JP2682422B2 - Hanging pin cutting device in the manufacture of semiconductor devices - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a hanging pin cutting device in the manufacture of semiconductor devices.

[0002]

2. Description of the Related Art A manufacturing process of a resin-sealed semiconductor device will be described with reference to FIGS.

First, a perspective view of FIG. 6A and FIG.
As shown in FIG. 6B of the cross-sectional view of the BB ′ portion of FIG. 1, the lead frame 50 has an outer frame 51 extending in the long side direction, a sprocket hole 54 formed in the outer frame 51, and a length extending in the short side direction. The inner frame 52, the outer frame 51, and the inner frame 52 along the hole 53 each have a plurality of leads 55 extending in the direction of the island 56. Then, the semiconductor chip 57 is mounted on the island 56, and the electrodes of the semiconductor chip 57 and the tip portions of the internal portions of the leads 55 (internal leads) are connected by the thin metal wires 58 to form a package having a thickness T. A plurality of (five in the figure) semi-finished products of the semiconductor device sealed with 59 are formed on the lead frame 50.

Next, tie bar cutting is performed. FIG. 7 is a plan view after the tie bar is cut, and the tie bar connected to the root vicinity 55 ′ of the lead (external lead) 55 derived from the sealing resin 59 is cut after the resin sealing.

Next, as shown in FIG. 8, the leads 55 are cut and separated from the outer frame 51 and the inner frame 52, and the lead frame 50 is cut in the direction of the short sides at the long holes 53.
As a result, a resin-sealed package having a plane size of X × Y and a thickness T (FIG. 6B) is provided inside the frame body of the outer frame 51 and the inner frame 52 having a plane size of L × W. A semi-finished product of a semiconductor device, in which a plurality of leads (external leads) 55 are respectively led out from four sides of 59, is connected to the lead frame 50 only by four hanging pins 60 respectively led out from four corners of the sealing resin 59. It will be in a suspended or suspended state. The suspension pins 60 are made of the same lead frame material as the leads 55 and the island 56, and are connected to the island 56 in the sealing resin.

Next, the hanging pins 60 are cut to separate the semi-finished product of the semiconductor device from the frame of the lead frame.
Then, as shown in FIG. 10, the leads 55 led out from the sealing resin 59 are molded to complete the semiconductor device.

The present invention relates to a hanging pin cutting device for changing the state of FIG. 8 to the state of FIG.

Next, a conventional technique will be described with reference to FIGS. 11 to 13.

FIG. 11 shows a conventional hanging pin cutting and lead forming apparatus. The semi-finished product in the state of FIG. 8 after the resin sealing, tie bar cutting, and lead cutting is supplied from the supply section 41 to the supply arranging section 42 and aligned at a predetermined position, and then conveyed by the conveying section 43 to be lifted by the hanging pins. The semiconductor device in the state of FIG. 10 is obtained from the cutting part 44 by the work in the lead forming part 45, and is taken out and aligned in the take-out aligning part 46, and the aligned semiconductor devices are housed in the housing part 47.

FIG. 12 shows a hanging pin cutting portion 44 and a lead forming portion 45 of the prior art. The upper die 33 is vertically driven by using the four guide posts 31 fixed to the lower die 32 as guides. Further, it is provided with a feed bar for transporting the supplied semi-finished product of the semiconductor device and a transport unit (not shown) of a vacuum suction head.

Further, in FIG. 12, the hanging pin cutting portion 44 and the lead forming portion 45 are fixed at the positions where the same pair of upper and lower molds face each other.

Next, the conventional hanging pin cutting portion 44 will be described with reference to FIG. The hanging pin cutting punch 36 is guided by the pad 35, and the lower die 32 is provided with a package pedestal 34 and a resin waste suction hole 37.
First, the semi-finished product of the semiconductor device of FIG. 8 is transported by the transport unit while the upper die 33 is raised, and is placed on the package pedestal 34 (FIG. 13A). Next, upper mold 33
Starts to descend, and the pad 35 stops by pressing the hanging pin at a position in contact with the surface of the hanging pin. And further upper mold 33
Descends from the lower surface of the pad 35 and the hanging pin cutting punch 36
Is about 2 of the thickness of the hanging pin 60 (thickness of the lead frame)
Approximately twice (0.3 mm-0.
5 mm) and project the hanging pin 60 (Fig. 13).
(B)).

[0013]

In this hanging pin cutting device of the prior art, since the hanging pin cutting punch is fixed to the upper die in the die and guided by the pad, it can be applied to only one type of semiconductor device. Even if the lead frame frame has the same outer shape and the supply section, the transport section, and the storage section can be shared, the package size (outer dimension of the sealing resin)
In the case of cutting the hanging pins of the semiconductor device of different type, the mold had to be replaced and replaced.

Therefore, a cutting die must be prepared for each package size, resulting in a large amount of equipment investment cost.

Further, there is a problem that the man-hours for exchanging the mold are generated every time the package size is changed and the productivity is lowered.

Further, since a large number of molds are required to be stored in a storage place, there is a problem that floor efficiency is deteriorated.

[0017]

A feature of the present invention is to provide a semiconductor device in which sealing with a sealing resin, tie bar cutting, and lead cutting are completed, and the semiconductor device is connected to a frame of a lead frame by a plurality of suspension pins. In a hanging pin cutting device that cuts the plurality of hanging pins of a semi-finished product to separate the semi-finished product from the frame of the lead frame, it is possible to correspond to each of the plurality of hanging pins and change the interval dimension between them. Have a plurality of hanging pin cutting punches that can be moved horizontally , and a pair of hanging pin cutting pans that are positioned in one direction
The above-mentioned interval dimension between the
It is possible to change it, which makes it possible to move
It is a hanging pin cutting device . For example, first, second,
Having third and fourth hanging pin cutting punches, the first and second hanging pin cutting punches being located on the first Y axis,
The third and fourth hanging pin cutting punches are located on the second Y axis parallel to the first Y axis, and the first and third hanging pin cutting punches are located on the first X axis perpendicular to the Y axis. Located on the second
And the fourth hanging pin cutting punch is located on the second X-axis parallel to the first X-axis, and the interval between the first Y-axis and the second Y-axis is a forward-reverse screw extending in the X-direction. The distance between the first X-axis and the second X-axis can be changed by a forward-reverse screw (a threaded rod having a right-hand screw and a left-hand screw) extending in the Y-direction. Further, the stage on which the hanging pin cutting device is placed and the stage on which the lead forming device of the next step is placed can be separated.

[0018]

DESCRIPTION OF THE PREFERRED EMBODIMENTS The present invention will be described below with reference to the drawings.

FIG. 1 is a diagram showing an outline of a layout in the vicinity of a hanging pin cutting device according to an embodiment of the present invention.

The semi-finished product in the state shown in FIG. 8 after resin sealing, tie bar cutting, and lead cutting is conveyed from the supply section 1 to the first positioning stage 2 and positioned in the X and Y directions, and then suspended. It is conveyed and placed on the pin cutting device 3. Here, the semi-finished product of the semiconductor device in the state of FIG. 9 in which the hanging pins 60 are cut and separated from the frame body of the lead frame is transferred and placed on the lead forming device 4 to form the leads 55 in the X and Y directions. The semiconductor device in the state of FIG. 10 is obtained. Then, after this semiconductor device is transported to the second positioning stage 5 and positioned, it is transported to the storage tray of the storage unit 6 and stored therein. In FIG. 1, the carrying direction is indicated by an arrow 7, and each carrying and placing operation is performed by a carrying unit such as a feed bar or a vacuum suction head.

FIG. 2 is a plan view showing a hanging pin cutting device 3 according to an embodiment of the present invention.

Four X-axis fixed blocks 14 are fixedly mounted on the stage 10, and two X-axis fixed blocks 14 are rotatably supported by the respective X-axis fixed blocks 14 via bearings so as to be in the X direction. Has been extended to. This X-axis 12 is a forward and reverse screw,
For example, it is a lead screw (feed screw) in which a left screw is formed on the left side of the center boundary 12 ′ and a right screw is formed on the right side, and the left and right screws have the same pitch.

A total of four X-axis movable blocks 13 are screwed and mounted on the left and right sides of the boundaries 12 'of the respective X-axis 12. That is, by engaging the screw of the screw hole penetrating the X-axis movable block 13 in the X direction with the lead screw of the X-axis 12, the X-axis movable block 13 is moved in the X-direction by the rotation of the X-axis 12. ing. And 1
An X-axis drive motor 16 fixed to each X-axis fixing block 14 is coupled to one X-axis 12 to transmit the rotational force of the motor, and the other X-axis 12 is rotated by a transmission means 20 such as a belt. Tell the power.

A Y-axis fixed block 15 is fixedly mounted on each of the four X-axis movable blocks 13, and two Y-axis 11 can rotate on each Y-axis fixed block 13 via a bearing. It is supported by and extends in the Y direction. Like the X axis 12, the Y axis 11 is also a lead screw of forward and reverse threads, and is, for example, the left and right sides of the central boundary 11 '(upper and lower sides in the figure).
A left screw and a right screw having the same pitch are formed on each.

A total of four Y-axis movable blocks 21 are screwed and mounted on the left and right sides (upper and lower sides in the figure) of the boundaries 11 'of the respective Y-axis 11. That is, the screw of the screw hole penetrating the Y-axis movable block 21 in the Y direction and the Y-axis 1
By engaging with the lead screw of No. 1, rotation of the Y-axis 11 causes Y
The movable shaft block 21 is adapted to move in the Y direction. Then, at one end of each of the two Y axes 11, Y
The Y-axis drive motor 17 fixed to the shaft fixing block 15 is coupled to transmit the rotational force of the motor to each Y-axis. Further, the two Y-axis drive motors 17 are controlled so as to simultaneously rotate in the same direction.

The hanging pin cutting punch 18 is fixed to each of the four Y-axis movable blocks 23 in the XY plane so as to be movable in the vertical direction (perpendicular to the paper surface), and the four hanging pins are provided. Below the cutting punch 18, one pedestal 19 on which the semi-finished product of the semiconductor device shown in FIG. 8 is placed is fixed to the stage 10.

In the hanging pin cutting device 3, by rotating the X-axis drive motor 16 in one direction, the X-axis 1
2, X-axis movable block 13 and Y-axis fixed block 15
The distance between the two Y-axes 11 increases and
The space in the X direction between the hanging pin cutting punches 18 facing each other in the direction is widened. Similarly, by rotating the X-axis drive motor 16 in the opposite direction, the interval in the X direction between the hanging pin cutting punches 18 facing each other in the X direction becomes narrower.

By rotating the two Y-axis drive motors 17 in one direction at the same time, the interval between the Y-axis movable blocks 21 is expanded through the Y-axis 11, whereby the hanging pin cutting punches facing each other in the Y-direction. The space in the Y direction between 18 widens. Similarly, by rotating the Y-axis drive motor 17 in the opposite direction, the interval in the Y direction between the hanging pin cutting punches 18 facing each other in the Y direction becomes narrower.

Thus, the X and Y axis drive motors 16 and 17 are
The position of the hanging pin cutting punch 18 can be changed by the rotation of, and it becomes possible to cope with the cutting of the hanging pins of semiconductor devices of various sizes.

The cutting of the suspension pin 60 will be described with reference to FIG. The semi-finished product of the semiconductor device in the state of FIG. 8 is placed on the pedestal 19, and the key-like tip 18 ′ of the hanging pin cutting punch 18 is positioned above the cutting positions of the four hanging pins 60. Motor drive control is performed (FIG. 3 (A)). Next, the lifting pin cutting punch 18 is lifted by a vertical drive mechanism (not shown).
As shown by the solid arrow 28, the key pin tip 18 ′ is brought into contact with the surface of the hanging pin and then further lowered to cut the hanging pin 60 from the root of the sealing resin 59 (FIG. 3).
(B)). Alternatively, the hanging pin cutting punch 18 is not vertically driven, but instead, the pedestal 19 is lifted by a vertical driving mechanism (not shown) and is raised to the surface of the hanging pin 18 as indicated by a dotted arrow 29. 'After contacting, it may be further raised and cut. By this cutting, the semi-finished product of the semiconductor device in the state of FIG. 9 is separated from the lead frame frame, and the remaining lead frame frame opens the stage, falls to the lower part of the stage, and is accommodated in the scrap box.

Next, as shown in FIG. 4A, the semi-finished product of the semiconductor device conveyed to the lead forming device 4 is formed by the forming die 2.
4B by inserting the tip end portion of the lead 55, which is placed on the sheet 7 in the horizontal direction from the sealing resin 59, into the side surface concave portion of the lead forming claw 26 and lowering the lead forming claw 26. As shown in, the lead 55 is formed in a gull wing shape.

FIG. 5 is a plan view showing a hanging pin cutting device 3 of another embodiment. In FIG. 5, the portions having the same or similar functions as those in FIG. 2 are denoted by the same reference numerals, and the duplicate description will be omitted.

In FIG. 5, the difference from FIG. 2 is that the Y-axis drive motor 17 is coupled only to the Y-axis 11 of the right-handed and right-handed screws, and the left Y-axis 22 is a shaft 22 having no screw or The two left Y-axis movable blocks 21 which are rails are slidably attached to the Y-axis 22 in the Y direction. A through hole 21 'in the X direction is formed in each of the four Y axis movable blocks 21, and a pair of Y axis movable blocks 21 facing each other in the X direction are inserted into the through holes 21' so as to be slidable in the X direction. The shaft 23 is connected through the shaft 23. With this configuration, the movement of the right Y-axis movable block 21 in the Y direction due to the rotation of the Y-axis drive motor 17 is transmitted to the left Y-axis movable block 21 through the respective shafts 23, and the left Y-axis movable block 21 also It moves in the same Y direction as the Y-axis movable block 21 on the right side. In FIG. 5, a coupling mechanism by the shaft 23 is required, but there is an advantage that only one Y-axis drive motor 17 is required.

[0034]

As described above, according to the present invention, the hanging pin cutting punch is provided corresponding to each of the plurality of hanging pins, and the hanging pin cutting punch can be moved in the horizontal plane. The hanging pins of various semiconductor devices having different (package sizes) can be cut without preparing a cutting die.

For example, as shown in Table 1, the frame frame dimensions W and L of FIG. 8 are equal to 30 mm × 20 mm, but the sealing resin dimensions (package size) X, Y and T (FIG. 6) are different. 7 types of semiconductor devices No. 7 to No. 7 can perform the hanging pin cutting without changing the cutting die.

[0036]

[Table 1]

Therefore, it is not necessary to prepare a cutting die for each package size, and there is an effect that equipment investment can be reduced. Also, because you can change the product type only by changing the data,
There is an effect that there is no need for die replacement, and there is almost no decrease in productivity due to product type switching.

[Brief description of the drawings]

FIG. 1 is a diagram showing an outline of a layout in the vicinity of a hanging pin cutting device according to an embodiment of the present invention.

FIG. 2 is a plan view illustrating a hanging pin cutting device according to an embodiment of the present invention.

FIG. 3 is a cross-sectional view showing a state in which a suspension pin is cut according to an embodiment of the present invention.

FIG. 4 is a cross-sectional view showing a state of lead molding after cutting the hanging pin according to the embodiment of the present invention.

FIG. 5 is a plan view illustrating a hanging pin cutting device according to another embodiment of the present invention.

FIG. 6 is a diagram showing a state of a lead frame on which a plurality of sealing resin type semiconductor devices are mounted.

FIG. 7 is a plan view showing a state after cutting the tie bar.

FIG. 8 is a plan view showing a state in which each lead is cut and separated from the frame of the lead frame, and the lead frame is cut in the direction of the short side at the position of the long hole.

FIG. 9 is a plan view showing a state in which the semi-finished product of the semiconductor device is cut off from the frame body of the lead frame by cutting the hanging pins.

FIG. 10 is a perspective view showing a semiconductor device on which lead molding has been performed.

FIG. 11 is a diagram showing an outline of a layout in the vicinity of a conventional hanging pin cutting device.

FIG. 12 is a perspective view showing a conventional hanging pin cutting device.

FIG. 13 is a cross-sectional view showing a state in which a suspension pin of the related art is cut.

[Explanation of symbols]

 1 Supply Unit 2 First Positioning Stage 3 Hanging Pin Cutting Device 4 Lead Forming Device 5 Second Positioning Stage 6 Storage Unit 7 Transfer Direction 11 X Axis 11 'Boundary between Right and Left Screws of X Axis 12 Y Axis 12 'Boundary between right and left screws of Y-axis 13 X-axis movable block 14 X-axis fixed block 15 Y-axis fixed block 16 X-axis drive motor 17 Y-axis drive motor 18 Lifting pin cutting punch 18' Tip of lifting pin cutting punch Part 19 Cradle 20 Belt 21 Y-axis movable block 21 'Through hole formed in Y-axis movable block 22 Y-axis shaft 23 Shaft connecting the Y-axis movable blocks 26 Lead forming claw 27 Lead forming die 28 Lifting pin punch Downward direction 29 Upward direction of pedestal 31 Guide post 32 Lower mold 33 Upper mold 34 Package pedestal 35 Pack 36 Hanging Pin Cutting Punch 37 Resin Suction Suction Hole 41 Supply Section 42 Supply Alignment Section 43 Conveying Section 44 Suspension Pin Cutting Section 45 Lead Forming Section 46 Takeout Alignment Section 47 Storage Section 50 Lead Frame 51 Frame Outer Frame 52 Frame Inner Frame 53 Long hole of lead frame 54 Sprocket hole of lead frame 55 Lead 55 'Lead part connected by tie bar 56 Island of lead frame 57 Semiconductor chip 58 Metal fine wire 59 Encapsulating resin (package) 60 Hanging pin

Claims (5)

(57) [Claims] 1. A semi-finished product of a semiconductor device, which has been sealed by a sealing resin, tie bar cutting and lead cutting are completed, and is connected to a frame of a lead frame by a plurality of hanging pins. In a hanging pin cutting device for cutting and cutting the semi-finished product from the frame body of the lead frame,
A pair of front hanging pins corresponding to each of the plurality of hanging pins and having a plurality of hanging pin cutting punches movable in the horizontal direction so as to be able to change the distance dimension between them, and located in one direction.
Note that the distance between the hanging pin cutting punches is
It can be changed with the forward and reverse screws that extend to
The hanging pin cutting device is characterized in that it can be moved . 2. The number of the hanging pins is four, and the four movable hanging pin cutting punches are arranged corresponding to the respective hanging pins.
The hanging pin cutting device described in. 3. The hanging pin cutting device according to claim 2, wherein the planar shape of the sealing resin forming the package is a quadrangular shape, and the hanging pins are respectively derived from the quadrangles. . 4. A first, a second, a third and a fourth hanging pin cutting punch, wherein the first and the second hanging pin cutting punch are located on a first Y-axis, and a third and a third hanging pin cutting punch are provided. No. 4 hanging pin cutting punch is located on a second Y axis parallel to the first Y axis, and the first and third hanging pin cutting punches are located on a first X axis perpendicular to the Y axis. , The second and fourth hanging pin cutting punches are located on a second X-axis parallel to the first X-axis,
The interval between the first Y-axis and the second Y-axis can be changed by a forward / reverse screw extending in the X direction, and the interval between the first X-axis and the second X-axis is forward / reverse extending in the Y-direction. The hanging pin cutting device according to claim 1, wherein the hanging pin cutting device is changeable with a screw. 5. The suspension according to claim 1, wherein the stage on which the hanging pin cutting device is mounted and the stage on which the lead forming device in the next step is mounted are separated from each other. Pin cutting device.