JP2002015677A - Gas discharge type display panel - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a gas discharge type display panel having good luminous efficiency and high brightness. SOLUTION: A convex section of dielectrics is formed near directly under a back substrate of a discharging gap (gap between a pair of display electrodes) of a display electrode of a front substrate, and a phosphor is formed on it. By this, an attenuation of an ultraviolet intensity can be prevented by shortening a distance from the ultraviolet produced in a main discharge to the phosphor. Moreover, the convex section of the dielectrics is formed almost directly under a back substrate of a contiguity gap (gap between the display electrode and an adjacent cell in a direction of an address electrode) of the display electrode. Then, an incorrect discharge which is caused from moving of an electrical charge of the adjacent cell, is prevented. By this, the contiguity gap is narrowed, an opening rate contributing to luminescence can be extended, and luminescence brightness is improved.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a gas discharge type display panel such as a plasma display panel, and more particularly to a display device of high luminance and high quality by improving the luminous efficiency of a phosphor formed on a rear substrate. The present invention relates to an AC-driven gas discharge display panel having a panel structure capable of performing the following.

[0002]

2. Description of the Related Art A gas discharge type display panel such as a plasma display performs display by self-emission, so that the display angle is wide and the display is easy to see. In addition, it has features such as being able to produce a thin type and realizing a large screen, and has begun to be applied to display devices of information terminal equipment and high-definition television receivers. Plasma displays are roughly classified into a DC drive type and an AC drive type. Among them, the AC drive type plasma display has a high luminance due to the memory effect of the dielectric layer covering the electrodes, and has a practically usable life due to the formation of the protective layer and the like. As a result, AC driven plasma displays have been put to practical use as versatile video monitors. This example is shown in FIG. 3 and FIG.
Shown in FIG. 3 is a perspective view showing a structure of a practically used plasma display panel. In this figure, the front substrate 1 is shown separated from the rear substrate 2 and the discharge space region 3 for easy viewing. The front substrate 1 has an I
A display electrode 6 made of a transparent conductive material such as TO (Indium Tin Oxide) or tin oxide (SnO2), a bus electrode 7 made of a low-resistance material, a dielectric layer 8 made of a transparent insulating material, magnesium oxide (MgO), etc. It has a structure in which a protective layer 9 made of a material is formed. The rear substrate 2 has a structure in which an address electrode 10, a barrier rib 13, and a phosphor layer 12 are formed on a rear glass substrate 5. The discharge space region 3 is formed between the front substrate 1 and the rear substrate 2 by bonding the front substrate 1 and the rear substrate 2 such that the display electrodes 6 and the address electrodes 10 are substantially orthogonal to each other. FIG. 4 is a sectional view of the gas discharge type display device shown in FIG. 4A shows a cross section parallel to the address electrode 10, and FIG. 4B shows an AB cross section of FIG. 4A perpendicular to the address electrode 10. This gas discharge type display panel has a structure including a large number of cells which are pixels partitioned by barrier ribs 13.

In this gas discharge type display panel, display is performed by a driving method described below. First, by applying an AC voltage to the display electrodes 6 provided on the front substrate 1 and the address electrodes 10 of the rear substrate 2, an address discharge is generated only in the cells to be displayed, and generally on the protective layer 9 of the front substrate 1. It accumulates charges called wall charges. In the cell in which the address discharge has occurred, the sum of the voltage of the wall charge formed on the protective layer 9 and the AC voltage for main discharge applied between the display electrodes after the address discharge reaches the main discharge start voltage. Occurs. The ultraviolet light generated by this main discharge causes the phosphor layer 12
Is emitted, and light from the phosphor layer 12 is transmitted through the front substrate 1 to perform display. On the other hand, in the cells in which the address discharge has not been performed, no wall charge is formed, and thus no main discharge occurs even when the AC voltage for main discharge is applied. That is, in the gas discharge type display panel, a cell to emit light is selected based on the presence or absence of wall charges.

Referring to FIG. 5, an example of a manufacturing process of the conventional gas discharge type display device shown in FIGS. 3 and 4 will be briefly described. First, a manufacturing process of the front substrate 1 will be described. The front glass substrate 4 made of soda lime glass or the like is washed, and a transparent electrode pattern 6 is formed on one main surface thereof. When ITO is used as the transparent electrode material, the formation of the transparent electrode pattern 6 is performed by using the sputtering method or the like.
It is often performed by a known photo-etching method after forming O. On the other hand, when SnO2 is used, the transparent electrode pattern 6 is formed by a chemical vapor deposition method (Chemical Vapor Deposition) using a lift-off method.
ion, CVD), and soda lime glass used for the front glass substrate is often coated with silica or the like. For the bus electrode 7, a printed film using a silver (Ag) paste or a copper (Cu) film is
r) A Cr / Cu / Cr laminated film sandwiched by films is often used. The former is formed by a printing method using a screen, and the latter is formed by performing well-known photoetching after film formation. Transparent electrode 6 and bus electrode 7
A transparent dielectric layer 8 is formed by printing a dielectric paste containing lead glass as a main component, followed by drying and sintering, on the front glass substrate 4 on which is formed. A sealing layer 16 for performing vacuum sealing is formed on the front glass substrate 4 on which the dielectric layer 8 is formed by a printing method, and further, an MgO layer is formed by a vacuum deposition method or the like. Thus, the front substrate 1 is completed. Next, a manufacturing process of the back substrate 2 will be described. The back glass substrate 5 made of soda lime glass or the like is washed, and the address electrode pattern 10 is formed on one main surface by a thick film printing method using a silver (Ag) paste.
Is formed by thick film printing and baking. Address electrode 1
The barrier ribs 13 are formed by repeating thick film printing and drying on the rear glass substrate 5 on which 0 is formed until a predetermined height is reached, followed by baking. Next, the red, green, and blue phosphor layers 12 that are separately applied to the respective discharge cells by the thick film printing method are formed, thereby completing the rear substrate 2.

[0005] The completed front substrate 1 and rear substrate 2 are assembled while positioning. An exhaust pipe (not shown) for exhausting and introducing a sealed gas is attached, and thereafter, the substrates are sealed and the exhaust pipe is fixed in a sealing furnace. The seal between the substrates is melted and fixed by the seal layer 16 (low-melting glass, frit) formed in the substrate process. Next, a panel is attached to the exhaust device, and the panel is evacuated with an exhaust pipe while baking. Thereafter, a gas mixture of, for example, neon (Ne) and xenon (Xe) is sealed, and the exhaust pipe is chipped off and aged, thereby completing the conventional gas discharge type display panel shown in FIGS. . A conventional example of the gas discharge type display panel shown here is, for example, a flat panel display 1996 (edited by Nikkei Micro Devices,
1995), pp. 208-215.

[0006]

In the above prior art,
Red, green and blue phosphors are formed between barrier ribs on the rear substrate to a substantially uniform thickness by a thick film printing method. Ultraviolet light generated by a main discharge in which an AC voltage is applied to a display electrode formed on the front substrate causes the phosphor to emit light, and light from the phosphor is transmitted through the front substrate to perform display. The light emission intensity of the phosphor is substantially proportional to the intensity of ultraviolet light generated by the main discharge. When the distance to the phosphor is increased, the intensity of the ultraviolet light generated by the main discharge decreases in inverse proportion to the square of the distance. It was also found that the emission luminance of the phosphor was lower near the discharge gap (gap between the pair of display electrodes) of the display electrodes on the front substrate and the rear substrate than in the portion near the bus electrodes.
This is because the distance from the ultraviolet light generated by the main discharge to the phosphor becomes long. Also, the adjacent gap of the display electrode (gap between the display electrode and the next cell in the address electrode direction)
Requires a sufficient interval to prevent erroneous discharge due to movement of the charge of the next discharging cell, but this gap does not contribute to light emission, and a sufficient gap is employed to prevent erroneous discharge. Then, the aperture ratio contributing to light emission becomes narrow, and as a result, the luminance decreases.

The present invention has been made to solve the above problems, and has as its object to provide a gas discharge type display panel having good luminous efficiency and high luminance. In particular,
Protrusions are provided on the dielectric layer formed on the rear substrate to suppress the attenuation of ultraviolet light intensity, improve the emission intensity of the phosphor, and reduce the movement of charges in the adjacent cells to narrow the adjacent gap to emit light. It is an object of the present invention to provide a gas discharge type display panel having a suitable structure with a high efficiency and a widened aperture ratio and improved luminance.

[0008]

According to the present invention, a discharge gap (a gap between a pair of display electrodes) of a display electrode on a front substrate is provided.
Form one of the above objects by forming a convex part of a dielectric just below the back substrate and forming a phosphor on it, and shortening the distance from the ultraviolet ray generated by the main discharge to the phosphor. It is. In addition, a convex portion of a dielectric is formed just below the adjacent gap of the display electrode (gap between the display electrode and the adjacent cell in the address electrode direction) to the rear substrate, and the charge of the adjacent discharging cell is reduced. The other of the above objects is achieved by preventing the erroneous discharge due to the movement, thereby narrowing the adjacent gap and increasing the aperture ratio contributing to light emission.

However, if these convex dielectrics are higher than the height of the barrier rib separating the discharge cells in the direction of the display electrode,
Since the display electrode cannot be separated from the adjacent discharge cell, and discharge occurs in the entire display electrode direction, these convex dielectrics need to be lower than the height of the barrier rib separating the discharge cell in the display electrode direction. In addition, the convex dielectric formed immediately under the adjacent gap of the display electrode (the gap between the display electrode and the cell adjacent to the address electrode in the direction of the address electrode) on the rear substrate is used to transfer charges from the adjacent cell in the direction of the address electrode. It is better to be as high as possible to prevent movement, but a space necessary for evacuation and introduction of discharge gas in the cell is required. As the convex dielectric formed immediately below the adjacent gap is higher, the interval between the adjacent gaps can be narrowed, and the aperture ratio contributing to light emission can be increased, thereby improving the luminance. On the other hand, the area immediately below the discharge gap of the display electrode (gap between the pair of display electrodes) to the rear substrate is the main discharge space. When the convex dielectric is formed, the main discharge space becomes narrow, and discharge becomes difficult. Therefore, it is preferable that the protrusion dielectric is lower than the protrusion dielectric formed immediately below the adjacent gap. In other words, the protrusion dielectric near the discharge gap of the display electrode (gap between the pair of display electrodes) directly below the back substrate should be able to shorten the distance from the ultraviolet rays generated by the main discharge to the phosphor, and the height of the barrier ribs Is desirably less than one-third.

[0010]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS First Embodiment A first embodiment of the present invention will be described with reference to FIG. Figure 1
1 is a sectional view showing a part of a gas discharge type display device to which the present invention is applied. FIG. 1A shows an address electrode 10.
(B) is a cross section perpendicular to the address electrode 10, and FIG. (C) is a cross section perpendicular to the address electrode 10. FIG. C) shown in
D section is shown.

In the drawing, 1 is a front substrate, 2 is a rear substrate, 3 is a discharge space region, 4 is a front glass substrate, and 5 is a front glass substrate.
Is a rear glass substrate, 6 and 6 'are display electrodes made of a transparent conductive material, 7 and 7' are bus electrodes provided so as to overlap a part of the display electrodes, and 8 is a dielectric formed on the front substrate. 9, a protective layer made of MgO, 10 an address electrode formed on the back substrate, 11 a dielectric layer formed on the back substrate, 12 a phosphor layer, and 13 a main discharge space. Barrier ribs, 14 a convex dielectric layer formed on the rear substrate, and 15 a main discharge space where a main discharge for display occurs. In general, in the gas discharge type display device, one of the display electrodes 6 and 6 'is a common electrode common to all display cells, and the other is a scan electrode unique to the display cell. In FIG. 1, the display electrode 6 is a scan electrode, and the display electrode 6 'is a common electrode.

Next, an example of the manufacturing method of the present embodiment will be described.

First, a method for manufacturing the front substrate 1 will be described.

(1) A glass plate such as soda lime glass as the front glass substrate 4 is washed with a neutral detergent or the like.

(2) A tin oxide (SnO 2) film or an ITO (Indium Tin) film is formed on the cleaned front glass substrate 4 by a film forming method such as a sputtering method or an electron beam evaporation method.
Oxide) transparent conductive film such as a film having a thickness of 0.1 to
It is formed to have a thickness of 0.5 μm. Next, the transparent conductive film is processed by a well-known photoetching method to form an electrode pattern serving as the display electrodes 6 and 6 ′. The pattern size of the display electrode may be determined according to the size of the discharge cell to be manufactured.

(3) A copper (Cu) film is sandwiched with a chromium (Cr) film on the front glass substrate 4 on which the display electrodes 6 and 6 'are formed by using a film forming technique such as a sputtering method or an electron beam evaporation method. The formed Cr / Cu / Cr laminated film is formed. The thickness of the chromium (Cr) film in contact with the front glass substrate 4 on which the display electrodes 6 and 6 'are formed is 0.1 to 1 [mu] m, and the thickness of the copper (Cu) film thereon is 1 to 3 [mu] m. The chromium (Cr) film was formed to have a thickness of 0.1 to 1.5 μm. Then, using a well-known photo etching method,
After processing the Cr / Cu / Cr laminated film, the display electrodes 6
An electrode pattern is formed so as to overlap with a part of 6 ′, and is used as bus electrodes 7 and 7 ′. The thickness of the Cu film and the pattern size of the bus electrode may be determined according to the resistance value required for the bus electrode. The display electrode and the bus electrode are made of tin oxide (Sn oxide) by a film forming method such as a sputtering method or an electron beam evaporation method.
O2) film and ITO (Indium Tin Oxid)
e) A transparent conductive film such as a film and copper (C)
u) A Cr / Cu / Cr laminated film in which a film is sandwiched is continuously formed, and the Cr / Cu / Cr laminated film is processed by a photo-etching method using a bus electrode pattern. It can also be formed by processing a transparent conductive film by a photoetching method using a pattern.

(4) Solid printing is performed at predetermined locations on the bus electrodes 7 and 7 'by a screen printing method using a paste containing lead oxide as a main component, and then fired with a predetermined profile. The dielectric layer 8 having a thickness of 0.01 to 0.05 mm is formed. If these film thicknesses cannot be obtained by one printing, printing and baking may be repeated a plurality of times.

(5) An MgO film is formed at a predetermined position by using a film forming method such as a sputtering method or an electron beam evaporation method, and the protective layer 9 is formed. The thickness of the MgO film needs to be determined according to the life required for the gas discharge type display panel, and a typical value is 0.3 to 1 μm. Through the above steps, the front substrate 1 is completed.

Next, a method of manufacturing the rear substrate 2 will be described.

(1) A glass plate such as soda lime glass as the rear glass substrate 5 is washed with a neutral detergent or the like.

(2) A chromium (Cr) film sandwiched between a copper (Cu) film and a chromium (Cr) film by using a film forming method such as a sputtering method or an electron beam evaporation method on the cleaned back glass substrate 5.
A Cu / Cr laminated film is formed. The thickness of the chromium (Cr) film in contact with the back glass substrate 5 is 0.1 to 1 μm, the thickness of the copper (Cu) film thereon is 1 to 3 μm, and the thickness of the chromium (Cr) film thereon is It was formed to have a thickness of 0.1 to 1.5 μm. Then, the Cr / Cu / Cr laminated film is processed by using a well-known photo-etching method, and the address electrode 1 is processed.
Set to 0. The thickness of the Cu film and the pattern size of the address electrode may be determined according to the resistance value required for the address electrode.

(3) Solid printing is performed on a predetermined location on the address electrode 10 by a screen printing method using a paste containing lead oxide as a main component, followed by baking with a predetermined profile to obtain a film thickness. Forms a dielectric layer 11 having a thickness of 0.01 to 0.05 mm. If these film thicknesses cannot be obtained by one printing, printing and baking may be repeated a plurality of times.

(4) Using a paste containing lead oxide as a main component at a predetermined position on the dielectric layer 11, pattern printing is performed by a screen printing method, followed by firing with a predetermined profile to form a projection. The dielectric layer 14 having a part height of 0.02 to 0.15 mm is formed. If these film thicknesses cannot be obtained by one printing, printing and baking may be repeated a plurality of times.

(5) A rib material having a thickness of 0.1 to 0.2 mm is printed in a predetermined place on the rear glass substrate 5 by using a rib paste mainly composed of lead oxide by a screen printing method. Is applied. If these film thicknesses cannot be obtained by one printing, printing may be repeated a plurality of times. At this time, for example, a black material may be used only for the uppermost layer of the rib, and a white material may be used for the other layers. in this way,
It may be changed to a paste that suits the purpose. The rib paste may be formed by a single method using a blade coating method or a roll coating method.

(6) A predetermined photosensitive film pattern is formed by laminating a photosensitive film on the back glass substrate 5 on which the rib material has been formed and performing well-known exposure, development, washing and drying.

(7) By performing a sandblasting process, a portion of the rib material that is not covered with the photosensitive film on the rear glass substrate 5 is removed, thereby forming a “groove” serving as the main discharge space 15. After peeling off the photosensitive film, it is baked with a predetermined profile to form the barrier ribs 13.

(8) The green, blue and red phosphors 12 are applied to the surface of the inner wall of the "groove" to be the main discharge space 15 by using a dispenser method, a spray method, a screen printing method or the like. .

(9) A frit glass pattern is formed using a dispenser method, dried at 150 ° C.,
A heat treatment at about 450 ° C. is performed to form a seal layer 16 (not shown) for performing vacuum sealing. By this heat treatment, the organic substances used when applying the phosphor are simultaneously thermally decomposed and removed.

Through the above steps, the back substrate 2 having the barrier ribs 13 for separating the discharge space and the phosphor layer 12 is completed.

The front substrate 1 and the rear substrate 2 completed in each of the above steps are aligned and subjected to a heat treatment at 400 to 500 ° C. to fix these substrates. in this case,
The display electrodes 6 and bus electrodes 7 provided on the front substrate 1 are orthogonal to the address electrodes 10 provided on the rear substrate 5. In addition,
A chip tube (not shown) is attached to the rear substrate 2 for exhaust and gas introduction after panel assembly. next,
The main discharge space 15 formed between the front substrate 1 and the rear substrate 2 is evacuated through a chip tube provided on the rear substrate, and a Ne gas containing, for example, 3 to 10% of Xe gas is introduced into the main discharge space 15. And the pressure in the main discharge space 15 becomes 35-
Adjust to 70 kPa. Next, the gas discharge type display panel shown in FIG. 1 is completed by performing chip-off by local heating of the chip tube.

Table 1 shows an example of various dimensions of the gas discharge type display panel prepared as described above. Also, the convex dielectric 1
Table 2 shows the emission luminance and discharge voltage when the height of No. 4 and the adjacent gap were changed. The discharge gap and the cell size were made constant, and the display electrode width and the adjacent gap were varied. Since the emission luminance increases when the discharge voltage is increased, the discharge voltage is set to 170 V so that the gas discharge display panel can emit light stably. However, in Table 2, No. In Nos. 15 to 20, since stable discharge was not performed at this voltage, a discharge voltage at which stable light emission was possible was evaluated.

[0032]

[Table 1]

[0033]

[Table 2]

As shown in Table 1, the fired barrier ribs 13
Was 0.15 mm in height. On the other hand, the height of the convex dielectric 14 formed immediately below the rear substrate 2 of the adjacent gap of the display electrode 6 on the front substrate 1 (gap between the display electrode with the cell adjacent to the address electrode 10). Is 0.13
In the case of not less than mm, the height of the barrier ribs 13 is equal to or greater than the height of the barrier ribs 13 when the phosphor 12 is filled in the "grooves" between the barrier ribs. In addition, it becomes difficult to evacuate the cells in the main discharge space 15 and to introduce the discharge gas.

No. 2 in Table 2 Reference numerals 1 to 10 denote convex dielectrics 1 formed in the vicinity of a discharge gap (a gap between a pair of display electrodes) of the display electrodes 6 of the front substrate 1 immediately below the rear substrate 2.
4 is constant, and a convex dielectric formed near the gap immediately adjacent to the display electrode 6 of the front substrate 1 (gap between the display electrode and the cell adjacent to the cell in the direction of the address electrode 10) immediately below the rear substrate 2. 14 is a gas discharge type display panel in which the height and the adjacent gap are changed. No. in Table 2 Reference numeral 21 denotes a gas discharge type display panel which is the closest to the conventional example without forming the convex dielectric 14 on the dielectric of the back substrate 2. In this gas discharge type display panel (No. 21 in Table 2), the width of the display electrode 6 is 0.25 mm.

The height of the convex dielectric 14 formed immediately below the rear substrate 2 of the gap adjacent to the display electrode 6 on the front substrate 1 (gap between the display electrode and an adjacent cell in the direction of the address electrode 10) is determined. Gas discharge type display panel whose height was increased and the adjacent gap was narrowed (No. 10 in Table 2)
The gas discharge type display panel (N in Table 2) has a high light emission luminance because the aperture ratio contributing to light emission can be widened, and is close to the conventional example.
o. The light emission luminance was about 2.5 times as high as that of 21), and good results were obtained. This means that for the same input power,
This means that the luminous efficiency has been improved about 2.5 times. On the other hand, the gap between the display electrodes 6 on the front substrate 1 (the address electrodes 10
A gas discharge type in which the height of the convex dielectric 14 formed immediately below the back substrate 2 (the gap between the display electrodes with the adjacent cells in the direction) and the adjacent gap is widened to prevent erroneous discharge In the display panel (No. 1 in Table 2), the aperture ratio contributing to light emission was narrowed, and the light emission luminance was reduced. Compared to a gas discharge type display panel (No. 21 in Table 2) close to the conventional example,
The performance improvement was about 1.2 times.

No. 2 in Table 2 11 to 20 are front substrates 1
The height and the adjacent gap of the convex dielectric 14 formed immediately below the rear electrode 2 of the adjacent gap (the gap between the display electrode and the cell adjacent to the address electrode 10) of the display electrode 6 are constant; This is a gas discharge type display panel in which the height of a convex dielectric 14 formed near the discharge gap (gap between a pair of display electrodes) of the display electrodes 6 of the front substrate 1 and directly below the rear substrate 2 is changed.

The height of the convex dielectric 14 formed immediately below the discharge gap (gap between the pair of display electrodes) of the display electrodes 6 of the front substrate 1 and the rear substrate 2 is equal to the height of the barrier ribs 13.
In the gas discharge type display panel (No. 11 to 15 in Table 2) lower than one third of the height (0.15 mm), the discharge voltage did not increase and the emission luminance increased. Discharge gap of display electrode 6 on front substrate 1 (gap between a pair of display electrodes)
No. 16 of the gas discharge display panel (No. 16 in Table 2) in which the height of the convex dielectric 14 formed immediately below the rear substrate 2 of the No. 2 is higher than one third of the height (0.15 mm) of the barrier rib 13.
20) cannot be put to practical use because the main discharge space 15 is narrowed, the discharge voltage is increased, and the usage limit of the high breakdown voltage semiconductor used in the drive circuit is exceeded. Also, because the discharge voltage rises,
Although the light emission luminance was increased, the light emission efficiency, which indicates the light emission luminance per input power, did not improve much.

In the present embodiment, Cu and Cr are used as the materials for the bus electrodes 7 and 7 'and the address electrode 10. However, metals such as Al, Ni, W, Mo, and Ag and alloys thereof may be used. I can't tell. In addition, although a sputtering method or an electron beam evaporation method is used as a method for forming the material forming the bus electrode 7 and the address electrode 10, there is no limitation on the formation method, and a plating method, a resistance heating evaporation method, a thick film printing method, and the like. May be used. The transparent conductive material forming the display electrode 6 is not limited to tin oxide or ITO. Further, the method for forming the same is not limited to the sputtering method or the electron beam evaporation method, and a chemical vapor reaction method, a sol-gel method, or the like may be used. The dielectric layers 8, 11, and 14 are formed using glass paste containing lead oxide as a main component, but the material is not limited to this.
Although the thick film printing method is used as a method for forming the dielectric layers 8, 11, and 14, there is no limitation on the forming method, and a sputtering method, a chemical vapor reaction method, a blade method, a spray method, and a thermosetting method. May be used. Although MgO is used for the protective layer 9, it is sufficient that the sputtering rate for the discharge gas is low and the secondary electron emission coefficient is high.
rO, Y2O3, or a mixture thereof may be used. In the present embodiment, Ne and Xe are used as discharge gases.
However, the present invention is not limited to these.

In the embodiment of the present invention, soda lime glass is used as the back glass substrate 5, but another glass plate or an electrically insulating plate such as a ceramic substrate may be used.

Embodiment 2 of the Invention A first embodiment of the present invention will be described with reference to FIG. FIG.
1 is a sectional view showing a part of a gas discharge type display device to which the present invention is applied. FIG. 2A shows an address electrode 10.
(B) is a cross section perpendicular to the address electrode 10, and FIG. (C) is a cross section perpendicular to the address electrode 10. FIG. C) shown in
D section is shown.

In the drawing, 1 is a front substrate, 2 is a rear substrate, 3 is a discharge space region, 4 is a front glass substrate, and 5 is a front glass substrate.
Is a rear glass substrate, 6 and 6 'are display electrodes made of a transparent conductive material, 7 and 7' are bus electrodes provided so as to overlap a part of the display electrodes, and 8 is a dielectric formed on the front substrate. 8 ′ denotes an electrode base dielectric layer formed on the front substrate,
9 is a protective layer made of MgO, 10 is an address electrode formed on the back substrate, 11 is a dielectric layer formed on the back substrate, 11 'is an electrode base dielectric layer formed on the back substrate,
12 is a phosphor layer, 13 is a barrier rib for limiting the main discharge space, 14 is a convex dielectric layer formed on the rear substrate, and 1 is
Reference numeral 5 denotes a main discharge space where a main discharge for display occurs.
Generally, in a gas discharge type display device, one of the display electrodes 6 and 6 ′ is a common electrode common to all display cells,
The other is used as a scan electrode unique to the display cell. In FIG. 2, the display electrode 6 is a scan electrode, and the display electrode 6 'is a common electrode.

Next, an example of the manufacturing method of the present embodiment will be described.

First, a method for manufacturing the front substrate 1 will be described.

(1) A glass plate such as soda lime glass as the front glass substrate 4 is washed with a neutral detergent or the like.

(2) A silicon oxide (SiO 2) film electrode base dielectric layer 8 ′ having a film thickness of 0.1 mm is formed on the cleaned front glass substrate 4 by a film forming method such as a sputtering method or an electron beam evaporation method. It is formed to have a thickness of 1 to 1.5 μm. further,
A tin oxide (SnO2) film or an ITO (Indium Ti) film is formed by a film forming method such as a sputtering method or an electron beam evaporation method.
n Oxide) film or other transparent conductive film having a thickness of 0.1 to
It is formed to have a thickness of 0.5 μm. Next, the transparent conductive film is processed by a well-known photoetching method to form an electrode pattern serving as the display electrodes 6 and 6 ′. The pattern size of the display electrode may be determined according to the size of the discharge cell to be manufactured.

(3) A copper (Cu) film is sandwiched with a chromium (Cr) film on the front glass substrate 4 on which the display electrodes 6 and 6 'are formed, using a film forming method such as a sputtering method or an electron beam evaporation method. The formed Cr / Cu / Cr laminated film is formed. The thickness of the chromium (Cr) film in contact with the front glass substrate 4 on which the display electrodes 6 and 6 'are formed is 0.1 to 1 [mu] m, and the thickness of the copper (Cu) film thereon is 1 to 3 [mu] m. The chromium (Cr) film was formed to have a thickness of 0.1 to 1.5 μm. Then, using a well-known photo etching method,
After processing the Cr / Cu / Cr laminated film, the display electrodes 6
An electrode pattern is formed so as to overlap with a part of 6 ′, and is used as bus electrodes 7 and 7 ′. The thickness of the Cu film and the pattern size of the bus electrode may be determined according to the resistance value required for the bus electrode. The display electrode and the bus electrode are made of tin oxide (Sn oxide) by a film forming method such as a sputtering method or an electron beam evaporation method.
O2) film and ITO (Indium Tin Oxid)
e) A transparent conductive film such as a film and copper (C)
u) A Cr / Cu / Cr laminated film in which a film is sandwiched is continuously formed, and the Cr / Cu / Cr laminated film is processed by a photo-etching method using a bus electrode pattern. It can also be formed by processing a transparent conductive film by a photoetching method using a pattern.

(4) Solid printing is performed at predetermined locations on the bus electrodes 7 and 7 'by a screen printing method using a paste containing lead oxide as a main component, followed by baking with a predetermined profile. The dielectric layer 8 having a thickness of 0.01 to 0.05 mm is formed. If these film thicknesses cannot be obtained by one printing, printing and baking may be repeated a plurality of times.

(5) An MgO film is formed at a predetermined place by using a film forming technique such as a sputtering method or an electron beam evaporation method, and the protective layer 9 is formed. The thickness of the MgO film needs to be determined according to the life required for the gas discharge type display panel, and a typical value is 0.3 to 1 μm. Through the above steps, the front substrate 1 is completed.

Next, a method of manufacturing the rear substrate 2 will be described.

(1) A glass plate such as soda lime glass to be used as the back glass substrate 5 is washed with a neutral detergent or the like.

(2) On the cleaned back glass substrate 5, a silicon oxide (SiO 2) film electrode base dielectric layer 11 ′ having a film thickness of 0.1 mm is formed by a film forming method such as a sputtering method or an electron beam evaporation method. It is formed to have a thickness of 1 to 1.5 μm. Silver (A
After the pattern is printed by a screen printing method using paste containing g) as a main component, the paste is fired with a predetermined profile to form the address electrode 10 having a thickness of 0.01 to 0.02 mm. . The thickness of the Ag film and the pattern size of the address electrode may be determined by the resistance value required for the address electrode.

(3) Using a paste mainly composed of lead oxide at a predetermined place on the address electrode 10, solid printing is performed by a screen printing method, and then baked with a predetermined profile to form a film. Forms a dielectric layer 11 having a thickness of 0.01 to 0.05 mm. If these film thicknesses cannot be obtained by one printing, printing and baking may be repeated a plurality of times.

(4) Using a paste containing lead oxide as a main component at a predetermined location on the dielectric layer 11, pattern printing is performed by a screen printing method, followed by firing with a predetermined profile to form a projection. The dielectric layer 14 having a part height of 0.02 to 0.15 mm is formed. If these film thicknesses cannot be obtained by one printing, printing and baking may be repeated a plurality of times.

(5) A rib material having a thickness of 0.1 to 0.2 mm is printed in a predetermined place on the rear glass substrate 5 using a rib paste containing lead oxide as a main component by a screen printing method. Is applied. If these film thicknesses cannot be obtained by one printing, printing may be repeated a plurality of times. At this time, for example, a black material may be used only for the uppermost layer of the rib, and a white material may be used for the other layers. in this way,
It may be changed to a paste that suits the purpose. The rib paste may be formed by a single method using a blade coating method or a roll coating method.

(6) A predetermined photosensitive film pattern is formed by laminating a photosensitive film on the back glass substrate 5 on which the rib material has been formed and performing well-known exposure, development, washing and drying.

(7) By performing a sandblasting process, a portion of the rib material which is not covered with the photosensitive film on the rear glass substrate 5 is removed to form a “groove” serving as the main discharge space 15. After peeling off the photosensitive film, it is baked with a predetermined profile to form the barrier ribs 13.

(8) The green, blue and red phosphors 12 are applied to the surface of the inner wall of the "groove" to be the main discharge space 15 by using a dispenser method, a spray method, a screen printing method or the like. .

(9) A frit glass pattern is formed using a dispenser method, dried at 150 ° C.
A heat treatment at about 450 ° C. is performed to form a seal layer 16 (not shown) for performing vacuum sealing. By this heat treatment, the organic substances used when applying the phosphor are simultaneously thermally decomposed and removed.

Through the above steps, the rear substrate 2 having the barrier ribs 13 for separating the discharge space and the phosphor layer 12 is completed.

The front substrate 1 and the rear substrate 2 completed in each of the above steps are aligned, and these substrates are fixed by performing a heat treatment at 400 to 500 ° C. in this case,
The display electrodes 6 and bus electrodes 7 provided on the front substrate 1 are orthogonal to the address electrodes 10 provided on the rear substrate 5. In addition,
A chip tube (not shown) is attached to the rear substrate 2 for exhaust and gas introduction after panel assembly. next,
The main discharge space 15 formed between the front substrate 1 and the rear substrate 2 is evacuated through a chip tube provided on the rear substrate, and a Ne gas containing, for example, 3 to 10% of Xe gas is introduced into the main discharge space 15. And the pressure in the main discharge space 15 becomes 35-
Adjust to 70 kPa. Next, by performing chip-off by local heating of the chip tube, the gas discharge type display panel shown in FIG. 2 is completed.

The gas discharge type display panel manufactured in this manner has an electrode base dielectric layer 8 ′,
The diffusion of the alkali metal component from a glass plate such as soda lime glass was prevented, and the increase in the electrical resistance of the transparent electrode was reduced. Further, by forming the electrode base dielectric layer 11 ', diffusion of the alkali metal component from a glass plate such as soda lime glass could be prevented, and migration of the address electrode 10 containing Ag as a main component could be reduced. As for the characteristics of the gas discharge type display panel produced in this way, the same results as in the first embodiment were obtained.

In this embodiment, Cu and Cr are used as the materials of the bus electrodes 7 and 7 ′.
Mo and Ag metals and their alloys may be used. Although Ag is used as the material of the address electrode 10, metals such as Cu and Cr, Al, Ni, W, and Mo, and alloys thereof may be used. Although a sputtering method or an electron beam evaporation method is used as a method for forming the material forming the bus electrode 7, there is no limitation on the formation method, and a plating method, a resistance heating evaporation method, a thick film printing method, or the like may be used. In addition, a thick film printing method is used as a method for forming the material forming the address electrode 10, but the forming method is not limited, and a plating method, a resistance heating evaporation method, a sputtering method, an electron beam evaporation method, or the like may be used. good. The transparent conductive material forming the display electrode 6 is not limited to tin oxide or ITO. Further, the method for forming the same is not limited to the sputtering method or the electron beam evaporation method, and a chemical vapor reaction method, a sol-gel method, or the like may be used. The dielectric layers 8, 11, and 14 are formed using glass paste containing lead oxide as a main component, but the material is not limited to this. Although the thick film printing method is used as a method for forming the dielectric layers 8, 11, and 14, there is no limitation on the forming method, and a sputtering method, a chemical vapor reaction method, a blade method, a spray method, and a thermosetting method. May be used. Further, as the protective layer 9, Mg
Although O is used, it is only necessary that the sputtering rate for the discharge gas is low and the secondary electron emission coefficient is high. In addition to MgO, CaO, SrO, Y2O3, or a mixture thereof may be used. In this embodiment, a mixed gas of Ne and Xe is used as the discharge gas, but the present invention is not limited to these.

In the embodiment of the present invention, soda lime glass is used as the back glass substrate 5, but other electrically insulating plate materials such as a glass plate and a ceramic substrate may be used.

[0065]

According to the present invention, it is possible to improve the luminous efficiency of the phosphor by forming a projection on the dielectric of the back substrate, and to provide a high performance gas discharge type display panel. can get.

[Brief description of the drawings]

FIG. 1 is a cross-sectional view showing a first embodiment of the present invention.

FIG. 2 is a sectional view showing a second embodiment of the present invention.

FIG. 3 is a perspective view showing a conventional example of a gas discharge type display panel.

FIG. 4 is a sectional view showing a conventional example of a gas discharge type display panel.

FIG. 5 is a process flow chart showing an example of a method for manufacturing a conventional gas discharge type display device.

[Description of Signs] 1. Front substrate, 2. Back substrate, 3. Discharge space region, 4.
Front glass substrate, 5: rear glass substrate, 6: display electrode (scan electrode), 6 ': display electrode (common electrode), 7,
7 ': bus electrode, 8: dielectric layer formed on front substrate,
8 ': an electrode base dielectric layer formed on the front substrate; 9: a protective layer (MgO); 10: address electrode; 11: a dielectric layer formed on the back substrate; 11': an electrode base dielectric formed on the back substrate Layer, 12: phosphor layer, 13: barrier rib, 14
... a convex dielectric layer formed on the back substrate, 15 ... main discharge space, 16 ... a seal layer.

 ──────────────────────────────────────────────────続 き Continued on the front page (72) Inventor Yasuhiko Nakayama 292 Yoshida-cho, Totsuka-ku, Yokohama-shi, Kanagawa Prefecture Inside the New Display Business Promotion Center of Hitachi, Ltd. No. 292 Hitachi Display Co., Ltd. New Display Business Promotion Center (72) Inventor ▲ Mochi ▼ Kazuhiro Ta 292 Yoshida-cho, Totsuka-ku, Yokohama-shi, Kanagawa Prefecture Hitachi Display Co., Ltd. New Display Business Promotion Center F-term (reference) 5C040 FA01 GB03 GB14 GD01 GD10 MA03 5C094 AA10 AA48 BA31 CA19 DA13 DA15 DB04 EA04 EA05 EA10 EB02 EC04 FA01 FA02 FB15 GB10

Claims (6)

[Claims] At least one device for generating a discharge for display
A front substrate composed of at least one pair of electrode pairs and a dielectric layer formed so as to cover the electrode pairs and a protective layer for protecting the dielectric layers, and an address electrode for selecting at least display pixels and In a gas discharge type display panel in which a dielectric layer formed so as to cover the electrodes, a barrier rib defining a space between the front substrate and the rear substrate and forming a cell, and a rear substrate provided with a phosphor layer are bonded to each other, A gas discharge type display panel, wherein a projection is provided on a dielectric layer formed on the rear substrate. 2. The gas discharge type display panel according to claim 1, wherein the projection of the dielectric layer formed on the back substrate has one projection.
A gas discharge type display panel comprising at least one or more cells provided in a cell. 3. The gas discharge display panel according to claim 1, wherein at least a projection of the dielectric layer formed on the rear substrate corresponds to a discharge gap or an adjacent gap of the electrode pair formed on the front substrate. A gas discharge type display panel provided at a position on a rear substrate. 4. The gas discharge type display panel according to claim 1, wherein a projection of the dielectric layer formed on the back substrate is lower than a height of the barrier rib. 5. The gas discharge type display panel according to claim 1, wherein the projection of the dielectric layer formed on the rear substrate has a projection corresponding to a discharge gap of the electrode pair formed on the front substrate. A gas discharge type display panel characterized in that a convex portion at a position corresponding to an adjacent gap is larger than a portion. 6. The gas discharge type display panel according to claim 1, wherein a protrusion at a position corresponding to a discharge gap of the electrode pair formed on the front substrate is one third of a height of the barrier rib. A gas discharge type display panel characterized by being lower.