JPH0955321A - Chip coil - Google Patents

Abstract

PROBLEM TO BE SOLVED: To reduce mounting defect by grooving and forming a conductor layer wherein a coil part is applied to a surface of a main body, providing a recessed part to upper and lower surfaces alone of an outer circumference of a main body and providing insulation resin inside a recessed part of at least a lower surface. SOLUTION: A square pole-like main body 1 on its side is formed by providing a conductor layer on an insulating surface. A coil part 2 is formed by grooving a conductor layer of the outer circumferential surface of the main body 1 spirally. An eliminated part 3 is formed by eliminating a part of a front of an electrode part 5 of both end parts of the main body 1. A recessed part 6 is provided to upper and lower surfaces alone of the outer circumferential surface of the main body 1. Insulation resin 4 is applied to the outer circumferential surface of the coil part 2. The electrode part 5 is also arranged in both end parts of a lower surface of the main body 1 provided with the recessed part 6. The insulation resin 4 is applied to an inside of the recessed part 6 alone even if the insulation resin 4 is provided between the electrodes 5; therefore, flatness between a surface of the electrode part 5 and a surface of the resin layer 4 is good and mounting defect on a printed board, etc., during mounting can be reduced.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a chip coil used in electronic equipment, communication equipment and the like.

[0002]

2. Description of the Related Art FIG. 6 is a perspective view of a conventional spirally chipped chip coil. Reference numeral 11 is a prismatic main body having a conductor provided on the surface of an insulator. Reference numeral 12 is a coil portion formed by spirally cutting the surface conductor layer of the main body 11,
Is an insulating resin applied to the surface of the coil portion 12, and 15 is an electrode portion of the coil portion 12.

[0003]

In the above configuration, for example, in the configuration of the chip coil shown in FIG. 6, the insulating resin coated between the electrode portions 15 is thicker than the thickness of the electrode portions 15 arranged at the ends of the main body 11. Since the thickness of 14 is thicker, the flatness between the surface of the electrode portion 15 and the surface of the insulating resin 14 becomes worse.
As a result, when the chip coil is mounted on the printed circuit board or the like, the flatness between the surface of the printed circuit board or the like and the mounting surface of the chip coil also deteriorates, resulting in poor solderability between the electrode portion 15 and the printed circuit board or the like, resulting in poor mounting. Had a problem that occurs. Then, in order to improve this, the chip coil shown in FIG. 7 was proposed. In the configuration of the chip coil shown in FIG. 7, since the concave portions 16 are provided on the front surface, the rear surface, the upper surface and the lower surface of the outer periphery of the main body 11, the insulating resin 1 is provided between the electrode portions 15.
Even if the insulating resin 14 is covered with the insulating resin 14, the flatness between the surface of the electrode portion 15 and the surface of the insulating resin 14 is improved as compared with the chip coil shown in FIG. 2 and the mounting failure is less likely to occur. Become.

In this case, however, since the main body 11 is provided with the concave portions 16 on its front surface, rear surface, upper surface, and lower surface, it is difficult to take out the main body 11 from the mold easily when the main body 11 is machined. The productivity is not improved, and moreover, since the concave portions 16 are provided on the front surface, the rear surface, the upper surface, and the lower surface of the main body 11, the cross sectional area of the main body 11 becomes small, and the inductance defined by the size of the cross sectional area of the main body 11 is reduced. It also had the problem of becoming smaller.

The present invention solves the above problems, and an object of the present invention is to provide a chip coil in which mounting defects are reduced, productivity is high, and inductance is not easily reduced.

[0006]

In order to achieve the above object, a chip coil of the present invention comprises a prismatic main body made of an insulating material, electrode portions arranged at both ends of the main body, and connecting to the electrode portion. Along with, a coil portion disposed on the outer periphery of the main body between the electrode portions, and an insulating resin coating the coil portion, the coil portion is formed by cutting a conductor layer coated on the surface of the main body, In the outer periphery of the main body, the recess is provided only on the upper surface and the lower surface, and the insulating resin is provided at least in the recess on the lower surface.

With the above structure, the upper surface and the lower surface of the outer periphery of the main body are provided with the concave portions, and the insulating resin is provided at least in the concave portions of the lower surface of the main body. Therefore, even if the coil portion between the electrodes is covered with the insulating resin, The flatness of the bottom surface is good and mounting defects are unlikely to occur.

Further, since the main body is not provided with a concave portion on the front surface, the main body can be easily taken out from the mold, the productivity is high, the cross-sectional area of the main body is not small, and the inductance is not easily small.

[0009]

BEST MODE FOR CARRYING OUT THE INVENTION The invention according to claim 1 of the present invention is
A prismatic main body made of an insulating material, electrode parts arranged at both ends of the main body, a coil part connected to the electrode parts and arranged on the outer periphery of the main body between the electrode parts, and the coil part being covered. An insulating resin is provided, and the coil portion is formed by cutting a conductor layer covering the surface of the main body, and a recess is provided only on the upper surface and the lower surface of the outer periphery of the main body.
At least the insulating resin is provided in the recess of the lower surface.

With the above structure, the upper surface and the lower surface of the outer periphery of the main body are provided with the concave portions, and the insulating resin is provided at least in the concave portions of the lower surface of the main body. Therefore, even if the coil portion between the electrodes is covered with the insulating resin, The flatness of the bottom surface is good and mounting defects are unlikely to occur.

Furthermore, since the front surface of the main body is not provided with the concave portion, the main body can be easily taken out from the mold, the productivity is high, the cross-sectional area of the main body is not small, and the inductance is not easily small.

The invention according to claim 2 of the present invention is claim 1
In the invention described, while arranging the electrode portion also at least one end portion of the front end or the rear end of the main body,
The electrode section has a configuration in which a deletion section is provided by removing a part thereof.

With the above-described structure, since the deletion portion is provided by removing a part of the electrode portion, it is possible to improve the characteristics of the inductance adjustment and the no-load Q depending on the degree of the deletion portion.

The invention according to claim 3 of the present invention is the invention according to claim 1.
In the invention described above, an intermediate electrode is provided in an intermediate portion of the coil portion, and the intermediate electrode is exposed from the insulating resin.

With the above structure, there are two coil portions in the main body.
Since individual pieces are provided, the mounting rate can be improved.

The invention according to claim 4 of the present invention is the invention according to claim 1.
In the invention described above, a dielectric resin is provided in place of the insulating resin in the recess that covers the surface of the coil portion, and a strip-shaped conductor electrode portion is provided on the surface of the dielectric resin.

With the above structure, since the capacitor is formed between the coil portion and the conductor electrode portion, one chip coil can add the function of the filter by the two coil portions and the capacitor. it can.

(Embodiment 1) Hereinafter, a first embodiment of the present invention will be described with reference to the drawings.

FIG. 1 (a) is a perspective view of a chip coil before insulating resin coating according to the first embodiment of the present invention, FIG.
(B) is a perspective view of a chip coil. In FIG. 1A, reference numeral 1 denotes a horizontal prismatic body having a conductor layer on an insulating surface. Reference numeral 2 is a coil portion formed by spirally cutting the conductor layer on the outer peripheral surface of the main body 1. Reference numeral 3 denotes a deletion portion obtained by deleting a part of the front surface of the electrode portion 5 at both ends of the main body 1. 6
Is a recess provided only on the upper and lower surfaces of the outer peripheral surface of the main body 1. Further, in FIG. 1B, 4 is an insulating resin applied to the outer peripheral surface of the coil portion 2.

It should be noted that H is the height dimension of the main body 1 and W is the width dimension, and H is 0.7 mm and W is 0.5 mm.

As shown in FIGS. 1 (a) and 1 (b), the chip coil has a prismatic main body 1 made of an insulating material, and is arranged on the upper, lower, front, rear and end surfaces of both ends of the main body 1. The electrode portion 5, the coil portion 2 connected to the electrode portion 5 and arranged between the electrode portions 5, and the insulating resin 4 covering the coil portion 2 are provided.

The coil portion 2 is formed by cutting a conductor layer covering the outer peripheral surface of the main body 1.

The recess 6 is provided only on the upper and lower surfaces of the outer periphery of the main body 1, and the upper and lower surfaces of the main body 1 are
The insulating resin 4 is provided in the recess 6.

Further, the left and right front surfaces of the electrode portion 5 are provided with the deletion portions 3. The operation of the chip coil having the above structure will be described below.

First, FIG. 1A before the insulating resin 4 is provided.
In this state, the upper and lower surfaces of the main body 1 are aligned. That is, in the state of FIG. 1A, since the insulating resin 4 is not coated, the recess 6 is exposed on the upper surface and the lower surface of the main body 1. Therefore, the concave portion 6 is detected, the main body 1 is corrected so that the concave portion 6 becomes the upper and lower surfaces, and in that state, the insulating resin 4 is then covered and then attached to the tape member.
At this time, since the position of the main body 1 can be corrected by the recessed portion 6, the accuracy for correcting the directionality can be improved.

Further, the electrode portions 5 are also arranged at both ends of the lower surface of the main body 1 having the concave portions 6, but even if the insulating resin 4 is provided between the electrode portions 5, the insulating resin 4 is provided only in the concave portions 6. Since the surface of the electrode portion 5 and the surface of the insulating resin 4 are flat, the mounting failure on the printed circuit board or the like during mounting is unlikely to occur.

Further, since the concave portion 6 is not provided on the front surface of the outer periphery of the main body 1, the cross-sectional area of the main body 1 does not become small, and the concave portion 6 is not provided on the front surface and the rear surface of the main body 1. At this time, the main body 1 can be easily taken out from the mold, and the productivity is improved.

In addition, since the deletion section 3 in which a part of the electrode section 5 is deleted is provided in the electrode section 5 on the entire surface of the main body 1, the inductance is adjusted or the inductance is not adjusted by adjusting the deletion degree of the deletion section 3. The characteristics of the load Q can also be improved.

(Second Embodiment) A second embodiment of the present invention will be described below with reference to the drawings.

FIG. 2 is a partially cutaway perspective view of the chip coil according to the second embodiment, and FIG. 3 is an equivalent circuit diagram of the same chip coil.

In FIG. 2, the chip coil according to the second embodiment is the same as the chip coil according to the first embodiment except that an intermediate electrode 7 is provided at an intermediate portion of the coil portion 2 and the intermediate electrode 7 is exposed. It has a different structure.

An equivalent circuit diagram at this time is as shown in FIG. With the above structure, the coil portion 2 is
Since individual pieces are provided, the mounting rate can be improved.

(Third Embodiment) Hereinafter, a third embodiment of the present invention will be described with reference to the drawings.

FIG. 4 is a partially cutaway perspective view of the chip coil according to the third embodiment, and FIG. 5 is an equivalent circuit diagram of the same chip coil.

In FIG. 4, the chip coil according to the third embodiment is the same as the chip coil according to the first embodiment except that the surface of the dielectric resin 8 is replaced with the surface of the coil portion 2 covered with the insulating resin 4. Conductor electrode part 9 in strip shape
Is provided.

The equivalent circuit diagram at this time is as shown in FIG. As a result, a capacitor is formed between the coil part 2 and the conductor electrode part 9, so that the filter function can be added by the two coil parts 2 and the capacitor 10 with one chip coil. it can.

[0037]

As described above, according to the present invention, since the recesses are provided on the upper surface and the lower surface of the outer periphery of the main body and the insulating resin is provided at least in the recesses on the lower surface of the main body, the coil portion between the electrodes is insulated from the insulating resin. Even if it is covered with, the insulating resin does not protrude to the outside of the concave portion on the lower surface of the main body, the flatness of the lower surface of the main body is improved, and mounting defects are less likely to occur.

Since the front surface of the outer periphery of the main body is not provided with a recess, the cross-sectional area of the main body is not reduced, the inductance is not reduced, and the front and rear surfaces of the main body are not provided with a recess. At this time, the main body can be easily taken out from the mold, and the productivity can be improved.

Further, since the deletion portion is provided by deleting a part of the electrode portion, it is possible to improve the characteristics of the inductance adjustment and the no-load Q depending on the degree of deletion of the deletion portion.

In addition, if an intermediate electrode is provided in the intermediate portion of the coil portion and the intermediate electrode is exposed from the insulating resin, two coil portions are provided in the main body, so that the mounting rate can be improved and the coil can be improved. Instead of insulating resin coated on the surface of the part,
If a dielectric resin is used and a conductor electrode portion is provided in a strip shape on the surface of the dielectric resin, a capacitor is formed between the coil portion and the conductor electrode portion. The function of the filter can be added by the two coil portions and the capacitor.

[Brief description of drawings]

FIG. 1A is a perspective view of a chip coil before being coated with an insulating resin according to a first embodiment of the present invention. FIG. 1B is a perspective view of the same chip coil after being coated with an insulating resin.

FIG. 2 is a perspective view of a chip coil according to a second embodiment of the present invention.

FIG. 3 is an equivalent circuit diagram of the chip coil.

FIG. 4 is a perspective view of a chip coil according to a third embodiment of the invention.

FIG. 5 is an equivalent circuit diagram of the chip coil.

FIG. 6 is a partially cutaway perspective view of a conventional chip coil.

FIG. 7 is a partially cutaway perspective view of another conventional chip coil.

[Explanation of symbols]

 1 Main body 2 Coil part 3 Deletion part 4 Insulating resin 5 Electrode part 6 Recessed part

Claims (4)

[Claims] 1. A prismatic main body made of an insulating material, electrode parts arranged at both ends of the main body, a coil part connected to the electrode parts and arranged on the outer periphery of the main body between the electrode parts, An insulating resin coating a coil portion, the coil portion is formed by cutting a conductor layer coated on the surface of the main body, and a concave portion is provided only on an upper surface and a lower surface of the outer periphery of the main body, and at least a lower surface. Chip coil with insulating resin inside the recess. 2. The electrode part is arranged also at least at one end part of the front end part or the rear end part of the main body, and the electrode part is provided with a delete part, a part of which is deleted.
The described chip coil. 3. An intermediate electrode is provided at an intermediate portion of the coil portion,
The chip coil according to claim 1, wherein the intermediate electrode is exposed from the insulating resin. 4. The chip coil according to claim 1, wherein a dielectric resin is provided instead of the insulating resin in the recess, and a strip-shaped conductor electrode portion is provided on the surface of the dielectric resin.