JP2002117769A - Gas discharge type display device and its manufacturing device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a structure and a manufacturing method for a gas discharge type display device capable of shortening the manufacturing process of a back substrate for forming barrier ribs and improving the manufacturing yield thereof and of improving adhesion between the barrier ribs and a front substrate. SOLUTION: Grooves used as discharge spaces and the barrier ribs for partitioning the discharge spaces are formed by machining a surface of a substrate for the back substrate, and address electrodes are formed after the formation of the barrier ribs, so that the gas discharge type display device with the improved adhesion between the barrier ribs and the front substrate is manufactured with a shorter manufacturing process than a conventional one.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

The present invention relates to a gas discharge type display device such as a plasma display and a method for manufacturing the same.
In particular, the present invention relates to a structure of a gas discharge type display device having highly reliable display cell selectivity and capable of shortening a manufacturing process, and a manufacturing method thereof.

[0002]

2. Description of the Related Art A gas discharge type display device such as a plasma display performs display by self-emission, so that the display angle is wide and the display is easy to see. In addition, it has features such as being able to produce a thin type and realizing a large screen, and has begun to be applied to display devices of information terminal equipment and high-definition television receivers. Plasma displays are roughly classified into a DC drive type and an AC drive type. Among them, the AC drive type plasma display has a high luminance due to the memory effect of the dielectric layer covering the electrodes, and has a practically usable life due to the formation of the protective layer and the like. As a result, plasma displays have been put to practical use as versatile video monitors. This example is shown in FIG. 17 and FIG. FIG. 17 is a perspective view showing the structure of a plasma display panel that has been put into practical use. In this figure, the front substrate 1 is shown separated from the rear substrate 2 and the discharge space region 3 for easy viewing. The front substrate 1 has an IT
A display electrode 6 made of a transparent conductive material such as O (Indium Tin Oxide) or tin oxide (SnO 2), a bus electrode 7 made of a low-resistance material, a dielectric layer 8 made of a transparent insulating material, magnesium oxide (MgO), etc. It has a structure in which a protective layer 9 made of a material is formed. The rear substrate 2 has a structure in which an address electrode 10, a barrier rib 11, and a phosphor layer 12 are formed on a rear glass substrate 5. The discharge space region 3 is formed between the front substrate 1 and the rear substrate 2 by bonding the front substrate 1 and the rear substrate 2 such that the display electrodes 6 and the address electrodes 10 are substantially orthogonal to each other. FIG. 18 is a sectional view of the gas discharge type display device shown in FIG. In FIG. 18, (a) is a cross section parallel to the address electrode 10, (b) is a cross section taken along a line AB in FIG.
Is a line perpendicular to the address electrode 10 shown in FIG.
It shows a cross section. In this gas discharge type display device, an AC voltage is applied between a pair of display electrodes 6 provided on the front substrate 1 and an address electrode 10 and a display electrode 6 provided on the rear substrate 2 are applied.
During this period, an address discharge is generated by applying a voltage, and a main discharge is generated in a predetermined discharge cell. The display is performed by causing the phosphors 12 to emit light by the ultraviolet rays generated by the main discharge.

A manufacturing process of the conventional gas discharge type display device shown in FIGS. 17 and 18 will be briefly described with reference to FIG. 19 showing an example of a manufacturing process flow. First, a manufacturing process of the front substrate 1 will be described. The front glass substrate 4 made of soda lime glass or the like is washed, and a transparent electrode pattern 6 is formed on one main surface thereof. When ITO is used as a transparent electrode material, the transparent electrode pattern 6 is often formed by a well-known photo-etching method after forming an ITO film by using a sputtering method or the like. On the other hand, when SnO 2 is used, the transparent electrode pattern 6 is formed by a chemical vapor deposition method (Chemical Vapor method) using a lift-off method.
Porous deposition (CVD), and soda-lime glass used for the front glass substrate is often coated with silica or the like. For the bus electrode 7, a Cr / Cu / Cr laminated film in which a copper (Cu) film is sandwiched by a chromium (Cr) film is often used, and is formed by performing a known photoetching after the film formation. A transparent dielectric layer 8 is formed by printing a dielectric paste on the front glass substrate 4 on which the transparent electrodes 6 and the bus electrodes 7 are formed, followed by drying and sintering.
A sealing layer 17 for performing vacuum sealing is formed by a printing method on the front glass substrate 4 on which the dielectric layer 8 is formed,
Further, an MgO layer is formed by a vacuum deposition method or the like.
Thus, the front substrate 1 is completed. Next, a manufacturing process of the back substrate 2 will be described. The back glass substrate 5 made of soda lime glass or the like is washed, and an address electrode pattern 10 is formed on one main surface by a thick film printing method using a silver (Ag) paste. On the back glass substrate 5 on which the address electrodes 10 are formed, the barrier ribs 11 are formed by repeating thick film printing and drying. Next, the back substrate 2 is completed by forming the phosphor layer 12 by the thick film printing method.

[0004] The completed front substrate 1 and rear substrate 2 are assembled while positioning. An exhaust pipe (not shown) for exhausting and introducing a sealed gas is attached, and thereafter, the substrates are sealed and the exhaust pipe is fixed in a sealing furnace. The seal between the substrates is melted and fixed by the seal layer 17 (low-melting glass, frit) formed in the substrate process. Next, a panel is attached to the exhaust device, and the panel is evacuated with an exhaust pipe while the panel is baked. Thereafter, a gas mixture of, for example, neon (Ne) and xenon (Xe) is sealed, and the exhaust pipe is chipped off and aged, whereby the conventional gas discharge display device shown in FIGS. 17 and 18 is completed. . The conventional example of the gas discharge type display device shown here is, for example, a flat panel display 1996 (edited by Nikkei Micro Devices,
1995), pp. 208-215.

[0005]

In the above prior art, it is most difficult to form the barrier rib 11 provided on the back substrate 2.
In the formation of the barrier rib by the thick film printing method described with reference to FIG. 19, since the thick film printing and drying are repeated many times, the dimensional accuracy of the thick film pattern, the occurrence of defects, the misalignment of the thick film patterns, the large screen plate Deformation easily occurs. Therefore, the manufacturing process becomes longer and the manufacturing yield becomes lower. Further, it is difficult to reduce the size to about 0.05 mm by the thick film printing method, and the larger the screen plate, the more easily the deformation occurs. This makes it difficult to increase the definition and size of the display screen. In order to cope with these problems, a photo embedding method, a sand blast method, and a photosensitive paste method shown in FIG. 20 have been proposed, and studies thereof have begun.

In the photo embedding method, the photosensitive film 11
In this method, a barrier rib-like groove pattern 1130 is formed on the rear substrate 4 on which the address electrodes 10 are formed by using the substrate electrode 20, and a barrier rib layer 1110 is buried in the groove pattern 1130. In such a method, it is difficult to form the groove pattern 1130 having a depth of 0.1 mm or more with a width of about 0.05 mm.
The development of a method for embedding the barrier rib material and the chemical stability between the film 10 and the photosensitive film 1130 (such as dissolution and reaction) also become important issues.

In the sand blast method, a barrier rib layer 11 provided on a back glass substrate 5 on which an address electrode 10 is formed is provided.
In this method, a barrier rib pattern of a photosensitive film 1120 is formed on the substrate 10, and the barrier rib layer 1110 in a region where the photosensitive film 1120 does not exist is removed using sandblasting. Even in such a method, since the thickness of the barrier rib layer that can be printed at one time is small, it is necessary to repeat printing and drying to obtain a thick barrier rib layer 1110. Further, in order to prevent the address electrode 10 from being damaged in the sandblasting process, it is necessary to cover the address electrode with another material. That is, even in the case of the sand blast method, there is a problem that the process becomes long and the address electrodes may be damaged.

In the photosensitive paste method, a barrier rib layer 1110 is formed using a barrier rib material having photosensitivity, and the barrier rib 11 is formed by a known photolithography method such as exposure and development. This method is the simplest process, but the material development is incomplete. For this reason, the processing limit and lamination limit when the thickness is increased are unknown, and a thick film forming method or the like has not been established even in the film forming method, and it can be said that this is a future technology. As described above, in the above-described related art, the manufacturing process is lengthened, and it is difficult to obtain a high manufacturing yield.

In the method of forming a barrier rib, a barrier rib layer is formed on a back substrate on which an address electrode is formed, and
The barrier rib is obtained by sintering it. The variation in the thickness of the barrier rib layer affects the adhesion of the barrier rib when the front substrate 1 and the barrier rib 11 are in contact with each other. In some cases, a large gap is formed between the barrier rib 11 and the front substrate 1, causing a problem that the discharge spreads to display cells that should not be discharged therethrough. In addition, since the sintering temperature of the barrier rib 11 is higher than the strain point of soda lime glass used for the back glass substrate 5, there is a problem that the glass is deformed. Further, when the area of the display screen is increased, shrinkage of the barrier rib due to sintering may be a problem. These problems cause a reduction in the reliability of display cell selection.

An object of the present invention is to provide a gas discharge type having a structure in which barrier ribs are sandwiched between a front substrate provided with display electrodes and a rear substrate provided with address electrodes as in the conventional plasma display shown in FIGS. In a display device and a method of manufacturing the same, there is provided a structure of a gas discharge type display device which can shorten the manufacturing process of a rear substrate provided with barrier ribs and improve the yield and increase the reliability of display cell selection, and a method of manufacturing the same. It is in.

[0011]

SUMMARY OF THE INVENTION It is an object of the present invention to provide a gas discharge type display device having a back substrate having a plurality of "grooves" serving as discharge spaces and address electrodes for selecting display cells, and a main discharge for display. This is achieved by forming a structure in which a front substrate having a display electrode for generating a discharge is laminated, forming a barrier rib for separating the discharge space from a rear glass substrate material, and forming the address electrode by a conductor layer embedded in the groove. . According to this configuration, the grooves used for the discharge space can be formed by digging the surface of the rear glass substrate, so that the address electrodes can be formed only by embedding the conductor layer in the grooves. Shortening of the process and improvement of the manufacturing yield are achieved. Further, since the upper surface of the barrier rib in contact with the front substrate is constituted by the surface of the rear glass substrate itself, the adhesion between the barrier rib and the front substrate is improved as compared with a conventional gas discharge display device. This prevents the discharge from spreading to the adjacent discharge space through the gap between the barrier rib and the front substrate, and improves the reliability of display cell selection.

[0012]

(Embodiment 1) A first embodiment of the present invention will be described with reference to FIG. FIG. 1 is a cross-sectional view showing a part of a gas discharge type display device to which the present invention is applied. 1A shows a cross section parallel to the address electrode, FIG. 1B shows a cross section taken along the line AB shown in FIG. 1A perpendicular to the address electrode, and FIG. It shows the CD cross section shown in FIG.

In the drawing, 1 is a front substrate, 2 is a rear substrate, 3 is a discharge space region, 4 is a front glass substrate, and 5 is a front glass substrate.
Is a rear glass substrate, 61 and 62 are display electrodes made of a transparent conductive material, 71 and 72 are bus electrodes provided so as to overlap with a part of the display electrodes, and 6 is a case where 61 and 62 are not distinguished. Are the display electrodes, 7 is the bus electrode when 71 and 72 are not distinguished from each other, 8 is the dielectric layer, and 9 is the Mg layer.
O denotes a protective layer, 11 denotes a barrier rib for limiting a main discharge space, 12 denotes a phosphor layer, and 100 denotes a main discharge space where a main discharge for display occurs.

Hereinafter, an example of the manufacturing method of the present embodiment will be described with reference to FIG.

First, a method of manufacturing the front substrate 1 will be described.

(1) A glass plate such as soda lime glass as the front glass substrate 4 is washed with a neutral detergent or the like.

(2) A tin oxide (SnO 2) film or an ITO (Indium Tin) film is formed on the cleaned front glass substrate 4 by a film forming method such as a sputtering method or an electron beam evaporation method.
A transparent conductive film such as an oxide film is formed. Next, the transparent conductive film is processed by a well-known photoetching method to form an electrode pattern serving as the display electrodes 61 and 62. The pattern size of the display electrode may be determined according to the size of the discharge cell to be manufactured.

(3) A copper (Cu) film is sandwiched by a chromium (Cr) film on the front glass substrate 4 on which the display electrodes 61 and 62 are formed, using a film forming technique such as a sputtering method or an electron beam evaporation method. A Cr / Cu / Cr laminated film is formed.
Then, using a well-known photo-etching method, Cr / Cu
/ Cr laminated film is processed and an electrode pattern is formed so as to overlap a part of the display electrodes 61 and 62,
72. The thickness of the Cu film and the pattern size of the bus electrode may be determined according to the resistance value required for the bus electrode.

(4) Aluminum (A) is provided at a predetermined position on the front glass substrate 4 on which the display electrode 6 and the bus electrode 7 are formed.
l), a hydrolysis-type coating agent (alkoxide, etc.) containing silicon (Si) and oxygen (O) as main components is applied by a method such as a blade method or a spray method, and 100 to 4
By heating at a temperature of 00 ° C. for 1 to 60 minutes, a dielectric layer 8 having a thickness of 0.002 to 0.03 mm is formed.

(5) An MgO film is formed at a predetermined place by using a film forming technique such as a sputtering method or an electron beam evaporation method, and the protective layer 9 is formed. The thickness of the MgO film needs to be determined according to the life required for the gas discharge type display device, and a typical value is 0.0001 to 0.002 mm.

Through the above steps, the front substrate 1 is completed.

Next, a method of manufacturing the rear substrate 2 will be described.

(1) A glass plate such as soda lime glass as the rear glass substrate 5 is washed using a neutral detergent or the like.

(2) The photosensitive film 1120 is laminated on the rear glass substrate 5 and subjected to well-known exposure, development, washing with water, and drying to form a predetermined photosensitive film pattern.

(3) By performing a sand blasting process, a portion of the rear glass substrate 5 that is not covered with the photosensitive film 1120 is removed, and “grooves” that become the main discharge space 100 are formed on the surface of the rear glass substrate 5. Form. In this case, sandblast conditions are adjusted so that the depth of the groove is 0.08 to 0.3 mm.

(4) A Cr / Cu / Cr laminated film is formed on the rear glass substrate 5 provided with “grooves” serving as the main discharge space 100 by using a film forming technique such as a sputtering method or an electron beam evaporation method. . By this step, the Cr / Cu / Cr laminated film forming the address electrode 10 is embedded in the “groove” that becomes the main discharge space 100. FIG. 3 shows an example of a process for forming the address electrode 10, which will be described later.

(5) The phosphor 12 is applied to the surface of the inner wall of the “groove” which becomes the main discharge space 100 by using a method such as a spray method or a blade method. In the case of a gas discharge type display device of a color display, a mask of a predetermined pattern of green, blue and red is aligned, and a phosphor layer 12 for emitting green, blue and red colors is applied. Then, at a temperature of 150 to 300 ° C., 5 to 60
Heat treatment for a minute.

(6) A pattern of frit glass is formed using a thick film printing method, and drying is performed to form a seal layer (not shown) for vacuum sealing.

Through the above steps, the rear substrate 2 having the barrier rib 11 for separating the discharge space and the phosphor layer 12 is completed. A chip tube (not shown) is attached to the rear substrate 2 for exhaust and gas introduction after the panel is assembled.

The front substrate 1 and the rear substrate 2 completed in each of the above steps are aligned and subjected to a heat treatment at 300 to 400 ° C. to fix these substrates. in this case,
The display electrodes 6 and bus electrodes 7 provided on the front substrate 1 and the address electrodes 10 provided on the rear substrate 5 are substantially orthogonal to each other. Next, a main discharge space 10 formed between the front substrate 1 and the rear substrate 2 through a chip tube (not shown) provided on the rear substrate.
Vacuum evacuation is performed to zero, and for example, Ne containing 3% of Xe is introduced into the main discharge space 100, and the pressure in the main discharge space 100 is adjusted to 35 to 70 kPa. Next, the tip is turned off by local heating of a tip tube (not shown) to complete the gas discharge display device shown in FIG.

Next, the address electrodes 1 omitted in the above description
0 will be described with reference to FIG. A typical process for forming the address electrode 10 is the two processes (A) and (B) shown in FIG. First, (A)
The process will be described.

(1) The back glass substrate 5 in which the “groove” to be the main discharge space 100 is formed is washed with a neutral detergent or alcohol.

(2) A conductor layer 1140 made of a Cr / Cu / Cr laminated film is formed on the back glass substrate 5 in which the groove serving as the main discharge space 100 is formed by using a film forming technique such as a sputtering method or an electron beam evaporation method. To form

(3) The surface of the rear glass substrate 5 on which the Cr / Cu / Cr laminated film is formed is polished by using a polishing method such as a tape polishing method or a polishing method. Thereby, the conductor layer 1000 deposited on the photosensitive film 1120 is removed. This step is performed to facilitate removal of the photosensitive film 1120. Therefore, the conductor layer 114
If the photosensitive film 1120 can be removed after the formation of 0, it can be omitted. (4) The photosensitive film 1120 is removed by spray peeling using an aqueous solution of sodium hydroxide having a concentration of 1 to 4% and a temperature of 40 to 50 ° C. A typical spray pressure in this case is 1 to 3 kg / cm2.

Next, the process (B) will be described.

(1) The concentration is 1 to 4% and the temperature is 40 to 50.
The photosensitive film 1120 is removed from the back glass substrate 5 in which the “groove” to be the main discharge space 100 is formed by spray peeling using an aqueous solution of sodium hydroxide at a temperature of ° C. A typical spray pressure in this case is 1 to 3 kg / cm2.

(2) On the back glass substrate 5 from which the photosensitive film 1120 has been removed, a conductor layer 1000 made of Cr / Cu / Cr is formed by a film forming technique such as a sputtering method or an electron beam evaporation method.

(3) The surface of the back glass substrate 5 on which the Cr / Cu / Cr laminated film is formed is polished by using a polishing method such as a tape polishing method or a polishing method. Thus, the conductor layer 1000 deposited on the barrier rib 11 is removed. Next, cleaning is performed using alcohol or the like to remove abrasive grains and the like.

The example of the method for forming the address electrode 10 in the manufacturing process according to the first embodiment of the present invention has been described above.
In each of the cases (A) and (B) shown in FIG. 3, the conductor layer 1140 forming the address electrode 10 is
1 is formed. This point is different from the conventional method of manufacturing the barrier rib shown in FIG. In the present embodiment, Cu and Cr are used as the material of the bus electrode 7 and the address electrode 10, but Al, Ti, Ni,
W and Mo metals and their alloys may be used. In addition, although a sputtering method or an electron beam evaporation method is used as a method for forming the material forming the bus electrode 7 and the address electrode 10, there is no limitation on the formation method, and a plating method, a resistance heating evaporation method, a thick film printing method, and the like. May be used. The transparent conductive material forming the display electrode 6 is not limited to tin oxide or ITO, and the method for forming the transparent conductive material is not limited to the sputtering method or the electron beam evaporation method.
A chemical vapor reaction method or a sol-gel method may be used. Although an alkoxide is used for forming the dielectric layer 8, the material is not limited to this. Further, as a method for forming the dielectric layer 8, a method combining a blade method, a spray method, and a thermosetting method is used, but the forming method is not limited, and a sputtering method, a chemical vapor reaction method, a thick film printing method, You can use such as. Although MgO is used for the protective layer 9, it is sufficient that the sputtering rate for the discharge gas is low and the secondary electron emission coefficient is high.
In addition, CaO, SrO, or a mixture thereof may be used. In this embodiment, Ne is used as the discharge gas.
Although a mixed gas of Xe and Xe is used, the present invention is not limited thereto.

Since the gas discharge type display device according to the present embodiment to which the present invention is applied can be manufactured by a low-temperature process of 400 ° C. or less, a glass such as soda lime glass having a low strain point but inexpensive can be used as a substrate. However, this does not necessarily require that the temperature of the manufacturing process be 400 ° C. or lower, and the gas discharge display device of the present embodiment can be manufactured even when the temperature of the manufacturing process is 400 ° C. or higher.

In the gas discharge type display device shown in the present embodiment, the main discharge space 100 between the front substrate 1 and the rear substrate 2 is filled by filling a Ne gas containing, for example, 3% of Xe.
Is formed. The barrier rib 11 forms a main discharge space 100 by contacting the surface of the front substrate 1. The main discharge spaces 100 of the display cells arranged in the direction in which the display electrodes 6 extend are separated, but the display cells arranged in the direction orthogonal to the direction in which the display electrodes 6 extend share the main discharge space 100. ing. Since the display cell rows arranged so as to share the main discharge space exist along the extending direction of the address electrodes 10, they will be referred to herein as "address electrode cell rows". In addition, a display cell row arranged along the display electrode 6 is referred to as a “display electrode cell row”. The phosphor layer 12 has an inner wall of a “groove” dug into the surface of the rear glass substrate 5, that is, a bottom of the “groove” formed on the rear glass substrate 5 (the upper surface of the address electrode 10) and a side surface of the barrier rib 11. Is formed. In the address electrode cell row, the main discharge space 100 is shared by the display cells, but the discharge space of each display cell is limited by applying a voltage between the pair of display electrodes 61 and 62.

In the case of the gas discharge type display device shown in this embodiment, the same driving as that of the conventional gas discharge type display device shown in FIGS. 17 and 18 can be performed. That is,
A wall charge is formed on the phosphor layer formed on the address electrode, and an external voltage is applied to the wall charge to generate an address discharge, thereby performing a drive for selecting a display cell. Although one of the display electrodes 6 is often used as a common electrode common to all display cells, in this embodiment, either the display electrode 61 or the display electrode 62 may be used as a common electrode.

The first point of application of the present invention in the embodiment of the present invention is that the main discharge space 100 is
It is a point formed by digging. This simplifies the process of forming the barrier rib 11 that forms the discharge space,
Manufacturing Process of Conventional Barrier Rib (FIG. 20A)
This is a shorter process than (C)). Further, the problem of forming a thick film of the barrier rib material, which is a problem in the conventional manufacturing technique described with reference to FIG. 20, does not occur. Further, in the case of the embodiment of the present invention, the problem of the mask alignment shown in FIG. 20A, the lack of resolution of the photosensitive material shown in FIGS. The damage of the address electrode due to the sandblast shown in FIG.
In a gas discharge type display device, a discharge space is formed by contacting a barrier rib provided on a rear substrate with a front substrate. Therefore, ensuring the adhesion between the surface of the barrier rib and the front substrate is important for eliminating the gap between the barrier rib and the front substrate and preventing the discharge from spreading beyond the barrier rib. Also in this regard, in the embodiment of the present invention, since the surface of the barrier rib 11 is flattened on the surface of the rear glass substrate 5 itself, it is superior to the barrier rib formed by the conventional method shown in FIG. ing. That is, according to the present embodiment to which the present invention is applied, the adhesion between the barrier rib 11 and the front substrate 1 can be improved as compared with a conventional gas discharge display device. This means that erroneous display due to erroneous discharge of non-selected cells can be prevented.

The second point of application of the present invention in the embodiment of the present invention is that the address electrodes 10 are formed after the "grooves" constituting the discharge space, that is, the barrier ribs 11 are formed. According to this method, a processing process (for example, photoetching) of the conductor layer for forming the address electrode 10 can be omitted, and the manufacturing process of the rear substrate can be shortened. Also, it is clear that the damage of the address electrode 10 observed by the conventional sandblasting method shown in FIG. 20 is not seen in the embodiment of the present invention. In addition, in this embodiment to which the present invention is applied, the following effects can be obtained as compared with the conventional gas discharge display device and its manufacturing method.

1) Since the barrier ribs 11 can be formed at a temperature lower than the strain point of soda lime glass, deformation of the glass substrate can be suppressed.

2) The yield of the rear substrate 2 is reduced due to the defective formation of the barrier ribs and the defective formation of the address electrodes.
In particular, defective formation of barrier ribs is a serious problem, and in the conventional method of manufacturing a gas discharge display device, there are many back substrates 2 that are defective due to defective formation of barrier ribs even if the address electrodes are good. On the other hand, in the embodiment of the present invention, it becomes possible to form the address electrode only on the rear substrate having a good barrier rib. That is, the production yield of the rear substrate can be increased.

As described above, according to the first embodiment of the present invention, it is possible to shorten the manufacturing process of the rear substrate and to improve the yield, and to improve the reliability of the selection of the display cell. There is an effect that the device can be provided.

In the first embodiment of the present invention, soda lime glass is used as the back glass substrate 5,
Other electrically insulating plate materials such as a glass plate and a ceramic substrate may be used. Further, if the withstand voltage against the address voltage is secured, a conductive material such as a metal plate having a “groove” provided on one main surface as a discharge space may be covered with an insulating material to form the rear glass substrate 5. . In this case, a large mechanical strength of the back substrate 2 and an excellent heat dissipation effect can be obtained.

(Embodiment 2) A second embodiment of the present invention will be described with reference to FIG. FIG. 4 is a sectional view showing a part of a gas discharge type display device to which the present invention is applied. FIG. 4A shows a cross section parallel to the address electrode, and FIG.
Is a line AB perpendicular to the address electrode shown in FIG.
FIG. 3C shows a cross section taken along a line CD shown in FIG. 3A, which is perpendicular to the address electrodes.

As can be seen from FIG. 4, the second embodiment differs from the first embodiment in that the barrier rib 11 for separating the main discharge space 100 is made of an insulating material (not shown) different from the rear glass substrate 5. Here, it is referred to as a “first insulating layer”. Other configurations, manufacturing methods, and points to which the present invention is applied are the same as those in the first embodiment. In FIG. 4, reference numeral 110 denotes a barrier rib formed from the “first insulating layer”.

In this embodiment, since the structure of the rear substrate 2 is different from that of the first embodiment, an example of the manufacturing process of the rear substrate 2 will be described with reference to FIG.

(1) A glass plate such as soda lime glass as the rear glass substrate 5 is washed with a neutral detergent or the like.

(2) The first insulating layer 1150 is formed on the rear glass substrate 5 by applying a glass paste by a thick film printing method, followed by drying and baking. The conditions for forming the first insulating layer 1150 are as follows:
The density is adjusted so as to be lower than that of the rear glass substrate 5.

(3) A photosensitive film 1120 is laminated on the first insulating layer 1150, and a known photosensitive film pattern is formed by performing known exposure, development, washing and drying.

(4) By processing using a sand blast method to remove a portion of the first insulating layer 1150 that is not covered with the photosensitive film, a “groove” serving as the main discharge space 100 is formed on the rear glass substrate. 5 is formed on the surface. Since the density of the first insulating layer 1150 is lower than that of the rear glass substrate 5, the first insulating layer 1150 can be selectively removed. Therefore, it is preferable to determine the blast conditions so that the back glass substrate 5 is exposed. Thereby, the depth of the formed groove (that is, the barrier rib 110
Of the blast depth can be reduced.

(5) A Cr / Cu / Cr laminated film is formed on the rear glass substrate 5 provided with the “groove” serving as the main discharge space 100 by using a film forming technique such as a sputtering method or an electron beam evaporation method. . By this step, the Cr / Cu / Cr laminated film constituting the address electrode 10 is embedded in the “groove” that becomes the main discharge space 100. The method for manufacturing the address electrode 10 is the same as that of the first embodiment.

(6) The phosphor layer 12 is applied to the surface of the inner wall of the groove serving as the main discharge space 100 by using a method such as a spray method or a blade method. In the case of a gas discharge type display device of a color display, a mask of a predetermined pattern of green, blue and red is aligned, and a phosphor 12 for emitting green, blue and red colors is applied. Next, heat treatment is performed at a temperature of 150 to 300 ° C. for 5 to 60 minutes.

(7) A pattern of frit glass is formed by using a thick film printing method, and drying is performed to form a seal layer (not shown) for performing vacuum sealing.

Through the above steps, the rear substrate 2 having the barrier rib 11 for separating the discharge space and the phosphor layer 12 is completed. A chip tube (not shown) is attached to the rear substrate 2 for exhaust and gas introduction after the panel is assembled.

The back substrate 2 completed in each of the above steps and the first substrate
The front substrate 1 manufactured by the same method as in the first embodiment is aligned, and these substrates are fixed by performing a heat treatment at 300 to 400 ° C. In this case, the display electrodes 6 and the bus electrodes 7 provided on the front substrate 1 and the address electrodes 10 provided on the rear substrate 5 are substantially orthogonal. Next, the front substrate 1 is passed through a chip tube (not shown) provided on the rear substrate.
After evacuating the main discharge space 100 formed between the substrate and the back substrate 2, for example, Ne containing 3% of Xe is introduced, and the pressure in the main discharge space 100 is adjusted to 35 to 70 kPa. Next, by performing chip-off by local heating of a chip tube (not shown), the gas discharge display device shown in FIG. 4 is completed. In this embodiment, the first insulating layer is fired before the sandblasting process. However, the firing may be performed after forming the discharge space groove. Alternatively, a ceramic green sheet may be attached to the back glass substrate 5 to form the first insulating layer.

In the present embodiment, the main discharge space 100
Since the manufacturing method and the structure of the address electrodes 10 are basically the same as those of the first embodiment, the same effects as those of the first embodiment can be obtained. However, in the case of the second embodiment, the “groove” (or the barrier rib 110) serving as the main discharge space 100 is formed by the first insulating layer 1150 formed on the back glass substrate 5, so that the depth of the groove is small. The height (the height of the barrier rib 110) is determined by the thickness of the first insulating layer. Therefore, there are the following differences from the first embodiment.

(1) Compared to the first embodiment, the size of the back substrate 2 is increased by the amount corresponding to the step of forming the first insulating layer 1150.
Manufacturing process becomes longer. However, photo etching and the formation of a protective film for the address electrode in the address electrode forming process are not required, which is shorter than the manufacturing process of the gas discharge type display device using the conventional sandblast method. (2) When the thickness distribution of the first insulating layer 1150 is poor, a gap exists between the barrier rib 110 and the front substrate 1. For this reason, compared to the first embodiment,
There is a risk that erroneous display is likely to occur due to the spread of the discharge beyond the barrier ribs, and it is important to control the thickness of the first insulating layer 1150.

(3) Since the density of the first insulating layer 1150 is lower than that of the rear glass substrate, the processing speed by blasting is high and the processing time is short.

(4) When the uniformity of the film thickness of the first insulating layer 1150 is good, the variation in the distance between the display electrode 6 (or the bus electrode 7) of the front substrate 1 and the address electrode 10 becomes small. In addition, it is possible to reduce a variation in a discharge voltage (that is, an address voltage or a scanning voltage) of an address discharge generated between a display electrode and an address electrode for each display cell. This is an advantage over the first embodiment.

(Embodiment 3) A third embodiment of the present invention will be described with reference to FIG. FIG. 6 is a sectional view showing a part of a gas discharge type display device to which the present invention is applied. FIG. 6A shows a cross section parallel to the address electrode, and FIG.
Is a line AB perpendicular to the address electrode shown in FIG.
FIG. 3C shows a cross section taken along a line CD shown in FIG. 3A, which is perpendicular to the address electrodes.

As can be seen from FIG. 6, the third embodiment is different from the first embodiment in that the inner wall of the “groove” provided in the rear glass substrate 5 and serving as the main discharge space 100 (ie, The second insulating layer 50 is formed on the surface of the barrier rib 11 that contacts the main discharge space 100 and the bottom surface of the groove. Other configurations and manufacturing methods are the same as those of the first embodiment.

In the present embodiment, since the structure of the rear substrate 2 is slightly different from that of the first embodiment, a method of manufacturing the rear substrate 2 will be described with reference to FIG.

(1) A glass plate such as soda lime glass as the rear glass substrate 5 is washed with a neutral detergent or the like.

(2) The photosensitive film is formed on the back glass substrate 5
A predetermined photosensitive film pattern is formed by laminating on the substrate and performing well-known exposure, development, washing with water, and drying.

(3) A portion of the rear glass substrate 5 that is not covered with the photosensitive film is removed by sandblasting, and “grooves” that become the main discharge spaces 100 are formed on the surface of the rear glass substrate 5. In this case, the blast conditions are adjusted such that the depth of the “groove” is 0.08 to 0.3 mm.

(4) The concentration is 1 to 4% and the temperature is 40 to 50.
The photosensitive film is removed by spray-peeling using an aqueous solution of sodium hydroxide at ℃. Typical spray pressure is 1-3 kg / cm2.

(5) On the back glass substrate 5 from which the photosensitive film has been removed, a hydrolysis type coating agent containing Al, Si, and O as a main component is applied by a method such as a blade method or a spray method. The “second insulating layer 50” is formed by heating at a temperature of 400 ° C. for 1 to 60 minutes. The thickness of the second insulating layer 50 may be determined according to the surface condition of the inner wall of the groove formed by the sandblasting process and the properties of the insulating layer to be formed.
It is 0.01 mm.

(6) A Cr / Cu / Cr laminated film is formed on the rear glass substrate 5 on which the second insulating layer 50 is formed by using a film forming technique such as a sputtering method or an electron beam evaporation method.
By this step, Cr / C constituting the address electrode 10 is formed.
The u / Cr laminated film is embedded in a “groove” formed on the surface of the rear glass substrate 5 and serving as the main discharge space 100. (7) The surface of the back substrate 2 on which the Cr / Cu / Cr laminated film is formed is polished by using a polishing method such as a tape polishing method or a polishing method. Next, abrasive grains and the like are removed by washing.
By this step, the Cr / Cu / Cr on the barrier rib 11 is
The laminated film is removed, and the address electrode 10 is formed in the “groove” formed on the surface of the rear glass substrate 5 and serving as the main discharge space 100.

(8) The phosphor 12 is applied to the surface of the inner wall of the groove serving as the main discharge space 100 by using a method such as a spray method, a blade method, or a printing method. In the case of a gas discharge type display device of a color display, a phosphor layer 1 that emits green, blue and red colors by aligning a mask of a predetermined pattern of green, blue and red.
2 is applied. Then, at a temperature of 150 to 300 ° C.,
A heat treatment for 60 minutes is performed.

(9) A pattern of frit glass is formed by using a thick film printing method, and drying is performed to form a seal layer (not shown) for performing vacuum sealing.

Through the above steps, the back substrate 2 in the third embodiment is completed. As you can see from the above explanation,
In this embodiment, in order to form the second insulating layer 50, the process shown in FIG.
Cannot be used as a process for forming Therefore,
It is necessary to use the process (B) shown in FIG. 3 as a process for forming the address electrodes 10. The back substrate 2
Is mounted with a chip tube (not shown) for exhaust and gas introduction after panel assembly.

The back substrate 2 manufactured in the above steps and the front substrate 1 manufactured by the same method as in the first embodiment are aligned and adhered to each other, and subjected to a heat treatment at 300 to 400.degree. Fix it. In this case, the display electrode 6 and the bus electrode 7 provided on the front substrate 1 and the rear substrate 5
Are made substantially orthogonal to each other. Next, the main discharge space 100 formed between the front substrate 1 and the rear substrate 2 is evacuated through a chip tube (not shown) provided on the rear substrate, and for example, Ne containing 3% of Xe is discharged mainly. The pressure in the main discharge space 100 is reduced to 35 to
Adjust to 70 kPa. Next, a tip tube (not shown)
By performing chip-off by local heating described above, the gas discharge display device shown in FIG. 6 is completed. In the third embodiment shown here, a hydrolysis-type coating agent is used for forming the second insulating layer, but the present invention is not limited to this material. Further, as a method for forming the second insulating layer, a method in which a blade method, a spray method, and a thermosetting method are combined is used. You can use the law.

Also in the case of the third embodiment, the main discharge space 1
Since the manufacturing method and structure of the address electrode 00 and the address electrode 10 are basically the same as those of the first embodiment, the same effects as those of the first embodiment can be obtained. However, in the case of this embodiment, the main discharge space 10 formed by sandblasting is used.
Since the inner wall of the “groove” serving as “0” is covered with the second insulating layer, the manufacturing process of the rear substrate is longer than that of the first embodiment. However, since the scratches on the inner wall of the groove and the remaining abrasive grains are covered with the second insulating layer, the cleanliness and smoothness of the inner wall of the “groove” are improved, and the occurrence of defects in the address electrode 10 is suppressed. Is obtained.

(Embodiment 4) A fourth embodiment of the present invention will be described with reference to FIG. FIG. 7 is a sectional view showing a part of a gas discharge type display device to which the present invention is applied. FIG. 7A shows a cross section parallel to the address electrode, and FIG.
Is a line AB perpendicular to the address electrode shown in FIG.
FIG. 3C shows a cross section taken along a line CD shown in FIG. 3A, which is perpendicular to the address electrodes.

As can be seen from FIG. 7, the fourth embodiment is different from the first embodiment in that the fourth embodiment is formed at the bottom of a “groove” serving as main discharge space 100 provided in rear glass substrate 5. Address electrode 10 is covered with a “third insulating layer”. Other configurations and manufacturing methods are the first.
This is the same as the embodiment.

In the present embodiment, since the structure of the rear substrate 2 is slightly different from that of the first embodiment, a method of manufacturing the rear substrate 2 will be described with reference to FIG.

(1) A glass plate such as soda lime glass as the rear glass substrate 5 is washed with a neutral detergent or the like.

(2) The photosensitive film is formed on the back glass substrate 5
A predetermined photosensitive film pattern is formed by laminating on the substrate and performing known exposure, development, washing with water, and drying.

(3) A portion of the back glass substrate 5 that is not covered with the photosensitive film is removed by performing a sandblasting process, and a groove serving as the main discharge space 100 is formed on the surface of the back glass substrate 5. In this case, the blast conditions are adjusted so that the depth of the groove is 0.08 to 0.3 mm. Thereafter, if necessary, cleaning with alcohol or the like is performed to remove foreign substances such as abrasive grains.

(4) A Cr / Cu / Cr laminated film is formed on the back glass substrate 5 on which the groove serving as the main discharge space 100 is formed, by using a film forming technique such as a sputtering method or an electron beam evaporation method. By this step, the Cr / Cu / Cr laminated film constituting the address electrode 10 is embedded in the “groove” formed on the surface of the rear glass substrate 5 and serving as the main discharge space 100. The process for forming the address electrodes 10 is the same as the process shown in FIG.

(5) The concentration is 1 to 4% and the temperature is 40 to 50.
The photosensitive film is removed by spray-peeling using an aqueous solution of sodium hydroxide at ℃. Typical spray pressure is 1-3 kg / cm2.

(6) On the back glass substrate 5 from which the photosensitive film has been removed, a hydrolysis type coating agent containing Al, Si, and O as a main component is applied by a method such as a blade method or a spray method. The “third insulating layer 80” is formed by heating at a temperature of 400 ° C. for 1 to 60 minutes. By this step, the surfaces of the address electrodes 10 and the barrier ribs 11 provided at the bottom of the groove serving as the main discharge space 100 are covered with the third insulating layer 80. The thickness of the third insulating layer 80 may be determined according to the state of occurrence of pinholes in the third insulating layer on the address electrode 10, but a typical thickness is 0.002 to 0.01 mm. .

(7) The phosphor 12 is applied to the surface of the inner wall of the “groove” serving as the main discharge space 100 by using a method such as a spray method, a blade method, or a printing method. In the case of a gas discharge type display device of a color display, a mask of a predetermined pattern of green, blue and red is aligned, and a phosphor 12 for emitting green, blue and red colors is applied. Then, at a temperature of 150 to 300 ° C., 5
Heat treatment for ~ 60 minutes.

(8) A pattern of frit glass is formed by using a thick film printing method, and drying is performed to form a seal layer (not shown) for vacuum sealing.

Through the above steps, the rear substrate 2 according to the fourth embodiment is completed. A chip tube (not shown) is attached to the rear substrate 2 for exhaust and gas introduction after the panel is assembled.

The back substrate 2 completed in the above steps and the front substrate 1 manufactured by the same method as in the first embodiment are aligned and bonded, and a heat treatment at 300 to 400.degree. Fix it. In this case, the display electrode 6 and the bus electrode 7 provided on the front substrate 1 and the rear substrate 5
Are made substantially orthogonal to each other. Next, the main discharge space 100 formed between the front substrate 1 and the rear substrate 2 is evacuated through a chip tube (not shown) provided on the rear substrate, and for example, Ne containing 3% of Xe is discharged mainly. The pressure in the main discharge space 100 is reduced to 35 to
Adjust to 70 kPa. Next, a tip tube (not shown)
By performing chip-off by local heating described above, the gas discharge display device shown in FIG. 7 is completed. In the fourth embodiment shown here, a hydrolysis-type coating agent is used for forming the third insulating layer, but the present invention is not limited to this material. Further, as a method for forming the third insulating layer, a method in which a blade method, a spray method, and a thermosetting method are combined is used. However, the forming method is not limited, and a sputtering method, a chemical vapor reaction method, a thick film printing method, or the like. You can use the law.

Also in the case of the fourth embodiment, the main discharge space 1
Since the structure and manufacturing method of the address electrode 10 and the address electrode 10 are basically the same as those of the first embodiment, the same effects as those of the first embodiment can be obtained. In the case of this embodiment, since the formation of the third insulating layer is increased, the manufacturing process of the back substrate 2 is longer than that of the first embodiment. However, since the address electrode 10 and the paria rib 11 are covered with the third insulating layer, deterioration of the address electrode 10 and degassing from the “groove” serving as the main discharge space 100 in the process after the formation of the phosphor layer 12 are prevented. The effect that can be suppressed is obtained.

(Embodiment 5) A fifth embodiment of the present invention will be described with reference to FIGS. FIG. 8 is a sectional view showing a part of a gas discharge type display device to which the present invention is applied. 8A shows a cross section parallel to the address electrodes, FIG. 8B shows a cross section taken along the line AB shown in FIG. 8A perpendicular to the address electrodes, and FIG. It shows the CD cross section shown in FIG. FIG.
FIG. 9 is a plan view of the gas discharge display device shown in FIGS. 1 and 8 when viewed from the front substrate 1 side toward the rear substrate 2.
FIG. 8A shows the first embodiment, and FIG. 8B shows the fifth embodiment. In the figure, reference numeral 1000 denotes a display cell array arranged along the direction in which the display electrodes 6 extend (herein referred to as display electrode cell arrays), and 2000 denotes a display cell array arranged in the direction in which the address electrodes extend. Column (here, it is called address electrode cell column)
, 3000 are display cells, 7000, 7100, 72
Reference numeral 00 denotes a pattern including a display electrode and a bus electrode. This figure does not show a cross section, but is hatched for easy understanding.

As can be seen from FIGS. 8 and 21, the fifth embodiment differs from the first embodiment in that
In the pattern shape of the Cr / Cu / Cr laminated film. That is, in the case of this embodiment, the point that the bus electrode 7 made of the Cr / Cu / Cr laminated film is formed so as to surround the display cell 3000 and the pattern 700 made of the Cr / Cu / Cr laminated film is the display electrode This is a point formed between the cell rows 1000. Other configurations and manufacturing methods are the same as those of the first embodiment.

In the fifth embodiment, the structure and manufacturing steps are basically the same as those of the gas discharge type display device shown in the first embodiment, and the same effects as in the first embodiment are obtained. can get. Further, in the case of the present embodiment, Cr / Cu / C
Since the pattern 700 made of the r film and the bus electrode 7 function as a black matrix, uncontrollable light around the display cells 3000 is shielded, and an effect of preventing color mixture and color bleeding between the display cells 3000 is obtained.

The pattern 7 composed of the Cr / Cu / Cr laminated film provided between the adjacent display electrode cell rows 1000
A transparent electrode film constituting the display electrode 6 may be present under the layer No. 00.

(Embodiment 6) A sixth embodiment of the present invention will be described with reference to FIGS. FIG. 9 is a cross-sectional view showing a part of a gas discharge type display device to which the present invention is applied. 9A shows a cross section parallel to the address electrode, FIG. 9B shows a cross section taken along a line AB shown in FIG. 9A perpendicular to the address electrode, and FIG. It shows the CD cross section shown in FIG. FIG.
10 is a plan view of the gas discharge display device shown in FIG. 9 when viewed from the front substrate 1 side toward the rear substrate 2. This figure does not show a cross section, but for clarity,
Hatching was applied.

As can be seen from FIGS. 9 and 22, the sixth embodiment is different from the first embodiment in that a grid-like barrier rib 120 is provided on the surface of front substrate 1 in contact with main discharge space 100. In that the main discharge space 100 is separated as a discharge space for each display cell. Other configurations and manufacturing methods are the same as those of the first embodiment.

The following three typical methods are used to manufacture the lattice-shaped barrier ribs 120 in this embodiment.

First manufacturing method: The front surface on which the dielectric layer 8 is formed by using a conventional barrier rib manufacturing method such as the thick film printing method, the photo embedding method, the sand blast method, and the photosensitive paste method shown in FIG. A method of forming lattice-shaped barrier ribs 120 on the surface of the substrate 1. Second manufacturing method: A method of forming a grid-like barrier rib 120 by providing an opening corresponding to each display cell in a plate made of an insulating material such as glass or ceramic. The openings corresponding to the respective display cells are formed by a method combining sandblasting, etching, and photolithography.

Third Manufacturing Method: A method of forming a grid-like barrier rib 120 by coating a metal plate provided with openings corresponding to respective display cells with an insulating material. The opening of the metal plate is formed by a method such as a photoetching method or a pressing method. The coating of the insulating material on the metal plate is performed using a technique such as a dipping method or a spray coating method. As a raw material of the insulating material, a liquid such as a hydrolysis-type coating agent (such as an alkoxide) or water glass is desirably used.

Of the above three manufacturing methods, the second and third manufacturing methods, in which the grid-like barrier rib 120 can be formed as a partition substrate independent of the front substrate and the rear substrate, are suitable for the present embodiment. . In particular, since a metal plate having excellent mechanical strength is used, it is easy to handle and has advantages such as a large degree of freedom in selecting a thickness. Therefore, the third manufacturing method is the most preferable method. is there.

In the sixth embodiment, the structure and manufacturing process of the rear substrate having barrier ribs are the same as those of the first embodiment, and the same effects as obtained in the first embodiment can be obtained. . Further, in this embodiment, the following effects can be obtained by providing grid-like barrier ribs 120 on the main discharge space surface of front substrate 1.

(1) The quality of black display is improved, which is effective in improving the contrast of the display screen. That is, by forming the grid-like barrier ribs 120 from an opaque material, the grid-like barrier ribs 120 can function as a black matrix, and uncontrollable light around each display cell is shielded. Color mixing and color bleeding can be prevented. This effect is enhanced by making the color of the barrier rib 120 black.

(2) Since the distance between the display electrodes of each display cell can be reduced, it is effective in improving the brightness and miniaturization by improving the aperture ratio of the display screen. That is, since the main discharge space in contact with the front substrate 1 is forcibly separated as the discharge space for each display cell by the grid-like barrier ribs 120, even if the distance between adjacent display cells of the display electrode is reduced, This is because the discharge does not spread to the adjacent display cell.

(3) It is effective to increase the brightness of the display screen. In order to increase the luminance, it is necessary to irradiate as many ultraviolet rays as possible to as many phosphors as possible while securing a discharge space for performing a stable discharge. For this purpose, the distance between the region where the ultraviolet rays are strongest and the place where the most phosphors are present may be shortened to secure a discharge space for maintaining stable discharge. In order to bring the region having the strongest ultraviolet light into the “groove” provided in the rear substrate 5, it is necessary to increase the depth of the groove. But in this case,
Processing of the "groove" becomes difficult, and the production yield decreases.
Further, it is considered that electrons are largely lost on the surface of the phosphor layer, and discharge is likely to be unstable. In the case of this embodiment,
Since the discharge space is ensured by the space surrounded by the lattice-shaped barrier ribs 120, the groove provided in the back substrate 5 can be made shallow. That is, by generating the main discharge in the space surrounded by the barrier rib 120, the distance between the bottom of the groove provided on the rear glass substrate 5 where the most phosphor is present and the region where the ultraviolet rays are strongest can be reduced. This allows
High brightness of the display screen can be achieved.

In this embodiment, the structure of the back substrate is the same as that of the first embodiment, but the structure of the back substrate is the same as that of the second to fourth embodiments. However, the effects described in (1) to (3) can be obtained.

(Embodiment 7) A seventh embodiment of the present invention will be described with reference to FIGS. FIG. 10 is a sectional view showing a part of a gas discharge type display device to which the present invention is applied. 10A shows a cross section parallel to the address electrode, and FIG. 10B shows a cross section perpendicular to the address electrode.
(C) shows the CD section shown in (a), which is perpendicular to the address electrode. FIG.
FIG. 11 is a plan view of a part of the gas discharge display device shown in FIG. 10 when viewed from the front substrate 1 side toward the rear substrate 2. This figure does not show a cross section, but is hatched for easy understanding.

As can be seen from FIGS. 10 and 23, the difference between this embodiment and the sixth embodiment is that
62 are provided for every two display electrode cell rows, and a central one 62 of the three display electrodes 61 and 62 is
The point is that it is provided over two display electrode cell rows. Other configurations, manufacturing methods, and points to which the present invention is applied are the same as those of the sixth embodiment. The display electrode 62, which extends over two display electrode cell rows, functions as a common electrode for generating a main discharge for display. The bus electrode 72 with respect to the display electrode 62 is desirably disposed so as to overlap the barrier rib 120 in order to prevent a decrease in the aperture ratio of the display cell. Further, in the present embodiment, the display electrode 62 is a common electrode that extends over the display electrode cell row. However, the display electrode 62 does not necessarily need to extend over the display electrode cell row, and the display electrode 62 may extend over the display electrode cell row.

In the seventh embodiment, the structure other than the display electrode and the bus electrode and the point that the present invention is applied are the same as those of the sixth embodiment, and are the same as those of the sixth embodiment. The effect is obtained. Further, in this embodiment, as compared with the case of the sixth embodiment, the aperture ratio is wide due to the difference in the structure of the display electrode 6 and the bus electrode 7, and the luminance is higher than in the case of the sixth embodiment. Is obtained. Further, the luminance in the dark state is equal to or less than that in the sixth embodiment, and a higher contrast can be obtained than in the sixth embodiment.

In this embodiment, the barrier rib separating the auxiliary discharge space 200 is formed by the back glass substrate. However, as in the case of the second embodiment, the first insulating material is formed by the back glass substrate. The first insulating material may be formed by processing the first insulating material.
Also, as in the third embodiment, the auxiliary discharge space 200
The address electrode may be formed after the second insulating layer is formed on the inner wall of the “groove” to be formed.

(Eighth Embodiment) An eighth embodiment of the present invention will be described with reference to FIGS. FIG. 11 is a sectional view showing a part of a gas discharge type display device to which the present invention is applied. In FIG. 11, (a) is a cross section parallel to the address electrode, and (b) is perpendicular to the address electrode (a).
(C) shows the CD section shown in (a), which is perpendicular to the address electrode. FIG.
FIG. 12 is a plan view of a part of the gas discharge display device shown in FIG. 11 when viewed from the front substrate 1 side toward the rear substrate 2. This figure does not show a cross section, but is hatched for easy understanding.

As can be seen from FIGS. 11 and 24, the present embodiment is different from the sixth and seventh embodiments in that three display electrodes 61 and 62 are provided for each display electrode cell row. The point is that two of the three display electrodes 61 and 62 on both sides are common to the display electrodes 62 of the adjacent display electrode cell row. For other configurations and manufacturing methods, see
This is the same as in the seventh embodiment. The display electrode 62, which extends over two display electrode cell rows, functions as a common electrode for generating a main discharge for display. The bus electrode 72 with respect to the display electrode 62 is desirably disposed so as to overlap the barrier rib 120 in order to prevent a decrease in the aperture ratio of the display cell. Further, in the present embodiment, the display electrode 62 is a common electrode that extends over the display electrode cell row. However, the display electrode 62 does not necessarily need to extend over the display electrode cell row, and the display electrode 62 may extend over the display electrode cell row.

In the eighth embodiment, the structure other than the display electrodes and the bus electrodes and the application of the present invention are the same as those in the sixth and seventh embodiments. The same effect as in the case of the embodiment can be obtained. Further, in this embodiment, as compared with the sixth and seventh embodiments, the aperture ratio is increased due to the difference in the structure of the display electrode 6 and the bus electrode 7, and the sixth and seventh embodiments are different. From the form of
High brightness can be obtained. In addition, the area of the area around the display cell where the display cannot be controlled is smaller than in the sixth and seventh embodiments. Therefore, the contrast is higher than in the sixth and seventh embodiments.
Further, in this embodiment, since one display cell has two electrodes, the intensity of generation of ultraviolet rays by discharge increases. Thus, in this embodiment, the luminance is further increased.

In this embodiment, the barrier ribs for separating the auxiliary discharge space 200 are formed by the rear glass substrate 5, but as in the second embodiment,
Forming a first insulating material on the back glass substrate,
It may be formed by processing the insulating material. Further, as in the third embodiment, the auxiliary discharge space 2
The address electrode 10 may be formed after the second insulating layer is formed on the inner wall of the “groove” to be 00.

(Embodiment 9) A ninth embodiment of the present invention will be described with reference to FIG. FIG. 1 is a sectional view showing a part of a gas discharge type display device to which the present invention is applied. 12A is a cross section parallel to the address electrode, FIG. 12B is a cross section taken along a line AB shown in FIG. 12A perpendicular to the address electrode, and FIG. 12C is a cross section perpendicular to the address electrode. FIG. 3A is a cross-sectional view taken along the line C-D shown in FIG. In the figure, 100 is a main discharge space provided on the front substrate 1 side,
Reference numeral 200 denotes an auxiliary discharge space provided on the rear substrate 2 side,
Reference numeral 3 denotes a partition for separating the main discharge space 100 from the auxiliary discharge space 200, and reference numeral 14 denotes a main discharge space 100 provided in the partition 13.
And an opening connecting the auxiliary discharge space 200 to the opening.

The points to which the present invention is applied in the ninth embodiment from FIG. 12 are summarized as follows.

(1) Auxiliary discharge space 200 extending in a certain direction by “grooves” provided in rear glass substrate 5
Are formed, and the respective auxiliary discharge spaces 100 are separated by barrier ribs 11 made of a rear glass substrate material.

(2) The back substrate 2 has a “groove” formed as an auxiliary discharge space 200 formed in the back glass substrate 5.
(Barrier rib 11 for separating auxiliary discharge space 200);
It comprises an address electrode 10 formed in the "groove", a dielectric layer 8 covering the address electrode 10, and a protective layer 9 made of MgO or the like.

(3) The discharge space is divided into a main discharge space 100 and an auxiliary discharge space 200 by a partition wall 13.

(4) The main discharge space 100 is separated for each display cell by a grid-like barrier rib 120.
The phosphor 12 is formed on a surface of the partition wall 13 and the barrier rib 110 facing the main discharge space 100.

The manufacturing steps of the front substrate 1 and the rear substrate 2 up to the formation of the address electrodes 10 and the method of forming the phosphor layer 12 are the same as those in the first embodiment. In the case of the rear substrate 2, after forming the address electrodes 10, a dielectric layer 8 and a protective layer 9 made of MgO or the like are formed. The dielectric layer 8 and the protective layer 9 are formed by the same method as the method of forming the dielectric layer 8 and the protective layer 9 in the manufacturing process of the front substrate 1 described in the first embodiment. The following two methods are typical methods for manufacturing the grid-like barrier ribs 120 and the partition walls 13 in this embodiment.

First manufacturing method: A grid-shaped barrier rib 120 corresponding to each display cell and an opening 1 are formed by digging a plate made of an insulating material such as glass or ceramic.
Method of forming 4. For the processing of the plate material, a method in which a sand blast method or an etching method is combined with a photolithography method is used.

Second manufacturing method: A method in which a metal plate provided with lattice-shaped barrier ribs 120 and openings 14 corresponding to respective display cells is covered with an insulating material. For processing of the metal plate, a method such as a photoetching method or a press is used. For coating the metal plate with an insulating material, a technique such as a dipping method or a spray coating method is used. As a raw material of the insulating material, a liquid such as a hydrolysis-type coating agent (such as an alkoxide) or water glass is desirably used.

According to the above-described two manufacturing methods, the barrier ribs 120 and the barrier ribs 13 in the form of a lattice can be formed as barrier rib substrates independent of the front substrate 1 and the rear substrate 2.

In this embodiment, as in the first embodiment, the process of processing the conductor layer for forming the address electrode 10 can be omitted, so that the manufacturing process of the rear substrate 2 can be shortened. Since the address electrodes 10 are formed after the formation of the barrier ribs 11 which are likely to cause a reduction in the manufacturing yield, the manufacturing yield of the rear substrate 2 can be increased. Further, according to this embodiment, the following effects can be obtained.

(1) The barrier ribs 11 of the rear substrate 2 can be formed at a temperature lower than the strain point of soda-lime glass, and the barrier ribs 120 and the partition walls 13 can be formed independently of the front substrate 1 and the rear substrate 3. Even when soda lime glass is used as the substrate 4 or the rear glass substrate 5,
Deformation can be prevented.

(2) The area on which the phosphor layer 12 is applied is widened, and the display electrode 6 and the bus electrode 7 have the same structure. The brightness of the display screen is higher than in the first to sixth embodiments. it can. (3) An address discharge between the display electrode 6 and the address electrode 10 for selecting a display cell is performed through the main discharge space 100, the auxiliary discharge space 200, and the opening 14. Thereby, ion damage to the phosphor layer 12 due to the address discharge is suppressed, and the life of the phosphor is improved. Further, since the address discharge is performed between the electrodes coated with MgO having a high secondary electron emission coefficient, the discharge voltage can be reduced.

(4) When an auxiliary discharge or an address discharge for the purpose of lowering the address voltage (scanning voltage) is generated by using the address electrode 10 as a cathode, a place where ultraviolet rays are strong becomes the auxiliary space 200. Therefore, light emission of the phosphor layer 12 due to the auxiliary discharge or the address discharge can be suppressed. Therefore, the contrast can be increased as compared with the first to sixth embodiments in which the display electrode 6 and the bus electrode 7 have the same structure.

As described above, according to the ninth embodiment of the present invention, the manufacturing process of the back substrate 2 can be shortened and the yield can be improved, and the luminance is higher than that of the first to sixth embodiments. The effect of being able to provide a gas discharge display device having improved contrast, improved life, and the like is obtained. In this embodiment, soda lime glass is used as the back glass substrate 5, but the present invention is not limited to this, and other electrically insulating plate materials such as a glass plate and a ceramic plate may be used.
If a withstand voltage with respect to the voltage applied to the address electrode 10 is ensured, a metal plate provided with a groove serving as an auxiliary discharge space 200 on one main surface may be covered with an insulating material to form the rear glass substrate 5. In this case, the effect of improving the mechanical strength and heat dissipation of the back substrate 2 can be obtained.

In this embodiment, the barrier rib separating the auxiliary discharge space 200 is formed by the back glass substrate 5. However, as in the second embodiment,
Forming a first insulating material on the back glass substrate,
It may be formed by processing the insulating material. Further, as in the third embodiment, the auxiliary discharge space 2
The address electrode 10 may be formed after the second insulating layer is formed on the inner wall of the “groove” to be 00.

(Embodiments 10 and 11) The tenth embodiment of the present invention
13 is shown in FIG. 13, and the eleventh embodiment is shown in FIG.
Shown in These figures are cross-sectional views showing a part of a gas discharge type display device to which the present invention is applied. FIG. 13 and FIG.
4, (a) shows a cross section parallel to the address electrode,
(B) is a cross section taken along the line AB shown in FIG. (A) perpendicular to the address electrode, and (c) is a cross section taken along the line CD shown in (a) perpendicular to the address electrode.

As can be seen from FIGS. 13 and 14, the difference between this embodiment and the ninth embodiment is that
1, 62 are provided for every two display electrode cell rows,
Of the three display electrodes 61 and 62, the central one 62
However, it is provided over two display electrode cell rows. Other configurations, manufacturing methods, and points to which the present invention is applied are the same as in the ninth embodiment. The display electrode 62, which extends over two display electrode cell rows, functions as a common electrode for generating a main discharge for display. The bus electrode 72 with respect to the display electrode 62 is desirably disposed so as to overlap the barrier rib 120 in order to prevent a decrease in the aperture ratio of the display cell. Further, in the present embodiment, the display electrode 62 is a common electrode that extends over the display electrode cell row. However, the display electrode 62 does not necessarily need to extend over the display electrode cell row, and the display electrode 62 may extend over the display electrode cell row.

In the tenth embodiment shown in FIG.
Discharge for selecting a display cell between a display electrode 61 (hereinafter referred to as an X electrode) unique to a display electrode cell row provided on the front substrate 1 and an address electrode 10 provided on the back substrate 2. Generate. On the other hand, in the eleventh embodiment shown in FIG. 14, a display electrode 62 (herein referred to as a Y electrode) serving as a common electrode provided on the front substrate 1 and an address electrode provided on the back substrate 2 1
A discharge for selecting a display cell between 0 is generated.
In the eleventh embodiment, the display electrode 6 serving as a common electrode
2 is applied with a high voltage of about 300 V to generate a discharge in all of the display cells, whereby the protective film 9 covering the display electrode 62 and the surface of the protective film 9 covering the address electrode 10 are formed. This is effective when forming a wall charge and lowering the scanning voltage applied to the address voltage 10 in order to line-select the address electrode cell row. In the ninth embodiment, one of the display electrodes 61 and 62 may be an X electrode and the other may be a Y electrode.

In the tenth and eleventh embodiments, the structure other than the display electrodes, the manufacturing method, and the point that the present invention is applied are the same as those of the ninth embodiment.
The same effect as that of the embodiment can be obtained. Further, in this embodiment, as compared with the case of the ninth embodiment, the aperture ratio is wide due to the difference in the structure of the display electrode 6 and the bus electrode 7, and high luminance can be obtained. In addition, compared to the seventh embodiment in which the display electrode 6 and the bus electrode 7 have the same structure and the same aperture ratio, the application area of the phosphor layer 12 is large, so that high luminance can be obtained. . Furthermore, the area of the display control area around the display cell which cannot be controlled is
Since it is smaller than in the case of the ninth embodiment, higher contrast can be obtained than in the case of the ninth embodiment.

In this embodiment, the barrier rib for separating the auxiliary discharge space 200 is formed by the back glass substrate 5, but as in the second embodiment,
Forming a first insulating material on the back glass substrate,
It may be formed by processing the insulating material. Further, as in the third embodiment, the auxiliary discharge space 2
The address electrode 10 may be formed after the second insulating layer is formed on the inner wall of the “groove” to be 00.

(Embodiments 12 and 13) A twelfth embodiment of the present invention
The embodiment of FIG. 15 is shown in FIG.
Shown in These figures are cross-sectional views showing a part of a gas discharge type display device to which the present invention is applied. FIG. 15 and FIG.
6, (a) shows a cross section parallel to the address electrode,
(B) is a cross section taken along the line AB shown in FIG. (A) perpendicular to the address electrode, and (c) is a cross section taken along the line CD shown in (a) perpendicular to the address electrode.

As can be seen from FIGS. 15 and 16, the difference between this embodiment and the ninth to eleventh embodiments is that three display electrodes 61 and 62 are provided for each display electrode cell row.
Of these three display electrodes 61 and 62, two 62 on both sides
Are common to the display electrodes 62 of the adjacent display electrode cell rows. Other configurations, manufacturing methods, and points to which the present invention is applied are the same as the ninth to eleventh embodiments. 2
The display electrodes 62 existing across the display electrode cell columns in the column serve as common electrodes for generating a main discharge for display. The bus electrode 72 with respect to the display electrode 62 is desirably disposed so as to overlap the barrier rib 120 in order to prevent a decrease in the aperture ratio of the display cell. Further, in the present embodiment, the display electrode 62 is a common electrode that extends over the display electrode cell row. However, the display electrode 62 does not necessarily need to extend over the display electrode cell row, and the display electrode 62 may extend over the display electrode cell row.

In the twelfth embodiment shown in FIG.
A discharge for selecting a display cell is generated between the X electrode provided on the front substrate 1 and the address electrode 10 provided on the back substrate 2. On the other hand, the thirteenth shown in FIG.
In the embodiment, a discharge for selecting a display cell is generated between the Y electrode provided on the front substrate 1 and the address electrode 10 provided on the rear substrate 2. In the thirteenth embodiment, a discharge is generated in all the display cells by applying a high voltage of about 300 V to the display electrode 62 serving as a common electrode, whereby the protective film 9 covering the display electrode 62 is removed. This is effective when a wall charge is formed on the surface of the protective film 9 covering the address electrode 10 and the scanning voltage applied to the address voltage 10 is reduced in order to select the address electrode cell row line-sequentially.

The twelfth and thirteenth embodiments are the same as the ninth to eleventh embodiments in the structure and manufacturing method other than the display electrodes and in that the present invention is applied. The same effects as those of the embodiments 9 to 11 can be obtained. Further, in the case of this embodiment, the aperture ratio is wide due to the difference in the structure of the display electrode 6 and the bus electrode 7, and higher luminance can be obtained than the ninth to eleventh embodiments. Also,
Compared with the ninth to eleventh embodiments, the area of the area around the display cell where the display cannot be controlled is smaller. Therefore, a higher contrast can be obtained as compared with the ninth to eleventh embodiments. Further, in this embodiment, since one display cell has two electrodes, the intensity of generation of ultraviolet rays by discharge increases. Thus, in this embodiment, the luminance is further increased. In addition, compared to the eighth embodiment in which the structure of the display electrode 6 and the bus electrode 7 is the same, high luminance can be obtained because the phosphor layer 12 has a large application area.

In this embodiment, the barrier ribs for separating the auxiliary discharge space 200 are formed by the rear glass substrate 5. However, as in the second embodiment,
Forming a first insulating material on the back glass substrate,
It may be formed by processing the insulating material. Further, as in the third embodiment, the auxiliary discharge space 2
The address electrode 10 may be formed after the second insulating layer is formed on the inner wall of the “groove” to be 00.

[0142]

According to the present invention, the manufacturing process of the rear substrate provided with the barrier ribs and the address electrodes can be shortened and the yield can be improved. Further, since the upper surface of the barrier rib that comes into contact with the front substrate can be easily made flat, the effect of providing a gas discharge display device that can increase the reliability of display cell selection can be obtained.

[Brief description of the drawings]

FIG. 1 is a cross-sectional view showing a first embodiment of the present invention.

FIG. 2 is a process flowchart illustrating an example of a manufacturing process according to the first embodiment of the present invention.

FIG. 3 is a process flow chart showing an example of an address electrode forming process in a manufacturing process according to the first embodiment of the present invention.

FIG. 4 is a sectional view showing a second embodiment of the present invention.

FIG. 5 is a process flow chart showing an example of a manufacturing process according to a second embodiment of the present invention.

FIG. 6 is a sectional view showing a third embodiment of the present invention.

FIG. 7 is a sectional view showing a fourth embodiment of the present invention.

FIG. 8 is a sectional view showing a fifth embodiment of the present invention.

FIG. 9 is a sectional view showing a sixth embodiment of the present invention.

FIG. 10 is a sectional view showing a seventh embodiment of the present invention.

FIG. 11 is a sectional view showing an eighth embodiment of the present invention.

FIG. 12 is a sectional view showing a ninth embodiment of the present invention.

FIG. 13 is a sectional view showing a tenth embodiment of the present invention.

FIG. 14 is a sectional view showing an eleventh embodiment of the present invention.

FIG. 15 is a sectional view showing a twelfth embodiment of the present invention.

FIG. 16 is a sectional view showing a thirteenth embodiment of the present invention.

FIG. 17 is a perspective view showing a conventional example of a gas discharge type display panel.

FIG. 18 is a sectional view showing a conventional example of a gas discharge type display panel.

FIG. 19 is a process flow chart showing an example of a method for manufacturing a conventional gas discharge display device.

FIG. 20 is a process flow chart showing a conventional method for manufacturing a barrier rib.

FIG. 21 is a diagram showing a display electrode and a barrier rib viewed from the front substrate side of the gas discharge display device according to the first and fifth embodiments of the present invention.

FIG. 22 is a diagram showing a display electrode and barrier ribs viewed from a front substrate side of a gas discharge display device according to a sixth embodiment of the present invention.

FIG. 23 is a view of a display electrode and a barrier rib viewed from a front substrate side of a gas discharge display device according to a seventh embodiment of the present invention.

FIG. 24 is a diagram showing a display electrode and barrier ribs viewed from a front substrate side of a gas discharge display device according to an eighth embodiment of the present invention.

[Explanation of symbols]

DESCRIPTION OF SYMBOLS 1 ... Front board, 2 ... Back board, 3 ... Discharge space area, 4 ...
Front glass substrate, 5 back glass substrate, 6 display electrode (transparent electrode), 7 bus electrode, 8 dielectric layer, 9 protection layer (MgO), 10 address electrode, 11, 15, 11
0 · 120 · barrier rib, 12 · phosphor layer, 13 · partition, 14 · opening, 17 · sealing layer, 50 · second insulating layer, 60 · 61 · 62 · display electrode (transparent electrode), 70 ·
71 · 72 ··· bus electrode, 80 ··· third insulating layer, 100 ···
Main discharge space, 200: auxiliary discharge space, 700: pattern formed of the same material as bus electrode, 1000: display electrode cell row, 1110: barrier rib material, 1120: photosensitive film, 1130: opening provided in photosensitive film pattern Part, 1140 ... conductor layer, 1150 ... first insulating layer, 2
000... Address electrode cell row, 7000/7100/7
200: pattern consisting of display electrodes and bus electrodes.

 ──────────────────────────────────────────────────続 き Continuing on the front page (72) Inventor Seiichi Tsuchida 292 Yoshida-cho, Totsuka-ku, Yokohama-shi, Kanagawa Prefecture Inside the Manufacturing Research Laboratory, Hitachi, Ltd. (72) Kazuo Suzuki 292 Yoshida-cho, Totsuka-ku, Yokohama-shi, Kanagawa Hitachi, Ltd. Production Technology Laboratory (72) Inventor Teruo Takai 292, Yoshida-cho, Totsuka-ku, Yokohama-shi, Kanagawa Prefecture F-term in the Digital Media Systems Division, Hitachi, Ltd. 5C027 AA01 AA03 AA09 5C040 FA01 FA04 GB03 GB14 GC01 GC02 GC11 GF08 GF19 5C094 BA31 BA32 CA19 CA24 DA13 EA04 EA07 EB02 EC04

Claims (30)

[Claims] 1. A front substrate in which a display electrode for generating a main discharge for performing display is formed on an insulating substrate for a front substrate, and a display which is disposed in parallel to the front substrate so as to face and emits light. A back substrate in which an address electrode for generating an address discharge for selecting a cell is formed on an insulating substrate for the back substrate, and a main substrate for generating the main discharge divided by barrier ribs corresponding to the display cells. A discharge space, and a phosphor layer formed on an inner wall of the main discharge space, wherein the discharge space is formed by bonding the front substrate and the back substrate, and the discharge space corresponds to a display cell. The gas discharge type display device, wherein the barrier rib for dividing is made of the same material as the insulating substrate for the rear substrate. 2. A front substrate having a display electrode for generating a main discharge for performing a display formed on an insulating substrate for a front substrate, and a display which is disposed in parallel with the front substrate so as to face and emits light. A back substrate in which an address electrode for generating an address discharge for selecting a cell is formed on an insulating substrate for the back substrate, and a main substrate for generating the main discharge divided by barrier ribs corresponding to the display cells. A discharge space, and a phosphor layer formed on an inner wall of the main discharge space, wherein the main discharge space is formed by digging one surface of a main surface of the back substrate insulating substrate. The rear substrate and the front substrate having grooves extending in the direction (herein referred to as grooves of the rear substrate) are formed by bonding together, and the address electrodes are embedded in the grooves of the rear substrate. The phosphor layer is formed on the inner wall of the groove of the back substrate on which the address electrode is formed and on the address electrode, and the front substrate and the back substrate are formed by the main substrate. A gas discharge display device, wherein a direction in which a discharge electrode extends and a direction in which the address electrode extends intersect with each other. 3. The gas discharge type display device according to claim 2, wherein one surface of the main surface of the insulating substrate for the rear substrate is made of a material having a lower density than the insulating substrate for the rear substrate. A first insulating layer is formed, and the groove of the back substrate is
A gas discharge type display device formed by digging the first insulating layer. 4. The gas discharge display device according to claim 2, wherein a surface of the groove of the rear substrate is covered with a second insulating layer made of an electrically insulating material, and the address electrode is And a gas discharge type display device formed on the second insulating layer. 5. The gas discharge type display device according to claim 1, wherein the address electrode is covered with a third insulating layer made of an electrically insulating material. Discharge type display device. 6. The gas discharge type display device according to claim 1, wherein a barrier rib for separating display cells arranged in a direction in which the discharge space extends is provided in the main discharge space of the front substrate. A gas discharge type display device provided on a side of the front substrate, wherein the discharge space is separated for each display cell on the front surface of the front substrate. 7. The gas discharge type display device according to claim 6, wherein the barrier rib for separating the discharge space for each display cell by contacting the surface of the front substrate has a discharge corresponding to each display cell. A gas discharge type display device formed by a first partition substrate provided with an opening for defining a space. 8. The gas discharge type display device according to claim 7, wherein the first partition substrate, which contacts a surface of the front substrate to define a discharge space corresponding to each display cell, is electrically insulated. A gas discharge type display device formed by a metal plate coated with a material. 9. A front substrate in which a display electrode for generating a main discharge for performing a display is formed on an insulating substrate for a front substrate, and a display which is disposed in parallel to and opposes the front substrate and emits light. A back substrate in which an address electrode for generating an address discharge for selecting a cell is formed on an insulating substrate for the back substrate, and a main substrate for generating the main discharge divided by barrier ribs corresponding to the display cells. A discharge space, and a phosphor layer formed on an inner wall of the main discharge space, wherein the insulating substrate for the rear substrate is formed of a metal plate having a surface coated with an insulating material; The groove of the rear substrate, which forms the main discharge space by bonding the rear substrate, is formed by machining a surface of the metal plate and extending in a certain direction with an insulating material. The address electrode is formed by a conductor layer embedded in a groove of the back substrate, and the phosphor layer is formed by covering an inner wall of the groove of the back substrate on which the address electrode is formed. A gas discharge type formed on an address electrode, wherein the front substrate and the rear substrate are bonded so that a direction in which the main discharge electrode extends and a direction in which the address electrode extends intersect. Display device. 10. The gas discharge type display device according to claim 9, wherein the address electrode is covered with a third insulating layer made of an electrically insulating material. 11. The gas discharge display device according to claim 9, wherein a barrier rib for separating display cells arranged in a direction in which the discharge space extends is provided on a discharge space side of the front substrate, A gas discharge type display device, wherein the discharge space is separated for each display cell on the front surface of the front substrate. 12. The gas discharge type display device according to claim 11, wherein the barrier rib that separates the discharge space for each display cell by contacting the surface of the front substrate includes a discharge corresponding to each display cell. A gas discharge type display device formed by a first partition substrate provided with an opening for defining a space. 13. The gas discharge type display device according to claim 12, wherein said first partition substrate, which contacts a surface of said front substrate to define a discharge space corresponding to each display cell, is electrically insulated. A gas discharge type display device formed by a metal plate coated with a material. 14. A front substrate in which a display electrode for generating a main discharge for performing a display is formed on an insulating substrate for a front substrate, and a display cell which is disposed in parallel to the front substrate so as to face and emits light. An address electrode for generating an address discharge for selecting a rear substrate formed on the rear substrate insulating substrate; a partition wall disposed in parallel between the front substrate and the rear substrate; A barrier rib that is disposed between the substrate and the partition wall and divides a main discharge space in which a main discharge for performing display is generated for each display cell, and a display cell that is formed between the back substrate and the partition wall and emits light. An auxiliary discharge space in which an address discharge for selecting occurs, an opening provided in the partition wall for connecting the main discharge space and the auxiliary discharge space, and a phosphor layer formed on an inner wall of the main discharge space And A gas discharge type display device, wherein a barrier rib for dividing the auxiliary discharge space corresponding to a display cell is made of the same material as the insulating substrate for the rear substrate. 15. A front substrate in which a display electrode for generating a main discharge for performing a display is formed on an insulating substrate for a front substrate, and a display cell which is disposed in parallel to the front substrate and emits light. A back substrate formed with an address electrode for generating an address discharge for selecting a back substrate insulating substrate, a partition wall disposed in parallel between the front substrate and the back substrate, A barrier rib that is disposed between the front substrate and the partition wall and divides a main discharge space where a main discharge for performing display is generated for each display cell, and a display cell that is formed between the rear substrate and the partition wall and emits light. An auxiliary discharge space in which an auxiliary discharge for selecting an auxiliary discharge is generated; an opening provided in the partition wall for connecting the main discharge space to the auxiliary discharge space; and a phosphor formed on an inner wall of the main discharge space. Layers and The auxiliary discharge space includes a groove (hereinafter, referred to as a groove of the rear substrate) extending in a certain direction formed by dug one surface of the main surface of the insulating substrate for the rear substrate. The address electrode is constituted by a conductor layer embedded in a groove of the rear substrate, and the main substrate is formed by extending the main discharge electrode. A direction in which the address electrodes extend and a direction in which the address electrodes extend. 16. The gas discharge display device according to claim 15, wherein one surface of the main surface of the insulating substrate for the rear substrate is made of a material having a lower density than the insulating substrate for the rear substrate. A gas discharge type display device, wherein a first insulating layer is formed, and the groove of the back substrate is formed by dug the first insulating layer. 17. The gas discharge display device according to claim 15, wherein a surface of the groove of the rear substrate is covered with a second insulating layer made of an electrically insulating material, and the address electrode is And a gas discharge type display device formed on the second insulating layer. 18. The gas discharge type display device according to claim 14, wherein the address electrode is covered with a third insulating layer made of an electrically insulating material. Discharge type display device. 19. The gas discharge display device according to claim 18, wherein a sputtering rate for a discharge gas is lower on the third insulating layer than in the third insulating layer. A gas discharge display device characterized by forming a high electrical insulating material. 20. The gas discharge display device according to claim 18, wherein the third insulating layer is formed of an electrically insulating material having a low sputtering rate with respect to a discharge gas and a high secondary electron emission coefficient. A gas discharge type display device characterized by the above-mentioned. 21. The gas discharge type display device according to claim 19, wherein the electrical insulating material having a low sputtering rate with respect to a discharge gas and a high secondary electron emission coefficient is one of MgO, CaO, and SrO. A gas discharge type display device comprising at least one material selected from the group consisting of: 22. A front substrate in which a display electrode for generating a main discharge for performing display is formed on an insulating substrate for a front substrate, and a display cell which is disposed in parallel with and faces the front substrate and emits light. A back substrate formed with an address electrode for generating an address discharge for selecting a back substrate insulating substrate, a partition wall disposed in parallel between the front substrate and the back substrate, A barrier rib that is disposed between the front substrate and the partition wall and divides a main discharge space where a main discharge for performing display is generated for each display cell, and a display cell that is formed between the rear substrate and the partition wall and emits light. An auxiliary discharge space in which an address discharge is generated for selecting one of the following; an opening provided in the partition wall for connecting the main discharge space to the auxiliary discharge space; and a phosphor formed on an inner wall of the main discharge space. layer The insulating substrate for a rear substrate is formed of a metal plate having a surface covered with an insulating material, and the groove of the rear substrate constituting the auxiliary discharge space processes a surface of the metal plate. The address electrodes are formed by covering a groove extending in a certain direction with an insulating material, and the address electrode is constituted by a conductor layer embedded in the groove of the rear substrate, and the front substrate and the rear substrate are formed. A gas discharge display device, wherein the substrates are bonded so that a direction in which the main discharge electrode extends and a direction in which the address electrode extends intersect. 23. The gas discharge display device according to claim 22, wherein the address electrode is covered with a third insulating layer made of an electrically insulating material. 24. The gas discharge type display device according to claim 23, wherein a sputtering rate with respect to a discharge gas is lower on the third insulating layer than in the third insulating layer, and a secondary electron emission coefficient is higher. A gas discharge display device comprising an electrically insulating material. 25. The gas discharge display device according to claim 23, wherein the third insulating layer is formed of an electrically insulating material having a low sputtering rate with respect to a discharge gas and a high secondary electron emission coefficient. Characteristic gas discharge type display device. 26. The gas discharge type display device according to claim 24, wherein the electrically insulating material having a low sputtering rate with respect to a discharge gas and a high secondary electron emission coefficient is one of MgO, CaO, and SrO. A gas discharge type display device comprising at least one material selected from the group consisting of: 27. The method of manufacturing a gas discharge type display device according to claim 1, wherein the step of manufacturing the rear substrate includes the steps of:
The method includes a step B, a step C, and a step D. The step A is a step of forming a predetermined organic film pattern on the insulating substrate for a back substrate using a photosensitive resin composition.
Is a step of digging the insulating substrate for a rear substrate to form a groove (a groove of the rear substrate) extending in a direction on the surface of the insulating substrate for the rear substrate. The step of embedding the conductor layer in the groove of the back substrate, the step D is a step of removing the organic film pattern, and the manufacturing steps of the back substrate are steps A to B, C, and C A method for manufacturing a gas discharge type display device, wherein the method proceeds in the order of D. 28. The method of manufacturing a gas discharge display device according to claim 27, wherein a back substrate cleaning step is provided between the step B and the step C. . 29. The method of manufacturing a gas discharge display device according to claim 27, wherein between the step C and the step D, the surface of the back substrate is polished to deposit on the organic film pattern. A method for manufacturing a gas discharge display device, comprising a step of removing a conductor layer. 30. The method of manufacturing a gas discharge type display device according to claim 1, wherein the step of manufacturing the back substrate includes the steps of:
Step B includes Step B, Step C, Step D, and Step E;
Is a step of forming a predetermined organic film pattern on the insulating substrate for the back substrate using a photosensitive resin composition, the process B is dug the insulating substrate for the back substrate,
Forming a groove (groove of the rear substrate) extending in a direction on the surface of the insulating substrate for the rear substrate;
Is a step of embedding a conductor layer in the “groove of the back substrate”, the step D is a step of removing the organic film pattern, and the step E is a step other than the “groove of the back substrate” by surface polishing. Removing the conductor layer deposited in the region of the above, wherein the manufacturing process of the back substrate proceeds in the order of the step A, the step B, the step D, the step C, and the step E;
A method for manufacturing a gas discharge type display device, comprising: