JPH0982748A - Conductive ball supply device, conductive ball mounting device, conductive ball mounting method and manufacture of electronic component - Google Patents
Conductive ball supply device, conductive ball mounting device, conductive ball mounting method and manufacture of electronic componentInfo
- Publication number
- JPH0982748A JPH0982748A JP7241144A JP24114495A JPH0982748A JP H0982748 A JPH0982748 A JP H0982748A JP 7241144 A JP7241144 A JP 7241144A JP 24114495 A JP24114495 A JP 24114495A JP H0982748 A JPH0982748 A JP H0982748A
- Authority
- JP
- Japan
- Prior art keywords
- ball
- conductive
- pallet
- reservoir
- solder
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/484—Connecting portions
- H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
- H01L2224/48465—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73265—Layer and wire connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/91—Methods for connecting semiconductor or solid state bodies including different methods provided for in two or more of groups H01L2224/80 - H01L2224/90
- H01L2224/92—Specific sequence of method steps
- H01L2224/922—Connecting different surfaces of the semiconductor or solid-state body with connectors of different types
- H01L2224/9222—Sequential connecting processes
- H01L2224/92242—Sequential connecting processes the first connecting process involving a layer connector
- H01L2224/92247—Sequential connecting processes the first connecting process involving a layer connector the second connecting process involving a wire connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/151—Die mounting substrate
- H01L2924/153—Connection portion
- H01L2924/1531—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface
- H01L2924/15311—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface being a ball array, e.g. BGA
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3457—Solder materials or compositions; Methods of application thereof
- H05K3/3478—Applying solder preforms; Transferring prefabricated solder patterns
Landscapes
- Wire Bonding (AREA)
Abstract
Description
【０００１】[0001]
【産業上の利用分野】本発明は、導電性バンプを形成す
る際に用いられる導電性ボール供給装置に関するもので
ある。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a conductive ball supplying device used for forming a conductive bump.
【０００２】[0002]
【従来の技術】従来、ＢＧＡ（ボールグリッドアレイ）
等の電子部品にバンプを形成するために、小径の半田ボ
ールなどの導電性ボールが使用されている。そして、半
田バンプは、１つの電子部品に対して複数設けられるも
のであるから、半田ボール供給装置は、１つの電子部品
に搭載するだけの個数の半田ボールを一括して供給でき
るようになっていることが必要となる。2. Description of the Related Art Conventionally, BGA (ball grid array)
Conductive balls such as small-diameter solder balls are used to form bumps on electronic components such as. Further, since a plurality of solder bumps are provided for one electronic component, the solder ball supply device can collectively supply the solder balls of the number required to be mounted on one electronic component. Need to be present.
【０００３】さて、従来の半田ボール供給装置では、多
数の半田ボールをボール溜に収納しておき、このボール
溜に複数の半田ボールを吸着する吸引孔を備えた吸着ヘ
ッドを突っ込み、その後吸着ヘッドをボール溜から離す
ようになっていた。In a conventional solder ball supply device, a large number of solder balls are stored in a ball reservoir, an adsorption head having a suction hole for adsorbing a plurality of solder balls is inserted into the ball reservoir, and then the adsorption head. Was supposed to move away from the bowl.
【０００４】[0004]
【発明が解決しようとする課題】しかしながら、このよ
うな構成では、半田ボールの位置は全くコントロールさ
れておらず、吸着ヘッドをボール溜に突っ込んでも直ち
に吸着ヘッドの吸引孔に半田ボールが吸着されるとは限
らない。However, in such a structure, the position of the solder ball is not controlled at all, and even if the suction head is thrust into the ball reservoir, the solder ball is immediately sucked into the suction hole of the suction head. Not necessarily.
【０００５】したがって、従来の半田ボール供給装置で
は、吸着ヘッドをボール溜に突っ込むだけでなく、突っ
込んだ後しばらくの時間吸着ヘッドをボール溜の内部で
動かして、全ての吸引孔に１個ずつ半田ボールが吸着さ
れることを期待していた。ところが、このような構成で
は、吸着ヘッドが半田ボールを確実にピックアップする
ことが難しいだけでなく、吸着ヘッドをボール溜に突っ
込んだ後、ボール溜から吸着ヘッドを離すまでに、ある
程度以上の時間を確保しなければならないので、タクト
タイムが長くなるという問題点があった。Therefore, in the conventional solder ball supplying device, not only the suction head is thrust into the ball reservoir, but the suction head is moved inside the ball reservoir for a while after the thrust, and one solder is applied to all the suction holes. I expected the ball to be adsorbed. However, in such a configuration, not only is it difficult for the suction head to reliably pick up the solder ball, but also after the suction head is thrust into the ball reservoir, it takes a certain amount of time or more before the suction head is separated from the ball reservoir. Since it has to be secured, there was a problem that the tact time became long.
【０００６】そこで本発明は、短いタクトタイムでも吸
着ヘッドが確実に導電性ボールをピックアップできる導
電性ボール供給装置を提供することを目的とする。SUMMARY OF THE INVENTION Therefore, an object of the present invention is to provide a conductive ball supply device capable of reliably picking up a conductive ball by a suction head even in a short tact time.
【０００７】[0007]
【課題を解決するための手段】本発明の導電性ボール供
給装置は、多数の導電性ボールを貯留するボール溜と、
ボール溜に対して水平方向に移動できるように支持さ
れ、かつ導電性ボールを１個収納できるボール孔が複数
個設けられたパレットと、パレットをボール溜に対して
水平方向に移動させる移動手段を備える。SUMMARY OF THE INVENTION A conductive ball supply device of the present invention comprises a ball reservoir for storing a large number of conductive balls,
A pallet supported so as to be movable in the horizontal direction with respect to the ball reservoir and provided with a plurality of ball holes capable of accommodating one conductive ball, and a moving means for moving the pallet in the horizontal direction with respect to the ball reservoir. Prepare
【０００８】[0008]
【作用】上記構成により、パレットがボール溜に対して
水平移動することにより、ボール溜の中の半田ボール
は、パレットに設けられたボール孔によって位置決めさ
れ整列した状態で、ボール溜の外へ出される。With the above structure, the pallet moves horizontally with respect to the ball reservoir, so that the solder balls in the ball reservoir are positioned and aligned by the ball holes provided in the pallet and are ejected out of the ball reservoir. Be done.
【０００９】従って、吸着ヘッドにより半田ボールをピ
ックアップする際に、半田ボールは既に整列した状態に
あり、吸着ヘッドの吸引孔と半田ボールを容易に対応さ
せて、確実にピックアップを行うことができる。また、
吸着ヘッドの吸引孔と半田ボールを容易に対応させるこ
とができるので、吸着ヘッドをパレットに接近させた後
直ちに吸着ヘッドをパレットから離すことができ、従来
の半田ボール供給装置において不可避であった待ち時間
を省略し、それだけタクトタイムを短縮することができ
る。Therefore, when the solder balls are picked up by the suction head, the solder balls are already aligned, and the suction holes of the suction head and the solder balls can be easily made to correspond to each other to reliably pick up the solder balls. Also,
Since the suction holes of the suction head and the solder balls can be easily associated with each other, the suction head can be separated from the pallet immediately after the suction head is brought close to the pallet, which is inevitable in the conventional solder ball supply device. Time can be omitted and the takt time can be shortened accordingly.
【００１０】[0010]
【実施例】次に図面を参照しながら、本発明の実施例に
ついて説明する。図１は、本発明の一実施例における半
田ボール搭載装置の平面図である。Embodiments of the present invention will now be described with reference to the drawings. FIG. 1 is a plan view of a solder ball mounting device according to an embodiment of the present invention.
【００１１】図１において、１は基台、２、３は基台１
の中央部にＸ方向に沿って設けられる一対のコンベアで
あり、コンベア２、３は基板４を搬送し、また位置決め
する位置決め手段に対応する。５、６は基台１の両側部
にＹ方向に沿って設けられるＹガイド、７はＹガイド５
と平行に回転自在に軸支される送りネジ、８は送りネジ
７を回転させるＹモータ、９はＹ方向に移動し、Ｘ方向
に長い移動テーブル、１０は移動テーブル９上にＸ方向
に沿って配置されるＸガイド、１１はＸガイド１０と平
行に回転自在に軸支される送りネジ、１２は送りネジ１
１を回転させるＸモータ、１３は送りネジ１１に螺合
し、吸着ヘッド１４に連結される送りナットである。従
って、Ｘモータ１２、Ｙモータ８をそれぞれ駆動するこ
とにより、吸着ヘッド１４を基台１上においてＸＹ方向
に移動させることができる。In FIG. 1, 1 is a base, 2 and 3 are bases 1.
Is a pair of conveyors provided along the X direction in the central part of the, and the conveyors 2 and 3 correspond to positioning means for carrying and positioning the substrate 4. Reference numerals 5 and 6 are Y guides provided on both sides of the base 1 along the Y direction, and 7 is a Y guide 5.
A feed screw that is rotatably supported in parallel with, a Y motor that rotates the feed screw 7, a moving table 9 that moves in the Y direction, and a moving table that is long in the X direction, and 10 that is on the moving table 9 along the X direction. Are arranged as X guides, 11 is a feed screw rotatably supported in parallel with the X guide 10, and 12 is a feed screw 1.
An X motor that rotates 1 and a feed nut 13 that is screwed onto the feed screw 11 and is connected to the suction head 14. Therefore, by driving the X motor 12 and the Y motor 8 respectively, the suction head 14 can be moved in the XY directions on the base 1.
【００１２】２０は基台１の前側に配設される半田ボー
ル供給装置である。このうち、２１、２２はそれぞれ一
定距離を隔ててＸ方向に沿って基台１上に配置されるガ
イドレール、２３は基台１上の一定の位置に設けられる
枠型のボール溜であり、ボール溜２３内には半田ボール
２４が多数収納されている。Reference numeral 20 denotes a solder ball supply device arranged on the front side of the base 1. Of these, 21 and 22 are guide rails arranged on the base 1 along the X direction with a constant distance therebetween, and 23 is a frame-shaped ball reservoir provided at a fixed position on the base 1. A large number of solder balls 24 are stored in the ball reservoir 23.
【００１３】次に図２を参照しながら、半田ボール供給
装置２０について説明する。図２（ａ）において、２５
はＸ方向に長い送りネジ、２６は送りネジ２５を回転さ
せるモータ、２７は送りネジ２５に螺合する送りナット
である。２８は送りナット２７にその下部が連結される
パレットである。パレット２８の下面には、ガイドレー
ル２１、２２に摺動自在に係合するスライダ２９が設け
られている。パレット２８の上面は、二つのエリアに分
かれており、第１エリアＡには半田ボール２４が１個ず
つ収納できるボール孔３０が所定の配列で複数設けられ
ている。また第２エリアＢには、ボール孔３０が形成さ
れておらず、その上面はフラットになっている。Next, the solder ball supply device 20 will be described with reference to FIG. In FIG. 2A, 25
Is a feed screw long in the X direction, 26 is a motor for rotating the feed screw 25, and 27 is a feed nut screwed onto the feed screw 25. 28 is a pallet whose lower part is connected to the feed nut 27. A slider 29 that slidably engages with the guide rails 21 and 22 is provided on the lower surface of the pallet 28. The upper surface of the pallet 28 is divided into two areas, and the first area A is provided with a plurality of ball holes 30 for accommodating the solder balls 24 one by one in a predetermined arrangement. Further, the ball hole 30 is not formed in the second area B, and the upper surface thereof is flat.
【００１４】そして、図２（ａ）に示すように、ボール
溜２３の底部は開いており、モータ２６が駆動されるこ
とにより、第１エリアＡまたは第２エリアＢのいずれか
が、ボール溜２３の底を塞ぐようになっている。ここ
で、パレット２８の上面とボール溜２３の下端面とに
は、半田ボール２４の直径よりもせまくかつ半田ボール
２４の半径より広い隙間が開けてあり、ボール孔３０内
に入った半田ボール２４はパレット２８が水平移動する
に伴い、第２エリアＢから第１エリアＡへ出ることがで
きるが、ボール孔３０に収納されなかった半田ボール２
４がこの隙間からボール溜２３の外に出ないようになっ
ている。ボール溜２３内に収納される最下部の半田ボー
ル２４は、モータ２６が駆動されることにより、第１エ
リアＡまたは第２エリアＢのいずれかに接触する。ここ
で、モータ２６、送りネジ２５、送りナット２７は、パ
レット２８を水平方向へ移動させる移動手段に相当す
る。なお図２（ａ）において、吸着ヘッド１４には真空
吸引を行うために配管３１が接続されている。モータ２
６を駆動して、パレット２８を矢印Ｎ１方向に移動する
と、図２（ａ）の破線で示すように、第１エリアＡでボ
ール溜２３の底を塞ぎ、第２エリアＢをボール溜２３か
ら図２右方にずらした位置に置くことができる。このと
き、図２（ｂ）に示すように、複数のボール孔３０内
に、ボール溜２３の最下部にある半田ボール２４を１個
ずつ収納するものである。次にモータ２６を駆動して、
パレット２８を矢印Ｎ２方向に移動させると、ボール孔
３０に１個ずつ収納された半田ボール２４を整列させた
状態で、ボール溜２３の外側に位置する吸着ヘッド１４
のピックアップ位置に移動することができる。このと
き、第１エリアＡは吸着ヘッド１４のピックアップ位置
にあり、第２エリアＢはボール溜２３の底を塞いでい
る。このように、上面にボール孔３０が形成されたパレ
ット２８を、ボール溜２３の下方へ移動させることによ
りボール溜２３に収納された半田ボール２４でその上面
を覆ってボール孔３０に半田ボール２４を１個ずつ収納
し、さらにパレット２８の第１エリアＡをボール溜２３
の外側へ移動させることにより、吸着ヘッド１４のピッ
クアップ位置に所定の配列に整列させた状態で供給す
る。As shown in FIG. 2 (a), the bottom of the ball reservoir 23 is open, and the motor 26 is driven so that either the first area A or the second area B is in the ball reservoir. It is designed to block the bottom of 23. Here, a gap smaller than the diameter of the solder ball 24 and wider than the radius of the solder ball 24 is opened between the upper surface of the pallet 28 and the lower end surface of the ball reservoir 23. As the pallet 28 moves horizontally, the solder balls 2 that can go out from the second area B to the first area A, but are not housed in the ball holes 30.
4 does not come out of the ball reservoir 23 through this gap. The lowest solder ball 24 accommodated in the ball reservoir 23 comes into contact with either the first area A or the second area B when the motor 26 is driven. Here, the motor 26, the feed screw 25, and the feed nut 27 correspond to moving means for moving the pallet 28 in the horizontal direction. In FIG. 2A, a pipe 31 is connected to the suction head 14 for performing vacuum suction. Motor 2
6 is driven to move the pallet 28 in the direction of the arrow N1, the bottom of the ball reservoir 23 is closed in the first area A and the second area B is removed from the ball reservoir 23 as shown by the broken line in FIG. It can be placed in a position shifted to the right in FIG. At this time, as shown in FIG. 2B, the solder balls 24 at the bottom of the ball reservoir 23 are housed in the plurality of ball holes 30 one by one. Next, drive the motor 26,
When the pallet 28 is moved in the direction of the arrow N2, the solder heads 24 housed one by one in the ball holes 30 are aligned and the suction heads 14 located outside the ball reservoir 23 are aligned.
It can be moved to the pickup position. At this time, the first area A is at the pickup position of the suction head 14, and the second area B closes the bottom of the ball reservoir 23. In this way, the pallet 28 having the ball holes 30 formed on the upper surface is moved to the lower side of the ball reservoir 23 to cover the upper surface with the solder balls 24 housed in the ball reservoir 23, and the solder balls 24 are placed in the ball holes 30. Are stored one by one, and the first area A of the pallet 28 is stored in the ball storage 23.
By moving it to the outside of the suction head 14 in a state where it is aligned in a predetermined arrangement at the pickup position of the suction head 14.
【００１５】図１において、３２は半田ボール供給装置
２０の隣に配置され、フラックス３３を溜めておく容器
である。容器３２内のフラックス３３は、モータ３４に
より移動する移動板３５に取り付けられたスキージ３６
により、厚さが一定になるようにコントロールされてい
る。３７は半田ボール供給装置２０と容器３２の間に配
置されるリニアセンサ、３８はコンベア３と容器３２の
間に配置されるリニアセンサ、３９は不要な半田ボール
２４を廃棄するための廃棄箱、４０、４１は一対の光セ
ンサであり、コンベア３と半田ボール供給装置２０の間
に配置されている。In FIG. 1, reference numeral 32 denotes a container which is arranged next to the solder ball supply device 20 and stores the flux 33. The flux 33 in the container 32 is squeegee 36 attached to a moving plate 35 that is moved by a motor 34.
Is controlled so that the thickness is constant. 37 is a linear sensor arranged between the solder ball supply device 20 and the container 32, 38 is a linear sensor arranged between the conveyor 3 and the container 32, 39 is a waste box for discarding unnecessary solder balls 24, Reference numerals 40 and 41 denote a pair of optical sensors, which are arranged between the conveyor 3 and the solder ball supply device 20.
【００１６】次に、本実施例の半田ボール搭載装置の動
作を説明する。まず、図２（ａ）の破線で示すように、
パレット２８の第１エリアＡをボール溜２３の下部に位
置させておき、ボール孔３０内に１個ずつ半田ボール２
４を整列させた状態で収納する。そして、図２（ａ）の
実線で示すように、モータ２６を駆動し、パレット２８
の第１エリアＡを吸着ヘッド１４のピックアップ位置に
移動し、第２エリアＢでボール溜２３の底を塞いでお
く。また、Ｘモータ１２、Ｙモータ８を駆動して、吸着
ヘッド１４を図１に示すように第１エリアＡ上に移動さ
せる。そして、既にパレット２８にボール孔３０により
整列させられた複数の半田ボール２４を吸着ヘッド１４
の図示しない吸引孔により一括してピックアップする。Next, the operation of the solder ball mounting device of this embodiment will be described. First, as shown by the broken line in FIG.
The first area A of the pallet 28 is positioned below the ball reservoir 23, and one solder ball 2 is placed in each ball hole 30.
Store 4 in an aligned state. Then, as shown by the solid line in FIG. 2A, the motor 26 is driven to move the pallet 28.
The first area A is moved to the pickup position of the suction head 14, and the bottom of the ball reservoir 23 is blocked by the second area B. Further, the X motor 12 and the Y motor 8 are driven to move the suction head 14 onto the first area A as shown in FIG. Then, the plurality of solder balls 24 already aligned in the pallet 28 by the ball holes 30 are attached to the suction head 14.
It picks up collectively by the suction hole (not shown).
【００１７】次いで、図１の矢印Ｍ１で示すように、吸
着ヘッド１４を容器３２側に移動する。このとき、リニ
アセンサ３７により吸着ヘッド１４の吸着ミスをチェッ
クし、１個でも吸着ミスがあれば、ボール溜２３内に全
ての半田ボール２４を戻して、再度初期状態に戻る。な
おこのとき、半田ボール２４にはフラックス３３が付着
していないので、そのままボール溜２３に半田ボール２
４を戻してもボール溜２３内の他の半田ボール２４にフ
ラックス３３が付く恐れはない。Then, as shown by an arrow M1 in FIG. 1, the suction head 14 is moved to the container 32 side. At this time, the suction error of the suction head 14 is checked by the linear sensor 37, and if there is even one suction error, all the solder balls 24 are returned to the ball reservoir 23 and the initial state is restored again. At this time, since the flux 33 is not attached to the solder ball 24, the solder ball 2 is directly attached to the ball reservoir 23.
Even if 4 is returned, there is no fear that the flux 33 will attach to the other solder balls 24 in the ball reservoir 23.
【００１８】またリニアセンサ３７のチェックの結果吸
着ミスがなければ、容器３２内にあるフラックス３３に
半田ボール２４を浸けて、吸着ヘッド１４を基板４側に
移動する。この移動の際、リニアセンサ３８によりフラ
ックス３３が塗布された後の半田ボール２４の欠落をチ
ェックする。ここで、１つでも欠落があれば、全ての半
田ボール２４を、ボール溜２３ではなく、廃棄箱３９に
廃棄する。次いで、リニアセンサ３８のチェックにおい
て欠落がなければ、基板４上に半田ボール２４を搭載
し、次のピックアップ動作に入るべく、矢印Ｍ３で示す
ように、吸着ヘッド１４を光センサ４０、４１を通過す
るような経路で、パレット２８の第１エリアＡ上へ移動
させる。If there is no adsorption error as a result of checking the linear sensor 37, the solder ball 24 is dipped in the flux 33 in the container 32 and the adsorption head 14 is moved to the substrate 4 side. During this movement, the linear sensor 38 checks for missing solder balls 24 after the flux 33 is applied. Here, if even one is missing, all the solder balls 24 are discarded in the waste box 39 instead of the ball reservoir 23. Next, if there is no omission in the check of the linear sensor 38, the solder balls 24 are mounted on the substrate 4, and the suction head 14 passes through the optical sensors 40 and 41 as shown by an arrow M3 to start the next pickup operation. The pallet 28 is moved onto the first area A along such a route.
【００１９】なお、上述したような吸着ヘッド１４の移
動の間に、パレット２８を水平方向に往復させることに
より、新たな半田ボール２４を第１エリアＡのボール孔
３０に収納し、第１エリアＡを吸着ヘッド１４のピック
アップ位置へ移動させておくことにより、途切れなく半
田ボール２４の搭載動作を繰り返すことができる。During the movement of the suction head 14 as described above, by reciprocating the pallet 28 in the horizontal direction, new solder balls 24 are accommodated in the ball holes 30 of the first area A, and By moving A to the pickup position of the suction head 14, the solder ball 24 mounting operation can be repeated without interruption.
【００２０】ここで、光センサ４０、４１を吸着ヘッド
１４が通過する際に、基板４への搭載動作を終えた吸着
ヘッド１４に、１個でも半田ボール２４が吸着されたま
ま残った状態になっていないかどうかをチェックする。
もし、半田ボール２４が残っていれば、廃棄箱３９へ残
った半田ボール２４を廃棄する。以上の動作を必要な回
数繰り返して、次々に基板４上に半田ボール２４を搭載
するものである。When the suction head 14 passes through the optical sensors 40 and 41, even one solder ball 24 remains sucked on the suction head 14 that has finished the mounting operation on the substrate 4. Check if not.
If the solder balls 24 remain, the remaining solder balls 24 are discarded in the waste box 39. The above operation is repeated a required number of times to mount the solder balls 24 on the substrate 4 one after another.
【００２１】次に図３、図４を参照しながら、上述した
ような半田ボール２４の搭載を伴う電子部品製造方法の
各工程について説明する。まず図４（ａ）に示すよう
に、基板４を準備し、次にステップ１において図４
（ｂ）に示すように基板４に回路パターンを形成する。
ここで本実施例では、基板４に形成される回路パターン
は、基板４を貫通するスルーホール部分と、このスルー
ホールの一方の面の端部に形成されるワイヤ用電極５１
と、スルーホールの他方の面側等に形成されるバンプ用
電極５０とを含む。Next, with reference to FIGS. 3 and 4, the respective steps of the electronic component manufacturing method involving mounting the solder balls 24 as described above will be described. First, a substrate 4 is prepared as shown in FIG.
A circuit pattern is formed on the substrate 4 as shown in FIG.
Here, in this embodiment, the circuit pattern formed on the substrate 4 includes a through hole portion penetrating the substrate 4 and a wire electrode 51 formed at an end of one surface of the through hole.
And a bump electrode 50 formed on the other surface side of the through hole or the like.
【００２２】次に、ステップ２において、図４（ｃ）に
示すように、基板４上のワイヤ用電極５１が形成されて
いる側に半導体チップ５２をダイボンディングする。な
お、５３は半導体チップ５２に形成されているチップ電
極である。Next, in step 2, as shown in FIG. 4C, the semiconductor chip 52 is die-bonded to the side of the substrate 4 where the wire electrode 51 is formed. Reference numeral 53 is a chip electrode formed on the semiconductor chip 52.
【００２３】ステップ３において、半導体チップ５２の
チップ電極５３と、ワイヤ用電極５１をワイヤ５４で接
続する。次にステップ４において、図４（ｅ）に示すよ
うに、半導体チップ５２などを樹脂５５で封止する。In step 3, the chip electrode 53 of the semiconductor chip 52 and the wire electrode 51 are connected by the wire 54. Next, in step 4, as shown in FIG. 4E, the semiconductor chip 52 and the like are sealed with resin 55.
【００２４】そして、ステップ５において、基板４を上
下反転させて、図１を参照しながら説明した半田ボール
２４の搭載動作により、バンプ用電極５０のそれぞれに
半田ボール２４を搭載する。次にステップ６において、
図４（ｇ）に示すように、基板４を半田の溶融温度以上
に加熱した後冷却することにより、半田ボール２４を一
旦溶融させた後固化させ、バンプ用電極５０上に半田バ
ンプ５６を形成するものである。Then, in step 5, the substrate 4 is turned upside down, and the solder ball 24 is mounted on each of the bump electrodes 50 by the mounting operation of the solder ball 24 described with reference to FIG. Next, in step 6,
As shown in FIG. 4 (g), the solder balls 24 are once melted and then solidified by heating the substrate 4 to a temperature higher than the melting temperature of the solder and then cooling the solder balls 24 to form the solder bumps 56 on the bump electrodes 50. To do.
【００２５】[0025]
【発明の効果】本発明の導電性ボール供給装置は、多数
の導電性ボールを貯留するボール溜と、ボール溜に対し
て水平方向に移動できるように支持され、かつ導電性ボ
ールを１個収納できるボール孔が複数個設けられたパレ
ットと、パレットをボール溜に対して水平方向に移動さ
せる移動手段を備えるので、短いタクトタイムでしかも
確実に半田ボールのピックアップを行うことができる。The conductive ball supply device of the present invention is provided with a ball reservoir for storing a large number of conductive balls, a ball reservoir supported so as to be movable in the horizontal direction with respect to the ball reservoir, and one conductive ball accommodated therein. Since the pallet having a plurality of possible ball holes and the moving means for moving the pallet in the horizontal direction with respect to the ball reservoir are provided, the solder balls can be picked up reliably in a short tact time.
【図１】本発明の一実施例における半田ボール搭載装置
の平面図FIG. 1 is a plan view of a solder ball mounting device according to an embodiment of the present invention.
【図２】（ａ）本発明の一実施例における半田ボール供
給装置の側面図 （ｂ）本発明の一実施例におけるパレットの一部拡大断
面図FIG. 2A is a side view of a solder ball supply device according to an embodiment of the present invention. FIG. 2B is a partially enlarged sectional view of a pallet according to the embodiment of the present invention.
【図３】本発明の一実施例における電子部品製造方法を
示すフローチャートFIG. 3 is a flowchart showing an electronic component manufacturing method according to an embodiment of the present invention.
【図４】（ａ）本発明の一実施例における電子部品製造
方法の工程説明図 （ｂ）本発明の一実施例における電子部品製造方法の工
程説明図 （ｃ）本発明の一実施例における電子部品製造方法の工
程説明図 （ｄ）本発明の一実施例における電子部品製造方法の工
程説明図 （ｅ）本発明の一実施例における電子部品製造方法の工
程説明図 （ｆ）本発明の一実施例における電子部品製造方法の工
程説明図 （ｇ）本発明の一実施例における電子部品製造方法の工
程説明図FIG. 4A is a process explanatory diagram of an electronic component manufacturing method according to an embodiment of the present invention. FIG. 4B is a process explanatory diagram of an electronic component manufacturing method according to an embodiment of the present invention. (D) Process explanatory drawing of the electronic component manufacturing method in one Example of this invention (e) Process explanatory drawing of the electronic component manufacturing method in one Example of this invention (f) This invention Process explanatory drawing of the electronic component manufacturing method in one Example (g) Process explanatory drawing of the electronic component manufacturing method in one Example of this invention
２３ ボール溜 ２４ 半田ボール ２５ 送りネジ ２６ モータ ２７ 送りナット ３０ ボール孔 23 Ball Reservoir 24 Solder Ball 25 Feed Screw 26 Motor 27 Feed Nut 30 Ball Hole
Claims (5)
するボール溜と、前記ボール溜の底部を塞ぎ、かつ前記
ボール溜に対して水平方向に移動できるように支持さ
れ、かつ導電性ボールを１個収納できるボール孔が複数
個設けられたパレットと、前記パレットを前記ボール溜
に対して水平方向に移動させる移動手段を備えたことを
特徴とする導電性ボール供給装置。1. A ball reservoir for storing a large number of conductive balls, the bottom of which is open, the bottom of the ball reservoir being closed, and being supported so as to be movable in the horizontal direction with respect to the ball reservoir, and electrically conductive. A conductive ball supply device comprising: a pallet provided with a plurality of ball holes capable of accommodating one ball; and a moving means for moving the pallet in a horizontal direction with respect to the ball reservoir.
性ボール供給装置と、導電性ボールに付着させるフラッ
クスを溜めた容器と、前記導電性ボール供給装置から導
電性ボールをピックアップし、ピックアップした導電性
ボールの下部を前記容器に溜められたフラックスに浸
け、かつ前記位置決め手段に位置決めされた基板に搭載
する吸着ヘッドとを有し、 前記導電性ボール供給装置は、多数の導電性ボールを貯
留し、底部が開口するボール溜と、前記ボール溜の底部
を塞ぎ、かつ前記ボール溜に対して水平方向に移動でき
るように支持され、かつ導電性ボールを１個収納できる
ボール孔が複数個設けられたパレットと、前記パレット
を前記ボール溜に対して水平方向に移動させる移動手段
を備えることを特徴とする導電性ボール搭載装置。2. A positioning means for positioning a substrate, a conductive ball supplying device, a container in which a flux for adhering to the conductive ball is stored, a conductive ball is picked up from the conductive ball supplying device, and the picked-up conductive material is picked up. A lower part of the conductive ball is immersed in the flux stored in the container, and is mounted on the substrate positioned by the positioning means, and the conductive ball supply device stores a large number of conductive balls. A ball reservoir having an open bottom, and a plurality of ball holes for closing the bottom of the ball reservoir and supported so as to be movable in the horizontal direction with respect to the ball reservoir and capable of accommodating one conductive ball. And a moving means for moving the pallet horizontally with respect to the ball reservoir. .
列させ、前記パレットに対して吸着ヘッドを昇降させて
整列した導電性ボールをピックアップし、基板に搭載す
ることを特徴とする導電性ボール搭載方法。3. A conductive ball, wherein conductive balls are arranged in a predetermined array on a pallet, a suction head is moved up and down with respect to the pallet to pick up the aligned conductive balls, and the conductive balls are mounted on a substrate. Mounting method.
開口する底部をパレットで塞ぎ、前記ボール溜に対し
て、前記パレットを水平方向に移動させることにより、
前記パレットに形成されたボール孔に導電性ボールを１
個ずつ収納して導電性ボールを前記ボール溜から取り出
し、取り出された導電性ボールを吸着ヘッドでピックア
ップし、基板に搭載することを特徴とする導電性ボール
搭載方法。4. A ball reservoir for storing a large number of conductive balls is closed with a pallet, and the pallet is moved horizontally with respect to the ball reservoir.
One conductive ball is placed in the ball hole formed in the pallet.
A conductive ball mounting method, characterized in that the conductive balls are individually stored and taken out from the ball reservoir, and the picked-up conductive balls are picked up by a suction head and mounted on a substrate.
部品製造方法であって、 基板にバンプ形成用の電極を作成するステップと、 多数の半田ボールを貯留するボール溜の開口する底部を
パレットで塞ぎ、前記ボール溜に対して、前記パレット
を水平方向に移動させることにより、前記パレットに形
成されたボール孔に半田ボールを１個ずつ収納して半田
ボールを前記ボール溜から取り出し、取り出された半田
ボールを吸着ヘッドでピックアップし、基板に搭載する
ステップと、 基板に搭載された半田ボールを溶融させた後固化させ
て、基板に半田バンプを形成するステップとを含むこと
を特徴とする電子部品製造方法。5. An electronic component manufacturing method for manufacturing an electronic component with solder bumps, comprising: a step of forming electrodes for forming bumps on a substrate; and a pallet having an opening bottom of a ball reservoir for storing a large number of solder balls. Block, and by moving the pallet horizontally with respect to the ball reservoir, the solder balls are housed one by one in the ball holes formed in the pallet, and the solder balls are taken out from the ball reservoir. An electronic device comprising: picking up a solder ball with a suction head and mounting it on a substrate; and melting and then solidifying the solder ball mounted on the substrate to form a solder bump on the substrate. Parts manufacturing method.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP24114495A JP3243982B2 (en) | 1995-09-20 | 1995-09-20 | Conductive ball mounting method and electronic component manufacturing method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP24114495A JP3243982B2 (en) | 1995-09-20 | 1995-09-20 | Conductive ball mounting method and electronic component manufacturing method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0982748A true JPH0982748A (en) | 1997-03-28 |
| JP3243982B2 JP3243982B2 (en) | 2002-01-07 |
Family
ID=17069930
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP24114495A Expired - Fee Related JP3243982B2 (en) | 1995-09-20 | 1995-09-20 | Conductive ball mounting method and electronic component manufacturing method |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP3243982B2 (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2004158797A (en) * | 2002-11-08 | 2004-06-03 | Umc Japan | Bump ball pressure bonding apparatus |
| US7353596B2 (en) | 2003-03-20 | 2008-04-08 | Matsushita Electric Industrial Co., Ltd. | Component mounting method |
-
1995
- 1995-09-20 JP JP24114495A patent/JP3243982B2/en not_active Expired - Fee Related
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2004158797A (en) * | 2002-11-08 | 2004-06-03 | Umc Japan | Bump ball pressure bonding apparatus |
| US6959485B2 (en) | 2002-11-08 | 2005-11-01 | Umc Japan | Bump ball crimping apparatus |
| US7353596B2 (en) | 2003-03-20 | 2008-04-08 | Matsushita Electric Industrial Co., Ltd. | Component mounting method |
| US7797820B2 (en) | 2003-03-20 | 2010-09-21 | Panasonic Corporation | Component mounting apparatus |
Also Published As
| Publication number | Publication date |
|---|---|
| JP3243982B2 (en) | 2002-01-07 |
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