JPH09283032A - Gas discharge type display panel and its manufacture - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a display cell shape having high luminous efficiency of phosphors and high luminance with low power by providing multiple main discharge recesses having phosphor layers on the curved inner walls on the front substrate side surface. SOLUTION: Display electrodes 6, 6a, bus electrodes 7, 7a, a dielectric layer 8 having the film thickness of 0.002-0.03mm, and a protective layer 9 having the thickness of 0.0001-0.002mm are formed on a glass substrate 4 to obtain a front substrate 1. A photosensitive film 1120 is laminated on the surface of a glass substrate 5, it is exposed, developed, washed with water, and dried, the glass substrate 5 is machined by the sand blast method to remove the portion of the glass substrate 5 not covered by the film 1120, and recesses having the depth of 0.08-0.3mm are formed as main discharge spaces 100. Address electrodes 10 and phosphor layers 12 are provided on the recesses to obtain a back substrate 2 having barrier ribs 11 and the phosphor layers 12. The front substrate 1 and the back substrate 2 are fixed so that the display electrodes 6 and bus electrodes 7 are made perpendicular to the address electrodes 10.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a gas discharge type display panel used in a gas discharge type display device such as a plasma display and a method for manufacturing the same, and more particularly to a display cell having a high luminous efficiency of a phosphor. The present invention relates to a gas discharge type display panel capable of high brightness and low power and a manufacturing method thereof.

[0002]

2. Description of the Related Art A gas discharge type display device such as a plasma display performs display by self-emission, so that the display angle is wide and the display is easy to see. In addition, it has features such as being able to produce a thin type and realizing a large screen, and has begun to be applied to display devices of information terminal equipment and high-definition television receivers.

[0003] Plasma displays are roughly classified into a DC drive type and an AC drive type. Among them, the AC drive type plasma display has a high luminance due to the memory effect of the dielectric layer covering the electrodes, and has a practically usable life due to the formation of the protective layer and the like. As a result, plasma displays have been put to practical use as versatile video monitors. An example of this is shown in FIGS.

FIG. 7 is a perspective view showing the structure of a practical plasma display panel. In this figure, the front substrate 1 is shown separated from the rear substrate 2 and the discharge space region 3 for easy viewing. The front substrate 1 comprises a display electrode 6 made of a transparent conductive material such as ITO (Indium Tin Oxide) or tin oxide (SnO ₂ ) on the front glass substrate 4, a bus electrode 7 made of a low resistance material, and a transparent insulating material. It has a structure in which a dielectric layer 8 and a protective layer 9 made of a material such as magnesium oxide (MgO) are formed.
The rear substrate 2 includes the address electrodes 10 on the rear glass substrate 5.
The barrier rib 11 and the phosphor layer 12 are formed. Then, the front substrate 1 and the rear substrate 2 are attached to each other so that the display electrodes 6 and the address electrodes 10 are substantially orthogonal to each other, so that the discharge space region 3 is formed in the front substrate 1 and the rear substrate 2.
Is formed between.

FIG. 8 is a sectional view of the gas discharge type display device shown in FIG. In FIG. 8, (a) is a cross section parallel to the address electrode 10, (b) is a cross section taken along the line AB of FIG. 8 (a) perpendicular to the address electrode 10, and (c) is perpendicular to the address electrode 10. 7A shows a C-D cross section of the drawing shown in FIG. In this gas discharge type display device, an AC voltage is applied between a pair of display electrodes 6 provided on the front substrate 1, and a voltage is applied between the address electrodes 10 provided on the rear substrate 2 and the display electrodes 6. As a result, an address discharge is generated, and a main discharge is generated in a predetermined discharge cell. The display is performed by causing the phosphors 12 to emit light by the ultraviolet rays generated by the main discharge.

An example of the manufacturing process of the conventional gas discharge display device shown in FIGS. 7 and 8 will be briefly described with reference to FIG.

First, the manufacturing process of the front substrate 1 will be described. Front glass substrate 4 made of soda lime glass, etc.
And the transparent electrode pattern 6 is formed on one of the main surfaces. When ITO is used as a transparent electrode material, the transparent electrode pattern 6 is often formed by a well-known photo-etching method after forming an ITO film by using a sputtering method or the like. On the other hand, when SnO ₂ is used, the transparent electrode pattern 6 is formed by chemical vapor deposition (Chemical Vapor Depos) using a lift-off method.
It is often formed by
Soda lime glass used for the front glass substrate is often coated with silica or the like.

A copper (Cu) film is formed on the bus electrode 7 by chromium (C).
A Cr / Cu / Cr laminated film sandwiched by r) film is often used, and is formed by performing well-known photoetching after film formation. A transparent dielectric layer 8 is formed by printing a dielectric paste on the front glass substrate 4 on which the transparent electrodes 6 and the bus electrodes 7 are formed, drying and sintering. A seal layer 17 for vacuum sealing is formed by a printing method on the front glass substrate 4 on which the dielectric layer 8 is formed, and further, a Mg layer is formed by a vacuum deposition method or the like.
An O layer is formed. Thus, the front substrate 1 is completed.

Next, the manufacturing process of the rear substrate 2 will be described. Rear glass substrate 5 made of soda lime glass, etc.
And the address electrode pattern 10 is formed on one of the main surfaces by a thick film printing method using a silver (Ag) paste. On the back glass substrate 5 on which the address electrodes 10 are formed, the barrier ribs 11 are formed by repeating thick film printing and drying. Next, the back substrate 2 is completed by forming the phosphor layer 12 by a thick film printing method.

The completed front substrate 1 and rear substrate 2 are assembled while aligning them. An exhaust pipe (not shown) for exhausting and introducing a sealed gas is attached, and thereafter, the substrates are sealed and the exhaust pipe is fixed in a sealing furnace. The seal between the substrates is melted and fixed by the seal layer 17 (low-melting glass, frit) formed in the substrate process. Next, a panel is attached to the exhaust device, and the panel is evacuated with an exhaust pipe while baking the panel. Thereafter, for example, a mixed gas of neon (Ne) and xenon (Xe) is sealed, and the exhaust pipe is chipped off and aged, thereby completing the conventional gas discharge display device shown in FIGS. . The conventional example of the gas discharge type display device shown here is, for example, a flat panel display 1996 (edited by Nikkei Microdevice, 19th edition).
1995), pp. 208-215.

[0011]

According to the above conventional technique, it is most difficult to form the barrier ribs 11 provided on the back substrate 2.
In the barrier rib formation by the thick film printing method described with reference to FIG. 9, since thick film printing and drying are repeated many times, dimensional accuracy and defects of thick film patterns occur, misalignment of thick film patterns with each other, and large screens. Plate deformation is likely to occur. Therefore, the manufacturing process becomes longer and the manufacturing yield becomes lower. Further, it is difficult to reduce the size to about 0.05 mm by the thick film printing method, and the larger the screen plate, the more easily the deformation occurs. This makes it difficult to increase the definition and size of the display screen.

The shape of the barrier rib thus produced is close to a rectangle. When a fluorescent substance is formed on the surface of the barrier rib on the discharge space side, the structure conforms to the shape of the barrier rib, so the distance from the ultraviolet rays generated by the main discharge is not constant, and a difference in light emission intensity occurs. This causes uneven brightness in the interior.

In order to address these problems, it is an object of the present invention to provide a gas discharge type display panel which is easy to manufacture and has uniform brightness, and a manufacturing method thereof.

[0014]

SUMMARY OF THE INVENTION It is an object of the present invention to provide a gas discharge type display device with a plurality of "recesses (including grooves)" serving as discharge spaces and a rear substrate having address electrodes for selecting display cells. And a structure in which a front substrate having a display electrode for generating a main discharge for display is laminated, a barrier rib separating the discharge space is made of a rear glass substrate material, and the address electrode is made of a conductor layer embedded in the recess. It is achieved by making the shape of the display cell in the main discharge space similar to the shape of the plasma of the main discharge, and disposing the phosphor at a position where the intensity of the generated ultraviolet rays is equal to increase the luminous efficiency of the phosphor. .

According to this structure, since the recess used for the discharge space can be formed by digging the surface of the rear glass substrate by the sandblasting method, the address electrode can be formed only by burying the conductor layer in the recess. It is possible to reduce the number of manufacturing steps of the rear substrate provided with and to improve the manufacturing yield. The shape dug by the sandblast method is similar to the plasma shape of the main discharge.

Further, since the upper surface of the barrier rib which comes into contact with the front substrate is constituted by the surface of the rear glass substrate itself, the adhesion between the barrier rib and the front substrate is improved as compared with the conventional gas discharge display device. This prevents the discharge from spreading through the gap between the barrier rib and the front substrate to the adjacent discharge space, which improves the reliability of display cell selection and allows the phosphors to be located at positions where the intensity of ultraviolet rays generated is the same. Therefore, the luminous efficiency of the phosphor can be increased, and higher brightness and lower power can be achieved as compared with the conventional gas discharge type display device.

[0017]

BEST MODE FOR CARRYING OUT THE INVENTION A first mode of a gas discharge type display panel of the present invention comprises a front substrate provided with electrodes for main discharge and a back substrate provided with electrodes for auxiliary discharge, and the back substrate is the front substrate. The side surface is provided with a plurality of main discharge recesses each having a phosphor layer on the inner wall, and the main discharge recesses are formed by bending the inner wall. Further, if the auxiliary discharge electrode is provided between the inner wall of the main discharge recess and the phosphor layer, the manufacturing becomes easier.

A second mode of the gas discharge type display panel of the present invention is a front substrate having a main discharge electrode, a rear substrate having an auxiliary discharge electrode, and a partition wall sandwiched between the front substrate and the rear substrate. And a partition substrate, the front substrate side surface, a plurality of main discharge recesses having a phosphor layer on the inner wall, the back substrate side surface, a plurality of auxiliary discharge recesses,
The inner wall of the recess for main discharge is curved.

A third mode of the gas discharge display panel of the present invention is a front substrate having electrodes for main discharge, a rear substrate having electrodes for auxiliary discharge, and a partition substrate sandwiched between the front substrate and the rear substrate. The partition substrate is provided on the front substrate side surface,
The inner wall is provided with a plurality of main discharge recesses having a phosphor layer, the rear substrate is provided with a plurality of auxiliary discharge recesses on the partition substrate side surface, and the main discharge recesses are curved inner walls. Is.

In the second or third embodiment, it is desirable that the inner wall of the recess for auxiliary discharge is bent similarly to the recess for main discharge. The auxiliary discharge electrode is preferably provided on the inner wall of the auxiliary discharge recess.

In any of the above-described first to third embodiments, the recess can be formed by a groove extending in the same direction. In this case, it is desirable that the extending direction of the main discharge recess and the extending direction of the auxiliary discharge recess are orthogonal to each other when viewed from the front substrate. Further, the recesses may be formed by recesses arranged in a matrix in the vertical and horizontal directions.

When the concave portion is used as a groove, it is desirable that the inner wall of the groove forms a part of a circle in a cross section of the display panel at right angles to the extending direction of the groove. Further, the inner wall of the recess may form part of the spherical shape. This is because the distance from the discharge generation source becomes uniform.

The display panel of the first embodiment has a front substrate forming step of forming a front substrate having main discharge electrodes, a rear substrate forming step of forming a rear substrate having auxiliary discharge electrodes, a front substrate and a back surface. It is produced by a manufacturing method including an assembling step of assembling the substrates so as to face each other. Here, the back substrate forming step has a step of forming a plurality of main discharge recesses, the inside of which is curved, on the surface of the base material.

Here, in the back substrate forming step, a step of forming the auxiliary discharge electrode on the inner wall of the main discharge recess and a phosphor layer on the inner wall of the main discharge recess so as to cover the auxiliary discharge electrode. And the step of forming.

In the display panel of the second embodiment, a front substrate forming step of forming a front substrate having electrodes for main discharge, a rear substrate forming step of forming a rear substrate having electrodes for auxiliary discharge, a front substrate and a back surface are provided. It is manufactured by a manufacturing method including a partition substrate forming step of forming a partition substrate for separating from the substrate and an assembly step of stacking and fixing the back substrate, the partition substrate and the front substrate. Here, the partition substrate forming step includes a step of forming a plurality of concave portions each having an inner curved surface on both front and back surfaces of the base material.

In the display panel of the third embodiment, a front substrate forming step of forming a front substrate having a main discharge electrode, a rear substrate forming step of forming a rear substrate having an auxiliary discharge electrode, a front substrate and a back surface. A partition wall substrate forming step of forming a partition wall substrate for separating between the substrates, and an assembly step of stacking and fixing a rear substrate, a partition wall substrate, and a front substrate, the partition wall substrate forming step comprising: , A step of forming a plurality of concave portions having an inner curved surface on one of the front and back surfaces of the substrate, and In the assembling step, the surface of the back substrate on which the recess is provided and the surface of the partition substrate on which the recess is not provided face each other.
It is manufactured by a manufacturing method including a step of assembling the front surface substrate and the surface of the partition substrate on which the concave portion is provided so as to face each other.

[0027]

【Example】

<First Embodiment> A first embodiment of the present invention will be described with reference to FIG. FIG. 1 is a cross-sectional view showing a part of a gas discharge type display device to which the present invention is applied. FIG. 1A shows a cross section parallel to the address electrode 10, and FIG.
1 is a sectional view taken along line A-B shown in FIG.
FIG. 1C shows a CD section shown in FIG. 1A, which is perpendicular to the address electrode 10.

In the figure, 1 is a front substrate, 2 is a rear substrate, 3 is a discharge space region, 4 is a front glass substrate, and 5 is a front glass substrate.
Is a back glass substrate, 6 and 6a are display electrodes made of a transparent conductive material, 7 and 7a are bus electrodes provided so as to partially overlap the display electrodes, 8 is a dielectric layer, and 9 is MgO. Is a protective layer, 11 is a barrier rib that limits the main discharge space, 12 is a phosphor layer, and 100 is a main discharge space in which main discharge for display occurs.

An example of the manufacturing method of this embodiment will be described below with reference to FIG. First, a method for manufacturing the front substrate 1 will be described. (1) A glass plate such as soda lime glass as the front glass substrate 4 is washed with a neutral detergent or the like.

(2) A tin oxide (SnO ₂ ) film or ITO (Indium Tin) film is formed on the cleaned front glass substrate 4 by a film forming method such as a sputtering method or an electron beam evaporation method.
A transparent conductive film such as an oxide film is formed. Then, the transparent conductive film is processed by a well-known photoetching method to form an electrode pattern serving as the display electrodes 6 and 6a. The pattern size of the display electrode may be determined according to the size of the discharge cell to be manufactured.

(3) A copper (Cu) film is sandwiched by a chromium (Cr) film on the front glass substrate 4 on which the display electrodes 6 and 6a are formed by using a film forming method such as a sputtering method or an electron beam evaporation method. A Cr / Cu / Cr laminated film is formed. Then, using a well-known photo-etching method, Cr / Cu /
The Cr laminated film is processed and an electrode pattern is formed so as to overlap a part of the display electrodes 6 and 6a to form the bus electrodes 7 and 7a. The thickness of the Cu film and the pattern size of the bus electrode may be determined according to the resistance value required for the bus electrode.

(4) Aluminum (A) is placed at a predetermined location on the front glass substrate 4 on which the display electrodes 6 and the bus electrodes 7 are formed.
l), a hydrolysis-type coating agent (alkoxide, etc.) containing silicon (Si) and oxygen (O) as main components is applied by a method such as a blade method or a spray method, and 100 to 4
By heating at a temperature of 00 ° C. for 1 to 60 minutes, the dielectric layer 8 having a thickness of 0.002 to 0.03 mm is formed.

(5) An MgO film is formed at a predetermined place by using a film forming method such as a sputtering method or an electron beam evaporation method to form the protective layer 9. The thickness of the MgO film needs to be determined according to the life required for the gas discharge type display device, and a typical value is 0.0001 to 0.002 mm.

Through the above steps, the front substrate 1 is completed. In this example, tri (n-butoxy) aluminum and tetra (n-butyl) silicate were converted into Al and Si oxides as the hydrolysis-type coating agent containing Al, Si, and O as main components. 37: 6 when converted
The gel obtained by hydrolyzing the n-butanol solution contained in the weight ratio of 3 at room temperature was used.

Next, a method of manufacturing the rear substrate 2 will be described. (1) A glass plate such as soda lime glass as the rear glass substrate 5 is washed with a neutral detergent or the like.

(2) Laminating the photosensitive film 1120 on the back glass substrate 5, exposing, developing, washing with water, as is well known.
By drying, a predetermined photosensitive film pattern is formed.

(3) By sandblasting, the portion of the rear glass substrate 5 which is not covered with the photosensitive film 1120 is removed, and "grooves" forming the main discharge space 100 are formed on the surface of the rear glass substrate 5. Form. In this case, the sandblasting conditions are adjusted so that the groove depth is 0.08 to 0.3 mm.

(4) A Cr / Cu / Cr laminated film is formed on the rear glass substrate 5 provided with "grooves" which become the main discharge space 100, by a film forming method such as sputtering or electron beam evaporation. . By this step, the Cr / Cu / Cr laminated film forming the address electrode 10 is embedded in the “groove” which becomes the main discharge space 100. An example of the process of forming the address electrode 10 is shown in FIG. 3, which will be described later.

(5) The phosphor 12 is applied to the surface of the inner wall of the "groove" which becomes the main discharge space 100 by using a method such as a spray method or a blade method. In the case of a gas discharge type display device of a color display, a mask of a predetermined pattern of green, blue and red is aligned, and a phosphor layer 12 for emitting green, blue and red colors is applied. Then 5-60 at a temperature of 150-400 ° C
Heat treatment for a minute.

(6) A frit glass pattern is formed by using a thick film printing method and dried to form a seal layer (not shown) for vacuum sealing.

Through the above steps, the rear substrate 2 having the barrier ribs 11 for separating the discharge space and the phosphor layer 12 is completed. A chip tube (not shown) is attached to the rear substrate 2 for exhaust and gas introduction after the panel is assembled.

The front substrate 1 and the rear substrate 2 completed in the above steps are aligned and heat-treated at 400 to 450 ° C. to fix these substrates. in this case,
The display electrodes 6 and the bus electrodes 7 provided on the front substrate 1 and the address electrodes 10 provided on the rear substrate 5 are substantially orthogonal to each other. Next, the main discharge space 10 formed between the front substrate 1 and the rear substrate 2 is passed through a chip tube (not shown) provided on the rear substrate.
The vacuum is evacuated to 0, for example, Ne containing 3% Xe is introduced into the main discharge space 100, and the pressure in the main discharge space 100 is adjusted to 35 to 70 kPa. Next, the gas discharge type display device shown in FIG. 1 was completed by performing chip-off by locally heating a chip tube (not shown).

Next, the address electrode 1 omitted in the above description.
The process of forming 0 will be described with reference to FIG. Typical forming processes of the address electrode 10 are two processes of (A) and (B) shown in FIG.

First, the process (A) will be described. (1) The rear glass substrate 5 having the “groove” which becomes the main discharge space 100 is washed with a neutral detergent or alcohol.

(2) A conductor layer 1140 made of a Cr / Cu / Cr laminated film is formed on the rear glass substrate 5 in which a groove serving as the main discharge space 100 is formed by using a film forming method such as a sputtering method or an electron beam evaporation method. To form.

(3) The back glass substrate 5 having the Cr / Cu / Cr laminated film formed thereon is polished by a polishing method such as a tape polishing method or a polishing method. As a result, the conductor layer 1140 deposited on the photosensitive film 1120 is removed. This step is performed to facilitate removal of the photosensitive film 1120. Therefore, the conductor layer 114
If the photosensitive film 1120 can be removed after the formation of 0, it can be omitted.

(4) Concentration is 1 to 4%, temperature is 40 to 50
The photosensitive film 1120 is removed by spray peeling using a sodium hydroxide aqueous solution at 0 ° C. A typical spray pressure in this case is 1 to 3 kg / cm 2.

Next, the process (B) will be described. (1) The photosensitive film 1120 is removed from the rear glass substrate 5 having the “grooves” forming the main discharge space 100 by spray peeling using a sodium hydroxide aqueous solution having a concentration of 1 to 4% and a temperature of 40 to 50 ° C. Remove. A typical spray pressure in this case is 1 to 3 kg / cm 2.

(2) On the rear glass substrate 5 from which the photosensitive film 1120 has been removed, a conductor layer 1140 made of Cr / Cu / Cr is formed by a film forming method such as a sputtering method or an electron beam evaporation method.

(3) The back glass substrate 5 having the Cr / Cu / Cr laminated film formed thereon is polished by a polishing method such as a tape polishing method or a polishing method. As a result, the conductor layer 1140 deposited on the barrier rib 11 is removed. Next, cleaning is performed using alcohol or the like to remove the abrasive grains and the like.

The example of the method of forming the address electrode 10 in the manufacturing process in the first embodiment of the present invention has been described above. FIG.
In either of the cases (A) and (B) shown in (1), the conductor layer 1140 forming the address electrode 10 is formed after the barrier rib 11 is formed. This point is different from the conventional manufacturing method of the barrier rib shown in FIG.

In this embodiment, Cu and Cr are used as materials for the bus electrodes 7 and the address electrodes 10, but Al and T
Metals of i, Ni, W, Mo and alloys thereof may be used. In addition, although a sputtering method or an electron beam evaporation method is used as a method for forming the material forming the bus electrode 7 and the address electrode 10, there is no limitation on the formation method, and a plating method, a resistance heating evaporation method, a thick film printing method, and the like. May be used. The transparent conductive material forming the display electrode 6 is also tin oxide or I
The method is not limited to TO, and the forming method thereof is not limited to the sputtering method or the electron beam evaporation method, and a chemical vapor phase reaction method, a sol-gel method or the like may be used. Although an alkoxide is used to form the dielectric layer 8, the material is not limited to this. Further, as the method for forming the dielectric layer 8, a method combining a blade method, a spray method and a thermosetting method is used, but the forming method is not limited, and the sputtering method, the chemical vapor reaction method, the thick film printing method are used. It does not matter even if you use such as. Although MgO is used as the protective layer 9, it is sufficient if the sputtering rate to the discharge gas is low and the secondary electron emission coefficient is high, and CaO, SrO, or a mixture thereof may be used in addition to MgO. Further, in this embodiment, a mixed gas of Ne and Xe is used as the discharge gas, but the discharge gas is not limited to these.

Since the gas discharge type display device of this embodiment to which the present invention is applied can be manufactured by a low temperature process of 450 ° C. or lower, a glass such as soda lime glass which has a low strain point but is inexpensive can be used as a substrate. However, the temperature of the manufacturing process is not required to be 450 ° C. or lower, and the gas discharge display device of this embodiment can be manufactured even when the temperature of the manufacturing process is higher than 450 ° C.

In the gas discharge type display device shown in this embodiment, the main discharge space 100 is formed between the front substrate 1 and the rear substrate 2 by enclosing Ne gas containing 3% Xe, for example. The barrier rib 11 contacts the surface of the front substrate 1 to form the main discharge space 100. The main discharge spaces 100 of the display cells arranged in the direction in which the display electrodes 6 extend are separated, but the display cells arranged in the direction orthogonal to the direction in which the display electrodes 6 extend share the main discharge space 100. ing. The display cell array arranged so as to share the main discharge space exists along the extending direction of the address electrode 10, and will be referred to as “address electrode cell array” here. In addition, a display cell row arranged along the display electrode 6 is referred to as a “display electrode cell row”. The phosphor layer 12 is an inner wall of the “groove” dug into the surface of the rear glass substrate 5, that is, the bottom of the “groove” formed in the rear glass substrate 5 (the upper surface of the address electrode 10) and the side surface of the barrier rib 11. Is formed in. In the address electrode cell column, the main discharge space 100 is shared by the display cells, but the discharge space of each display cell is limited by applying a voltage between the pair of display electrodes 6 and 6a.

In the case of the gas discharge type display device shown in this embodiment, the same driving as that of the conventional gas discharge type display device shown in FIGS. 7 and 8 can be performed. That is, by forming wall charges on the phosphor layer formed on the address electrodes and applying an external voltage to the voltage of the wall charges, it is possible to generate address discharge and select a display cell. In addition, although one electrode of the display electrode 6 is often used as a common electrode common to all display cells, in this embodiment, either the display electrode 6 or the display electrode 6a may be used as a common electrode.

The first point to which the present invention is applied in the embodiment of the present invention is that the main discharge space 100 is formed by digging the rear glass substrate 5 and the distance from the ultraviolet rays excited by the main discharge is constant. This is the point that the phosphor could be formed. As a result, variations in emission intensity of ultraviolet rays can be reduced, variations in brightness can be prevented, and luminous efficiency is most favorable. Moreover, the process of forming the barrier ribs 11 that form the discharge spaces is simplified. In the gas discharge type display device, a barrier rib provided on the back substrate is brought into contact with the front substrate to form a discharge space. Therefore, ensuring the adhesiveness between the surface of the barrier rib and the front substrate is important for eliminating the gap between the barrier rib and the front substrate and preventing the discharge from spreading beyond the barrier rib. Also in this point, in the embodiment of the present invention, the flattening of the surface of the barrier rib 11 is performed on the surface of the rear glass substrate 5 itself, which is superior to the barrier rib formed by the conventional method shown in FIG. There is. That is, according to the present embodiment to which the present invention is applied, the barrier rib 1
1 and the front substrate 1 can be made to have good adhesion as compared with the conventional gas discharge type display device. This indicates that erroneous display due to erroneous discharge of non-selected cells can be prevented.

The second point to which the present invention is applied in the embodiment of the present invention is to form the recesses (grooves) forming the discharge space (the barrier ribs 11 are formed thereby) and then form the address electrodes 10. In point. By this method, the process of processing the conductor layer for forming the address electrode 10 (for example, photoetching) can be omitted, and the manufacturing process of the rear substrate can be shortened. Further, in this embodiment to which the present invention is applied, the following effects can be obtained as compared with the conventional gas discharge type display device and its manufacturing method.

(A) Since the barrier ribs 11 can be formed at a temperature lower than the strain point of soda lime glass, the deformation of the glass substrate can be suppressed.

(B) The yield of the rear substrate 2 is lowered due to defective formation of barrier ribs and defective formation of address electrodes. In particular, defective formation of barrier ribs is a serious problem, and in the conventional method of manufacturing a gas discharge type display device, many rear substrates 2 are defective due to defective formation of barrier ribs even if the address electrodes are good. On the other hand, in the embodiment of the present invention, the address electrode can be formed only on the rear substrate having the good barrier rib. That is, the manufacturing yield of the back substrate can be increased.

As described above, according to the first embodiment of the present invention, the gas discharge type display device capable of shortening the manufacturing process of the rear substrate and improving the yield and enhancing the reliability of the display cell selection. There is an effect that can be provided.

In the first embodiment of the present invention, soda lime glass is used as the back glass substrate 5, but other glass plates or electrically insulating plate materials such as ceramic substrates may be used. Further, as long as the withstand voltage against the address voltage is secured, the back glass substrate 5 may be formed by coating a conductive material such as a metal plate having a "groove" serving as a discharge space on one main surface with an insulating material. . In this case, the effects of the large mechanical strength of the rear substrate 2 and the excellent heat dissipation are also obtained.

<Second Embodiment> FIG. 4 shows a second embodiment of the present invention.
This will be described below. FIG. 4 is a sectional view showing a part of a gas discharge type display device to which the present invention is applied. 4A shows a cross section parallel to the address electrode 10 and FIG.
4A is a cross section perpendicular to the address electrode 10 shown in FIG. 4A, and FIG. 4C is a cross section perpendicular to the address electrode 10 shown in FIG. 4A. Shows. As shown in FIG. 4, in the second embodiment of the present invention, the same method as in the first embodiment of the present invention except that the grid-shaped barrier ribs 18 are inserted between the front substrate 1 and the rear substrate 2. Then, a gas discharge type display device was produced.

The grid-like barrier ribs 18 are made of an insulating material or an insulating-treated metal material. The lattice-shaped barrier rib 18
The insulating material is the front glass substrate 4 and the rear glass substrate 5.
Using soda lime glass of the same material as above, it was formed into a predetermined shape by sandblasting or chemical etching. In addition, the insulating treatment of the metal material used for the grid-like barrier ribs 18 was performed using the hydrolysis-type coating agent used for the dielectric layer 8 of the first embodiment. As the metal material, 426 alloy having a thermal expansion coefficient substantially equal to that of soda lime glass used for the front glass substrate 4 and the rear glass substrate 5 was used, and it was formed into a predetermined shape by chemical etching.

Also in this embodiment, the same effect as that of the above-mentioned first embodiment was obtained.

<Embodiment 3> A third embodiment of the present invention is shown in FIG.
This will be described below. FIG. 5 is a sectional view showing a part of a gas discharge type display device to which the present invention is applied. 5A shows a cross section parallel to the address electrode 10 and FIG.
5A is a cross section perpendicular to the address electrode 10 shown in FIG. 5A, and FIG. 5C is a cross section perpendicular to the address electrode 10 shown in FIG. 5A. Shows. As shown in FIG. 5, in the third embodiment of the present invention, the same method as in the first embodiment except that the partition substrate 13 having the barrier ribs 11 is inserted between the front substrate 1 and the rear substrate 2. Then, a gas discharge type display device was produced.

A method of forming the partition substrate 13 having the barrier ribs 11 shown in FIG. 5 will be described below.

(1) The glass substrate for the partition substrate 13 is washed with a neutral detergent or alcohol.

(2) A positive resin having a predetermined pattern for applying a photosensitive resin to the glass substrate for the partition substrate 13 to form a discharge conduction path between the front substrate 1 side and the rear substrate 2 side in each cell. Negative) film is set and the exposure amount is 200 mJ using a 3 kW (output 8 mW) ultra high pressure mercury lamp.
/ Cm ^{2 to} 250 mJ / cm ² and exposure is performed.

(3) Thereafter, using a 0.2% to 0.5% sodium carbonate aqueous solution, the developing temperature: 25 ° C., the pressure:
Spray development is performed under the conditions of 1.2 kg / cm ² and time: 105 seconds. After this development, it is neutralized with a dilute acid of about 0.1%, washed with water and dried.

(4) Next, a conduction path for discharge between the front substrate side and the rear substrate side is formed by the sandblast method.
The size and shape of the conduction path is 0.1 mm x 0.15 mm
Through hole.

(5) In order to form a cell by sandblasting for forming a conductive path, the photosensitive film is peeled off by a peeling solution, and then a photosensitive resin is applied to both surfaces of the glass substrate for the partition substrate 13. Positive pattern (negative)
Set the film and use a super high pressure mercury lamp of 3kW (output 8mW), and the exposure amount is 200mJ / cm ^{2 to} 250mJ.
/ Cm ² and adjust the exposure.

(6) Then, using a 0.2% to 0.5% sodium carbonate aqueous solution, the developing temperature: 25 ° C., the pressure:
Spray development is performed under the conditions of 1.2 kg / cm ² and time: 105 seconds. After this development, it is neutralized with a dilute acid of about 0.1%, washed with water and dried.

(7) A space 100 for main discharge and a space 200 for auxiliary discharge of the cell are formed by the double-sided sandblasting method. Thereby, the barrier ribs 11 and the partition walls 13 parallel to these surfaces are formed between the front substrate 1 and the rear substrate 2.

(8) Further, a white phosphor is applied to the front substrate side of the partition wall 13 by a spray method. 150 ° C
Dry at a temperature of ~ 300 ° C for 5 to 60 minutes.

In the gas discharge type display panel produced by the above-mentioned process, cells to be pixels are formed by the barrier ribs 11 separating the cells, and the cells are assisted in parallel with the surfaces of the front substrate 1 and the rear substrate 2 in each cell. Partition wall 13 to hide the discharge
Is formed. Then, by applying an AC voltage to the electrode 10 formed on the rear substrate 2, an auxiliary discharge is generated in the space for the auxiliary discharge of the cell. This auxiliary discharge causes a main discharge due to the AC voltage applied between the two parallel electrodes 6 and 6a formed on the front substrate 1 through the conduction path. The ultraviolet light generated by this main discharge causes the phosphor to emit light, and the light passes through the front substrate,
An image is formed on the entire display surface. At that time, the light emission due to the auxiliary discharge is shielded by the partition wall, and only the light emission due to the main discharge is observed. Therefore, in the display panel obtained in this example, in addition to the same effect as in the first example, there was an effect that a sufficient contrast can be obtained in the displayed image.

<Fourth Embodiment> A fourth embodiment of the present invention is shown in FIG.
This will be described below. FIG. 6 is a sectional view showing a part of a gas discharge type display device to which the present invention is applied. 6A shows a cross section parallel to the address electrode 10 and FIG.
6A is a vertical cross section of the address electrode 10 shown in FIG. 6A, and FIG. 6C is a vertical cross section of the address electrode 10 shown in FIG. 6A. Shows. As shown in FIG. 6, in the fourth embodiment of the present invention, similarly to the third embodiment of the present invention, the partition substrate 13 having the barrier ribs 11 is inserted between the front substrate 1 and the rear substrate 2. A gas discharge display device was manufactured by the same method as in the first embodiment of the present invention except for the above.

The method of forming the partition substrate 13 having the barrier ribs 11 shown in FIG. 6 is the same as that of the present invention except that steps (2) to (4) in the third embodiment of the present invention are omitted. It is similar to the third embodiment. However, the longitudinal direction of the space 100 for the main discharge and the longitudinal direction of the space 200 for the auxiliary discharge are formed so as to be substantially orthogonal to each other.

In the gas discharge type display panel produced by the above-described process, cells to be pixels are formed by the barrier ribs 11 that separate the cells from each other, and the cells are assisted in parallel with the surfaces of the front substrate 1 and the rear substrate 2 in each cell. Partition wall 13 to hide the discharge
Is formed. Then, by applying an AC voltage to the electrode 10 formed on the rear substrate 2, an auxiliary discharge is generated in the space for the auxiliary discharge of the cell. This auxiliary discharge causes a main discharge due to the AC voltage applied between the two parallel electrodes 6 and 6a formed on the front substrate 1 through the conduction path. The ultraviolet light generated by this main discharge causes the phosphor to emit light, and the light passes through the front substrate,
An image is formed on the entire display surface. At this time, the light emitted by the auxiliary discharge is shielded by the barrier ribs, and only the light emitted by the main discharge is observed, so that a sufficient contrast can be obtained in the displayed image. Therefore, in this embodiment, the same effect as that of the above-mentioned first and third embodiments was obtained.

<Embodiment 5> A gas discharge type is prepared in the same manner as in the first to fourth embodiments of the present invention, except that the materials used for forming the dielectric layer 8 are those shown in Tables 1 and 2. A display device was manufactured. Table 1 shows hydrolyzable coating agents, and Table 2 shows water glass materials. The composition in the table is% by weight when converted to an inorganic oxide. With any composition, a good dielectric layer 8 can be obtained,
The same effects as those of the first to fourth examples were obtained.

[0080]

[Table 1]

[0081]

[Table 2]

Example 6 In this example also, a gas discharge type display panel was produced in the same manner as in the first example.
However, when forming the "groove" on the rear substrate, as shown in FIG.
As shown in FIG. 5, the address electrodes were also bent in a direction parallel to the extending direction. 10A shows a cross section parallel to the address electrode 10, and FIG. 10B shows the address electrode 10.
10 is perpendicular to the address electrode 10, and FIG. 10 (c) is perpendicular to the address electrode 10.
The CD cross section shown to (a) is shown.

The display panel obtained in this example provided more uniform brightness than the display panel of Example 1.

[0084]

According to the present invention, since the shape of the phosphor formed in the main discharge space can be formed so that the distance from the ultraviolet rays excited by the main discharge is constant, there is no variation in the emission intensity and the brightness is high. It is possible to provide the effect that the structure and manufacturing method of the gas discharge type display device having the best luminous efficiency without variations can be provided.

[Brief description of drawings]

FIG. 1 is a partial cross-sectional view showing a configuration of a display panel of Example 1.

2 is a process flow chart showing an example of a manufacturing process of Example 1. FIG.

FIG. 3 is a process flow chart showing an example of an address electrode forming process in the manufacturing process of the first embodiment.

FIG. 4 is a partial cross-sectional view showing the configuration of the display panel of Example 2.

FIG. 5 is a partial cross-sectional view showing a configuration of a display panel of Example 3.

FIG. 6 is a partial cross-sectional view showing the configuration of the display panel of Example 4.

FIG. 7 is a perspective view showing a conventional example of a gas discharge type display panel.

FIG. 8 is a cross-sectional view showing a conventional example of a gas discharge type display panel.

FIG. 9 is a process flow chart showing an example of a method of manufacturing a conventional gas discharge display device.

FIG. 10 is a partial cross-sectional view showing the configuration of the display panel of Example 6.

[Explanation of symbols]

1 ... Front substrate, 2 ... Rear substrate, 3 ... Discharge space region, 4 ...
Front glass substrate, 5 ... Rear glass substrate, 6.6a ... Display electrode (transparent electrode), 7.7a ... Bus electrode, 8 ... Dielectric layer, 9 ... Protective layer (MgO), 10 ... Address electrode, 10
a ... Common electrode for auxiliary discharge, 11 ... Barrier rib, 12 ... Phosphor layer, 13 ... Partition, 17 ... Seal layer, 18 ... Black lattice, 100 ... Main discharge space, 200 ... Auxiliary discharge space, 1
120 ... Photosensitive film, 1140 ... Conductor layer.

 ─────────────────────────────────────────────────── ─── Continuation of the front page (72) Kazuo Suzuki, inventor Kazuo Suzuki, 292 Yoshida-cho, Totsuka-ku, Yokohama, Kanagawa, Ltd., Hitachi, Ltd., Institute of Industrial Science (72) Teruo Takai, 292 Yoshida-cho, Totsuka-ku, Yokohama, Kanagawa Incorporated company Hitachi, Ltd., Visual Information Media Division (72) Inventor Kyoko Amamiya 292 Yoshida-cho, Totsuka-ku, Yokohama-shi, Kanagawa Prefecture Production Engineering Research Laboratory, Hitachi, Ltd. (72) Inventor Shika Sakagami Totsuka, Yokohama-shi, Kanagawa 292, Yoshida-cho, Ward-ku, Hitachi, Ltd., Production Engineering Laboratory, Ltd. (72) Inventor, Fusuji Shoko, 292, Yoshida-cho, Totsuka-ku, Yokohama, Kanagawa

Claims (15)

[Claims] 1. A front substrate provided with electrodes for main discharge and a back substrate provided with electrodes for auxiliary discharge, wherein the back substrate has a plurality of main discharges having a phosphor layer on an inner wall on a front substrate side surface. A gas discharge type display panel comprising a concave portion, wherein the main discharge concave portion has a curved inner wall. 2. The gas discharge display panel according to claim 1, wherein the auxiliary discharge electrode is provided between the inner wall of the main discharge recess and the phosphor layer. 3. A front substrate provided with electrodes for main discharge, a back substrate provided with electrodes for auxiliary discharge, and a partition substrate sandwiched between the front substrate and the back substrate, wherein the partition substrate is a front substrate. The side surface is provided with a plurality of main discharge recesses having a phosphor layer on the inner wall, the rear substrate side surface is provided with a plurality of auxiliary discharge recesses, and the main discharge recesses are curved inner walls. Gas discharge type display panel characterized by. 4. A front substrate provided with electrodes for main discharge, a back substrate provided with electrodes for auxiliary discharge, and a partition substrate sandwiched between the front substrate and the back substrate, wherein the partition substrate is a front substrate. The side surface is provided with a plurality of main discharge recesses having a phosphor layer on the inner wall, the back substrate is provided with a plurality of auxiliary discharge recesses on the partition substrate side surface, and the main discharge recess has an inner wall. A gas discharge type display panel characterized by being bent. 5. The gas discharge type display panel according to claim 3, wherein an inner wall of the recess for auxiliary discharge is curved. 6. The gas discharge type display panel according to claim 4, wherein the auxiliary discharge electrode is provided on an inner wall of the auxiliary discharge recess. 7. The gas discharge display panel according to claim 1, 3 or 4, wherein the main discharge recesses are grooves extending in the same direction. 8. The gas discharge display panel according to claim 3, wherein the recess for auxiliary discharge is a groove extending in the same direction. 9. The gas discharge display according to claim 7, wherein an inner wall of the groove constitutes a part of a circle in a cross section of the display panel at a right angle to the extending direction of the groove. panel. 10. The gas discharge type display panel according to claim 1, 3, or 4, wherein the inner wall of the main discharge concave portion constitutes a part of a spherical shape. 11. The gas discharge display panel according to claim 3, wherein an inner wall of the auxiliary discharge recess forms a part of a spherical shape. 12. A front substrate forming step of forming a front substrate having an electrode for main discharge, a back substrate forming step of forming a back substrate having an electrode for auxiliary discharge, the front substrate and the back substrate facing each other. And the assembling step of assembling, wherein the back substrate forming step has a step of forming a plurality of main discharge concave portions having an inner curved surface on the base material surface. Production method. 13. The back substrate forming step according to claim 12, wherein the auxiliary discharge electrode is formed on an inner wall of the main discharge recess, and the main discharge is performed so as to cover the auxiliary discharge electrode. And a step of forming a phosphor layer on the inner wall of the recess for use in gas discharge display panel. 14. A front substrate forming step of forming a front substrate having an electrode for main discharge, a back substrate forming step of forming a rear substrate having an electrode for auxiliary discharge, and a step between the front substrate and the back substrate. A partition substrate forming step of forming a partition substrate for separation, an assembly step of stacking and fixing the back substrate, the partition substrate, and the front substrate, wherein the partition substrate forming step is a base material. 2. A method of manufacturing a gas discharge type display panel, comprising the step of forming a plurality of concave portions each having a curved inner surface on both front and back sides thereof. 15. A front substrate forming step of forming a front substrate having a main discharge electrode, a back substrate forming step of forming a back substrate having an auxiliary discharge electrode, and a step between the front substrate and the back substrate. A partition substrate forming step of forming a partition substrate for separation, an assembly step of stacking and fixing the back substrate, the partition substrate, and the front substrate, wherein the partition substrate forming step is a base material. Has a step of forming a plurality of concave portions having an inner curved surface on one of the front and back surfaces thereof, and the back substrate forming step includes forming a plurality of concave portions having an inner curved surface on one of the front and back surfaces of the base material. The assembly step includes the step of forming the recessed surface of the partition substrate, and the surface of the partition substrate opposite to the recessed surface of the partition substrate. And the front substrate above Method for manufacturing a gas discharge display panel comprising a step of assembling by.