JPH0948019A - Method and apparatus for manufacturing laminated electronic component - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a method and an apparatus for manufacturing a laminated electronic component wherein a laminating failure due to the winding of a sheet does not occur. SOLUTION: A green sheet supported to a carrier tape is largely quarried from the shape of a unit sheet while being sucked by the outer cutting head of a quarrying conveying unit 10, and the quarried green sheet is released from the tape and transferred to a laminating stage 11. The green sheet sucked by an outer cutting head is stacked on a movable table 11a in the recess 11b of the stage while the green sheet sucked by the cutting head is quarried in the same shape as the unit sheet. Thus, even extremely thin green sheet can be easily handled, and the laminating failure due to the winding can be prevented, and hence a small-sized high functional laminated electronic component can be manufactured with high yield.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method and an apparatus for manufacturing a laminated electronic component such as a laminated capacitor, and more particularly to a method and an apparatus for manufacturing a laminated electronic component in which green sheets are punched into a predetermined shape and stacked.

[0002]

2. Description of the Related Art Conventionally, a laminated electronic component has a structure in which a layered internal conductor is formed inside a laminated body. Such a laminated electronic component is manufactured as follows.

That is, a ceramic raw material powder is kneaded with an organic binder or the like to prepare a ceramic slurry. This ceramic slurry is processed into a sheet by a coating machine such as a doctor blade to obtain a ceramic green sheet.

Then, a conductive paste is applied to this ceramic green sheet by a method such as screen printing to form an internal conductor pattern. The ceramic green sheet on which the internal conductor pattern is formed is punched out into a certain shape, and a plurality of the sheets are stacked and heat-processed to form a laminated body.
This laminated body is cut and divided into individual chips of a certain size, the chips are baked, and then external electrodes are baked to manufacture a laminated electronic component.

[0005]

In recent years, the demand for small size and high functionality in laminated electronic components has increased, and the number of laminated layers per unit volume has increased. Along with this, the thickness of the ceramic green sheet has to be reduced, and the strength of the ceramic green sheet is reduced and its handling becomes difficult.

For this reason, a method has been devised in which the step of punching and stacking the ceramic green sheets into a certain shape is carried out while being carried on a reinforcing film such as a PET film. For example, a method has been proposed in which a ceramic green sheet held on a reinforcing film is punched out on the reinforcing film by a cutting head having an adsorbing means, adsorbed and held, and transferred to a laminating step.

However, there are still problems when the above-mentioned method is used. That is, when the ceramic green sheet was peeled from the reinforcing film, the edges of the ceramic green sheet adsorbed and held by the cutting head were turned up, and wrapping occurred. When such entrainment occurs, stacking failure occurs and normal stacking and pressure bonding cannot be performed.

In view of the above problems, it is an object of the present invention to provide a method of manufacturing a laminated electronic component and an apparatus for the same, in which stacking failure due to the winding of sheets does not occur.

[0009]

In order to achieve the above-mentioned object, the present invention provides a method of manufacturing a laminated electronic component according to claim 1, wherein unit sheets having conductor patterns corresponding to component types are laminated. A step of cutting the ceramic green sheet supported by the reinforcing film into a larger size than the unit sheet while adsorbing the ceramic green sheet by an outer cutting head, and separating the cut ceramic green sheet from the reinforcing film and transferring it to a laminating stage. And a step of stacking the ceramic green sheets adsorbed by the outer cutting head in the same shape as the unit sheet by the inner cutting head provided on the inner side of the outer cutting head while cutting the ceramic green sheets on the stacking stage. Proposing a manufacturing method for multilayer electronic components .

According to the method of manufacturing the laminated electronic component, the ceramic green sheet supported by the reinforcing film is supplied, and the ceramic green sheet is cut into a larger size than the single sheet shape by the outer cutting head.
The cut-out ceramic green sheet is adsorbed and held and separated from the reinforcing sheet. At this time, the edge of the cut-out ceramic green sheet may be turned up and rolled up inward, but since it is adsorbed by the outer cutting head, the rollup remains within the range of the outer cutting head. Next, the cut-out ceramic green sheets are transferred to a laminating stage, the inner cutting head is operated, and punched into a laminating area, and at the same time laminating. As a result, the ceramic green sheets in the portion to be laminated are not rolled up, and the occurrence of stacking defects is reduced. The entangled portion can be removed as a sheet ear portion.

According to a second aspect of the present invention, in the method for manufacturing a laminated electronic component, which is formed by laminating unit sheets each having a conductor pattern corresponding to a component type, the ceramic green sheet supported by the reinforcing film is attached to the outer cutting head. A step of cutting together with the reinforcing film larger than the shape of the unit sheet while adsorbing, a step of peeling the reinforcing film from the cut-out ceramic green sheet and transferring it to a laminating stage, and a step of providing inside the outer cutting head And a step of stacking the ceramic green sheets adsorbed by the outer cutting head on the stacking stage while cutting out the ceramic green sheets attracted by the outer cutting head into the same shape as the unit sheet.

According to the method of manufacturing the laminated electronic component, the ceramic green sheet supported by the reinforcing film is supplied, and the ceramic green sheet is cut out by the outer cutting head together with the reinforcing film into a larger size than the shape of the single sheet. After the ceramic green sheet cut out is adsorbed and held, the reinforcing sheet is peeled off from the ceramic green sheet. At this time, the edge of the cut-out ceramic green sheet may be turned up and rolled up inward, but since it is adsorbed by the outer cutting head, the rollup remains within the range of the outer cutting head. Next, the cut-out ceramic green sheets are transferred to a laminating stage, and an inner cutting head provided inscribed in the outer cutting head is operated to punch out the laminating area and at the same time laminate it. As a result, the ceramic green sheets in the portion to be laminated are not rolled up, and the occurrence of stacking defects is reduced. The entangled portion can be removed as a sheet ear portion.

According to a third aspect of the present invention, in the method of manufacturing a laminated electronic component in which unit sheets each having a conductor pattern corresponding to a component type are laminated, the ceramic green sheet supported by the reinforcing film is replaced with the outer cutting head. A step of cutting together with the reinforcing film a shape larger than the shape of the unit sheet; a step of sucking the cut ceramic green sheet by an inner cutting head; and a step of peeling the reinforcing film from the ceramic green sheet sucked by the inner cutting head. After that, a step of transferring the ceramic green sheets to the stacking stage, and a step of stacking the adsorbed ceramic green sheets on the stacking stage while cutting out the adsorbed ceramic green sheets into the same shape as the unit sheet by the inner cutting head. We propose a method of manufacturing a multilayer electronic component having and.

According to the method of manufacturing the laminated electronic component, the ceramic green sheet supported by the reinforcing film is supplied, and the ceramic green sheet is cut out by the outer cutting head together with the reinforcing sheet to a size larger than the shape of the single sheet. Further, the cut-out ceramic green sheet is adsorbed and held by an inner cutting head, and the reinforcing sheet is peeled from the ceramic green sheet. At this time, the edge of the cut-out ceramic green sheet may be turned up and may be wound inward, but since the suction is performed by the inner cutting head, the winding remains within the outer peripheral portion of the inner cutting head. Next, the cut-out ceramic green sheets are transferred to a laminating stage, the inner cutting head is operated, and punched into a laminating area, and at the same time laminating. As a result, the ceramic green sheets in the portion to be laminated are not rolled up, and the occurrence of stacking defects is reduced. The entangled portion can be removed as a sheet ear portion.

Further, in a fourth aspect of the present invention, in a method of manufacturing a laminated electronic component, which is formed by laminating unit sheets each having a conductor pattern corresponding to a component type, the ceramic green sheet supported by the reinforcing film is replaced with the outer cutting head. With the reinforcing film, a step of cutting out larger than the shape of the unit sheet, a step of laminating the cut out ceramic green sheet with the reinforcing film, and adsorbing the laminated ceramic green sheet by an inner cutting head, and adsorbing After peeling the reinforcing film from the ceramic green sheet, the ceramic green sheet is transferred to a stacking stage, and the adsorbed ceramic green sheet is cut into the same shape as the unit sheet by the inner cutting head. We propose a method of manufacturing a multilayer electronic component and a step of stacking on the stacking stage.

According to the method for manufacturing the laminated electronic component, the ceramic green sheet supported by the reinforcing film is supplied, and the ceramic green sheet is cut out by the outer cutting head together with the reinforcing sheet into a shape larger than the shape of the single sheet. The cut-out ceramic green sheet is laminated with the reinforcing sheet. Then
The ceramic green sheet laminated with the reinforcing sheet is adsorbed and held by the inner cutting head, and the reinforcing sheet is separated from the ceramic green sheet. At this time, the edge of the cut-out ceramic green sheet may be turned up and may be wound inward, but since the suction is performed by the inner cutting head, the winding remains within the outer peripheral portion of the inner cutting head. next,
The cut ceramic sheets are transferred to a laminating stage, and the inner cutting head is operated to punch out the laminating area and at the same time, laminating the ceramic sheets. As a result, the ceramic sheets in the portion to be laminated are not rolled up, and the occurrence of stacking defects is reduced. The entangled portion can be removed as a sheet ear portion.

According to a fifth aspect of the present invention, in a laminated electronic component manufacturing apparatus in which unit sheets having conductor patterns corresponding to component types are laminated, an inner cutting head having the same shape as the area to be laminated, and the inner cutting head. An apparatus for manufacturing a laminated electronic component having a sheet punching device that is in close contact with the periphery of a cutting head and that operates independently of the inner cutting head and that has an outer cutting head having suction means is proposed.

According to the apparatus for manufacturing a laminated electronic component, for example, when the ceramic green sheets supported by the reinforcing film are supplied, the ceramic green sheets are laminated by the outer cutting head of the sheet punching apparatus having the inner and outer cutting heads. The ceramic green sheet is cut out in an area larger than the area and separated from the reinforcing film. At this time, the edge of the cut out ceramic green sheet may be turned up and caught inside, but since it is adsorbed by the outer cutting head,
The wraps remain within the outer cutting head.
After that, the cut-out ceramic green sheets are transferred to a laminating stage, and the inner cutting head is operated to punch the ceramic green sheets into a laminating area and at the same time laminating them. As a result, the ceramic green sheets in the portion to be laminated are not rolled up, and the occurrence of stacking defects is reduced. Furthermore, the part where the wrapping has occurred can be removed as a sheet ear.

A sixth aspect of the present invention proposes a laminated electronic component manufacturing apparatus according to the second aspect, wherein the inner cutting head is provided with suction means.

According to the laminated electronic component manufacturing apparatus, since the suction is performed by the inner cutting head, almost all of the cut out ceramic green sheet can be sucked,
The transfer can be performed stably.

According to a seventh aspect of the present invention, in a laminated electronic component manufacturing apparatus in which unit sheets each having a conductor pattern corresponding to a component type are laminated, the laminated electronic component has the same shape as the area to be laminated and is provided with a suction means. An inner cutting head, and is arranged to face the inner cutting head at a cutting position, and circumscribes the periphery of the inner cutting head,
Also proposed is a laminated electronic component manufacturing apparatus having a sheet punching device including the inner cutting head and an outer cutting head that operates independently.

According to the manufacturing apparatus of the laminated type electronic component, for example, when the ceramic green sheet supported by the reinforcing film is supplied, the ceramic green sheets are laminated by the outer cutting head of the sheet punching apparatus having the inner and outer cutting heads. The ceramic green sheet is cut out in an area larger than the area. After that, the cut-out ceramic green sheet is attracted to the inner cutting head together with the reinforcing film, and the reinforcing film is peeled from the ceramic green sheet. At this time, the edge of the cut-out ceramic green sheet may be turned up and may be wound inward, but since the suction is performed by the inner cutting head, the winding remains within the outer peripheral portion of the inner cutting head. After that, the cut-out ceramic green sheets are transferred to a laminating stage, and the inner cutting head is operated to punch the ceramic green sheets into a laminating area and at the same time laminating them. As a result, the ceramic green sheets in the portion to be laminated are not rolled up, and the occurrence of stacking defects is reduced. Furthermore, the part where the wrapping has occurred can be removed as a sheet ear.

[0023]

BEST MODE FOR CARRYING OUT THE INVENTION Embodiments of the present invention will be described below with reference to the drawings. FIG. 1 is a block diagram showing an apparatus for manufacturing a multilayer electronic component according to the first embodiment of the present invention.
In the figure, 1 is a supply reel, 2 is a take-up reel, 3 is a guide reel, 4 is a tension reel, 5 is a peeling blade, 6 is a recovery box, 7 is a cutting reel, 8 is a cutter, 9 is a punching table, 10 Is a cutout transport unit,
Reference numeral 11 is a stacking stage.

A strip-shaped ceramic green sheet (hereinafter simply referred to as a green sheet) shown in FIG. 2 is provided on the supply reel 1.
The GS is wrapped around. This green sheet GS
Is a strip-shaped carrier tape K made of PET film or the like.
The lower surface is supported by T, and a conductor group P corresponding to the electronic component is formed in a predetermined array on the upper surface. Further, a positioning mark (not shown) is provided around each conductor group P.
Are provided in plural. The green sheet GS shown here is, for example, for a multilayer capacitor, and 5 × 6 arrayed rectangular conductor groups P are formed at equal intervals in the longitudinal direction. The two-dot chain line in the figure indicates the position and size of the cut sheet Sc punched from the green sheet GS.

The green sheet GS delivered from the supply reel 1 is sent to the cutting reel 7 via the guide reel 3 and the tension reel 4, and then to the punching table 9 via the guide reel 3. It is wound by the take-up reel 2 via the guide reel 3.

A power source such as a motor is connected to the take-up reel 2, and the take-up reel 2 is rotated as necessary to move the green sheet GS. The residual material of the green sheet GS after punching the unit sheet is scraped off the carrier tape KT by the peeling blade 5 and collected in the collection box 6. As a result, only the carrier tape KT is wound on the take-up reel 2.

As shown in FIG. 3, the cutter 8 is equipped with two circular blades 8a facing each other at both ends of the shaft, and cuts the green sheet GS in cooperation with the cutting reel 7. The interval (cutting interval) between both circular blades 8a matches the width dimension of the unit sheet St described later. Further, the cutter 8 is spring-biased on the surface of the cutting reel 7, and cuts only the green sheet GS without damaging the carrier tape KT.

As shown in FIG. 4, the punching table 9 has a plurality of suction ports 9a communicating with a suction source such as an air compressor.
And an electric heater 9b for heating the table itself, and the carrier tape KT is supported by a flat rectangular upper surface. Further, the front end of the punching table 9 is a carrier tape KT.
Is curved so that it can slide smoothly.

As shown in FIG. 4, the cutting and conveying unit 10 has an inner cutting head 1 which is vertically movable and has a flat rectangular lower surface matching the shape to be cut out.
0a and an outer cutting head 10b closely arranged so as to be vertically movable around the inner cutting head 10a.
And This outer cutting head 10b
Can move up and down independently of the inner cutting head 10a.

Further, the inner cutting head 10a is provided with a plurality of suction ports 10c communicating with a suction source such as an air compressor.

The outer cutting head 10b includes a suction block 10d, a rectangular blade 10e arranged outside the suction block 10d, a spring member 10f for urging the rectangular blade 10e downward, and an air cylinder for vertically moving these. Etc. The arrangement position (cutting position) of the rectangular blade 10e is set to be slightly larger than the length dimension of the unit sheet St.

In addition, the suction block 10d has an outer peripheral position separated from the conductor group P of the cut sheet Sc to be sucked,
A plurality of suction ports 10 leading to a suction source such as an air compressor
g is provided so that the conductor group P and the surface of the sheet are not damaged during adsorption.

The cutting and conveying unit 10 is mounted on a ball screw 12b which is rotationally driven by a motor 12a and moves back and forth in parallel with the punching table 9.

The stacking stage 11 is provided with a movable table 11a which can be moved up and down by an air cylinder or the like, which allows the concave portion 1 having a shape corresponding to the unit sheet St to be formed.
1b is formed, and the unit sheet St is stacked in the recess 11b.

Next, the operation of the present apparatus having the above-mentioned structure will be described with reference to FIGS. Supply reel 1
The green sheet GS fed out from the sheet passes over the cutting reel 7 with the carrier tape KT facing down. In this passing process, as shown in FIG. 3, both circular blades 8 of the cutter 8 are
a bites into the green sheet GS under a predetermined spring bias, whereby only the green sheet GS is cut in the width dimension of the unit sheet St without damaging the carrier tape KT.

Green sheet G whose width has been cut
As shown in FIG. 4, S is fed onto the punching table 9 and stopped, and the carrier tape KT is adsorbed by the negative pressure generated in the suction port 9a and the stopped state is held.
It is heated by the table heat by the electric heater 9b.

After this, as shown in FIG. 4, the cutting and conveying unit 10 moves onto the punching table 9, and then, as shown in FIG. 5, the cutting and conveying unit 10 descends. In this descending process, the rectangular blades 10e at the front and rear positions bite into the green sheet GS under a predetermined spring force, whereby the green sheet G without damaging the carrier tape KT.
Only S is cut in the length dimension of the unit sheet St. Since the binder of the green sheet GS is softened by the heat of the table, the cutting here can be easily performed. Green sheet that has been cut to length (cut sheet S
c) is the suction ports 10c, 1 of the cutout transport unit 10.
It is adsorbed by the negative pressure generated at 0 g.

After the cutting and conveying unit is lowered, the suction of the carrier tape KT on the punching table 9 is released, and as shown in FIG.
Guide reel 3 underneath while sliding underneath at a constant speed
Retreat with. In this backward movement process, the green sheet GS and the carrier tape KT which are fed out with a predetermined tension are drawn forward, and the cut sheet Sc after cutting is left on the side of the cutting and conveying unit 10 and these are the lower surface of the cutting and conveying unit 10. Gradually leave.

Since the punching table 9 is moved backward together with the guide reel 3 to keep the peeling angle constant, the cut sheet Sc can be smoothly peeled by the backward movement of the punching table 9. As shown in FIG. 7, the punching table 9
Also, when the cut sheet Sc is completely peeled off due to the backward movement of the guide reel 3, the cutout conveyance unit 10 is raised.

The cutting and conveying unit 10 holding the cut sheet Sc, as shown in FIG.
Move to the upper position of and stop after positioning.

After the cutting and conveying unit 10 has stopped at the position of the laminating stage 11, as shown in FIG. 9, the cutting and conveying unit 10 is lowered to press the cut sheet Sc onto the concave portion 11b of the laminating stage 11 at the same time. ,
As shown in FIG. 10, only the inner cutting head 10a is further lowered. As a result, the cut sheet Sc is cut by the edge portion of the recess 11b and the edge portion of the inner cutting head 10a, and the unit sheet St is cut out and simultaneously stacked in the recess 11b.

Next, air is blown out from the suction port 10c of the inner cutting head 10a, and the unit sheet St
Is recessed away from the inner cutting head 10a
Is placed inside. The peripheral edge of the cutting sheet Sc left on the stacking stage 11 is removed as an ear.

As a result, even an extremely thin ceramic green sheet can be easily handled and the occurrence of stacking defects such as winding can be prevented.

After that, the above-described steps are repeated, and a plurality of unit sheets St are stacked in the recess 11b of the stacking stage 11 as shown in FIG. When the specified number of unit sheets are stacked, as shown in FIG.
1a rises and the laminated body can be taken out.

As described above, according to this embodiment, even an extremely thin ceramic green sheet can be easily handled, and the occurrence of stacking defects such as winding can be prevented. Therefore, a compact and high-performance stacked electronic component can be obtained. It can be manufactured with high yield.

Needless to say, the present invention can be widely applied to multilayer electronic components other than multilayer capacitors, such as multilayer inductors, multilayer coils, and multilayer composite components, and the same effects as those of this embodiment can be obtained.

Further, in this embodiment, the suction port 10c is provided in the inner cutting head 10a, but the similar effect can be obtained without providing the suction port 10c.

Further, an outer cutting head 10b is provided over the entire outer circumference of the inner cutting head 10a,
The ceramic green sheet GS may be cut into a rectangular shape as in the second embodiment shown in FIG.

Next, a third embodiment of the present invention will be described. FIG. 14 is a diagram showing the main steps of the manufacturing method according to the third embodiment. In the figure, the same components as those in the first embodiment described above are denoted by the same reference numerals, and description thereof will be omitted. Here, the cutting and conveying unit 10 is provided with an outer cutting head 10b over the entire outer circumference of the inner cutting head 10a.

In the third embodiment, as shown in FIG.
First, the outer cutting head 10b cuts the green sheet GS and the carrier tape KT into a rectangular shape.
After this, the cut green sheet GS (cut sheet S
c) with cutting tape 1 with carrier tape KT
It is adsorbed by 0a and 10b and transferred to the laminating stage 11.
In this transfer process, the carrier tape KT attached to the cut sheet Sc is peeled off.

After the cutting and conveying unit 10 is stopped at the position of the laminating stage 11, the same operation as described above is performed. As shown in FIG. 9, the cutting and conveying unit 10 is lowered to cut the cut sheet Sc on the concave portion 11b of the laminating stage 11. Simultaneously with pressing, the inner cutting head 10a alone is further lowered as shown in FIG. As a result, the edge of the recess 11b and the inner cutting head 10a
The cut sheet Sc is cut by the edge portion of, and the unit sheet St is cut out and at the same time stacked in the recess 11b.

Next, air is blown out from the suction port 10c of the inner cutting head 10a, and the unit sheet St
Is recessed away from the inner cutting head 10a
Is placed inside. The peripheral edge of the cutting sheet Sc left on the stacking stage 11 is removed as an ear.

As a result, even an extremely thin ceramic green sheet can be easily handled and the occurrence of stacking defects such as winding can be prevented.

After that, the above-described steps are repeated to stack a plurality of unit sheets St in the recess 11b of the stacking stage 11 as shown in FIG. When the specified number of unit sheets are stacked, as shown in FIG.
1a rises and the laminated body can be taken out.

As described above, according to the present embodiment, even an extremely thin ceramic green sheet can be easily handled and the occurrence of stacking defects such as winding can be prevented. Can be manufactured well.

Next explained is the fourth embodiment of the invention. In the fourth embodiment, as shown in FIG. 15, the cutting and conveying unit 10 has an inner cutting head 10a.
Only the outer cutting head 10b is provided.
Is arranged in the punching table 9 so as to move up and down. In the other components, the same components as those in the first embodiment are designated by the same reference numerals and the description thereof will be omitted.

Next, the operation of the present apparatus having the above-mentioned structure will be described with reference to FIGS. The green sheet GS delivered from the supply reel 1 passes over the cutting reel 7 with the carrier tape KT facing down. In this passing process, as shown in FIG. 3, both circular blades 8a of the cutter 8 bite into the green sheet GS under a predetermined spring bias, whereby the carrier tape KT and the green sheet GS have the width dimension of the unit sheet St. Be disconnected.

Green sheet G whose width dimension has been cut
As shown in FIG. 16, S is fed to the punching table 9 and stopped, and the carrier tape KT is adsorbed by the negative pressure generated in the suction port 9a and the stopped state is held, and the table by the electric heater 9b is held. It is heated by heat.

After that, as shown in FIG. 17, after the cutout transport unit 10 moves onto the punching table 9, the cutout transport unit 10 descends. When the cutting and conveying unit 10 comes into contact with the green sheet GS, the outer cutting head 10b rises from within the punching table 9, and the rectangular blades 10d at the front and rear positions bite into the carrier tape KT and the green sheet GS under a predetermined spring bias. As a result, the green sheet GS is cut along with the carrier tape KT in the length dimension of the unit sheet St.

Since the binder of the green sheet GS is softened by the heat of the table, the cutting here can be easily performed. The green sheet (cut sheet Sc) that has been cut into the length dimension is adsorbed by the negative pressure generated in the suction port 10c of the cutout transport unit 10.

After the cutting and conveying unit descends, the suction of the carrier tape KT on the punching table 9 is released, and as shown in FIG.
While sliding under T at a constant speed, it retreats together with the lower guide reel 3. In this backward movement process, the green sheet GS and the carrier tape KT which are fed with a predetermined tension are drawn forward, and the cut sheet Sc with the cut carrier tape KT is cut out and left on the side of the transport unit 10. It gradually separates from the lower surface of the cutout transport unit 10.

Since the punching table 9 is moved backward together with the guide reel 3 to keep the peeling angle constant, the cut sheet Sc can be smoothly peeled by the backward movement of the punching table 9. As shown in FIG. 19, when the punching table 9 and the guide reel 3 are retracted, the cut sheet Sc is completely peeled off, and the cutout conveyance unit 10 is moved up. After this, as shown in FIG. 20, the cut sheet S
The carrier tape KT attached to c is peeled off.

Next, as shown in FIG. 21, the cutout conveyance unit 10 holding the cut sheet Sc moves to the upper position of the stacking stage 11 and stops after positioning.

After the cutting and conveying unit 10 stops at the position of the laminating stage 11, as shown in FIG. 22, the cutting and conveying unit 10 is lowered to press the cut sheet Sc onto the recess 11b of the laminating stage 11 at the same time. , The inner cutting head 10a as shown in FIG.
Only lowers further. As a result, the cut sheet Sc is cut by the edge portion of the recess 11b and the edge portion of the inner cutting head 10a, and the unit sheet St is cut out and simultaneously stacked in the recess 11b.

Next, air is blown out from the suction port 10c of the inner cutting head 10a, and the unit sheet St
Is recessed away from the inner cutting head 10a
Is placed inside. The peripheral edge of the cutting sheet Sc left on the stacking stage 11 is removed as an ear.

As a result, even an extremely thin ceramic green sheet can be easily handled and the occurrence of stacking defects such as winding can be prevented.

After that, the above-described steps are repeated, and a plurality of unit sheets St are stacked in the recess 11b of the stacking stage 11 as shown in FIG. When the specified number of unit sheets are stacked, the movable table 11a rises, and the stacked body can be taken out.

As described above, according to this embodiment as well, an extremely thin ceramic green sheet can be easily handled, and the occurrence of stacking defects such as winding can be prevented. Can be manufactured well.

In this embodiment, the carrier tape KT
The cutting of the green sheet GS in the width direction is performed by the cutter 8. However, the outer cutting head 10b is provided so as to cover the entire outer circumference of the inner cutting head 10a, and the outer cutting head 10b is provided as in the second embodiment described above. Alternatively, the carrier tape KT and the green sheet GS may be cut into a rectangular shape.

The cut sheets Sc that have been cut out are once stacked, and then the cut sheets S that have been stacked are stacked.
c is adsorbed by the inner cutting head 10a,
The carrier tape KT may be peeled off and transferred to the laminating stage 11.

[0071]

As described above, according to the method for manufacturing a laminated electronic component according to any one of claims 1 to 4 of the present invention, even an extremely thin ceramic green sheet can be easily handled and rolled up. Since it is possible to prevent the occurrence of stacking failure in (1), it is possible to manufacture a small-sized and highly-functional multilayer electronic component with a high yield.

According to the apparatus for manufacturing a laminated electronic component according to the fifth aspect, even an extremely thin ceramic green sheet can be easily handled and the occurrence of stacking defects such as entrainment can be prevented. Highly functional laminated electronic components can be manufactured with high yield.

Further, according to the laminated type electronic component manufacturing apparatus of the sixth aspect, in addition to the above effects, since the suction is performed by the inner cutting head, almost all of the cut out ceramic green sheet can be sucked. The transfer can be performed stably.

According to the apparatus for manufacturing a laminated electronic component according to the seventh aspect, even an extremely thin ceramic green sheet can be easily handled, and the occurrence of stacking defects such as winding can be prevented. Highly functional laminated electronic components can be manufactured with high yield.

[Brief description of drawings]

FIG. 1 is a configuration diagram showing an apparatus for manufacturing a multilayer electronic component according to a first embodiment of the present invention.

FIG. 2 is a top view showing a green sheet according to the first embodiment.

FIG. 3 is a diagram showing a manner of cutting the green sheet in the width direction in the first embodiment.

FIG. 4 is a view showing a state of cutting a green sheet in a length direction and adsorbing a sheet in the first embodiment.

FIG. 5 is a view showing a state of cutting a green sheet in a length direction and adsorbing the sheet in the first embodiment.

FIG. 6 is a diagram showing how the green sheet is peeled off in the first embodiment.

FIG. 7 is a diagram showing how the green sheet is peeled off in the first embodiment.

FIG. 8 is a diagram showing how the unit sheets are stacked in the first embodiment.

FIG. 9 is a diagram showing how the unit sheets are stacked in the first embodiment.

FIG. 10 is a diagram showing how the unit sheets are stacked in the first embodiment.

FIG. 11 is a diagram showing how the unit sheets are stacked in the first embodiment.

FIG. 12 is a diagram showing how the unit sheets are stacked in the first embodiment.

FIG. 13 is a diagram showing a cut state of a green sheet according to a second embodiment.

FIG. 14 is a view showing a main process of a manufacturing method according to a third embodiment.

FIG. 15 is a diagram showing a configuration of a main part of a fourth embodiment.

FIG. 16 is a view showing a state of cutting a green sheet in the length direction and adsorbing the sheet in the fourth embodiment.

FIG. 17 is a view showing a state of cutting a green sheet in a length direction and adsorbing a sheet in the fourth embodiment.

FIG. 18 is a diagram showing how a green sheet according to a fourth embodiment is peeled off.

FIG. 19 is a diagram showing how the green sheet is peeled off in the fourth embodiment.

FIG. 20 is a diagram showing how the carrier tape is peeled off in the fourth embodiment.

FIG. 21 is a diagram showing how the unit sheets are stacked in the fourth embodiment.

FIG. 22 is a diagram showing how the unit sheets are stacked in the fourth embodiment.

FIG. 23 is a diagram showing how the unit sheets are stacked in the fourth embodiment.

[Explanation of symbols]

1 ... Supply reel, 2 ... Take-up reel, 3 ... Guide reel,
4 ... Tension reel, 5 ... Peeling blade, 6 ... Collection box, 7 ... Cutting reel, 8 ... Cutter, 9 ... Punching table, 10 ... Cutting transport unit, 10a ... Inner cutting head, 10b ... Outer cutting head, 1
0c ... Suction port, 10d ... Suction block, 10e ... Rectangular blade, 10f ... Spring material, 10g ... Suction port, 11 ... Stacking stage, 11a ... Movable table, 11b ... Recessed portion.

Claims (7)

[Claims] 1. A method of manufacturing a laminated electronic component, which comprises laminating unit sheets having conductor patterns corresponding to component types, wherein a ceramic green sheet supported by a reinforcing film is adsorbed by an outer cutting head. A step of cutting out the ceramic green sheet larger than the shape of the unit sheet; a step of peeling the cut out ceramic green sheet from the reinforcing film and transferring it to a laminating stage; and an outer cutting head provided inside the outer cutting head, And a step of stacking the ceramic green sheets adsorbed by a cutting head on the laminating stage while cutting out the ceramic green sheets into the same shape as the unit sheets. 2. A method for manufacturing a laminated electronic component, which comprises laminating unit sheets each having a conductor pattern corresponding to a component type, wherein the ceramic green sheet supported by a reinforcing film is adsorbed by an outer cutting head. A step of cutting together with the reinforcing film larger than the shape of a unit sheet, a step of peeling the reinforcing film from the cut ceramic green sheet and transferring it to a laminating stage, and an inner cutting head provided inside the outer cutting head. And stacking the ceramic green sheets adsorbed by the outer cutting head on the stacking stage while cutting out the ceramic green sheets in the same shape as the unit sheets. 3. A method of manufacturing a laminated electronic component, which comprises laminating unit sheets each having a conductor pattern corresponding to a component type, wherein a ceramic green sheet supported by a reinforcement film is provided together with the reinforcement film by an outer cutting head. A step of cutting out larger than the shape of the unit sheet; a step of adsorbing the cut out ceramic green sheet by an inner cutting head; and a step of separating the reinforcing film from the ceramic green sheet adsorbed by the inner cutting head, and then the ceramic A step of transferring the green sheet to a stacking stage, and a step of stacking on the stacking stage while cutting out the adsorbed ceramic green sheet into the same shape as the unit sheet by the inner cutting head. Method of manufacturing a multilayer electronic component according to claim. 4. A method for manufacturing a laminated electronic component, which comprises laminating unit sheets each having a conductor pattern corresponding to a component type, wherein a ceramic green sheet supported by a reinforcement film is formed together with the reinforcement film by an outer cutting head. A step of cutting out larger than the shape of the unit sheet; a step of laminating the cut out ceramic green sheet together with the reinforcing film; a step of adsorbing the laminated ceramic green sheet by an inner cutting head, and A step of transferring the ceramic green sheet to a laminating stage after peeling the reinforcing film; and a step of cutting the adsorbed ceramic green sheet into the same shape as the unit sheet by the inner cutting head, Production method of a multilayer electronic device, characterized by a step of stacking up. 5. An apparatus for manufacturing a laminated electronic component, which is formed by laminating unit sheets each having a conductor pattern corresponding to a component type, in an inner cutting head having the same shape as the area to be laminated, and around the inner cutting head. An apparatus for manufacturing a multi-layer electronic component, comprising a sheet punching device that is in close contact and operates independently of the inner cutting head, and has an outer cutting head having a suction means. 6. An apparatus for manufacturing a laminated electronic component according to claim 5, wherein said inner cutting head is provided with a suction means. 7. An apparatus for manufacturing a laminated electronic component, which is formed by laminating unit sheets having conductor patterns corresponding to component types, and has an inner cutting head having the same shape as the laminating area and provided with suction means. A sheet punching device having an outer cutting head that is disposed opposite to the inner cutting head in a cutting position, is circumscribed around the inner cutting head, and has an outer cutting head that operates independently of the inner cutting head. Characteristic multi-layer electronic component manufacturing equipment.