JPH0936532A - Bonding of electronic component - Google Patents
Bonding of electronic componentInfo
- Publication number
- JPH0936532A JPH0936532A JP7206784A JP20678495A JPH0936532A JP H0936532 A JPH0936532 A JP H0936532A JP 7206784 A JP7206784 A JP 7206784A JP 20678495 A JP20678495 A JP 20678495A JP H0936532 A JPH0936532 A JP H0936532A
- Authority
- JP
- Japan
- Prior art keywords
- solder
- bonding
- electronic component
- bonding material
- piece
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
- H05K3/3421—Leaded components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3457—Solder materials or compositions; Methods of application thereof
- H05K3/3485—Applying solder paste, slurry or powder
Landscapes
- Connections Effected By Soldering, Adhesion, Or Permanent Deformation (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
Description
【０００１】[0001]
【発明の属する技術分野】この発明は電子部品の接合方
法に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for joining electronic parts.
【０００２】[0002]
【従来の技術】例えば、液晶表示装置では、表示パネル
を駆動するＬＳＩチップ等の半導体チップをＴＡＢ（Ta
pe Automated Bonding）技術によりテープキャリアパッ
ケージ（Tape Carrier Package:以下、ＴＣＰという）
化して実装し、このＴＣＰのアウタリード（一の電子部
品の接続電極）を回路基板の接合パッド（他の電子部品
の接続電極）に接合したものがある。2. Description of the Related Art For example, in a liquid crystal display device, a semiconductor chip such as an LSI chip for driving a display panel is mounted on a TAB (Ta
Tape carrier package (hereinafter referred to as TCP) by pe Automated Bonding) technology
In some cases, the outer leads (connection electrodes of one electronic component) of this TCP are bonded to the bonding pads (connection electrodes of other electronic components) of the circuit board.
【０００３】ところで、従来よりアウタリードと接合パ
ッドとを接続する接合方法の一つにはんだ付けがある。
この場合、はんだは予め接合パッド上面に形成されてい
る。次に、このはんだの形成方法について図８および図
９を参照して説明する。所定の大きさよりも若干大きめ
の絶縁基板２は、最終的には一点鎖線で示す切断線に沿
って切断されることにより、所定の大きさとされるよう
になっている。この絶縁基板２の一端部上面には、切断
線の内側に複数の接合パッド３が一定のピッチで配列形
成され、切断線の外側には共通リード線４が形成され、
それらの間に接続線５が形成されている。このうち接合
パッド３には引き回し線６が接続されている。そして、
接合パッド４の配列部分および共通リード線４の一端部
を除く絶縁基板２の上面にはソルダレジスト７が塗布さ
れている。この状態において、共通リード線４の一端部
をめっき電極８としてはんだの電解めっきを行うと、接
合パッド３の上面にはんだ層９が形成される。この後、
切断線に沿って切断すると、接合パッド３の上面にはん
だ層９が形成された回路基板１が得られる。By the way, conventionally, soldering is one of the joining methods for connecting the outer lead and the joining pad.
In this case, the solder is previously formed on the upper surface of the bonding pad. Next, a method for forming this solder will be described with reference to FIGS. The insulating substrate 2, which is slightly larger than the predetermined size, is finally cut along the cutting line indicated by the alternate long and short dash line to have the predetermined size. On the upper surface of one end of this insulating substrate 2, a plurality of bonding pads 3 are arranged inside the cutting line at a constant pitch, and a common lead wire 4 is formed outside the cutting line.
The connecting line 5 is formed between them. Of these, the lead wire 6 is connected to the bonding pad 3. And
A solder resist 7 is applied to the upper surface of the insulating substrate 2 excluding the array portion of the bonding pads 4 and one end portion of the common lead wire 4. In this state, when one end of the common lead wire 4 is used as the plating electrode 8 and electrolytic plating of solder is performed, a solder layer 9 is formed on the upper surface of the bonding pad 3. After this,
When cut along the cutting line, the circuit board 1 having the solder layer 9 formed on the upper surface of the bonding pad 3 is obtained.
【０００４】次に、このようにして得られた回路基板１
の接合パッド３に図示しないＴＣＰのアウタリードを接
合する場合、はんだ層９上にアウタリードを位置させ、
ヒートツールによって加熱しつつ加圧すると、接合パッ
ド３にアウタリードがはんだ層９を介して接合されるこ
とになる。Next, the circuit board 1 thus obtained
When bonding the TCP outer lead (not shown) to the bonding pad 3 of FIG. 1, position the outer lead on the solder layer 9,
When pressure is applied while heating with a heat tool, the outer leads are bonded to the bonding pads 3 via the solder layer 9.
【０００５】[0005]
【発明が解決しようとする課題】しかしながら、この従
来の接合方法にあっては、はんだ層９を形成する際、め
っき電極８となる共通リード線４の一端部と複数の接合
パッド３との間の各配線抵抗が配線長等が異なるために
同一とならず、印加されるめっき電圧が接合パッド３ご
とに変化し、すべての接合パッド３にはんだ層９を均一
に析出させて形成することが困難である。そのため、各
接合パッド３でははんだ層９の形成量にバラツキが生
じ、過少の場合はアウタリードとの間の接合強度が不足
し、過分の場合はアウタリードとの接合に際し溶融した
過分のはんだ層９が隣接するものに接触して短絡を引き
起こし易い。特に、後者の短絡の問題は、アウタリード
を微小ピッチ化するのに弊害となっていた。この発明の
課題は、はんだ等の接合材の量等を均一にできるように
することである。However, in this conventional bonding method, when the solder layer 9 is formed, between the one end of the common lead wire 4 which becomes the plating electrode 8 and the plurality of bonding pads 3. Since the wiring resistances are not the same because the wiring lengths are different, the applied plating voltage changes for each bonding pad 3, and the solder layer 9 can be uniformly deposited and formed on all the bonding pads 3. Have difficulty. Therefore, the amount of the solder layer 9 formed in each bonding pad 3 varies, and when the amount is too small, the bonding strength between the outer lead and the outer lead is insufficient. It is easy to come into contact with an adjacent object and cause a short circuit. In particular, the latter problem of short-circuiting has been an obstacle to reducing the outer lead pitch. An object of the present invention is to make it possible to make the amount of bonding material such as solder uniform.
【０００６】[0006]
【課題を解決するための手段】この発明は、接合材成形
部材の上面に一定ピッチで配設されている同一形状の複
数の凹部にそれぞれ接合材料を供給して接合材片を成形
し、これらの接合材片を一の電子部品に設けられている
複数の接続電極に転写し、転写された前記接合材片を介
して前記一の電子部品の接続電極を他の電子部品に設け
られている接続電極に接合するようにしたものである。According to the present invention, a bonding material is supplied to a plurality of recesses of the same shape arranged on the upper surface of a bonding material molding member at a constant pitch to mold a bonding material piece. The bonding material piece of 1 is transferred to a plurality of connection electrodes provided in one electronic component, and the connection electrode of the one electronic component is provided in another electronic component via the transferred bonding material piece. It is designed to be joined to the connection electrode.
【０００７】そして、この発明のように、接合材成形部
材の同一形状の複数の凹部にそれぞれ接合材料を供給し
て接合材片を成形すると、これらの接合材片の平面的形
状および量を同一とすることができ、したがってこれら
の接合材片を一の電子部品の接続電極に転写し、転写さ
れた接合材片を介して一の電子部品の接続電極を他の電
子部品の接続電極に接合すると、両接続電極を接合する
ための接合材の量等を均一にすることができる。As in the present invention, when the bonding material is molded by supplying the bonding material to the plurality of recesses having the same shape of the bonding material molding member, the bonding material pieces have the same planar shape and amount. Therefore, these bonding material pieces are transferred to the connection electrode of one electronic component, and the connection electrode of one electronic component is bonded to the connection electrode of another electronic component via the transferred bonding material piece. Then, the amount of the bonding material for bonding the both connection electrodes can be made uniform.
【０００８】[0008]
【発明の実施の形態】次に、この発明の一実施形態につ
いて説明するに、まず、図１(a)に示すはんだ成形部材
（接合材成形部材）１０を用意する。このはんだ成形部
材１０は、基本的には、シリコン等からなる基板状の型
プレート１１の上面に平面ほぼ長方形状でほぼ一定の深
さの同一形状の複数の凹部が一定のピッチで形成された
構造となっている。このはんだ成形部材１０は、図２
(a)〜(d)に示す工程の順に製作される。まず、図２(a)
のように、型プレート１１の上面にスピンコート法等で
フォトレジスト１２を1.0〜2.0μｍ程度の厚さに塗布す
る。次に、図２(b)のように、フォトレジスト１２をガ
ラス等のマスク１３を用いて露光し、現像を行うことで
マスク１３通りの形状としたフォトレジスト１２ａを加
工する。次に、図２(c)のように、マスク１３通りに加
工されたフォトレジスト１２ａをマスクにして型プレー
ト１１を水酸化カリウム（ＫＯＨ）等のアルカリ系エッ
チング液でエッチングし、型プレート１１の上面に凹部
１４を形成する。この後、フォトレジスト１２ａを除去
する。次に、図２(d)のように、凹部１４の表面と型プ
レート１１の表面に熱酸化法等で酸化膜１５を数千Å程
度の厚さに形成する。この酸化膜１５は凹部１４から成
形材を容易に離型し易くするためのものであるので、型
プレート１１の材質がシリコンやガラス等のはんだとの
離型性の良いものである場合には、この酸化膜１５の形
成を省略してもよい。かくして、図１(a)に示すはんだ
成形部材１０が製作される。BEST MODE FOR CARRYING OUT THE INVENTION Next, to describe one embodiment of the present invention, first, a solder molding member (bonding material molding member) 10 shown in FIG. 1 (a) is prepared. In this solder-molded member 10, basically, a plurality of concave portions of the same shape having a substantially rectangular shape in a plane and a substantially constant depth are formed at a constant pitch on the upper surface of a substrate-shaped mold plate 11 made of silicon or the like. It has a structure. This solder molding member 10 is shown in FIG.
The steps (a) to (d) are performed in this order. First, Fig. 2 (a)
As described above, the photoresist 12 is applied to the upper surface of the mold plate 11 by a spin coating method or the like to a thickness of about 1.0 to 2.0 μm. Next, as shown in FIG. 2B, the photoresist 12 is exposed by using a mask 13 made of glass or the like, and developed to process the photoresist 12a having the shape of the mask 13. Next, as shown in FIG. 2C, the mold plate 11 is etched with an alkaline etching solution such as potassium hydroxide (KOH) using the photoresist 12a processed according to the mask 13 as a mask to remove the mold plate 11 A recess 14 is formed on the upper surface. After that, the photoresist 12a is removed. Next, as shown in FIG. 2D, an oxide film 15 is formed on the surface of the recess 14 and the surface of the mold plate 11 to a thickness of about several thousand Å by a thermal oxidation method or the like. Since the oxide film 15 is for easily releasing the molding material from the recessed portion 14, when the material of the mold plate 11 has a good mold releasability from solder such as silicon or glass. The formation of the oxide film 15 may be omitted. Thus, the solder molding member 10 shown in FIG. 1 (a) is manufactured.
【０００９】次に、図１(b)に示すように、はんだ成形
部材１０の複数の凹部１４にそれぞれはんだペースト
（接合材料）２０ａを供給してはんだ片（接合材片）２
０を配列して成形する。このはんだ片２０は、図３(a)
〜(d)に示す工程の順に成形される。まず、図３(a)のよ
うに、はんだペースト２０ａを型プレート１１の上面に
載せ、スキージ１６を一方側から他方側へ移動させて、
図３(b)のように、すべての凹部１４にはんだペースト
２０ａを同一量ずつ供給する。次に、不活性ガス等によ
り酸素濃度が数ppm以下となった雰囲気中において、凹
部１４内のはんだペースト２０ａを所定の温度で加熱
し、図３(c)のように、溶解はんだ２０ｂとする。この
場合、はんだペースト２０ａ中の金属材が溶解するとと
もに、金属材以外の他の有機物成分が蒸発するが、蒸発
しない有機物成分は溶解金属材との比重差によって分離
し表面に析出する。次に、型プレート１１全体を冷却し
て凹部１４内の溶解はんだ２０ｂを冷却し固化させる
と、図３(d)のように、凹部１４内にはんだ片２０が形
成される。この後、はんだ片２０の表面に析出した有機
物成分を洗浄して除去する。かくして、図１(b)に示す
ように、はんだ成形部材１０の凹部１４にはんだ片２０
が成形される。Next, as shown in FIG. 1 (b), solder paste (bonding material) 20a is supplied to each of the plurality of recesses 14 of the solder molding member 10 to solder piece (bonding material piece) 2
0 is arrayed and molded. This solder piece 20 is shown in FIG.
Molded in the order of steps (d) to (d). First, as shown in FIG. 3A, the solder paste 20a is placed on the upper surface of the mold plate 11, and the squeegee 16 is moved from one side to the other side,
As shown in FIG. 3B, the same amount of solder paste 20a is supplied to all the recesses 14. Next, the solder paste 20a in the concave portion 14 is heated at a predetermined temperature in an atmosphere in which the oxygen concentration is several ppm or less due to an inert gas or the like to form the molten solder 20b as shown in FIG. 3 (c). . In this case, the metal material in the solder paste 20a is dissolved and other organic material components other than the metal material are evaporated, but the organic material components that are not evaporated are separated due to the difference in specific gravity from the dissolved metal material and deposited on the surface. Next, when the entire mold plate 11 is cooled and the molten solder 20b in the recess 14 is cooled and solidified, the solder piece 20 is formed in the recess 14 as shown in FIG. After that, the organic component deposited on the surface of the solder piece 20 is washed and removed. Thus, as shown in FIG. 1 (b), the solder piece 20 is placed in the recess 14 of the solder molding member 10.
Is molded.
【００１０】次に、図４を参照して、はんだ成形部材１
０上の複数のはんだ片２０をＴＣＰ３０のベースフィル
ム３１端部から突出された複数のアウタリード３２に転
写する場合について説明する。まず、はんだ成形部材１
０上の各はんだ片２０の上面中央部に各アウタリード３
２を当接させる。次に、ヒートツール４０を降下させ、
その下面をアウタリード３２の上面に圧接させる。そし
て、ヒートツール４０を一瞬だけ、はんだ片２０の融点
よりも数十度高い程度に加熱する。すると、アウタリー
ド３２と接触しているはんだ片２０の上面中央部のみ
が、アウタリード３２を介して加熱されることになり、
瞬間的に溶融した後、固化する。これにより、はんだ片
２０の上面中央部がアウタリード３２に融着される。こ
の後、ヒートツール４０を上昇させ、次いでＴＣＰ３０
全体を持ち上げると、アウタリード３２に融着されたは
んだ片２０が凹部１４から剥離される。かくして、図５
に示すように、はんだ片２０がアウタリード３２に転写
されることになる。Next, referring to FIG. 4, the solder molding member 1
A case will be described in which a plurality of solder pieces 20 on the substrate 0 are transferred to the plurality of outer leads 32 protruding from the end portion of the base film 31 of the TCP 30. First, the solder molding member 1
Each outer lead 3 on the center of the upper surface of each solder piece 20 on
2 is abutted. Next, lower the heat tool 40,
The lower surface is brought into pressure contact with the upper surface of the outer lead 32. Then, the heat tool 40 is momentarily heated to a temperature of several tens of degrees higher than the melting point of the solder piece 20. Then, only the central portion of the upper surface of the solder piece 20 in contact with the outer lead 32 is heated via the outer lead 32,
It melts momentarily and then solidifies. As a result, the central portion of the upper surface of the solder piece 20 is fused to the outer lead 32. After this, the heat tool 40 is raised and then the TCP 30
When the whole is lifted, the solder piece 20 fused to the outer lead 32 is peeled from the recess 14. Thus, FIG.
As shown in, the solder piece 20 is transferred to the outer lead 32.
【００１１】ここで、はんだ片２０の形状について説明
する。図１(a)においてすでに説明したように、はんだ
成形部材１０の凹部１４は平面ほぼ長方形状でほぼ一定
の深さとなっているので、図５に示すように、はんだ片
２０の形状は厚さがほぼ一定の平面ほぼ長方形状とな
る。また、複数の凹部１４は同一形状であるので、複数
のはんだ片２０も同一形状となる。ところで、はんだ片
２０の平面形状がほぼ長方形状となるようにしたのは、
次に図６を参照して説明する回路基板１の接合パッド３
の平面形状がほぼ長方形状であるので、この接合パッド
３の平面形状と同一かもしくはそれよりも若干小さくな
るようにしたからである。Now, the shape of the solder piece 20 will be described. As already described in FIG. 1 (a), since the concave portion 14 of the solder molding member 10 has a substantially rectangular shape in a plane and has a substantially constant depth, the shape of the solder piece 20 has a thickness as shown in FIG. Has a substantially constant plane and a substantially rectangular shape. Moreover, since the plurality of recesses 14 have the same shape, the plurality of solder pieces 20 also have the same shape. By the way, the reason why the plane shape of the solder piece 20 is substantially rectangular is
Next, the bonding pad 3 of the circuit board 1 described with reference to FIG.
This is because the planar shape of the bonding pad 3 is substantially rectangular, and is made to be the same as or slightly smaller than the planar shape of the bonding pad 3.
【００１２】次に、図６を参照して、ＴＣＰのアウタリ
ード３２と回路基板１の接合パッド３とを接合する場合
について説明する。ただし、図６においては、説明の便
宜上、図８および図９に示された部分と同一名称部分に
同一の符号を付し、その説明を適宜省略する。まず、複
数のアウタリード３２に転写された各はんだ片２０を複
数の接合パッド３の各上面に重ね合わせる。この場合、
はんだ片２０と接合パッド３の平面形状が共にほぼ長方
形状であるので、両者の縦横方向の各中心線が互いに一
致するように重ね合わせる。次に、ヒートツール４０を
降下させて加圧するとともに加熱し、はんだ片２０を溶
融させた後固化させると、図７に示すように、はんだ片
２０を介してアウタリード３２が接合パッド３に熱圧着
されることになる。この熱圧着工程は、例えばＮ2Ｈ2と
ＡｒＨ2との混合ガスによる低酸素の不活性還元ガス雰
囲気中において行うか、あるいは無洗浄タイプのフラッ
クスを使用して行う。すると、アウタリード３２とはん
だ片２０双方の表面酸化物が除去され、接合時の酸化を
防ぐことができる。Next, referring to FIG. 6, the case where the outer lead 32 of the TCP and the bonding pad 3 of the circuit board 1 are bonded will be described. However, in FIG. 6, for convenience of description, the same reference numerals are given to the same names as those shown in FIGS. 8 and 9, and the description thereof will be appropriately omitted. First, the solder pieces 20 transferred to the plurality of outer leads 32 are superposed on the upper surfaces of the plurality of bonding pads 3. in this case,
Since both the solder pieces 20 and the bonding pads 3 have a substantially rectangular shape in plan view, the solder pieces 20 and the bonding pads 3 are overlapped so that their respective center lines in the vertical and horizontal directions coincide with each other. Next, when the heat tool 40 is lowered, pressurized and heated to melt and then solidify the solder piece 20, the outer lead 32 is thermocompression bonded to the bonding pad 3 via the solder piece 20 as shown in FIG. 7. Will be done. This thermocompression bonding step is carried out, for example, in a low oxygen inert reducing gas atmosphere of a mixed gas of N 2 H 2 and ArH 2 or using a non-cleaning type flux. Then, the surface oxides of both the outer leads 32 and the solder pieces 20 are removed, and the oxidation at the time of joining can be prevented.
【００１３】以上のように、この実施形態の接合方法で
は、はんだ成形部材１０の同一形成の複数の凹部１４に
それぞれはんだペースト２０ａを供給してはんだ片２０
を成形しているので、これらのはんだ片２０の平面的形
状および量を同一とすることができる。したがって、こ
れらのはんだ片２０をＴＣＰのアウタリード３２に転写
し、転写されたはんだ片２０を介してＴＣＰのアウタリ
ード３２を回路基板１の接合パッド３に接合すると、こ
の接合に供されるはんだの量等を均一にすることができ
る。この場合、はんだ片２０の平面形状を接合パッド３
の平面形状と同一かもしくはそれよりも若干小さくなる
ようにすると、フィレット形状の均一なものが得られ、
バラツキのない接合強度を得ることができるばかりでな
く、短絡防止にも有効である。この結果、アウタリード
３２の微小ピッチ化が可能となり、100μｍピッチ以下
とすることもできる。As described above, in the joining method of this embodiment, the solder paste 20a is supplied to each of the plurality of recesses 14 of the solder forming member 10 which are formed in the same manner, and the solder piece 20 is supplied.
Since these are molded, the solder pieces 20 can have the same planar shape and quantity. Therefore, when these solder pieces 20 are transferred to the TCP outer leads 32 and the TCP outer leads 32 are bonded to the bonding pads 3 of the circuit board 1 through the transferred solder pieces 20, the amount of solder used for this bonding is increased. Etc. can be made uniform. In this case, the planar shape of the solder piece 20 is changed to the bonding pad 3
If it is made to be the same as or slightly smaller than the planar shape of, a uniform fillet shape can be obtained,
Not only is it possible to obtain uniform bonding strength, but it is also effective in preventing short circuits. As a result, the outer leads 32 can be finely pitched, and the pitch can be 100 μm or less.
【００１４】なお、上記実施形態では、はんだ片２０の
アウタリード３２への転写を加圧と加熱とによって行っ
ているが、これに限定されず、加圧のみで転写すること
も可能である。例えば、アウタリード等を電解銅箔で形
成した場合、アウタリードのベースフィルムと対向する
側の面に凹凸が形成されているので、このアウタリード
の凹凸面にはんだ片をヒートツールによる加圧のみで食
い込ませることにより（アンカーリング効果）、はんだ
片をアウタリードに転写するようにしてもよい。In the above embodiment, the transfer of the solder piece 20 to the outer lead 32 is performed by pressurization and heating, but the present invention is not limited to this, and it is possible to transfer only by pressurization. For example, when the outer leads and the like are formed of electrolytic copper foil, unevenness is formed on the surface of the outer lead facing the base film. By doing so (anchoring effect), the solder pieces may be transferred to the outer leads.
【００１５】また、上記実施形態では、ＴＣＰのアウタ
リード３２と回路基板１の接合パッド３とを接合する場
合について説明したが、これに限定されず、例えばＴＣ
Ｐのアウタリードと表示パネルの接続電極とを接合する
ようにしてもよく、また半導体チップの実装されていな
い通常のフレキシブル配線基板の接続電極と回路基板ま
たは表示パネルの接続電極とを接合するようにしてもよ
い。In the above embodiment, the case where the outer lead 32 of TCP and the bonding pad 3 of the circuit board 1 are bonded has been described, but the invention is not limited to this, and for example, TC may be used.
The outer lead of P and the connection electrode of the display panel may be joined together, or the connection electrode of the ordinary flexible wiring board on which the semiconductor chip is not mounted and the connection electrode of the circuit board or the display panel are joined together. May be.
【００１６】[0016]
【発明の効果】以上説明したように、この発明によれ
ば、接合材成形部材の同一形状の複数の凹部にそれぞれ
接合材料を供給して接合材片を成形すると、これらの接
合材片の平面的形状および量を同一とすることができ、
したがってこれらの接合材片を一の電子部品の接続電極
に転写し、転写された接合材片を介して一の電子部品の
接続電極を他の電子部品の接続電極に接合すると、両接
続電極を接合するための接合材の量等を均一にすること
ができる。As described above, according to the present invention, when the bonding material is molded by supplying the bonding material to the plurality of recesses having the same shape of the bonding material molding member, the bonding material pieces are flat. Shape and quantity can be the same,
Therefore, when these bonding material pieces are transferred to the connection electrodes of one electronic component, and the connection electrode of one electronic component is bonded to the connection electrode of another electronic component via the transferred bonding material piece, both connection electrodes are connected. It is possible to make the amount and the like of the bonding material for bonding uniform.
【図１】この発明による一実施形態の電子部品の接合方
法において、（a）ははんだ成形部材を示す斜視図、
（b）はこのはんだ成形部材によって複数のはんだ片を
成形した状態を示す斜視図。FIG. 1A is a perspective view showing a solder-molded member in a method for joining electronic components according to an embodiment of the present invention;
(B) is a perspective view showing a state in which a plurality of solder pieces are formed by this solder forming member.
【図２】同接合方法において、（a）〜（b）ははんだ成
形部材の製作工程を順に示す断面図。2A and 2B are cross-sectional views sequentially showing steps of manufacturing a solder-molded member in the joining method.
【図３】同接合方法において、（a）〜（b）ははんだ成
形部材に複数のはんだ片を成形する工程を順に示す断面
図。3A to 3B are cross-sectional views sequentially showing steps of forming a plurality of solder pieces on a solder forming member in the joining method.
【図４】同接合方法において、はんだ成形部材上のはん
だをＴＣＰのアウタリードに転写する状態を示す斜視
図。FIG. 4 is a perspective view showing a state in which the solder on the solder molding member is transferred to the outer leads of the TCP in the joining method.
【図５】同接合方法において、はんだをアウタリードに
転写した状態を示す斜視図。FIG. 5 is a perspective view showing a state in which solder is transferred to outer leads in the same joining method.
【図６】同接合方法において、転写されたはんだを介し
てアウタリードと回路基板の接合パッドとを接合する状
態を示す斜視図。FIG. 6 is a perspective view showing a state in which the outer leads and the bonding pads of the circuit board are bonded via the transferred solder in the bonding method.
【図７】同接合方法において、アウタリードと接合パッ
ドとを接合した状態を示す斜視図。FIG. 7 is a perspective view showing a state in which an outer lead and a bonding pad are bonded in the bonding method.
【図８】従来の回路基板の接合パッドにはんだを形成す
る場合を説明するために示す平面図。FIG. 8 is a plan view shown for explaining a case of forming solder on a bonding pad of a conventional circuit board.
【図９】図８のＸ−Ｘ線に沿う断面図。9 is a sectional view taken along line XX of FIG.
１ 回路基板 ３ 接合パッド １０ はんだ成形部材 １４ 凹部 ２０ はんだ片 ３０ ＴＣＰ ３１ ベースフィルム ３２ アウタリード 1 Circuit Board 3 Bonding Pad 10 Solder Forming Member 14 Recess 20 Solder Piece 30 TCP 31 Base Film 32 Outer Lead
Claims (3)
設されている同一形状の複数の凹部にそれぞれ接合材料
を供給して接合材片を成形し、これらの接合材片を一の
電子部品に設けられている複数の接続電極に転写し、転
写された前記接合材片を介して前記一の電子部品の接続
電極を他の電子部品に設けられている接続電極に接合す
ることを特徴とする電子部品の接合方法。1. A bonding material piece is molded by supplying a bonding material to a plurality of recesses of the same shape which are arranged at a constant pitch on the upper surface of the bonding material molding member. Transferring to a plurality of connection electrodes provided on a component, and connecting the connection electrode of the one electronic component to a connection electrode provided on another electronic component via the transferred bonding material piece. How to join electronic components.
とする請求項１記載の電子部品の接合方法。2. The method for joining electronic components according to claim 1, wherein the joining material piece is solder.
アウタリードであり、前記他の電子部品の接続電極は回
路基板の接合パッドであることを特徴とする請求項１記
載の電子部品の接合方法。3. The bonding of the electronic component according to claim 1, wherein the connecting electrode of the one electronic component is an outer lead of a TCP, and the connecting electrode of the other electronic component is a bonding pad of a circuit board. Method.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7206784A JP2870456B2 (en) | 1995-07-21 | 1995-07-21 | How to join electronic components |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7206784A JP2870456B2 (en) | 1995-07-21 | 1995-07-21 | How to join electronic components |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0936532A true JPH0936532A (en) | 1997-02-07 |
| JP2870456B2 JP2870456B2 (en) | 1999-03-17 |
Family
ID=16529045
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP7206784A Expired - Fee Related JP2870456B2 (en) | 1995-07-21 | 1995-07-21 | How to join electronic components |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2870456B2 (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR19990070186A (en) * | 1998-02-18 | 1999-09-15 | 윤종용 | Tape carrier package |
| US6454159B1 (en) | 1999-08-18 | 2002-09-24 | International Business Machines Corporation | Method for forming electrical connecting structure |
| JP2009032764A (en) * | 2007-07-25 | 2009-02-12 | Nippon Avionics Co Ltd | Method and device for soldering flexible flat cable to electronic component |
-
1995
- 1995-07-21 JP JP7206784A patent/JP2870456B2/en not_active Expired - Fee Related
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR19990070186A (en) * | 1998-02-18 | 1999-09-15 | 윤종용 | Tape carrier package |
| US6454159B1 (en) | 1999-08-18 | 2002-09-24 | International Business Machines Corporation | Method for forming electrical connecting structure |
| JP2009032764A (en) * | 2007-07-25 | 2009-02-12 | Nippon Avionics Co Ltd | Method and device for soldering flexible flat cable to electronic component |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2870456B2 (en) | 1999-03-17 |
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