JPH0951121A - Light semiconductor device and its manufacture - Google Patents

Abstract

PROBLEM TO BE SOLVED: To reduce a packaging area by miniaturizing a photo-coupling semiconductor device. SOLUTION: A light emitting element 21 is die-bonded onto a lead 12 and a light emitting element 32 is wire-bonded to a lead part 23a which is formed in one piece with the lead 12 while being insulated by an insulator 31 by a wire 33. A light reception element 34 is die-bonded to another lead 12 and the light reception element 34 wirebonded to a lead part 23a which is formed in one piece with the lead 12 while being insulated by the insulator 31 by a wire 35. The light emitting element 32 and the light reception element 34 are optically coupled by an inner package 36 and the inner package 36 is molded by an outer package 37. Each lead 12 is partially extended to the outside from the outer package 37 and the surface of each lead part 23a is exposed from the surface of the outer package 37.

Description

Detailed Description of the Invention

[0001]

The present invention relates to a light emitting semiconductor device,
The present invention relates to an optical semiconductor device such as a light receiving semiconductor device and an optically coupled semiconductor device, and a manufacturing method thereof.

[0002]

2. Description of the Related Art In an optically coupled semiconductor device in which an input electric signal is converted into an optical signal by a light emitting element and the optical signal is received by a light receiving element and converted into an electric signal, an input side and an output side are electrically connected. The electrical signal can be transmitted in a physically insulated state.

An example of such an optically coupled semiconductor device is shown in FIG.
8 shows. In this optically coupled semiconductor device, a lead 6 in which a light emitting element 61 is die-bonded to a tip end portion by a conductive paste
2, a lead 64 to which the light receiving element 63 is die-bonded to the tip by a conductive paste, an inner package 68 made of a light-transmissive resin for molding the light emitting element 61 and the light receiving element 63, and a light-shielding resin for molding the inner package 68. And an outer package 69 made of the same.

The light emitting element 61 and the light receiving element 63 are in a state of facing each other so as to be optically coupled, and the light emitted from the light emitting element 61 is received by the light receiving element 63. There is. Each lead 62 and 64
Extend in different directions from the inner package 68 and the outer package 69 to the outside in a state of being located in the same plane so that the light emitting element 61 and the light receiving element 63 are respectively provided with appropriate insulation intervals. It is bent.

The light emitting element 61 is wire-bonded to a lead (not shown) arranged side by side to the lead 62 by a bonding wire 65 made of a gold wire or the like. In order to relieve the stress caused by the package 68, it is molded together with the bonding wire 65 by a translucent resin 66 such as a silicone resin.

The light receiving element 63 is also wire-bonded to a lead (not shown) arranged side by side with the lead 64 by a bonding wire 67 formed of a gold wire or the like.

As described above, the leads 62 and 64 extend in different directions from the inner package 68 and the outer package 69, respectively, and are arranged side by side on the leads 62 and 64 to form the bonding wire 65. The leads to which 67 and 67 are connected also extend outward from the inner package 68 and the outer package 69 in different directions.

Such an optically coupled semiconductor device is manufactured as follows. A pair of lead frames is prepared, and each lead of each lead frame is bent and formed in advance. In this state, the light emitting element 61 is die-bonded to the tip portion of the lead 62 of one lead frame by a conductive paste, and the light receiving element 63 is attached to the tip portion of the lead 64 of the other lead frame by a conductive paste. Die bond. Then, the light emitting element 61 is wire-bonded to the lead arranged on the side of each lead 62 by a bonding wire 65 such as a gold wire, and the light receiving element 63 is also provided.
Are wire-bonded to the leads arranged on the sides of each lead 64 by a bonding wire 67 such as a gold wire. After that, in order to relieve the stress on the light emitting element 61, a translucent resin 66 such as a silicone resin is applied to the light emitting element 61.
Pre-coat around.

In such a state, the light emitting element 61 and the semiconductor light receiving element 63 are optically coupled to each other by spot welding the lead frames to which the light emitting element 61 and the light receiving element 63 are die-bonded, or by a loading frame set. So that they face each other. Then, primary transfer molding is performed using a translucent epoxy resin or the like so that the light emitting element 61 and the light receiving element 63 are fixed in an optically coupled state, and an inner package 68 is formed. Then, after deburring the formed inner package 68, secondary transfer molding is performed using a light-shielding epoxy resin or the like to form the outer package 69.

After that, each lead frame is externally plated to remove unnecessary tie bars, and each lead 6
Forming into a predetermined shape so that 2 and 64 serve as external terminals. Then, through a withstand voltage test for evaluating the insulation between the lead 62 provided with the light emitting element 61 and the lead 64 provided with the light receiving element 63, an electrical characteristic inspection, an appearance inspection, and a packaging process, FIG. The semiconductor optical coupling device shown in FIG.

FIG. 19 is a sectional view showing another example of the optically coupled semiconductor device. In this optically coupled semiconductor device, when the optically coupled semiconductor device shown in FIG. 18 is manufactured, a light transmissive resin such as a silicone resin is used as the light emitting element 61 without molding the light emitting element 61 with the light transmissive resin 66. An inner package 71 that is injected into the light receiving element 63 and optically coupled integrally is formed, and an outer package 72 is formed by secondary transfer molding using a light-shielding epoxy resin. Other configurations are as follows. It is similar to the optically coupled semiconductor device shown in FIG.

[0012]

In these conventional optical coupling semiconductor devices, the light emitting element 61 and the light receiving element 63 are die-bonded to the leads 62 and 64, respectively, and the light emitting element 61 and the light receiving element 63 are wire-bonded to each other. Since the leads are arranged side by side in the lateral direction, the size of the entire device is large, and the presence of the leads serving as external terminals also increases the mounting area. Recently, there has been a particular demand for downsizing and high added value of electronic devices and electronic devices, and it is also desired to downsize the optically coupled semiconductor device so that the mounting area becomes small.

The present invention solves such a problem, and an object thereof is to provide an optical semiconductor device having a small size and a small mounting area, and a manufacturing method thereof.

[0014]

An optical semiconductor device of the present invention includes a pair of first conductors that are die-bonded in a state in which a light emitting element and a light receiving element are optically coupled, and a first first conductor.
The light emitting element and the light receiving element are optically integrated with each other, and are paired with the light emitting element and the light receiving element by wire bonding with a bonding wire. It is equipped with an inner package made of translucent resin that is molded together with each bonding wire in a bonded state, and an outer package that molds the inner package. A part of one of the pair of conductors is separated from the outer package. Each of the pair of conductors extends to the outside and the surfaces of the other pair of conductors are exposed from the surface of the outer package.

The first conductors and the second conductors are
The conductive pattern is layered on the substrate in an insulated state.

The optical semiconductor device of the present invention has a plurality of such optical semiconductor devices, and the conductors of any of the adjacent optical semiconductor devices are integrated.

Furthermore, the optical semiconductor device of the present invention is integrated with a first conductor, to which one of the light emitting element and the light receiving element is die-bonded, in an insulated state with respect to the first conductor. The optical semiconductor element and the bonding wire are molded such that the second conductor wire-bonded to the optical semiconductor element by a bonding wire and a part of one of the pair of conductors extend to the outside. And a package made of a translucent resin, the surfaces of the other pair of conductors being exposed from the surface of the package.

According to the method of manufacturing an optical semiconductor device of the present invention, a light emitting element is die-bonded to one conductor of a base integrated with a pair of conductors insulated, and the light emitting element is bonded to the other conductor. The step of wire-bonding to and the die-bonding of the light-receiving element to one of the conductors of the other base, which is integrated in a state where the pair of conductors are insulated, and the light-receiving element to the other conductor are wire-bonded by a bonding wire. Bonding step and arranging the bases so that the light emitting element and the light receiving element are optically coupled to each other, and molding the light emitting element and the light receiving element together with a bonding wire with an optically transparent resin to form an inner package. So that one conductor of each base is in an extended state and the other conductor of each base is molded respectively. So as to be exposed from the surface, characterized in that it comprises a step of forming an outer package by molding the inner package with a resin, the.

Further, in the method for manufacturing an optical semiconductor device of the present invention, a step of die-bonding either one of the light emitting element and the light receiving element to one of the pair of conductors integrated in an insulated state. And a step of wire-bonding the die-bonded optical semiconductor element to the other conductor with a bonding wire, and so that one conductor is in an extended state and the other conductor is exposed from the surface of the mold. As described above, the step of molding the optical semiconductor element together with the bonding wire with the transparent resin is included.

[0020]

Embodiments of the present invention will be described below in detail with reference to the drawings.

FIG. 1 is a sectional view showing an example of an embodiment of an optically coupled semiconductor device of the present invention, and FIG. 2 (a) is a side view thereof.
(B) is the top view, (c) is the bottom view. As shown in FIG. 1, this optically coupled semiconductor device has a first die-bonded light emitting element 32 such as a light emitting diode (LED).
An inner package composed of a lead 12 which is a conductor, a lead 12 which is a first conductor to which a light receiving element 34 such as a phototransistor is die-bonded, and a translucent resin which molds the light emitting element 32 and the light receiving element 34. 36 and an outer package 37 made of a light-shielding resin that molds the inner package 36.

The leads 12 are separated from each other by a predetermined insulating distance in the same plane, and are separated from each other in the inner package 36 and the outer package 3.
It extends from 7 to the outside. The light emitting element 32 is die-bonded to the tip of one of the leads 12 located in the inner package 36 by a conductive paste, and the tip of the other lead 12 located in the inner package 36 is The light receiving element 34 is die-bonded with a conductive paste. The light emitting element 32 and the light receiving element 34 are arranged so as to face each other so as to be optically coupled, and the light emitted from the light emitting element 32 is received by the light receiving element 34.

On the surface of each lead 12 opposite to the surface on which the light emitting element 32 and the light receiving element 34 are die-bonded, an insulating material 31 made of insulating paste, pellets, polyimide-based insulating sheet, or the like is used.
The header leads 23, which are conductors, are joined together. Each header lead 23 is parallel to each lead 12 with a proper distance from the tip of each lead 12, and as shown in FIG. A lead portion 23a protruding toward one side is provided. The lead portions 23a of the leads 23 are in a state of being appropriately spaced from each other, and both end faces of the leads 23 are exposed from the outer package 37.

The lead portion 23a adjacent to the light emitting element 32
Is a bonding wire 3 composed of a gold wire or the like.
3 is wire-bonded to the light emitting element 32,
The lead portion 23a adjacent to the light receiving element 34 is wire-bonded to the light receiving element 34 by a bonding wire 35 formed of a gold wire or the like.

The light emitting element 32 and the light receiving element 34 are integrally formed with a portion near each die-bonded lead 12 and the bonding wires 33 and 35 by an inner package 36 made of a translucent resin such as silicone resin. It is molded. And
The inner package 36 is molded by an outer package 37 made of a light-shielding resin such as a light-shielding epoxy resin.

Each lead 12 has an outer package 37.
From the lead portion 23a
It is bent at a right angle to the side and further bent at a right angle to the outside. The surface of each lead portion 23a opposite to the surface to which the bonding wires 33 and 35 are bonded is located in the same plane as the surface of the outer package 37 and exposed from the surface of the outer package 37. ing. Each side portion of the header lead 23 provided with the lead portion 23a has an outer package 37
It is exposed from each side of.

Such an optically coupled semiconductor device is manufactured as follows. First, the first lead frame 10 as shown in FIG. 3 is prepared. This first lead frame 10
Has a cradle 11 that extends linearly and a plurality of leads (first conductors) 12 that extend in a vertical state with respect to the cradle 11. The tips of the leads 12 are not connected to each other and are in a free state. The cradle 11 is provided with a plurality of positioning holes 11a at equal intervals.

The second lead frame 20 shown in FIG.
Is also prepared. The second lead frame 20 includes a cradle 21 extending linearly and a plurality of vertical tie bars 2 extending vertically to the cradle 21.
And 2. The cradle 21 is provided with a plurality of positioning holes 21a at equal intervals. Then, the tip portions of the vertical tie bars 22 are connected to each other by a header lead 23 which is parallel to the cradle 11. The header lead 23 is provided with lead portions 23 a projecting to the far side of the cradle 11 between adjacent vertical tie bars 22. Each of the vertical tie bars 22 is in a state in which the portions near the header leads 23 are connected to each other by a tip side tie bar 24 which is orthogonal to each of the vertical tie bars 22.

Cradle 11 of first lead frame 10
And the cradle 21 of the second lead frame 20 have the same width dimension, and the distance from the cradle 11 in the first lead frame 10 to the tip of each lead 12 is
It is equal to the distance from the cradle 21 in the second lead frame 20 to the outer side edge of the header lead 23. Then, each lead portion 23a provided on the header lead 23 of the second lead frame 20 is in a laterally spread state with a dimension equal to the width direction dimension of each lead 12 of the first lead frame 10.

The prepared first lead frame 10 and second
As shown in FIG. 5, the cradle 11 and 21 are overlapped with the lead frame 20 so that the lead 12 and the vertical tie bar 22 extend in the same direction. In this case, the leads 12 of the first lead frame 10 are stacked so that the lead portions 23a on the header leads 23 of the second lead frame 20 are located laterally on the tip side. Then, the tips of the leads 12 in each of the first lead frames 10 and the header leads 23 of the second lead frame 20 facing the tips are insulated from each other by insulating paste, pellets, polyimide-based insulating sheet, or the like. The object 31 is joined in an insulated state. Thus, the base body 30 is formed in which the first lead frame 10 and the second lead frame 20 are joined in parallel while being insulated from each other.

In this way, the first lead frame 10
And two sets of the base bodies 30 are prepared in which the second lead frames 20 are overlapped and joined by the insulator 31. Then, as shown in FIG. 6, the light emitting elements 32 are die-bonded to the tip ends of the leads (first conductors) 12 of the first lead frame 10 on one of the bases 30, respectively, and the light emitting elements 32 are die-bonded with a conductive paste or the like. 32 and each lead portion 23a of the header lead 23 in the second lead frame 20 are wire-bonded by a bonding wire 33 formed of a gold wire or the like. The respective light emitting elements 32 are die-bonded so that their respective light emitting surfaces face the sides of the lead 12 on the tip end side.

As shown in FIG. 7, the other base 30 is also provided at the tip of each lead 12 in the first lead frame 10.
Each light receiving element 34 is die-bonded, and each light receiving element 34 and each lead portion 23a of the header lead 23 in the second lead frame 20 are wire-bonded by a bonding wire 35 formed of a gold wire or the like. Each light receiving element 34 has a light receiving surface
The lead 12 is die-bonded so as to be directed to the side of the tip end side.

In this case, the light emitting element 32 and the light receiving element 3
4 is die-bonded to the lead portions 12 and 22 of the first lead frame 10 and the second lead frame 20 in advance, and the first lead frame 1 is formed by the insulator 31.
0 and the second lead frame 20 are joined, and thereafter,
The light emitting element 32 and the light receiving element 34 may be wire-bonded to the lead portions 23a by the bonding wires 33 and 35.

Thereafter, as shown in FIG. 7, each light emitting element 3
In the same plane, the base body 30 to which 2 is die-bonded and the base body 30 to which each light-receiving element 34 is die-bonded are arranged such that the lead portions 23a of the header leads 23 in the respective base bodies 30 are spaced apart from each other by a certain distance. The light emitting surface of each light emitting element 32 and the light receiving surface of each light receiving element 34 face each other.
Then, as shown in FIG. 8, the lead portions 2 facing each other.
The light emitting element 32 and the light receiving element 34, which are die-bonded close to 3a, are molded together with the bonding wires 33 and 35 with a translucent resin such as a silicone resin, a polyimide resin, or a silicone modified epoxy resin. The translucent resin is respectively molded on the lead portions 23a arranged close to each other to form the inner packages 36, respectively. As a result, the leads 23a arranged in close proximity to each other are positioned outside the inner package 36, and the inner packages 36 also bond the bases 30 to each other.

The distance between the bases 30 joined by the inner packages 36 is set based on the insulation distance between the light emitting element 32 and the light receiving element 34 arranged in the inner package 36.

In such a state, as indicated by hatching in FIG. 9, secondary transfer molding is performed using a light-shielding epoxy resin or the like so as to mold the inner package 36. In this case, the epoxy resin is used for each base 3
During 0, the whole state is filled. After that, as shown by a chain double-dashed line in FIG. 9, unnecessary epoxy resin portions between the bases 30 are removed as burrs. As a result, an outer package 37 made of light-shielding resin is formed by molding each inner package 36.

In such a state, the leads 12, 23, etc. of each first lead frame 10 extending from the outer package 37 are respectively subjected to exterior plating, and thereafter, as shown by hatching in FIG. The portions of the vertical tie bar 22, header lead 23, and tie bar 24 extending from the outer package 37 of the second lead frame 20 in the base body 30 are removed by tie bar cutting. Then, each lead 12 is cut from the cradle 11 and extended from the outer package 37.
2 and 22 are each bent into a predetermined shape so as to serve as external terminals, and the optically coupled semiconductor device shown in FIGS. 1 and 2 is formed.

Thereafter, a withstand voltage test and electric characteristics for evaluating the insulation between the lead 12 and the lead portion 23a to which the light emitting element 32 is connected and the lead 12 and the lead portion 23a to which the light receiving element 34 is connected. Inspection, visual inspection,
An optical coupling semiconductor device is obtained through a packaging process and the like.

In such an optically coupled semiconductor device, the light emitting device 32 and the light receiving device 3 are provided from the outer package 37.
Since only the leads 12 to which 4 are die-bonded are extended to the outside as external terminals,
The number of leads extending from the outer package 37 is reduced, and the optical coupling semiconductor device is downsized. Moreover, since the lead portions 23a to which the light emitting element 32 and the light receiving element 34 are wire-bonded are exposed to the outside while being positioned in the same plane as the surface of the outer package 37, the respective lead portions 23a are exposed to the circuit board. Can be directly mounted, and the area required for mounting the optically coupled semiconductor device on the circuit board can be reduced.

In the above embodiment, the outer package 37 for molding the pair of the optically coupled light emitting element 32 and the light receiving element 34 is tie bar cut so as to be separated one by one. However, as shown in FIG. 11, the tie bar may be cut so that the pair of outer packages 37 are integrated. In this case, as shown by the diagonal lines in FIG. 12, each header lead 23 located between the pair of outer packages 37 to be connected is left in a connected state, and each outer package 37 is
Are connected by a pair of header leads 23.

As shown in FIG. 13, the tie bar may be cut so that the three outer packages 37 are integrated. In this case, as shown by the diagonal lines in FIG. 14, the pair of header leads 23 located between the outer packages 37 to be coupled are left in a coupled state.
A pair of adjacent outer packages 37,
They are connected by a pair of header leads 23.

Similarly, it is possible to make an optically coupled semiconductor device in which four or more outer packages 37 are connected.

FIG. 15 shows four outer packages 37.
2 shows an optically coupled semiconductor device having a. In this optical coupling semiconductor device, a pair of outer packages 37 in the central portion are connected by one header lead 23 on the light emitting element 32 side, and a pair of outer packages located on each side portion. The packages 37 are connected by one header lead 23 on the light receiving element 34 side. Such an optically coupled semiconductor device is
The light emitting elements 32 in each of the pair of outer packages 37 located in the central portion are connected to each other by the header leads 23, but the light emitting elements in each outer package 37 located on each side portion. Since the parts 32 are independent of each other, an input signal can be independently applied to each light emitting element 32 in the outer package 37 located on each side.

Further, the light receiving elements 34 of the pair of outer packages 37 located on the respective side portions are connected by the lead portions 23a. Therefore, there is an advantage that the degree of freedom in circuit design for the circuit board is increased when the circuit board is mounted.

FIG. 16 is a sectional view showing still another example of the embodiment of the semiconductor optical coupling device of the present invention. In this semiconductor optical coupling device, a pair of substrates 40 in which a first conductive pattern 41 and a second conductive pattern 42 are layered via an insulating layer 43 are used. Light emitting element 32
Is die-bonded onto the first conductive pattern 41 of one of the substrates 40 with a conductive paste or the like.
0 second conductive pattern 42 to bonding wire 3
Wire-bonded by 3. Further, the light receiving element 34 is provided on the first conductive pattern 41 of the other substrate 40,
It is die-bonded with a conductive paste or the like, and is wire-bonded with the bonding wire 35 to the second conductive pattern 42 of the substrate 40. Light emitting element 3
2 and the light receiving element 34 are in an optically coupled state,
Inner package 3 made of translucent resin
Molded by 6, inner package 3
6 is molded by an outer package 37 made of a light-shielding resin. The outer package 37 is also arranged between the substrates 40.

The first conductive pattern 41 of each substrate 40 is in a state of extending from the outer package 37 to the outside, and the second conductive pattern 42 is in a state of being exposed from the surface of the outer package 37. ing. The substrate 40 may have a tape shape or a sheet shape.

In each of the above-described optically coupled semiconductor devices, a resin having a light shielding property is used as the outer package 37. However, after mounting on the circuit board, the entire optically coupled semiconductor device is coated with a light shielding powder. When applying resin coating,
It may be made of a translucent resin.

Although the first lead frame 10 is used for die bonding the light emitting element 32 or the light receiving element 34 and the second lead frame 20 is used for wire bonding, the first lead frame 10 is used for wire bonding and the second lead frame 10 is used for wire bonding. The lead frame 20 may be used for die-bonding the light emitting element 32 or the light receiving element 34.

Further, in the above-described optically coupled semiconductor device, the inner package 36 and the outer package 37 are described as a one-layer mold type which is molded by another manufacturing method. However, a resin-fixed tie bar is provided on the second lead frame 20. By providing and remodeling the molding die, the inner package 36 and the outer package 37 can be formed into a two-layer molding type in which they can be molded with the respective dies.

The present invention can be applied not only to the optically coupled semiconductor device but also to a light emitting semiconductor device as shown in FIG. This light emitting semiconductor device has a lead 52 and a lead 53 which are integrated in an insulating state by an insulator 51, and a light emitting element 54 is die-bonded on the lead 52 with a conductive paste. Then, the light emitting element 52 and the lead portion 5
3 is wire-bonded with a bonding wire 55 such as a gold wire. The light emitting element 54 is molded with a translucent resin 56 such as a silicone resin in order to relieve the stress, and the translucent resin 56 is formed by a package 57 made of the translucent resin together with the bonding wire 55. It is molded.

Such a light emitting semiconductor device is manufactured by using the first lead frame 10 and the second lead frame 20 in the same manner as in the method of manufacturing the optically coupled semiconductor device described above.
Further, instead of the leads 52 and 53 integrated by the insulator 51, a substrate provided with a pair of conductive patterns in an insulated state may be used.

In this case, instead of the light emitting element 54, the light receiving element is die-bonded to the lead 52, and the light receiving element is lead 53.
By wire-bonding to the light-receiving semiconductor device of the present invention.

[0053]

As described above, the optical semiconductor device of the present invention has the following features.
Since a part of the conductor is exposed from the package, the number of external terminals extending from the package can be reduced and the entire device can be downsized. Further, since the conductor portion exposed from the package can be directly adhered to the circuit board or the like, the mounting area on the circuit board can be reduced.

The method of manufacturing an optical semiconductor device according to the present invention can easily manufacture such an optical semiconductor device, and also facilitates mass production.

[Brief description of drawings]

FIG. 1 is a sectional view showing an example of an embodiment of an optically coupled semiconductor device of the present invention.

FIG. 2A is a side view of the optically coupled semiconductor device,
(B) is the top view, (c) is the bottom view.

FIG. 3 is a plan view showing an example of a lead frame used for manufacturing the optically coupled semiconductor device.

FIG. 4 is a plan view showing an example of another lead frame used for manufacturing the optically coupled semiconductor device.

FIG. 5 is a plan view showing a state in which a pair of lead frames are joined to form a base body in the manufacturing process of the optically coupled semiconductor device.

FIG. 6 is a plan view showing a state in which a light emitting element is die-bonded and wire-bonded to a substrate in the manufacturing process of the optically coupled semiconductor device.

FIG. 7 is a plan view showing an arrangement state of a substrate on which a light emitting element is die-bonded and a substrate on which a light receiving element is die-bonded in the manufacturing process of the optically coupled semiconductor device.

FIG. 8 is a plan view showing a state in which a light emitting element and a light receiving element are molded with an inner package in the manufacturing process of the optically coupled semiconductor device.

FIG. 9 is a plan view showing a state in which the inner package is molded with a light-shielding resin in the manufacturing process of the optically coupled semiconductor device.

FIG. 10 is a plan view for explaining a tie bar cut portion performed after forming an outer package in a manufacturing process of the optically coupled semiconductor device.

FIG. 11 is a plan view showing another example of the embodiment of the optically coupled semiconductor device of the present invention.

FIG. 12 is a plan view for explaining a tie bar cut portion performed after forming an outer package in a manufacturing process of the optically coupled semiconductor device.

FIG. 13 is a plan view showing still another example of the embodiment of the optically coupled semiconductor device of the present invention.

FIG. 14 is a plan view for explaining a tie bar cut portion performed after forming an outer package in a manufacturing process of the optically coupled semiconductor device.

FIG. 15 is a plan view showing still another example of the embodiment of the optically coupled semiconductor device of the present invention.

FIG. 16 is a sectional view showing still another example of the embodiment of the optically coupled semiconductor device of the present invention.

FIG. 17 is a cross-sectional view showing an example of an embodiment of a light emitting semiconductor device of the present invention.

FIG. 18 is a cross-sectional view showing an example of a conventional optically coupled semiconductor device.

FIG. 19 is a cross-sectional view showing another example of the conventional optically coupled semiconductor device.

[Explanation of symbols]

 10 First Lead Frame 11 Cradle 12 Lead (First Conductor) 20 Second Lead Frame 21 Cradle 22 Vertical Tie Bar 23 Header Lead (Second Conductor) 23a Lead Part 30 Base 31 Insulator 32 Light Emitting Element 33 Bonding Wire 34 Light Receiving Element 35 Bonding wire 36 Inner package 37 Outer package

Claims (6)

[Claims] 1. A pair of first conductors, each of which is die-bonded in a state where a light emitting element and a light receiving element are optically coupled, is integrated with each of the first conductors in an insulated state. A pair of second wires wire-bonded to the light emitting element and the light receiving element by bonding wires, respectively.
A conductor, the light emitting element and the light receiving element, in an optically coupled state, an inner package made of a translucent resin that is molded with each bonding wire, and an outer package that molds the inner package, An optical semiconductor device, wherein a part of one of the pair of conductors extends outward from the outer package, and the surface of the other pair of conductors is exposed from the surface of the outer package. 2. The first conductor and the second conductor,
The optical semiconductor device according to claim 1, wherein the optical semiconductor device is a conductive pattern that is layered on a substrate in an insulating state. 3. An optical semiconductor device comprising a plurality of the optical semiconductor devices according to claim 1, wherein conductors of any of adjacent optical semiconductor devices are integrated. 4. A first conductor, to which one of a light emitting element and a light receiving element is die-bonded, is integrated with the first conductor in an insulated state,
A second conductor wire-bonded to the optical semiconductor element by a bonding wire, and a light-transmitting material that molds the optical semiconductor element and the bonding wire so that a part of one of the pair of conductors extends to the outside. And a package made of a conductive resin, wherein the other pair of conductors have surfaces exposed from the surface of the package. 5. A step of die-bonding a light-emitting element to one conductor of a substrate integrated with a pair of conductors insulated from each other, and wire-bonding the light-emitting element to the other conductor by a bonding wire. , The die-bonding of the light-receiving element to one conductor of the other base, which is integrated with the pair of conductors insulated,
The step of wire-bonding the light-receiving element to the other conductor with a bonding wire, and arranging the bases so that the light-emitting element and the light-receiving element are optically coupled, and using a light-transmissive resin, the light-emitting element and the light-receiving element To form an inner package by molding with a bonding wire, and one conductor of each base is in an extended state, and the other conductor of each base is exposed from the surface of the mold. And a step of forming an outer package by molding the inner package with a resin as described above. 6. A step of die-bonding an optical semiconductor element, which is one of a light-emitting element and a light-receiving element, to one of a pair of conductors that are integrated in an insulated state; The step of wire-bonding the conductor to the conductor with a bonding wire, and the optical semiconductor element is transparent so that one conductor is in an extended state and the other conductor is exposed from the surface of the mold. A method of manufacturing an optical semiconductor device, comprising the step of molding with a bonding resin together with a bonding resin.