatic force (Coulomb force), the beam portion 11 is flexibly deformed, and the valve closing surface 12 becomes the element substrate 3.
As shown in FIG. 4B, the valve closing surface 12 of the actuator valve 13 comes into pressure contact with the surface of the communication passage 8 on which the external opening 9 is formed, and closes the external opening 9.

In this state, for example, when the valve closing surface 12 is made of gold (Au), the element substrate 3 is about 40
By heating to 0 ° C., the contact surface between the element substrate 3 and the valve closing surface 12 is melt-bonded by a eutectic reaction of silicon (Si) and gold (Au). Further, when the valve closing surface 12 is made of a material other than Au such as Si or Al, it is possible to perform fusion bonding by a melting reaction other than the eutectic reaction, or physical or chemical generated by cleaning the contact surface. The joining is performed by a joining method such as joining by reaction or joining by diffusion reaction generated by heating. After that, if necessary, the above-mentioned joint portion is sealed with a vapor-deposited or sputtered film of gold (Au), aluminum (Al) or the like, and the outer side opening 9 is closed more firmly. As described above, the vacuum sealed device 1 is manufactured.

According to this embodiment, the communication passage 8 for communicating the space 7 for accommodating the operating element 4 with the outside and the communication passage 8 are provided.
An actuator valve 13 having a valve closing surface 12 and a beam portion 11 facing the outer opening 9 of the actuator, and an actuator valve 13
Since an electrostatic drive means 14 for pressing the valve closing surface 12 of the above to the outer side opening 9 of the communication passage 8 by electrostatic force is provided,
After evacuating the accommodation space 7 of the operating element 4 from the communication passage 8, the valve closing surface 12 closes the outer side opening 9 of the communication passage 8 by the electrostatic force action by the voltage application using the electrostatic drive means 14. The contact surface between the closing surface 12 and the element substrate 3 can be firmly bonded by a melting reaction, a physical or chemical reaction generated by cleaning the contact surface, or a bonding reaction such as a diffusion reaction.

The bonding reaction of the contact surface between the valve closing surface 12 and the element substrate 3 can be regarded as no gas generation, and the vacuum state of the element housing space 7 caused by the gas generation at the time of bonding. Can be avoided. That is,
It is possible to seal the operating element 4 in a vacuum state in which the operating characteristics are good, and it is possible to provide a vacuum sealed device in which the operating characteristics of the operating element 4 are excellent.

Further, as described above, since it becomes possible to seal the operating element 4 in a vacuum state in which the operating characteristics are good, in order to adsorb gas in the individual element housing space 7 as in the conventional case. It is not necessary to house the getter material, the work of housing the getter material can be omitted, and the vacuum-sealed device can be mass-produced. Further, since the getter material is not housed, the vacuum sealed device can be downsized.

By the way, it is conceivable to close the outer opening 9 of the communication passage 8 with a film of vapor deposition or sputtering, but in this case, the vapor deposition gas or the atmospheric gas of sputtering is used.
Therefore, there is a problem that it enters the accommodation space 7 of the operating element 4 and deteriorates the vacuum state of the space 7. Moreover, in order to close the outer side opening 9 with a film formed by vapor deposition or sputtering, the opening area of the outer side opening 9 must be narrowed, and the operating space of the operating element 4 has a good operating characteristic. It takes time to evacuate to the desired vacuum state.

On the other hand, in the present embodiment, since the valve-closing surface 12 closes the outer opening 9, the opening area of the outer opening 9 can be increased. The vacuum evacuation time can be shortened, and the mass production of vacuum sealed devices can be promoted. Moreover, by sealing the valve closing surface 12 with a film of vapor deposition or sputtering, a large force can be applied to the actuator valve.
In addition to 13, it is possible to reliably prevent the valve closing surface 12 from coming off from the external opening 9, and it is possible to enhance the mechanical strength of the vacuum sealing device.

The present invention is not limited to the above-mentioned embodiments, but various embodiments can be adopted. For example, although the operating element 4 is a vibrating element such as a gyro or a resonator in the above-described embodiment, it may be an operating element such as an actuator. Further, although the lid member 6 is formed of the glass substrate in the above-described embodiment, other forms such as a glass film formed on the surface (both front and back surfaces) of the silicon substrate may be used.

Further, in the above-mentioned embodiment, the electrostatic drive means 14 is provided, and a voltage is applied to the actuator valve 13 when the external side opening 9 of the communication passage 8 is closed by using the electrostatic drive means 14 so as to maintain the static electricity. Use the electric power to open the valve closing surface 12 to the outside opening 9
Although the outer side opening 9 was closed by making pressure contact with the formation surface of
A work robot or the like may close the outer opening 9 by bringing the valve closing surface 12 into pressure contact with the surface on which the outer opening 9 is formed. In such a case, the actuator valve 13 can be made of an insulating material such as glass. Alternatively, the beam portion 11 may be flexibly deformed by utilizing piezoelectric force, thermal stress, static magnetic force, magnetostriction, or the like, and the valve closing surface 12 may be brought into pressure contact with the formation surface of the outer opening 9 to close the outer opening 9.

Further, in the above embodiment, the beam portion 11 of the actuator valve 13 has a cantilever shape, but it may have a double-supported beam shape. Furthermore, although the element substrate 3 is formed of silicon (Si) in the above-described embodiment, the element substrate 3 is not limited to silicon and may be formed of another material.

Further, in the above embodiment, the valve closing surface 12 and its contact surface are melted in a state in which the valve closing surface 12 is brought into pressure contact with the formation surface of the external opening 9 to close the external opening 9. Although they were joined by a reaction, a diffusion reaction, a physical, a chemical reaction, etc., for example, the valve closing surface 12 is brought into pressure contact with the formation surface of the outer side opening 9, and in that state, the valve closing surface 12
Is sealed with an organic adhesive, an oxide film formed by CVD or the like, or the state where the valve closing surface 12 is in pressure contact with the surface where the external opening 9 is formed by electrostatic force. The outer side opening 9 may be closed by the valve closing surface 12 without joining the valve closing surface 12 and its contact surface, for example, by maintaining it.

Even if gas is generated from the organic adhesive or the like for sealing the valve closing surface 12 as described above, the valve closing surface 12 is brought into pressure contact with the surface on which the external opening 9 is formed and the external side is closed. When the opening 9 is closed and the valve closing surface 12 and its contact surface are smooth, the valve closing surface 12 and its contact surface are in a weak physical contact state, so that the generated gas is exposed to the outside opening. 9 does not enter the communication passage 8 and the space 7 accommodating the operating element 4 can be sealed in a vacuum state in which the operating characteristics of the operating element 4 are good, as in the above-described embodiment.

Further, in the above embodiment, the lid member 6
A concave portion 17 is formed in a region facing the operating element in
A space 7 for accommodating the operating element 4 is formed in the joint boundary area between the lid member 6 and the element substrate 3 by 17, but conversely,
A recess may be formed in the element substrate 3 to form the accommodation space 7, and the operating element 4 may be provided on the bottom surface of this recess.

Further, in the above embodiment, the communication passage 8 is provided in the element substrate 3, but the communication passage 8 may be provided in the lid member 6, and the communication passage 8 is not necessarily the element substrate 3 and the lid. It is not limited to be provided in the joining region with the member 6, and for example, as shown in FIG. 5, a communication passage 8 may be provided in the thickness direction of the lid member 6,
Alternatively, various embodiments such as providing the communication path 8 in the element substrate 3 in a form shown by a chain line can be adopted. Of course, no matter how the communication passage 8 is provided, the valve closing surface of the actuator valve 13 faces the outer opening 9 of the communication passage 8.
12 are formed.

[0039]

According to the present invention, in the case where the outer side opening of the communication passage is closed at the valve closing surface of the actuator valve by the bonding reaction without gas generation, no gas is generated at the time of bonding, Sealing the operating element accommodating space in a vacuum state in which the operating characteristics of the operating element are good without causing deterioration of the vacuum state of the space accommodating the operating element due to the generation of gas due to soldering as in It is possible to provide a vacuum sealed device having excellent operating characteristics of the operating element.

Further, as described above, since the operating element accommodating space can be sealed in a vacuum state in which the operating characteristics of the operating element are good, the getter material for adsorbing gas as in the conventional case is accommodated in the operating element. You do n’t have to store it in space
Therefore, the vacuum sealed device can be downsized. Further, since the work of housing the getter material is omitted, the labor and the number of working steps can be reduced, the product can be mass-produced, and the inexpensive vacuum sealing device can be provided.

Further, in the case where the valve closing surface closes the outer opening without joining the valve closing surface and the outer opening forming surface, for example, the valve closing surface is the outer opening forming surface. Even if gas is generated when the valve closing surface is sealed when the valve closing surface is sealed with an organic adhesive that generates gas and the external opening is closed under pressure contact with Since the valve closing surface pressurizes the outer opening forming surface to completely close the outer opening,
The generated gas does not enter the communication passage through the external opening, and the space containing the operating element can be sealed in a vacuum state in which the operating characteristics of the operating element are good in the same manner as described above. Further, as described above, the mechanical strength can be increased by sealing the valve closing surface.

[Brief description of drawings]

FIG. 1 is an explanatory diagram showing a main configuration of a vacuum sealed device according to an embodiment of the present invention.

FIG. 2 is an explanatory diagram showing a manufacturing sequence of an element substrate on which the operating elements and communication paths shown in FIG. 1 are formed.

3A and 3B are explanatory views showing the order of manufacturing the lid member in which the actuator valve and the concave portion shown in FIG. 1 are formed.

FIG. 4 is an explanatory diagram showing an operation example of the actuator valve after the element substrate and the lid member are joined.

FIG. 5 is an explanatory diagram showing another embodiment example.

[Explanation of symbols]

 1 Vacuum Sealing Device 3 Element Substrate 4 Operating Element 6 Lid Member 8 Communication Path 11 Beam Section 12 Valve Closing Surface 13 Actuator Valve 14 Electrostatic Driving Means 17 Recess

Claims (12)

[Claims] 1. An operating element is formed on a surface of an element substrate, and a lid member is joined on the surface of the element substrate on which the operating element is formed to form a package, which is formed in a joining boundary region between the element substrate and the lid member. In the vacuum sealed device in which the operating element is housed in the vacuum space inside the package, a communication path that communicates the inside of the vacuum space with the outside is formed in the vacuum sealed device, and the outside of the communication path. An actuator valve having a beam portion at least one end of which is fixedly supported by the package and a valve closing surface which is connected to the beam portion and faces the outer side opening is provided near the opening. The vacuum-sealing device, wherein the outer opening is closed by the valve closing surface of the actuator valve in an operating state in which the beam portion is flexibly deformed toward the outer opening side. 2. An operating element is formed on a surface of an element substrate, and a lid member is bonded on the surface of the element substrate on which the operating element is formed to form a package, which is formed in a bonding boundary region between the element substrate and the lid member. In the vacuum sealed device in which the operating element is housed in the vacuum space inside the package, a communication path that communicates the inside of the vacuum space with the outside is formed in the vacuum sealed device, and the outside of the communication path. An actuator valve having a beam portion at least one end of which is fixedly supported by the package and a valve closing surface which is connected to the beam portion and faces the outer side opening is provided near the opening. The vacuum sealing, characterized in that the outer opening is closed to the valve closing surface of the actuator valve by a gas-free joint in an operating state in which the beam portion is flexibly deformed to the outer opening side. device. 3. Gas-free bonding includes melt bonding by eutectic reaction of contact surfaces, melt bonding other than eutectic reaction, and bonding by physical and chemical reactions caused by cleaning the contact surfaces. The vacuum sealed device according to claim 2, which is one of bonding by a diffusion reaction caused by heating. 4. A beam closing portion is applied to the outer side opening by bending the beam portion of the actuator valve by electrostatic force by applying a voltage between the side where the outer side opening of the communication passage is formed and the actuator valve. The vacuum sealing device according to claim 1, 2 or 3, wherein electrostatic drive means for making pressure contact is provided. 5. The material for one side of the element substrate and the lid member is Si
The vacuum sealing device according to claim 1, 2 or 3 or 4, wherein the other side is formed of one material of glass and Si. 6. The vacuum sealing device according to claim 1, wherein the operating element housed in the package is a vibrating element. 7. A package is formed by joining a lid member on a substrate surface of an element substrate on which an operating element is formed, and the operation is performed in a vacuum space inside the package formed in a joining boundary region between the element substrate and the lid member. In a method of manufacturing a vacuum-sealed device in which an element is housed, a recess serving as the vacuum space is formed on a joint surface of at least one of an element substrate on which an operation element is formed on an element substrate surface and a lid member. A communication path that communicates the inside of the vacuum space with the outside is formed in the bonding surface region on one side of the substrate and the lid member, and the bonding surface facing the formation surface of the external opening of the communication path is formed. An actuator operation gap is formed on at least one of the mating side actuator forming surfaces, and further, the actuator forming surface supports the valve closing surface facing the external opening of the communication passage. An actuator valve made by connecting beams is formed by fixing at least one end of the beam, and then a lid member is joined by anodic bonding to the substrate surface on which the operating element of the element substrate is formed to form a package. Next, in a vacuum, the air in the vacuum space in the package is evacuated through the communication passage, and after that, the beam portion of the actuator valve is flexibly deformed in the vacuum and the communication passage is formed at the valve closing surface. A method for manufacturing a vacuum sealed device, characterized in that the valve closing surface and the surface on which the external opening is formed are bonded by a bonding method that does not generate gas by closing the external opening. 8. A gas-free joining method is one of fusion joining, joining by a physical or chemical reaction produced by cleaning a contact surface, and joining by a diffusion reaction produced by heating. The method for manufacturing a vacuum sealed device according to claim 7, wherein 9. The method according to claim 7, wherein after the valve closing surface and the surface on which the external opening of the communication passage is formed are bonded, the bonding portion is sealed with a film formed by vapor deposition or sputtering. Manufacturing method of vacuum sealed device. 10. The vacuum seal according to claim 7, 8 or 9, wherein the valve closing surface and the surface on which the outer side opening of the communication path is formed are joined by heating the contact surface of the joining. Method for manufacturing stop device. 11. The melting reaction of the fusion bonding between the valve closing surface and the outer opening forming surface of the communication passage is carried out by a eutectic reaction of Au—Si.
10. The method for manufacturing a vacuum sealed device according to 10. 12. The material for one side of the element substrate and the lid member is Si
12. The method for manufacturing a vacuum sealed device according to claim 7, wherein the other side is made of one of glass and Si.