JP2000022394A - Apparatus and method for mounting electronic component and apparatus and method for transferring flux - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an apparatus and a method for mounting an electronic component to improve productivity by shortening a flux transfer time and an apparatus and a method for transferring the flux. SOLUTION: Flux 14 is transferred to a bump 12a of a flip-chip 12 held at a transfer head by a flux transferring apparatus 11 disposed adjacent to a recognition unit 10, after the flip-chip 12 is recognized by moving a transfer head 7 on the unit 10 arranged on a moving route in the case of picking up the flip-chip 12 by the head 7 and mounting on a board. At this time, a roller 15 is rotated to move the flux 15 in a container 13 to an upper surface of the roller 15, and the bump 12a is brought into contact with the flux 14. Thus, the recognition and the flux transfer can be conducted by a series of operations, and a tact time can be shortened.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electronic component mounting apparatus and a mounting method for mounting an electronic component on a substrate, and a flux transfer apparatus and a transfer method for applying a flux to the electronic component during mounting.

[0002]

2. Description of the Related Art As a type of electronic component, a flip chip in which a metal bump is directly formed on a semiconductor element is known. Compared to QFPs that connect semiconductor elements to pins by wire bonding, this flip chip can be made smaller and space-saving, has excellent circuit characteristics because it does not require wires or pins, and has good jointability and reliability. In recent years, it has been used frequently because of its many advantages, such as high cost.

[0003] In general, solder bonding is widely used for mounting a flip chip. In solder bonding, before mounting the flip chip, a flux is applied to a bonding portion between the flip chip bump and the substrate in order to improve the solder bonding property. Is applied. As a method of applying a flux, a method of transferring a flux to a bump of a flip chip is widely used. In this method, a transfer head holding a flip chip is moved to a flux transfer portion on which a flux coating film is formed, and the flux is transferred by bringing a bump into contact with the flux coating film. Then, after mounting the flip chip on the substrate, the flip chip is pressed against the substrate by a thermocompression bonding tool,
The bumps are soldered and mounted on a substrate.

[0004]

However, as described above, the mounting of the flip chip involves steps such as flux transfer and thermocompression bonding, so that a long tact time is required. For example, while the mounting tact time of the conventional QFP is about 1 second, the flip chip requires a tact time of 4 seconds or more, and the length of the tact time is a factor in improving the productivity of the flip chip mounting line. It was a major factor that hindered. In order to reduce the tact time of the flip-chip mounting line, it has been required to reduce the time of the above-described flux transfer step.

Accordingly, an object of the present invention is to provide an electronic component mounting apparatus and a mounting method, and a flux transfer apparatus and a transfer method, which can shorten the flux transfer time and improve the productivity.

[0006]

According to a first aspect of the present invention, there is provided an electronic component mounting apparatus for supplying an electronic component, a positioning unit for positioning a substrate on which the electronic component is mounted, and an electronic component mounting unit. A transfer head that picks up from the substrate and transfers the transfer head to the substrate; a moving unit that moves the transfer head from the supply unit to the positioning unit; an elevating unit that moves the transfer head up and down; A recognition unit disposed on the movement path and recognizing the electronic component held by the transfer head; and a flux transfer unit disposed adjacent to the recognition unit and transferring a flux to the electronic component by a roller. Was.

According to a second aspect of the present invention, there is provided a method of mounting an electronic component, wherein the electronic component stored in the supply unit is picked up by a transfer head, and the electronic component is mounted on a recognition unit disposed on a moving path of the transfer head. Recognizing the electronic component held by the transfer head by moving the transfer head; and moving the transfer head over a flux transfer unit disposed adjacent to the recognition unit to transfer the electronic component. The method includes a step of transferring a flux to an electronic component held by a head by a roller of the flux transfer unit, and a step of mounting the electronic component to which the flux has been transferred on a substrate.

According to a third aspect of the present invention, there is provided a flux transfer device, comprising: a container for storing the flux; a roller having a horizontal rotating shaft on the container and arranged so that a lower surface thereof is in contact with the flux; Roller driving means for rotating the roller, the flux attached to the lower surface of the roller is moved to the upper surface of the roller by rotating the roller, and the electronic component held by the transfer head is attached to the upper surface of the roller. By contacting the flux, the flux was transferred to the electronic component.

According to a fourth aspect of the present invention, there is provided the flux transfer device according to the third aspect, further comprising rotation control means for controlling rotation of the roller driving means, wherein the upper surface of the roller relative to the transfer head is provided. By controlling the relative peripheral speed, the transfer shape of the flux transferred to the electronic component is adjusted.

According to a fifth aspect of the present invention, there is provided a flux transfer device according to the third aspect, further comprising a film thickness adjusting means for adjusting a film thickness of the flux adhering to the surface of the roller.

According to a sixth aspect of the present invention, there is provided a flux transfer method, wherein a roller which has a horizontal rotating shaft on a container storing the flux and has a lower surface in contact with the flux is driven by a roller driving means. By rotating,
The flux attached to the lower surface of the roller is moved to the upper surface of the roller, and the electronic component held by the transfer head is brought into contact with the flux attached to the upper surface of the roller, so that the flux is transferred to the electronic component. did.

A flux transfer method according to a seventh aspect is the flux transfer method according to the sixth aspect, wherein the flux is transferred to the electronic component by controlling a relative peripheral speed of the upper surface of the roller with respect to the transfer head. The transfer shape of the flux was adjusted.

The flux transfer method according to claim 8 is the flux transfer method according to claim 6, further comprising a film thickness adjusting means for adjusting the film thickness of the flux adhering to the surface of the roller.

According to the first and second aspects of the present invention, a flux transfer section having a roller for transferring flux is disposed adjacent to a recognition section for recognizing an electronic component held by a transfer head. Recognition of an electronic component and flux transfer can be performed in a series of operations to reduce the flux transfer time.

According to the third to eighth aspects of the present invention, the roller disposed so that the lower surface contacts the flux is rotated to move the flux attached to the lower surface of the roller to the upper surface, and the flux is bumped on the electronic component. , A compact flux transfer device can be realized, and control for obtaining a good flux transfer shape can be easily performed.

[0016]

Embodiments of the present invention will now be described with reference to the drawings. FIG. 1 is a perspective view of an electronic component mounting apparatus according to an embodiment of the present invention, FIG. 2 is a plan view of the electronic component mounting apparatus, FIG. 3 is a cross-sectional view of the flux transfer apparatus, and FIG.
(A), (b), and (c) are process explanatory diagrams of the flux transfer method.

First, an electronic component mounting apparatus will be described with reference to FIGS. In FIG. 1, a transport path 2 is provided in the center of a base 1 in the X direction. The transport path 2 serves as a positioning unit that transports and positions the substrate 3. On both sides of the transport path 2, supply units 4 for electronic components are arranged, and a plurality of tape feeders 5 are arranged in each supply unit 4. The tape feeder 5 stores flip chips, which are electronic components held on the tape, and supplies the flip chips by feeding the tape at a pitch. In addition, the supply form of the flip chip 4 is not limited to the tape feeder, and a tray may be used.

On the X-axis table 6, a flip chip transfer head 7 provided with a lifting means is mounted. The X-axis table 6 is a Y-axis table 8A and a Y-axis table 8A
The guides 8B arranged side by side are supported at both ends. X axis table 6 and Y axis table 8A
, The transfer head 7 moves horizontally and picks up the flip chip from the pickup position 9 of the tape feeder 5 by the nozzle 7a (see FIGS. 3 and 4) attached to the lower end, and transfers the flip chip onto the substrate 3. I do. Therefore,
The X-axis table 6 and the Y-axis table 8A are moving means.

In the movement path of the transfer head between the transport path 2 and the supply section 4, a flip chip recognition section 10 is provided. The recognition unit 10 recognizes an electronic component by a line camera when the transfer head 7 holding the flip chip passes above. A flux transfer device 11 as a flux transfer unit is provided adjacent to the recognition unit 10. Hereinafter, the recognition unit 10 and the flux transfer device 11 will be described with reference to FIG.

In FIG. 3, a flip chip 12 having a bump 12a is held by a nozzle 7a mounted on the lower end of the transfer head 7. FIG. 3 shows a state in which the transfer head 7 holding the flip chip 12 is horizontally moving on the recognition unit 10, and at this time, the bump 12 a is located above the line camera 10 b of the recognition unit 10 by the focal height H. In the position. In this state, while moving the transfer head 7 horizontally, the bumps 12 illuminated by the illumination unit 10a are
a is recognized by the line camera 10b. The recognition camera is not limited to the line camera, and may be an area camera.

Next, the flux transfer device 11 will be described. The flux transfer device 11 includes a container 13 for storing a flux 14 and a roller 15 above the container 13 and having a horizontal rotation axis. The lower surface of the roller 15 is located below the liquid level of the flux 14, It is always in contact with the flux 14. The roller 15 is rotatably driven by a motor 16 as a roller driving means via a belt 17. When the roller 15 rotates in the direction of the arrow a, the flux 14 attached to the lower surface of the roller 15 is rotated by the rotation of the roller 15. Move to the top.
As the motor 16, a motor such as a servo motor or a stepping motor capable of controlling the number of rotations is used, and the number of rotations is controlled by a motor controller 19 as rotation control means.

A scraper 18 is disposed on the side surface of the roller 15 while maintaining a clearance c from the surface of the roller 15. By adjusting the clearance c by moving the scraper 18 in the horizontal direction, the thickness t of the flux 14 attached to the lower surface of the roller 15 and moving to the upper surface of the roller 15 can be adjusted. That is, the scraper 18 is a film thickness adjusting means. As shown in FIG. 3, the height position of the flux transfer device 11 is adjusted such that the upper surface of the roller 15 substantially matches the position above the line camera 10b by the focal height H.

This flux transfer device does not require a squeegee device used for forming a flux coating film in a conventional flux transfer device, and is therefore extremely compact. The degree of freedom of the layout can be increased, and the overall space can be reduced.

This electronic component mounting apparatus is configured as described above, and the operation will be described below. First, in FIG. 2, the substrate 3 is positioned at a mounting position on the transport path 2. Next, the X-axis table 6 and the Y-axis table 8A are driven to move the transfer head 7, and the flip chip 12 is picked up at the pickup position 9 of the tape feeder 5 for supplying the flip chip 12.

The subsequent operation will be described with reference to FIG. 4A, the nozzle 7a is lowered (arrow b) in front of the recognition unit 10 in the path for moving the transfer head 7 after the pick-up.
Is located above the line camera 10b by a height H. The line camera 10b moves the bumps 12a while moving the recognition unit 10 at a predetermined speed.
Is imaged and recognized.

Next, by horizontally moving the nozzle 7a, the lower end of the bump 12a comes into contact with the coating film of the flux 14 attached to the upper surface of the roller 15, as shown in FIG. At this time, the rotation speed of the motor 16 is controlled by the motor controller 19, and the peripheral speed v2 of the surface of the roller 15 is appropriately combined with the horizontal moving speed v1 of the transfer head 7, so that the nozzle of the transfer head 7 7a
Peripheral speed of the roller 15 with respect to the
The relative speed of the flux 14 with respect to a can be set to the optimum speed for the flux transfer. Roller 1
By adjusting the relative height position of the nozzle 7a with respect to the upper surface of 5, the coating height dimension d at the lower end of the bump 12a can be set to an optimum value. That is, the transfer head 7
By controlling the relative peripheral speed of the roller 15 with respect to, and further controlling the coating height dimension d of the bump 12a, it is possible to maintain a good transfer shape of the flux 14 to the bump 12a.

Then, all the bumps 12 a are
By contacting the flux 14 on the upper surface of FIG.
As shown in (c), the bumps 12 of the flip chip 12 are formed.
The flux 14 is transferred to a. Thereafter, the transfer head 7 moves onto the substrate 3, lowers the nozzle 7 a to mount the flip chip 12 on the substrate 3, and heats while pressing the flip chip 12 for a predetermined time to mount the bump 12 a by soldering. .

At this time, since the flux transfer device 11 is compact and is disposed adjacent to the imaging unit 10, the recognition operation and the flux transfer operation can be performed in a series of short movement operations. The required travel distance can be greatly reduced, and the tact time can be reduced.

The present invention is not limited to the above embodiment. For example, in the present embodiment, an example is shown in which the flux application is performed after the recognition operation is performed, but the recognition operation is performed after the flux application is performed. The transition may be made. In this case, the moving direction of the transfer head 7 and the roller 15
May be reversed.

[0030]

According to the present invention, the flux transfer section provided with the flux transfer roller is disposed adjacent to the recognition section for recognizing the electronic component held by the transfer head.
Recognition of the electronic component and flux transfer can be performed by a series of short moving operations to shorten the flux transfer time.
Also, by rotating the roller arranged so that the lower surface is in contact with the flux, the flux attached to the lower surface of the roller is moved to the upper surface, and the electronic component is brought into contact with the flux to transfer the flux, so that the compact size is achieved. A flux transfer device can be realized, and control for a good flux transfer shape can be easily performed.

[Brief description of the drawings]

FIG. 1 is a perspective view of an electronic component mounting apparatus according to an embodiment of the present invention.

FIG. 2 is a plan view of an electronic component mounting apparatus according to an embodiment of the present invention.

FIG. 3 is a cross-sectional view of a flux transfer device according to an embodiment of the present invention.

FIG. 4 (a) Process explanatory diagram of a flux transfer method according to an embodiment of the present invention (b) Process explanatory diagram of a flux transfer method according to an embodiment of the present invention (c) Embodiment of the present invention Process diagram of the flux transfer method

[Explanation of symbols]

 3 Substrate 4 Supply unit 6 X-axis table 7 Transfer head 7a Nozzle 8A Y-axis table 10 Recognition unit 11 Flux transfer device 12 Flip chip 12a Bump 13 Container 14 Flux 15 Roller 18 Scraper 19 Motor controller

 ────────────────────────────────────────────────── ─── Continuing on the front page (72) Inventor Yasuhiro Kashiwagi 1006 Kazuma Kadoma, Osaka Pref. Matsushita Electric Industrial Co., Ltd. F-term (reference) 5E313 AA02 AA03 AA11 AA15 AA23 CC05 CD05 DD13 DD21 DD50 EE33 EE35 EE50 FF34 FG02 FG04 5E319 AA03 AA07 AB05 AC01 BB05 CC33 CC61 CD15 CD22 CD25 CD53 GG15

Claims (8)

[Claims] A supply unit for supplying an electronic component; a positioning unit for positioning a substrate on which the electronic component is mounted; a transfer head for picking up the electronic component from the supply unit and transferring and mounting the electronic component on the substrate; Moving means for moving the transfer head from the supply section to the positioning section; elevating means for moving the transfer head up and down; and an electronic device provided on a movement path of the transfer head and held by the transfer head. An electronic component mounting apparatus, comprising: a recognition unit that recognizes a component; and a flux transfer unit that is disposed adjacent to the recognition unit and transfers a flux to the electronic component by a roller. 2. A step of picking up an electronic component stored in a supply unit by a transfer head, and moving the transfer head over a recognition unit disposed on a movement path of the transfer head. Recognizing the electronic component held by the mounting head; and moving the mounting head over a flux transfer unit disposed adjacent to the recognition unit, so that the electronic component held by the mounting head receives the flux. A method of mounting an electronic component, comprising: transferring a flux by a roller of a transfer unit; and mounting the electronic component to which the flux has been transferred on a substrate. 3. A container for storing a flux, a roller provided on the container and having a horizontal rotation axis and arranged such that a lower surface thereof is in contact with the flux, and a roller driving means for rotating the roller. By rotating the roller, the flux adhered to the lower surface of the roller is moved to the upper surface of the roller, and the electronic component held by the transfer head is brought into contact with the flux adhered to the upper surface of the roller. A flux transfer device for transferring flux to electronic components. 4. A transfer shape of a flux transferred to said electronic component by controlling rotation of said roller driving means and controlling a peripheral speed of an upper surface of said roller with respect to said transfer head. The flux transfer device according to claim 3, wherein the flux transfer device is adjusted. 5. The flux transfer device according to claim 3, further comprising a film thickness adjusting means for adjusting the film thickness of the flux adhering to the surface of the roller. 6. A roller having a horizontal rotating shaft on a container in which the flux is stored and having a lower surface in contact with the flux is rotated by a roller driving means, thereby rotating the roller. The flux attached to the lower surface is moved to the upper surface of the roller, and the electronic component held by the transfer head is brought into contact with the flux attached to the upper surface of the roller to transfer the flux to the electronic component. Flux transfer method. 7. The flux transfer method according to claim 6, wherein a transfer shape of the flux transferred to the electronic component is adjusted by controlling a relative peripheral speed of the upper surface of the roller with respect to the transfer head. . 8. The flux transfer method according to claim 6, further comprising a film thickness adjusting means for adjusting the film thickness of the flux attached to the surface of the roller.