JPH09284087A - Piezoelectric component - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide the piezoelectric component with high reliability for continuity connection, stable quality and manufactured at a low cost. SOLUTION: One end of a lead electrode 18 connects to a 1st electrode 16a of one major face of a piezoelectric substrate 14 and the other end is led onto a node of the other major face of the piezoelectric substrate 14. First and second conductors 24a, 24b are formed between a piezoelectric vibrator element 12 and an insulation board 20. One end of the 1st conductor 24a is connected to the other end of the lead electrode 18 on a node of the piezoelectric vibrator element 12 and the other end connects to a 1st pattern electrode 22a on the insulation board 20. One end of the 2nd conductor 24b connects to the 2nd electrode 16b on the node of the piezoelectric vibrator element 12 and the other end connects to a 2nd pattern electrode 22b on the insulation board 20.

Description

Detailed Description of the Invention

[0001]

The present invention relates to a piezoelectric component,
In particular, it relates to a piezoelectric component using a piezoelectric vibrating element such as an oscillator, a filter and a piezoelectric transformer.

[0002]

2. Description of the Related Art FIG. 4 is a perspective view showing a conventional piezoelectric component which is the background of the present invention. The piezoelectric component 1 shown in FIG.
It includes a strip-shaped piezoelectric vibrating element 2. The piezoelectric vibrating element 2 includes a strip-shaped piezoelectric substrate 3. Electrodes 4a and 4b are formed on both main surfaces of the piezoelectric substrate 3 and vibrate in a length vibration mode. The piezoelectric component 1 also includes an insulating substrate 5 for supporting the node portion of the piezoelectric vibrating element 2 and electrically connecting the piezoelectric vibrating element 2 and an external circuit (not shown). The piezoelectric vibrating element 2 is supported on one main surface of the insulating substrate 5 at the node portion on the other main surface. further,
On one main surface of insulating substrate 5, for example, a substantially I-shaped first pattern electrode 6a and a substantially U-shaped second pattern electrode 6b are formed. One end of the lead wire 7 longer than the width of the piezoelectric vibrating element 2 is connected to the electrode 4a on the node portion on the one main surface of the piezoelectric vibrating element 2 by soldering or a conductive adhesive. The other end of the lead wire 7 is connected to the first pattern electrode 6 a on the insulating substrate 5. In addition, the electrode 4b on the node portion on the other main surface of the piezoelectric vibrating element 2
Are connected to the second pattern electrode 6b on the insulating substrate 5 by soldering or a conductive adhesive. As described above, conventionally, the conductive connection between the electrode 4a of the piezoelectric vibrating element 2 and the pattern electrode 6a of the insulating substrate 5 has been performed by a so-called wire bonding method.

[0003]

However, in the conventional piezoelectric component 1, the lead wire 7 may come off from the piezoelectric vibrating element 2 or the insulating substrate 5 due to the vibration of the piezoelectric vibrating element 2 and the subsequent handling. There is
The reliability of the conductive connection was low. In addition, the conventional piezoelectric component 1
Then, since the vibration of the piezoelectric vibrating element 2 may be hindered by the variation in the lead shape of the lead wire 7, the quality of the piezoelectric component 1 was not stable. Further, in the conventional piezoelectric component 1, there are problems in cost, such as high equipment cost for wire bonding and a large number of steps. Further, in the conventional piezoelectric component 1, since it is necessary to provide the pattern electrode 6a for connecting the lead wire 7 to the outside of the piezoelectric vibrating element 2 on the insulating substrate 5, the piezoelectric component cannot be downsized.

Therefore, a main object of the present invention is to provide a piezoelectric component having a highly reliable conductive connection, a stable quality, and a low cost.

[0005]

According to the present invention, there is provided a piezoelectric component comprising:
Between the piezoelectric vibrating element having a pair of electrodes, an insulating substrate having a plurality of pattern electrodes arranged to face the piezoelectric vibrating element and connected to the pair of electrodes, respectively, and between the piezoelectric vibrating element and the insulating substrate. And a plurality of connecting portions for electrically connecting the corresponding electrodes and pattern electrodes to each other and supporting the node portion of the piezoelectric vibrating element on the insulating substrate.

In the piezoelectric component of the present invention, the piezoelectric vibrating element includes a piezoelectric substrate, a first electrode formed on one main surface of the piezoelectric substrate, and a second electrode formed on the other main surface of the piezoelectric substrate. The insulating substrate includes: an electrode; and an extraction electrode, one end of which is connected to the first electrode and the other end of which is drawn out to a node portion on the other main surface side of the piezoelectric vibrating element. A first pattern electrode to be connected to the electrode and a second pattern electrode to be connected to the second electrode are included, and the connecting portion has one end between the piezoelectric vibrating element and the insulating substrate. Between the piezoelectric vibrating element and the insulating substrate, a first conductor that is connected to the other end of the extraction electrode on the node portion of the piezoelectric vibrating element, and the other end is connected to the first pattern electrode,
It is preferable to include a second conductor having one end connected to the second electrode on the node portion of the piezoelectric vibrating element and the other end connected to the second pattern electrode.

Further, in the piezoelectric component of the present invention, the piezoelectric vibrating element includes a piezoelectric substrate, a first electrode formed on one main surface of the piezoelectric substrate, and a second electrode formed on the other main surface of the piezoelectric substrate. An electrode and an extraction electrode formed by extracting one end of the piezoelectric vibrating element to the first electrode, the other end of which is connected to the one principal surface on which the first electrode is formed and which is adjacent to the node. The insulating substrate includes a first pattern electrode to be connected to the first electrode and a second pattern electrode to be connected to the second electrode, and the connecting portion is a piezoelectric vibrating element. Between the insulating substrate and the insulating substrate, one end is connected to the other end of the extraction electrode on the node portion of the piezoelectric vibration element, and the other end is the first end.
Between the first conductor connected to the pattern electrode of, and the piezoelectric vibrating element and the insulating substrate, one end is connected to the second electrode on the node portion of the piezoelectric vibrating element, and the other end is the first electrode. Two
A second conductor connected to the pattern electrode of.

[0008]

In the piezoelectric component of the present invention, the piezoelectric vibrating element is supported on the insulating substrate by the plurality of connecting portions. At the same time, the pair of electrodes of the piezoelectric vibrating element and the plurality of pattern electrodes of the insulating substrate are electrically connected by the connecting portions.

When the first electrode on the one main surface of the piezoelectric component is drawn out to the node portion on the other main surface side by the extraction electrode, the first electrode is formed via the extraction electrode and the first conductor.
And the first pattern electrode are electrically connected.
In addition, the second electrode and the second pattern electrode are electrically connected via the second conductor. At the same time, the piezoelectric vibrating component is supported on the insulating substrate by the first and second conductors.

When the first electrode on the one main surface of the piezoelectric component is drawn out to the node portion on the adjacent surface by the lead electrode, the first electrode is formed via the lead electrode and the first conductor.
And the first pattern electrode are electrically connected.
In addition, the second electrode and the second pattern electrode are electrically connected via the second conductor. At the same time, the piezoelectric vibrating component is supported on the insulating substrate by the first and second conductors.

[0011]

According to the piezoelectric component of the present invention, since the piezoelectric vibrating element is supported on the insulating substrate by the connecting portion and both are electrically connected, the conductive connection may be deviated due to vibration or the like like a lead wire. There is no. Therefore, in this piezoelectric component, the conductive connection between the piezoelectric vibrating element and the insulating substrate is highly reliable. Further, in this piezoelectric component, since the lead wire is not used for the conductive connection, the trouble such as the inhibition of the vibration of the piezoelectric vibrating element due to the variation in the lead wire leading shape does not occur. Therefore, this piezoelectric component has stable quality,
The production yield is also improved. Further, in this piezoelectric component, the number of steps and facility cost for conducting connection can be reduced as compared with the wire bonding method. Therefore, this piezoelectric component can be manufactured at a lower cost than the wire bonding type piezoelectric component. Furthermore, in this piezoelectric component, since it is not necessary to provide a pattern electrode for connecting a lead wire to the outside of the piezoelectric vibrating element on the insulating substrate, the piezoelectric vibrating element and the insulating substrate are formed to have substantially the same size. be able to. Therefore, the size of the insulating substrate can be reduced and the piezoelectric component can be miniaturized as compared with the conventional wire-bonding type piezoelectric component.

The above-mentioned objects, other objects, features and advantages of the present invention will become more apparent from the following detailed description of the embodiments of the invention with reference to the drawings.

[0013]

BEST MODE FOR CARRYING OUT THE INVENTION

1 is an exploded perspective view showing an embodiment of the present invention. FIG. 2 is a perspective view showing the other main surface of the piezoelectric vibrating element shown in FIG. FIG. 3 is a schematic cross-sectional view showing a main part of the piezoelectric component shown in FIG. Piezoelectric component 10 shown in FIG.
Includes a strip-shaped piezoelectric vibrating element 12. This piezoelectric vibrating element 12 utilizes a vibration mode of length vibration. In this case, the central portion in the longitudinal direction of the piezoelectric vibrating element 12 becomes the node portion. The node portion N is linear and has no area on the surface of the piezoelectric vibrating element 12, as indicated by the chain double-dashed line in FIGS. 1 and 2.

The piezoelectric vibrating element 12 is a strip-shaped piezoelectric substrate 1.
Including 4. A first electrode 16a is formed on the entire one main surface of the piezoelectric substrate 14. The second electrode 16b is formed on the other main surface of the piezoelectric substrate 14. For example, strip-shaped extraction electrodes 18, 18 are formed along the node portion on both side surfaces of the piezoelectric substrate 14 that face each other in the width direction. One end of each of the extraction electrodes 18, 18 is connected to the first electrode 16a on one main surface of the piezoelectric substrate 14, and the other end thereof is a node on the other main surface of the piezoelectric substrate 14, as shown in FIG. It is pulled out to the department. The other main surface of the piezoelectric substrate 14 is cut out into a substantially rectangular shape at a portion corresponding to the other end of the extraction electrodes 18 and 18 in order to insulate the extraction electrodes 18 and 18 from the second electrode 16b. There is. In this case, in order to minimize the loss of the area of the second electrode 16b on the other main surface, it is necessary to make the cutout area as small as possible. for that reason,
The other ends of the lead electrodes 18, 18 are formed as small as possible on the node part on the other main surface of the piezoelectric substrate 14. The first electrode 16a and the second electrode 16a of the piezoelectric vibrating element 12
The electrode 16b and the extraction electrodes 18 and 18 are formed of, for example, Ag electrodes, and the Ag electrodes are formed by a method such as sputtering or vapor deposition.

Further, the piezoelectric component 10 supports the node portion of the piezoelectric vibrating element 12, and at the same time, the piezoelectric vibrating element 12
And an insulating substrate 20 for electrically connecting an external circuit (not shown). The insulating substrate 20 is, for example, 96.
% Alumina. On the one main surface of the insulating substrate 20, for example, a substantially U-shaped first pattern electrode 22a and a substantially T-shaped second pattern electrode 22 are provided.
b are formed. First and second pattern electrodes 22
a and 22b are drawn out to the side surface or the other main surface of the insulating substrate 20 and electrically connected to an external circuit (not shown). First and second pattern electrodes 22a and 22
Each b is formed of, for example, an Ag electrode.
The Ag electrode is formed, for example, by applying a glass-based conductive paste on the insulating substrate 20 and then baking it.
In this specification, the electrical connection between electrodes is referred to as conductive connection.

The piezoelectric vibrating element 12 is supported on the insulating substrate 20 by the connecting portion. The connection part of this embodiment is 2
It includes one first conductor 24a, 24a and one second conductor 24b. The first and second conductors 24a and 24b are made of solder, a conductive adhesive, or the like.
As shown in FIG. 5, each of the piezoelectric vibrating elements 12 is formed with a predetermined height such that a predetermined gap is formed between the other main surface and the one main surface of the insulating substrate 20. Piezoelectric vibration element 12
A predetermined gap is provided between the other main surface of the piezoelectric substrate and the one main surface of the insulating substrate 20, so that the vibration of the piezoelectric vibrating element 12 is not hindered. Further, since the node portion is linear and has no area, the size of the first and second conductors 24a and 24b is set so as to support the piezoelectric vibrating element 12 from the viewpoint of preventing the vibration of the piezoelectric vibrating element 12 from being hindered. It is formed as small as possible within the range that does not interfere with. Piezoelectric component 12 and insulating substrate 2
As a method of connecting with 0, for example, a bump connection method or the like can be adopted. The bump connection method is
This is a method in which a conductor such as solder is applied in advance to one electrode in the form of a protrusion and then the conductor is connected to the other electrode.

As shown by the black dots in FIGS. 1 and 2, the first conductors 24a, 24a are provided on the node portion of the piezoelectric vibrating element 12 and the other ends of the lead electrodes 18, 18 and the first conductors 24a, 24a, respectively. The pattern electrodes 22a are formed at positions where they are electrically connected to each other. Also, the second conductor 24b is the same as in FIG.
Further, as indicated by black dots in FIG. 2, it is formed on the node portion of the piezoelectric vibrating element 12 at a position where the second electrode 16b and the second pattern electrode 22b are electrically connected. Therefore, the first electrode 16a of the piezoelectric vibrating element 12 is conductively connected to the first pattern electrode 22a via the extraction electrodes 18, 18 and the first conductors 24a, 24a. Further, the second electrode 16b of the piezoelectric vibrating element 12 is electrically connected to the second pattern electrode 22b via the second conductor 24b.

As described above, according to the piezoelectric component 10 of this embodiment, the piezoelectric vibrating element 12 is supported on the insulating substrate 20 by the first and second conductors 24a and 24b of the connecting portion, and both are connected. Since they are electrically connected, the conductive connection does not come off due to vibration unlike the conventional lead wire. Therefore, in the piezoelectric component 10, the conductive connection between the piezoelectric vibrating element 12 and the insulating substrate 20 has high reliability. Further, in this piezoelectric component 10, since the lead wire is not used for the conductive connection, the trouble such as the inhibition of the vibration of the piezoelectric vibrating element 12 due to the variation in the lead wire leading shape does not occur. Therefore, the piezoelectric component 10 has stable quality and the yield at the time of manufacturing is improved. Further, when manufacturing the piezoelectric component 10, the extraction electrode 18 can be formed simultaneously with the first and second electrodes 16a and 16b by a method such as sputtering or vapor deposition. Then, the piezoelectric vibrating element 12 and the insulating substrate 20 can be connected more easily by the bump connection method than by wire bonding. Therefore, the piezoelectric component 10 can be manufactured at low cost because the number of steps and the facility cost can be reduced as compared with the conventional piezoelectric component. Furthermore, in this piezoelectric component 10, since it is not necessary to provide a pattern electrode for connecting a lead wire to the outside of the piezoelectric vibrating element 12 on the insulating substrate 20, the piezoelectric vibrating element 12 and the insulating substrate 20 are substantially the same. It can be formed in a size. Therefore, the size of the insulating substrate 20 can be reduced as compared with the conventional wire bonding type piezoelectric component 10.
The piezoelectric component 10 can be miniaturized.

In this embodiment, the extraction electrode 18 has two electrodes.
However, the present invention is not limited to this and may be, for example, only one. In addition, in this embodiment, the extraction electrode 18 is connected to the piezoelectric substrate 1.
Although it is formed on the side surface of No. 4, it is not limited to this and may be drawn to the other main surface of the piezoelectric substrate 14 through a through hole, for example. Further, in this embodiment, the extraction electrode 18
Although the other end of the piezoelectric substrate 14 is drawn out to the other main surface of the piezoelectric substrate 14, the present invention is not limited to this and may be formed only on the side surface of the piezoelectric substrate 14, for example.

[Brief description of drawings]

FIG. 1 is an exploded perspective view showing an embodiment of the present invention.

FIG. 2 is a perspective view showing the other main surface of the piezoelectric vibrating element of the piezoelectric component shown in FIG.

FIG. 3 is a schematic sectional view showing a main part of the piezoelectric component shown in FIG.

FIG. 4 is a perspective view showing a conventional piezoelectric component which is the background of the present invention.

[Explanation of symbols]

 10 piezoelectric component 12 piezoelectric vibrating element 14 piezoelectric substrate 16a first electrode 16b second electrode 18 extraction electrode 20 insulating substrate 22a first pattern electrode 22b second pattern electrode 24a first conductor 24b second conductivity body

Claims (3)

[Claims] 1. A piezoelectric vibrating element having a pair of electrodes, an insulating substrate having a plurality of pattern electrodes which are arranged so as to face the piezoelectric vibrating element and are to be connected to the pair of electrodes, respectively, and the piezoelectric vibrating element. And a plurality of electrodes for electrically connecting the corresponding electrodes and the pattern electrodes to each other and supporting the node portion of the piezoelectric vibrating element on the insulating substrate. Piezoelectric components, including connections. 2. The piezoelectric vibrating element, a piezoelectric substrate, a first electrode formed on one main surface of the piezoelectric substrate, a second electrode formed on the other main surface of the piezoelectric substrate, one end A part connected to the first electrode, and the other end part drawn out to a node part on the other main surface side of the piezoelectric vibrating element to be formed, wherein the insulating substrate is the first electrode. A first pattern electrode to be connected with, and a second pattern electrode to be connected to the second electrode, the connection portion between the piezoelectric vibrating element and the insulating substrate, A first conductor whose one end is connected to the other end of the extraction electrode on the node part of the piezoelectric vibrating element, and the other end is connected to the first pattern electrode; Between the insulating substrate and one end on the node portion of the piezoelectric vibrating element The piezoelectric component according to claim 1, further comprising a second conductor that is connected to the second electrode and has the other end connected to the second pattern electrode. 3. The piezoelectric vibrating element includes: a piezoelectric substrate; a first electrode formed on one principal surface of the piezoelectric substrate; a second electrode formed on the other principal surface of the piezoelectric substrate; Part is connected to the first electrode, and the other end part is the first electrode.
A lead electrode formed by being drawn to a node portion of the piezoelectric vibrating element on a surface adjacent to the one main surface on which the electrode is formed, the insulating substrate being connected to the first electrode. One pattern electrode and a second pattern electrode to be connected to the second electrode, wherein the connection portion has one end between the piezoelectric vibrating element and the insulating substrate. A first conductor connected to the other end of the extraction electrode on the node part of the element, the other end connected to the first pattern electrode; and between the piezoelectric vibrating element and the insulating substrate. The second conductor according to claim 1, wherein one end is connected to the second electrode on the node portion of the piezoelectric vibrating element, and the other end is connected to the second pattern electrode. The piezoelectric component described.