JPH0964261A - Cutting molding method - Google Patents

Abstract

PROBLEM TO BE SOLVED: To simply and easily materialize the multikind and small-quantity production of semiconductor devices by reducing the amount of investment on facilities accompanying the description change of the products in cutting molding process. SOLUTION: Item separators 1, loaders 2, cutting molding mechanisms 3, and unloaders 4 which are unitized severally are coupled with one another by an optional number of units, and in each item separators 1, a long lead frame is divided roughly separately for each package into works, and with these works as units, the carriage in cutting molding process and the cutting molding with the cutting molds 23 and 24 of the cutting molding mechanism 3 are performed to make a semiconductor device being a product. At the time of description change of the lead frame, other facilities can be made in common to all different kinds merely by exchanging the cutting molds 23 and 24 of the cutting molding mechanism 3, and the multikind and small-quantity production in cutting molding process can be materialized simply, quickly, and besides at low cost.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a cutting and molding technique, and more particularly to a technique effectively applied to an assembling process in a semiconductor device manufacturing process.

[0002]

2. Description of the Related Art Conventionally, in a semiconductor device manufacturing process, a plurality of semiconductor elements collectively formed on a semiconductor wafer in a wafer process are individually separated by dicing, and then a plurality of semiconductor elements are formed on a lead frame at a predetermined pitch. After mounting and electrically connecting individual semiconductor elements to the lead frame by wire bonding or the like, a plurality of semiconductor elements on the lead frame are individually sealed with a resin or the like to form a package. There is. Then, the lead frame that has completed the formation of such a package is conveyed to a cutting molding process, and is provided with a feed claw or the like that fits into the lead frame while the plurality of packages are continuously mounted on the lead frame. By sequentially feeding to multiple cutting and molding dies arranged along the transfer chute, multiple leads protruding from the periphery of each package are cut and molded, and finally cut into package units to obtain the final product. Becomes

As for the technique of assembling a semiconductor device, see, for example, Nikkan Kogyo Shimbun, November 30, 1994.
It is described in the literature such as “Semiconductor Manufacturing Equipment Glossary” P271, published by Japan Semiconductor Manufacturing Equipment Association, Japan.

[0004]

However, when the lead frame in which a plurality of packages are connected in the cutting and molding process is handled as in the prior art as described above, each cutting and molding die is changed when the type is changed. It is necessary to replace the entire transfer mechanism such as the chute that transfers the lead frame between the molds, making the work such as change of setup large and complicated, and the amount of capital investment for cutting and molding new varieties. There was a problem that it became larger than necessary.
Further, since the long lead frame is handled as it is, there is a problem that an installation space for a transport mechanism such as a chute for transporting the lead frame is required, and the entire apparatus becomes large. This is an even greater technical issue in realizing the short life cycle of semiconductor products in the market and the high-mix low-volume production accompanying the diversification of semiconductor devices.

An object of the present invention is to provide a cutting and molding technique capable of reducing the amount of capital investment required for changing product types.

Another object of the present invention is to provide a cutting and molding technique capable of easily, quickly and easily realizing high-mix low-volume production of semiconductor devices.

Still another object of the present invention is to provide a cutting and molding technique capable of realizing downsizing of equipment and reduction of manufacturing cost.

Still another object of the present invention is to provide a cutting and molding technique capable of easily and quickly changing the processing capacity of equipment.

The above and other objects and novel features of the present invention will be apparent from the description of this specification and the accompanying drawings.

[0010]

SUMMARY OF THE INVENTION Among the inventions disclosed in the present application, the outline of a representative one will be briefly described.
It is as follows.

The cutting and molding method of the present invention comprises a first step of obtaining a work by separating from a continuous frame, which has been completed up to a sealing step for forming a package for sealing each of a plurality of mounted semiconductor elements, into package units. A second step of individually inserting the work pieces into a cutting mold and performing at least one of a cutting operation and a molding operation of at least one of a plurality of lead portions protruding from the package and a connecting portion with respect to the continuous frame. It includes.

Further, in the above-mentioned first step, the continuous frame is fed into the cutting die through the inclined rail by its own weight of the continuous frame, and the work is obtained by separating into package units. .

Further, the cutting and molding apparatus of the present invention is an individual separating mechanism for obtaining a work by separating the continuous frame, which has been completed up to a sealing step for forming a package for sealing each of a plurality of mounted semiconductor elements, into package units. And a cutting and forming mechanism that performs at least one of cutting operation and molding operation of at least one of a plurality of lead portions protruding from the package and a connecting portion with respect to the continuous frame for each work obtained by the individual separating mechanism. And a transport mechanism that performs at least one of an operation of supplying the work obtained by the individual separating mechanism to the cutting and forming mechanism and an operation of paying out the work from the cutting and forming mechanism.

Further, in the above-mentioned cutting and molding apparatus, the individual separating mechanism is disposed on the inclined rail for guiding the continuous frame and the lower end side of the inclined rail, and divides the continuous frame coming by its own weight into package units. It can be configured to include an individual separation type that forms a work.

Further, in the above-described cutting and forming apparatus, the cutting and forming mechanism includes a substantially rectangular frame guide for guiding the outer frame of the frame of the work, and a cutting operation and a forming operation of the lead portion of the work positioned on the frame guide. The cutting mold may include a punch and a die that perform at least one of them.

Further, in the above-mentioned cutting and forming apparatus, the carrying mechanism can be commonly used for a plurality of types of works by performing a holding operation with the center of the work package as a reference.

Further, in the above-mentioned cutting and molding apparatus, the transport mechanism may be configured to have a mechanism which can be used as a sleeve and a tray for housing a plurality of works or semiconductor devices obtained by cutting and molding the works. .

Further, in the above-mentioned cutting / molding apparatus, the individual separating mechanism, the cutting / molding mechanism, and the conveying mechanism constitute blocks each having an independent control mechanism, and are constructed by a building block system in which the blocks are arbitrarily combined. be able to.

[0019]

According to the above-described cutting and forming apparatus of the present invention, since the semi-finished work pieces separated from the long lead frame into the package units are supplied as a unit to the cutting and forming mechanism, for example, in the conveying mechanism, the long forming work is performed. No special transport mechanism such as a chute or feed claw for transporting the lead frame is required. Further, in a transfer mechanism that moves a work or a semiconductor device between the cutting and forming mechanism and the individual separating mechanism, by handling the center of a plurality of types of semiconductor devices or packages in a semi-finished product as a reference, for example, an XY transfer robot. It is possible to use a technique for performing a general-purpose transport operation such as, and a dedicated transport mechanism for each product is completely unnecessary.

Therefore, the capital investment for switching the product type is only the cost for exchanging the cutting and forming die forming the cutting and forming mechanism. For example, when compared to
It is possible to realize a large reduction in capital investment to about 1/3.

Further, the setup work at the time of changing the product type is only the work of exchanging the cutting and forming mechanism, so that the multi-product small-quantity production of the semiconductor device can be realized simply and easily. Further, since the long lead frame is not handled as it is, the cutting and forming mechanism, the conveying mechanism and the like can be simplified and downsized, and the entire cutting and forming process can be downsized.

Further, the individual separating mechanism, the cutting and forming mechanism, and the conveying mechanism which constitute the cutting and forming apparatus each form an independent block, and the blocks are arbitrarily combined to construct the cutting and forming apparatus, so that the processing capability is improved. Can be easily realized, and not only small quantity of many kinds but also mass production of specific kinds can be easily realized.

[0023]

Embodiments of the present invention will now be described in detail with reference to the drawings.

FIG. 1 is a plan view showing an example of the construction of a cutting and forming apparatus which is an embodiment of the present invention. The cutting and molding apparatus according to the present embodiment includes a single-piece separator 1, a loader 2, a cutting and molding mechanism 3, and an unloader 4.

Each of the single-piece separator 1, the loader 2, the cutting / molding mechanism 3, and the unloader 4 is, for example, as shown in FIG. 15, a main control unit 100 including a microprocessor and the like, and control according to each mechanism. A control mechanism including a mechanism control unit 101 that performs an operation and an I / F control unit 102 that controls the exchange of control information with other connected mechanisms is provided, and any number of units can be connected to each other to be described later. It is possible to perform such a cooperative operation.

FIG. 2 is a plan view of the single-piece separator 1 in the cutting and molding apparatus of this embodiment, and FIG. 3 is a side view thereof. The single-piece separator 1 of this embodiment has a structure shown in FIG.
A case magazine 5 in which long lead frames 50 are stacked and accommodated, a frame transport mechanism 6 for individually taking out and carrying out the lead frames 50 from the case magazine 5, a movable inclined rail 7 and The fixed sloping rail 7a and the fixed sloping rail 7a on the lower end side of the movable sloping rail 7 are arranged so as to face each other, and the lead frame 50 arriving at the fixed sloping rail 7a by its own weight is divided into package units and exemplified in FIG. The individual separation mold 8 for performing the operation of forming the work W as described above, and the take-out arm 9a for taking out the obtained individual work W and carrying it out to the work take-out pocket 9. A work transfer mechanism 10, a relay transfer mechanism 11, and a relay transfer mechanism 12 are arranged above the work take-out pocket 9, and each work W is delivered to the adjacent loader 2 side described later. There is.

Work transfer mechanism 10 and relay transfer mechanism 1
1. Since the relay transfer mechanism 12 holds the work W by, for example, a vacuum suction operation with the center position of the package 52 of the work W as a reference, the common work mechanism 12 is commonly used regardless of the type of the work W, that is, the change in the outer dimension or the like. Used.

FIG. 4 is a plan view showing an example of the cutting and forming mechanism 3 in the cutting and forming apparatus of this embodiment, and FIGS. 5 and 6 are side views thereof. Cutting and forming mechanism 3 of this embodiment
Is a plurality of cutting molds 23 and cutting molds 24.
A transport mechanism 20, a reversing pocket 21 arranged on the side of the loader 2, and a positioning pocket 22 arranged on the side of the unloader 4.

The cutting mold 23 is a lower die set 23.
a, an upper die set 23b, and a guide post 23c for guiding the up-and-down movement of the upper die set 23b. The lower die set 23a includes a die 23 for cutting and molding.
D and a die mounting block 23f provided with a frame positioning frame 23e for positioning the work W with respect to the die 23d are arranged. Upper die set 23b
Is provided with a punch mounting block 23g to which a punch (not shown) having a predetermined shape is fixed.

Similarly, the cutting mold 24 includes a lower die set 24a, an upper die set 24b, and an upper die set 2.
It is provided with a guide post 24c for guiding the up-and-down movement of 4b. The lower die set 24a is provided with a die 24d for cutting and molding, and a die mounting block 24f provided with a frame positioning frame 24e for positioning the work W with respect to the die 24d. The upper die set 24b is provided with a punch mounting block 24g to which a punch (not shown) having a predetermined shape is fixed.

Cutting mold 23 and cutting mold 24
May perform the same type of cutting and molding operation, or may partially share a series of cutting and molding steps. The transfer mechanism 20 includes a plurality of suction arms 20 a as illustrated in FIG.
And cutting molds 23 and 24, positioning pocket 2
A work W (semiconductor device) can be transported between the two.

On the other hand, the loader 2 and the unloader 4 in the cutting and molding apparatus of this embodiment will be described. FIG.
FIG. 8 is a plan view of the loader 2 and the unloader 4 in this embodiment, and FIG. 8 is a side view thereof. In the case of this embodiment,
The loader 2 and the unloader 4 have a common configuration, and each has a configuration that can be used for both the sleeve storage system and the tray storage system, as illustrated in FIGS. 7 and 8. There is.

That is, the loader 2 (unloader 4) is
An XY robot 13 having a suction arm 14 for holding a work W, a tray loader 15 and a tray unloader 16, a tray loader 15 and a tray unloader 16
A tray accommodating mechanism including a tray elevating mechanism 18 and a tray elevating mechanism 17 for driving each of the above, and a sleeve accommodating mechanism including a work pushing mechanism 19, a work pusher 19a, and a sleeve support 19b. There is. The suction arm 14 of the XY robot 13 performs the holding operation of the work W with the center position of the package 52 of the work W as a reference. Therefore, it is commonly used regardless of the change in the size of the package 52 or the size of the lead frame 50A in the work W, that is, in common to the transport operation of a plurality of types of works W.

FIG. 9 is a plan view showing an example in which the loader 2 and the unloader 4 illustrated in FIGS. 7 and 8 are used in a tray storage system, and FIG. 10 is a side view thereof. It should be noted that, in order to make the explanation easy to understand, in FIGS. 9 and 10, the illustration of the sleeve storage system mechanism not related to the tray storage system is omitted.

When the tray loading method is used, the tray loader 15 and the tray unloader 16 each have a plurality of trays 15a for storing the work W and the like and an empty tray 16a after the work W and the like are taken out. The tray 15a and the tray 16a are moved up and down by the tray elevating mechanism 17 and the tray elevating mechanism 18. The take-out operation of the work W is executed by combining the moving operation of the suction arm 14 of the XY robot 13 and the lifting operation of the tray loader 15 and the tray unloader 16. The movement of the tray 15a and the tray 16a between the tray loader 15 and the tray unloader 16 is performed by XY
This is performed by the suction arm 14 of the robot 13.

On the other hand, FIG. 11 is a plan view showing an example in which the loader 2 and the unloader 4 illustrated in FIGS. 7 and 8 are used in a sleeve storage system, and FIG. 12 is a side view thereof. In order to make the explanation easy to understand, FIG.
1 and 12, the illustration of the tray storage type mechanism not related to the sleeve storage type is omitted.

In the case of using the sleeve storage system, a plurality of sleeves S are placed on the sleeve support base 19b in parallel and horizontally, and are housed inside via slits formed in the respective sleeves S in the longitudinal direction. The work W or the like which is present is opened by the work pushing mechanism 19 (see FIG. 1).
1), and the work W or the like extruded is individually gripped by the suction arm 14 and carried out, and by the work pusher 19a arranged so as to face the opening of the sleeve S, the work is sucked into the opening. Both of the operation of pushing the work W carried in by the arm 14 into the sleeve S and storing the work W are possible.

FIG. 13 is a lead frame 50 from which a work W to be processed by the cutting and molding apparatus of this embodiment is cut out.
FIG. 14 is a plan view showing an example of the overall configuration of FIG. 14, and FIG. 14 is a plan view showing an example of a work W to be processed by the cutting and molding apparatus of this embodiment.

The lead frame 50 undergoes the pellet bonding process, the wire bonding process, and the sealing process for forming the package 52 in the preceding stage.
The plurality of packages 52 are arranged in the longitudinal direction at a predetermined pitch. A plurality of outer leads 51a, which are connected to the tie bars 51b and whose outer ends are integrated with the lead frame 50, are provided around each package 52 in a protruding manner. Side portions of each package 52 other than the side where the plurality of rectangular outer leads 51a are provided are supported by the lead frame 50 by tab suspension leads (not shown), and the tab suspension leads are lead-cut by a pinch cut operation or the like. It is separated from the frame 50. The outer ends of the outer leads 51a belonging to each package 52 are separated by slits 51c. As will be described later, the slit 51c serves as a dividing position when the work W supplied to the cutting mold of the present embodiment is individually cut from the lead frame 50 to form the work W.

Further, on both side edges in the longitudinal direction of the lead frame 50, a circular positioning hole 51d and an oval positioning elongated hole 51e are provided at positions where the package 52 is a unit.
Has been drilled.

In the case of the present embodiment, in order to make the explanation easy to understand, a package in which a plurality of packages 52 are integrally connected is referred to as a lead frame 50, and the lead frame 50 is concerned.
What is attached to the work W in a state of being roughly divided by the package 52 is referred to as a lead frame 50A to be distinguished.

An example of the operation of the cutting and molding process using the cutting and molding apparatus of this embodiment will be described below. First, as shown in FIG. 13, the frame transport mechanism 6 individually takes out the long lead frame 50 having the plurality of packages 52 formed up to the sealing step, from the case magazine 5, and movably tilts the lead frame 50. Transport to rail 7. The movable tilted rail 7 tilts after receiving the incoming lead frame 50 in a horizontal posture, and this tilting operation causes the lead frame 50 to be fed to the fixed tilted rail 7a by its own weight, and in order from the tip side, the individual separation type 8 By the cutting operation by, the package 52 is divided by the slit 51c as a boundary, and the work W as illustrated in FIG. 14 is obtained. Here, since the operation of feeding the lead frame 50 to the individual separation mold 8 is performed by the weight of the lead frame 50 itself, a mechanism such as a conveying claw that depends on the type of the lead frame 50 is not necessary at all, and a plurality of types of For the lead frame 50, the movable inclined rail 7, the fixed inclined rail 7a, the individual separation mold 8 and the like can be commonly used.

The work W thus obtained is placed on the work take-out pocket 9 via the take-out arm 9a, and then carried out to the reversing pocket 21 via the work carrying mechanism 10 and the relay carrying mechanisms 11 and 12. . At this time, the tray 15a of the loader 2 may be used as an intermediate buffer, if necessary. The work W arriving at the reversal pocket 21 is judged to be the front and back of the package 52, and is reversed as necessary.

Next, the work W in the reversing pocket 21 is
The suction arm 20a of the transport mechanism 20 on the side of the cutting and molding mechanism 3
After being taken out by being sucked and held at the center position of the package 52 by the, and put into the frame positioning frame 23e of the cutting molding die 23, for example, after being roughly positioned by the outer peripheral portion of the lead frame 50A of the work W, further. The positioning is accurately performed by fitting a positioning pin or the like (not shown) into the positioning hole 51d. Then, the punch mounting block 23g descends, and the cutting and molding operation is performed by the punch mounting block 23g and the die 23d. After that, the work W is attached to the suction arm 20.
It is put into the frame positioning frame 24e of the adjacent cutting molding die 24 by a, and the same cutting molding operation is performed. In the cutting and forming operation in the cutting and forming dies 23 and 24,
For example, the tie bar 51b in the lead frame 50A of the work W is cut off, the outer end portion of the outer lead 51a is cut, a pinch cut for cutting a tab suspension lead (not shown), or the outer lead 51a is formed into a predetermined shape. Operations and the like are shared by the cutting molds 23 and 24 as necessary.

In this way, the work W, which has been cut and formed, is dispensed to the positioning pocket 22 as a product such as a predetermined semiconductor device in which the lead frame 50A and the like have been cut off, and further, the XY of the adjacent unloader 4 is used. Robot 1
3 is taken out by the suction arm 14 and, for example, in the case of the sleeve storing method illustrated in FIGS. 11 and 12, after being placed in the opening of each sleeve S, it is pushed into the inside of the sleeve S by the work pusher 19a. It is housed inside the sleeve S by the operation.

When the lead frame 50, that is, the type of the work W is changed, the cutting and molding mechanism 3 including the cutting and molding die 23 and the cutting and molding die 24 is replaced if necessary. Further, when the demand for the processing capacity changes, the number of the single-piece separator 1, the loader 2, the cutting and forming mechanism 3, the unloader 4, etc. is increased or decreased as necessary. A series of operation procedures of the cutting and forming method according to the present embodiment as described above are shown in the flowchart of FIG.

As described above, according to the cutting / forming apparatus of this embodiment, the cutting / forming step is executed in units of the work W divided from the long lead frame 50 into the length of the package 52. Therefore, at the time of carrying the work W, by using the central position of the package 52 of each work W as a reference position at the time of carrying, the carrying operation of a plurality of types of works W of different sizes is carried out by a common carrying mechanism (the present embodiment). In the case of the example, the take-out arm 9a, the work transfer mechanism 10, the relay transfer mechanisms 11 and 12, the suction arm 20a of the transfer mechanism 20, and the suction arm 1 of the XY robot 13.
4)) can be used for general purposes.

Therefore, in the cutting and forming process of the present embodiment, the large and high-cost conveying mechanism such as a chute necessary for conveying the long lead frame 50 is completely unnecessary, and the cutting and forming mechanism 3 is cut and formed. Mold 23 and cutting mold 2
Since only 4 needs to be exchanged according to the type, it is not necessary to replace or install a large and expensive transfer mechanism such as a chute for changing the type (size, etc.) of the work W, resulting in a significant cost reduction. It is also possible to reduce the size of equipment by saving space.

Further, by increasing / decreasing the single-piece separator 1, the loader 2, the cutting / forming mechanism 3, and the unloader 4 in units of units, the step of dividing the work W from the lead frame 50, the supply of the work W, the cutting / forming, and the processing after the processing are performed. Work W
It is possible to increase or reduce the processing capacity of any step such as paying out of (semiconductor device) arbitrarily and quickly, and to change the processing capacity quickly and easily. Therefore, it is possible to flexibly cope with a wide variety of products from small-quantity production to mass production of specific products.

Further, the loader 2 and the unloader 4 can be arbitrarily used for a tray storage system, a sleeve storage system, etc. by using a common mechanism, and the manufacturing cost of the cutting and molding apparatus can be reduced by sharing parts. it can.
As a result, it becomes possible to inexpensively and quickly and easily perform the production of a wide variety of workpieces W in small quantities.

Although the invention made by the present inventor has been specifically described based on the embodiments, the present invention is not limited to the above embodiments, and various modifications can be made without departing from the scope of the invention. Needless to say.

For example, the shapes of the lead frame and the work are not limited to those exemplified in the above embodiment.

In the above description, the case where the invention made by the present inventor is mainly applied to the manufacturing process of the semiconductor device which is the field of application which is the background of the invention has been described.
The present invention is not limited to this, and can be widely applied to general precision cutting and molding techniques.

[0054]

Advantageous effects obtained by typical ones of the inventions disclosed in the present application will be briefly described.
It is as follows.

According to the cutting and molding method of the present invention, it is possible to reduce the amount of capital investment required for changing product types. Further, there is an effect that it is possible to easily, quickly and easily realize high-mix low-volume production of semiconductor devices. Further, there is an effect that the downsizing of equipment and the reduction of manufacturing cost can be realized.

Further, according to the cutting and molding apparatus of the present invention, it is possible to reduce the amount of capital investment required for changing product types. Further, there is an effect that it is possible to easily, quickly and easily realize high-mix low-volume production of semiconductor devices. Further, there is an effect that the downsizing of equipment and the reduction of manufacturing cost can be realized.

[Brief description of drawings]

FIG. 1 is a plan view showing an example of the configuration of a cutting and molding apparatus that is an embodiment of the present invention.

FIG. 2 is a plan view of a single-piece separator in the cutting and molding apparatus that is an embodiment of the present invention.

FIG. 3 is a side view of a single-piece separator in the cutting and molding apparatus that is an embodiment of the present invention.

FIG. 4 is a plan view showing an example of a cutting and forming mechanism in the cutting and forming apparatus that is an embodiment of the present invention.

FIG. 5 is a side view showing an example of a cutting and forming mechanism in the cutting and forming apparatus that is an embodiment of the present invention.

FIG. 6 is a side view showing an example of a cutting and forming mechanism in the cutting and forming apparatus which is an embodiment of the present invention.

FIG. 7 is a plan view showing an example of the configurations of a loader and an unloader in the cutting and molding apparatus that is an embodiment of the present invention.

FIG. 8 is a side view showing an example of the configurations of a loader and an unloader in the cutting and molding apparatus that is an embodiment of the present invention.

FIG. 9 is a plan view showing an example in which the loader and unloader illustrated in FIGS. 7 and 8 are used in a tray storage system.

FIG. 10 is a side view showing an example in which the loader and unloader illustrated in FIGS. 7 and 8 are used in a tray storage system.

FIG. 11 is a plan view showing an example in which the loader and unloader illustrated in FIGS. 7 and 8 are used in a sleeve storage system.

FIG. 12 is a side view showing an example in which the loader and unloader illustrated in FIGS. 7 and 8 are used in a sleeve storage system.

FIG. 13 is a plan view showing an example of the overall configuration of a lead frame from which a work to be processed by the cutting and molding apparatus according to an embodiment of the present invention is cut out.

FIG. 14 is a plan view showing an example of a work to be processed by the cutting and molding apparatus that is an embodiment of the present invention.

FIG. 15 is a block diagram showing an example of the configuration of a control system in the cutting and molding apparatus that is an embodiment of the present invention.

FIG. 16 is a flow chart showing an example of the operation of the cutting and molding method and apparatus according to one embodiment of the present invention.

[Explanation of symbols]

 1 Single Separator 2 Loader 3 Cutting and Forming Mechanism 4 Unloader 5 Case Magazine 6 Frame Conveying Mechanism 7 Movable Inclined Rail 7a Fixed Inclined Rail 8 Individual Separation Type 9 Work Ejecting Pocket 9a Ejecting Arm 10 Work Conveying Mechanism 11 Relay Conveying Mechanism 12 Relay Conveying Mechanism 13 XY robot 14 Suction arm 15 Tray loader 15a Tray 16 Tray unloader 16a Tray 17 Tray lifting mechanism 18 Tray lifting mechanism 19 Work pushing mechanism 19a Work pusher 19b Sleeve support 20 Transfer mechanism 20a Suction arm 21 Inversion pocket 22 Positioning pocket 23 Cutting Molding die 23a Lower die set 23b Upper die set 23c Guide post 23d Mold 23e Frame positioning frame 23f Die mounting block 23g Punch mounting block 24 Cutting Mold 24a Lower Die Set 24b Upper Die Set 24c Guide Post 24d Die 24e Frame Positioning Frame 24f Die Mounting Block 24g Punch Mounting Block 50 Lead Frame 50A Lead Frame (Work Condition) 51a Outer Lead 51b Tie Bar 51c Slit 51d Positioning hole 51e Positioning long hole 52 Package 100 Main control unit 101 Mechanism control unit 102 I / F control unit S Sleeve W Work

 ─────────────────────────────────────────────────── ─── Continuation of the front page (72) Hiromi Kosaka, Asahidai, Moroyama-cho, Iruma-gun, Saitama 15 Asahidai, Hitachi Tobu Semiconductor Co., Ltd. (72) Akihide Higuchi, Asahidai, Moroyama-cho, Iruma-gun, Saitama 15 In the Eastern Eastern Semiconductor Co., Ltd. (72) Hiroaki Kikuchi, Ina No. 15 Asahidai, Moroyama-cho, Iruma-gun, Saitama Nissho Eastern Eastern Semiconductor Ltd. (72) Nobuaki Takahashi 15 Asahidai, Moroyama-cho, Iruma-gun, Saitama Within Semiconductor Corporation

Claims (8)

[Claims] 1. A first step of obtaining a work by separating it into the package units from a continuous frame that has been completed up to a sealing step of forming a package for sealing each of a plurality of mounted semiconductor elements, and the work individually. And a second step of performing at least one of a cutting operation and a molding operation of at least one of a plurality of lead portions projecting from the package and a connecting portion to the continuous frame, the cutting step being performed in a cutting mold. A cutting and forming method characterized by the above. 2. The cutting and molding method according to claim 1, wherein
In the first step, the cutting and molding method is characterized in that the continuous frame is fed into a cutting die by an own weight of the continuous frame via an inclined rail to separate the package into package units to obtain a work. 3. An individual separating mechanism for separating a package from a continuous frame that has completed a sealing process for forming a package for sealing each of a plurality of mounted semiconductor elements to obtain a work, and the individual separating mechanism. A cutting and forming mechanism that executes at least one of a cutting operation and a molding operation of at least one of a plurality of lead portions projecting from the package and a connecting portion for the continuous frame with respect to the obtained individual work, A cutting and forming apparatus comprising: a conveying mechanism that performs at least one of an operation of supplying the work obtained by the individual separating mechanism to the cutting and forming mechanism and an operation of paying out the work from the cutting and forming mechanism. 4. The cutting and molding apparatus according to claim 3,
The individual separating mechanism is provided with an inclined rail that guides the continuous frame, and an individual separating type that is disposed on the lower end side of the inclined rail and forms the work by dividing the continuous frame that arrives by its own weight into the package units. And a cutting and forming device. 5. The cutting and molding apparatus according to claim 3,
The cutting and forming mechanism includes a substantially rectangular frame guide that guides an outer frame of the frame of the work, and a punch that performs at least one of a cutting operation and a forming operation of a lead portion of the work positioned on the frame guide. A cutting and molding apparatus comprising a cutting and molding die including a die. 6. The cutting and molding apparatus according to claim 3,
The cutting and forming apparatus, wherein the transport mechanism is commonly used for a plurality of types of the work by performing a holding operation with the center of the package of the work as a reference. 7. The cutting and molding apparatus according to claim 3,
The cutting and forming apparatus, wherein the transport mechanism has a mechanism that can also serve as a sleeve and a tray for housing a plurality of works or semiconductor devices obtained by cutting and forming the works. 8. The cutting and molding apparatus according to claim 3,
The cutting / molding apparatus, wherein each of the individual separating mechanism, the cutting / molding mechanism, and the conveying mechanism has a control mechanism independent of each other, and constitutes a block that can be arbitrarily combined with each other.