JPH0945741A - Semiconductor integrated circuit - Google Patents

Semiconductor integrated circuit

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Publication number
JPH0945741A
JPH0945741A JP7193703A JP19370395A JPH0945741A JP H0945741 A JPH0945741 A JP H0945741A JP 7193703 A JP7193703 A JP 7193703A JP 19370395 A JP19370395 A JP 19370395A JP H0945741 A JPH0945741 A JP H0945741A
Authority
JP
Japan
Prior art keywords
terminals
circuit
semiconductor integrated
analog
signal
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP7193703A
Other languages
Japanese (ja)
Inventor
Takayuki Suemitsu
孝行 末光
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp filed Critical NEC Corp
Priority to JP7193703A priority Critical patent/JPH0945741A/en
Publication of JPH0945741A publication Critical patent/JPH0945741A/en
Pending legal-status Critical Current

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  • Tests Of Electronic Circuits (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Semiconductor Integrated Circuits (AREA)

Abstract

PROBLEM TO BE SOLVED: To enable the reduction of the cost for tests and inspections maintaining the features for special use by providing test terminals respectively connected to signal terminals at fixed positions common to various types different in specified parameters, including the locations of analog circuits and signal terminals. SOLUTION: A semiconductor integrated circuit 10 for special use has analog circuits 1a and 1b which are disposed at specified positions and connected to outer circuits disposed at specified positions and signal terminals TS1 and TS2 for transmitting signals between the outer circuits and analog circuits 1a and 1b. Test terminals TT1 and TT2 respectively connected to the signal terminals TS1 and TS2 are provided at predetermined fixed position common to several types different in parameters, including the locations of the circuits 1a and 1b and terminal TS1 and TS2. At usual operation, for example, the terminals TT1 and TT2 are set to the open state.

Description

【発明の詳細な説明】Detailed Description of the Invention

【0001】[0001]

【発明の属する技術分野】本発明は半導体集積回路に関
し、特にアナログ回路を含みこのアナログ回路に対し所
定の検査が実施される特殊用途向けの半導体集積回路に
関する。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a semiconductor integrated circuit, and more particularly to a special purpose semiconductor integrated circuit including an analog circuit and performing a predetermined inspection on the analog circuit.

【0002】[0002]

【従来の技術】特殊用途向けの半導体集積回路(ASI
C)は、顧客が回路を自由に構成できることを特徴とし
ているため、それぞれの回路構成が異なるだけでなく、
信号等の入出力端子の位置も異なる。このような特殊用
途向けの半導体集積回路においては、近年、アナログ回
路を含むものが増加してきている。
2. Description of the Related Art Semiconductor integrated circuits (ASI) for special applications
Since C) is characterized in that the customer can freely configure the circuit, not only are the circuit configurations different,
The positions of input / output terminals for signals etc. are also different. Among such semiconductor integrated circuits for special purposes, those including analog circuits have been increasing in recent years.

【0003】従来のこの種の半導体集積回路の一般的な
一例を図4(A),(B)に示す。
A general example of a conventional semiconductor integrated circuit of this type is shown in FIGS. 4 (A) and 4 (B).

【0004】この半導体集積回路10xは、複数の第1
及び第2のアナログ用の信号端子TS1,TS2と、複
数の第1のアナログ用の信号端子TS1のうちの所定の
端子からの信号を受けて所定のアナログ処理を行い、ア
ナログ処理された信号を複数の信号端子TS1のうちの
所定の端子から出力する第1のアナログ回路1aと、複
数の第2のアナログ用の信号端子TS2のうちの所定の
端子からの信号を受けて所定のアナログ処理を行い、ア
ナログ処理された信号を複数の信号端子TS2のうちの
所定の端子から出力する第2のアナログ回路1bとを有
する構成となっている。
This semiconductor integrated circuit 10x includes a plurality of first
And the second analog signal terminals TS1 and TS2 and a signal from a predetermined terminal of the plurality of first analog signal terminals TS1 to perform predetermined analog processing, and output the analog processed signal. A first analog circuit 1a that outputs from a predetermined terminal of the plurality of signal terminals TS1 and a signal from a predetermined terminal of the plurality of second analog signal terminals TS2 receive predetermined analog processing. The second analog circuit 1b outputs the analog-processed signal from a predetermined terminal of the plurality of signal terminals TS2.

【0005】この半導体集積回路10xでは、第1及び
第2のアナログ回路1a,1bが顧客によって半導体チ
ップの任意の位置に配置され、これらアナログ回路1
a,1bそれぞれと接続する複数の信号端子TS1,T
S2は、通常その近傍の周辺に配置される。
In this semiconductor integrated circuit 10x, the first and second analog circuits 1a and 1b are arranged at arbitrary positions on the semiconductor chip by the customer.
a, 1b a plurality of signal terminals TS1 and T connected to each
S2 is usually arranged in the vicinity of the vicinity.

【0006】このような半導体集積回路10xが正常に
動作するかどうかを検査するには、通常、テストボード
を含む検査用装置が使用されるが、アナログ回路の検査
のためには、その信号端子にディジタル回路に対する検
査とは異なる、特殊な測定回路,測定機器を接続する必
要があり、この場合、テストボードも、製品ごとにアナ
ログ回路及び信号端子の位置が異なるため、それぞれの
製品ごとに用意する必要があった。
In order to inspect whether such a semiconductor integrated circuit 10x normally operates, an inspection apparatus including a test board is usually used, but in order to inspect an analog circuit, its signal terminal is used. It is necessary to connect a special measuring circuit and measuring equipment different from the inspection for the digital circuit in this case. In this case, the test circuit also has different analog circuit and signal terminal positions for each product, so prepare for each product. Had to do.

【0007】[0007]

【発明が解決しようとする課題】上述した従来の半導体
集積回路は、特殊用途向けとなっていてアナログ回路及
びその信号端子が任意の位置に配置されるため、製品ご
とに検査用装置のテストボードを用意する必要があり、
テストボードの費用と、テスト用のプログラムやテスト
仕様の変更による費用が発生し、テスト,検査用の費用
が増大するという問題点がある。
The conventional semiconductor integrated circuit described above is intended for a special purpose, and the analog circuit and its signal terminals are arranged at arbitrary positions. Therefore, the test board of the inspection device for each product. Must be prepared,
There is a problem that the cost for the test board and the cost for changing the test program and the test specifications are generated, and the cost for the test and the inspection is increased.

【0008】本発明の目的は、特殊用途向けの特徴を、
継承しつつテスト,検査用の費用を削減することができ
る半導体集積回路を提供することにある。
The object of the present invention is to provide features for special applications,
An object of the present invention is to provide a semiconductor integrated circuit that can reduce costs for testing and inspection while continuing.

【0009】[0009]

【課題を解決するための手段】本発明の半導体集積回路
は、所定の位置に配置されたアナログ回路と、このアナ
ログ回路と接続して所定の位置に配置され外部回路と前
記アナログ回路との間の信号の伝達を行う複数の信号端
子とを有する特殊用途向けの半導体集積回路において、
前記アナログ回路及び信号端子の配置位置を含む諸元の
異なる複数種類に共通の予め設定され固定された位置に
配置されかつ前記複数の信号端子それぞれと対応接続す
る複数のテスト用端子を設けて構成される。
A semiconductor integrated circuit of the present invention includes an analog circuit arranged at a predetermined position, and an analog circuit connected to the analog circuit and arranged at a predetermined position between an external circuit and the analog circuit. In a semiconductor integrated circuit for a special purpose having a plurality of signal terminals for transmitting the signal of
A configuration is provided in which a plurality of test terminals, which are arranged at preset and fixed positions common to a plurality of types having different specifications including arrangement positions of the analog circuit and the signal terminal and which are correspondingly connected to the plurality of signal terminals, are provided. To be done.

【0010】また、アナログ回路が複数配置されてこれ
ら複数のアナログ回路それぞれに対して複数の信号端子
が配置され、前記複数のアナログ回路に共用の複数のテ
スト用端子を設け、前記複数のアナログ回路及び対応す
る信号端子の組のうちの1組を選択して前記複数のテス
ト用端子と接続する選択切換回路を設けて構成され、更
に、複数のテスト用端子に近接して外部回路からの制御
信号を入力するための端子を設け、前記制御信号により
複数のアナログ回路及び対応する信号端子の組のうちの
1組を選択して前記複数のテスト用端子と接続するよう
にして構成される。
Further, a plurality of analog circuits are arranged, a plurality of signal terminals are arranged for each of the plurality of analog circuits, a plurality of test terminals shared by the plurality of analog circuits are provided, and the plurality of analog circuits are provided. And a selection switching circuit for selecting one set of corresponding signal terminals and connecting it to the plurality of test terminals, and further controlling the control from an external circuit in the vicinity of the plurality of test terminals. A terminal for inputting a signal is provided, and one set of a plurality of analog circuits and a corresponding set of signal terminals is selected by the control signal and connected to the plurality of test terminals.

【0011】[0011]

【発明の実施の形態】次に本発明の実施の形態について
図面を参照して説明する。
Embodiments of the present invention will now be described with reference to the drawings.

【0012】図1(A),(B)は本発明の第1の実施
の形態を示す回路図及び配置模式図である。
1A and 1B are a circuit diagram and an arrangement schematic diagram showing a first embodiment of the present invention.

【0013】この実施の形態が図4(A),(B)に示
された従来の半導体集積回路と相違する点は、アナログ
回路及びこのアナログ回路と接続する信号端子の配置位
置を含む諸元の異なる複数種類の半導体集積回路に共通
の予め設定され固定された位置に配置されかつ複数の信
号端子TS1,TS2それぞれと対応接続する複数のテ
スト用端子TT1,TT2を設けた点にある。
This embodiment is different from the conventional semiconductor integrated circuit shown in FIGS. 4A and 4B in that it includes specifications including an arrangement position of an analog circuit and a signal terminal connected to the analog circuit. The plurality of different types of semiconductor integrated circuits are provided with a plurality of test terminals TT1 and TT2 arranged at preset and fixed positions common to the plurality of different types of semiconductor integrated circuits and correspondingly connected to the plurality of signal terminals TS1 and TS2.

【0014】次に、この第1の実施の形態の動作及び検
査方法について説明する。
Next, the operation and inspection method of the first embodiment will be described.

【0015】通常の動作時には、テスト用端子TT1,
TT2は開放状態とし、信号端子TS1,TS2を外部
回路と接続して、外部回路とアナログ回路1a,1bと
の間で信号のやりとりを行う。
During normal operation, the test terminals TT1,
The TT2 is opened, the signal terminals TS1 and TS2 are connected to an external circuit, and signals are exchanged between the external circuit and the analog circuits 1a and 1b.

【0016】次に、アナログ回路1a,1bの検査を行
うときは、信号端子TS1,TS2を開放状態とし、テ
スト用端子TT1,TT2を外部回路、TS1,TS2
を開放状態とし、テスト用端子TT1,TT2を外部回
路、すなわち、検査用装置のテストボードに接続してア
ナログ回路1a,1bと検査用装置との間で信号のやり
とりを行う。
Next, when the analog circuits 1a and 1b are inspected, the signal terminals TS1 and TS2 are opened and the test terminals TT1 and TT2 are connected to the external circuit TS1 and TS2.
Is opened and the test terminals TT1 and TT2 are connected to an external circuit, that is, a test board of the inspection device, and signals are exchanged between the analog circuits 1a and 1b and the inspection device.

【0017】この第1の実施の形態においては、テスト
用端子TT1,TT2が、アナログ回路及びこのアナロ
グ回路と接続する信号端子の配置位置を含む諸元(以
下、アナログ諸元という)の異なる複数種類の半導体集
積回路と共用の、予め設定され固定された位置に配置さ
れているので、これら複数の種類の半導体集積回路に対
して1つのテストボードを用意すればよく、また、テス
トのためのプログラムやテスト仕様も共用することがで
きる。
In the first embodiment, the test terminals TT1 and TT2 have a plurality of specifications (hereinafter referred to as analog specifications) including an arrangement position of an analog circuit and a signal terminal connected to the analog circuit. Since the semiconductor integrated circuits are arranged in a preset and fixed position, which is shared with the semiconductor integrated circuits of different types, it is sufficient to prepare one test board for these plural types of semiconductor integrated circuits. Programs and test specifications can also be shared.

【0018】従って、種類の異なる複数の半導体集積回
路ごとにテストボード,プログラム,テスト仕様を用意
していた従来例に比べ、これらテスト,検査に係わる費
用を低減することができる。しかも、特殊用途向けの半
導体集積回路としての特徴をそのまま継承することがで
きる。
Therefore, the cost for these tests and inspections can be reduced as compared with the conventional example in which a test board, a program, and a test specification are prepared for each of a plurality of different types of semiconductor integrated circuits. Moreover, the characteristics of the semiconductor integrated circuit for special purposes can be inherited as they are.

【0019】図2(A),(B)は本発明の第2の実施
の形態を示す回路図、図3はその配置模式図である。
2 (A) and 2 (B) are circuit diagrams showing a second embodiment of the present invention, and FIG. 3 is a layout schematic diagram thereof.

【0020】この第2の実施の形態が第1の実施の形態
と相違する点は、アナログ回路1a及びその信号端子T
S1の組、並びにアナログ回路1b及びその信号端子T
S2の組の2組に共用のテスト用端子TTと、これらテ
スト用端子TTに近接して制御信号用のテスト用端子T
Taとを設け、このテスト用端子TTaに入力される制
御信号に従って上記2組のうちの1組を選択してテスト
用端子TTに接続する選択切換回路2を設けた点にあ
る。
The second embodiment is different from the first embodiment in that the analog circuit 1a and its signal terminal T are provided.
S1 set, analog circuit 1b and its signal terminal T
A test terminal TT shared by two sets of S2 and a test terminal T for a control signal in the vicinity of these test terminals TT.
Ta is provided, and a selection switching circuit 2 for selecting one of the above two sets and connecting it to the test terminal TT is provided in accordance with a control signal input to the test terminal TTa.

【0021】なお、選択切換回路2は、図2(B)に示
されたように、トランスファゲートTG1〜TG4と、
インバータIV1とを備えた構成となっている。
The selection switching circuit 2 includes transfer gates TG1 to TG4, as shown in FIG.
It has a configuration including an inverter IV1.

【0022】この第2の実施の形態において、アナログ
回路1a,1bを検査するときには、テスト用端子TT
aに入力される制御信号により、アナログ回路1a,1
bのうちの一方を選択して1つずつ行う。この場合、検
査時間はやや長くなるものの、テスト用端子全数が第1
の実施の形態より少なくなるので半導体集積回路全体の
寸法を小さくすることができる。また、信号端子及びテ
スト用端子を含む端子全体の数が制限されるように場
合、この第2の実施の形態は極めて有効である。
In the second embodiment, when the analog circuits 1a and 1b are inspected, the test terminal TT is used.
By the control signal input to a, the analog circuits 1a, 1
Select one of b and perform one by one. In this case, the inspection time is slightly longer, but the total number of test terminals is
Since the number is smaller than that of the embodiment, the size of the entire semiconductor integrated circuit can be reduced. The second embodiment is extremely effective when the total number of terminals including the signal terminals and the test terminals is limited.

【0023】なお、この第2の実施の形態においても、
第1の実施の形態と同様の効果を有する。
Incidentally, also in the second embodiment,
It has the same effect as the first embodiment.

【0024】[0024]

【発明の効果】以上説明したように本発明は、アナログ
諸元の異なる複数種類の半導体集積回路に共通の、予め
設定され固定された位置に配置されかつアナログ回路の
信号伝達用の信号端子と直接、または選択切換回路を介
して接続する複数のテスト用端子を設けた構成とするこ
とにより、上記複数種類の半導体集積回路に共用の検査
用装置のテストボード及びプログラム,テスト仕様を一
組用意すればよいので、特殊用途向けの特徴を継承しつ
つ、これらテスト,検査に係る費用を削減することがで
きる効果がある。
As described above, according to the present invention, a signal terminal for signal transmission of an analog circuit is provided which is common to a plurality of types of semiconductor integrated circuits having different analog specifications and which is arranged at a preset and fixed position. A set of test boards, programs, and test specifications for a common inspection device for the above-mentioned semiconductor integrated circuits of multiple types is prepared by providing a plurality of test terminals that are connected directly or through a selection switching circuit. Therefore, the cost for these tests and inspections can be reduced while inheriting the features for special applications.

【図面の簡単な説明】[Brief description of drawings]

【図1】本発明の第1の実施の形態を示す回路図及び配
置模式図である。
FIG. 1 is a circuit diagram and an arrangement schematic diagram showing a first embodiment of the present invention.

【図2】本発明の第2の実施の形態を示す回路図であ
る。
FIG. 2 is a circuit diagram showing a second embodiment of the present invention.

【図3】本発明の第2の実施の形態を示す配置模式図で
ある。
FIG. 3 is an arrangement schematic diagram showing a second embodiment of the present invention.

【図4】従来の半導体集積回路の一例を示すブロック図
及び配置模式図である。
FIG. 4 is a block diagram and an arrangement schematic diagram showing an example of a conventional semiconductor integrated circuit.

【符号の説明】[Explanation of symbols]

1a,1b アナログ回路 2 選択切換回路 10,10a,10x 半導体集積回路 TS1,TS2 信号端子 TT,TT1,TT2,TTa テスト用端子 1a, 1b Analog circuit 2 Selection switching circuit 10, 10a, 10x Semiconductor integrated circuit TS1, TS2 Signal terminal TT, TT1, TT2, TTa Test terminal

Claims (3)

【特許請求の範囲】[Claims] 【請求項1】 所定の位置に配置されたアナログ回路
と、このアナログ回路と接続して所定の位置に配置され
外部回路と前記アナログ回路との間の信号の伝達を行う
複数の信号端子とを有する特殊用途向けの半導体集積回
路において、前記アナログ回路及び信号端子の配置位置
を含む諸元の異なる複数種類に共通の予め設定され固定
された位置に配置されかつ前記複数の信号端子それぞれ
と対応接続する複数のテスト用端子を設けたことを特徴
とする半導体集積回路。
1. An analog circuit arranged at a predetermined position, and a plurality of signal terminals connected to the analog circuit and arranged at a predetermined position for transmitting a signal between an external circuit and the analog circuit. In a semiconductor integrated circuit for special use, the semiconductor integrated circuit is arranged at a preset and fixed position common to a plurality of types having different specifications including the arrangement positions of the analog circuit and the signal terminal, and corresponding connection with each of the plurality of signal terminals. A semiconductor integrated circuit having a plurality of test terminals provided therein.
【請求項2】 アナログ回路が複数配置されてこれら複
数のアナログ回路それぞれに対して複数の信号端子が配
置され、前記複数のアナログ回路に共用の複数のテスト
用端子を設け、前記複数のアナログ回路及び対応する信
号端子の組のうちの1組を選択して前記複数のテスト用
端子と接続する選択切換回路を設けた請求項1記載の半
導体集積回路。
2. A plurality of analog circuits are arranged, a plurality of signal terminals are arranged for each of the plurality of analog circuits, a plurality of test terminals shared by the plurality of analog circuits are provided, and the plurality of analog circuits are provided. 2. The semiconductor integrated circuit according to claim 1, further comprising a selection switching circuit that selects one set of the corresponding signal terminals and connects it to the plurality of test terminals.
【請求項3】 複数のテスト用端子に近接して外部回路
からの制御信号を入力するための端子を設け、前記制御
信号により複数のアナログ回路及び対応する信号端子の
組のうちの1組を選択して前記複数のテスト用端子と接
続するようにした請求項2記載の半導体集積回路。
3. A terminal for inputting a control signal from an external circuit is provided close to the plurality of test terminals, and one of the plurality of analog circuits and the corresponding signal terminal group is set by the control signal. 3. The semiconductor integrated circuit according to claim 2, wherein the semiconductor integrated circuit is selected and connected to the plurality of test terminals.
JP7193703A 1995-07-28 1995-07-28 Semiconductor integrated circuit Pending JPH0945741A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP7193703A JPH0945741A (en) 1995-07-28 1995-07-28 Semiconductor integrated circuit

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP7193703A JPH0945741A (en) 1995-07-28 1995-07-28 Semiconductor integrated circuit

Publications (1)

Publication Number Publication Date
JPH0945741A true JPH0945741A (en) 1997-02-14

Family

ID=16312385

Family Applications (1)

Application Number Title Priority Date Filing Date
JP7193703A Pending JPH0945741A (en) 1995-07-28 1995-07-28 Semiconductor integrated circuit

Country Status (1)

Country Link
JP (1) JPH0945741A (en)

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0281454A (en) * 1988-09-19 1990-03-22 Hitachi Ltd Semiconductor integrated circuit device and method of testing the same
JPH03215762A (en) * 1990-01-19 1991-09-20 Nec Corp Semiconductor integrated circuit

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0281454A (en) * 1988-09-19 1990-03-22 Hitachi Ltd Semiconductor integrated circuit device and method of testing the same
JPH03215762A (en) * 1990-01-19 1991-09-20 Nec Corp Semiconductor integrated circuit

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