JPH0936007A - Carrier plate for holding chip component and method of transferring printing paste for chip component - Google Patents

Abstract

PROBLEM TO BE SOLVED: To improve the precision of printing and the workability, and to reduce the fraction defective, by preventing the squeeze-out of printing paste from the transfer groove of a transfer plate when the protrusion height of the side surface of the chip component held inside each holding hole of a carrier plate is low. SOLUTION: Holding holes 13, where chip components (a) surrounded by elastic bodies 12 are fitted are arranged at fixed distance lengthwise and crosswise in the carrier plate and grooves 14 are formed along the diameters of the holding holes 13 in the surface plate of the elastic bodies 12. The chip components a are fitted in the holding holes 13 of the carrier plate so that the side surface thereof protrude slightly from the surface plate of the elastic bodies 12. The carrier plate is positioned so that the groove 14 of the carrier plate agrees with transfer groove 17 that is applied with the printing paste (b) of the transfer plate 16, the side surface of the chip component (a) is pressed to the plant surface of the transfer plate 16 and the printing paste (b) is transferred to the center of the side surface of the chip component (a) in the direction of width.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention applies a printing paste to the side surface of a chip-shaped component, so that the chip-shaped component is fitted into a holding hole surrounded by an elastic body and the side surface of the chip-shaped component is elastic. A chip-shaped component holding carrier plate for holding a plurality of chip-shaped components in a state of slightly protruding from the plate surface of,
The present invention relates to a chip-shaped component printing paste transfer method for transferring a printing paste to the side surface of a chip-shaped component using this carrier plate.

[0002]

2. Description of the Related Art In a bipolar type chip-like circuit component such as a laminated ceramic capacitor or a laminated ceramic inductor, a pair of terminal electrodes are formed at both ends of a chip element body. On the other hand, in a chip-shaped circuit component having a number of poles of three poles or more such as a so-called T-shaped noise filter, terminal electrodes are also formed on the side surfaces of the chip element body. For example, FIG. 8 shows an example of the appearance of a three-pole type chip-shaped circuit component such as the above-mentioned T-shaped noise filter. This chip-shaped circuit component is provided at both ends of the chip-shaped component a which is the chip element body. In addition to having the terminal electrodes d, d, the terminal electrode e is also provided on the side surface of the intermediate portion.

The terminal electrode e formed on the side surface of the intermediate portion of the chip-shaped component a is generally formed by applying a conductive paste on the side surface of the intermediate portion of the chip-shaped component a and baking it. In applying this conductive paste, a carrier plate in which holding holes are arranged in the plate-like elastic body at regular intervals in the vertical and horizontal directions is used, and the side surface of these holding holes is slightly projected from the plate surface of the elastic body. Shaped part a
Is inserted, and the conductive paste is transferred to the side surface in this state.

That is, the chip-like parts a are arranged so that their longitudinal directions are oriented in a direction orthogonal to one of the arranging directions of the holding holes, and the side surfaces thereof are fitted so as to slightly project from the plate surface of the elastic body. . Also, a transfer plate having transfer grooves having elasticity is prepared in accordance with the arrangement pitch of the holding holes, and a printing paste such as a conductive paste is applied to the transfer grooves. Then, the plate surface of the elastic body of the carrier plate and the plate surface of the transfer plate are opposed to each other, and further, the side surface of the chip-shaped component a protruding from the holding hole is aligned so that the transfer groove crosses, and the chip-shaped component a Press the side surface against the plate surface of the transfer plate. The conductive paste filled in the groove of the transfer plate is pressed against the side surface of the chip-shaped component and applied over the side surface and the edge of the other side surface continuous with the side surface. As a result, the conductive paste in the transfer groove is applied so as to cross the side surface of the chip-shaped component a. Then, the carrier plate is raised to separate the chip-shaped component a from the surface of the transfer plate, and the applied printing paste is dried, whereby the applying step is completed.

FIG. 6 shows a state in which the printing paste b is transferred to the side surface of the chip-shaped component a. Here, the chip-shaped parts a are arranged so that the longitudinal direction is oriented in the front-back direction of the paper surface, and are held in the holding holes 3 of the carrier plate. In the chip-shaped component a, the front and rear ends of the paper surface in FIG. 6 are held by abutting against the wall surface of the elastic body 2 surrounding the holding hole 3, and the lower side surface thereof slightly projects from the plate surface of the elastic body 2. There is. It should be noted that the frame 2 is contained inside the elastic body 2, and the elastic body 2 is provided so as to cover the frame 5, and is thereby held by the frame 5.

In this way, the chip-shaped part a of the holding hole 3 is formed.
As shown in FIG. 6 (a), the carrier plate holding the so that the lower surface of the elastic body 2 faces the plate surface of the transfer plate 6,
Placed on it. The transfer plate 6 is made of an elastic material such as rubber, and a transfer groove 7 is formed on the plate surface in accordance with the arrangement direction of the holding holes 3. In FIG. 6, the holding holes 3 in the left-right direction in the drawing are formed. The transfer groove 7 is formed in line with the arrangement direction of No. 3, and the cross section is taken at the central position in FIG.

In this state, lower the carrier plate,
As shown in FIG. 6B, the side surface of the chip-shaped component a held in the holding hole 3 that protrudes from the plate surface of the elastic body 2 is transferred to the transfer plate 6.
Press on. As a result, the printing paste b in the transfer groove 7 is applied across the side surface of the chip-shaped component a held in the holding hole 3 and over the edge of the other side surface continuous with the side surface. After that, the carrier plate is lifted, the printing paste applied to the side surface of the chip-shaped component a is dried, and the chip-shaped component a is taken out from the holding hole of the carrier plate. Is completed. After that, the printing paste is fixed on the surface of the chip-shaped component a by means of baking or the like to form the terminal electrode e as described above.

[0008]

In the case of the printing means of the printing paste b on the side surface of the chip-shaped component a using the carrier plate as described above, the chip-shaped component a is stored in the holding hole 3 of the carrier plate. Then, if the protruding height of the side surface of the chip-shaped component a from the plate surface of the elastic body 2 is low, the following inconvenience occurs. For example, as shown in FIG. 7A, if the side surface of the chip-shaped component a hardly projects from the plate surface of the elastic body 2 or only slightly projects from the plate surface, the transfer is insufficient with normal pressing force. Becomes Therefore, if an attempt is made to apply a stronger pressing force than the normal pressing force and transfer is performed, the result is as shown in FIG.
As shown in FIG. 3, when the chip-shaped component b is strongly pressed against the transfer plate 6, the elastic body 2 elastically deforms, and the plate surface also presses against the transfer plate 6. As a result, since the transfer plate 6 made of an elastic material such as rubber is compressed, the printing paste b in the transfer groove 7 is compressed.
Is extruded and penetrates between the plate surface of the elastic body 2 and the plate surface of the transfer plate 6, or the printing paste b enters the inside of the holding hole 3 as shown in FIG. 7B. For this reason, not only the printing paste b wraps around and adheres to the side surface of the chip-shaped component a by a predetermined size or more, but also the elastic body 2 of the carrier plate
The board surface of is also stained with the printing paste. As a result, printing accuracy deteriorates, workability also deteriorates, and inconveniences such as defective products occur.

On the other hand, if the side surface of the chip-shaped component b is made to largely project from the plate surface of the elastic body 2, the chip-shaped component b is likely to come out of the holding hole 3 and come off easily, and conversely, workability is deteriorated and defective products are It will cause. Further, the chip-shaped component is not held sufficiently, its posture is inclined, and the coating accuracy is deteriorated. In view of such problems in the conventional printing paste transfer means, the present invention performs printing from the transfer groove of the transfer plate even when the side surface of the chip-shaped component held in the holding hole of the carrier plate has a low protruding height. An object of the present invention is to provide a carrier plate and a chip-shaped component printing paste transfer method, which can prevent the paste from being extruded, improve the printing accuracy, improve the workability, and reduce the defective rate, and thus prevent the chip from coming off.

[0010]

In the present invention, since the printing paste b is transferred onto the side surface of the chip-shaped component a, the side surface of the chip-shaped component a held in the holding hole 13 of the carrier plate is transferred to the plate of the transfer plate 16. When pressed against the surface, the groove 14 is formed in a portion of the plate surface of the elastic body 12 facing the transfer groove 17 of the transfer plate 16.
Was formed. As a result, the plate surface of the elastic body 12 is transferred to the transfer plate 1.
Even if it hits the plate surface of No. 6, it is possible to allow the groove 14 to escape so that the plate surface of the elastic body 12 does not hit the portion of the transfer groove 17, thereby reducing the amount of protrusion of the side surface of the chip-shaped component a. However, the printing paste b can be prevented from adhering to the plate surface of the elastic body 12.

That is, in the carrier plate for holding the chip-shaped component according to the present invention, a plurality of holding holes 13 into which the chip-shaped component a surrounded by the elastic body 12 is fitted are arranged vertically and horizontally at regular intervals. A groove 14 is formed on the plate surface of the elastic body 12 along the radial direction of the holding hole 13. Here, the groove 14 is formed along one of the arrangement directions of the plurality of holding holes 13. The groove 14 formed on the plate surface of the elastic body 12 of the carrier plate is a transfer plate 16 that transfers the printing paste b to the side surface of the chip-shaped component a.
The width is made wider than the transfer groove 17 formed on the plate surface.

Further, in the chip-shaped component printing paste transfer method according to the present invention, a plurality of holding holes 13 surrounded by the elastic bodies 12 arranged vertically and horizontally on the carrier plate at regular intervals.
The chip-shaped component a is fitted so that the side surface thereof slightly projects from the plate surface of the elastic body 12, and the longitudinal direction of the chip-shaped component a is oriented in a direction orthogonal to one of the arrangement directions of the holding holes 13. A step of arranging, a step of applying the printing paste b to the transfer groove 17 formed in the transfer plate 16 having elasticity according to the arrangement pitch of the holding holes 13, a plate surface of the elastic body 12 of the carrier plate and the transfer plate 16 and the side surface of the chip-shaped component a protruding from the holding hole 13 is aligned so that the transfer groove 17 is cut, and the side surface of the chip-shaped component a is pressed against the plate surface of the transfer plate 16. In the transfer method having a step of separating the chip-shaped component a from the plate surface of the transfer plate 16 after applying the chip-shaped component holding carrier plate as described above, the groove 1 of the carrier plate is used. There is characterized in that pressing a side surface of the chip-part a are aligned so as to match the transfer groove 17 of the transfer plate 16 to the plate surface of the transfer plate 16.

[0013]

In the carrier plate for holding chip-shaped parts according to the present invention, the holding hole 13 is formed on the plate surface of the elastic body 12.
The groove 14 is formed in the radial direction of the carrier plate. Further, in the chip-shaped component printing paste transfer method using this carrier plate, the groove 14 of the carrier plate is
Since the side surface of the chip-shaped component a is pressed against the plate surface of the transfer plate 16 in alignment with the transfer groove 17 of 6, the projection of the side surface of the chip-shaped component a from the plate surface of the elastic body 12 is performed. Even if the plate surface of the elastic body 3 hits the plate surface of the transfer plate 16 due to its low height, the elastic body 3 can escape to the transfer groove 17 so as not to hit the groove 14 at the groove 14. This can prevent the printing paste b from adhering to the plate surface of the elastic body 12. In order to avoid the transfer groove 17 in this way, the elastic body 1 of the carrier plate is
The groove 14 formed on the second plate surface is preferably wider than the transfer groove 17 formed on the plate surface of the transfer plate 16.

As described above, in the present invention, the printing paste b can be accurately and reliably transferred to the side surface of the chip-shaped component a by only slightly protruding the side surface of the chip-shaped component a from the plate surface of the elastic body 2. . Therefore, the chip-shaped component b does not come off from the holding hole 3, workability is improved, and a defective product due to detachment of the chip-shaped component does not occur. Furthermore, since it is not necessary to project the side surface of the chip-shaped component b from the plate surface of the elastic body 2 more than necessary, the transfer accuracy does not exceed the standard for the size to be applied to the side surface other than the side surface to which the printing paste is applied. improves.

[0015]

Embodiments of the present invention will now be described specifically and in detail with reference to the drawings. FIG. 1 shows an external appearance of a carrier plate holding a chip-shaped component a according to an embodiment of the present invention, FIG. 2 shows an enlarged view of portion A of FIG. 1, and FIGS. FIG. 3 is an enlarged view of an essential part including a transfer plate 16 which is a vertical cross section from the direction in which it is performed. The carrier plate has a frame 11 made of stainless steel or the like, and a frame 15 made of a rigid body in which a large number of through holes are arranged in the frame 11 at regular intervals in the vertical and horizontal directions (see FIGS. 3 and 4).
Is stretched. The frame 15 is covered with an elastic body 12 made of rubber or the like, and the elastic body 12 has a plate shape as a whole. The elastic body 12 has circular holding holes 13, 13 having a diameter smaller than that of the through hole of the frame 15.
Are arranged vertically and horizontally at regular intervals, and this elastic body 1
The diameter of the holding holes 13 surrounded by 2 is smaller than the length of the chip-shaped circuit component a held therein.

Grooves 14 are formed on the main surface of the elastic body 12 in the radial direction of the holding holes 13, 13 along one of the two arranging directions of the holding holes 13, 13 ... Has been formed. The groove 14 is formed wider than the transfer groove 17 of the transfer plate 6 described later. In the illustrated embodiment, the groove 14 is provided only along one arrangement direction of the holding holes 13, 13, ... However, it may be provided along the other arrangement direction of the holding holes 13, 13 ,. In this case, the extension lines of the two sets of grooves 14 are orthogonal to each other at the centers of the holding holes 13, 13, ...

On the other hand, as shown in FIGS. 3 and 4, the transfer plate 16 is made of an elastic material such as a rubber plate and has the holding holes 13 and 1.
3 and the transfer grooves 17 at the same pitch as the arrangement pitch of the grooves 14.
Are formed. As described above, this transfer groove 17
Is narrower than the groove 14 provided on the plate surface of the elastic body 12 of the carrier plate. In the carrier plate, the chip-shaped circuit components a are fitted and held in the holding holes 13 surrounded by the elastic body 12. At this time, the chip-shaped component a
Is fitted into the holding holes 13 so that the longitudinal direction is in the direction orthogonal to the direction in which the grooves 14 are provided, that is, the other arranging direction of the holding holes 13. In this state, both ends of the chip-shaped component a elastically push the wall surface of the elastic body 12, and the chip-shaped component a is held by its reaction force. Further, the side surface of the chip-shaped component a to which the printing paste b is applied is slightly projected from the plate surface of the elastic body 12.

On the other hand, in the transfer groove 17 of the transfer plate 16,
A printing paste b such as a conductive paste is applied, and the printing paste is held in the transfer groove 17. In this state, FIG.
As shown in FIGS. 4A and 4A, the plate surface of the elastic body 12 of the carrier plate on the side where the chip-shaped component a projects is arranged so as to face the plate surface of the transfer plate 16. At this time, positioning is performed so that the groove 14 on the plate surface of the elastic body 12 and the transfer groove 17 of the transfer plate 16 face each other. As a result, the central portion of the side surface of the chip-shaped component a held in the holding hole 13 faces the transfer groove 17 of the transfer plate 16, and the longitudinal direction of the chip-shaped component a faces the direction orthogonal to this transfer groove 17.

In this state, lower the carrier plate,
As shown in FIGS. 3B and 4B, the side surface of the chip-shaped component a protruding from the plate surface of the elastic body 12 is pressed against the transfer plate 16. At this time, since the transfer groove 17 is in contact with the chip-shaped component a held in the holding hole 3 so as to cross the side surface central portion, the printing paste b held in the transfer groove 17 is applied to the plate of the elastic body 12 of the chip-shaped component b. It is applied along the width direction to the center of the side surface protruding from the surface. Thereafter, the carrier plate is raised and the applied printing paste b is dried, whereby the transfer of the printing paste b to the side surface of the chip-shaped component a is completed.

FIG. 5 shows an example in which the projecting height of the side surface of the chip-shaped component a from the plate surface of the elastic body 12 is extremely low in the above process. In this case, when the side surface of the chip-shaped component a is pressed against the transfer plate 16 from the state of FIG. 5A as described above as shown in FIG. 5B, the plate surface of the elastic body 12 is also transferred. Hits 16. However, in the plate surface portion of the elastic body 12, since the groove 14 is present in the transfer groove 17,
It is possible to escape without contacting the printing paste b. Therefore, the printing paste b adheres to the side surface of the chip-shaped component a over the edges of the other side surfaces and does not adhere to the plate surface of the elastic body 12.

The following Table 1 shows a length of 3.2 mm and a length and width of 1.6.
Since the ground electrode is provided in the widthwise direction at the center of the side surface of the cubic T-shaped noise filter of mm, the results are obtained when the silver paste is actually transferred. Here, a carrier plate having the groove 14 as described above and a conventional carrier plate having no such groove are used, respectively. For the latter, the protrusion amount from the plate surface of the elastic body on the side surface of the chip-shaped component is used. Was transferred for two sets of 0.3 mm and 0.1 mm. Regarding the former, transfer was performed only for the case where the amount of protrusion of the elastic body on the side surface of the chip-shaped component from the plate surface was 0.1 mm. The "entrance rate" in Table 1 is the rate of occurrence of chip-shaped parts a in which the coating size of the silver paste attached to the side surface other than the side surface of the chip-shaped part a to which the silver paste is applied exceeds 0.7 mm. Means Further, the “chip detachment rate” refers to a rate at which the chip-shaped component a held in the holding hole 13 of the carrier plate comes out of the holding hole 13. The number of test samples is 1,00
It is 0.

[0022]

[Table 1]

Thus, in the case where the carrier plate according to the embodiment of the present invention having the groove 14 is used and the silver paste is transferred to the side surface of the chip-shaped component a, the chip-shaped component a
Only by slightly projecting the side surface of the above from the plate surface of the elastic body 2, the silver paste can be correctly transferred to the side surface of the chip-shaped component a without the wrapping of the silver paste. Therefore, the chip-shaped component b does not come off from the holding hole 3, and the chip detachment rate is 0.

[0024]

As described above, according to the present invention, the printing paste is extruded from the transfer groove of the transfer plate even if the side surface of the chip-shaped component held in the holding hole of the carrier plate has a low protruding height. Is eliminated, the printing accuracy can be improved, the workability can be improved, and the defect rate can be reduced. Further, since the protruding height of the side surface of the chip-shaped component held in the holding hole of the carrier plate can be reduced, the chip is less likely to come off, and in this respect also, the workability can be improved and the defective rate can be reduced.

[Brief description of drawings]

FIG. 1 is a perspective view showing a state where a chip-shaped component is held in a holding hole of a chip-shaped component holding carrier plate according to an embodiment of the present invention.

FIG. 2 is an enlarged view of a portion A in FIG.

FIG. 3 is a vertical cross-sectional side view of essential parts in a state where the printing paste is transferred to the side surface of the chip-shaped component held in the holding hole using the carrier plate.

FIG. 4 is a vertical cross-sectional front view of essential parts in a state where the printing paste is transferred to the side surface of the chip-shaped component held in the holding hole using the carrier plate.

FIG. 5 is a state in which the printing paste is transferred to the side surface of the chip-shaped component held in the holding hole using the carrier plate, and the amount of protrusion from the side surface of the chip-shaped component and the plate surface of the elastic body is extremely large. FIG. 6 is a vertical sectional side view of a main part when it is extremely small.

FIG. 6 is a vertical cross-sectional front view of essential parts in a state where a printing paste is transferred to a side surface of a chip-shaped component held in a holding hole using a conventional carrier plate.

FIG. 7 is a state in which the printing paste is transferred to the side surface of the chip-shaped component held in the holding hole using the carrier plate, and the amount of protrusion from the side surface of the chip-shaped component and the plate surface of the elastic body is small. FIG. 3 is a vertical sectional front view of a main part in the case.

FIG. 8 is a perspective view showing an example of a chip-shaped component to which a printing paste is applied according to the embodiment of the present invention.

[Explanation of symbols]

 12 elastic body 13 holding hole 14 groove 16 transfer plate 17 transfer groove a chip-like component b printing paste

Claims (4)

[Claims] 1. A carrier plate for holding a chip-shaped component, wherein a plurality of holding holes (13) for fitting the chip-shaped component (a) surrounded by an elastic body (12) are arranged vertically and horizontally at regular intervals. A carrier plate for holding chip-shaped parts, characterized in that a groove (14) is formed on the plate surface of the elastic body (12) along the radial direction of the holding hole (13). 2. The carrier plate for holding chip-shaped components according to claim 1, wherein the groove (14) is formed along one of the arrangement directions of the plurality of holding holes (13). 3. The groove (14) formed on the plate surface of the elastic body (12) of the carrier plate is formed on the plate surface of the transfer plate (16) for transferring the printing paste (b) to the side surface of the chip-shaped component a. The carrier plate for holding chip-shaped parts according to claim 1 or 2, wherein the carrier plate is wider than the transfer groove (17). 4. A plurality of holding holes (1) surrounded by elastic bodies (12) arranged in a carrier plate at regular intervals in length and width.
3) The chip-like component (a) is fitted into the elastic member (12) such that its side surface slightly projects from the plate surface of the elastic body (12), and the longitudinal direction of the chip-like component (a) is one of the holding holes (13). Arranging so as to face in a direction orthogonal to the arranging direction of
The step of applying the printing paste (b) to the transfer groove (17) formed in the transfer plate (16) having elasticity according to the arrangement pitch of the holding holes (13), and the elastic body (12) of the carrier plate. The plate surface and the plate surface of the transfer plate (16) are opposed to each other, and the side surface of the chip-shaped component (a) protruding from the holding hole (13) is aligned so that the transfer groove (17) cuts the same chip shape. A chip-shaped component printing paste transfer method comprising a step of pressing the side surface of the component (a) against the plate surface of the transfer plate (16) and then separating the chip-shaped component (a) from the plate surface of the transfer plate (16). The carrier plate for holding chip-shaped parts according to any one of claims 1 to 3 is used, and the groove (14) of the carrier plate is aligned with the transfer groove (17) of the transfer plate (16). Align the chip parts ( Side chip-like component printing paste transfer method characterized by pressing a plate surface of the transfer plate (16) of).