JPH0943313A - Semiconductor test method - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a semiconductor test method by which automation of remeasurement of a tested semiconductor device becomes possible and shortening of a measurement work time and promotion of the further automation of a production line can be made possible and fixation of the quality of measurement can be retained. SOLUTION: Testing is conducted by means of a testing device by throwing plural tested semiconductor devices onto the DUT board 3 of a handler 1, and tested semiconductor devices decided as rejections by means of a measurement outcome deciding device 6 are made to remain on the DUT board 3 as they are, and tested semiconductor devices decided as successes are discharged from the handler 1, and the same number of new tested semiconductor devices as that of those discharged is set on the DUT board 3, and as for rejected tested semiconductor devices, after their contact separation/connection from/to sockets, their retesting is conducted together with the new tested semiconductor devices. The retesting of rejected tested semiconductor devices is repeated with predetermined frequency.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention adds a re-measurement function to a handler of a semiconductor device under test having a simultaneous measurement function, and ejects a semiconductor device under test that has failed at the first measurement from the handler. Without fail, retest the semiconductor device under test again with the same number of new semiconductor devices under test as the semiconductor devices under test that have passed and are ejected from the handler. The present invention relates to a semiconductor test method for improving automation time efficiency.

[0002]

2. Description of the Related Art Semiconductor devices such as semiconductor integrated circuits and LSIs (Large Scale Integrated Circuits) are often composed of a large number of circuits and have many functions, and the electrical characteristics of such semiconductor devices are tested. In this case, there are many measurement items, and manually measuring a large number of measurement items increases the manufacturing cost of the semiconductor device. Therefore, the test and measurement of the semiconductor device have been automated early in the semiconductor manufacturing process. Semiconductor device test equipment requires higher speed and higher accuracy of the measurement circuit as the integration density of semiconductor devices increases, and the test pattern becomes longer and the function test and pin measurement are performed with the complexity of the semiconductor device configuration. An increase in the number is required.

In order to meet such requirements, the test equipment is automated and the measurement time is shortened, and the automatic insertion of the leads of the semiconductor device into the socket of the handler is also progressing. FIG. 3 is a flow chart showing the procedure of a conventional semiconductor test method for testing a semiconductor device using such a handler. The conventional semiconductor test method will be described with reference to FIG. First, the first measurement is performed in step S1. In this case, the DU of the handler (not shown) is used.
Insert the leads of a plurality of semiconductor devices under test into the sockets provided on a T (device under test) device, and then, with the leads in contact with the sockets, heat and cool the parts to a set temperature. When the semiconductor device under test is heated or cooled until the temperature reaches a set temperature, the test device sends a predetermined test signal programmed to the semiconductor device under test.

From the operating state of the semiconductor device under test with respect to this test signal, the measurement result determination device makes a first determination in step S2 as to whether the semiconductor device under test is a pass product or a reject product. As a result of this judgment, if there is a passing product among the semiconductor devices under test, it is discharged from the handler in step S3 and classified into the passing product category. Further, if it is determined that the determination result by the determination result determination device in step S2 is a non-defective product for the semiconductor device under test, step S2 is performed.
In 4, the product is automatically discharged from the handler and classified into the rejected product category.

However, when the leads of the semiconductor device under test are inserted into the socket into the handler, the semiconductor device under test is misaligned or the leads of the semiconductor device under test are not properly contacted with the socket. In many cases, the measurement result determination device determines that the test result obtained by the test device is a non-defective product although the product is a non-defective product. Therefore, if the semiconductor device under test classified into the rejected product category in step S4 is tested again,
It may be judged as a passing product. Therefore, in step S4, the lead of the semiconductor device under test classified into the rejected product category is manually inserted into the socket of the handler, and in step S5, the test programmed by the test device is performed on the semiconductor device under test again. Send a signal to perform the second test.

The result of this second test is taken as step S6.
Then, in the same manner as in the case of the determination of the first test result, the measurement result determination device determines, and when the determination result is determined to be a pass product, the handler determines it as a pass product in step S7. Eject semiconductor devices under test and classify them as acceptable products. When the measurement result determination device determines that the result of the determination in step 6 is a rejected product, step S8
The semiconductor device under test that has been determined as a rejected product is automatically discharged from the handler and classified into a rejected product category.

In the same manner, the leads of the semiconductor device under test classified into the rejected product category are again inserted into the socket of the handler by human work, and in step S9, the same as the first and second times. Then, the third measurement is performed by sending a programmed test signal from the test apparatus to the semiconductor device under test. The result of this measurement is determined in step S10.
When the determination result is determined by the measurement result determination device and, as a result of the determination, the semiconductor device under test is determined to be a passing product, the semiconductor device under test of a passing product is discharged from the handler in step S11, Classify as acceptable products. Also,
As a result of the third determination in step S10, if it is determined that there is a rejected semiconductor device under test, the rejected semiconductor device under test is ejected from the handler and rejected in step S12. Classify into product categories.

In this manner, the semiconductor device under test is tested a plurality of times and the pass / fail judgment is made. In the example of FIG. 3, the semiconductor device under test is measured three times. However, the point is that by performing a predetermined number of pre-programmed tests, it is not the failure of the semiconductor device under test itself, but the case of defective contact among the leads of the semiconductor device under test and the socket of the handler. The non-defective product is re-detected.

[0009]

However, in recent years, the automation of the test by the combination of the handler of the semiconductor device under test and the test device has progressed, and the steps S4 to S
5. It is inevitable that human intervention will occur a plurality of times in the transition stage from step S8 to step S9, and when the handler is used and the man-hour is large, the test work of the semiconductor device under test is inefficient. In addition, the semiconductor device under test to be re-measured is once discharged from the handler every time it is determined to be a rejected product, resulting in a long measurement time as a whole and wasted measurement time.

The present invention has been devised in view of the above circumstances, and an object of the present invention is to make it possible to automate re-measurement of a semiconductor device under test, shorten the measurement work time, and improve the production line. It is an object of the present invention to provide a semiconductor test method capable of promoting further automation and maintaining constant measurement quality.

[0011]

In order to achieve the above-mentioned object, the present invention sets a plurality of semiconductor devices under test in a handler with a measuring function and contacts the sockets for measurement of the handlers to the respective semiconductor devices under test. Then, a step of performing a test of each semiconductor device under test by a test signal from the handler with a measuring function, and when there is a semiconductor device under test determined to be unacceptable based on the test result by the handler with a measuring function, The step of leaving the semiconductor device under test determined to be unacceptable in the handler and discharging the semiconductor device under test determined to be passed from the handler, and the same number of new semiconductor devices as the discharged tested device under test. The step of setting the semiconductor device under test in the handler and the contact of the measuring socket for the rejected semiconductor device under test remaining in the handler After opening time, a step of re-contact, and the features novel become more thing as the set step of simultaneously testing the determined and tested semiconductor device under test semiconductor device and the failure was on. Further, the present invention is characterized in that the semiconductor device under test determined to be rejected is repeatedly retested a predetermined number of times together with the semiconductor device under test newly set for each test.

When a test signal is supplied to a plurality of semiconductor devices under test mounted on the handler to test the semiconductor device under test, and there is a semiconductor device under test for which the test result is determined to be unacceptable from the measurement result. Causes the semiconductor device under test determined to be unacceptable to remain in the handler, and ejects the semiconductor device under test determined to be acceptable. Then, the same number of new semiconductor devices under test as the discharged semiconductor devices under test are automatically attached to the handler, and after temporarily opening the contact of the measurement socket for the rejected semiconductor device under test remaining in the handler, Recontacting is performed, and the new semiconductor device under test and the semiconductor device under test that failed are simultaneously tested. The semiconductor device to be tested that has failed is repeatedly retested a predetermined number of times together with the semiconductor device to be tested newly set for each test.

Therefore, it is possible to automate the re-measurement without ejecting or resetting the semiconductor device under test which has been determined to be rejected, which shortens the measurement work time and further increases the production line. It is possible to maintain the automation quality and the measurement quality.

[0014]

BEST MODE FOR CARRYING OUT THE INVENTION Embodiments of a semiconductor test method of the present invention will be described below with reference to the drawings. FIG. 1 is a schematic configuration explanatory view of a handler for carrying out the semiconductor test method of the present invention. Reference numeral 1 in FIG. 1 indicates the entire handler, and a plurality of sockets 4a to 4n are arranged on the DUT board 3 in the measuring section 2 of the handler 1. This socket 4
The leads of the semiconductor device under test (not shown) loaded on the DUT board 3 from the device loading unit 5 are automatically inserted into a to 4n, and the measurement result determination device 6 causes the socket to be inserted into the socket during the test of the semiconductor device under test. A contact command is output to 4a to 4n, and the lead and socket 4 of the semiconductor device under test are output.
a to 4n are electrically and automatically connected. In addition, from the measurement result judging device 6 to the socket 4
Contact opening command for sockets 4 to 4n
a to 4n.

This contact opening command is issued by the sockets 4a ...
4n, the electrical contact between the sockets 4a to 4n and the leads of the semiconductor device under test is automatically opened. Further, with the leads of the semiconductor device under test connected to the sockets 4a to 4n, the semiconductor device under test is heated or cooled to a predetermined temperature at the start of a predetermined test of the semiconductor device under test to set the temperature. A heating / cooling unit 7 for performing the above is provided. The heating / cooling unit 7 sets the temperature in order to test whether or not the semiconductor device under test operates normally in the temperature at which the semiconductor device under test is operated normally.

Further, a pass signal and a fail signal of the test result of the semiconductor device under test are output from the measuring section 2 to the measurement result judging device 6. When either the pass signal or the fail signal is input to the measurement result determination device 6, the measurement result determination device 6 determines whether the semiconductor device under test is acceptable or not. When the measurement result judging device 6 makes a pass judgment, only the semiconductor device under test, which has been judged as pass, passes from the DUT board 3 of the measuring part 2 to the device ejecting part 8
The leads of the semiconductor device to be tested that have been rejected and have been rejected remain to be inserted into any of the sockets 4a to 4n of the DUT board 3 as they are.

However, at the time of discharging the semiconductor device that has passed the test, at the same time, a contact opening command is issued from the measurement result determination device 6 and the leads of the semiconductor device that is not passed among the sockets 4a to 4n of the DUT board 3 are inserted. Are sent to the socket. Therefore, the leads of the semiconductor device under test which have failed are repeatedly electrically opened and contacted with the socket at each test. That is, the previous test signal is reset.

Furthermore, after the semiconductor devices under test that have passed the test are discharged, the same number of new semiconductor devices under test as the semiconductor chips under test that have been discharged from the device loading section 5 are automatically output from the device loading section 5. The leads of the newly inserted semiconductor device under test are automatically inserted into the board 3 and inserted into the ejected sockets of the semiconductor device under test. The newly introduced semiconductor device to be tested and the semiconductor device to be tested that have failed the previous test are subjected to the second test. Every time a failed semiconductor device to be tested appears, the same number of new semiconductor devices to be tested as the semiconductor devices to be tested discharged as acceptable products from the device loading unit 5 are loaded on the DUT board 3, and the new semiconductor device to be tested is tested. The semiconductor device is tested together with the rejected semiconductor device under test that remains on the DUT board 3 as a rejected product. The number of times the semiconductor device under test that has failed is tested is a predetermined number of times programmed in advance.

Next, the semiconductor test method of the present invention using the handler 1 thus constructed will be described with reference to the flow chart of FIG. When performing the first measurement in step S21 of FIG. 2, a plurality of semiconductor devices under test are loaded into the DUT board 3 of the handler 1 from the device loading section 5, and the leads of the semiconductor device under test are inserted into the sockets 4a to 4a.
insert into n. Next, the semiconductor device under test is heated or cooled by the heating / cooling unit 7 so as to reach a predetermined operating temperature. When the temperature of the semiconductor device under test reaches a predetermined set temperature, the measurement result determination device 6 outputs a contact contact command to the sockets 4a to 4n, and the sockets 4a to 4n.
n is brought into electrical contact with the leads of the semiconductor device under test.

In this state, a test device (not shown) connected to the handler 1 connects the semiconductor device under test to the socket 4
A test signal is sent via a to 4n to test the semiconductor device under test. As a result of this test, if all of the semiconductor devices under test are acceptable products, only a pass signal is output to the measurement result determination device 6, and the measurement result determination device 6 uses each of the sockets 4a to 4a.
In step S22, the semiconductor device under test connected to 4n is judged to be passable, and a contact open signal is sent to each of the sockets 4a to 4n. Next, each of these sockets 4a-
The semiconductor device under test connected to 4n is subjected to step S2.
In 3, the products are classified as acceptable products and discharged from the measuring unit 2 to the device discharging unit 8, and the next new semiconductor device under test is automatically loaded from the device loading unit 5 to the DUT board 3 of the measuring unit 2. A lead of a new semiconductor device under test is inserted into each of the sockets 4a to 4n to prepare for the first test.

However, normally, in the semiconductor device under test, the leads of the semiconductor device under test are misaligned with respect to the socket or contact failure occurs, so that the semiconductor device under test is not acceptable. Acceptable products are mixed, and a pass signal and a fail signal are output to the measurement result determination device 6. When the pass / fail of the semiconductor device under test is determined by the measurement result determination device 6 in step S22, the semiconductor device under test of the acceptable product is classified into the acceptable product category in step S23 and the device is ejected from the DUT board 3. Part 8
Is discharged. At this time, the semiconductor device under test of the rejected product remains on the DUT board 3 as it is, and at the same time as the semiconductor device under test of the acceptable product is discharged to the device discharging portion 8, the contact is opened from the measurement result judging device 6. The command is output to the socket in which the lead of the semiconductor device under test of the rejected product of the DUT board 3 is inserted. As a result, the electrical contact between the socket and the lead of the semiconductor device under test of the rejected product is opened, and the processing for the first test signal for the semiconductor device under test of the rejected product is released. Will be.

In this way, in the state where the failed semiconductor device to be tested is left on the DUT board 3, next step S24 is performed.
Then, the processing shifts to the second test. In the case of this second test, the same number of new semiconductor devices under test as the semiconductor devices under test of the acceptable product discharged according to the result of the first test are transferred from the device loading section 5 to the DUT board 3. The lead of the new semiconductor device under test is automatically inserted into the socket in which the lead of the semiconductor device under test of the discharged acceptable product is inserted. This gives D
This means that the rejected semiconductor device to be tested and the new semiconductor device to be tested are mixedly mounted on the UT board 3.

In this state, as in the case of the first measurement process, the heating / cooling unit 7 heats or cools all the semiconductor devices under test to a predetermined temperature to reach the set temperature. When the set temperature is reached, a contact contact command is sent from the measurement result determination device 6 to each socket 4 of the DUT board 3.
a to 4n to bring the sockets 4a to 4n into contact with the leads of all the semiconductor devices under test. In this state,
The test apparatus completes preparations for executing the second test, and the test signal is supplied from the test apparatus to the semiconductor device under test.

By this test, the pass signal and the fail signal of the semiconductor device under test are output from the DUT board 3 to the measurement result judging device 6. The measurement result determination device 6 determines, in step S25, which semiconductor device under test passes or fails based on the pass signal and the fail signal, and determines the semiconductor device under test as a pass product. On the other hand, similarly to the case of the first determination result, the semiconductor devices to be tested that are acceptable products are classified into the acceptable product categories in step S26 and are ejected to the device ejecting unit 8. Among the passed products, there are also cases where the semiconductor device under test, which has been judged as a defective product due to a contact failure between the lead and the socket in the previous test, is originally a passed product.

Also in the second test, the semiconductor device under test newly subjected to the second test and the semiconductor device under test determined to be unacceptable in the first test again fail. It may be judged as a passing product. Such a rejected product is continuously left on the DUT board 3 in the same manner as in the case of the first time, and is subjected to the third test after step S27. Also in the case of the third test, the same number of new semiconductor devices under test that have passed the second test and have been passed to the device discharging unit 8 are automatically added from the device loading unit 5 to the DUT. The lead of the new semiconductor device under test is inserted into the board 3 and inserted into the socket of the semiconductor device under test that has passed the second test and has passed the device discharging section 8.

Then, a contact contact command is output from the measurement result judging device 6 to all the sockets 4a to 4n in which the leads of the new semiconductor device to be tested and the semiconductor device to be tested which have been left as unacceptable are inserted. The semiconductor device that is not passed is prepared for the third test. In this state, a test signal is supplied to the sockets 4a to 4n by the test apparatus, and the new semiconductor device under test and the semiconductor device under test that remains as a failure are tested. According to this test, when the pass signal and the fail signal are output from the DUT board 3 to the measurement result determination device 6, the semiconductor device under test of the rejected product is continuously left on the DUT board 3 in step S28, and the passed product is rejected. Simultaneously with the ejection of the semiconductor device to be tested, the measurement result judging device 6 sends a contact opening command to the socket in which the lead of the semiconductor device to be tested of the rejected product is inserted.

As a result, the electrical contact between the lead and the socket of the semiconductor device under test of the rejected product is released, the test signal for the second test is reset, and the third test from the test device is performed. Prepare for signal reception. Thereby, in order to perform the third test, the test signal is supplied from the test device to the sockets 4a to 4n of the DUT board 3,
The third test is performed on the unsuccessful semiconductor device under test and the new semiconductor device under test, and a pass signal and a non-acceptance signal are output depending on whether the unsuccessful semiconductor device under test and the new semiconductor device under test pass or fail. Acceptance signal from DUT board 3 measurement result judging device 6
Send. Based on the pass signal and the fail signal, the pass / fail determination of these semiconductor devices under test is performed in step S28.

As a result of this determination, the semiconductor device under test which has been determined to be an acceptable product is classified into the acceptable product category in step S29 and is ejected from the device ejecting unit 8 to the outside of the handler 1. If the product is determined to be rejected, step S
The product is classified into rejected product categories at 30 and discharged from the device discharge unit 8 to the outside of the handler 1. In this way, the third test is performed, and as a result of the determination, among the semiconductor devices to be tested which are determined to be acceptable products, some of the semiconductor devices which are determined to be unacceptable in the first and second tests. If it is included, it is originally an acceptable product and the first and second products are included.
At the time of the second test, it is assumed that the lead has caused poor contact with the socket or has been displaced with respect to the socket. However, in any case of the first to the third tests, those judged to be rejected and classified into the rejected product category are no longer due to poor contact, but can be regarded as internal defective products. It is a good one.

As described above, in the above-mentioned embodiment, even if a defective product is detected in the semiconductor device under test for each test by performing the test three times, without removing it from the handler 1 artificially,
The semiconductor device is then subjected to the next test together with the same number of new semiconductor devices under test as the semiconductor devices under test which are discharged as acceptable products. Therefore, it is possible to automatically re-measure the semiconductor device under test that has been determined as a rejected product, shorten the measurement time and further automate the production line, and keep the measurement quality constant. be able to.

In the above embodiment, the case where the test is performed three times has been described, but the point is that it is sufficient to program the test a predetermined number of times in advance.

[0031]

As is apparent from the above description, according to the present invention, a plurality of semiconductor devices under test are set in a handler having a measuring function, and the measurement sockets of the handlers are brought into contact with the respective semiconductor devices under test for measurement. A step of performing a test on each semiconductor device under test by a test signal from a handler with a function, and if there is a semiconductor device under test determined to be a failure based on the test result by the handler with a measurement function, it is determined as a failure. Leaving the determined semiconductor device under test in the handler and ejecting the semiconductor device under test determined to be passed from the handler, and the same number of new semiconductors under test as the ejected semiconductor devices under test. The process of setting the device in the handler and the contact of the measuring socket for the semiconductor device under test remaining in the handler is temporarily opened. After the step of re-contact,
The configuration is such that the newly set semiconductor device under test and the semiconductor device under test determined to be unacceptable are simultaneously tested. Further, according to the present invention, the semiconductor device under test determined to be rejected is repeatedly retested a predetermined number of times together with the semiconductor device under test newly set for each test. Therefore, the re-measurement of the semiconductor device under test can be automated, the measurement work time can be shortened, the automation of the production line can be further promoted, and the measurement quality can be kept constant.

[Brief description of drawings]

FIG. 1 is a configuration explanatory view showing a schematic configuration of a handler applied to an embodiment of a semiconductor test method of the present invention.

FIG. 2 is a flowchart showing a processing procedure for explaining an embodiment of a semiconductor test method of the present invention.

FIG. 3 is a flowchart showing a processing procedure for explaining a conventional semiconductor test method.

[Explanation of symbols]

 1 Handler 2 Measuring Part 3 DUT Board 4a-4n Socket 5 Device Inserting Part 6 Measurement Result Judgment Device 7 Heating / Cooling Part 8 Device Discharging Part

Claims (2)

[Claims] 1. A plurality of semiconductor devices to be tested are set in a handler having a measuring function, the measuring sockets of the handlers are brought into contact with each semiconductor device to be tested, and each semiconductor device to be tested is tested by a test signal from the handler having a measuring function. And a step of performing the test, and if there is a semiconductor device under test determined to be rejected based on the test result by the handler with the measurement function, the semiconductor device under test determined to be rejected is left in the handler. Ejecting the semiconductor device under test determined to have passed from the handler, setting the same number of new semiconductor devices under test as the ejected semiconductor device under test in the handler, and remaining in the handler The step of re-contacting after temporarily opening the contact of the measurement socket for the semiconductor device under test that fails, The set comprising the steps of simultaneously testing a tested semiconductor device is determined to be tested semiconductor device and rejected the semiconductor testing method characterized by comprising more. 2. The semiconductor device according to claim 1, wherein the semiconductor device under test determined to be rejected is repeatedly retested a predetermined number of times together with the semiconductor device under test newly set for each test. Test method.