JPH0982136A - High heat conduction semiconductive prepreg sheet, stator coil, and dynamo-electric machine using the same, and manufacture of dynamo-electric machine stator - Google Patents

Abstract

PROBLEM TO BE SOLVED: To increase the capacity of a coil while keeping it at the same temperature as in the pass even when a large current is carried in the coil, and reduce the size, weight, and cost with the same capacity. SOLUTION: A high-tension rotating machine is formed of an iron core 4 having a slot, a stator in which a coil 5 having an earth insulating layer formed by winding an insulating tape on a conductor and a semiconductive layer on the outermost layer is integrated into the slot, and a rotor. In this high-tension rotating machine, a stator in which a highly heat conductive, semiconductive prepreg sheet 6 is put between the coil 5 and the iron core 4 in such a manner that the high heat conduction semiconductive semi-cure resin 2 side is situated on the core side followed by hardening is used. Thus, the irregularities in the laminating direction of the iron core 4 is filled up with the highly heat conductive, semiconductive semi-cure resin 2 to firmly adhere it, whereby the dispersibility of the heat generated from the coil 5 can be enhanced.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a high thermal conductive semiconductive filler for improving thermal conductivity and a rotating electric machine stator coil having a large thermal conductivity packed between the coil and the core. The present invention relates to an output rotating electric machine.

[0002]

2. Description of the Related Art A high-voltage rotating machine such as a generator or an electric motor has a large capacity, a high voltage, a small size and a light weight, or a low cost is a design / cooling technology, an insulating material / electric work, a reliability evaluation technology. It has been achieved by being supported by such progress. In order to achieve high capacity, high voltage, small size and light weight, or low cost of a rotating machine, it is necessary to increase the allowable heat amount generated by the rotating machine itself. For that purpose, it is possible to increase the heat resistance classification of the rotating machine or increase the heat conductivity to improve the heat dissipation. Taking an insulating material as an example, the heat resistance of the insulating material is from type Y (90 ° C) to type A (105 ° C) and type E (1
20 ° C), B type (130 ° C), F type (155 ° C), H type (180 ° C), C type (over 180 ° C), and the specific output of the rotating machine increases accordingly. Higher capacity, higher voltage, smaller size and lighter weight have been achieved.

On the other hand, ingenuity was made to improve the thermal conductivity of the insulating material, and mica added with an inorganic powder such as alumina having good thermal conductivity as proposed in Japanese Patent Publication No. 56-38006. By adopting the tape, the thermal conductivity of the insulating layer is more than double that of the conventional one, the heat dissipation is improved, and the temperature rise of the coil is suppressed. Therefore, even if a large amount of current is applied to the coil, the coil temperature can be kept the same as in the conventional case, and the capacity of the rotating electric machine can be increased.
Further, since the current density can be increased, the cross-sectional area of the coil can be reduced, so that the rotating machine can be downsized. Further, when the size is reduced, the amount of material used is small and the material cost is low, so that cost reduction can be achieved.

A method of manufacturing a stator of a high-voltage rotating electric machine such as an electric motor or a generator is as follows: a single prepreg system in which a single coil of prepreg mica tape is cured and then stored in a slot, and a coil of dry mica tape is wound. After the resin is impregnated and cured by itself, the individual injection method is stored in the slot, the coil alone wound with dry mica tape is stored in the slot, and the coils are electrically connected to each other.
It is roughly divided into a total impregnation method in which resin is impregnated and cured. The fully impregnated stator has a gap between the stator coil and the slot filled with a hardened material of impregnated resin, the core and coil are integrated, and the thermal conductivity between the coil and core is high, which improves cooling performance. It is excellent and has the advantage of simplifying the process, and is being widely applied as an insulation treatment method for small to medium-sized high-voltage rotating electric machines.

However, since the conductor, the insulating layer, the cured resin, and the iron core have different coefficients of thermal expansion, the larger the size, the larger the thermal stress due to the difference in the coefficients of thermal expansion, resulting in peeling of the insulating layer and dielectric breakdown. Therefore, the applicable range is limited.

If there is a gap between the slot and the coil, the coil itself will vibrate due to the electromagnetic force applied to the coil during operation of the high-voltage rotating electric machine, and the insulating layer of the coil will be mechanically damaged by abrasion and tapping by the iron core. The contact between the iron core and the coil is intermittent, so-called vibration sparking occurs between the coil surface and the iron core, and the energy of this spark damages the insulating layer and causes dielectric breakdown of the coil. Therefore, in order to eliminate a gap between the slot and the coil, a semi-conductive ripple spring having a spring property or a semi-conductive liner such as a plate-shaped or paper-shaped laminated plate is inserted so as not to move. The semi-conductive material is used to prevent corona generation from the coil surface.

In order to increase the thermal conductivity of this semiconductive liner, a composite side spacer composed of a corrugated laminated plate and a rubber elastic body between a slot and a coil as described in JP-A-59-136039. Inserting method and Japanese Patent Laid-Open No. 6-105
A method of inserting a thermally expansive semiconductive laminate into a slot as described in Japanese Patent No. 497 has been proposed. or,
The iron core is made by stacking thin steel plates of 0.3 to 0.5 mm in layers, and even if the steel plates are carefully stacked, irregularities are always present in the slot stacking direction.

In order to fill the irregularities and improve the thermal conductivity, a semiconductive elastic paint is applied to the coil surface as described in JP-A-2-303338, or a semiconductive elastic coating is applied. A method of winding a tape and storing it in a slot has been proposed.

Recently, demands for larger capacity, higher voltage, smaller size and lighter weight, or cost reduction of large rotating machines such as generators and electric motors have become stronger, and heat dissipation from the coil is further increased. It has been found that a significant improvement can be achieved by increasing the percentage, and the above measures alone were not sufficient.

[0010]

SUMMARY OF THE INVENTION The present invention has been made in view of the above situation, and an object thereof is to provide a highly reliable high heat conductive rotary machine stator and a rotary electric machine.

The thermal conductivity is improved by a method of inserting a composite side spacer made of a corrugated laminated plate and a rubber elastic body between the slot and the coil or a method of inserting a thermally expansive semiconductive laminated plate in the iron core slot. In addition, the current flowing through the iron core and the semi-conductive layer (current due to the core back magnetic flux) is blocked by poor contact between the semi-conductive layer and the core, vibration, etc., and slot discharge tends to occur easily. there were.

A method of applying a semi-conductive elastic paint or winding a semi-conductive elastic tape on the surface of the coil and storing it in the slot is to fill the irregularities in the stacking direction of the slot at the initial stage of manufacture, Although the thermal conductivity was improved, the improvement of the thermal conductivity was still insufficient.

Further, since the slot is not adhered to the elastic paint and the elastic tape, the contact is insufficient and the slot is peeled off with time, the thermal conductivity is lowered, and the current flowing through the iron core and the semiconductive layer is decreased. (Current due to core back magnetic flux)
Was blocked by poor contact between the semi-conductive layer and the core, vibration, etc., and there was a tendency for slot discharge to easily occur due to vibration sparking.

As a result of various studies, if the irregularities in the slot stacking direction are filled with a high thermal conductive semiconductive filler and firmly adhered, the heat dissipation from the coil can be enhanced and the core and the semiconductive layer can be improved. It was found that the current flowing through the layers (current due to the core back magnetic flux) is not interrupted by vibration or the like, and thus the structure has excellent slot discharge resistance. Furthermore, if the coil and the high-heat-conducting semiconductive filler are not adhered to each other but only contacted by a spring force, thermal stress due to a difference in thermal expansion coefficient can be reduced.

The present method is most suitable for the single prepreg system or the single injection system, but it can also be applied to the total impregnation system which has a low manufacturing cost. For example, if the high thermal conductive semiconductive filler subjected to the mold release is sandwiched between the coil and the slot and then impregnated with a resin, when the thermal stress becomes large, the semiconductive layer of the coil outermost layer and the Delamination occurs with the high thermal conductivity semiconductive filler, and the thermal stress is released. The slot and the high-thermal-conductivity semiconductive filler are firmly adhered to each other, and the current flowing through the iron core and the semiconductive layer (current due to the core back magnetic flux) is not blocked, resulting in a structure with excellent slot discharge resistance. Therefore, it is possible to obtain a rotating machine having a high thermal conductivity and a strong resistance to vibration sparking, which is convenient. When manufacturing a large-sized rotating machine stator by the full impregnation method with low manufacturing cost, when the thermal stress becomes large, the outermost semiconductive layer of the coil and the iron core that adheres to or contacts the semiconductive layer peels off. It is important to design so that thermal stress is released.

An object of the present invention is to improve the dissipation of heat generated from a stator coil, to provide a large-capacity, small-sized and lightweight generator with high reliability, a rotor stator for a large electric motor, and a high-voltage rotary machine. To provide.

[0017]

SUMMARY OF THE INVENTION An object of the present invention is to provide an iron core having a slot, a ground insulating layer formed by winding an insulating tape around a conductor, and a coil having a semiconductive layer as the outermost layer. In the rotor stator assembled in the slot, the surface resistance of the gap between the coil and the slot is 0.2 to 100k.
Ω and a thermal conductivity of 0.4 to 5 W / m · K filled with a high thermal conductive semiconductive filler, the high thermal conductive semiconductive filler is adhered to the slot, and is substantially in contact with the coil. To be achieved.

The present invention will be summarized as follows. The first aspect of the present invention relates to a high thermal conductive semiconductive prepreg sheet having a surface resistance of 0.2 to 100 kΩ and a surface resistance of 0.2 to 100 kΩ. 100kΩ and thermal conductivity is 0.4
It is characterized in that it is a prepreg sheet obtained by applying and semi-curing a thermosetting resin composition of up to 5 W / mK.

A second aspect of the present invention is an invention relating to a stator of a high-voltage rotating machine, comprising an iron core having a slot, a ground insulating layer formed by winding an insulating tape around a conductor, and a semiconductive layer as an outermost layer. In a stator for a rotor in which a coil having the above is incorporated in the slot, the gap between the coil and the iron core slot has a surface resistance of 0.2 to 100 kΩ and a thermal conductivity of 0.4 to
It is characterized in that it is a rotating machine stator which is filled with 5 W / m · K of high thermal conductive semi-conductive filler, and the high thermal conductive semi-conductive filler is adhered to the slot and is in contact with the coil.

A third aspect of the present invention is an invention relating to a high-voltage rotating machine, comprising an iron core having a slot, a ground insulating layer formed by winding an insulating tape around a conductor, and a semiconductive layer as an outermost layer. In a rotating machine including a rotating machine stator and a rotor in which the surface resistance is 0.2 to 100 kΩ and a thermal conductivity is 0.4 to 5 W / m. Filling with a high-thermal-conductivity semi-conductive filler of K, the high-thermal-conductivity semi-conductive filler and the slot being bonded,
The stator is in contact with the coil.

A fourth aspect of the present invention is an invention relating to a method of manufacturing a stator of a high-voltage rotating machine, which comprises forming an iron core having slots and a ground insulating layer in which an insulating tape is wound around a conductor, and forming the ground insulating layer on the outermost layer. In a method of manufacturing a rotating machine stator in which a coil having a semiconductive layer is incorporated in the slot, a sheet having a surface resistance of 0.2 to 100 kΩ in a gap between the coil and the slot has a surface resistance of 0.2. ˜100 kΩ and thermal conductivity 0.4-5 W / m · K Thermosetting resin composition is applied and sandwiched with the thermosetting resin side of the semi-cured prepreg sheet as the slot side and heat-cured for rotation. It is characterized by manufacturing a stator.

A fifth aspect of the present invention is an invention relating to a method for manufacturing a stator of a rotating machine, which comprises winding a dry mica tape having a low resin content on a conductor group laminated via a rare insulating layer a predetermined number of times. A rotating machine in which a coil wound with semi-conductive tape or a coil coated with semi-conductive paint is housed in the slot of the iron core, the coils are electrically connected to each other, and then the resin is vacuum impregnated and heat-cured. In the method for manufacturing a stator, a thermosetting sheet having a surface resistance of 0.2 to 100 kΩ and a thermal conductivity of 0.4 to 5 W / m · K on one side of a sheet having a surface resistance of 0.2 to 100 kΩ together with the coil. After the resin composition is applied and semi-cured, the prepreg sheet is sandwiched with the semi-cured resin side being the slot side, the coils are electrically connected to each other, and then the resin is vacuum-impregnated and heat-cured.
The slot and the thermosetting resin composition are firmly adhered to each other, and the semiconductive layer and the prepreg sheet are not substantially adhered to each other.

The high thermal conductive semi-conductive prepreg sheet flows toward the core side of the core at the time of heat curing and fills the space between the core and the core.
Moreover, it is preferable that they are adhered and do not flow out to the coil side and are not substantially adhered to the coil in order to reduce the thermal stress due to the difference in thermal expansion coefficient. In particular, when manufacturing with the full impregnation method, the weak points are consciously created so that there is peeling between the semiconductive layer of the coil outer layer and the high thermal conductive semiconductive prepreg sheet, or when the thermal stress becomes large. It is preferable that the high thermal conductive semiconductive prepreg sheet and the coil are not substantially adhered. It is preferable that a semi-conductive spring-like liner such as a ripple spring is sandwiched between the iron core and the coil in order to fill the space between the iron core and the high thermal conductive semi-conductive prepreg sheet and increase the adhesiveness.

The bottom of the slot, the space between the coils, etc. may be inserted into the core core slot of the stator of the present invention.

[0025]

In the rotating machine stator, the iron core having the slot and the ground insulating layer formed by winding the insulating tape around the conductor are formed, and the coil having the semiconductive layer as the outermost layer is incorporated in the slot. And the iron core slot have a surface resistance of 0.2 to 100 kΩ and a thermal conductivity of 0.4 to 5 W /
It is filled with m.K. high heat-conducting semi-conductive filler, and the high heat-conducting semi-conducting filler is adhered to the iron core slot. The single unit can have large capacity, high voltage, small size and light weight, or low cost.

Further, since the outermost semiconductive layer of the coil and the high thermal conductive semiconductive prepreg sheet are substantially in contact with each other, thermal stress can be reduced and the core and the high thermal conductive semiconductive prepreg sheet can be reduced. Since the current flowing through the filling (current due to the core back magnetic flux) is not interrupted by vibration or the like, it is possible to manufacture a highly reliable rotating machine having excellent slot discharge resistance.

The high thermal conductive semiconductive prepreg sheet used in the present invention has a surface resistance of 0.2 to 100 kΩ and a surface resistance of 0.2 to 100 kΩ and a thermal conductivity of 0.4 to 5 W / on one side. There is no particular limitation as long as it is a prepreg sheet coated with a thermosetting resin composition of m · K 2. As such a specific example, a thermosetting resin composition having a surface resistance of 0.2 to 100 kΩ and a thermal conductivity of 0.4 to 5 W / m · K on one surface of a sheet having a surface resistance of 0.2 to 100 kΩ. A semi-cured high thermal conductive semi-conductive prepreg sheet, a thermoplastic resin having a surface resistance of 0.2 to 100 kΩ is applied to a glass non-woven fabric, and one surface thereof has a surface resistance of 0.
2 to 100 kΩ and thermal conductivity of 0.4 to 5 W / mK
After applying the thermosetting resin composition described in 1. above, a semi-cured high thermal conductive semiconductive prepreg sheet, and a thermoplastic resin having a surface resistance of 0.2 to 100 kΩ filled with carbon are applied to a glass nonwoven fabric, and then carbon and Semi-cured high thermal conductive semi-conductivity by applying a thermosetting resin composition having a surface resistance of 0.2 to 100 kΩ and a thermal conductivity of 0.4 to 5 W / mK filled with a high thermal conductive inorganic filler. Surface resistance of prepreg sheet and carbon is 0.2-10
A thermosetting resin composition of 0 kΩ was applied to a glass non-woven fabric, semi-cured, and then carbon and a thermally conductive inorganic filler were filled on one surface to give a surface resistance of 0.2 to 100 k.
Ω and a semi-cured high thermal conductive semiconductive prepreg sheet coated with a thermosetting resin composition having a thermal conductivity of 0.4 to 5 W / m · K, and a thermoplastic resin having a surface resistance of 0.2 to 100 kΩ. After being applied to a glass non-woven fabric, one surface has a surface resistance of 0.2 to 100 kΩ and a thermal conductivity of 0.4 to 5
A W / m · K thermosetting resin composition was applied, and a semi-cured high thermal conductive semi-conductive prepreg sheet and a carbon-filled thermoplastic resin composition having a surface resistance of 0.2 to 100 kΩ were applied to a glass nonwoven fabric. Later, the surface resistance of carbon and high thermal conductive inorganic filler filled on one side was 0.2.
〜100kΩ and thermal conductivity 0.4〜5W / m ・ K
Semi-cured high thermal conductive semi-conductive prepreg sheet coated with the thermosetting resin composition of No. 10 and having a surface resistance of 0.2 to 10
One side of 0kΩ carbon fiber mixed polyamide paper has a surface resistance of 0.2-100kΩ and a thermal conductivity of 0.4-5W.
/ M · K thermosetting resin composition applied, semi-cured, high thermal conductivity semi-conductive prepreg sheet, surface resistance is 0.
The surface resistance is 0.2 to 1 on one side of the 2 to 100 kΩ sheet.
There is a semiconductive prepreg sheet having a high thermal conductivity which is semi-cured by laminating sheets coated with a thermosetting resin composition having a thermal conductivity of 00 kΩ and a thermal conductivity of 0.4 to 5 W / m · K.

Further, the surface resistance is 0.2 to 100 kΩ on one side of the corrugated sheet laminated plate embedded in the elastic body having the surface resistance of 0.2 to 100 kΩ and the thermal conductivity of 0.4 to 5 W / m · K. ,
In addition, a semi-cured high thermal conductive semiconductive prepreg sheet coated with a thermosetting resin composition having a thermal conductivity of 0.4 to 5 W / mK and a surface resistance of 0.2 to 100 kΩ, and a thermal conductivity of 0.2. The surface resistance is 0.2 to 100k on one side of the semi-conductive corrugated sheet laminate embedded in the elastic body of 4 to 5 W / mK.
A high thermal conductive semiconductive prepreg sheet obtained by applying and semi-curing a thermosetting resin composition having a resistance of Ω and a thermal conductivity of 0.4 to 5 W / m · K is also useful as a ripple spring. It is preferable to improve the thermal conductivity by adding a high thermal conductive filler to the sheet having the surface resistance of 0.2 to 100 kΩ.

Further, one side of the thermal conductivity of 0.4 to 5 W / mK rubber sheet has a surface resistance of 0.2 to 100 kΩ and a thermal conductivity of 0.4 to 5 W / mK. A high-heat-conducting semiconductive prepreg sheet obtained by applying and semi-curing a resin composition can be used. Further, instead of the high thermal conductive semi-conductive prepreg sheet, a sheet having a surface resistance of 0.2 to 100 kΩ has a surface resistance of 0.2 to 100 kΩ and a thermal conductivity of 0.4 to 5 W / m · K. A high thermal conductive semiconductive adhesive sheet coated with a thermoplastic resin composition can also be used. The high thermal conductive semiconductive adhesive sheet coated with the thermoplastic resin composition is not particularly limited as long as the thermoplastic resin composition adheres to the iron core.

Further, instead of the high thermal conductive semiconductive prepreg sheet, a high thermal conductive semiconductive thermosetting resin composition having a surface resistance of 0.2 to 100 kΩ and a thermal conductivity of 0.4 to 5 W / m · K. A thing can be used. In any case, peeling occurs between the semiconductive layer of the coil outer layer and the high thermal conductive semiconductive prepreg sheet, high thermal conductive semiconductive adhesive sheet or high thermal conductive semiconductive thermosetting resin composition. Or when the stress becomes high, the core core and the high thermal conductive semiconductive prepreg sheet, the high thermal conductive semiconductive adhesive sheet or the high thermal conductive semiconductive thermosetting resin composition are provided. It is essential that they are bonded. Among these, it is preferable in terms of work to use a high thermal conductive semiconductive prepreg sheet.

The surface resistivity is a carbon type conductive filler such as carbon black, graphite, carbon fiber,
It can be adjusted by adding a metallic conductive filler such as silver or nickel, or a non-metallic conductive filler such as zinc oxide, titanium oxide, potassium titanate or tin oxide.

The thermal conductivity used in the present invention is 0.4-5.
As a W / m · K filler, the thermal conductivity is 1.4 to 60.
There is no particular limitation as long as it is W / m · K. Specific examples thereof include alumina, crystalline silica, fused silica, magnesium oxide, boron nitride, silicon carbide, aluminum fluoride, aluminum borate, calcium fluoride,
High heat of inorganic powder such as magnesium fluoride, titanium oxide, calcium carbonate, magnesium carbonate, dolomite, talc, kaolin clay, mica, hydrated alumina, wollastonite, glass short fiber, potassium titanate fiber, fiber, whisker, etc. Thermosetting resin composition filled with conductive inorganic material, or thermoplastic resin composition, sheet, film,
Fiber, laminated board, etc. The filling amount of these high thermal conductive inorganic materials with respect to the thermosetting resin composition or the thermoplastic resin composition is based on the thermal conductivity of the high thermal conductive inorganic materials and the thermal conductivity of the base resin, Katsuhiko Kanari, Polymer, Volume 26, August issue, pages 557 to 561 can be calculated using a formula to obtain a desired thermal conductivity. When the surface resistance of the filler having the thermal conductivity of 0.4 to 5 W / mK is 0.2 to 100 kΩ, the high thermal conductivity filler can also serve as the electric field relaxation layer, which is convenient. Carbon black, graphite, for the purpose of imparting semiconductivity to the filler having a thermal conductivity of 0.4 to 5 W / mK
Surface resistance is reduced to 0 by adding carbon type conductive filler such as carbon fiber, metal type conductive filler such as silver and nickel, non-metal type conductive filler such as zinc oxide, titanium oxide, potassium titanate and tin oxide. It is preferable to adjust to 0.2 to 100 kΩ.

Putty-like thermal conductivity of 0.4 to 5 W / mK
The core filling material may be filled in the iron core slot to eliminate the unevenness in the stacking direction of the iron core slot to provide high heat conduction and enhance the heat dissipation of the coil. In addition, a commercially available high thermal conductive silicone sheet, high thermal conductive silicone rubber, high thermal conductive laminated plate, etc. are sandwiched between the iron core slots to eliminate irregularities in the iron core slot stacking direction for high thermal conductivity and to enhance heat dissipation from the coil. Is also good.

The thermoplastic resin composition of the present invention is not particularly limited as long as it has heat resistance equal to or higher than that of a rotating machine and good adhesion to the iron core. Specific examples thereof include, for example, polyamideimide, polyamide,
Examples include polyurethane, polyacrylonitrile, polycarbonate, polyethylene terephthalate, polyvinyl alcohol, polyvinyl acetal, fluororesin, ethylene / vinyl acetate copolymer, styrene / acrylonitrile copolymer, and styrene / acrylonitrile / butadiene copolymer. These thermoplastic resin compositions can be used alone or as a mixture. You may add a solvent. Of these, polyamideimide, polyamide, polycarbonate and polyurethane are preferable.

In order to avoid adhesion between the coil and the high thermal conductive semiconductive prepreg sheet, it is preferable to precoat the coil or the high thermal conductive semiconductive prepreg sheet with silicone or a fluorine-based release agent. Especially, one side of the sheet with surface resistance of 0.2-100 kΩ is treated with a release agent,
After heating, the surface resistance on the opposite side is 0.2-100k
It is preferable to use a high thermal conductive semiconductive prepreg sheet obtained by applying and semi-curing a thermosetting resin composition having Ω and a thermal conductivity of 0.4 to 5 W / m · K. The thermosetting resin composition used in the present invention is not particularly limited as long as it has heat resistance equal to or higher than the heat resistance of the rotating machine and good adhesiveness to the iron core. One such example is:
For example, (A) a polyfunctional epoxy resin composition comprising a curing catalyst and a polyfunctional epoxy resin, (B) a polyfunctional epoxy resin composition comprising a polyfunctional epoxy resin and an acid anhydride curing agent,
(C) Polyfunctional epoxy resin composition comprising polyfunctional epoxy resin and phenol curing agent, (D) Thermosetting maleimide resin composition, (E) Thermosetting allylic resin composition,
(F) phenol resin composition, (G) unsaturated polyester resin composition, (H) alkyd resin composition, (I) melamine resin composition, (J) silicone resin and the like. Examples of the polyfunctional epoxy resin include bisphenol A
Diglycidyl ether, bisphenol F diglycidyl ether, bisphenol AD diglycidyl ether, hydrogenated bisphenol A diglycidyl ether, 2,2- (4-hydroxyphenyl) nonadecane diglycidyl ether, 4,4′- Bis (2,3-epoxypropyl) diphenyl ether, 3,4-epoxycyclohexylmethyl- (3,4-epoxy) cyclohexanecarboxylate, 4- (1,2-epoxypropyl) -1,2-epoxycyclohexane, 2- (3,
4-epoxy) cyclohexyl-5,5-spiro (3,3
4-epoxy) -cyclohexane-m-dioxane,
3,4-epoxy-6-methylcyclohexylmethyl-
Bifunctional epoxy resin such as 4-epoxy-6-methylcyclohexanecarboxylate, phenol novolac type epoxy resin, bisphenol A novolac type epoxy resin, bisphenol F novolac type epoxy resin, bisphenol AD novolac type epoxy resin,
Polyfunctional epoxy resin containing three or more p- (2,3-epoxypropoxy) phenyl groups, that is, tris [p-
(2,3-epoxypropoxy) phenyl] methane,
1,1,3-tris [p- (2,3-epoxypropoxy) phenyl] butane, 1,1,2,2-tetrakis [p- (2,3-epoxypropoxy) phenyl] ethane, 1,1, 3,3-Tetrakis [p- (2,3-epoxypropoxy) phenyl] propane, 1,1,3-tris [p- (2,3-epoxypropoxy) phenyl]
There are polyfunctional epoxy resins such as propane, naphthalene skeleton polyfunctional epoxy resins, diglycidyl ether of anthracene diol, and anthracene skeleton epoxy resins such as triglycidyl ether of anthracentriol.

Further, (a) bis (4-hydroxyphenyl) methane, (b) bis (4-hydroxyphenyl) ethane, (c) bis (4-hydroxyphenyl) propane, (d) tris (4-hydroxyphenyl). ) Alkane,
(E) A polyfunctional epoxy resin obtained by reacting a mixture of at least two or more polyhydric phenols of tetrakis (4-hydroxyphenyl) alkane with epichlorohydrin is also low in viscosity before curing, has good workability, and after curing. It is useful because it has high heat resistance.

As the tris (4-hydroxyphenyl) alkane, tris (4-hydroxyphenyl) methane, tris (4-hydroxyphenyl) ethane, tris (4-hydroxyphenyl) propane, tris (4-hydroxyphenyl) methane.
Hydroxyphenyl) butane, tris (4-hydroxyphenyl) hexane, tris (4-hydroxyphenyl) heptane, tris (4-hydroxyphenyl) octane, tris (4-hydroxyphenyl) nonane and the like.

Also, a tris (4-hydroxyphenyl) alkane derivative such as tris (4-hydroxydimethylphenyl) methane may be used. Tetrakis (4-
Hydroxyphenyl) alkanes include tetrakis (4-hydroxyphenyl) methane and tetrakis (4-
Hydroxyphenyl) ethane, tetrakis (4-hydroxyphenyl) propane, tetrakis (4-hydroxyphenyl) butane, tetrakis (4-hydroxyphenyl) hexane, tetrakis (4-hydroxyphenyl)
Examples include heptane, tetrakis (4-hydroxyphenyl) octane, tetrakis (4-hydroxyphenyl) nonane, and the like.

Alternatively, a tetrakis (4-hydroxyphenyl) alkane derivative such as tetrakis (4-hydroxydimethylphenyl) methane may be used. this house,
Tris [p- (2,3-epoxypropoxy) phenyl] methane, 1,1,3-tris [p- (2,3-epoxypropoxy) phenyl] butane, 1,1, from the viewpoint of heat resistance and viscosity. 2,2-Tetrakis [p- (2,3-epoxypropoxy) phenyl] ethane, 1,1,3,3
-Tetrakis [p- (2,3-epoxypropoxy) phenyl] propane, 1,1,3-tris [p- (2,3
A combination of a polyfunctional epoxy resin such as -epoxypropoxy) phenyl] propane and a diglycidyl ether of bisphenol A, a diglycidyl ether of bisphenol F, or a diglycidyl ether of bisphenol AD is preferable.

In this case, the compounding ratio of the trifunctional or higher polyfunctional epoxy resin and the bifunctional epoxy resin is not particularly limited, but the bifunctional epoxy resin is added to 1 part by weight of the trifunctional or higher polyfunctional epoxy resin. 0.1 to 19 parts by weight is preferably blended. When the amount of the polyfunctional epoxy resin having three or more functional groups is increased, the viscosity before curing is increased and the cured product tends to be hard and brittle. Conversely, when the amount of the bifunctional epoxy resin is increased, the viscosity is decreased, but the heat resistance tends to be reduced. It is in. From the viewpoint of achieving both viscosity and heat resistance, it is particularly useful to add 1 to 9 parts by weight of a bifunctional epoxy resin to 1 part by weight of a trifunctional polyfunctional epoxy resin. Further, a composition containing naphthalene such as diglycidyl ether of naphthalene diol or an anthracene skeleton epoxy resin is preferable from the viewpoint of heat resistance and viscosity.

Further, a mixture of a novolac type epoxy resin and a bisphenol type epoxy resin such as a phenol novolac resin, a bisphenol A novolac type epoxy resin, a bisphenol F novolac type epoxy resin, and a bisphenol AD novolac type epoxy resin can also be used as a mixture of viscosity and heat resistance. It is preferable from the viewpoint of satisfying both.

The acid anhydride used in the present invention is not particularly limited as long as it is a general acid anhydride. Examples of such compounds include methylhexahydrophthalic anhydride, hexahydrophthalic anhydride, methyltetrahydrophthalic anhydride, tetrahydrophthalic anhydride, nadic acid anhydride, methylnadic acid anhydride, dodecylsuccinic anhydride, succinic anhydride, Octadecyl succinic anhydride, maleic anhydride,
Examples thereof include benzophenone tetracarboxylic acid anhydride, and examples thereof include single species or a mixture thereof. Among them, it is preferable to contain nadic anhydride and methylnadic anhydride from the viewpoint of heat resistance.

The phenol resin used in the present invention is not particularly limited as long as it has two or more phenolic hydroxyl groups. As such a phenol resin, for example,
There are phenol novolac, cresol novolac, xyresole novolac, bisphenol A novolac, bisphenol F novolac, bisphenol AD novolac, poly-p-vinylphenol, resole type phenol and the like, and they may be used alone or in a mixture thereof.

When curing the epoxy resin composition of the present invention, a curing catalyst may be added to the thermosetting resin composition, if necessary. The curing catalyst is not particularly limited as long as it has a function of curing the polyfunctional epoxy resin. Examples of such curing catalysts include tertiary amines such as trimethylamine, triethylamine, tetramethylbutanediamine, triethylenediamine, dimethylaminoethanol, dimethylaminopentanol, tris (dimethylaminomethyl) phenol, N-methylmorpholine. Amines such as cetyltrimethylammonium bromide, cetyltrimethylammonium chloride, cetyltrimethylammonium iodide, dodecyltrimethylammonium bromide, dodecyltrimethylammonium chloride, dodecyltrimethylammonium iodide, benzyldimethyltetradecylammonium chloride, benzyldimethyltetradecyl Ammonium bromide, allyldodecyl trimethyl ammonium Quaternary ammonium salts such as mud, benzyldimethylstearylammonium bromide, stearyltrimethylammonium chloride, benzyldimethyltetradecylammonium acetylate, 2-methylimidazole, 2-ethylimidazole, 2-undecylimidazole, 2-heptadecylimidazole, 2-methyl-4-ethylimidazole, 1-butylimidazole, 1-propyl-2-methylimidazole, 1-benzyl-2-methylimidazole, 1-cyanoethyl-2
-Phenylimidazole, 1-cyanoethyl-2-methylimidazole, 1-cyanoethyl-2-undecylimidazole, 1-azine-2-methylimidazole, 1
-Imidazoles such as azine-2-undecyl, metal salts of amines with zinc octanoate, cobalt, etc., 1,8-diaza-bicyclo (5,4,0) -undecene-7, N-
Methyl-piperazine, tetramethylbutylguanidine,
Triethylammonium tetraphenylborate, 2-
Ethyl-4-methyltetraphenylborate, 1,8-
Amine tetraphenylborate such as diaza-bicyclo (5,4,0) -undecene-7-tetraphenylborate, triphenylphosphine, triphenylphosphonium tetraphenylborate, aluminum trialkylacetoacetate, aluminum trisacetylacetoacetate, aluminum alcoholate , Aluminum acylate, sodium alcoholate, amine salt of boron trifluoride, and the like. Such a curing catalyst is resistant to the thermosetting resin composition and is generally added in an amount of 0.01 to 5% by weight.

In addition, a monoepoxy resin such as cyclohexene vinyl monooxide, octylene oxide, butyl glycidyl ether, styrene oxide, phenyl glycidyl ether, glycidyl methacrylate or allyl glycidyl ether may be added as a diluent, if necessary. . However, in general, the diluent has the effect of lowering the viscosity, but also lowers the heat resistance.

Examples of the thermosetting maleimide resin composition according to the present invention include N, N'-ethylene bismaleimide, N, N'-hexamethylene bismaleimide,
N, N'-dodecamethylene bismaleimide, N, N'-
m-xylylene bismaleimide, N, N'-p-xylylene bismaleimide, N, N'-1,3-bismethylenecyclohexane bismaleimide, N, N'-1,4-bismethylenecyclohexane bismaleimide, N , N'-
2,4-tolylylene bismaleimide, N, N'-2,6
-Tolyrylene bismaleimide, N, N'-3,3'-diphenylmethane bismaleimide, N, N '-(3-ethyl) -3,3'-diphenylmethane bismaleimide,
N, N '-(3,3'-dimethyl) -3,3'-diphenylmethane bismaleimide, N, N'-(3,3'-diethyl) -3,3'-diphenylmethane bismaleimide, N, N '-(3,3'-dichloro)-3,3'-diphenylmethane bismaleimide, N, N'-4,4'-
Diphenylmethane bismaleimide, N, N '-(3-ethyl) -4,4'-diphenylmethane bismaleimide,
N, N '-(3,3'-dimethyl) -4,4'-diphenylmethane bismaleimide, N, N'-(3,3'-diethyl) -4,4'-diphenylmethane bismaleimide, N, N '-(3,3'-dichloro)-4,4'-diphenylmethane bismaleimide, N, N'-3,3'-
Diphenyl sulfone bismaleimide, N, N'-4,
4'-diphenylsulfone bismaleimide, N, N '
-3,3'-diphenylsulfid bismaleimide,
N, N'-4,4'-diphenylsulfid bismaleimide, N, N'-p-benzophenone bismaleimide, N, N'-4,4'-diphenylethane bismaleimide, N, N'-4, 4'-diphenyl ether bismaleimide, N, N '-(methylene-ditetrahydrophenyl) bismaleimide, N, N'-tolidine bismaleimide, N, N'-isophorone bismaleimide, N,
N'-p-diphenyldimethylsilyl bismaleimide,
N, N'-4,4'-diphenylpropane bismaleimide, 2,2-bis (4- (4- (3-maleimidophenoxy) phenyl) propane, N, N'-naphthalene bismaleimide, N, N'- p-phenylene bismaleimide, N, N'-m-phenylene bismaleimide, N,
N'-4,4 '-(1,1'-diphenylcyclohexane) -bismaleimide, N, N'-3,5- (1,2,
4-triazole) -bismaleimide, N, N'-pyridine-2,6-diylbismaleimide, N, N'-5-
Methoxy-1,3-phenylene bismaleimide, 1,2
-Bis (2-maleimidoethoxy) -ethane, 1,3-
Bis (3-maleimidopropoxy) -propane, N,
N'-4,4'-diphenylmethane-bis-dimethylmaleimide, N, N'-hexamethylene-bis-dimethylmaleimide, N, N'-4,4 '-(diphenylether) -bis-dimethylmaleimide, N, N '-4, 4'
-(Diphenylsulfone) -bis-dimethylmaleimide, N, N'-bismaleimide of 4,4'-diamino-triphenylphosphate, 2,2'-bis [4- (4
-Aminophenoxy) phenyl] propane N, N'-
Bismaleimide, 2,2'-bis [4- (4-aminophenoxy) phenylmethane N, N'-bismaleimide, 2,2'-bis [4- (4-aminophenoxy) phenylethane N, N In addition to bifunctional maleimides represented by ′ -bismaleimide, etc., reaction products (polyamine compounds) of aniline and formalin, 3,4,4 ′
There are monofunctional maleimides such as polyfunctional maleimides, phenylmaleimides, tolylmaleimides and xylylmaleimides obtained by reacting triaminodiphenylmethane, triaminophenol and the like with maleic anhydride.

Triallyl trimellitate, diallyl terephthalate, diallyl isophthalate, p, p'-diaryloxycarbonyldiphenyl ether, m, p'-diaryloxycarbonyldiphenyl ether, o, p'-are added to the addition-curable maleimide. Diallyloxycarbonyl diphenyl ether, m, m′-dialyloxycarbonyl diphenyl ether, triallyl isocyanurate,
A polyvalent carboxylic acid allyl ester such as triallyl cyanurate, styrene, the alkenylphenol compound, the alkenylamine compound, an acid anhydride, an epoxy resin, a diamine compound and the like may be added or modified. Among these, the addition-curable maleimide and acid anhydride, combined use of epoxy resin, or modified, the addition-curable maleimide, acid anhydride, epoxy resin and alkenylphenol compound or alkenylamine compound combined use, Alternatively, modification, combined use of the addition-curable maleimide or polyvalent carboxylic acid allyl ester with an alkenylphenol compound, or an alkenylamine compound or diamine, or modification is preferable from the viewpoint of achieving both heat resistance and viscosity. The thermosetting maleimide resin composition of the present invention can be sufficiently cured even with an uncured catalyst, but if it is desired to further accelerate the reaction,
A curing catalyst may be added to the thermosetting resin composition, if necessary. The curing catalyst is not particularly limited as long as it has a function of accelerating the reaction of the thermosetting maleimide resin composition.
As such a compound, for example, an ionic catalyst or a free radical catalyst is effective. The curing catalyst was 0.0 based on the thermosetting maleimide resin composition.
The amount is 5 to 10% by weight, preferably 0.1 to 5% by weight. As the ionic catalyst, the same curing catalyst as in the acid anhydride-curable epoxy resin composition can be used. As the free radical catalyst, known organic peroxides, hydroperoxides, azoisobutyronitrile and the like can be used.

Examples of the thermosetting allyl resin composition of the present invention include triallyl trimellitate, diallyl terephthalate, diallyl isophthalate, p, p'-diaryloxycarbonyldiphenyl ether, m, p'-diaryloxycarbonyldiphenyl ether. , O, p'-diaryloxycarbonyldiphenyl ether, m, m'-diaryloxycarbonyldiphenyl ether, triallyl isocyanurate, triallyl cyanurate, and other polyvalent carboxylic acid allyl esters, their oligomers, or their oligomers. There is a mixture of monomers.

The thermosetting allylic resin composition of the present invention can be sufficiently cured even with a non-curing catalyst, but if it is desired to further accelerate the reaction, the curing catalyst may be added to the thermosetting resin composition, if necessary. You may add. The curing catalyst is not particularly limited as long as it has a function of accelerating the reaction of the thermosetting allylic resin composition. As such a compound, for example, an ionic catalyst or a free radical catalyst is effective. The curing catalyst is used in an amount of 0.05 to 10% by weight, preferably 0.1 to 5% by weight, based on the thermosetting allylic resin composition.
Adjust to be weight percent. As the ionic catalyst, the same curing catalyst as in the acid anhydride-curable epoxy resin composition can be used. As the free radical catalyst, known organic peroxides, hydroperoxides, azoisobutyronitrile and the like can be used. An unsaturated polyester body may be added.

In order to improve the wettability of the thermosetting resin composition used in the present invention with the high thermal conductive inorganic material,
It is preferable to add a surfactant. Examples of such a surfactant include γ-chloropropyltrimethoxysilane, vinyltrichlorosilane, vinyltriethoxysilane, vinyltrimethoxysilane, vinyltris (β-methoxyethoxy) silane, γ-methacryloxypropyltrisilane. Methoxysilane, β- (3,4-epoxycyclohexyl) ethyltrimethoxysilane, γ-glycidoxypropyltrimethoxysilane, γ-mercaptopropyltrimethoxysilane, γ-aminopropyltriethoxysilane, N-β- (amino Ethyl) -γ-aminopropyltrimethoxysilane, γ-ureidopropyltriethoxysilane and other silane-based surfactants, isopropyl isostearoyl titanate, isopropyl trioctanoyl titanate, isopropyl methacryloyl isostear Irtitanate, isopropyl tridodecyl titanate, isopropyl isostearoyl diacrylic titanate, isopropyl tris (dioctyl phosphate) titanate, isopropyl tricumyl phenyl titanate, isopropyl tris (dioctyl pyrophosphate) titanate, isopropyl tris (n-amino) Ethyl) titanate, tetraisopropyl bis (dioctyl phosphite) titanate, tetraoctyl bis (didodecyl phosphite) titanate, tetra (2,2
Titanate surfactants such as 2-diallyloxymethyl-1-butyl) bis (ditridecyl) phosphite titanate, diisostearoyl ethylene titanate, bis) dioctyl pyrophosphate) ethylene titanate, ethyl acetoacetate aluminum diisopropylate, aluminum tris Examples include aluminum-based surfactants such as (ethyl acetoacetate), zirconium-based surfactants, and the like.

Of these, γ-glycidoxypropyltrimethoxysilane, β- (3,4-epoxycyclohexyl) ethyltrimethoxysilane, γ-mercaptopropyltrimethoxysilane, γ-aminopropyltriethoxysilane, N-β. -(Aminoethyl) -γ-aminopropyltrimethoxysilane, isopropylisostearoyl titanate, isopropyltrioctanoyl titanate, ethyl acetoacetate aluminum diisopropylate, and aluminum tris (ethylacetoacetate) are preferable. You may mix 2 or more types of the said surfactant. In particular, monofunctional surfactants such as isopropyl isostearoyl titanate and isopropyl trioctanoyl titanate for lowering the viscosity, and γ-glycidoxypropyltrimethoxysilane for improving crack resistance and mechanical strength, β- (3,4-epoxycyclohexyl) ethyltrimethoxysilane, γ-mercaptopropyltrimethoxysilane, γ-aminopropyltriethoxysilane, N-β- (aminoethyl) -γ-aminopropyltrimethoxysilane, etc. It is particularly preferable to use a functional surfactant in combination.

The surface-active agent may be previously treated with a filler or may be added later to the resin composition. Alternatively, both may be used together. The preferred addition amount of the surfactant can be calculated by (specific surface area of the filler (m ² / gr) × weight of the filler (gr)) / covered area of the surfactant (m ² / gr).

It is also effective to modify the thermosetting resin composition of the present invention, if necessary. For example, modification with vinyl compound monomer such as styrene and methyl methacrylate, modification with rubber such as polybutadiene and polychloroprene, modification with unsaturated polyester, modification with amine such as aliphatic amine, aromatic amine and allyl amine,
It is also possible to modify with a furan-based compound or a phenol compound.

[0054]

EXAMPLES The present invention will now be described in more detail with reference to examples, but the present invention is not limited to these examples.

The abbreviations of the compounds used in the examples are as follows.

TKEPPE: 1,1,2,2-tetrakis [p- (2,3-epoxypropoxy) phenyl]
Ethane Epoxy Equivalent 192 TEPPM: 1,1,3-Tris [p- (2,3-epoxypropoxy) phenyl] methane Epoxy Equivalent 161 TEPBP: 1,1,3-Tris [p- (2,3-epoxypropoxy) Phenyl] butane Epoxy equivalent 196 DGEBPA: Diglycidyl ether of bisphenol A Epoxy equivalent 175 DGEBPF: Diglycidyl ether of bisphenol F Epoxy equivalent 170 GEPN: Glycidyl ether of phenol novolac Epoxy equivalent 190 GECN: Cresol-novolac glycidyl ether 1 Epoxy equivalent 2 , 2-DGON: 1,2-diglycidyloxynaphthalene epoxy equivalent 141 1,3-DGON: 1,3-diglycidyloxynaphthalene epoxy equivalent 141 PDGON High molecular weight 1,6-diglycidyl sulfopropyl epoxy equivalent 250 softening point 67 ℃ GONDGONM: 1- (2- glycidyloxy-1
Naphthyl) -1- (2 ', 7'-diglycidyloxy-
1-naphthyl) methane epoxy equivalent 187 softening point 75 ° C. PGENCN: novolak polyglycidyl ether of cresol and 2-hydroxynaphthalene mixture epoxy equivalent 225 softening point 84 ° C. TGIC: triglycidyl isocyanurate epoxy equivalent MHAC-P: methyl nadic acid anhydride Physical acid anhydride equivalent 178 PN: phenol novolac hydroxyl equivalent 106 BMI: 4,4'-diphenylmethane bismaleimide DAPPI: 2,2'-bis [4- (4-maleimidophenoxy) phenyl] propane DAM: 4,4'- Diaminodiphenylmethane amine equivalent 92.1 DADPE: 4,4'-diaminodiphenyl ether
Amine equivalent 93.1 DABA: diallyl bisphenol A DABF: diallyl bisphenol F DGEDABA: diglycidyl ether of diallyl bisphenol A TAIC: triallyl isocyanurate MDAP: diallyl phthalate monomer ODAP: diallyl phthalate oligomer AMS: terephthalic acid unsaturated polyester body BTPP -K: triphenylbutylphosphine tetraphenylborate 2E4MZ-K: 2-ethyl-4-methylimidazole tetraphenylborate TPP: triphenylphosphine TPP-K: triphenylphosphine tetraphenylborate IOZ: 2-ethyl-4-methylimidazole And a salt of octanoic acid zinc salt C11Z-AZINE: 1-azine-2-undecylimidazole TEA- Triethylamine tetraphenylborate 2E4MZ-CN: 1-cyanoethyl-2-ethyl-4
-Methylimidazole ABF: triethylamine salt of boron trifluoride DCPO: dicumylpa-oxide BPO: benzoylper-oxide KBM-403: γ-glycidoxypropyltrimethoxysilane KBM-603: N-β- (aminoethyl) -γ- Aminopropyltrimethoxysilane S-181: Trisisostearoyloxyisopropoxytitanium IPZ: Tetraisopropyl Zirconate Examples 1-36 Preparation of High Thermal Conductivity Semiconducting Prepreg Sheets Examples 1-Table 1 The resin composition (1) of 36 was applied to the sheets of Examples 1 to 36.

Next, in Examples 1 to 16, Example 19, Examples 25 to 28, and Examples 33 to 36, the solvent toluene was volatilized to give a semiconductive sheet 1 having a surface resistance of 0.2 to 10 kΩ. Got

On the other hand, Example 17, Example 18, and Example 2
In Examples 0 to 24 and Examples 29 to 32, the semiconductive sheet 1 having a surface resistance shown in the table was obtained by holding at 100 ° C. for 3 hours and performing full curing. A fluorine-based release agent was sprayed on one surface of the semiconductive sheet 1 and heated.

In addition, Example 2 described in Table 7 to Table 9
The resin composition (2) of 5 to 36 was applied to a glass nonwoven fabric to obtain a high thermal conductive semiconductive uncured resin coated sheet.

The resin composition (2) described in Examples 1 to 24 in Tables 1 to 6 was applied to one surface of the semiconductive sheet 1 obtained in Examples 1 to 24, which was not treated with a release agent. The heating semi-cure and the B stage were performed to obtain the high thermal conductive semi-conductive prepreg sheet 6 shown in FIG. The high thermal conductive semiconductive prepreg sheet 6 shown in FIG. 1 has a structure in which the high thermal conductive semiconductive semi-cured resin 2 is attached to one surface of the semiconductive sheet 1.

In addition, one of the semiconductive sheets 1 obtained in Examples 25 to 36, which was not treated with a release agent, was subjected to Examples 25 to 3 on one side.
The high thermal conductive semi-conductive uncured resin coating sheet obtained in 6 was pressure bonded, heated and semi-cured, and was subjected to B stage to obtain a high thermal conductive semi-conductive prepreg sheet 6 shown in FIG. The high thermal conductive semiconductive prepreg sheet 6 shown in FIG. 2 has a structure in which the high thermal conductive semiconductive semi-cure sheet 18 is attached to the semiconductive sheet 1.

In Examples 25 to 36, a glass non-woven fabric was brought into contact with one surface of the semi-conductive sheet 1 which was not treated with the release agent, and the resin compositions of Examples 25 to 36 shown in Tables 7 to 9 ( Even if the method of coating, pressure-bonding, heating semi-cure, and B-stage are applied to 2), the high thermal conductive semiconductive prepreg sheet 6 which is exactly the same as the above method can be obtained.

This high thermal conductive semiconductive prepreg sheet 6
When cured under the curing conditions shown in Tables 1 to 9, at 130 ° C., the thermal conductivity is 0.4 to 5 W / m · K and the surface resistance is 0.2.
It had a property of high thermal conductivity semiconductivity of about 90 kΩ. 1 for the cured product of high thermal conductive semi-conductive prepreg sheet 6
Even when heated to 30 ° C. for 20,000 hours, the characteristics were almost the same as in the initial stage, and the heat resistance was 130 ° C. or higher.

When the resin compositions (2) themselves shown in Tables 1 to 9 are heat-cured, the same 13
A cured product having a thermal conductivity of 0.4 to 5 W / m · K and a surface resistance of 0.2 to 90 kΩ was obtained at 0 ° C. Even when the cured product was heated to 130 ° C. for 20,000 hours, the properties were almost the same as those in the initial stage and the heat resistance was 130 ° C. or higher.

[0065]

[Table 1]

[0066]

[Table 2]

[0067]

[Table 3]

[0068]

[Table 4]

[0069]

[Table 5]

[0070]

[Table 6]

[0071]

[Table 7]

[0072]

[Table 8]

[0073]

[Table 9]

Examples 37 to 40 High Thermal Conductivity Semiconductive Prepreg Sheet A resin composition (2) was applied to one surface of a semiconductive sheet having a surface resistance shown in Table 10, heated to semi-cure, and made into a B stage to achieve high heat. A conductive semiconductive prepreg sheet 6 was obtained. This high thermal conductive semi-conductive prepreg sheet 6
When cured by heating at 0 ° C. for 1 hour, a high thermal conductive semiconductive prepreg sheet cured product was obtained. This cured product is 130 ℃
Even after heating for 20,000 hours, the characteristics are almost the same as the initial,
It had a heat resistance of 130 ° C. or higher.

[0075]

[Table 10]

Example 41 Production of prepreg sheet containing high thermal conductive semi-conductive corrugated sheet A glass nonwoven fabric was impregnated with an epoxy resin composition consisting of GEPN 144 g, DAM 66 g and carbon black 90 g and laminated to obtain a corrugated sheet. Then, 500 g of thermosetting silicone resin and 150 g of carbon black were mixed and heat-cured to obtain the semiconductive elastic sheet 3 with corrugated plate shown in FIG.

The surface resistance of the corrugated sheet-containing semiconductive elastic sheet 3 was 8 kΩ. The resin composition (2) described in Example 1 of Table 1 is provided on one surface of the semiconductive elastic sheet 3 containing the corrugated plate.
Was applied, heated to semi-cure, and subjected to B-stage to obtain a prepreg sheet 15 with a high thermal conductive semi-conductive corrugated plate shown in FIG. This high thermal conductive semi-conductive corrugated sheet prepreg sheet 1
The thermal conductivity of the cured product of No. 5 at 130 ° C is 1.0 W / m.
-In K, the surface resistance was 1.0 kΩ. This cured prepreg sheet with high thermal conductivity semi-conductive corrugated sheet is 130
Even when heated to ℃ for 20,000 hours, the thermal conductivity and the surface resistance were completely the same as in the initial stage, and the heat resistance was 130 ° C. or higher.

Example 42 Production of prepreg sheet containing high thermal conductive semi-conductive corrugated sheet A glass nonwoven fabric was impregnated with an epoxy resin composition composed of 144 g of GEPN, 66 g of DAM and 90 g of carbon black and laminated to obtain a corrugated sheet. Then, 500 g of thermosetting butadiene-modified epoxy resin and 150 g of carbon black were mixed and heat-cured to obtain a corrugated sheet-containing semiconductive elastic sheet 3 shown in FIG. The surface resistance of this corrugated sheet-containing semiconductive elastic sheet 3 was 8 kΩ. After applying the resin composition (2) described in Example 29 of Table 2 to a glass nonwoven fabric, it is attached to one surface of the semiconductive elastic sheet 3 with corrugated plate, heated to semi-cure, and made into a B stage to show in FIG. A prepreg sheet 15 containing a high thermal conductive semiconductive corrugated plate was obtained.

The thermal conductivity at 130 ° C. of the cured product of the prepreg sheet 15 containing the high thermal conductive semiconductive corrugated sheet is 1.
The surface resistance was 1.0 kΩ at 0 W / m · K. This cured prepreg sheet 1 with a high thermal conductive semiconductive corrugated sheet
Even when the sample No. 5 was heated to 130 ° C. for 20,000 hours, its thermal conductivity and surface resistance were completely the same as in the initial stage, and it had heat resistance of 130 ° C. or higher.

Example 43 and Comparative Examples 1 to 3 Application Example to Rotor Stator Hereinafter, an example of the present invention will be described with reference to the accompanying drawings.

FIG. 4 is a sectional view of the stator of the rotating electric machine, and FIG.
Is the enlarged view. FIG. 6 is an enlarged view of a main part of FIG. FIG. 7 is a sectional view taken along the line AA ′ of FIG.

First, 0.5 mm thick magnetic steel sheets that had been subjected to an insulation treatment were punched out and stacked in layers to form an iron core core 4 having slots. Next, the ground insulating layer 8 was obtained by winding the prepreg mica tape around the conductor group laminated via the rare insulating layer 9 a predetermined number of times and heating and curing it. A coil 5 having a semiconductive layer 12 was manufactured by applying a semiconductive coating on the ground insulating layer 8.

The coil 5, the ripple spring 7, and the high thermal conductive semiconductive prepreg sheet 6 obtained in Examples 1 to 40 are housed in the slot of the iron core 4 as shown in FIG. 5, and the cutting 11 is inserted. After that, the high heat conductive semiconductive prepreg sheet 6 was cured by heating for a predetermined time to manufacture a rotating machine stator. The high thermal conductive semi-conductive prepreg sheet 8 must have the high thermal conductive semi-conductive semi-cured resin 2 or high thermal conductive semi-conductive semi-cured sheet 6 side facing the iron core 4 side, and the semi-conductive sheet 1 on the coil 5 side. Toward.

When the rotating machine stator was disassembled, the resin in the high thermal conductive semiconductive prepreg sheet 6 completely filled up the irregularities of the slots of the iron core 4 in the stacking direction and adhered well to the iron core 4. Further, the resin in the high thermal conductive semi-conductive prepreg sheet 6 barely flowed out to the coil 5 and the ripple spring 7, and the coil 5 and the iron core 4 were substantially in contact with each other. Therefore, the ground insulating layer 8 was not newly peeled due to thermal stress or the like due to the difference in temperature between the time of operation and the time of rest. The ripple spring 7 makes the coil 5 and the cured product of the high thermal conductive semi-conductive prepreg sheet 6 adhere to each other, improves the thermal conductivity between the coil 5 and the high thermal conductive semi-conductive prepreg sheet 6, and enhances the heat dissipation effect. The coil 5 itself vibrates due to the electromagnetic force applied to the coil 5 during operation, and mechanical damage and vibration sparking are avoided by abrasion and tapping of the ground insulating layer 8 by the iron core 4, and thermal stress due to thermal contraction difference is avoided. Is important for.

When the rotor stator after being heated and deteriorated at 130 ° C. for 20,000 hours is dismantled, the high thermal conductive semi-conductive prepreg sheet 6 completely fills the irregularities of the core core 4 in the slot stacking direction as in the initial stage, and the core core 4 is removed. It was well adhered.

When the surface resistance of the high thermal conductive semi-conductive prepreg sheet 6 exceeds 100 kΩ, the electric field relaxation is insufficient and corona is apt to occur, and when it is less than 0.2 kΩ, eddy current flows and the efficiency is poor. It tends to generate heat, which is not preferable. Further, if the thermal conductivity of the high thermal conductive semiconductive prepreg sheet 6 is smaller than 0.4 W / m · K, the heat dissipation property is insufficient. When the thermal conductivity of the high thermal conductive semi-conductive prepreg sheet 6 is higher than 5 W / m · K, the fluidity becomes poor, and it becomes difficult to produce the high thermal conductive semi-conductive prepreg sheet 6.

8 to 14 show a conventional rotary machine stator. FIG. 8 shows the high thermal conductive semi-conductive prepreg sheet 6 of FIG.
There is no conventional example. 9 is an enlarged view of FIG. 8, and FIG. 10 is a cross-sectional view taken along the line 9-9 of FIG. The irregularities of the iron core 4 in the slot stacking direction are not in contact with the high thermal conductivity medium, and the heat dissipation from the coil is poor. In addition, due to deterioration of the insulators and reduction of the spring force of the ripple spring 7 during operation for many years, a gap is generated between the semiconductive layer 12 and the iron core 4, and as shown in FIG. The current due to the magnetic flux is cut off, a potential difference occurs between the layers of the electromagnetic steel sheet, and the earth insulating layer 8 is broken down.

FIG. 11 shows a conventional example in which a semiconductive corrugated elastic body 13 made of a corrugated laminated plate and a rubber elastic body is inserted between the iron core slot and the coil. FIG. 12 is A- of FIG.
It is a sectional view of the A'plane. Inserting the semi-conductive corrugated elastic body 13 in place of the ripple spring 7 improves the thermal conductivity as compared with the case of the conventional example of FIG. 8, but unlike the case of FIG. Lower thermal conductivity. On the side without the semiconductive corrugated elastic body 13, as in the case of FIG. 8, the unevenness in the slot stacking direction of the iron core 4 is not in contact with the high thermal conductivity medium, and thus the heat generated from the coil is not dissipated. bad.

Further, due to deterioration of the insulators and reduction of the spring force of the ripple spring 7 during operation for many years, a gap is generated between the semiconductive layer 12 and the iron core 4, and as shown in FIG. The current due to the interlinking magnetic flux is cut off, a potential difference occurs between the layers of the electromagnetic steel sheet, and the earth insulating layer 8 is broken down.

FIG. 13 shows a semiconductive elastic paint 1 on the coil surface.
4 is a conventional example in which No. 4 is applied. FIG. 14 shows AA ′ of FIG.
It is sectional drawing of a surface. Initially semi-conductive elastic paint 14
Fills up the unevenness of the iron core 4 in the stacking direction, and the thermal conductivity is slightly improved as compared with the case of the conventional example of FIG. 8, but unlike the case of FIG. The rate is low. Further, the iron core 4 and the semiconductive elastic paint 14
Since is not adhered, the contact is insufficient, or it peels off over time, and the thermal conductivity decreases. In addition, due to deterioration of the insulators and reduction of the spring force of the ripple spring 7 during operation for many years, a gap is generated between the semi-conductive layer 12 and the iron core 4, and as shown in FIG. The current due to the magnetic flux is cut off, a potential difference occurs between the layers of the electromagnetic steel sheet, and the earth insulating layer 8 is broken down.

From the above, by filling the irregularities in the stacking direction of the iron core slots with a high thermal conductive semiconductive filler and firmly adhering, the heat dissipation from the coil can be enhanced and the core core and It was found that the current flowing through the conductive layer (current due to the core-back magnetic flux) is not blocked by vibration or the like, so that the structure has excellent slot discharge resistance. Instead of the above-mentioned high thermal conductive semiconductive prepreg sheet 6, the high thermal conductive semiconductive thermosetting resin composition (2) shown in Tables 1 to 3 may be directly processed into the iron core slot.

Furthermore, if the coil and the high-heat-conducting semiconductive filler are not adhered to each other but only contacted by a spring force, the thermal stress due to the difference in thermal expansion coefficient can be reduced.

Example 44 Application Example to Rotating Machine Stator FIG. 16 is an enlarged view of a cross section of the rotating machine stator. FIG. 17 is a sectional view taken along the line AA 'in FIG. First, an insulating treated 0.5 mm thick electromagnetic steel plate was punched out and stacked in layers to form an iron core 4 having slots. Next, a dry mica tape having a small resin content was wound around the conductor group laminated via the rare insulating layer 9 a predetermined number of times, and the resin was vacuum-impregnated and heat-cured to obtain the ground insulating layer 8. A coil 5 having a semi-conductive layer 12 was manufactured by winding a semi-conductive tape on the ground insulating layer 8.

The coil 5, the ripple spring 7, and the high-thermal-conductivity semiconductive prepreg sheet 6 obtained in Examples 1 to 40 are housed in the slot of the iron core 4 as shown in FIG. After that, the high heat conductive semiconductive prepreg sheet 6 was cured by heating for a predetermined time to manufacture a rotating machine stator. In addition, in the high thermal conductive semiconductive prepreg sheet 6, the high thermal conductive semiconductive semi-cured resin 2 side was always directed toward the iron core 4 side. When the rotating machine stator was disassembled, the resin in the high-thermal-conductivity semiconductive prepreg sheet 6 completely filled up the irregularities in the stacking direction of the slots of the core core 4 and adhered well to the core core 4.

Further, the high thermal conductive semi-conductive prepreg sheet 6
The resin inside did not almost flow out to the coil 5 and the ripple spring 7, and the coil 5 and the iron core 4 were substantially in contact with each other. Therefore, the ground insulating layer 8 was not newly peeled due to thermal stress or the like due to the difference in temperature between the time of operation and the time of rest. Also, 20,000 at 130 ° C
When the stator of the rotating machine after heat deterioration is disassembled, the resin in the high-thermal-conductivity semiconductive prepreg sheet 6 completely fills the irregularities in the stacking direction of the slots of the iron core 4 as in the initial stage.
It was well adhered to the iron core 4.

Embodiments 45 and 46 Example of application to a stator of a rotating machine The same as Embodiment 43 except that the high thermal conductive semiconductive prepreg sheet 6 is inserted between the slot bottom and the coil, and FIG.
~ A rotary machine stator having a structure shown in Fig. 21 was manufactured. When the rotating machine stator was disassembled, the resin in the high-thermal-conductivity semiconductive prepreg sheet 6 completely filled up the irregularities in the stacking direction of the slots of the core core 4 and adhered well to the core core 4. Further, the resin in the high thermal conductive semi-conductive prepreg sheet 6 barely flowed out to the coil 5 and the ripple spring 7, and the coil 5 and the iron core 4 were substantially in contact with each other. Therefore, the ground insulating layer 8 was not newly peeled due to thermal stress or the like due to the difference in temperature between the time of operation and the time of rest. Further, when the rotor stator after being heated and deteriorated at 130 ° C. for 20,000 hours is disassembled, the resin in the high thermal conductive semiconductive prepreg sheet 6 completely fills the irregularities in the stacking direction of the slots of the iron core 4 as in the initial stage. It was well adhered to the iron core 4.

Embodiments 47 and 48 Example of application to a stator of a rotating machine A prepreg sheet 15 with a high thermal conductive semiconductive corrugated plate is used in place of the ripple spring 7 in the same manner as in Embodiment 43, and FIGS. A rotating machine stator having the structure shown in was produced. When the rotating machine stator is dismantled, the resin in the high thermal conductive semiconductive prepreg sheet 6 or the high thermal conductive semiconductive corrugated sheet-containing prepreg sheet 15 completely fills the irregularities of the core core 4 in the stacking direction of the core, and the iron core It was well adhered to the core 4.

Also, a high thermal conductive semiconductive prepreg sheet 6
The resin in the prepreg sheet 15 containing the high thermal conductive semi-conductive corrugated sheet hardly flowed out to the coil 5 or the ripple spring 7, and the coil 5 and the iron core 4 were substantially in contact with each other. Therefore, the ground insulating layer 8 was not newly peeled due to thermal stress or the like due to the difference in temperature between the time of operation and the time of rest. When the rotor stator after being heated and deteriorated at 130 ° C. for 20,000 hours is disassembled, the resin in the high thermal conductive semiconductive prepreg sheet 6 and the high thermal conductive semiconductive corrugated prepreg sheet 15 is the same as in the initial stage. The unevenness of the slot in the stacking direction was completely filled and well adhered to the iron core 4.

Example 49 Application Example to Stator of Rotating Machine The same as Example 43 except that the ripple spring 7 and the high thermal conductive semiconductive prepreg sheet 6 were replaced by the high thermal conductive semiconductive corrugated sheet prepreg sheet 15. Fig. 2
6, A rotary machine stator having the structure shown in FIG. 27 was manufactured. When the rotor of the rotating machine was disassembled, the resin in the prepreg sheet 15 with a high-thermal-conductivity semiconductive corrugated plate completely filled up the irregularities of the core core 4 in the stacking direction of the slots and adhered well to the core core 4. Further, the resin in the prepreg sheet 15 containing the high thermal conductive semi-conductive corrugated sheet hardly flows into the coil 5 or the ripple spring 7, and the coil 5 and the iron core 4
Were only in substantial contact. Therefore, the ground insulating layer 8 was not newly peeled due to thermal stress or the like due to the difference in temperature between the time of operation and the time of rest. Also, 1
When the rotor stator after being heated and deteriorated at 30 ° C. for 20,000 hours is disassembled, the resin in the prepreg sheet 15 with a high thermal conductive semi-conductive corrugated plate completely fills the irregularities of the core core 4 in the stacking direction, as in the initial stage. , Was well adhered to the iron core 4.

Example 50 Example of Application to Rotating Machine Stator FIG. 28 is an enlarged view of a cross section of the rotating machine stator. FIG. 29 is a sectional view taken along the line AA ′ of FIG. First, an insulating treated 0.5 mm thick electromagnetic steel plate was punched out and stacked in layers to form an iron core 4 having slots. Then, a dry mica tape having a low resin content was wound around the conductor group laminated via the rare insulating layer 9 a predetermined number of times, and then the semiconductive tape was wound to manufacture a white coil having the semiconductive layer 12. . This white coil, ripple spring 7, Example 1
High heat conductive semi-conductive prepreg sheet 6
At the same time, as shown in FIG. 28, the coils were housed in the slots of the core 4 and the cuttings 11 were inserted, and then the coils were electrically connected to each other. Next, a rotary machine stator was manufactured by vacuum impregnation of the resin and heat curing.

The high thermal conductive semiconductive prepreg sheet 6
Always directed the high thermal conductive semiconductive semi-cured resin 2 side toward the iron core 4 side. Further, a release agent is applied to the semiconductive sheet 1 side of the high thermal conductive semiconductive prepreg sheet 6 in advance, and when the thermal stress due to the difference in thermal expansion coefficient becomes high, the high thermal conductive semiconductive prepreg sheet 6 and the coil are released. Peeling between the semi-conductive layer 12 of No. 5 and the semi-conductive layer 12 of No. 5 was performed.

A release agent is also applied to the ripple spring 7 in advance so that peeling occurs between the ripple spring 7 and the semiconductive layer 12 of the coil when the thermal stress due to the difference in coefficient of thermal expansion becomes high. . The ripple spring 7 also has semiconductivity. When the rotor of the rotating machine was disassembled, the resin in the high thermal conductive semiconductive prepreg sheet 6 completely filled up the irregularities in the stacking direction of the slots of the iron core 4 and adhered well to the iron core 4. Further, the resin in the high thermal conductive semi-conductive prepreg sheet 6 hardly flowed out to the coil 5 and the ripple spring 7, and the coil 5 and the iron core 4 were substantially in contact with each other. Therefore, the ground insulating layer 8 was not newly peeled due to thermal stress or the like due to the difference in temperature between the time of operation and the time of rest. or,
When the rotor stator after being heated and deteriorated at 130 ° C for 20,000 hours is disassembled, the resin in the high thermal conductive semiconductive prepreg sheet 6 completely fills the irregularities of the core core 4 in the stacking direction of the core, as in the initial stage. It was well adhered to No. 4.

The present invention can be applied not only to the single prepreg system and the single injection system but also to the total impregnation system.

Example 51 Example of Application to Rotating Machine Stator FIG. 30 is an enlarged view of a cross section of the rotating machine stator. 31 is a cross-sectional view taken along the line AA ′ of FIG. First, an insulating treated 0.5 mm thick electromagnetic steel plate was punched out and stacked in layers to form an iron core 4 having slots. Then, a dry mica tape having a low resin content was wound around the conductor group laminated via the rare insulating layer 9 a predetermined number of times, and then the semiconductive tape was wound to manufacture a white coil having the semiconductive layer 12. . This white coil was housed in the slot of the iron core 4 as shown in FIG. 30 together with the high thermal conductive semi-conductive prepreg sheet 6 obtained in Examples 1 to 40, and after inserting the cuttings 11, the coils were electrically connected to each other. Connection was made.

Next, the rotary machine stator was manufactured by vacuum impregnation of the resin and heat curing. In the high thermal conductive semiconductive prepreg sheet 6, the high thermal conductive semiconductive semi-cured resin 2 side was always directed to the iron core 4 side, and the semiconductive sheet 1 side was directed to the coil 5. Further, a mold release agent is applied to the semiconductive sheet 1 side of the high thermal conductive semiconductive prepreg sheet 6 in advance, and when the thermal stress due to the difference in coefficient of thermal expansion becomes high, the high thermal conductive semiconductive prepreg sheet 6 is Peeling occurred between the semiconductive sheet 1 and the semiconductive layer 12 of the coil 5.

When the rotor of the rotating machine was disassembled, the resin in the high thermal conductive semiconductive prepreg sheet 6 completely filled up the irregularities of the slots of the core core 4 in the stacking direction and was well bonded to the core core 4. Further, even if the impregnated resin is impregnated and cured, the coil 5 and the iron core 4 are substantially in contact with each other by the release treatment. Therefore, the ground insulating layer 8 was not newly peeled due to thermal stress or the like due to the difference in temperature between the time of operation and the time of rest. Also, at 130 ℃ 2
When the rotor stator after heating and aging for 0,000 hours is disassembled, the resin in the high thermal conductive semi-conductive prepreg sheet 6 completely fills the irregularities in the lamination direction of the slots of the core core 4 and is good with the core core 4 as in the initial stage. It was glued.

As described above, the present application can be applied not only to the single prepreg system and the single injection system but also to the total impregnation system.

Example 52 Example of application to generator Combined with the rotating electric machine stator 16 obtained in Examples 44 to 50 and the rotating electric machine rotor 17, a machine size of 3.03 m ³
145MVA, 12kV, 50Hz, 2P, large capacity air-cooled turbine generator shown in FIG. 32 was manufactured. This turbine generator is a 145 MVA, 12 kV, 50 manufactured using the stator of the rotating electric machine obtained in the conventional comparative example.
Compared with the turbine generator of Hz, 2P, the heat dissipation from the coil is improved by 20% or more, the machine size is reduced by 34% or more, and the weight is reduced by 26% or more. As a result, less material is used, the cost is significantly reduced, and the installation area can be reduced.

Further, as shown in FIG. 33, a thermal power generation facility was manufactured by combining the turbine generator, the steam turbine and the boiler. Compared with conventional products, the equipment is smaller and less expensive.

Example 53 Application Example to Electric Motor The rotating electric machine stator 1 obtained in Example 50 or Example 51.
6 and a rotating electric machine rotor 17 were combined to produce a fully-closed induction motor of machine size 0.154 m ³ , 400 kW, 3 kV, 50 Hz, 4P. This electric motor was manufactured by using the stator of the rotating electric machine obtained in the conventional comparative example.
Compared to the 00kW, 3kV, 50Hz, 4P fully closed induction motor, the heat dissipation from the coil is improved by 20% or more, the machine size is reduced by 25% or more, and the weight is reduced by 23% or more. As a result, less material is used, the cost is significantly reduced, and the installation area can be reduced.

[0111]

The unevenness of the iron core slot in the stacking direction is filled with the high thermal conductive semiconductive filler in the high thermal conductive semiconductive prepreg sheet and firmly bonded to enhance the heat dissipation of the coil. it can. Therefore, even if a large amount of current is passed through the coil, the coil temperature can be maintained at the same temperature as in the conventional case and the capacity can be increased. If the capacity is the same, it is possible to reduce the size and weight and the cost.

Further, since the outermost semiconductive layer of the coil and the high thermal conductive semiconductive prepreg sheet are substantially in contact with each other, the thermal stress can be reduced and the iron core and the high thermal conductive semiconductive layer can be reduced. Since the current flowing through the filler (current due to the core back magnetic flux) is not interrupted by vibration or the like, the rotating machine has excellent slot discharge resistance and high reliability.

[Brief description of drawings]

FIG. 1 is a diagram showing a structure of a high thermal conductive semiconductive prepreg sheet of the present invention.

FIG. 2 is a diagram showing a structure of a high thermal conductive semiconductive prepreg sheet of the present invention.

FIG. 3 is a diagram showing a structure of a high thermal conductive semiconductive prepreg sheet according to claim 13 of the present invention.

FIG. 4 is a view showing a cross-sectional view of a rotating machine stator.

FIG. 5 is an enlarged view of a cross-sectional view of a rotating machine stator of the present invention.

FIG. 6 is an enlarged view of a cross-sectional view of a rotating machine stator of the present invention.

7 is a view showing a cross section taken along the line AA ′ in the cross-sectional view of the rotating machine stator of FIG.

FIG. 8 is an enlarged view of a cross-sectional view of a known rotating machine stator.

FIG. 9 is an enlarged view of a cross-sectional view of the known rotating machine stator of FIG. 8.

10 is a view showing a cross section taken along the line AA ′ in the cross-sectional view of the rotating machine stator of FIG.

FIG. 11 is an enlarged view of a cross-sectional view of a known rotating machine stator.

12 is a view showing a cross section taken along line AA ′ of the cross-sectional view of the rotating machine stator of FIG.

FIG. 13 is an enlarged view of a cross-sectional view of a known rotating machine stator.

14 is a view showing a cross section taken along line AA ′ of the cross-sectional view of the rotating machine stator of FIG.

FIG. 15 is a diagram illustrating an effect of high reliability of the present invention.

FIG. 16 is an enlarged view of a cross-sectional view of the rotating machine stator of the present invention.

FIG. 17 is a view showing a cross section taken along line AA ′ in the cross-sectional view of the rotating machine stator of FIG. 16;

FIG. 18 is an enlarged view of a cross-sectional view of the rotating machine stator of the present invention.

FIG. 19 is a view showing a cross section taken along line AA ′ in the cross-sectional view of the rotating machine stator of FIG. 18.

FIG. 20 is an enlarged view of a cross-sectional view of a rotating machine stator of the present invention.

21 is a view showing a cross section taken along line AA ′ of the cross-sectional view of the rotating machine stator of FIG. 20.

FIG. 22 is an enlarged view of a cross-sectional view of the rotating machine stator of the present invention.

23 is a view showing a cross section taken along the line AA ′ in the cross-sectional view of the rotating machine stator of FIG. 22.

FIG. 24 is an enlarged view of a cross-sectional view of the rotating machine stator of the present invention.

FIG. 25 is a view showing a cross section taken along line AA ′ of the cross-sectional view of the rotating machine stator of FIG. 24.

FIG. 26 is an enlarged view of a cross-sectional view of the rotating machine stator of the present invention.

27 is a view showing a cross section taken along line AA ′ in the cross-sectional view of the rotating machine stator of FIG. 27.

FIG. 28 is an enlarged view of a cross-sectional view of the rotating machine stator of the present invention manufactured by the full impregnation method.

29 is a view showing a cross section taken along line AA ′ in the cross-sectional view of the rotating machine stator of FIG. 28.

FIG. 30 is an enlarged view of a cross-sectional view of a rotating machine stator of the present invention manufactured by a full impregnation method.

31 is a view showing a cross section taken along line AA ′ in the cross-sectional view of the rotating machine stator of FIG. 30.

FIG. 32 is a diagram showing a turbine generator according to an embodiment of the present invention.

FIG. 33 is a diagram showing a thermal power generation facility using the rotating machine of the present invention.

FIG. 34 is a diagram showing an electric motor according to an embodiment of the present invention.

[Explanation of symbols]

DESCRIPTION OF SYMBOLS 1 ... Semiconductive sheet, 2 ... High heat conductive semiconductive semi-cured resin, 3 ... Corrugated sheet-containing semiconductive elastic sheet, 4 ... Core core, 5 ... Coil, 6 ... High heat conductive semiconductive prepreg sheet, 7 ... Ripple spring, 8 ... Ground insulation layer, 9 ...
Rare insulating layer, 10 ... Conductor, 11 ... Cutting, 12 ... Semi-conductive layer, 13 ... Elastic body containing semi-conducting corrugated sheet, 14 ... Semi-conducting elastic paint, 15 ... High thermal conductive semi-conducting corrugated sheet-containing prepreg sheet , 16 ... rotating electric machine stator, 17 ... rotating electric machine rotor,
18 ... High thermal conductive semi-conductive semi-cure sheet, 19 ... Impregnated resin.

─────────────────────────────────────────────────── ─── Continuation of the front page (51) Int.Cl. ⁶ Identification number Office reference number FI technical display location H01B 1/24 H01B 1/24 B // H02K 3/34 H02K 3/34 C 3/48 3 / 48 (72) Inventor Kunihiro Takayama 3-1-1 Sachimachi, Hitachi, Ibaraki Hitachi Ltd. Hitachi factory (72) Inventor Hiroyuki Kamiya 3-1-1, Sachimachi, Hitachi, Ibaraki Hitachi, Ltd.Hitachi factory

Claims (22)

[Claims] 1. A high thermal conductive semiconductive thermosetting resin composition having a surface resistance of 0.2 to 100 kΩ and a thermal conductivity of 0.4 to 5 W / m · K. 2. A thermosetting resin composition having a surface resistance of 0.2 to 100 kΩ and a thermal conductivity of 0.4 to 5 W / m · K on one side of a sheet having a surface resistance of 0.2 to 100 kΩ. Application,
Semi-cured high thermal conductive semi-conductive prepreg sheet. 3. A thermosetting resin composition having a surface resistance of 0.2 to 100 kΩ and a thermal conductivity of 0.4 to 5 W / m · K on one surface of a sheet having a surface resistance of 0.2 to 100 kΩ. Semi-cured high heat conductive semi-conductive prepreg sheet by pasting the applied sheets together. 4. A resin composition is applied to reduce its surface resistance to 0.
One side of the sheet adjusted to 2 to 20 kΩ has a surface resistance of 0.2 to 100 kΩ and a thermal conductivity of 0.4 to 5 W / m ·
The high thermal conductive semiconductive prepreg sheet according to claim 2, wherein the thermosetting resin composition of K is applied and semi-cured. 5. A thermoplastic resin composition having a surface resistance of 0.2 to 100 kΩ is applied to a sheet, and one surface thereof has a surface resistance of 0.2 to 100 kΩ and a thermal conductivity of 0.4 to 5 W / m.
The high thermal conductive semiconductive prepreg sheet according to claim 2, wherein the thermosetting resin composition of K is applied and semi-cured. 6. A thermosetting resin composition having a surface resistance of 0.2 to 100 kΩ is applied to a sheet and semi-cured, and then one surface thereof has a surface resistance of 0.2 to 100 kΩ and a thermal conductivity of 0.2.
The high thermal conductive semiconductive prepreg sheet according to claim 2, wherein a thermosetting resin composition of 4 to 5 W / m · K is applied and semi-cured. 7. The surface resistance of carbon filled is 0.2 to 1.
A glass nonwoven fabric, glass cloth, or polyamide paper is coated with a resin composition of 00 kΩ, and one surface of the resin composition is filled with carbon and an inorganic filler having a high thermal conductivity. The surface resistance is 0.2 to 100 kΩ, and the thermal conductivity is 0. .4-5 W / m
The high thermal conductive semiconductive prepreg sheet according to claim 2, wherein the thermosetting resin composition of K is applied and semi-cured. 8. A resin composition having a surface resistance of 0.2 to 100 kΩ, which is filled with carbon and a highly heat-conductive filler, is applied to a glass nonwoven fabric, glass cloth, or polyamide paper, and then carbon and heat conduction are applied to one side thereof. The surface resistance filled with a water-soluble inorganic filler is 0.2-100 kΩ, and the thermal conductivity is 0.2.
The high thermal conductive semiconductive prepreg sheet according to claim 2, wherein a thermosetting resin composition of 4 to 5 W / mK is applied and semi-cured. 9. A thermosetting resin composition having a surface resistance of 0.2 to 100 kΩ is applied to glass non-woven fabric, glass cloth, or polyamide paper and semi-cured, and then the surface resistance is 0.2 to 100 kΩ on one side. Thermal conductivity 0.4-5 W / m
The high thermal conductive semiconductive prepreg sheet according to claim 2, wherein the thermosetting resin composition of K is applied and semi-cured. 10. The surface resistance of carbon filled is 0.2 to 0.2.
A 100 kΩ thermoplastic resin composition is applied to a glass non-woven fabric, a glass cloth, or a polyamide paper, and then carbon and a highly heat-conductive inorganic filler are filled on one side thereof to have a surface resistance of 0.2 to 100 kΩ and a thermal conductivity. Is 0.4-5
The highly heat conductive semiconductive prepreg sheet according to claim 2, wherein a W / m · K 2 thermosetting resin composition is applied and semi-cured. 11. A carbon fiber-blended polyamide paper having a surface resistance of 0.2 to 100 kΩ and a surface resistance of 0.2 to 1 on one side.
The high thermal conductive semiconductive prepreg sheet according to claim 2, wherein a thermosetting resin composition having a thermal conductivity of 00 kΩ and a thermal conductivity of 0.4 to 5 W / m · K is applied and semi-cured. 12. A thermosetting rubber sheet having a thermal conductivity of 0.4 to 5 W / m · K and a surface resistance of 0.2 to 100 kΩ on one side and a thermal conductivity of 0.4 to 5 W / m · K. The high thermal conductive semiconductive prepreg sheet according to claim 2, wherein the resin composition is applied and semi-cured. 13. A surface resistance of 0.2 to 100 kΩ on one surface of a corrugated laminate embedded in an elastic body having a surface resistance of 0.2 to 100 kΩ and a thermal conductivity of 0.4 to 5 W / m · K. A high thermal conductive semiconductive prepreg sheet obtained by applying and semi-curing a thermosetting resin composition having a thermal conductivity of 0.4 to 5 W / mK. 14. A rotating machine stator comprising an iron core having a slot, a ground insulating layer formed by winding an insulating tape around a conductor in the iron core slot, and a coil having a semiconductive layer as an outermost layer. , The surface resistance of the gap between the coil and the iron core slot is 0.2 to 100 kΩ, and the thermal conductivity is 0.4.
A rotary electric machine characterized in that it is filled with a high thermal conductive semi-conductive filler of ˜5 W / m · K, and the high thermal conductive semi-conductive filler is adhered to the iron core slot and is in contact with the coil. 15. A rotating machine stator comprising an iron core having a slot and a ground insulating layer formed by winding an insulating tape around a conductor in the iron core slot, and incorporating a coil having a semiconductive layer as an outermost layer. , The surface resistance is 0.2-100 kΩ in the gap between the coil and the iron core slot, and the thermal conductivity is 0.4-5 W / on one side of the sheet.
A high-heat-conducting semiconductive prepreg sheet cured product by sandwiching the thermosetting resin side of a high-heat-conducting semiconductive prepreg sheet, which is obtained by applying and semi-curing a m · K thermosetting resin composition, and curing it. The iron core slot is adhered to and is in contact with the coil. 16. A rotating machine stator comprising an iron core having a slot, a ground insulating layer formed by winding an insulating tape around a conductor in the iron core slot, and a coil having a semiconductive layer as an outermost layer. , The surface resistance in the gap between the coil and the iron core slot is 0.2 to 100 kΩ, and the thermal conductivity is 0.4.
One side of a semi-conductive corrugated sheet laminate embedded in an elastic body of ~ 5 W / mK, surface resistance of 0.2-100 kΩ, and thermal conductivity of 0.4-5 W / mK thermosetting A rotating electric machine characterized in that a resin composition is applied and semi-cured, and a semi-conductive prepreg sheet with high thermal conductivity is sandwiched with the thermosetting resin side facing the slot side and cured. 17. A rotor stator having an iron core having a slot, a ground insulating layer formed by winding an insulating tape around a conductor in the iron core slot, and a coil having a semiconductive layer as an outermost layer. In a rotating machine consisting of a rotor, the surface resistance of the gap between the coil and the iron core slot is 0.2 to 100k.
Ω, and a high thermal conductive semiconductive filling material having a thermal conductivity of 0.4 to 5 W / m · K, the high thermal conductive semiconductive filling material and the iron core slot are adhered to each other, and the rotating machine is in contact with the coil. A rotating electric machine using a stator. 18. A rotor stator having an iron core having a slot, a ground insulating layer formed by winding an insulating tape around a conductor in the iron core slot, and a coil having a semiconductive layer as an outermost layer. In a rotating machine consisting of a rotor, the surface resistance is 0.2 to 100 kΩ in the gap between the coil and the iron core slot.
The heat resistance of semi-cured high-conductivity semi-conductive prepreg sheet is obtained by applying a thermosetting resin composition with a surface resistance of 0.2-100 kΩ and a thermal conductivity of 0.4-5 W / mK on one side of the sheet It is characterized in that a rotating machine stator is used in which the cured product of the high-thermal-conductivity semiconductive prepreg sheet and the iron core slot are adhered by sandwiching the resin with the resin side as the slot side and curing it, and in contact with the coil. Rotating electric machine. 19. A stator of a rotating machine, comprising an iron core having a slot, a ground insulating layer formed by winding an insulating tape around a conductor in the iron core slot, and a coil having a semiconductive layer as an outermost layer. In the manufacturing method, a sheet having a surface resistance of 0.2 to 100 kΩ in the gap between the coil and the iron core slot has a surface resistance of 0.2 to 100 kΩ and a thermal conductivity of 0.4 to 100 kΩ.
Manufacture of a rotating electric machine stator characterized in that a thermosetting resin composition of 5 W / m · K coated and semi-cured is sandwiched and cured with the thermosetting resin side being the slot side. Method. 20. A rotating machine stator comprising an iron core having a slot, and a ground insulating layer formed by winding an insulating tape around a conductor in the iron core slot, and incorporating a coil having a semiconductive layer as an outermost layer. In the manufacturing method, a sheet having a surface resistance of 0.2 to 100 kΩ in the gap between the coil and the iron core slot has a surface resistance of 0.2 to 100 kΩ and a thermal conductivity of 0.4 to 100 kΩ.
A mold release agent is applied to the anti-thermosetting resin side of a semi-cured high-heat-conducting semi-conductive prepreg sheet coated with a 5 W / mK thermosetting resin composition, and the thermosetting resin side of the prepreg sheet is slotted. A method for manufacturing a rotating electric machine stator, characterized by being sandwiched on the side and cured. 21. A coil in which a conductive mica tape having a small resin content is wound a predetermined number of times around a conductor group laminated via a rare insulating layer, and then a semiconductive tape is wound or a semiconductive paint is applied. In a manufacturing method of a rotor stator in which a coil is housed in a slot of an iron core, coils are electrically connected to each other, and then resin is vacuum-impregnated and heat-cured, the surface resistance of one side of the coil and the mold release treatment is Surface resistance of 0.2-100kΩ sheet is 0.2-1
A thermosetting resin composition having a thermal conductivity of 00 kΩ and a thermal conductivity of 0.4 to 5 W / m · K was applied, and the semi-cured high thermal conductive semi-conductive prepreg sheet was sandwiched with the semi-cured resin side as the slot side, and the coils were separated from each other. After making the electrical connection
The iron core slot and the thermosetting resin composition are firmly adhered to each other by vacuum impregnation and heat curing of the resin, and the semiconductive layer and the prepreg sheet are not substantially adhered to each other. Manufacturing method of electric stator. 22. A coil in which a dry mica tape having a low resin content is wound a predetermined number of times around a conductor group laminated with a rare insulating layer, and then a semiconductive tape is wound or a semiconductive paint is applied. In a method for manufacturing a rotating machine stator in which a semiconductive sheet is housed in a slot of an iron core, coils are electrically connected to each other, and then resin is vacuum-impregnated and cured by heating, one side of the semiconductive sheet is used. After the mold release treatment, the non-release treated surface is sandwiched with the slot side, the coils are electrically connected to each other, and the resin is vacuum-impregnated and heat-cured to form the iron core slot and the semiconductive A method of manufacturing a rotating electric machine stator, wherein the sheet is firmly adhered, and the coil and the semiconductive sheet are not substantially adhered.