JPH09293812A - Printed circuit board type semiconductor package - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a printed circuit board type semiconductor package in which automatization of a step of bonding a printed circuit board and a metal board is facilitated by bonding the printed circuit board having an opening for housing a semiconductor device and the metal board by using a liquid adhesive agent. SOLUTION: An opening 1 for housing a semiconductor device is opened in a step shape in cross section in a printed circuit board 2. The printed circuit board 2 and a metal board 3 are bonded by using a liquid adhesive agent 5 in such a manner that the liquid adhesive agent is applied on a face to be bonded of either the printed circuit board 2 or the metal board 3, dried according to necessity to be half hardened, the printed circuit board 2 and the metal board 3 are brought into contact with each other via the liquid adhesive agent and are heated and pressurized, thereby enabling the printed circuit board 2 and the metal board 3 to be bonded. With the above process, a prepreg positioning step which is necessary when the prepreg is used can be omitted. Thus, automatization of the step of bonding the printed circuit board 2 and the metal board 3 can be easily achieved.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a printed circuit board type semiconductor package for mounting and accommodating semiconductor elements.

[0002]

2. Description of the Related Art As one type of printed circuit board type semiconductor package used in PGA, BGA, etc., a printed circuit board having an opening for accommodating a semiconductor element and a metal plate are used, and one end surface of the opening is made of metal. A type in which they are joined so as to be covered with a plate is known, and this type of printed circuit board type semiconductor package has an advantage of excellent heat dissipation because a semiconductor element can be mounted on the surface of a metal plate.
Conventionally, in this type of printed circuit board type semiconductor package,
A film-like sheet called a prepreg, which is obtained by impregnating glass fiber with a resin, is used for joining a printed circuit board and a metal plate. However, when using prepreg,
It was necessary to process the prepreg into the shape of the adhesive surface and to accurately align the prepreg with the position of the adhesive surface. Since it is difficult to automate the step of aligning the prepreg among these steps, a printed circuit board type semiconductor package that can easily automate the step of joining the printed board and the metal plate has been demanded.

[0003]

SUMMARY OF THE INVENTION The present invention has been made in view of the above circumstances, and an object of the present invention is to provide a printed circuit board type in which the process of joining a printed circuit board and a metal plate can be easily automated. To provide a semiconductor package.

[0004]

According to a first aspect of the present invention, there is provided a printed circuit board type semiconductor package including a printed board having an opening for accommodating a semiconductor element and a metal plate, wherein one end surface of the opening is made of metal. In a printed circuit board type semiconductor package bonded so as to cover with a plate, the printed circuit board and the metal plate are bonded with a liquid adhesive.

A printed circuit board type semiconductor package according to a second aspect of the present invention is the printed circuit board type semiconductor package according to the first aspect, wherein the liquid adhesive is an epoxy resin adhesive or a silicone resin adhesive. To do.

According to a third aspect of the present invention, there is provided a printed circuit board type semiconductor package in which a printed circuit board having an opening for accommodating a semiconductor element and a metal plate are joined so that one end face of the opening is covered with the metal plate. In the printed circuit board type semiconductor package, the printed circuit board and the metal plate are bonded to each other by using a solder layer formed in advance on the bonding surface of the printed circuit board and / or the metal plate.

A printed circuit board type semiconductor package according to a fourth aspect of the present invention is the printed circuit board type semiconductor package according to any one of the first to third aspects, wherein after the printed circuit board and the metal plate are joined, a metal is further added. It is characterized in that the outer peripheral edge of the plate and the printed circuit board are sealed with solder or resin.

[0008]

FIG. 1 is a sectional view showing an embodiment of the invention according to claim 1, claim 2 and claim 4.
In this embodiment, an opening 1 for accommodating a semiconductor element is formed in a printed board 2 in a stepwise cross section.
Then, the printed circuit board 2 and the metal plate 3 are bonded to each other by using a liquid adhesive as the adhesive 5. The type of the liquid adhesive is not particularly limited in the present invention, but it is desirable to use an epoxy resin adhesive or a silicone resin adhesive because the heat resistance is excellent. The method of joining using a liquid adhesive is not particularly limited. For example, it is applied to the surface of the printed circuit board 2 or the metal plate 3 to be joined, and if necessary dried and semi-cured, and then printed. The substrate 2 and the metal plate 3 are brought into contact with each other via a liquid adhesive, and can be joined by heating and pressing. As described above, in the embodiment shown in FIG. 1, since it is possible to apply the liquid adhesive as the adhesive 5 to the surface of the printed board 2 or the metal plate 3 to be joined, it is necessary when the prepreg is used. The process of aligning the existing prepreg is no longer necessary. Therefore, it is possible to easily achieve automation of the process of joining the printed board 2 and the metal plate 3.

Further, in the embodiment shown in FIG. 1, the printed circuit board 2 and the metal plate 3 are joined, and the space between the outer peripheral end 6 of the metal plate 3 and the printed circuit board 2 is sealed with a seal material 7,
The airtightness between the printed board 2 and the metal plate 3 is improved. As the sealing material 7, solder or resin can be used, and when electrically connecting the printed board 2 and the metal plate 3, it is desirable to use solder or conductive resin. On the other hand, the printed board When it is desired to insulate between the metal plate 3 and the metal plate 3, it is desirable to use an electrically insulating resin (for example, epoxy resin or silicon resin). When the airtightness between the printed circuit board 2 and the metal plate 3 is improved, the semiconductor element is mounted on the semiconductor element mounting position 4 of the metal plate 3 facing the opening 1, and the mounted semiconductor element is made of resin. When the semiconductor device is manufactured by sealing, the reliability of the semiconductor element (for example, moisture resistance reliability) is improved.

Next, an embodiment of the invention according to claim 3 will be described. In the invention according to claim 3, the printed circuit board and the metal plate are bonded using the solder layer formed on the surface to be bonded of the printed circuit board and / or the metal plate. In this case, whether the solder layer is formed on the surface to be joined of the metal plate, the solder layer is formed on the surface to be joined of the printed board, or both surfaces are formed is not particularly limited. The method of forming the solder layer is also not particularly limited, but it can be formed by, for example, applying a paste containing solder and then heating. The solder layer mentioned here is the so-called preform solder. Then, the printed circuit board and the metal plate are brought into contact with each other via the solder layer, and the printed circuit board and the metal plate can be joined by heating and pressing. In the invention according to claim 3, since the soldering is performed by using the solder layer formed on the surface to be joined of the printed board and / or the metal plate, the step of aligning the prepreg, which is necessary when using the prepreg, is unnecessary. Become. Therefore, it is possible to easily achieve automation of the process of joining the printed board and the metal plate. Further, since the solder layer can be used as a conductor, it is useful to use the solder layer for joining in the case of a printed circuit board type semiconductor package of the type in which the printed circuit board and the metal plate are electrically conducted. In addition, after joining the printed circuit board and the metal plate, if the space between the outer peripheral edge of the metal plate and the printed circuit board is sealed with solder or resin, the airtightness between the printed circuit board and the metal plate can be improved as described above. It is desirable because it can be done.

[0011]

In the printed circuit board type semiconductor package according to the first and second aspects of the present invention, the printed board and the metal plate are bonded using a liquid adhesive, so that the process of bonding the printed board and the metal plate can be automated. It will be easier to achieve.

In the printed circuit board type semiconductor package according to the third aspect, since the printed circuit board and the metal plate are bonded to each other by using the solder layer, it is easy to achieve automation of the bonding process of the printed circuit board and the metal plate. .

In the printed circuit board type semiconductor package according to a fourth aspect of the present invention, after the printed circuit board and the metal plate are joined, the outer peripheral end of the metal plate and the printed circuit board are sealed with solder or resin. The semiconductor package has improved airtightness between the substrate and the metal plate.

[Brief description of drawings]

FIG. 1 is a sectional view for explaining an embodiment of the present invention.

[Explanation of symbols]

 1 Opening 2 Printed Circuit Board 3 Metal Plate 4 Semiconductor Element Mounting Position 5 Adhesive 6 Outer Edge 7 Sealing Material

Claims (4)

[Claims] 1. A printed circuit board (2) having an opening (1) for accommodating a semiconductor element and a metal plate (3),
In a printed circuit board type semiconductor package in which one end surface of the opening (1) is bonded so as to cover it with a metal plate (3), the printed circuit board (2) and the metal plate (3) are bonded using a liquid adhesive. A printed circuit board type semiconductor package characterized in that 2. The liquid adhesive is an epoxy resin adhesive or a silicone resin adhesive.
A printed circuit board type semiconductor package as described above. 3. A printed circuit board (2) having an opening (1) for accommodating a semiconductor element and a metal plate (3),
In a printed circuit board type semiconductor package in which one end surface of the opening (1) is bonded so as to cover it with a metal plate (3), a printed circuit board (2) and / or a metal plate (3) is previously prepared.
A printed circuit board type semiconductor package, wherein the printed circuit board (2) and the metal plate (3) are bonded to each other by using a solder layer formed on the surfaces to be bonded. 4. The printed circuit board (2) and the metal plate (3) are joined together, and the space between the outer peripheral end (6) of the metal plate (3) and the printed circuit board (2) is further sealed with solder or resin. The printed circuit board type semiconductor package according to any one of claims 1 to 3, wherein