JPH09304432A - Measuring instrument with deviation preventing function - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a measuring instrument which can accurately inspect a semiconductor circuit device. SOLUTION: An insulating body 13 comprises a plurality of sets of barallel insulating wires 13a and 13b, two for one set. Two wires 13a mutually cross two wires 13b to form a mesh 14. A neck portion 5 is pressed into a probe 1 to allow the mesh 14 to engage with it. Deviation in the direction A of the probe 1 is suppressed by the two wires 13a, and the deviation in the direction B of the probe 1 by the two wires 13b is suppressed. The engagement of the mesh 14 with the neck portion 5 also eliminates variations and changes in a contact part of the probe 1 in the height direction C orthogonal to the directions A and B. In other words, deviation, variations and changes can be prevented in the contact part of the probe 1 in three directions orthogonal to each other.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a measuring device used for inspecting a semiconductor circuit device in a wafer state or a packaged state.

[0002]

2. Description of the Related Art FIG. 15 is a perspective view illustrating a structure of a conventional inspection mechanism near a probe 1. Probe 1
Respectively extend in two directions A and B which are orthogonal to each other, and are fixed to the inspection mechanism (not shown) at their roots.

As shown in the figure, the contact portion, which is the tip of each probe 1, is brought into contact with each pad 2 of the semiconductor circuit device, thereby electrically measuring the semiconductor circuit device.

[0004]

In the conventional inspection mechanism, since the probe 1 is fixed only at the root, the position of the probe 1 may be displaced when the probe 1 is brought into contact with the semiconductor circuit device during inspection. was there. FIG. 16 is a schematic view of the probe 1 in which its contact portion is displaced in a direction orthogonal to the direction in which the probes 1 are adjacent to each other (hereinafter, “adjacent direction”), as viewed from the adjacent direction. In the same figure, the probe 1 when the tips contact each other is shown by a chain double-dashed line. As shown in the figure, there is a problem that the semiconductor circuit device cannot be inspected because the probe 1 and the pad 2 of the semiconductor circuit device are not in good contact with each other.

Further, the contact portion of the probe 1 may be displaced in the adjacent direction. FIG. 17 is a schematic view of the probe 1 in contact with the adjacent probe 1 as seen from a direction orthogonal to the adjacent direction. FIG. 18 is a schematic view of the probe 1 contacting the pad 2 adjacent to the pad 2 to be contacted, as seen from a direction orthogonal to the adjacent direction. In the cases shown in these figures, there is a problem that the inspection result of the semiconductor circuit device becomes incorrect.

In view of the above points, it is an object of the present invention to provide an inspection mechanism capable of suppressing the displacement of the probe, particularly in the adjacent direction of the probe, and reliably inspecting the semiconductor circuit device. .

[0007]

According to another aspect of the present invention, there is provided a measuring device with a displacement preventing function, a plurality of probes each having one end for contacting an object to be measured and the other end, and a predetermined number of the plurality of probes. And an insulating base having a hole that penetrates at a position.

According to a second aspect of the present invention, there is provided a measuring device with a displacement preventing function, wherein the hole is provided so as to extend in a direction orthogonal to a direction in which the plurality of probes are adjacent to each other. It is characterized by

A measuring device with a deviation preventing function according to a third aspect is the measuring device with a deviation preventing function according to the first or second aspect, wherein the plurality of probes further have a constriction near the one end. , The hole is capable of engaging the constriction.

A measuring device with a deviation preventing function according to claim 4 is
It is a measuring device with a gap prevention function of Claim 3, Comprising: The said base | substrate WHEREIN: The 1st linear pair which is mutually parallel, and the 2nd linear pair which is mutually parallel in a different direction from this 1st linear pair. And the hole is formed by intersecting the first linear pair and the second linear pair.

According to a fifth aspect of the present invention, there is provided a measuring device with a displacement preventing function, a plurality of probes each having one end that contacts an object to be measured and the other end, and the one end and the other end of each of the plurality of probes. And an insulating substrate fixed to the plurality of probes.

According to a sixth aspect of the present invention, there is provided a measuring device with a deviation preventing function, which is the measuring device with a deviation preventing function, wherein the plurality of probes are arranged in a first direction. Of probe groups of the second direction different from the first direction
And a second probe group arranged along the direction of, wherein the base is integrally fixed to the plurality of probes.

[0013]

BEST MODE FOR CARRYING OUT THE INVENTION

Embodiment 1. The present embodiment discloses an inspection mechanism that preferably prevents the displacement of the contact portion of the probe in the direction in which the probes are adjacent to each other. The same components as those of the related art are designated by the same reference numerals.

1 and 2 are a sectional view and a perspective view illustrating the structure of a measuring apparatus according to the present embodiment, respectively. The probe 1 including the probe 1a and the probe 1b penetrates the mesh 4 of the net-shaped insulator 3. The probe 1 is fitted in the mesh 4 along the directions A and B indicated by double-headed arrows in FIGS. 1 and 2, respectively. The probe 1 arranged along the direction A is the probe 1a, and the probe 1 arranged along the direction B is the probe 1b. The direction A and the direction B are orthogonal to each other. The pads 2 of the semiconductor circuit device to be inspected are arranged along the direction A and the direction B, respectively, as shown in FIG. That is, the reason why the probe 1 is arranged along the direction A and the direction B, respectively, is to make electrical contact between the contact portion, which is the tip of the probe 1, and the pad 2.

FIG. 1 shows a cross section in a plane formed by the insulator 3. The probe 1 has a circular cross section. As shown in FIG.
The meshes 4 provided at are arranged along the direction A and the direction B, respectively, and the probe 1 penetrates them.
The mesh 4 is square and has a size with almost no gap with respect to the outer shape of the probe 1. That is, the insulator 3 is formed so as to substantially fill the space between the adjacent probes 1.

As shown in FIG. 2, probe 1
Has a hook shape with the middle part bent. In the probe 1, a portion closer to the root than the bent portion is referred to as a taper portion 7, and a portion closer to the tip than the bent portion is referred to as a tip portion 9. The tip 9 is the mesh 4 of the insulator 3.
Penetrates through. The insulator 3 is supported by columns (not shown) attached to the substrate of the inspection mechanism.

With the probe 1 fitted in the mesh 4,
The contact portion of each probe 1 is brought into contact with the corresponding pad 2. The semiconductor circuit device is inspected while the probe 1 and the pad 2 are in contact with each other.

Since the probe 1 is fitted in the mesh 4, the range in which the tip 9 of the probe 1 can move within the plane formed by the insulator 3 is naturally within the mesh 4.
Is determined by the insulator 3 forming the contour of In other words, this range is limited by the mesh 4. Therefore,
The contact portion of the probe 1 is prevented from coming off the pad 2, and the semiconductor circuit device is inspected reliably.

As the material of the insulator 3, it is possible to use a hard material such as glass or plastic, or to use a flexible material having elasticity such as insulating rubber or polychloroprene. When using a hard substance,
The displacement of the probe 1 is surely avoided. When a flexible substance is used, the insulator 3 can absorb the force that the probe 1 tends to shift, and the probe 1 is prevented from being deformed.

The insulator 3 having a mesh size of 20 to 80 μm can be formed. For example, when the diameter of the cross section of the probe 1 is 30 μm, the mesh size is about 40 × 40 μm. By adjusting according to the diameter of the cross section of the probe 1 in this way, it becomes possible to preferably prevent the displacement of the probe 1.

Next, another example according to the present embodiment will be described. FIG. 3 shows an insulator 3a provided with a mesh 4a.
3 is a cross-sectional view illustrating the structure of FIG. Insulator 3 and insulator 3a
Is a difference in shape and size between the mesh 4 and the mesh 4a, and the other configurations are the same.

FIG. 4 shows a probe 1 having the same cross-sectional diameter.
FIG. 4 is a cross-sectional view showing respective shapes and sizes of a mesh 4 and a mesh 4a which penetrate respectively. The mesh 4a is rectangular, and its short side is set to have the same length as one side of the mesh 4. Therefore, the long side of the rectangle of the mesh 4 a is longer than one side of the mesh 4.

As shown in FIG. 3, the direction in which the long side of the mesh 4a extends, that is, the extending direction of the mesh 4a is orthogonal to the adjacent direction. That is, the mesh 4a corresponding to the probe 1a extends in the direction B, and the mesh 4a corresponding to the probe 1b.
a extends in the direction A.

Since the mesh 4a has the above-described shape, the probe 1 moves its contact portion in the extension direction of the mesh 4a along the contour of the mesh 4a without causing displacement in the adjacent direction. Is possible. Since the movement of the contact portion of the probe 1 is allowed by the mesh 4a, when the contact portion of the probe 1 is brought into contact with the pad 2, the contact portion of the probe 1 can slide on the surface of the pad 2.

The use of the insulator 3a has the advantages described below. When the insulator 3a is used, the contact portion of the probe 1 can slide on the pad 2, so that the surface of the pad 2 is less likely to be damaged. On the other hand, when the semiconductor circuit device is inspected by using the insulator 3, since the tip portion 9 of the probe 1 is almost fixed, it is almost impossible for the contact portion of the probe 1 to move. However, the surface of the pad 2 may be damaged and rough.

Of course, even when the insulator 3a is used,
It is possible to prevent the displacement of the contact portion of the probe 1 in the adjacent direction of the probe 1, which is a particular problem at the time of inspection.

It is desirable to properly use the insulator 3 and the insulator 3a as described below. For example, when the probe 1 is brought into contact with the new pad 2 only once like in mass production inspection, the insulator 3 may be used. The mesh 4 provided on the insulator 3 ensures that the contact portion of the probe 1 comes into contact with the pad 2 to reliably inspect the semiconductor circuit device. On the other hand, when the probe 1 is repeatedly brought into contact with the pad 2 for inspection, the insulator 3a may be used. The mesh 4a provided on the insulator 3a makes it possible to prevent the surface of the pad 2 from being roughened, and suppresses contact failure caused by the roughening of the pad 2.

Here, an example of the length of the long side of the mesh 4a will be given. For example, by setting the long side of the mesh 4a to be 1.5 times the short side of the mesh 4a, the contact portion of the probe 1 can sufficiently slide on the pad 2, and the probe 1 in the direction orthogonal to the adjacent direction can be made. Displacement of the contact part is also sufficiently prevented.
That is, if the short side of the mesh 4a is, for example, 50 μm,
The long side is 75 μm.

In the inspection mechanism of the present embodiment, the shape and size of the mesh provided on the insulator are determined according to the number of contacts between the probe and the pad required for the inspection. This makes it possible to perform the inspection depending on which is more important, the reliable inspection or the avoidance of the surface roughness of the pad.

Embodiment 2 FIG. In the present embodiment,
Disclosed is a measuring device which is obtained by further improving the measuring device according to the first embodiment and is capable of preventing the displacement of the probe in the height direction. The same components as those in the first embodiment are designated by the same reference numerals and the description thereof will be omitted.

FIG. 5 is a perspective view illustrating the structure of the insulator 13 near the contact portion of the probe 1. Insulator 13
Is composed of a plurality of sets of insulating wires 13a and 13b each provided in parallel with two wires. Two wires 13a
And the two wires 13b intersect each other to form a mesh 14. The probe 1 is provided with a constriction 5 with which the mesh 14 of the insulator 13 engages.

FIG. 6 is an enlarged view showing the structure shown in FIG. 5 in the vicinity of the constriction 5 in an enlarged manner. As shown in the figure, the probe 1 is prevented from being displaced in the direction A by being sandwiched by the two wires 13a at the constriction 5, and the probe 1 is further displaced in the direction B by being sandwiched by the two wires 13b. Is suppressed. Further, since the constriction 5 and the mesh 14 are engaged,
Variations and fluctuations of the contact portion of the probe 1 in the height direction C orthogonal to the directions A and B do not occur.

It is possible to engage the constriction 5 with the mesh 14 by locating the constriction 5 in the vicinity of the mesh 14 with the wires 13a and 13b spaced apart from each other and then interlocking them. Since the tip of the probe 1 is thicker than the constriction 5, it is possible to easily achieve the above-mentioned engagement by making the wires 13a and 13b elastic and allowing the probe 1 to project into the mesh 14.

An example of the size of the constriction 5 and the wire 13 will be given. The diameter of the constriction 5 of the probe 1 is 5
It is preferable that the diameter is around 90% of the circumference. For example, in the probe 1 having a diameter of 30 μm, the diameter of the narrowed portion 5 is 27 μm. With this setting, it is possible to preferably engage the constriction 5 and the mesh 14 without largely changing the electrical characteristics of the probe 1. The width of the constriction 5 in the height direction C is 10 to 100 μm. Wires 13a, 13b
The diameter of is set to be substantially the same as the width of the constriction 5.

In the present embodiment, the displacement, variation and fluctuation of the contact portion of the probe 1 in the three directions orthogonal to each other are prevented. Therefore, it becomes possible to more surely inspect the semiconductor circuit device.

Of course, the insulator 13 may be configured like the insulator 3a shown in the first embodiment. That is, the mesh 14 provided on the insulator 13 is a rectangle extending in a direction orthogonal to the adjoining direction of the probe 1 penetrating itself. Thereby, the probe 1 in the direction orthogonal to the adjacent direction is avoided while avoiding the deviation in the adjacent direction.
Can be allowed to move, and the same effect as in the first embodiment can be obtained.

Embodiment 3 In the present embodiment,
Disclosed is a measuring device including an insulator fixed to a plurality of probes. In the measuring device of the present embodiment, the displacement of the contact portion in the adjoining direction of the probe 1 is preferably prevented. The same components as those in the first and second embodiments are designated by the same reference numerals and the description thereof will be omitted.

FIG. 7 is a perspective view illustrating the structure of the insulator 23 fixed to each taper portion 7 of the plurality of probes 1. FIG. 8 is a sectional view taken along the line VIII-VIII in FIG. 7, showing the positional relationship among the substrate 10, the support column 11, and the probe 1 of the inspection mechanism. The insulator 23 is made of a material such as glass fiber, has a circular cross section, and has a bent L partway.
It is a character-shaped stick. The insulator 23 extends in the directions A and B from the bent portion,
The probes 1a and 1b are fixed along the adjoining directions of the probes 1a and 1b, respectively. The probe 1 and the insulator 23 are fixed to each other by an adhesive 8 such as resin as shown in FIG. A pillar 11 is attached to the board 10 of the inspection mechanism. This prop 11
In the bent part of itself, the insulator 23
Is supported.

Since the probe 1 is fixed to the insulator 23 as described above, the positional relationship of the fixed portions remains unchanged, and the displacement of the contact portion of the probe 1 in the adjacent direction and the height direction C is caused by the insulator 23. Is prevented by. Therefore,
It is possible to reliably inspect the semiconductor circuit device.
Further, since the plurality of probes 1 are fixed by the insulator 23, the force applied to each probe 1 can be dispersed to other probes 1. Further, the pillar 11 that supports the insulator 23 and the substrate 10 to which the pillar 11 is attached
Also, the force applied to each probe 1 is dispersed. This makes it possible to avoid deformation of the probe 1.

Further, instead of the rod-shaped insulator 23, the plate-shaped insulator 33 may be used to fix the probe 1. FIG. 9 is a perspective view illustrating the structure of the insulator 33.
FIG. 10 is a sectional view taken along line XX of FIG. The insulator 33 is
The rod-shaped insulator 23 has a plate-like shape. That is, the insulator 33 has a shape in which a prism having an L-shaped bottom surface is bent at the corner portion of the L-shape, and the bottom surface is fixed to the tapered portion 7 of the probe 1.

By using the insulator 33 instead of the insulator 23, as shown in FIG. 10, the area of the portion to which the probe 1 is bonded becomes larger. Therefore, the bonded portion of the insulator 33 is less likely to be damaged than the insulator 23.

The insulator 23 is attached to the tip 9 of the probe 1.
You may fix it to. FIG. 11 is a perspective view illustrating the insulator 23 fixed to the tip portion 9 of the probe 1. FIG.
FIG. 12 is a sectional view taken along the line XII-XII of FIG. In this case, a portion closer to the contact portion of the probe 1 is fixed as compared with the case where the insulator 23 is fixed to the tapered portion 7 of the probe 1. Therefore, the displacement of the contact portion of the probe 1 in the direction adjacent to the probe 1 becomes small. Moreover, since the tip portion 9 of the probe 1 is fixed, the displacement of the contact portion in the direction orthogonal to the adjacent direction can be suppressed.

Next, the insulator 43 obtained by improving the insulator 23 fixed to the tip 9 will be described. FIG. 13 is a perspective view illustrating the insulator 43. 14 is a sectional view taken along the line XIV-XIV in FIG. As shown in FIGS. 13 and 14, the insulator 43 has a flat plate shape and is formed so as to surround the respective tip portions 9 of the probe 1a and the probe 1b arranged in a direction orthogonal to each other without a gap. It is a fixing material. The upper surface of the insulator 43 includes the upper surface of the L-shaped insulator 23. Insulator 43
Are supported by columns 11 near the boundary between probe 1a and probe 1b. Since it has a flat plate shape, the insulator 43 is less likely to be deformed by bending or the like than the L-shaped insulator 23.

Tip portions 9 of the probes 1a and 1b, respectively
Are fixed by an insulator 43 that is unlikely to be deformed, the positional relationship between the respective tip portions 9 is determined by the insulator 23.
It is even more invariant than the case. Therefore, the contact portion of the probe 1 is less likely to be displaced in the adjoining direction of the probe 1, the direction orthogonal to the adjoining direction, and the height direction C.

Here, the insulator 43 can be considered as a modification of the insulator 3 of the first embodiment. That is, there is no gap between the mesh 4 of the insulator 3 and the probe 1, and the insulator 3 is fixed to the probe 1 as the insulator 43.

Further, if a resin or the like which is not likely to be deformed is used as the material of the insulator 43, the above effect is further enhanced.

[0047]

According to the first aspect of the invention, the probe is prevented from moving in at least the adjacent direction by the portion of the base body existing between the two holes through which the adjacent probes penetrate. To be done. This reduces the occurrence of displacement when one end of the probe comes into contact with the object to be measured. Therefore, it is possible to reliably perform the measurement.

According to the second aspect of the invention, the probe is allowed to slide in the direction orthogonal to the direction in which the probes are adjacent to each other. As a result, the roughness of the surface of the object to be measured caused by the one end of the probe is less likely to occur. Therefore, it is possible to avoid a contact failure in the object to be measured when using after the measurement.

According to the third aspect of the invention, the engagement between the hole and the constriction makes it possible to suppress the displacement of the probe in the hole in the longitudinal direction of the probe, so that the measurement is reliably performed.

According to the structure described in claim 4, by expanding the distance between the first and second wire pairs respectively, the hole of the base body is positioned in the neck in a state of being larger than the peripheral portion of the neck, Next, the holes can be made smaller than the peripheral portion of the constriction by narrowing the intervals. This results in a neck-engaging substrate as claimed in claim 3.

According to the fifth aspect of the present invention, for example, one base is fixed to the plurality of probes, so that the displacement of the probes in the longitudinal direction of the base can be suppressed. Furthermore, the force applied to one probe can be dispersed to a plurality of probes through the base. This suppresses the deformation of the probe.

According to the sixth aspect of the invention, the positional relationship between the portions of the probe fixed to the base does not change. This makes it possible to suppress the displacement of the probes in the plane direction of the plane where the plurality of measurement points of the object to be measured, which are respectively brought into contact with the plurality of probes.

[Brief description of drawings]

FIG. 1 is a sectional view showing an example of a structure of a first embodiment.

FIG. 2 is a perspective view showing an example of the structure of the first embodiment.

FIG. 3 is a cross-sectional view showing another example of the structure of the first embodiment.

FIG. 4 is a cross-sectional view illustrating a mesh 4 and a mesh 4a.

FIG. 5 is a perspective view illustrating the structure of the second embodiment.

6 is a partially enlarged view of the insulator 13 and the probe 1 shown in FIG.

FIG. 7 is a perspective view showing a first example of the structure of the third embodiment.

FIG. 8 is a sectional arrow view showing a first example of the structure of the third embodiment.

FIG. 9 is a perspective view showing a second example of the structure of the third embodiment.

FIG. 10 is a cross-sectional arrow view showing a second example of the structure of the third embodiment.

FIG. 11 is a perspective view showing a third example of the structure of the third embodiment.

FIG. 12 is a cross-sectional arrow view showing a third example of the structure of the third embodiment.

FIG. 13 is a perspective view showing a fourth example of the structure of the third embodiment.

FIG. 14 is a cross-sectional arrow view showing a fourth example of the structure of the third embodiment.

FIG. 15 is a perspective view showing a configuration of a conventional inspection mechanism.

FIG. 16 is a schematic diagram showing the probe 1 when the contact portion is displaced.

FIG. 17 is a schematic diagram showing a probe 1 in contact with an adjacent probe 1.

FIG. 18 is a schematic view showing a probe 1 that contacts an adjacent pad 2.

[Explanation of symbols]

1,1a, 1b probe, 2 pads, 3,3a, 1
3,23,33,43 insulator, 4,4a, 14 mesh,
5 constriction, 7 taper part, 8 adhesive, 9 tip part, 1
0 board, 11 columns, 13a, 13b wires, A,
B direction, C height direction.

 ─────────────────────────────────────────────────── ─── Continuation of the front page (72) Inventor Tetsuo Tada 2-3-3 Marunouchi, Chiyoda-ku, Tokyo Sanryo Electric Co., Ltd.

Claims (6)

[Claims] 1. A plurality of probes each having one end in contact with an object to be measured and the other end, and an insulating base having a hole for penetrating the plurality of probes at a predetermined position. Measuring device with slip prevention function. 2. The measuring device with a deviation preventing function according to claim 1, wherein the hole is provided so as to extend in a direction orthogonal to a direction in which the plurality of probes are adjacent to each other. 3. The displacement according to claim 1, wherein the plurality of probes further have a constriction near the one end, and the hole is capable of engaging with the constriction. Measuring device with prevention function. 4. The base comprises a first linear pair of wires which are parallel to each other and a second linear pair of wires which are parallel to each other in a direction different from that of the first linear wire pair, and the hole includes the first linear wire pair. The measuring device with a deviation preventing function according to claim 3, wherein one linear pair and the second linear pair are formed so as to intersect with each other. 5. A plurality of probes each having one end that contacts the object to be measured and the other end, and fixed to the plurality of probes between the one end and the other end of each of the plurality of probes. A measuring device with a deviation preventing function, comprising an insulating base. 6. The plurality of probes comprises a first probe group arranged along a first direction and a second probe arranged along a second direction different from the first direction. 6. The measuring device with a deviation preventing function according to claim 5, wherein the base body is integrally fixed to the plurality of probes.