JPH09325485A - Photosensitive resin composition and layered product using the same - Google Patents

Abstract

PROBLEM TO BE SOLVED: To improve adhesiveness, tent film strength, and peeling property by containing a specific binder polymer, a photo-polymerization monomer having ethylenic unsaturated groups, and a photo-polymerization initiator as main components. SOLUTION: A compound expressed by the formula, a binder polymer having an α,βunsaturated carboxyl group-containing monomer as the essential copolymer component, a photo-polymerization monomer having two or more ethylenic unsaturated groups in one molecule, and a photo-polymerization initiator are contained as main components. In the formula, R1 is hydrogen or methyl group, R2 is hydrogen or alkyl group having 1-4 carbon atoms, (n) is an integer of 4-6, and (m) is an integer of 1-4. ω-carboxy polycaprolactone monoacrylate, methoxycarbonyl polycaprolactone monoacrylate, or butoxycarbonyl polycaprolactone monoacrylate is used as the compound expressed by the formula, for example, and ω-carboxy polycaprolactone monoacrylate is preferably used in particular.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a photosensitive resin composition, and more specifically, it has excellent adhesion and tent film strength as an etching resist or plating resist used in the production of printed wiring boards, precision processing of metals and the like. And a photosensitive resin composition having resist releasability and a laminate thereof.

[0002]

2. Description of the Related Art In the fields of manufacturing printed wiring boards, precision metal processing, etc., use of a photosensitive resin composition and a laminate for a dry film resist using the same as a resist material such as an etching resist or a plating resist. It has been known. 2. Description of the Related Art Conventionally, there are two types of methods for forming a resist in the manufacture of printed wiring boards, precision processing of metals, and the like, a tenting method and a plating method. In the tenting method, copper through-holes for chip mounting are protected with resist, and after etching and resist peeling, electric circuits are formed, whereas the plating method deposits copper in through-holes by electroplating. Then, it is protected by solder plating, and an electric circuit is formed by peeling off resist and etching.

Accordingly, the characteristics required of the photosensitive resin composition include not only good photosensitivity such as photosensitivity, but also adhesion to metal, followability to unevenness on the substrate surface, and the like.
There are various chemical resistances such as etching solutions and plating solutions, resist peeling properties, and, in the case of the tenting method, tent film strength. Among them, adhesion to metal, tent film strength, and resist strippability are important properties, but it is difficult to satisfy all of these properties, and raising one of the properties degrades any of the other properties. There was a point.

As a method for solving such a problem, Japanese Patent Publication No. 7-7208 discloses that a photosensitive resin composition comprising a carboxyl group-containing binder polymer, a photopolymerization initiator and a photopolymerizable monomer is used as a photopolymerizable monomer. A specific addition-polymerizable unsaturated compound having a urethane bond is used, or JP-A-7-56338 and JP-A-7-56338 are used.
-28239 proposes to use a specific graft polymer as the binder polymer.
Further, JP-A-6-161104 and JP-A-7-563.
JP-A-34-34407 and JP-A-7-134407 propose to use a specific photopolymerizable monomer.

[0005]

However, although the techniques disclosed in Japanese Patent Publication No. 7-7208 and Japanese Patent Application Laid-Open No. 7-56338 improve the tent film strength and the peelability, the adhesion is not examined. On the contrary, although the technology disclosed in Japanese Patent Laid-Open No. 7-28239 seeks to improve the adhesion and the strength of the tent film, the peelability has not been examined. That is, the above-mentioned prior art has not obtained a photosensitive resin composition excellent in all of adhesion, tent film strength, and peelability.

Further, in the techniques disclosed in JP-A-6-161104, JP-A-7-56334, and JP-A-7-134407, although the adhesion, tent film strength, and peelability are improved, As a result of detailed study by the present inventors, in view of the recent advancement and refinement of technology, the followability is not yet satisfactory, and further improvement is required. That is, it is desired to develop an excellent photosensitive resin composition having a good balance in adhesion, tent film strength, and releasability.

[0007]

Means for Solving the Problems The inventors of the present invention have conducted intensive studies in view of such circumstances, and as a result, as a result, a compound (a-1) represented by the following chemical formula 1 and an α, β-unsaturated carboxyl group-containing monomer ( A binder polymer (A) containing a-2) as an essential copolymerization component, a photopolymerizable monomer (B) having two or more ethylenically unsaturated groups in one molecule, and a photopolymerization initiator (C). It was found that the photosensitive resin composition containing as a main component is excellent in adhesion to a metal substrate of a resist, tent film strength and resist releasability, and also excellent in followability, and has completed the present invention. .

Embedded image (In the formula, R ₁ is hydrogen or a methyl group, R ₂ is hydrogen or an alkyl group having 1 to 4 carbon atoms, n is an integer of 4 to 6, and m is 1
4 is an integer. )

In the present invention, when the photopolymerizable monomer (B) contains a compound represented by the following chemical formula 2 as an essential component, the effect of the present invention is remarkably exhibited.

Embedded image (In the formula, R represents a hydrogen atom or an alkyl group, and two m
Are each independently an integer of 1 to 20, and X is a compound represented by the following chemical formula 3 or chemical formula 4. )

[0009]

Embedded image (N is an integer of 1 to 20.)

Embedded image

[0010]

BEST MODE FOR CARRYING OUT THE INVENTION The present invention is described in detail below.
The binder polymer (A) used in the present invention is the above-mentioned chemical formula 1
A copolymer containing the compound (a-1) represented by and the α, β-unsaturated carboxyl group-containing monomer (a-2) as essential copolymerization components may be used. The compound (a-1) represented by the above chemical formula 1 is not particularly limited, and includes, for example, ω-carboxypolycaprolactone monoacrylate,
Examples thereof include methoxycarbonylpolycaprolactone monoacrylate and butoxycarbonylpolycaprolactone monoacrylate. Of these, ω-carboxypolycaprolactone monoacrylate is particularly preferable.

Examples of the α, β-unsaturated carboxyl group-containing monomer (a-2) include (meth) acrylic acid, cinnamic acid, crotonic acid, sorbic acid, maleic acid,
Examples of the fumaric acid include acrylic acid and methacrylic acid. Further, as the copolymerization component other than the above (a-1) and (a-2), any copolymerizable vinyl monomer may be used, and examples thereof include (meth) acrylic acid alkyl ester and (meth) acrylic acid tetrahydrofurfuryl ester. , (Meth) acrylic dimethylaminoethyl ester,
(Meth) acrylic acid diethylaminoethyl ester, methacrylic acid glycidyl ester, 2,2,2-trifluoroethyl (meth) acrylate, 2,2,3,3-tetrafluoropropyl (meth) acrylate acrylamide, diacetone acrylamide, styrene , Vinyltoluene, vinyl acetate, alkyl vinyl ether, (meth) acrylonitrile and the like.

Here, as the (meth) acrylic acid ester, methyl (meth) acrylate, ethyl (meth) acrylate, propyl (meth) acrylate, butyl (meth) acrylate, hexyl (meth) acrylate, 2
-Ethylhexyl (meth) acrylate, cyclohexyl (meth) acrylate, benzyl (meth) acrylate, dimethylaminoethyl (meth) acrylate, hydroxyethyl (meth) acrylate, hydroxypropyl (meth) acrylate, glycidyl (meth) acrylate, and the like. You.

The binder polymer (A) of the present invention is composed of the above-mentioned (a-1), (a-2) and other copolymerization components. Regarding the blending amount of (a-1), the copolymerization is carried out. 1 to 30% by weight, preferably 3 to, based on the total amount of the components
It is desired to be 20% by weight, more preferably 5 to 15% by weight. If the content is less than 1% by weight, the flexibility of the cured resist will be poor, so that good tent film strength cannot be obtained. It is not preferable. Also, (a-
Regarding the compounding amount of 2), it is 1 with respect to the total amount of copolymerization components.
It is desired to be 0 to 35% by weight, preferably 10 to 30% by weight, and more preferably 15 to 25% by weight. If the blending amount is less than 10% by weight, the developability is poor, and conversely 35
If it exceeds 5% by weight, the developer resistance is poor and the adhesion is lowered, which is not preferable.

In addition to the above, a polyester resin, a polyamide resin, a polyurethane resin, an epoxy resin or the like can be used in combination with the binder polymer (A). or,
The weight average molecular weight of the binder polymer (A) is 10
000 to 200,000, preferably 30,000 to 180
000, more preferably in the range of 50,000 to 150,000, and if the molecular weight is small, cold flow easily occurs, and conversely, if the molecular weight is large, it is difficult to develop, resulting in a decrease in resolution and poor releasability at the time of resist stripping. Become.

The photopolymerizable monomer (B) is a compound obtained by adding an α, β-unsaturated carboxylic acid to a polyhydric alcohol, such as ethylene glycol di (meth) acrylate, diethylene glycol di (meth) acrylate, tetra. Ethylene glycol di (meth) acrylate, polyethylene glycol di (meth) acrylate,
Propylene glycol di (meth) acrylate, polypropylene glycol di (meth) acrylate, butylene glycol di (meth) acrylate, neopentyl glycol di (meth) acrylate, 1,6-hexane glycol di (meth) acrylate, trimethylolpropane di ( (Meth) acrylate, trimethylolpropane tri (meth) acrylate, tetramethylolmethane tri (meth) acrylate, tetramethylolmethane tetra (meth) acrylate, glycerin di (meth) acrylate, pentaerythritol di (meth) acrylate,
Compounds obtained by adding α, β-unsaturated carboxylic acid to a glycidyl group-containing compound such as pentaerythritol tri (meth) acrylate, dipentaerythritol penta (meth) acrylate, dipentaerythritol hexa (meth) acrylate, for example ethylene Glycol diglycidyl ether di (meth) acrylate, diethylene glycol diglycidyl ether di (meth) acrylate, trimethylolpropane triglycidyl ether triacrylate, bisphenol A glycidyl ether di (meth) acrylate, phthalic acid diglycidyl ester di (meth) acrylate, Glycerin polyglycidyl ether poly (meth) acrylate, etc., 2,2
-Bis (4- (meth) acryloxydiethoxyphenyl) propane, 2,2-bis- (4- (meth) acryloxypolyethoxyphenyl) propane, 2-hydroxy-3- (meth) acryloyloxypropyl (meth ) A polyfunctional monomer such as acrylate may be used, and one or more of them may be used. Particularly, in the present invention, the effect of the present invention is remarkably exhibited when the compound represented by the above Chemical formula 2 is used as an essential component. To do. Examples of the compound represented by the above chemical formula 2 include urethane dimethacrylate monomers produced from hexamethylene diisocyanate and polypropylene glycol monomethacrylate (Blenmer PP-800 manufactured by NOF CORPORATION). An appropriate amount of a monofunctional monomer can be used together with these polyfunctional monomers.

Examples of monofunctional monomers include 2-hydroxyethyl (meth) acrylate, 2-hydroxypropyl (meth) acrylate, 2-hydroxybutyl (meth) acrylate, 2-phenoxy-2-hydroxypropyl (meth) acrylate 2- (meth) acryloyloxy-2-hydroxypropyl phthalate, 3-chloro-2-hydroxypropyl (meth) acrylate,
Examples include glycerin mono (meth) acrylate, 2- (meth) acryloyloxyethyl acid phosphate, phthalic acid derivative half (meth) acrylate, and N-methylol (meth) acrylamide.

The amount of the photopolymerizable monomer (B) to be blended is 25 to 85 parts by weight, preferably 30 to 80 parts by weight, particularly preferably 4 per 100 parts by weight of the binder polymer (A).
It is desirable to select from the range of 0 to 70 parts by weight. Excessive amount of the photopolymerizable monomer (B) causes poor curing, deterioration of flexibility, delay of development speed, etc., and excessive amount of the photopolymerizable monomer (B) increases tackiness, cold flow, and peeling speed of the cured resist. It is not preferable because it causes deterioration.

Examples of the photopolymerization initiator (C) include benzoin, benzoin methyl ether, benzoin ethyl ether, benzoin isopropyl ether, and benzoin n.
-Butyl ether, benzoin phenyl ether, benzyl diphenyl disulfide, benzyl dimethyl ketal, dibenzyl, diacetyl, anthraquinone, naphthoquinone, 3,3'-dimethyl-4-methoxybenzophenone, benzophenone, p, p'-bis (dimethylamino) benzophenone, p , P'-bis (diethylamino) benzophenone, pivaloin ethyl ether, 1,
1-dichloroacetophenone, pt-butyldichloroacetophenone, hexaarylimidazole dimer,
2-chlorothioxanthone, 2-methylthioxanthone, 2,4-diethylthioxanthone, 2,2-diethoxyacetophenone, 2,2-dimethoxy-2-phenylacetophenone, 2,2-dichloro-4-phenoxyacetophenone, phenylglyoxy Rate, α-hydroxyisobutylphenone, dibezosparone, 1- (4
-Isopropylphenyl) -2-hydroxy-2-methyl-1-propanone, 2-methyl- [4- (methylthio) phenyl] -2-morpholino-1-propanone,
Examples include tribromophenyl sulfone, tribromomethylphenyl sulfone, N-phenylglycine and the like. These are used alone or in combination of two or more. The mixing ratio of the photopolymerization initiator (C) is 0.1 to 20 parts by weight, preferably 0.5 to 1 with respect to 100 parts by weight of the total amount of the binder polymer (A) and the photopolymerizable monomer (B).
It is suitable to be 8 parts by weight, more preferably 1 to 15 parts by weight.

The above-mentioned (A), (B) and (C) are essential components in the photosensitive resin composition of the present invention, but if necessary, a thermal polymerization inhibitor, a plasticizer, a dye (colorant, discoloration). Agents), adhesion promoters, antioxidants, solvents, surface tension modifiers, stabilizers, chain transfer agents, defoamers, flame retardants, and the like. For example, a thermal polymerization inhibitor is added to prevent thermal polymerization or polymerization with time of the photosensitive resin composition, and p-methoxyphenol, hydroquinone, t-butylcatechol, pyrogallol, 2-hydroxybenzophenone , 4-methoxy-2-hydroxybenzophenone, cuprous chloride, phenothiazine, chloranil, naphthylamine, β-naphthol, 2,6-di-
t-butyl-p-cresol, nitrobenzene, dinitrobenzene, picric acid, p-toluidine and the like.

The plasticizer is added to control the physical properties of the film. For example, phthalates such as dibutyl phthalate, diheptyl phthalate, dioctyl phthalate, diallyl phthalate; triethylene glycol diacetate, tetraethylene glycol diacetate, etc. Glycol esters of phosphoric acid esters such as tricresyl phosphate and triphenyl phosphate;
Amides such as p-toluenesulfonamide, benzenesulfonamide, Nn-butylacetamide; aliphatic dibasic acid esters such as diisobutyl adipate, dioctyl adipate, dimethyl sebacate, dioctyl azelate, dibutyl malate; citric acid Triethyl, tributyl citrate, glycerin triacetyl ester,
Glycols such as butyl laurate, dioctyl 4,5-diepoxycyclohexane-1,2-dicarboxylate, polyethylene glycol and polypropylene glycol are exemplified.

Examples of the dye include brilliant green, eosin, ethyl violet, erythrosin B,
Methyl green, crystal violet, basic fuchsin, phenolphthalein, 1,3-diphenyltriazine, alizarin red S, thymolphthalein, methyl violet 2B, quinaldine red, rose bengal, methanil yellow, thymol sulfophthalein, xylenol blue , Methyl orange, orange
IV, diphenylthiocarbazone, 2,7-dichlorofluorescein, paramethyl red, congo red, benzopurpurine 4B, α-naphthyl red, nile blue A, phenacetaline, methyl violet, malachite green, parafuchsin, oil blue # 603 [ Orient Chemical Co., Ltd.], Victoria Pure Blue B
OH, Spiron Blue GN [Hodogaya Chemical Industry Co., Ltd.
And Rhodamine 6G.

The color-changing agent is added to the photosensitive resin composition so that a visible image can be provided by exposure, and specific examples thereof include diphenylamine, dibenzylaniline, triphenylamine, diethylaniline, in addition to the above dyes. Diphenyl-p-phenylenediamine, p-toluidine,
4,4'-biphenyldiamine, o-chloroaniline,
Leuco crystal violet, leucomalachite green, leucoaniline, leucomethyl violet and the like.

Examples of the adhesion promoter include benzimidazole, benzthiazole, benzoxozole, benztriazole, 2-mercaptobenzthiazole, and 2
-Mercaptobenzimidazole and the like.

A method for producing a dry film resist laminate using the photosensitive resin composition of the present invention and a method for producing a printed wiring board using the same will be described.

(Layering Method) The above-mentioned photosensitive resin composition is
After applying this on a base film surface such as a polyester film, a polypropylene film, and a polystyrene film, a polyethylene film,
A protective film such as a polyvinyl alcohol film is coated to form a laminate for a dry film resist. Applications other than dry film resist, the photosensitive resin composition of the present invention, dip coating method, flow coating method,
The photosensitive layer having a thickness of 1 to 150 .mu. Can be easily formed by directly coating the (copper) substrate to be processed by a conventional method such as a screen printing method. At the time of coating, a solvent such as methyl ethyl ketone, methyl cellosolve acetate, ethyl cellosolve acetate, cyclohexane, methyl cellosolve, methylene chloride, 1,1,1-trichloroethane and the like can be added.

(Exposure) In order to form an image with a dry film resist, the adhesive strength between the base film and the photosensitive resin composition layer and the adhesive strength between the protective film and the photosensitive resin composition layer are compared to determine the adhesive strength. After peeling off the lower film, the photosensitive resin composition layer side is attached to a metal surface such as a copper surface of a copper-clad substrate, and then a pattern mask is brought into close contact with the other film for exposure. When the photosensitive resin composition does not have adhesiveness, the other film may be peeled off, and then the pattern mask may be brought into direct contact with the photosensitive resin composition layer for exposure. When the coating is applied directly to the metal surface, a pattern mask is brought into contact with the coating surface directly or via a polyester film or the like, and exposed. Exposure is usually performed by ultraviolet irradiation, and as a light source at that time, a high-pressure mercury lamp, an ultra-high-pressure mercury lamp, a carbon arc lamp, a xenon lamp, a metal halide lamp, a chemical lamp, or the like is used. After irradiation with ultraviolet rays, heating can be performed as necessary to complete the curing.

(Development) After exposure, the film on the resist is peeled off and developed. Since the photosensitive resin composition of the present invention is a rare alkali developing type, development after exposure is
This is performed using a dilute aqueous solution of about 0.5 to 2% by weight of an alkali such as sodium carbonate and potassium carbonate. A surfactant, an antifoaming agent, a small amount of an organic solvent for accelerating development, and the like may be mixed in the alkaline aqueous solution. (Etching, plating) Etching is usually performed by an ordinary method using an acidic etching solution such as an aqueous solution of cupric chloride-hydrochloric acid or an aqueous solution of ferric chloride-hydrochloric acid. In rare cases, an ammonia-based alkaline etching solution is also used. In the plating method, after performing pretreatment using a plating pretreatment agent such as a degreasing agent and a soft etching agent, plating is performed using a plating solution.

(Peeling Removal of Cured Resist) After the etching step, the remaining cured resist is peeled off. Stripping and removal of the cured resist is performed using an alkali stripping solution composed of an aqueous alkali solution having a concentration of about 0.5 to 5% by weight such as sodium hydroxide or potassium hydroxide. INDUSTRIAL APPLICABILITY The photosensitive resin composition of the present invention and the dry film resist laminate of the composition are useful as etching resists or plating resists used in the production of printed wiring boards, precision processing of metals, and the like, and are shown in Chemical Formula 1 above. Since the specific compound described above is used as an essential copolymerization component of the binder polymer (A), it exhibits excellent effects on adhesion, tent film strength, and resist peeling property, and also has excellent followability. Is shown.

[0029]

EXAMPLES The present invention will be specifically described below with reference to examples. In the examples, "%" and "parts" mean weight basis unless otherwise specified. Examples 1 to 3 and Comparative Example 1 The binder polymer (A) shown in Table 1 was mixed with the following photopolymerizable monomer (B), photopolymerization initiator (C), and additive to prepare a dope. The blending ratio was binder polymer (A): photopolymerizable monomer (B): photopolymerization initiator (C): additive = 59.5: 34: 6.5 (% by weight).

[Photopolymerizable monomer (B)] wt% -Ethylene oxide modified bisphenol A dimethacrylate 16% (Shin-Nakamura Chemical Co., Ltd., NK ester BPE-1300N) -Trimethylolpropane triacrylate 5% -Polyethylene Glycol (600) dimethacrylate 6% -Ethylene oxide modified phthalic acid acrylate 7% (Kyoeisha Chemical Industry Co., Ltd., light ester HOA-MPE)

[Photoinitiator (C)]-benzophenone 3 parts-p, p'-diethylaminobenzophenone 0.15 part-2,2'-bis (o-chlorophenyl) 4,5,4,3 parts 5- Tetraphenyl-1,2-biimidazole

[Additive (dye)]-Leuco crystal violet 0.3 part-Malachite green 0.05 part

(Preparation of dry film resist) Next,
Each dope was coated on a polyester film having a thickness of 20 μm using an applicator with a gap of 10 mils, and left at room temperature for 1 minute and 30 seconds, then at 60 ° C., 90 ° C., 1
Each was dried in an oven at 10 ° C. for 3 minutes to obtain a dry film having a resist thickness of 50 μm (however, no protective film was provided). This dry film was laminated on a copper-clad substrate preheated to 60 ° C. in an oven at a laminating roll temperature of 100 ° C., a roll pressure of 3 kg / cm ² , and a laminating speed of 1.5 m / sec. Then, the following evaluation was performed.

(Sensitivity) Next, the obtained substrate was exposed to 60 mj / cm ² with a 3 kW high pressure mercury lamp. On this occasion,
A negative film (Stouffer 21-step step tablet) that was made so that the amount of light transmission gradually decreased so that the light sensitivity could be evaluated was used. After 15 minutes from the exposure, the polyester film was peeled off, and an unexposed portion was removed by spraying a 1% aqueous solution of sodium carbonate at 30 ° C. for 50 to 60 seconds. The photosensitivity of the photosensitive resin composition was evaluated by measuring the number of steps of a step tablet of a photocured film formed on a copper-clad substrate. (The higher the number of steps in this step tablet, the higher the light sensitivity.)

(Adhesion of fine wire) After the above (lamination on a copper clad substrate), line widths 10, 15, 20, 25, 30, 3
Using a pattern mask (space width of 400 μm) of 5, 40, 45, and 50 μm, development was performed in the same manner as in the case of sensitivity evaluation, and the minimum line width (μm) with good adhesion was examined.

(Resist releasability) A negative film having a rectangular opening (light transmitting portion) of 10 cm × 20 cm was exposed in the same manner as in the sensitivity evaluation, and then developed with a 1% sodium carbonate aqueous solution. Next, the substrate after development was immersed in a beaker containing a 3% aqueous sodium hydroxide solution at 50 ° C., the resist (photocured coating) was peeled off, and the peeling time and the state of the peeled pieces were observed.・ Evaluation criteria ○ ・ ・ ・ At least 6 to 7 cracks are formed in the resist,
The cured resist becomes minute pieces (20 mm square or less) and peels off. △: At least a few cracks were formed in the resist,
The cured resist becomes a small piece (40 mm square or less) and peels off. ×: 10 cm × 20 cm without cracks in the resist
The film is peeled off in almost a film state.

(Tent film strength) A laminate of a photosensitive resin composition for a dry film resist was laminated on both sides of a substrate in which 100 holes having a diameter of 4.5 mm were formed in a copper clad substrate having a thickness of 1.6 mm, and 60 mj / cm ² exposure and development for 60 seconds. After the development, the substrate was immersed in water adjusted to 20 ° C. and left for 5 minutes, and then the strength of this hole was measured by a rheometer (FUDOH) using a cylinder having an insertion diameter of 1.5 mm. The strength and elongation were measured.

(Following property) After laminating a dry film resist having a resist thickness of 25 μm on a copper clad substrate having a thickness of 1.6 mm (copper thickness 35 μm), the line width (L) and the space width (S) are each 80 μm (L / L). According to the above method, a pattern was formed using a negative film of S = 80/80), and then a cupric chloride etching solution (cupric chloride 200 g / l
And a solution containing 200 g / l of hydrochloric acid) were heated to 30 ° C., and a groove having a depth of 4 μm was formed by half etching. Then, the dry film resist obtained in the above example was laminated on this substrate under the above-mentioned laminating conditions, and then a pattern of L / S = 80/80 was formed in the same manner as above so as to be orthogonal to the groove, and chloride was formed. The cupric etchant was heated to 50 ° C. to perform proper etching. 50 pieces of this sample piece
Peeling was performed with a 3% sodium hydroxide aqueous solution at 0 ° C., and 50 points of intersections between the groove and the line were observed with a microscope to determine the disconnection rate (%).

[0039]

[Table 1] Binder polymer (A) (a-1) (a-2) Other vinyl monomer (%) (%) (%) (Molecular weight) Example 1 M5300 MAA MMA EA nBMA 85000 (5) (18.5) (46.5) (10) (20) 〃 2 M5300 MAA MMA EA nBMA 83000 (10) (17) (43) (10) (20) 〃 3 M5300 MAA MMA EA nBMA 83000 (15) (15.5) (41) ( 10) (18.5) Comparative Example 1 --- MAA MMA EA nBMA 84000 (-) (20) (50) (10) (20) Note) M5300: ω-carboxypolycaprolactone monoacrylate (trade name; Aronix-M5300, Toa Gosei Chemical Co., Ltd.) MAA: Methacrylic acid MMA: Methyl methacrylate EA: Ethyl acrylate nBMA: n-Butyl methacrylate

Examples 4 to 6 The same procedures as in Examples 1 to 3 were carried out except that the photopolymerizable monomer (B) was changed to the compounding composition of the compound as described below, and the sensitivity, fine line adhesion, resist peeling property and tent were obtained. The film strength and the followability were evaluated. [Photopolymerizable monomer (B)] wt% -trimethylolpropane triacrylate 5% -ethylene oxide-modified phthalic acid acrylate 7% (Kyoeisha Chemical Co., Ltd., light ester HOA-MPE) -In the above chemical formula 2, R = _{CH 3, m = 6, X} = - (CH 2) n -, Table 2 shows the evaluation results of the compound examples and comparative examples of 22% n = 6.

[0041]

[Table 2] Sensitivity fine line Adhesiveness Resist peelability Tent film strength followability (60mj / cm ² ) Line width Peeling time Peeling piece strength Elongation Breakage rate (μm) (sec) State (g) (mm) (%) Implementation Example 1 7.5 35 58 ○ 630 1.5 20 〃 2 7.7 35 35 55 ○ 620 1.6 18 18 〃 3 7.8 35 54 ○ 620 1.6 1.6 16 〃 4 7.4 30 60 ○ 650 1. 4 22 〃 5 7.6 35 35 56 △ 630 1.5 20 〃 6 7.7 35 55 55 △ 630 1.5 18 Comparative Example 1 7.6 40 65 × 530 0.9 35 Note Example 4: Example Example 1 using the binder polymer of Example 1 Example 5 using the binder polymer of Example 2 Example 6: using the binder polymer of Example 3

[0042]

INDUSTRIAL APPLICABILITY The photosensitive resin composition obtained by the present invention and the dry film resist laminate using the same have good adhesion of the resist to the copper substrate during immersion in the plating bath, and in the resist stripping step. Since it has excellent resist releasability, tent film strength, and followability, it is useful as an etching resist or plating resist used in the production of printed wiring boards, precision processing of metals, and the like.

─────────────────────────────────────────────────── ─── Continuation of the front page (51) Int.Cl. ⁶ Identification code Office reference number FI Technical display location H05K 3/06 H05K 3/06 H J 3/18 0430-4E 3/18 D

Claims (7)

[Claims] 1. A compound (a-1) represented by the following chemical formula 1 and an α, β-unsaturated carboxyl group-containing monomer (a-2):
Binder polymer (A) containing as an essential copolymerization component
And a photopolymerizable monomer (B) having two or more ethylenically unsaturated groups in one molecule and a photopolymerization initiator (C) as main components. Embedded image (In the formula, R ₁ is hydrogen or a methyl group, R ₂ is hydrogen or an alkyl group having 1 to 4 carbon atoms, n is an integer of 4 to 6, and m is 1
4 is an integer. ) 2. The photosensitive resin composition according to claim 1, wherein the photopolymerizable monomer (B) contains a compound represented by the following chemical formula 2 as an essential component. Embedded image (In the formula, R represents a hydrogen atom or an alkyl group, and two m
Are each independently an integer of 1 to 20, and X is a compound represented by the following chemical formula 3 or chemical formula 4. ) (N is an integer of 1 to 20.) 3. The photosensitivity according to claim 1, wherein the compounding amount of the compound (a-1) represented by Chemical formula 1 is 1 to 30% by weight based on the total amount of the copolymerization components. Resin composition. 4. The blending amount of the α, β-unsaturated carboxyl group-containing monomer (a-2) is 10 to 35% by weight based on the total amount of the copolymerization components.
Or the photosensitive resin composition according to item 3. 5. The compounding amount of the photopolymerizable monomer (B) is 25 to 8 with respect to 100 parts by weight of the binder polymer (A).
It is 5 weight part, The photosensitive resin composition in any one of Claims 1-4. 6. The compounding amount of the photopolymerization initiator (C) is 1 in the total amount of the binder polymer (A) and the photopolymerizable monomer (B).
It is 0.1-20 weight part with respect to 00 weight part, The photosensitive resin composition in any one of Claims 1-5 characterized by the above-mentioned. 7. A photoresist laminate comprising a layer of the photosensitive resin composition according to claim 1 formed between a base film and a protective film.