JP2005079273A - Lc composite component - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an LC composite component to realize reduction in size of an electronic apparatus while the performances of a band-pass filter and a low-pass filter are maintained. <P>SOLUTION: The LC composite component comprises a base material 2, at least a pair of terminals 5a, 5b provided to the base material 2, a gap 4a provided between a pair of terminals 5a, 5b on the base material 2 to mutually make a pair of terminals 5a, 5b non-conductive, and at least a spiral portion 3a provided between the gap 4a and terminal 5a. <P>COPYRIGHT: (C)2005,JPO&NCIPI

Description

  The present invention relates to an LC composite component suitably used for electronic devices that perform wireless communication such as mobile communication and personal computers.

  In cordless phones and mobile phones, it is desired to reduce the size and the number of parts in order to reduce costs and downsize mobile phones. In addition, in portable mobile electronic devices such as notebook personal computers, the number of devices that perform data communication using a wireless LAN or the like is increasing, and it is desired to reduce the size and the number of components inside these electronic devices. .

  The LC composite component is often used as various filter circuits for the purpose of selectively passing a signal in a desired frequency band and attenuating an unnecessary signal in a wireless communication circuit. Examples of the filter include a band-pass filter that passes a frequency in a specific band, a low-pass filter that passes only a low-frequency band, and a high-pass filter that passes only a high-frequency band.

  Conventionally, these filters may be configured after an LC circuit is realized on a substrate of a wireless device using an inductor component and a capacitor component which are individual chip components. In addition, composite parts having a filter function such as a dielectric filter, a surface acoustic wave filter, and a laminated LC filter are also used, and a laminated LC filter is often used for wideband applications.

FIG. 16 is a cross-sectional view of a multilayer LC filter according to the conventional technique, and FIG. 17 is a perspective view of the multilayer LC filter according to the conventional technique.
Japanese Patent Laid-Open No. 11-146692 JP-A-1-259518

  However, since the conventional LC composite component such as a laminated LC filter is composed of electrodes inside the ceramics as is apparent from the cross-sectional view of FIG. 16, a complicated process is required and it is difficult to reduce costs. Further, since the process is complicated and the number of processes is increased, many factors of characteristic variation are included. In particular, since the circuit constants inside the filter cannot be finely adjusted in order to match the circuit pattern and impedance on the substrate when joining with an external circuit, an external matching circuit is required separately, making it difficult to reduce the size of the mobile terminal. There was a problem.

  Further, as is apparent from the perspective view of FIG. 17, in order to obtain a large inductance value in order to configure the inductance in a plane, there is a problem that it is difficult to keep the component size small in order to obtain a large inductance value.

  On the other hand, an arbitrary constant can be obtained by configuring the LC circuit with individual chip parts, and the degree of freedom in circuit board design is improved. However, the number of parts is increased and the mounting area is increased with respect to the composite part. However, there is a problem that it is difficult to reduce the size of electronic equipment. Of course, there is a problem that the cost increases due to the large number of parts.

An object of the present invention is to provide an LC composite component that can realize a reduction in size and a price of an electronic device such as a portable terminal while sufficiently ensuring the degree of design freedom of a circuit board used in a wireless communication device.

  The present invention relates to a base, at least a pair of terminal portions provided on the base, a gap portion provided on the base between the pair of terminal portions, and the pair of terminal portions being non-conductive with each other, and a gap And at least one spiral part provided between the terminal part and the terminal part.

  In the present invention, a spiral portion formed by trimming a part of a substrate covered with a conductive film as an LC composite component is used as an inductor component, and a gap portion provided over the entire circumference of the conductor is provided between the gap portions. By using a coupled capacitive component, an LC composite circuit can be configured.

  By connecting this LC composite component to a signal line on a circuit, a bandpass filter can be easily configured. Further, it is possible to easily configure a low-pass filter by providing a central terminal portion on the base and short-circuiting to the ground.

  By forming the spiral portion serving as the inductor component and the gap portion serving as the capacitance component by trimming with high accuracy and few processes, it is possible to provide an LC composite component with high yield and low cost. For this reason, the reliability of components is also very high.

  Needless to say, in the trimming, it is possible to form a very finely adjusted spiral, so that it is possible to form a highly accurate inductor component and capacitive component in one element body.

  In addition, the circuit constants can be set by trimming the substrate covered with the conductive film, making it possible to fine-tune and set the constants according to the wireless device board pattern, reducing the number of wireless device components, reducing costs, and mounting The area can be reduced, and the shape and performance specifications of the electronic device can be easily accommodated.

  Furthermore, since the inductor component can be three-dimensionally configured in a spiral shape, a large inductor value can be easily obtained, miniaturization of parts and reduction of the mounting area, and the shape and performance of electronic equipment. It can easily correspond to the specifications.

  Further, by arranging the spiral portion, the gap portion, and the terminal portion as a symmetrical circuit with respect to signal input / output, an LC composite component having no mounting direction can be provided.

  According to a first aspect of the present invention, there is provided a base, at least a pair of terminal portions provided on the base, and provided on the base and between the pair of terminal portions. An LC composite component comprising a gap portion to be conductive and at least one spiral portion provided between the gap portion and the terminal portion, wherein the LC composite component is a single and very small element. The electronic equipment can be shortened and miniaturized.

  The invention according to claim 2 of the present invention is the LC composite component according to claim 1, wherein the pair of terminal portions are connected on the signal line, and the band is formed as a series resonance circuit. Implement a pass filter.

The invention according to claim 3 of the present invention is characterized in that the spiral portion is provided only between one terminal portion and the gap portion of the terminal portions. The described LC composite component can realize a bandpass filter having a large inductor value.

  The invention according to claim 4 of the present invention is characterized in that the spiral portion is provided between each of the pair of terminal portions and the gap portion, and the spiral portion is disposed symmetrically with respect to the gap portion. 3. The LC composite component according to claim 1, wherein the component mounting direction is eliminated by eliminating the signal input / output direction with respect to the bandpass filter, thereby facilitating the mounting.

  The invention according to claim 5 of the present invention is the LC composite component according to any one of claims 1 to 4, wherein a plurality of spiral portions are provided between the terminal portion and the gap portion. Thus, the gap portion generates a capacitance and has a function of realizing a circuit having a lumped constant capacitance.

  The invention according to claim 6 of the present invention is the LC composite component according to any one of claims 1 to 5, wherein the gap portion is provided on the base and is provided at substantially the center of the pair of terminal portions. Thus, a symmetrical circuit can be reliably configured.

  The invention according to claim 7 of the present invention is the LC composite component according to any one of claims 1 to 6, wherein the gap portion is capacitively coupled, and the capacitance value is increased. Capacitance component and inductor component can be connected in series.

  The invention according to claim 8 of the present invention is the LC composite component according to any one of claims 1 to 7, characterized in that the gap portion is provided over the entire circumference of the substrate. Can be generated.

  According to a ninth aspect of the present invention, there is provided a base, a pair of terminal portions provided on the base, and a central terminal provided between the pair of terminal portions and electrically non-conductive with the pair of terminal portions. And a spiral part provided between the terminal part and the central terminal part, wherein the pair of terminal parts are connected on the signal line, wherein the low-pass filter Can be configured.

  The invention according to claim 10 of the present invention is the LC composite component according to any one of claims 1 to 9, wherein the LC composite component is a straight structure having substantially the same external shape. The process can be made easier.

  The LC composite component according to any one of claims 1 to 9, wherein the outer periphery of the substrate is stepped down at a portion other than the terminal portion and the central terminal portion. In this case, the contact between the gap portion or the spiral portion and the electronic substrate or the like is reduced, and the characteristic deterioration or the like is suppressed.

  The invention according to claim 12 of the present invention is the LC composite component according to any one of claims 1 to 11, wherein the substrate shape is any one of a prism, a cylinder, a triangular prism, and a polygonal prism, Variations such as ease of manufacturing and ensuring strength can be secured.

  According to a thirteenth aspect of the present invention, the spiral portion and the gap portion are formed by etching or laser trimming a conductive film applied to the substrate surface. The LC composite component according to 1, wherein the production process can be simplified and the productivity can be improved.

The invention according to claim 14 of the present invention is characterized in that a protective film for covering at least the spiral part and the gap part is provided in the base body.
It is a composite part, and damage to the element body can be prevented.

  The invention according to claim 15 of the present invention is the LC composite component according to claim 14, characterized in that either a coating paint or a tube-shaped resin is used for the protective film. Have

  The invention according to claim 16 of the present invention uses at least one of electrodeposition paint, transfer paint, glass, and low-temperature sintered ceramics as the coating paint. And it has the effect | action which improves durability.

  The invention according to claim 17 of the present invention is the LC composite component according to any one of claims 1 to 16, wherein ceramics having a relative dielectric constant of 1 to 150 is used as a base material. It can be simplified and productivity can be improved.

  The invention according to claim 18 of the present invention is the LC composite component according to any one of claims 1 to 17, wherein one of the pair of terminal portions is grounded, The number of mounted parts can be reduced, and the cost and size can be reduced.

  The invention according to claim 19 of the present invention is a receiving device including the LC composite component according to any one of claims 1 to 17, an antenna, a receiving unit, and a signal demodulating unit, wherein the number of mounting components is reduced. In addition, cost reduction and size reduction can be realized.

  Hereinafter, it demonstrates using drawing.

(Embodiment 1)
1, 2, 3, 6, and 9 are perspective views of the LC composite component according to Embodiment 1 of the present invention. 4, 7, and 10 are equivalent circuit diagrams of the LC composite component according to Embodiment 1 of the present invention. 5, FIG. 8 and FIG. 11 are diagrams showing simulation results in Embodiment 1 of the present invention.

  In FIG. 1, 1 is an LC composite component, 2 is a base, 3a and 3b are spiral portions, 4a is a gap portion, and 5a and 5b are terminal portions.

  The base 2 is made of an insulating material. As the constituent material of the substrate 2, materials such as barium titanate, alumina, alumina-based materials, forsterite, magnetic ferrite, silicon oxide, etc. are preferably used, and barium titanate having a large relative dielectric constant is mainly used. A large capacity can be obtained by using a dielectric material as a component, and an electronic component capable of handling high frequencies can be obtained by using a material mainly composed of alumina or alumina, and also has high strength and the like. Good workability. Further, a single layer or a plurality of conductive films made of a conductive material such as copper, silver, gold, nickel or the like are laminated on the base 2 to form a conductive surface. For the conductive film, plating, vapor deposition, sputtering, paste, CVD, printing, or the like is used. The relative dielectric constant of the ceramic used for the base material is preferably about 1 to 150.

  In FIG. 1, the base body 2 is represented by a quadrangular shape, but it may be a cylindrical body or a polygonal columnar body whose bottom surface is a pentagon or more.

The spiral portions 3a and 3b are provided over the entire circumference of the base 2 and form an inductance component. For example, the inductance value can be adjusted by adjusting the number of turns, groove width, groove depth, etc. of the spiral portions 3a, 3b. The spiral portions 3a and 3b are formed between the gap portion and the terminal portion. As shown in FIG. 1, the spiral portions 3a and 3b are provided between the gap portion 4a and each of the two terminal portions 5a and 5b. It may be provided, or may be provided only on one of the terminals 5a, 5b and the gap 4a. Further, when the spiral portions 3a and 3b are provided between the respective terminal portions 5a and 5b and the gap, the spiral portions 3a and 3b are formed symmetrically with respect to the gap portion 4a, thereby being symmetrical with respect to the gap portion 4a. It becomes a circuit, and the directionality of mounting LC composite parts can be eliminated. By eliminating the mounting direction, it works as a filter having the same characteristics described later, regardless of the direction of mounting, eliminating mounting errors and, as a result, improving yield and reducing costs. Can do.

  Further, two or more spiral portions may be provided between the terminal portions 5a and 5b and the gap portion 4a.

  The gap portion 4a generates a coupling capacitance on the opposing surface and forms a capacitance component. Here, the capacitance value can be adjusted by adjusting the groove width or the like of the gap portion, and a capacitance component can be formed according to the application.

  The terminal portions 5a and 5b are made of a conductive material. For example, when a conductive film is formed on the surface of the substrate 2, a conductive curtain is also formed on the surfaces of the terminal portions 5a and 5b. Alternatively, a multilayer conductive film may be further formed for the purpose of adjusting the conductive performance and strength. The terminal portions 5a and 5b are a pair of terminal portions provided on the base 2 and are usually formed at both ends. For example, when there are protrusions or the like at both ends, the terminals 5a and 5b are not at both ends. Also good. The terminal portions 5 a and 5 b may be provided on the end face of the base 2 and the side face of the base 1, respectively. However, the end face may be provided only on the side face of the base 2 without forming a conductive film. Alternatively, it may be formed only on a part of the side surfaces.

  Thus, a resonance state is generated by the inductor component and the capacitance component generated by the spiral portion and the gap portion. That is, in FIG. 1, the inductor value of the spiral portion 3a is L1, the inductor value of the spiral portion 3b is L2, and the coupling capacitance in the gap portion is C1, which is an equivalent circuit diagram shown in FIG.

  C0 is a parasitic capacitance generated between the terminals.

  At this time, since L1 and L2 are connected in series, the impedance Z is expressed by (Equation 1) by the combined inductor value and the capacitance C1, and the resonance frequency f0 is calculated from (Equation 2) which is the resonance condition. As is clear from (Equation 1) and (Equation 2), the impedance is minimum at the resonance frequency f0, the impedance in the band is low, and the impedance is high in the other bands.

  When the LC composite circuit 1 is mounted on a signal line and a signal is input from one of the terminal portions 5a and 5b and a signal is output from the other, the LC composite circuit 1 operates as a band-pass filter that passes only a signal in a certain band. .

  FIG. 5 shows experimental results of experiments using the LC composite component 1 as a bandpass filter, and shows experimental results based on the conditions shown in FIG. 4 representing an equivalent circuit. FIG. 5A shows the passband characteristic, FIG. 5B shows the wideband characteristic, FIG. 5C shows the return loss of the passband impedance characteristic, and FIG. 5D shows the passband impedance characteristic. The Smith chart display is shown.

  As is clear from FIG. 5A, a band pass filter that allows a signal in the vicinity of 900 MHz to pass through. Of course, since the inductor values L1 and L2 and the capacitance value C1 can be numerically adjusted, it is possible to change the bandpass frequency when the bandpass filter is used.

  In the first embodiment, the conductive film formed on almost the entire surface of the substrate 2 is trimmed with a laser, a grindstone, or the like to form the spiral portions 3a, 3b and the gap portion 4a. Alternatively, a resist may be provided on the conductive film formed almost over the entire surface using a photolithography technique, and etching may be performed.

  FIG. 2 shows an LC composite component provided with a protective film. FIG. 3 shows a case where the base body 2 is stepped down over the entire circumference excluding the terminal portions 5a and 5b.

  7 is a protective film, and 8 and 9 are bonding films. The protective film 7 is provided so as to cover at least the spiral portions 3a and 3b and the gap portion 4a. Of course, it may be provided on the entire circumference of the substrate 2 except for the terminal portions 5a and 5b. The protective film 7 is made of an insulating material, and a resin or ceramic is preferably used. Specifically, a resin material such as an epoxy resin or an insulating film such as silicon oxide can be used.

  The protective film 7 is formed using various methods such as coating, electrodeposition, and electrostatic coating. Moreover, you may form using a tubular protective film. The tube-shaped protective film is realized by attaching a tube-shaped protective film around the substrate 2 and applying heat to pressure-bond. Since the tubular protective film is formed so as to cover the spiral part and the gap part, the protective film does not flow into the groove of the spiral part or the gap part. For this reason, the antenna characteristic does not vary due to the provision of the tube-shaped protective film. Preferably, the tubular protective film is made of resin and has heat shrinkability. This is because the tube 2 is covered with a tube-shaped protective film and heat-treated to shrink the tube, and the tube-shaped protective film can be reliably formed on the substrate 2.

  Further, it is preferable to use any one of electrodeposition paint, transfer paint, glass, low-temperature sintered ceramics, or a combination thereof as the coating paint.

By providing the protective film 7, it is possible to prevent damage to the conductive film of the base 2 and damage to the spiral part and the groove of the gap part 4 a. In particular, it is possible to protect against impact and heat during transportation and mounting.

  The bonding films 8 and 9 are formed of Sn alone or so-called lead-free solder in which an element other than lead is added to Sn. In this embodiment, the bonding layer is provided to improve the bonding property when mounted on the circuit board. However, the bonding films 8 and 9 are particularly provided when the terminal portions 5a and 5b are sufficient. There is no need. More preferably, a nickel or nickel alloy film is provided to prevent solder erosion between the terminal portions 5a and 5b and the bonding films 8 and 9, and to prevent the weather resistance of the terminal portions 5a and 5b. Is preferred.

  In addition, as shown in FIG. 3, it is also preferable to provide stepped portions over the entire circumference leaving the terminal portions 5a and 5b in the base 2. This is because the provision of the stepped portion prevents the circuit board and the spiral portion from coming into direct contact during mounting, and does not affect the characteristics. Further, when the protective film 7 is provided, the height of the protective film 7 can be approximately the same as the height of the terminal portions 5a and 5b, so that mounting defects of the terminal portions 5a and 5b do not occur during mounting. Also, problems such as device standing do not occur. Furthermore, the protective film 7 can be formed thick, and the weather resistance of the spiral portions 3a, 3b, etc. can be improved. Of course, it is needless to say that the same effects as those shown in FIGS.

  In the conventional technology as the LC composite component, the 1608 size of the laminated LC filter is the smallest, but in the embodiment of the present invention, an inductance of 1 to 56 nH can be obtained in the spiral conductor at the 1005 size, further 0603 size. In addition, by using ceramics having a relative dielectric constant of 1 to 150 as a base material, a gap of 0.1 to 10 pF can be obtained with a gap having a width of 0.01 to 0.1 mm. The LC composite component can be realized, and the filter can be configured with a very small component compared to the conventional multilayer LC filter. By reducing the size of the components, the mounting area can be reduced, and the electronic device incorporating this as a whole can be reduced in size.

  Next, with the configuration shown in FIG. 6, it is possible to configure a low pass filter instead of a band pass filter.

  Reference numeral 5 c denotes a central terminal portion, 4 c denotes a gap portion, and the central terminal portion 5 is formed between the pair of terminal portions 5 a and 5 b in the base 2. A groove is provided around the entire circumference by the gap portion 4 c, and the central terminal portion 5 c is electrically disconnected from the base 2. In addition, as FIG. 6 shows, spiral part 3a, 3b is each provided between the center terminal part 5c and the terminal parts 5a, 5b, and the center terminal part 5c is provided in the approximate center, so that the center terminal Since the circuit can be symmetric with respect to the portion 5c, an LC composite component having no directionality in mounting can be formed. When the spiral portion is provided only between one of the terminal portions 3a and 3b and the central terminal portion 5c, the central terminal portion 5c is not at the central portion of the base 2 but at a position shifted to one. May be. In addition, as shown in FIG. 6, the straight structure with no stepping is advantageous in that the process can be simplified and the cost can be reduced.

  Here, since the central terminal portion 5c is surrounded by a groove and electrically disconnected from the periphery, a coupling capacitance is generated between the central terminal portion 5c and the base body 2, and a capacitive component is generated. Occurs. Further, since the spiral portions 3a and 3b generate inductor components as in the case of FIG. 1 and are electrically conducted on the upper surface of the base 2, the inductor components of the spiral portions 3a and 3b are connected in series.

  FIG. 7 shows an equivalent circuit of the LC composite component shown in FIG.

As is apparent from the equivalent circuit of FIG. 7, a T-type low-pass filter (hereinafter referred to as “LPF”) is configured by connecting the central terminal portion 5 c to the ground. That is, the terminal portions 5a and 5b and the center terminal portion 5c are shorted to the ground, and the inductor component L1 and the capacitance component C1 are connected in parallel.

  FIG. 8 shows a simulation result of frequency characteristics of the LC composite component having the structure shown in FIG. 6 and the inductor value and the capacitance value shown in the equivalent circuit of FIG. As is clear from the simulation results, a low-pass filter having a cutoff frequency around 1.8 GHz is configured. For example, it can be used as a low-pass filter for noise cut in mobile phones such as Japanese PHS and GSM1800. Of course, it is possible to change the cut-off frequency by changing the inductor value and the capacitance value by changing the number of turns of the spiral part, the groove width of the central terminal part 5c, and the like.

  Furthermore, as shown in FIG. 9, two gap portions 4a and 4b are arranged between the spiral portions 3a and 3b, and a region sandwiched between the gap portions 4a and 4b is defined as a central terminal portion 5c. By connecting to the ground, capacitance is generated between the central terminal portion 5c and the spiral portions 3a and 3b. Capacitance coupling is made to the center terminal portion 5c through the generated capacitance, and the center terminal portion 5c is connected to the grounding portion. Further, a series capacitance is also generated between the spiral portions 3a and 3b. From the above, the equivalent circuit is as shown in FIG.

  As is clear from the equivalent circuit of FIG. 10, the LC composite component of FIG. 9 is configured as a band-pass filter having a two-stage resonator. FIG. 11 shows a simulation result when the LC composite component shown in FIG. 9 has the inductor value and the capacitance value entered in the equivalent circuit diagram of FIG. As is apparent from the simulation results, the bandpass filter has improved pass characteristics.

  In addition, since the LC composite component shown in FIG. 9 can be formed with a very small element such as 0603, it is extremely small compared to an LC composite component composed of a conventional laminated type. Thus, the mounting area can be reduced and the electronic equipment to be incorporated can be downsized.

  In addition, it is very easy to adjust the numerical values because the inductor and inductor value can be determined by trimming after the inductor is configured inside the laminate, compared to a multilayer LC composite component that uses the multilayer part as a capacitive component. It is. In particular, the inductor value and the capacitance value can be determined at the same time by the trimming process, and the inductor and the capacitance can be formed by the same kind of work. Therefore, after the inductor is formed by transfer or printing, lamination is performed. Compared with a laminated type LC composite component that requires a complicated process such as, the process is greatly simplified. By simplifying the process, variation can be suppressed and low cost can be realized.

  In addition, since high-precision means of trimming is used, high-accuracy parts are realized, and variations in capacitance values and inductor values that can inevitably occur when stacking are reduced, resulting in higher yields and easier cost reduction. It is possible to realize. Further, since the coupling capacitance of the gap portion 4a can be used as the capacitance component, there is an advantage that the determination and fine adjustment of the capacitance component is facilitated.

  From the above, it is possible to realize an LC composite component that has a high yield and a low cost and is very small and highly accurate.

(Embodiment 2)
Next, the construction method of the LC composite part will be described.

12, 13 and 14 are construction method diagrams of the LC composite component according to Embodiment 2 of the present invention.

  10 is a rotation support base, 11 is a motor, 12 is a laser irradiator, 13 is a substrate with a conductive film, and 14 is a spiral groove. As described in the first embodiment, the conductive film-coated substrate 13 is formed by subjecting an insulator or dielectric material such as alumina or a ceramic material mainly composed of alumina to a pressing process, an extrusion method, or the like. Furthermore, the conductive film of the base body with conductive film 13 is formed by laminating a single layer or a plurality of conductive films made of a conductive material such as copper, silver, gold, or nickel.

  As shown in FIG. 12, a substrate 13 with a conductive film is installed on the rotation support base 10, rotated by a motor 11, and a laser beam is irradiated from the laser irradiator 12 onto the substrate 13 with a conductive film. The spiral groove 14 is formed by moving at least one of the rotation support bases 10. At this time, the spiral groove 14 is reliably excavated beyond the conductive film, and the spiral conductive film remains, thereby forming the spiral portions 3a and 3b having the spiral conductive film.

  Further, as shown in FIG. 13, the base 13 with a conductive film is installed on the rotation support base 10, and is rotated by the motor 11, and the base 13 with a conductive film is irradiated with a laser beam from the laser irradiator 12, whereby the gap groove 4 a, 4b is formed.

  Further, as shown in FIG. 14, a base 13 with a conductive film is installed on the rotation support base 10 and is rotated by a motor 11, and a laser beam is intermittently applied to the base 13 with a conductive film from a laser irradiator 12. The gap groove 4c is formed by moving at least one of the irradiator 12 or the rotary support base 10, and at this time, the gap groove 15 is reliably excavated beyond the conductive film, and an independent conductive film remains, thereby A central terminal portion 5c having an independent conductive film is formed.

  12, 13, and 14 are programmed to control the laser irradiation ON / OFF, the motor rotation, and the movement of at least one of the laser irradiator 12 or the rotation support base 10, and a plurality of spiral portions on the same substrate. A gap portion can be formed.

  Moreover, after forming the spiral groove 14 over a certain width, the laser irradiation from the laser irradiator 12 is stopped, whereby the conductor portion 8 in which the spiral groove 14 is not formed is formed on the substrate with conductive film 13. . By repeating this a desired number of times, a plurality of spiral portions 2 having a spiral groove 14 and a plurality of conductor portions 8 are alternately formed. Note that a cutting process such as a grindstone may be used instead of laser irradiation. Of course, when only one spiral portion is formed, laser irradiation is performed only at one location, and laser irradiation is terminated.

(Embodiment 3)
FIGS. 15A and 15B are schematic views of a part of the electronic circuit according to the third embodiment of the present invention. It is a part of electronic circuits of various electronic devices such as wireless terminals. 31 and 32 are signal lines. Reference numerals 33 and 34 denote ground lines. 35 is an LC composite component of the present invention. In FIG. 15a, the terminals 5a and 5b of the LC composite component 35 are connected to signal lines 31 and 32, and the signal input from 31 is subjected to a filtering process having a passband center frequency at the resonance frequency of the LC composite component of the present invention. Can be configured to output to the signal line output 32.

  In FIG. 15b, the terminal 5a of the LC composite component 35 is connected in parallel to the signal lines 31, 32, and the terminal 5b is connected to the 33, 34 ground lines. In this case, the LC composite component of the present invention operates as a resonator, and constitutes a notch filter circuit that outputs a signal obtained by filtering the signal input from 31 having an attenuation pole at the resonance frequency of the LC composite component of the present invention to 32. it can.

  By incorporating such a circuit, it can be used as a low-pass filter for noise removal, a band-pass filter for frequency selection of received signals, or a notch filter for signal extraction. be able to. At this time, since the LC composite component 35 can be configured as a very small element body, the electronic circuit can also be miniaturized, and as a result, the electronic apparatus in which the LC composite component 35 is incorporated is miniaturized. In addition, since the LC composite parts are high in yield and low in cost, it is possible to reduce the cost of electronic devices, reduce malfunctions after mounting, and increase the reliability of electronic devices. Become.

  A base, at least a pair of terminal portions provided on the base, at least one spiral portion provided between the base and the pair of terminal portions, and a base between one of the terminal portions and the spiral portion By providing the gap portion that makes the pair of terminal portions non-conductive, the filter performance can be secured and the electronic device can be applied to applications where downsizing and cost reduction are indispensable.

The perspective view of LC composite component in Embodiment 1 of this invention The perspective view of LC composite component in Embodiment 1 of this invention The perspective view of LC composite component in Embodiment 1 of this invention Equivalent circuit diagram of LC composite component in Embodiment 1 of the present invention The figure which shows the simulation result in Embodiment 1 of this invention The perspective view of LC composite component in Embodiment 1 of this invention Equivalent circuit diagram of LC composite component in Embodiment 1 of the present invention The figure which shows the simulation result in Embodiment 1 of this invention The perspective view of LC composite component in Embodiment 1 of this invention Equivalent circuit diagram of LC composite component in Embodiment 1 of the present invention The figure which shows the simulation result in Embodiment 1 of this invention Construction method diagram of LC composite part in Embodiment 2 of the present invention Construction method diagram of LC composite part in Embodiment 2 of the present invention Construction method diagram of LC composite part in Embodiment 2 of the present invention (A) Schematic of a part of an electronic circuit according to Embodiment 3 of the present invention (b) Schematic of a part of an electronic circuit according to Embodiment 3 of the present invention Sectional view of LC composite parts in the prior art Perspective view of LC composite parts in the prior art

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 LC composite component 2 Base | substrate 3a, 3b Spiral part 4a, 4b, 4c Gap part 5a, 5b Terminal part 5c Center terminal part 7 Protective film 8, 9 Bonding film 10 Rotation support stand 11 Motor 12 Laser irradiator 13 Base with conductive film 14 Spiral groove 15 Gap groove 31 Signal line input 32 Signal line output 33 Ground line input 34 Ground line output

Claims (19)

A substrate;
At least a pair of terminal portions provided on the base;
A gap provided on the base body and between the pair of terminal portions, wherein the pair of terminal portions are mutually non-conductive;
An LC composite component comprising at least one spiral portion provided between the gap portion and the terminal portion. The LC composite component according to claim 1, wherein the pair of terminal portions are connected on a signal line. The LC composite component according to claim 1, wherein the spiral portion is provided only between one terminal portion of the terminal portions and the gap portion. The spiral part is provided between each of the pair of terminal parts and the gap part, and the spiral part is arranged symmetrically with respect to the gap part. Or the LC composite part according to 1. The LC composite component according to any one of claims 1 to 4, wherein a plurality of the spiral portions are provided between the terminal portion and the gap portion. The LC composite component according to any one of claims 1 to 5, wherein the gap portion is provided on the base and substantially at the center of the pair of terminal portions. The LC composite component according to claim 1, wherein the gap portion is capacitively coupled. The LC composite component according to claim 1, wherein the gap portion is provided over the entire circumference of the base body. A substrate;
A pair of terminal portions provided on the base;
A central terminal portion provided between the pair of terminal portions and electrically non-conductive with the pair of terminal portions;
Having a spiral portion provided between the terminal portion and the central terminal portion;
The LC composite component, wherein the pair of terminal portions are connected on a signal line. The LC composite component according to any one of claims 1 to 9, wherein the LC composite component has a straight structure having substantially the same external shape. 10. The LC composite component according to claim 1, wherein an outer periphery of the base body is stepped down at a portion other than the terminal portion and the central terminal portion. The LC composite component according to claim 1, wherein the base shape is any one of a prism, a cylinder, a triangle, and a polygon. The LC composite component according to claim 1, wherein the spiral portion and the gap portion are formed by etching or laser trimming a conductive film applied to the surface of the substrate. The LC composite component according to claim 1, wherein a protective film that covers at least the spiral portion and the gap portion is provided on the base body. 15. The LC composite component according to claim 14, wherein either the coating paint or the tube-shaped resin is used for the protective film. The LC composite component according to claim 15, wherein at least one of electrodeposition paint, transfer paint, glass, and low-temperature sintering ceramics is used as the coating paint. The LC composite component according to claim 1, wherein ceramics having a relative dielectric constant of 1 to 150 is used as the base material. The LC composite component according to claim 1, wherein one of the pair of terminal portions is grounded. A receiver comprising the LC composite component according to claim 1, an antenna, a receiver, and a signal demodulator.

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