CN1042071C

CN1042071C - Electrically insulated coil, electric rotating machine, and method of manufacturing the coil

Info

Publication number: CN1042071C
Application number: CN93104603A
Authority: CN
Inventors: 小山彻; 营野周; 本庄浩; 金城德幸; 狩野育志; 丸山正一
Original assignee: Hitachi Ltd
Current assignee: Hitachi Ltd
Priority date: 1989-08-18
Filing date: 1993-04-20
Publication date: 1999-02-10
Anticipated expiration: 2010-08-18
Also published as: CN1079332A; EP0413179A2; CN1079331A; AU5996190A; CN1029440C; JPH0817060B2; AU614695B2; CN1025524C; MX174538B; EP0413179A3; KR100197167B1; JPH0377203A; CN1064171A; US5075159A; KR910005333A

Abstract

An electrically insulated coil is manufactured with a composition comprising a poly-functional epoxy resin having at least three of p-(2,3-epoxy propoxy) phenyl groups and a bi-functional epoxy resin as a binding resin for a reinforced insulating base sheet and as an impregnation resin. No peeling off occurs with the insulating layers, and the coil is capable of being used continuously at a temperature of 200 DEG C or above.

Description

A kind of method of making electric insulation coil

The present invention relates to the heat-resisting electric insulation coil of high pressure, its insulating barrier is for to have the polyfunctional epoxy resin of three P-(2, the 3-glycidoxy) phenyl group at least in molecule, and the method for making this electric insulation coil.

Recently, the improvement of insulating treatment process is significant.Particularly, be applied in electric automobile with the method manufacturing of no-solvent type thermosetting resin dipping and industry in developed rapidly in the field of high voltage rotating machine under the such harsh conditions of DC motor.This improvement is because of electric reliability height, (2) good heat dissipation, (3) the high moisture resistivity gone up of the resin (1) that obtains with this method.Recently, in view of motor (as electric rotating machine) capacity increases, size and weight will reduce, and require a kind of insulation system that can make electric rotating machine long-term continuous operation under H level (180 ℃) or more high-grade condition of exploitation.The performance that the no-solvent type thermosetting resin composition that the dipping dynamoelectric coil is used requires is: (1) viscosity low (being less than 10 pools when dipping) is so that dipping easily, (2) do not produce volatile materials, thereby prevent from resin combination heating and hardening process, to cause pore, (3) electric good with mechanical property, (4) and insulating substrate compatibility height, (5) thermal endurance height, promptly the thermal stability of the resin of Gu Huaing short and long-time in be 180 ℃ or more than.

Usually, because the molecular structure of resin is a contradiction reducing its viscosity and improving on its thermal endurance, so determine that the molecular structure of resin is difficult.No-solvent type thermosetting resin composition for the dipping dynamoelectric coil is used adopts the composition epoxy resin that contains traditional bifunctional epoxy resin and acid anhydrides, usually as described in Japanese kokai publication sho 60--5210 (1985).Yet, impregnatedly can not be used under H level or the more high-grade condition with composition epoxy resin and with the dynamoelectric coil that the resin hot curing is made because F level condition (155 ℃ of temperature or more than) down operation one segment length after the time its machinery and electrical insulation capability begin to lose.

In general, the method as the heat resistance of improving the no-solvent type thermosetting resin composition imports different ring, and as maleimide, the method in molecular structure is widely used traditionally.Yet, there is not a kind of resin can satisfy the requirement of low viscosity and high-fire resistance simultaneously by going to make viscosity increased in the molecular structure that different ring is imported resin.With regard to this point, then attempt epoxy resin and maleimide are combined, still, produce other problem, as reduced thermal endurance, precipitation appears when storing, from resin combination, produce penetrating odor.

Recently, in molecule, have the polyfunctional epoxy resin of trifunctional and the composition of acid anhydrides at least, as Japanese Patent Publication 57-13571 (1982), clear 57-14763 (1982), clear 62-1648 (1987) and clear 62-44767 (1987), and Japanese kokai publication sho 61-252224 (1986), described in the peaceful 1-4615 of clear 64-4615 (1989) (1989).Because their low relatively price, higher thermal endurance after viscosity lower before the sclerosis and sclerosis causes people's interest always very much.Japanese kokai publication sho 59-120621 (1984) discloses the mica sheet that a kind of usefulness four sense epoxy resin preimpregnation are handled.The common coiled conductor of mica sheet, and make hardening of resin and form insulating barrier.

Mica is indispensable when manufacturing runs on the high-tension coil that resembles the high voltage rotating machine under the harsh conditions the DC motor of using in motor vehicle and the general industry, but mica this when coiled conductor, lack enough mechanical strengths.Therefore, mica must be strengthened with lining form, and as glass cloth, kapton etc. adhere to mica with binder resin with this film and get on.Up to now, what be used as binder resin is: to general service is the bifunctional epoxy resin, phenolic resin varnish type epoxy resin and polyorganosiloxane resin, yet, an electric insulation coil is to use the insulating substrate that is strengthened by binder resin to be wound on the conductor to obtain, and the substrate with this winding floods with compositions of thermosetting resin again, particularly floods with the polyfunctional epoxy resin composition, and with hardening of resin, there is following point in it; Cause insulating barrier to puncture such as thermal conductivity that has reduced insulating barrier owing to peeling off of insulating barrier and rapid rising of electric insulation coil temperature.

One of the object of the invention provides a kind of high-tension electricity insulated coil and a kind of electric rotating machine that operates in continuously under 200 ℃ or the above temperature conditions.

From the result of investigation insulation displacement reason, demonstrate that to peel off be to result from the bonding strength of binder resin to descend and produce gas in insulating barrier.Here it is why when sclerosis is used for the thermosetting resin of varnished insulation layer, and it is not gratifying resembling the bifunctional epoxy resin that general service uses or the thermal endurance of these binder resins of phenolic resin varnish type epoxy resin.Comprise with the occasion of silicone resin at insulating substrate, find to reduce, produce low-molecular-weight siloxane gas because of the mechanical strength of insulating barrier as binder resin.

Another object of the present invention provide a kind of high-tension electricity insulated coil and a kind of can be under 200 ℃ or above hot conditions operation continuously, and at dipping with the electric rotating machine that the substrate of insulating barrier can not be peeled off in will flooding with compositions of thermosetting resin (particularly polyfunctional epoxy resin mixture) thermmohardening process.

Comprise that following a kind of insulated coil has reached above-mentioned purpose of the present invention:

Many conductors build up multilayer, insulate with a layer insulation electrical between conductor is mutual;

Strengthen by binder resin, and around the above-mentioned conductor wound multi insulating substrate that builds up multilayer; And

The dipping thermosetting resin that has hardened, this resin is used to flood above-mentioned each insulating substrate layer;

Above-mentioned binder resin is a kind of composition, and being surrounded by weight is 100～50 parts polyfunctional epoxy resin that has at least three P--(2, the 3-glycidoxy) phenyl group in molecule and the bifunctional epoxy resin who mostly is 50 parts (weight) most; With

Above-mentioned dipping resin is a kind of mixture, and the bifunctional epoxy resin of containing 100～50 parts (weight) reaches the described polyfunctional epoxy resin of 50 parts (weight) at the most.

The invention enables might be with phenol resin, and particularly novolac resin joins in the binder resin, adds to flood as curing agent and acid anhydrides and uses in the resin as curing agent.Can such as quickening curing agent, be added to dipping to the various additives of knowing usually with going in the thermosetting resin.The present invention also proposes a kind of insulating trip that binder resin is arranged, particularly mica sheet, and the electric rotating machine that mica sheet is arranged.

Based on new discovery of the present invention, proposed a kind ofly to can be used for various electric rotating machines, but only used a kind of insulated coil manufacture method of lacquer, however different to the heat-resisting requirement of the coil of above-mentioned various motors.This method has been simplified the management of dipping work in the factory significantly.Therefore, can obtain to make insulated coil aspect benefit economically.The present invention use the bifunctional epoxy resin at the most the polyfunctional epoxy resin of 50 parts (weight) and 100～50 parts (weight) as binder resin.Polyfunctional epoxy resin can be used alone as binder resin.Insulating barrier with the heat-resisting of requirement and viscosity performance can be used by the bifunctional epoxy resin's of the polyfunctional epoxy resin of 80-55 part (weight) and 20～45 parts (weight) mixture and make binder resin.On the other hand, make the dipping resin, use the mixture that mostly is 50 parts of (weight) polyfunctional epoxy resins and 100～50 parts of (weight) bifunctional epoxy resins most.Although the bifunctional epoxy resin can use separately, but has lower viscosity by the impregnation result that the polyfunctional epoxy resin of 50～45 parts (weight) and 80-55 part (weight) bifunctional epoxy resin's mixture produces, make dipping work easily and its hardenite have desired heat resistance, electrical property and mechanical performance.

Fig. 1 uses electric insulation coil phantom of the present invention.

Fig. 2 represents to use the characteristic curve of electric insulation coil current displacement angle tangent of the present invention (tan δ) to temperature relation.

Fig. 3 represents to use the heat-resisting life characteristic of electric insulation coil of the present invention.

Fig. 4 represents to use the curve of its thermal life of electric insulation coil of the present invention to temperature relation.

The insulating trip of coiled conductor includes at least three P-(2 in molecule, the 3-glycidoxy) polyfunctional epoxy resin of phenyl group is as binder resin, use a kind of compositions of thermosetting resin, particularly use polyfunctional epoxy resin composition or thermoset polyimide resin or their mixture, come varnished insulation substrate and heating, make hardening of resin and the high-tension electricity insulated coil can not caused between insulating barrier and peel off, this is because not decay of binder resin, do not reduce bonding strength yet, such coil be can be under 200 ℃ or above hot conditions continuously operation. Moreover, be used as the insulating barrier that the occasion of heat of immersion thermosetting resin obtains at polyfunctional epoxy resin, comprised the much more polyfunctional epoxy resin composition of hardenite of being made by the polyfunctional epoxy resin composition than separately, this is because at least 3 P--(2 are arranged in the polyfunctional epoxy resin molecule in binder resin, the 3-glycidoxy) phenyl group and the combination of polyfunctional epoxy resin composition, this shows that increase is heat-resisting. The special example of the insulating substrate that uses in embodiments of the present invention is mica sheet, polyimide piece. The special example of mica is unfired soft mica, baked soft mica, and unfired hard mica, baked hard mica, combined mica, and teritary amide (alamide) mixes mica. The megohmite insulant of being used as the enhancing mica need not be fastidious, as long as this material can strengthen mica. The special example of this material is glass fibre, teritary amide, teritary amide mixed paper, polyamide--imines, polyester, poly ether imide, polyether-ketone, polyether sulfone, polyethylene film, poly-parabanic acid, and Kapton. In these materials, glass fibre and Kapton see it is the most desirable from heat-resisting viewpoint. Be used in by mica and enhancing substance and have at least three P--(2 in the molecule, the 3-glycidoxy) polyfunctional epoxy resin of phenyl group, or with polyfunctional epoxy resin and bifunctional epoxy resin's mixture, perhaps with so that the composition that comprises curing agent be glued together as binder resin and make mica tape, can sheet, band shape and other shapes of selecting use. All these all are referred to as " insulating substrate " or " mica sheet ", if do not quote as proof specially, are exactly by this explanation.

In the present invention, term " has at least three P-(2,3-glycidoxy) phenyl group " in the molecule the meaning refers to any compound, as long as this compound has at least three P-(2 in molecule, the 3-glycidoxy) phenyl group there is no other special restriction. The special example of this compound is the phenolic resin varnish type epoxy resin of bisphenol-A, the phenolic resin varnish type epoxy resin of bisphenol-A D, and the polyfunctional epoxy resin of lower any one molecular formula of example is arranged:

(wherein, R is alkylene group, or the aralkyl group) for example,

1,1,3-three (P-(2,3-glycidoxy) phenyl) butane,

1,1,2,2-four (P-(2,3-glycidoxy) phenyl) ethane,

Three (P-(2,3-glycidoxy) phenyl) methane,1,1,3,3-four (P-(2,3-glycidoxy) phenyl) propane,

1,3,3-three (P-(2,3-glycidoxy) phenyl) propane,

Wherein, with heat-resisting viewpoint, three (P-(2,3-glycidoxy) phenyl) methane and 1,1,3-three (P-(2,3-glycidoxy) phenyl) butane are preferred. Also have, general purpose bifunctional epoxy resin is added in molecule, has at least three P-(2, the 3-glycidoxy) it is the most desirable going as binder resin in the polyfunctional epoxy resin of phenyl group, if this is in order to make manufacturing work easier, give insulating substrate with flexibility etc. Bifunctional epoxy resin's special example is, for example, and the diglycidyl ether of bisphenol-A, the diglycidyl ether of Bisphenol F, the diglycidyl ether of bisphenol-A D adds the diglycidyl ether of the hydrogen of bisphenol-A, 2, the diglycidyl ether of 2-(4-hydroxy phenyl) nonadecane, two (2, the 3-glycidyl) diphenyl ether of 4,4-, 3,4-epoxycyclohexyl methyl (3,4-epoxy) cyclohexane carboxylate, 4-(1, the 2-glycidyl)-1, the 2-7-oxa-bicyclo[4.1.0,2-(3,4-epoxy)-cyclohexyl-5,5-spiral (3, the 4-epoxy)-and cyclohexane-m-dioxane, 3,4-epoxy-6-methyl-cyclohexyl ylmethyl-4-epoxy-6-hexahydrotoluene carboxylate, simultaneously, as long as they are bifunctional epoxy resins but hard-core. Wherein with heat-resisting viewpoint opinion, the diglycidyl ether of the diglycidyl ether of bisphenol-A and bisphenol-A D is the most desirable. Mixing ratio polyfunctional epoxy resin and bifunctional epoxy resin is without particular limitation, and is best, and the bifunctional epoxy resin of 50 parts (weight) can mix with the polyfunctional epoxy resin of 100 parts (weight) at the most. More preferably, the bifunctional epoxy resin of the polyfunctional epoxy resin mixing 20-45 part (weight) of per 100 parts (weight) makes and may obtain soft and don't reduce stable on heating insulating trip. Insulating substrate is tending towards hardening because adding more polyfunctional epoxy resin. On the contrary, be tending towards relatively poor heat resistance because adding more bifunctional epoxy resins. In the too hard situation of insulating substrate, it can be softened before making with solvent.

Curing agent, hardening catalyst, hardening accelerator can be added in the binder resin of megohmite insulant, and its purpose is in the heat resistance of improving compositions of thermosetting resin. Curing agent is being to be not limited to them in the traditional curing agent scope to polyfunctional epoxy resin. From the storage life viewpoint, phenol resin is preferred as curing agent. For phenol resin, have no particular limits with regard to this scope of the hydroxyl groups that comprises at least two phenol in the molecule with regard to it. The special example of phenol resin is the phenates varnish of bisphenol-A, the novolaks of Bisphenol F, the novolaks of bisphenol-A D, to polyvinylphenol, the bakelite type, phenol, and they or use separately or with their mixture.

Hardening catalyst and hardening accelerator are that effectively this scope is without any restriction with regard to it to the reaction of accelerating polyfunctional epoxy resin and curing agent. The special example of hardening catalyst and promoter is tertiary amine, as; Trimethylamine, triethylamine, tetramethyl butane diamine, triethylenediamine; Amine is such as DMAE, dimethylamino amylalcohol, three (dimethylamino methyl) phenol, N-methylmorpholine; With, quaternary ammonium salt is such as softex kw, hexadecyltrimethylammonium chloride, cetyl trimethyl ammonium iodide, DTAB, dodecyl trimethyl ammonium iodide, benzyl dimethyl tetradecane ammonium bromide, aromatic radical dodecane trimethylammonium bromide, benzyl dimethyl octadecane ammonium bromide, the octadecane trimethyl ammonium chloride, benzyl dimethyl tetradecane acetylation ammonium; Imidazoles is such as glyoxal ethyline, 2-ethyl imidazol(e), 2-hendecane imidazoles; 2-heptadecane imidazoles, 2-methyl-4-ethyl imidazol(e), 1-butyl imidazole; 1-propyl group-glyoxal ethyline, 1 benzyl 2 methyl imidazole, 1-cyanoethyl-2-phenylimidazole; 1-cyanoethyl-2-phenylimidazole, 1-cyanoethyl-2-phenylimidazole, 1-cyanoethyl-2-phenylimidazole; 1-cyanoethyl-2-hendecane imidazoles, 1-azine-glyoxal ethyline, 1-amino-2-hendecane imidazoles; with the slaine of the amine of zinc octoate, cobalt, amino tetraphenyl borate as: 1; 8-diazo bicyclic-(5,4,0) endecatylene-7; N methyl piperazine, tetramethyl butyl guanidine, triethyl ammonium tetraphenyl borate salts; 2-ethyl-4-methyl tetraphenyl borate; 1,8-diazo bicyclic (5,4; 0)-endecatylene-7-tetraphenyl borate; and triphenyl phasphine, triphenyl phasphine tetraphenyl borate, acetoacetate aluminium; trigalloyl acetoacetate aluminium; aluminum alcoholate, acidylate aluminium, alcoholization sodium. Hardening catalyst is added in the binder resin by 0.01-5% (weight) usually.

Although the deal of binder resin does not have special restriction in megohmite insulant, this deal is 3-40% (weight) preferably, and preferable to be based on anhydrous insulating substrate gross weight be 5-30% (weight). Heat resistance reduces because sheet material is impregnated with less thermosetting resin amount because of the deal increase of binder resin. On the contrary, reduce the binder resin deal and reduced bonding strength and caused peeling off of insulating substrate, this is so that be difficult to the insulating substrate coiled conductor.

The compositions of thermosetting resin of the present invention that comprises the epoxy resin with at least three functional groups of the bifunctional epoxy resin of 100-50 part (weight) and 50 parts (weight) has low viscosity, processing ease, the ability of infiltrating coil is arranged, H level or more high-grade heat resistance are arranged after sclerosis. Although the mixing ratio to polyfunctional epoxy resin and bifunctional epoxy resin has no particular limits, preferably, at the most by 50 parts (weight), more preferably can mix polyfunctional epoxy resin with 100 parts (weight) by the bifunctional epoxy resin of 45-20 parts (weight). The resin embrittlement that the growth of polyfunctional epoxy resin deal is tending towards being increased in the viscosity of the former composition of sclerosis and makes sclerosis. On the contrary, the increase of bifunctional epoxy resin's deal reduces the viscosity of composition, but reduces the heat resistance of the resin of sclerosis.

By from (a) two (4-hydroxyphenyl) methane, (b) two (4-hydroxyphenyl) ethane, (c) two (4-hydroxyphenyl) propane, (d) three (4-hydroxyphenyl) alkane, (e) selecting the polyfunctional epoxy resin that obtains at least two polyhydric phenols and the chloropropylene oxide hybrid reaction in four alkane is effectively, because composition has low viscosity with the performance that is easy to control and the resin after hardening demonstrates high-fire resistance. The special example of three (4-hydroxyphenyl) alkane is three (4-hydroxyphenyl) methane, three (4-hydroxyphenyl) ethane, three (4-hydroxyphenyl) propane, three (4-hydroxyphenyl) butane, three (4-hydroxyphenyl) hexane, three (4-hydroxyphenyl) heptane, three (4-hydroxyphenyl) octane, three (4-hydroxyphenyl) nonane. The derivative of three (4-hydroxyphenyl) alkane also is effective such as three (4-hydroxyphenyl) methane. The special example of four (4-hydroxyphenyl) alkane is four (4-hydroxyphenyl) methane, four (4-hydroxyphenyl) ethane, four (4-hydroxyphenyl) butane, four (4-hydroxyphenyl) hexane, four (4-hydroxyphenyl) heptane, four (4-hydroxyphenyl) octane, four (4-hydroxyphenyl) nonane. The derivative of four (4-hydroxyphenyl) alkane also is effective such as four (4-hydroxyl 3,5-dimethylphenyl) methane. At least it is desirable selecting one in three (4-hydroxyphenyl) alkane or four (4-hydroxyphenyl) alkane in the two class polyhydroxy phenols that use in the present invention.

The acid anhydrides of using in the present invention has no particular limits, as long as it is identified acid anhydrides. The special example of acid anhydrides has methyl hexahydro phthalic anhydride, hexahydro phthalic anhydride, methyltetrahydro phthalic anhydride, tetrahydrophthalic anhydride, the nadic acid anhydrides, methyl nadic acid anhydrides, dodecane succinyl oxide, succinyl oxide, the octadecane succinyl oxide, maleic anhydride, the benzophenone tetracarboxylic anhydride, they can be used alone or as a mixture. Wherein, comprise the nadic acid anhydrides, the material of methyl nadic acid anhydrides says the most desirable from heat-resisting viewpoint.

Used acid anhydrides hardening epoxy resin is used as thermosetting resin to be used for dipping in the present invention, do not comprise in the occasion of any curing agent with the polyfunctional epoxy resin composition as binder resin, resulting insulating barrier has comprised many P-(2, the 3-glycidoxy) phenyl group composition, and equivalent balanced between acid anhydrides and epoxy radicals becomes and can change, the result, trend towards occuring the sheet material heat resistance and reduce, therefore a large amount of acid anhydrides is had to add in the acid anhydrides of hardening epoxy resin and is gone with in the equivalent balanced 0.9-1.1 of the being in scope between the acid anhydrides in the final adjustment insulating barrier and the epoxy radicals.

A large amount of acid anhydrides that add impel the viscosity that reduces compositions of thermosetting resin, and this is favourable to the easiness aspect of improving production work. Have, in this case, have full-bodied a large amount of P--(2,3-glycidoxy) phenyl group can be imported into compositions of thermosetting resin, the heat resistance of sheet material just can advantageously be modified.

When the binder resin of polyfunctional epoxy resin composition comprises curing agent, the insulating barrier that obtains contains many P-(2,3-glycidoxy) phenyl group composition, and the heat resistance of insulating barrier is improved also better than the hardenite of thermosetting resin composition itself.

If it is necessary with the compositions of thermosetting resin hardening process to be used for dipping of the present invention, hardening catalyst can add in compositions of thermosetting resin or the insulating substrate.

To hardening catalyst, if it quicken between polyfunctional epoxy resin and curing agent anti-Ying And without limits.The special example of catalyst has tertiary amine as Trimethylamine, triethylamine, tetramethyl butane diamine, triethyl group ethylene diamine; Amine is as dimethyl-amido ethanol, dimethyl amido amylalcohol, three (dimethylaminomethyl) phenol, N-methylmorpholine; With quaternary ammonium salt as hexadecane trimethyl ammonium bromide, the dodecane trimethylammonium bromide, the dodecane trimethyl ammonium chloride, benzyl tetradecane ammonium chloride, benzyl dimethyl tetradecane ammonium bromide, pi-allyl dodecane trimethylammonium bromide, benzyl dimethyl octadecane ammonium bromide, the octadecane trimethyl ammonium chloride, benzyl dimethyl tetradecane acetylation ammonium; Imidazoles is as glyoxal ethyline, the 2-ethyl imidazol(e), 2-hendecane imidazoles, 2-heptadecane imidazoles, 2-methyl-4-ethyl imidazol(e), the 1-butyl imidazole, 1-propyl group-glyoxal ethyline, 1-benzyl-glyoxal ethyline, 1-cyanoethyl-2-phenylimidazole, the 1-1-cyanoethyl-2-methylimidazole, 1-cyanoethyl-2-hendecane imidazoles, 1-azine-glyoxal ethyline, 1-azine-2-hendecane imidazoles, the slaine of the amine of band zinc octoate and cobalt, 1,8-phenodiazine-dicyclo-(5,4,4)-and endecatylene-7, N methyl piperazine, tetramethyl butyl-guanidine; Amino tetraphenyl borate salts is as triethylamine tetraphenyl borate salts, 2-ethyl-4-methyl tetraphenyl borate salts, 1,8-phenodiazine-dicyclo-(5; 4,0)-and endecatylene-7-tetraphenyl borate salts, triphenylphosphine, triphenylphosphine tetraphenyl borate salts; aluminum alcoholate, acidylate aluminium, alcoholization sodium.Above said hardening catalyst adds compositions of thermosetting resin by 0.01～5% (weight) usually.Hardening catalyst can directly add compositions of thermosetting resin or add in the insulating substrate before dipping.

Further, if needed, monocycle epoxy resins such as cyclohexane vinyl monoxide, the octene oxide, butyl glycidyl base diethyl ether, styrene oxide, phenyl glycidyl base diethyl ether, glycidyl methacrylate, allyl glycidyl diethyl ether can be used as diluent and add.Yet the adding of diluent although it is favourable to reducing viscosity, also should be restricted to lesser amt because it causes stable on heating reduction.

As filler, except silicon dioxide powder, silica flour and calcined bauxite in powder, hydrated alumina, hydrous magnesium, calcium carbonate, zirconium silicate, calcium silicates, talcum, potter's clay, mica and glass fiber powder can be used.

The present invention can be used for making the insulated coil of various electric rotating machines.For example, motor is a DC motor, induction motor, and alternating current generator, synchronous motor etc., the present invention can be used to make their stator coil, armature coil, pole coil etc.

Usually, electric rotating machine manufactory produces several electric rotating machines, the thermal endurance class difference that they require.For example, C level motor is the highest thermal endurance class, operate under 200 ℃ or the above temperature conditions, the H level be 180 ℃ or more than, the F level be 150 ℃ or more than.

Before the present invention, the binder resin of an insulated coil, insulating substrate and dipping have considered that with the best fit of resin its thermal endurance class selects for use.Therefore, need preserve multiple coating, a plurality of storage containers, and operate by their characteristic.And press the present invention, even be used in the C level when insulating barrier floods materials, possessing desired stable on heating insulated coil can be by selecting binder resin, and the curing condition of insulating substrate and binder resin obtains.Therefore, can simplify the management of materials and reduce producing cost only with a kind of dipping materials now.

The present invention will describe in detail with the following example, but be not limited to the following example.Used epoxy resin in following narration, the abbreviated form of curing agent and hardening catalyst is: (1) YL-931 (Yuka Shell Epoxy Ltd. makes, trade name):

1,2,2-four (P-(2, the 3-glycidoxy) phenyl) ethane.Epoxide equivalent 192.(2) YL--932 (Yuka Shell Epoxy Ltd. makes, trade name):

1,1,3-three (P--(2, the 3-glycidoxy) phenyl) methane.Epoxide equivalent 162.(3) YL-933 (Yuka Shell Epoxy Ltd. makes, trade name):

1,1,3-three (P--(2, the 3-glycidoxy) phenyl) butane.Epoxide equivalent 196.(4) DER-7342 (Dow Chemical Co. makes, trade name):

Three (P-(2, the 3-glycidoxy) phenyl) methane.Epoxide equivalent 162.(5) 157S65 (Yuka Shell Epoxy Ltd. makes, and trade name claims):

The phenolic resin varnish type epoxy resin of bisphenol-A.Epoxide equivalent 198.(6) DER-332 (Dow Chemical Co. makes, trade name):

The diglycidyl ether of bisphenol-A.Epoxide equivalent 175.(7) CEL-2021 (Daicel Ltd. makes, trade name):

3,4-epoxy cyclohexyl methyl (3, the 4-epoxy) cyclohexane-carboxylic acid salt.Epoxide equivalent 138.(8) E-807 (Yuka Shell Epoxy Ltd. makes, trade name):

The diglycidyl ether of Bisphenol F.Epoxide equivalent 170.(9) MHAC-P (Hitachi Kasei Ltd. makes, trade name):

Methyl nadic (methylnadic) acid anhydrides, anhydride equivalent 187.(10) HN-5500 (Hitachi Kasei Ltd. makes, trade name):

Methyl hexahydro phthalic anhydride.Anhydride equivalent 168.(11) HN-2200 (Hitachi Kasei Ltd. makes, trade name):

The methyltetrahydro phthalic anhydride.Anhydride equivalent 166.(12) BTPP-K (Hokko Kagaku Ltd. makes, trade name): triphenyl butyl phosphine tetraphenyl borate.(13) PX-48T (Nihon Kagakn Kogyo Ltd. makes, trade name): (14) 2E4MZ (Sikoku Kasei Ltd. makes, trade name):

2-ethyl-4-methylimidazole.(15) 2E4MZ-K (Hokko Kagaku Ltd. makes, trade name):

The 2-ethyl-4-methylimidazole tetraphenyl borate.(16) TPP (Hokko Kagaku Ltd. makes, trade name):

Triphenyl phasphine.(17) TPP-K (Hokko Kagaku Ltd. makes, trade name):

The triphenyl phasphine tetraphenyl borate.(18) IOZ (Hitachi Kasei Ltd. makes, trade name):

The salt of 2-ethyl-4-methylimidazole and zinc octoate.(19) CllZ-AZINE (Shikoku Kasei Ltd. makes, trade name):

1-azine-2-hendecane imidazoles.(20) TEA-K (Hokko Kagaku Ltd. makes, trade name):

The triethylamine tetraphenyl borate.(21) 2E4MZ-CN (Shikoku Kasei Ltd. makes, trade name):

1-cyanoethyl-2-ethyl-4-methylimidazole.(22) PN: phenol novolaks.Hydroxyl equivalent 85.(23) PSF (Gunei Kagaku Ltd. makes, trade name):

The phenol novolaks.Hydroxyl equivalent 106.(24) resin M (Maruzen Sikuyu Ltd. makes, trade name):

Poly-P-vinylphenol.Hydroxyl equivalent 120.(25) VH4150 (Dainihon Ink Ltd. makes, trade name:

The novolaks of bisphenol-A.Hydroxyl equivalent 118.(26) CN (Mitzubishi Yuka Ltd. manufacturing):

The cresols novolaks.Hydroxyl equivalent 120.(27) RN (Hitachi Kasei Ltd. manufacturing):

Phenol-formaldehyde A type phenol.Hydroxyl equivalent 107.(28) BMI:4,4 '-the two maleimides of diphenyl-methane.(29) DAPPI (Mitsui Toatsu Ltd. makes, trade name):

2,2 '-two (4-(4-maleimide phenoxy group) phenyl) propane.(30) DABF (Osaka Soda Ltd manufacturing):

The diallyl Bisphenol F.(31) TAIC (Nihon Kasei Ltd. manufacturing):

Triallyl isocyanates (Triallyl isocyanulate).The manufacturing of example 1 (1) insulating substrate.

A kind of binder resin solution for preparing with YL-933 is as polyfunctional epoxy resin, comprise at least three P-(2, the 3-glycidoxy) phenyl group and as the methyl ethyl ketone of solvent, thus whole not concentration of volatile substances in the solution are adjusted to 50 percent.Make it to combine with binder resin solution without flexible micanite sheet burnt in a heap and glass cloth, and solvent is volatilized falls.Make three kinds and strengthen the mica tapes of intensity, respectively comprise percent 5, the not volatile binder resin (based on the total weight of insulating substrate) of 20 and 30 (weight) with glass fibre (insulating substrate).By cutting these insulating substrates, obtain the wide band of 25mm.(2) manufacturing of compositions of thermosetting resin.

A reaction vessel is equipped with a thermometer, a blender, a titration funnel and a device that is used for condensation by the water of reaction generation, this container pack into 105 the gram three (4-hydroxyphenyl) methane, two (4-hydroxyphenyl) propane of 105 grams and the 3-chloro-1 of 925 grams, (table chlorine alkane) ， And splashed into 175 grams, 8% (weight) in 2 hours sodium hydrate aqueous solution ， And heat and stir the 2-expoxy propane simultaneously.Water and 3-chloro-1,2 epoxy prapane distill from reactant in course of reaction.Make that the concentration of water remains on 5 percent (weight) or lower in reactant mixture and have only 3-chloro-1,2 epoxy prapane to be sent back to reaction vessel ， And.

Finish add sodium hydrate aqueous solution after, by reactant being carried out 15 minutes continuous heating, water spins off fully, then unreacted 3-chloro-1,2 epoxy prapane is distilled out.

By adding the toluene of about 55 grams, make reactor product dissolved, to make it easily from salt, to analyse the unprocessed product of face; And separates out unprocessed product by filtering from salt, under by vacuum, be heated to 170 ℃ at 2mmHg, make after toluene is distilled out fully, obtained to have the light yellow epoxy resin of epoxide equivalent 171.By with 100 parts of (weight) epoxy resin, the anhydride hardener MHABC-P of 104.1 parts (weight) and the hardening catalyst 2E4MZ-CN of 1.021 parts (weight) mix and obtain compositions of thermosetting resin.(3) manufacturing of electric insulation coil

After insulating substrate is wound on a bundle insulated electric conductor, method by vacuum and pressurization is flooded this bundle conductor with compositions of thermosetting resin, then handled this bundle conductor was heated 10 hours in 100 ℃, heating is 3 hours in 150 ℃, heating is 10 hours in 230 ℃, makes this hardening of resin.In the layer of the electric insulation coil that obtains, do not observe and peel off.Humidity test and heat resistant test are finished with following method.

The part of used in test electric insulation coil shows with perspective in Fig. 1.Dipping and sclerosis by compositions of thermosetting resin make a bundle conductor 1 that is twined by insulating substrate 2 by cast solid.(a) heat resistant test:

Carry out 10 tests, at every turn all relative humidity 95% time by warming and humidifying in 270 ℃ 24 hours and in 40 ℃ warming and humidifying constituted ， And test current displacement angle tangent (tan δ) value and insulation resistance in each test in 24 hours.Its result is represented by table 1.(b) heat resistant test in short-term

Downcut the insulating barrier test piece that is of a size of 50mm * 50mm from electric insulation coil and be used to 10 days test of heating 270 ℃.After heat radiation, survey this test piece weight.It the results are shown in the table 1.(e) humidity test:

Downcut an insulating barrier test piece from the winding direction of electric insulation coil upper edge insulating tape, this specimen size is that 10mm is wide, and 60mm is long.By clamping 2 points of the 40mm of being separated by on the sample, And sample immerse in 40 ℃ the water before 24 hours and afterwards therebetween part add weight, the bending strength of sample when measuring 25 ℃.Example 2-6

Except using mica burnt in a heap, comprise the aromatic polyamide hybrid that piles up mica, hard mica not burnt in a heap or the synthetic mica of not roasting to replace outside the soft mica not burnt in a heap, use the method identical to make insulating substrate and electric insulation coil with example 1.And use the method identical to carry out heat resistant test, heat resistant test and humidity test in short-term with example 1.Example 7-25

Except using one of the following to replace comprising outside the YL-933 of at least three P-(2,3 glycidoxy) phenyl group as binder resin, use the method identical to make insulating substrate and electric insulation coil with example 1.They are: TL-932; YL-931; PER-7342; 157S65; The epoxy resin of the reactor product that produces by three (4-hydroxy phenyl) methane, two (4-hydroxy phenyl) propane and 3-chloro-1,2 epoxy prapane; The mixture of YL-933 and DER-332 is (with the blending ratio of five kinds of different weight: 5,2,1,0.7,0.5); Each adds by

weight

5,2,1,0.5 YL-933,0.1,0.01 2E4MZ-K; YL-933 adds 0.1% TPP-K by weight; YL-933 adds 0.1% IOZ by weight; YL-933 adds 0.1% PX-48T by weight; Add 0.1% COOZ-AZINE by weight with YL-933.

And and use the method identical to carry out heat resistant test, heat resistant test and humidity test in short-term with example 1.Example 26-30

Except using polyimide film, poly ether imide film, poly (ether ether ketone) film, poly-parabanic acid film, the alamid mixed paper replaces outside the glass cloth, uses the method identical with example 1 to carry out heat resistant test, heat resistant test and humidity test in short-term.Comparative Examples 1-5

One in using DER-332, E-807, DEN-438, CBEL-2021 and silicone resin replaces YL-933 to do the binder resin, uses method manufacturing insulating substrate and the electric insulation coil identical with example 1.And and use the method identical to carry out heat resistant test, heat resistant test and humidity test in short-term with example 1.Example 31-49

Except using the described compositions of thermosetting resin of table 7-10, use the method identical to make insulating substrate and electric insulation coil with example 1.Carry out heat resistant test, heat resistant test and humidity test in short-term with the method identical with example 1.Example 50

Except 5% C11Z-AZINE is by weight added binder resin and do not use the hardening catalyst in compositions of thermosetting resin, use the method identical to prepare insulating substrate and electric insulation coil with example 1.And and use the method identical to carry out heat resistant test, heat resistant test and humidity test in short-term with example 1.Example 51

Except by in the methanol solution that it is immersed C11Z-AZINE to come varnished insulation Ji Pian And air-dry and hardening catalyst is not added the compositions of thermosetting resin with centesimal C11Z-AZINE by weight, use the method identical to prepare insulating substrate and electric insulation coil with example 1.Carry out heat resistant test, heat resistant test and humidity test in short-term with the method identical with example 1.Example 52-60

Except phenol resin and the described hardening catalyst of table 11-12 are added binder resin as the curing agent, use the method identical to make insulating substrate and electric insulation coil with example 1.Carry out heat resistant test, heat resistant test and humidity test in short-term with the method identical with example 1.Example 61-63

Except the described hardening catalyst of phenol resin and table 13 is added the binder resin, use the method identical to make insulating substrate and electric insulation coil with example 1.Carry out heat resistant test, heat resistant test and humidity test in short-term with the method identical with example 1.Comparative Examples 6-7

Except replacing YL-933 as the binder resin, use the method identical to make insulating substrate and electric insulation coil with example 61 and 63 with DEN-438.Carry out heat resistant test with the method identical, heat resistant test and humidity test in short-term with example 61 and 63.

Table 1-14 illustrates experimental condition and the result described in routine 1-63 and the Comparative Examples 1-7.Example 64

Only make the insulated coil of F level, H level and C level with a kind of lacquer by changing the binder resin curing condition.

The temperature dependency of the current displacement angle tangent (tan δ) of the electric insulation coil that obtains in example 1 is represented the figure of tan δ (%, ordinate) with temperature (℃, abscissa) in Fig. 2.In Fig. 2, the insulation characterisitic curve of sample when line A is beginning, line B are the insulation characterisitic curves of heating sample after 1000 hours in 250 ℃.Also have, in Fig. 3, the heat-resisting life-span of the electric insulation coil that is obtained by the present invention is with the diagrammatic representation of temperature (℃, abscissa) to the heat-resisting life-span (hour, ordinate).As shown in Figure 3, the electric insulation coil by gained of the present invention has good thermal endurance ， And to find can be used for 200 ℃ and above temperature in heat-resisting life test (by by the motorlet experimental test of Unite States Standard IEEE No 275 for the basis).Example 65-68

Except binder resin and curing condition are become table 15 described, make electric insulation coil by the method identical with a kind of impregnating varnish with example 52.Fig. 4 represents to test the temperature dependency in the heat-resisting life-span of testing the gained coil by the motorlet based on Unite States Standard IEEE No 275.In Fig. 4, line A, B, C, D represent the result of the test of example 64,65,66 and 67 respectively.Fig. 4 expresses that the electric insulation coil of one of (as: F level, H level, C level) can only prepare with a kind of impregnating varnish by selecting to have the binder resin more high-grade than F level, insulating substrate and curing condition, make to have three thermal endurance classs.Exactly: even only use a kind of impregnating varnish, coil with low thermal endurance class can be by selecting cheap binder resin, cheap insulating substrate and economic curing condition prepare, on the other hand, having binder resin that the coil of higher thermal endurance class can be by selecting higher level and high-quality insulating substrate and high temperature and long-term curing condition prepares.

By the present invention, the electric insulation coil of various thermal endurance classs can only be used a kind of impregnating equipment.Thereby, there is no need Guan Li And corresponding for the thermal endurance class that obtains with various expections and that prepare multiple impregnating varnish ， And and might in manufactory, simplify impregnating varnish and reduce production costs greatly.

Table 1

				Embodiment
				Embodiment			1	2	3	4	5
				Insulating substrate		Binder resin mica reinforcement material hardening catalyst	1	2	3	4	5	YL-933 soft glass bonded mica cloth not burnt in a heap-	YL-933 contain the aramd glass cloth of mica burnt in a heap-	YL-933 footpath soft glass bonded mica cloth burnt in a heap-	YL-933 through soft glass bonded mica cloth burnt in a heap-	YL-933 without soft glass bonded mica cloth burnt in a heap-
Compositions of thermosetting resin		Epoxy resin acid anhydrides hardening catalyst		Insulating substrate		Binder resin mica reinforcement material hardening catalyst	Reactor product MHACP 2E4MZ-CN	Reactor product MMACP 2E4NZ-CN	Reactor product MHACP 2E4MZ-CN	Reactor product MHACP 2E4MZ-CN	Reactor product MHACP 2E4MZ-CN	YL-933 soft glass bonded mica cloth not burnt in a heap-
Compositions of thermosetting resin		Epoxy resin acid anhydrides hardening catalyst		C H A R	Just peel off		Reactor product MHACP 2E4MZ-CN	Reactor product MMACP 2E4NZ-CN	Reactor product MHACP 2E4MZ-CN	Reactor product MHACP 2E4MZ-CN	Reactor product MHACP 2E4MZ-CN	Do not have	Do not have	Do not have	Do not have	Do not have
HR	5 times 10 times first	tanδ(％) Meg(MΩ) tanδ(％) Meg(MΩ) tanδ(％) Meg(MΩ)	2.5 ∞ 5.6 ∞ 9.2 ∞		Just peel off		2.7 ∞ 5.7 ∞ 9.6 ∞	2.5 ∞ 5.6 ∞ 9.3 ∞	2.4 ∞ 5.5 ∞ 9.2 ∞	2.4 ∞ 5.5 ∞ 9.2 ∞		Do not have	Do not have	Do not have	Do not have	Do not have
HR	5 times 10 times first	tanδ(％) Meg(MΩ) tanδ(％) Meg(MΩ) tanδ(％) Meg(MΩ)	2.5 ∞ 5.6 ∞ 9.2 ∞		Rate of weight loss (weight %) after 270 ℃/10 days		2.7 ∞ 5.7 ∞ 9.6 ∞	2.5 ∞ 5.6 ∞ 9.3 ∞	2.4 ∞ 5.5 ∞ 9.2 ∞	2.4 ∞ 5.5 ∞ 9.2 ∞	5.2	5.8	5.3	5.2	5.2
MR	Bending strength conservation rate (%) after 40 ℃/24 hours		97		Rate of weight loss (weight %) after 270 ℃/10 days		96	97	96	96	5.2	5.8	5.3	5.2	5.2

CHAR ... characteristic, HR ... heat-resisting, MR ... moisture-proof

Table 2

				Embodiment
				Embodiment				6	7	8	9	10
				Insulating substrate		Bonding chair fat mica reinforcement material hardening catalyst	The unfired synthetic mica glass cloth of YL-933-	6	7	8	9	10	YL-932 without soft glass bonded mica cloth burnt in a heap-	YL-931 without soft glass bonded mica cloth burnt in a heap-	DER-7342 without soft glass bonded mica cloth burnt in a heap-	157S65 without soft glass bonded mica cloth burnt in a heap-
Compositions of thermosetting resin			Epoxy resin acid anhydrides hardening catalyst	Insulating substrate			The unfired synthetic mica glass cloth of YL-933-	Reactor product MHACP 2E4MZ-CN	Reactor product MHACP 2E4MZ-CN	Reactor product MHACP 2E4MZ-CN	Reactor product MHACP 2E4MZ-CN	Reactor product MHACP 2E4MZ-CN
Compositions of thermosetting resin			Epoxy resin acid anhydrides hardening catalyst	C H A R	Just peel off		Do not have	Reactor product MHACP 2E4MZ-CN	Reactor product MHACP 2E4MZ-CN	Reactor product MHACP 2E4MZ-CN	Reactor product MHACP 2E4MZ-CN	Reactor product MHACP 2E4MZ-CN	Do not have	Do not have	Do not have	Do not have
	5 times 10 times first	tanδ(％) Meg(MΩ) tanδ(％) Meg(MΩ) tanδ(％) Meg(MΩ)	2.5 ∞ 5.8 ∞ 9.9 ∞		Just peel off		Do not have	2.8 ∞ 5.9 ∞ 9.7 ∞	2.8 ∞ 5.9 ∞ 9.9 ∞	1.9 ∞ 5.7 ∞ 9.8 ∞	2.6 ∞ 7.6 ∞ 10.3 ∞		Do not have	Do not have	Do not have	Do not have
	5 times 10 times first	tanδ(％) Meg(MΩ) tanδ(％) Meg(MΩ) tanδ(％) Meg(MΩ)	2.5 ∞ 5.8 ∞ 9.9 ∞		Rate of weight loss (weight %) after 270 ℃/10 days		5.2	2.8 ∞ 5.9 ∞ 9.7 ∞	2.8 ∞ 5.9 ∞ 9.9 ∞	1.9 ∞ 5.7 ∞ 9.8 ∞	2.6 ∞ 7.6 ∞ 10.3 ∞	5.3	5.3	5.4	5.7
	Bending strength conservation rate (%) after 40 ℃/24 hours		95		Rate of weight loss (weight %) after 270 ℃/10 days		5.2	94	97	97	92	5.3	5.3	5.4	5.7

CHAR ... characteristic HR ... heat-resisting MR ... moisture-proof

Table 3

				Embodiment
				Embodiment				11	12	13	14	15
				Insulating substrate		Binder resin mica reinforcement material hardening catalyst	Reactor product without soft glass bonded mica cloth burnt in a heap-	11	12	13	14	15	YL-932:5, DER-332:1 without soft glass bonded mica cloth burnt in a heap-	YL-931:2, DER-332:1 without soft glass bonded mica cloth burnt in a heap-	XL-933:0.7 DER-332:1 without soft glass bonded mica cloth burnt in a heap-	YL-933:0.5 YL-933:1 is without soft glass bonded mica cloth burnt in a heap
Compositions of thermosetting resin			Epoxy resin acid anhydrides hardening catalyst	Insulating substrate		Binder resin mica reinforcement material hardening catalyst		Reactor product MHACP 2E4MZ-CN	Reactor product MHACP 2E4MZ=CN	Reactor product MHACP 2E4MZ-CN	Reactor product MHACP 2E4MZ-CN	Reactor product MHACP 2E4MZ-CN
Compositions of thermosetting resin			Epoxy resin acid anhydrides hardening catalyst	C H A R	Just peel off		Do not have	Reactor product MHACP 2E4MZ-CN	Reactor product MHACP 2E4MZ=CN	Reactor product MHACP 2E4MZ-CN	Reactor product MHACP 2E4MZ-CN	Reactor product MHACP 2E4MZ-CN	Do not have	Do not have	Do not have	Do not have
	5 times 10 times first	tanδ(％) Meg(MΩ) tanδ(％) Meg(MΩ) tanδ(％) Meg(MΩ)	2.5 ∞ 5.7 ∞ 9.2 ∞		Just peel off		Do not have	2.9 ∞ 5.9 ∞ 10.3 ∞	2.9 ∞ 6.0 ∞ 11.2 ∞	2.9 ∞ 6.5 ∞ 12.4 ∞	2.9 ∞ 10.5 ∞ 15.9 1000		Do not have	Do not have	Do not have	Do not have
	5 times 10 times first	tanδ(％) Meg(MΩ) tanδ(％) Meg(MΩ) tanδ(％) Meg(MΩ)	2.5 ∞ 5.7 ∞ 9.2 ∞		Rate of weight loss (weight %) after 270 ℃/10 days		5.4	2.9 ∞ 5.9 ∞ 10.3 ∞	2.9 ∞ 6.0 ∞ 11.2 ∞	2.9 ∞ 6.5 ∞ 12.4 ∞	2.9 ∞ 10.5 ∞ 15.9 1000	5.8	6.2	6.2	8.2
	Bending strength conservation rate (%) after 40 ℃/24 hours		98		Rate of weight loss (weight %) after 270 ℃/10 days		5.4	93	89	87	68	5.8	6.2	6.2	8.2

CHAR ... characteristic HR ... heat-resisting MR ... moisture-proof

Table 4

				Embodiment
				Embodiment				16	17	18	19	20
				Insulating substrate		Binder resin mica reinforcement material hardening catalyst	YL-933 is without soft glass bonded mica cloth 2EA4MZ-CN burnt in a heap	16	17	18	19	20	YL-933 is without soft glass bonded mica cloth 2EA4MZ-K:2 burnt in a heap	YL-933 is without soft glass bonded mica cloth 2EA4MZ-K:1 burnt in a heap	YL-933 is without soft glass bonded mica cloth 2EA4MZ-K:0.5 burnt in a heap	YL-933 is without soft glass bonded mica cloth 2EA4MZ-K:0.1 burnt in a heap
Compositions of thermosetting resin			Epoxy resin acid anhydrides hardening catalyst	Insulating substrate		Binder resin mica reinforcement material hardening catalyst		Reactor product MHACP-	Reactor product MHACP-	Reactor product MHACP-	Reactor product MHACP-	Reactor product MHACP-
Compositions of thermosetting resin			Epoxy resin acid anhydrides hardening catalyst	C H A R	Just peel off		Do not have	Reactor product MHACP-	Reactor product MHACP-	Reactor product MHACP-	Reactor product MHACP-	Reactor product MHACP-	Do not have	Do not have	Do not have	Do not have
	5 times 10 times first	tanδ(％) Meg(MΩ) tanδ(％) Meg(MΩ) tanδ(％) Meg(MΩ)	2.5 ∞ 5.6 ∞ 9.2 ∞		Just peel off		Do not have	2.5 ∞ 5.6 ∞ 9.2 ∞	2.5 ∞ 5.6 ∞ 9.2 ∞	2.5 ∞ 5.6 ∞ 9.2 ∞	2.5 ∞ 5.6 ∞ 9.2 ∞		Do not have	Do not have	Do not have	Do not have
	5 times 10 times first	tanδ(％) Meg(MΩ) tanδ(％) Meg(MΩ) tanδ(％) Meg(MΩ)	2.5 ∞ 5.6 ∞ 9.2 ∞		Rate of weight loss (weight %) after 270 ℃/10 days		5.2	2.5 ∞ 5.6 ∞ 9.2 ∞	2.5 ∞ 5.6 ∞ 9.2 ∞	2.5 ∞ 5.6 ∞ 9.2 ∞	2.5 ∞ 5.6 ∞ 9.2 ∞	5.2	5.2	5.2	5.2
	Bending strength conservation rate (%) after 40 ℃/24 hours		97		Rate of weight loss (weight %) after 270 ℃/10 days		5.2	97	97	97	97	5.2	5.2	5.2	5.2

CHAR ... characteristic HR ... heat-resisting MR ... moisture-proof

Table 5

				Embodiment
				Embodiment				21	22	23	24	25
				Insulating substrate		Binder resin mica reinforcement material hardening catalyst	YL-933 is without soft glass bonded mica cloth 2EA4ME-K:0.01 burnt in a heap	21	22	23	24	25	YL-933 is without soft glass bonded mica cloth TPPK:0.1 burnt in a heap	YL-933 is without soft glass bonded mica cloth IOE:0.1 burnt in a heap	YL-933 is without soft glass bonded mica cloth PX-48T:0.1 burnt in a heap	YL-933 is without soft glass bonded mica cloth Cll2-AZINE burnt in a heap
Compositions of thermosetting resin			Epoxy resin acid anhydrides hardening catalyst	Insulating substrate		Binder resin mica reinforcement material hardening catalyst		Reactor product MHACP-	Reactor product MHACP-	Reactor product MHACP-	Reactor product MHACP-	Reactor product MHACP-
Compositions of thermosetting resin			Epoxy resin acid anhydrides hardening catalyst	C H A R	Just peel off		Do not have	Reactor product MHACP-	Reactor product MHACP-	Reactor product MHACP-	Reactor product MHACP-	Reactor product MHACP-	Do not have	Do not have	Do not have	Do not have
HR	5 times 10 times first	tanδ(％) Meg(MΩ) tanδ(％) Meg(MΩ) tan δ(％) Meg(MΩ)	2.5 ∞ 5.6 ∞ 9.2 ∞		Just peel off		Do not have	2.5 ∞ 5.6 ∞ 9.2 ∞	2.9 ∞ 5.8 ∞ 9.9 ∞	2.5 ∞ 5.6 ∞ 9.2 ∞	2.5 ∞ 5.6 ∞ 9.2 ∞		Do not have	Do not have	Do not have	Do not have
HR	5 times 10 times first	tanδ(％) Meg(MΩ) tanδ(％) Meg(MΩ) tan δ(％) Meg(MΩ)	2.5 ∞ 5.6 ∞ 9.2 ∞		Rate of weight loss (weight %) after 270 ℃/10 days		5.2	2.5 ∞ 5.6 ∞ 9.2 ∞	2.9 ∞ 5.8 ∞ 9.9 ∞	2.5 ∞ 5.6 ∞ 9.2 ∞	2.5 ∞ 5.6 ∞ 9.2 ∞	5.2	7.9	5.2	5.2
	Bending strength conservation rate (%) after 40 ℃/24 hours		97		Rate of weight loss (weight %) after 270 ℃/10 days		5.2	97	87	97	97	5.2	7.9	5.2	5.2

CHAR ... characteristic HR ... heat-resisting MR ... moisture-proof

Table 6

				Embodiment
				Embodiment				26	27	28	29	30
				Insulating substrate		Binder resin mica reinforcement material hardening catalyst	YL-933 without soft mica polyimide film burnt in a heap-	26	27	28	29	30	YL-933 without soft mica poly ether imide film burnt in a heap-	YL-933 without soft mica poly (ether ether ketone) film burnt in a heap-	YL-933 without the poly-parabanic acid film of soft mica burnt in a heap-	YL-933 without soft mica aramid mixed paper burnt in a heap-
Compositions of thermosetting resin			Epoxy resin acid anhydrides hardening catalyst	Insulating substrate		Binder resin mica reinforcement material hardening catalyst	YL-933 without soft mica polyimide film burnt in a heap-	Reactor product MHACP 2E4ME-CN	Reactor product MHACP 2E4ME-CN	Reactor product MHACP 2E4ME-CN	Reactor product MHACP 2E4ME-CN	Reactor product MHACP 2E4ME-CN
Compositions of thermosetting resin			Epoxy resin acid anhydrides hardening catalyst	C H A R	Just peel off		Do not have	Reactor product MHACP 2E4ME-CN	Reactor product MHACP 2E4ME-CN	Reactor product MHACP 2E4ME-CN	Reactor product MHACP 2E4ME-CN	Reactor product MHACP 2E4ME-CN	Do not have	Do not have	Do not have	Do not have
	5 times 10 times first	tanδ(％) Meg(MΩ) tanδ(％) Meg(MΩ) tanδ(％) Meg(MΩ)	2.0 ∞ 3.5 ∞ 8.2 ∞		Just peel off		Do not have	2.0 ∞ 3.6 ∞ 8.2 ∞	2.0 ∞ 5.9 ∞ 10.6 ∞	2.0 ∞ 6.5 ∞ 12.8 ∞	2.0 ∞ 7.6 ∞ 11.5 ∞		Do not have	Do not have	Do not have	Do not have
	5 times 10 times first	tanδ(％) Meg(MΩ) tanδ(％) Meg(MΩ) tanδ(％) Meg(MΩ)	2.0 ∞ 3.5 ∞ 8.2 ∞		Rate of weight loss (weight %) after 270 ℃/10 days		5.2	2.0 ∞ 3.6 ∞ 8.2 ∞	2.0 ∞ 5.9 ∞ 10.6 ∞	2.0 ∞ 6.5 ∞ 12.8 ∞	2.0 ∞ 7.6 ∞ 11.5 ∞	5.4	5.8	6.2	6.9
	Bending strength conservation rate (%) after 40 ℃/24 hours		97		Rate of weight loss (weight %) after 270 ℃/10 days		5.2	95	90	85	90	5.4	5.8	6.2	6.9

CHAR ... characteristic HR ... heat-resisting MR ... moisture-proof

Table 7

				Embodiment
				Embodiment			31	32	33	34	35
				Insulating substrate		Binder resin mica reinforcement material hardening catalyst	31	32	33	34	35	YL-933 without soft glass bonded mica cloth burnt in a heap-	YL-933 without soft glass bonded mica cloth burnt in a heap-	YL-933 without soft glass bonded mica cloth burnt in a heap-	YL-933 without soft glass bonded mica cloth burnt in a heap-	YL-933 without soft glass bonded mica cloth burnt in a heap-
Thermosetting resin mixture		Epoxy resin acid anhydrides hardening catalyst		Insulating substrate		Binder resin mica reinforcement material hardening catalyst	YL-933：5，DER-332：1 MHACP 2E4ME-CN	YL-933：3，DER-332：1 MHACP 2E4MZ-CN	YL-933：1，DER-332：1 MHACP 2E4MZ-CN	YL-933：0.5，DER332：1 MHACP 2E4MZ-CN	YL-933：0.3，DER-332：1 MHACP 2E4MZ-CN
Thermosetting resin mixture		Epoxy resin acid anhydrides hardening catalyst		C H A R	Just peel off		YL-933：5，DER-332：1 MHACP 2E4ME-CN	YL-933：3，DER-332：1 MHACP 2E4MZ-CN	YL-933：1，DER-332：1 MHACP 2E4MZ-CN	YL-933：0.5，DER332：1 MHACP 2E4MZ-CN	YL-933：0.3，DER-332：1 MHACP 2E4MZ-CN	Do not have	Do not have	Do not have	Do not have	Do not have
HR	5 times 10 times first	tanδ(％) Meg(MΩ) tanδ(％) Meg(MΩ) tanδ(％) Meg(MΩ)	2.7 ∞ 5.8 ∞ 10.2 ∞		Just peel off		2.5 ∞ 5.4 ∞ 9.2 ∞	2.5 ∞ 5.5 ∞ 9.7 ∞	2.5 ∞ 6.0 ∞ 10.5 ∞	2.5 ∞ 7.2 ∞ 11.6 ∞		Do not have	Do not have	Do not have	Do not have	Do not have
HR	5 times 10 times first	tanδ(％) Meg(MΩ) tanδ(％) Meg(MΩ) tanδ(％) Meg(MΩ)	2.7 ∞ 5.8 ∞ 10.2 ∞		Rate of weight loss (weight %) after 270 ℃/10 days		2.5 ∞ 5.4 ∞ 9.2 ∞	2.5 ∞ 5.5 ∞ 9.7 ∞	2.5 ∞ 6.0 ∞ 10.5 ∞	2.5 ∞ 7.2 ∞ 11.6 ∞	4.9	4.9	5.8	6.8	7.5
	Bending strength conservation rate (%) after 40 ℃/24 hours		97		Rate of weight loss (weight %) after 270 ℃/10 days		96	92	85	78	4.9	4.9	5.8	6.8	7.5

CHAR ... characteristic HR ... heat-resisting MR ... moisture-proof

Table 8

				Embodiment
				Embodiment			36	37	38	39	40
				Insulating substrate		Binder resin mica reinforcement material hardening catalyst	36	37	38	39	40	YL-933 without soft glass bonded mica cloth burnt in a heap-	YL-933 without soft glass bonded mica cloth burnt in a heap-	YL-933 without soft glass bonded mica cloth burnt in a heap-	YL-933 without soft glass bonded mica cloth burnt in a heap-	YL-933 without soft glass bonded mica cloth burnt in a heap-
Compositions of thermosetting resin		Epoxy resin acid anhydrides hardening catalyst		Insulating substrate		Binder resin mica reinforcement material hardening catalyst	YL-933：0.2，DER-332 ：1 MHACP 2E4MZ-CN	YL-933：0.1，DER-332 ：1 MHACP 2E4MZ-CN	YL-933：1，DER-332：1 MHACP 2E4MZ-CN	DER7342：1，DER-332：1 MHACP 2E4MZ-CN	BPAN：1，DER-332：1 MHACP 2E4MZ-CN
Compositions of thermosetting resin		Epoxy resin acid anhydrides hardening catalyst		R R H A	Just peel off		YL-933：0.2，DER-332 ：1 MHACP 2E4MZ-CN	YL-933：0.1，DER-332 ：1 MHACP 2E4MZ-CN	YL-933：1，DER-332：1 MHACP 2E4MZ-CN	DER7342：1，DER-332：1 MHACP 2E4MZ-CN	BPAN：1，DER-332：1 MHACP 2E4MZ-CN	Do not have	Do not have	Do not have	Do not have	Do not have
	5 times 10 times first	tanδ(％) Meg(MΩ) tanδ(％) Meg(MΩ) tanδ(％) Meg(MΩ)	2.5 ∞ 7.9 ∞ 12.6 ∞		Just peel off		2.5 ∞ 8.2 ∞ 15.0 ∞	2.5 ∞ 5.5 ∞ 9.7 ∞	2.5 ∞ 5.5 ∞ 9.7 ∞	2.5 ∞ 5.8 ∞ 10.5 ∞		Do not have	Do not have	Do not have	Do not have	Do not have
	5 times 10 times first	tanδ(％) Meg(MΩ) tanδ(％) Meg(MΩ) tanδ(％) Meg(MΩ)	2.5 ∞ 7.9 ∞ 12.6 ∞		Rate of weight loss (weight) after 270 ℃/10 days		2.5 ∞ 8.2 ∞ 15.0 ∞	2.5 ∞ 5.5 ∞ 9.7 ∞	2.5 ∞ 5.5 ∞ 9.7 ∞	2.5 ∞ 5.8 ∞ 10.5 ∞	7.8	8.5	5.8	5.9	6.5
	Bending strength conservation rate (%) after 40 ℃/24 hours		75		Rate of weight loss (weight) after 270 ℃/10 days		70	92	90	88	7.8	8.5	5.8	5.9	6.5

CHAR ... characteristic HR ... heat-resisting MR ... moisture-proof

Table 9

				Embodiment
				Embodiment			41	42	43	44	45
				Insulating substrate		Binder resin mica reinforcement material hardening catalyst	41	42	43	44	45	YL-933 without soft glass bonded mica cloth burnt in a heap-	YL-933 without soft glass bonded mica cloth burnt in a heap-	YL-933 without soft glass bonded mica cloth burnt in a heap-	YL-933 without soft glass bonded mica cloth burnt in a heap-	YL-933 without soft glass bonded mica cloth burnt in a heap-
Compositions of thermosetting resin		Epoxy resin acid anhydrides hardening catalyst		Insulating substrate		Binder resin mica reinforcement material hardening catalyst	YL-931：1，DER-332：1 MHACP 2E4MZ-CN	YL-933 MHACP 2E4MZ-CN	YL-932 MHACP 2E4MZ-CN	YL-933：1，DER-332：1 MHACP 2E4MZ-CN	YL-933：1，DER-332：1 MHACP 2E4MZ-CN
Compositions of thermosetting resin		Epoxy resin acid anhydrides hardening catalyst		C H A R	Just peel off		YL-931：1，DER-332：1 MHACP 2E4MZ-CN	YL-933 MHACP 2E4MZ-CN	YL-932 MHACP 2E4MZ-CN	YL-933：1，DER-332：1 MHACP 2E4MZ-CN	YL-933：1，DER-332：1 MHACP 2E4MZ-CN	Do not have	Do not have	Do not have	Do not have	Do not have
	5 times 10 times first	tanδ(％) Meg(MΩ) tanδ(％) Meg(MΩ) tanδ(％) Meg(MΩ)	2.5 ∞ 5.8 ∞ 9.9 ∞		Just peel off		2.5 ∞ 5.4 ∞ 9.2 ∞	2.5 ∞ 5.3 ∞ 9.0 ∞	2.5 ∞ 5.5 ∞ 9.7 ∞	2.5 ∞ 5.5 ∞ 9.7 ∞		Do not have	Do not have	Do not have	Do not have	Do not have
	5 times 10 times first	tanδ(％) Meg(MΩ) tanδ(％) Meg(MΩ) tanδ(％) Meg(MΩ)	2.5 ∞ 5.8 ∞ 9.9 ∞		Rate of weight loss (weight %) after 270 ℃/10 days		2.5 ∞ 5.4 ∞ 9.2 ∞	2.5 ∞ 5.3 ∞ 9.0 ∞	2.5 ∞ 5.5 ∞ 9.7 ∞	2.5 ∞ 5.5 ∞ 9.7 ∞	6.0	5.2	4.9	5.2	5.2
	Bending strength conservation rate (%) after 40 ℃/24 hours		92		Rate of weight loss (weight %) after 270 ℃/10 days		95	97	95	95	6.0	5.2	4.9	5.2	5.2

CHAR ... characteristic HR ... heat-resisting MR ... moisture-proof

Table 10

				Embodiment
				Embodiment			46	47	48	49	50
				Insulating substrate		Binder resin mica reinforcement material hardening catalyst	46	47	48	49	50	YL-933 without soft glass bonded mica cloth burnt in a heap-	YL-933 without soft glass bonded mica cloth burnt in a heap-	YL-933 without soft glass bonded mica cloth burnt in a heap-	YL-933 without soft glass bonded mica cloth burnt in a heap-	YL-933 without soft glass bonded mica cloth burnt in a heap-
Compositions of thermosetting resin		Epoxy resin acid anhydrides hardening catalyst		Insulating substrate		Binder resin mica reinforcement material hardening catalyst	YL-933：5，DER-332：1 MHACP TPP	YL-931：1，DER-332：1 EN-5500 IOZ	YL-933：1，DER-332：1 EN-2200 2E4MZ-K	YL-933：1，DER-332：1 MEACP TEA-K	YL-933：1，DER-332：1 MHACP -
Compositions of thermosetting resin		Epoxy resin acid anhydrides hardening catalyst		C H A R	Just peel off		YL-933：5，DER-332：1 MHACP TPP	YL-931：1，DER-332：1 EN-5500 IOZ	YL-933：1，DER-332：1 EN-2200 2E4MZ-K	YL-933：1，DER-332：1 MEACP TEA-K	YL-933：1，DER-332：1 MHACP -	Do not have	Do not have	Do not have	Do not have	Do not have
HR	5 times 10 times first	tanδ(％) Meg(MΩ) tanδ(％) Meg(MΩ) tanδ(％) Meg(MΩ)	2.5 ∞ 5.8 ∞ 9.9 ∞		Just peel off		2.5 ∞ 6.5 ∞ 12.3 1000	2.5 ∞ 7.2 ∞ 15.3 800	2.5 ∞ 5.8 ∞ 9.9 ∞	2.5 ∞ 5.8 ∞ 9.9 ∞		Do not have	Do not have	Do not have	Do not have	Do not have
HR	5 times 10 times first	tanδ(％) Meg(MΩ) tanδ(％) Meg(MΩ) tanδ(％) Meg(MΩ)	2.5 ∞ 5.8 ∞ 9.9 ∞		Rate of weight loss (weight %) after 270 ℃/10 days		2.5 ∞ 6.5 ∞ 12.3 1000	2.5 ∞ 7.2 ∞ 15.3 800	2.5 ∞ 5.8 ∞ 9.9 ∞	2.5 ∞ 5.8 ∞ 9.9 ∞	6.0	7.5	8.5	5.9	5.9
	Bending strength conservation rate (%) after 40 ℃/24 hours		92		Rate of weight loss (weight %) after 270 ℃/10 days		92	90	95	95	6.0	7.5	8.5	5.9	5.9

CHAR ... characteristic HR ... heat-resisting MR ... moisture-proof

Table 11

				Embodiment
				Embodiment			51	52	53	54	55
				Insulating substrate		Binder resin mica reinforcement material hardening catalyst	51	52	53	54	55	YL-933:100 is without soft glass bonded mica cloth CllZ-AZINE 0.1 weight % burnt in a heap	YL-933:100, PSF:54.0 is without soft glass bonded mica cloth TEA-K:0.1 weight % burnt in a heap	YL-933:100, M:61.2 is through hard glass bonded mica cloth TEA-K:0.1 weight % burnt in a heap	YL-933:100, VH4150:60.2 is through hard glass bonded mica cloth TEA-K:0.1 weight % burnt in a heap	YL-933:100, CN:61.2 is without hard glass bonded mica cloth TEA-K:0.1 weight % burnt in a heap
Compositions of thermosetting resin		Epoxy resin acid anhydrides hardening catalyst		Insulating substrate		Binder resin mica reinforcement material hardening catalyst	Reactor product MHACP 2E4MZ-CN	Reactor product MHACP 2E4MZ-CN	Reactor product MHACP 2E4MZ-CN	Reactor product MHACP 2E4MZ-CN	Reactor product MHACP 2E4MZ-CN
Compositions of thermosetting resin		Epoxy resin acid anhydrides hardening catalyst		C H A R	Just peel off		Reactor product MHACP 2E4MZ-CN	Reactor product MHACP 2E4MZ-CN	Reactor product MHACP 2E4MZ-CN	Reactor product MHACP 2E4MZ-CN	Reactor product MHACP 2E4MZ-CN	Do not have	Do not have	Do not have	Do not have	Do not have
HR	5 times 10 times first	tanδ(％) Meg(MΩ) tanδ(％) Meg(MΩ) tanδ(％) Meg(MΩ)	1.0 ∞ 1.6 ∞ 3-2 ∞		Just peel off		1.2 ∞ 1.7 ∞ 3.3 ∞	1.0 ∞ 1.6 ∞ 3.3 ∞	1.4 ∞ 1.5 ∞ 5.2 ∞	2.4 ∞ 3.5 ∞ 6.2 ∞		Do not have	Do not have	Do not have	Do not have	Do not have
HR	5 times 10 times first	tanδ(％) Meg(MΩ) tanδ(％) Meg(MΩ) tanδ(％) Meg(MΩ)	1.0 ∞ 1.6 ∞ 3-2 ∞		Rate of weight loss (weight %) after 270 ℃/10 days		1.2 ∞ 1.7 ∞ 3.3 ∞	1.0 ∞ 1.6 ∞ 3.3 ∞	1.4 ∞ 1.5 ∞ 5.2 ∞	2.4 ∞ 3.5 ∞ 6.2 ∞	4.2	4.3	3.3	4.2	4.5
	Bending strength conservation rate (%) after 40 ℃/24 hours		97		Rate of weight loss (weight %) after 270 ℃/10 days		96	98	96	96	4.2	4.3	3.3	4.2	4.5

CHAR ... characteristic HR ... heat-resisting MR ... moisture-proof

Table 12

				Embodiment
				Embodiment			56	57	58	59	60
				Insulating substrate		Binder resin mica reinforcement material hardening catalyst	56	57	58	59	60	YL-933:100, RN:54.6 is without soft glass bonded mica cloth TEA-K:0.1 weight % burnt in a heap	YL-933:100, PN:43.4 is without soft glass bonded mica cloth TEA-K:0.1 weight % burnt in a heap	YL-933:100, PN:43.4 is through hard glass bonded mica cloth TEA-K:0.1 weight % burnt in a heap	YL-933:100, PN:43.4 is through hard glass bonded mica cloth TEA-K:0.5 weight % burnt in a heap	YL-933:100, PN:43.4 is through hard glass bonded mica cloth TEA-K:0.5 weight % burnt in a heap
Compositions of thermosetting resin		Epoxy resin acid anhydrides hardening catalyst		Insulating substrate		Binder resin mica reinforcement material hardening catalyst	Reactor product MHACP 2E4MZ-CN	Reactor product MHACP-	Reactor product MHACP-	VL933：1，DER-332：1 MHACP -	YL-932：1，DER-332：1 MHACP -
Compositions of thermosetting resin		Epoxy resin acid anhydrides hardening catalyst		C H R A	Just peel off		Reactor product MHACP 2E4MZ-CN	Reactor product MHACP-	Reactor product MHACP-	VL933：1，DER-332：1 MHACP -	YL-932：1，DER-332：1 MHACP -	Do not have	Do not have	Do not have	Do not have	Do not have
	5 times 10 times first	tanδ(％) Meg(MΩ) tanδ(％) Meg(MΩ) tanδ(％) Meg(MΩ)	1.0 ∞ 1.6 ∞ 3.2 ∞		Just peel off		1.2 ∞ 1.7 ∞ 3.3 ∞	1.0 ∞ 1.6 ∞ 3.3 ∞	1.4 ∞ 1.5 ∞ 5.2 ∞	2.4 ∞ 3.5 ∞ 6.2 ∞		Do not have	Do not have	Do not have	Do not have	Do not have
	5 times 10 times first	tanδ(％) Meg(MΩ) tanδ(％) Meg(MΩ) tanδ(％) Meg(MΩ)	1.0 ∞ 1.6 ∞ 3.2 ∞		Rate of weight loss (weight %) after 270 ℃/10 days		1.2 ∞ 1.7 ∞ 3.3 ∞	1.0 ∞ 1.6 ∞ 3.3 ∞	1.4 ∞ 1.5 ∞ 5.2 ∞	2.4 ∞ 3.5 ∞ 6.2 ∞	4.2	4.3	3.3	4.2	4.5
	Bending strength conservation rate (%) after 40 ℃/24 hours		97		Rate of weight loss (weight %) after 270 ℃/10 days		96	98	96	96	4.2	4.3	3.3	4.2	4.5

CHAR ... characteristic HR ... heat-resisting MR ... moisture-proof

Table 13

				Embodiment
				Embodiment			61	62	63	6	7
				Insulating substrate		Binder resin mica reinforcement material hardening catalyst	61	62	63	6	7	YL-933:100, RN:43.4 is through hard glass bonded mica cloth TEA-K:0.5 weight % burnt in a heap	YL-933:100, RN:43.4 is through hard glass bonded mica cloth TEA-K:0.5 weight % burnt in a heap	YL-933:100, RN:43.4 is through hard glass bonded mica cloth TEA-K:0.5 weight % burnt in a heap	YL-438:100, PN:43.4 is through hard glass bonded mica cloth TEA-K:0.5 weight % burnt in a heap	YL-438:100, PN:43.4 is through hard glass bonded mica cloth TEA-K:0.5 weight % burnt in a heap
Compositions of thermosetting resin		The composition hardening catalyst		Insulating substrate		Binder resin mica reinforcement material hardening catalyst	BMI：70，DABE：30 TAIC：67 2E4MZ-CN	BMI：70.DER-332：50 MHACP：50.8 2E4MZ-CN	DAPPT：30，DER-332： 50 MHACP：50.8 2E4MZ-CN	BMI：70，DABE：30 TAIC：67 2E4MZ-CN	DAPPI：30，DER-332： 50 MHACP：50.8 2E4MZ-CN
Compositions of thermosetting resin		The composition hardening catalyst		C H A R	Just peel off		BMI：70，DABE：30 TAIC：67 2E4MZ-CN	BMI：70.DER-332：50 MHACP：50.8 2E4MZ-CN	DAPPT：30，DER-332： 50 MHACP：50.8 2E4MZ-CN	BMI：70，DABE：30 TAIC：67 2E4MZ-CN	DAPPI：30，DER-332： 50 MHACP：50.8 2E4MZ-CN	Do not have	Do not have	Do not have	Have	Have
	5 times 10 times first	tanδ(％) Meg(MΩ) tanδ(％) Meg (MΩ) tanδ(％) Meg(MΩ)	2.5 ∞ 3.2 ∞ 4.2 ∞		Just peel off		2.5 ∞ 5.7 ∞ 9.6 ∞	2.5 ∞ 5.6 ∞ 9.3 ∞	3.4 ∞ 7.5 ∞ 20.2 100	3.4 ∞ 9.8 ∞ 17.5 50		Do not have	Do not have	Do not have	Have	Have
	5 times 10 times first	tanδ(％) Meg(MΩ) tanδ(％) Meg (MΩ) tanδ(％) Meg(MΩ)	2.5 ∞ 3.2 ∞ 4.2 ∞		Rate of weight loss (weight %) after 270 ℃/10 days		2.5 ∞ 5.7 ∞ 9.6 ∞	2.5 ∞ 5.6 ∞ 9.3 ∞	3.4 ∞ 7.5 ∞ 20.2 100	3.4 ∞ 9.8 ∞ 17.5 50	3.2	6.8	6.3	20.2	25.3
	Bending strength conservation rate (%) after 40 ℃/24 hours		97		Rate of weight loss (weight %) after 270 ℃/10 days		91	92	66	46	3.2	6.8	6.3	20.2	25.3

CHAR ... characteristic HR ... heat-resisting MR ... moisture-proof

Table 14

				Embodiment
				Embodiment			1	2	3	4	5
				Insulating substrate		Bonding chair fat mica reinforcement material hardening catalyst	1	2	3	4	5	DER-332 without soft glass bonded mica cloth burnt in a heap-	E-807 without soft glass bonded mica cloth burnt in a heap-	DEN-438 without soft glass bonded mica cloth burnt in a heap-	CEL-2021 without soft glass bonded mica cloth burnt in a heap-	Silicones without soft glass bonded mica cloth burnt in a heap-
Compositions of thermosetting resin		Epoxy resin acid anhydrides hardening catalyst		Insulating substrate			YL-933：1，DER-332：1 MHACP 2E4MZ-CN	YL-933：1，DER-332：1 MHACP 2E4MZ-CN	YL-933：1，DER-332：1 MHACP 2E2E4MZ-CN	YL-933：1，DER-332：1 MHACP 2E4MZ-CN	YL-933：0.3， DER-332：1 MHACP 2E4MZ-CN		E-807 without soft glass bonded mica cloth burnt in a heap-
Compositions of thermosetting resin		Epoxy resin acid anhydrides hardening catalyst		C H A R	Just peel off		YL-933：1，DER-332：1 MHACP 2E4MZ-CN	YL-933：1，DER-332：1 MHACP 2E4MZ-CN	YL-933：1，DER-332：1 MHACP 2E2E4MZ-CN	YL-933：1，DER-332：1 MHACP 2E4MZ-CN	YL-933：0.3， DER-332：1 MHACP 2E4MZ-CN	Have	Have	Have	Have	Have
	5 times 10 times first	tanδ(％) Meg(MΩ) tanδ(％) Meg(MΩ) tanδ(％) Meg(MΩ)	2.5 ∞ 18.6 100 22.7 80		Just peel off		∞ 22.3 100 24.5 50	2.5 ∞ 18.5 100 20.6 80	2.5 ∞ 25.3 80 26.5 5	2.5 ∞ 10.5 100 18.6 100		Have	Have	Have	Have	Have
	5 times 10 times first	tanδ(％) Meg(MΩ) tanδ(％) Meg(MΩ) tanδ(％) Meg(MΩ)	2.5 ∞ 18.6 100 22.7 80		Rate of weight loss (weight %) after 270 ℃/10 days		∞ 22.3 100 24.5 50	2.5 ∞ 18.5 100 20.6 80	2.5 ∞ 25.3 80 26.5 5	2.5 ∞ 10.5 100 18.6 100	15.3	20.3	18.8	23.3	10.3
	Bending strength conservation rate (%) after 40 ℃/24 hours		85		Rate of weight loss (weight %) after 270 ℃/10 days		70	85	35	35	15.3	20.3	18.8	23.3	10.3

CHAR ... characteristic HR ... heat-resisting MR ... moisture-proof

Table 15

		Embodiment
		Embodiment				65	66	67	68
		Insulating substrate	Binder resin mica reinforcement material hardening catalyst	YL-933:100 DER-332:0 PSF:54 is without soft glass bonded mica cloth TEA-K:0.5 weight % burnt in a heap	YL-933:100 DER-332:0 PSF:54 is without soft glass bonded mica cloth TEA-K:0.5 weight % burnt in a heap	65	66	67	68	YL-933:75 DER-332:22 PSF:54 is without soft glass bonded mica cloth TEA-K:0.5 weight % burnt in a heap	YL-933:75 DER-332:0 PSF:54 is without soft glass bonded mica cloth TEA-K:0.5 weight % burnt in a heap
Compositions of thermosetting resin	The epoxy resin acid anhydrides	Insulating substrate	Binder resin mica reinforcement material hardening catalyst			YL-932：1 DER-332：1 NEACP	YL-932：1 DER-332：1 MHACP	YL-932：1 DER-332：1 MHACP	YL-932：1 DER-332：1 MHACP
Compositions of thermosetting resin	The epoxy resin acid anhydrides	Curing condition ℃/h+ ℃/h+ ℃/h		100/10+150/3+ 230/10	100/5+150/3+ 200/5	YL-932：1 DER-332：1 NEACP	YL-932：1 DER-332：1 MHACP	YL-932：1 DER-332：1 MHACP	YL-932：1 DER-332：1 MHACP	100/5+150/3+ 200/5	100/3+150/2+ 170/5

Claims

1. method of making electric insulation coil, this coil has the thermal endurance class from the F level to the C level, and this method comprises the steps:

Constitute stacked multi-layer conductive, each is isolated with one deck insulator,

To twine above-mentioned stacked multi-layer conductive with a kind of insulating substrate of binder resin enhancing intensity with the formation insulating barrier,

Flood described insulating barrier with a kind of thermosetting resin,

The above-mentioned thermosetting resin that hardens,

It is characterized in that:

Select a kind of like this composition as described binder resin, said composition comprise weight be the polyfunctional epoxy resin that in molecule, has at least three P-(2, the 3-glycidoxy) phenyl group of 100-50 part and at the most weight be 50 parts bifunctional epoxy resin,

Select a kind of thermoset epoxy type resin as described thermosetting resin, and

According to the thermal endurance class of needed electric insulation coil, the final and maximum temperature of the described thermosetting resin of in 170 ℃-230 ℃ scope, selecting to be used to harden.

2. method according to claim 1 is characterized in that the selection of the described final and maximum temperature that is used for the hardening heat thermosetting resin is as follows:

(a) 170 ℃-230 ℃ are used to make the electric insulation coil that thermal endurance class is the F level;

(b) 200 ℃-230 ℃ are used to make the electric insulation coil that thermal endurance class is the H level;

(c) 230 ℃ are used to make the electric insulation coil that thermal endurance class is the C level.

3. method according to claim 1 and 2, it is characterized in that described thermosetting resin is a kind of composition, its comprise weight be the bifunctional epoxy resin of 100-50 part and at the most weight be 50 parts the polyfunctional epoxy resin that in molecule, has at least 3 P-(2, the 3-glycidoxy) phenyl group.

4. method according to claim 1 and 2 is characterized in that described binder resin comprises 1,1,3-three (P-(2, the 3-glycidoxy) phenyl) butane and a kind of phenolic resins, and a kind of diglycidyl ether of optional bisphenol-A.

5. method according to claim 1 and 2 is characterized in that described thermosetting resin comprises 1,1, the diglycidyl ether of 3-three (P-(2, the 3-glycidoxy) phenyl) methane and bisphenol-A, and a kind of optional methyl nadic acid anhydrides.

6. method according to claim 1 and 2 is characterized in that the thermal endurance of described insulating barrier is equal to or higher than the thermal endurance of described thermosetting resin.