JPH09277161A - Carrying hand for object to be polished - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a carrying hand for an object to be polished which can facilitate position adjusting work between a hand and a top ring during receiving and delivering a semiconductor wafer and prevent an excessive load from being given to the joint part of a robot arm provided with the hand. SOLUTION: The top surface of this hand is provided with a recessed storage part 11 for storing disc-shaped semiconductor wafers. 8 dampers 21 consisting of a flexible plate respectively are formed at prescribed intervals around the storage part 11. The damper 21 protrudes upwards from the top surface of the hand 1, and the surface is inclined by a prescribed angel to the top surface of the hand 1. One edge of the storage part 11 side of the damper 21 is made a guide edge 23 at the time of storing the semiconductor wafers in the storage part 11.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a hand for transporting a polishing object used to transfer a polishing object to and from a top ring.

[0002]

2. Description of the Related Art Conventionally, in a process of manufacturing a semiconductor wafer, a polishing apparatus has been used to make the surface of the semiconductor wafer flat and mirror-finished.

[0003] This type of polishing apparatus has a turntable and a top ring that rotate at independent rotation speeds, and the surface of a semiconductor wafer held on the lower surface of the top ring is brought into contact with a polishing surface provided on the turntable. And polishing while supplying the polishing liquid.

By the way, the delivery of the semiconductor wafer to the top ring, that is, the delivery of the semiconductor wafer before polishing to the top ring and the receipt of the semiconductor wafer after polishing from the top ring are attached to the tip of the arm of the robot. It was done by hand.

FIG. 12 is a view showing a semiconductor wafer delivery state between the top ring and the hand. As shown in the figure, the hand 80 is configured by providing a storage portion 81 that is recessed in a substantially circular shape in the center of a substantially flat plate-shaped member. The hand 80 can be moved in the horizontal direction (arrows a and b directions) and the vertical direction (arrows c and d directions) by being attached to a robot arm (not shown).

On the other hand, the top ring 90 is substantially disk-shaped and has a guide ring 97 attached to the outer periphery thereof, and a suction surface 91 for sucking the semiconductor wafer 100 is provided inside the guide ring 97 on the lower surface thereof. The top ring 90 is attached to the drive shaft 95 via a ball bearing 93.

When the semiconductor wafer 100 is transferred from the top ring 90 to the hand 80, the semiconductor wafer 100
The hand 80 is made to approach directly below the top ring 90 that has sucked the semiconductor wafer 100, and in this state, the suction of the semiconductor wafer 100 by the top ring 90 is stopped, so that the semiconductor wafer 100 falls into the storage portion 81 of the hand 80. Hold it. Then, the hand 80 is moved in the directions of arrows d and b.

[0008]

When the hand 80 is brought close to the lower surface of the top ring 90 for delivering the semiconductor wafer 100, if there is a gap between the two, the semiconductor wafer 100 may come out of the gap. There is.

As a method of solving this problem, the position of the guide ring 97 attached to the outer periphery of the top ring 90 is adjusted so that the upper surface of the hand 80 faces the lower surface of the guide ring 97 with an extremely narrow gap. Then, there is a method of directly contacting the upper surface of the hand 80 with the lower surface of the guide ring 97.

However, the guide ring 97 and the hand 8
It is difficult to position both 0 and 0 so as to face each other at an extremely narrow interval, and the position adjustment work becomes complicated.

Further, when the hand 80 is brought into direct contact with the guide ring 97, there is a possibility that the corresponding contact may impose an excessive load on the joint of the arm of the robot to which the hand 80 is attached. The mechanical strength must be strong, which leads to an increase in cost.

Some hands have a structure in which a vacuum suction mechanism is provided on the surface thereof and a semiconductor wafer is vacuum-sucked on the surface. This type of hand also has the above-mentioned hand 8
There was a problem similar to the problem of 0.

The present invention has been made in view of the above points, and an object thereof is to easily perform a position adjustment work between a hand and a top ring at the time of delivering an object to be polished, and to attach a hand to the robot arm. An object of the present invention is to provide a hand for transporting an object to be polished, which does not cause an excessive load on the joint part of the.

[0014]

In order to solve the above-mentioned problems, the present invention places the polishing object on the upper surface and approaches or abuts the lower surface of the top ring so that the polishing is performed with the top ring. In the hand for transporting the polishing object for delivering the object, the hand is provided with a cushioning member for cushioning a vertical impact when the polishing object is delivered to the top ring.

[0015]

Embodiments of the present invention will be described below in detail with reference to the drawings. [First Embodiment] FIG. 1 is a perspective view showing a hand 1 according to a first embodiment of the present invention, FIG. 2 is a plan view of the hand 1 (however, the handle 13 is omitted), and FIG. It is a cross-sectional arrow view of the -A portion. As shown in FIGS. 1 to 3, the hand 1 stores a disc-shaped semiconductor wafer on the upper surface of a substantially rectangular plate (having a synthetic resin coating on the surface of a metal plate) having a predetermined thickness. A storage unit 11 having a concave shape is provided, and a handle 13 is projected from the outer periphery of the storage unit 11.

The storage section 11 has a through hole 15 in the center thereof. Further, a taper surface 17 is provided on the inner peripheral side surface of the storage portion 11 so as to increase the inner diameter thereof from the bottom to the top.

A total of eight dampers (cushioning members) 2 are provided around the outer periphery of the upper end of the storage portion 11 at predetermined intervals.
1 is protruding.

The damper 21 is made of a flexible synthetic resin plate, and the portion of the damper 21 protruding upward from the upper surface of the hand 1 has a predetermined surface with respect to the protruding surface of the hand 1. It is configured to tilt at an angle.

Further, one side of the damper 21 is directed toward the storage portion 11 side of the hand 1, and this side is used as a guide side 23 for storing the semiconductor wafer in the storage portion 11.

The guide side 23 is formed in a taper shape in a direction away from the storage portion 11 from the bottom to the top. The lower end of the guide side 23 coincides with the upper end of the tapered surface 17 (see FIG. 3).

FIG. 4 is an enlarged perspective view of an essential part showing a method of attaching the damper 21 to the hand 1 (a partially enlarged view of the X portion in FIG. 1). As shown in the figure, the damper 21 is composed of an inclined surface 25 that is inclined at the upper end thereof, a storage portion 27 that is stored in the hand 1, and a fixing portion 29 that is bent at a right angle at the lower end of the storage portion 27. Has been done.

In this damper 21, the inclined surface 25 is inserted from the lower side of the through groove 19 provided in the hand 1 so that the inclined surface 2 is formed.
Only 5 is projected on the upper surface of the hand 1, and in this state, the fixing portion 2
It is attached by inserting the screw 26 into the hole 28 provided in 9 and screwing it into a screw hole (not shown) provided in the lower surface of the hand 1.

FIG. 5 is a view showing a semiconductor wafer delivery state between the hand 1 and the top ring 90. Since the top ring 90 is the same as the top ring 90 shown in FIG. 12, detailed description thereof will be omitted.

When the semiconductor wafer 100 is transferred from the top ring 90 to the hand 1, the hand 1 is brought close to directly below the top ring 90 which has sucked the semiconductor wafer 100, and the damper 21 is brought into contact with the lower surface of the guide ring 97. By stopping the suction of the semiconductor wafer 100 by the top ring 90, the semiconductor wafer 100 is held by the hand 1.
It is dropped and held in the storage section 11 of.

At this time, the damper 2 protruding from the upper surface of the hand 1 is provided on the lower surface of the guide ring 97 of the top ring 90.
1, but the damper 21 is easily bent because it is a flexible plate, and therefore the top ring 90 is damaged even if it comes into contact with the top ring 90, and the joint part of the robot arm to which the hand 1 is attached. There is no undue burden on the. Particularly, since the surface of the damper 21 according to this embodiment is inclined with respect to the upper surface of the hand 1,
When the top ring 90 is brought into contact with the top ring 90, the surface bends so as to have a large inclination angle, and the deformation can be easily performed.

Since the damper 21 is in contact with the guide ring 97, when the semiconductor wafer 100 is dropped onto the hand 1, there is no fear that the semiconductor wafer 100 will come out.

Further, the mutual positions of the top ring 90 and the hand 1 are slightly displaced from each other, and the semiconductor wafer 100 is moved to the top ring 9
When falling from 0, a part of the outer circumference of the semiconductor wafer 100 may fall so as to ride on the guide side 23 of the damper 21, but in the present embodiment, the lower end of the guide side 23 of the damper 21 is Since it matches the upper end side of the tapered surface 17 of the storage portion 11, the outer periphery of the semiconductor wafer 100 abuts on the guide side 23 and then slides over the guide side 23 and the tapered surface 17 to store the storage portion. It is securely stored in 11.

Second Embodiment By the way, the semiconductor wafer 1
As shown in FIG. 6, some of 00s are provided with a so-called orientation flat 101 in which a predetermined portion of the outer periphery thereof is linearly cut.

When the hand 1 is used to transfer the semiconductor wafer 100 of this type, there are the following problems. That is, when the semiconductor wafer 100 is dropped from the top ring 90 onto the hand 1, the semiconductor wafer 10 is
As shown in FIG. 7, the angular portions e, e at both ends of the orientation flat 101 are caught on the upper end side of the tapered surface 17 between the dampers 21 as shown in FIG. Wafer 100 is storage unit 1
There was a risk that it would not be stored in 1.

FIG. 8 shows a hand 1-that solves this problem as well.
2 is a perspective view showing the second embodiment, FIG. 9 is a plan view of the hand 1-2 (however, the handle 13 is omitted), and FIG. 10 is B of FIG.
FIG. In this embodiment, the same parts as those in the first embodiment are denoted by the same reference numerals, and detailed description thereof will be omitted.

That is, this embodiment is different from the first embodiment in the mounting position of the eight dampers 21 mounted around the storage section 11.

That is, in the case of the damper 21 according to this embodiment, the lower end of the tapered guide side 23 of the damper 21 is made to coincide with the lower end of the tapered surface 17 of the storage portion 11, and the guide side 23 of the damper 21 is tapered. It is designed to project inward from 17.

If the damper 21 is formed in this manner, the semiconductor wafer 100 is transferred from the top ring 90 to the hand 1-2.
If the corner portions e, e at both ends of the orientation flat 101 of the semiconductor wafer 100 shown in FIG. 6 are positioned so as to project from between the dampers 21 as shown in FIG. Even if there is, the corner portion e is guided by the guide side 23 of the damper 21 protruding to the inside of the tapered surface 17 without being caught on the upper end side of the tapered surface 17, and the storage portion 1
Accurately stored in 1.

In this embodiment, the guide side 2 of the damper 21
Tapered surface 1 provided with the lower end of 3 on the inner peripheral side surface of the storage portion 11
Although they are made to coincide with the lower end side of 7, it is not always necessary for both to be coincident. Further, it is not always necessary to provide the tapered surface 17 on the inner peripheral side surface of the storage section 11. That is, the point is that the tapered guide side 23 is positioned so as to project inside the inner peripheral side surface (tapered surface 17 in the embodiment) of the storage portion 11, so that the orientation flat 101 of the dropped semiconductor wafer 100 has a rectangular shape. Even if the portion e is positioned so as to project outward from between the two dampers 21, it is sufficient if it can be guided into the storage portion 11 without being caught by the upper end side of the inner peripheral side surface of the storage portion 11.

Since the surface of the damper 21 protruding above the hand 1-2 is inclined at a predetermined angle with respect to the upper surface of the hand 1-2, in the case of this embodiment, as shown in FIGS.
8 on the upper surface of the hand 1-2 for escaping the damper 21
A recess 31 is provided at some place.

[Third Embodiment] FIGS. 13 and 14 are views showing a hand 50 according to a third embodiment of the present invention. FIG. 13 (a) is a plan view and FIG. 13 (b) is a side sectional view. , FIG. 14
Is an exploded perspective view.

As shown in both figures, this hand 50 has a flat plate-shaped hand main body member 51 and a spring member (cushioning member).
The mounting member 71 is attached via 61.

Here, the hand body member 51 is a rectangular plate body, and is formed by providing a circular recess 53 at a predetermined position and circular holes 55, 55 on both sides of the circular recess 53. The circular holes 55, 55 have a tapered inner diameter that widens downward (see FIG. 13B).

The spring member 61 is composed of a coil spring, and spring receivers 63, 63 are attached to both upper and lower ends thereof.

The mounting member 71 is formed in a disk shape, and two screw holes 73, 73 penetrating therethrough and two through holes 75, 75 are provided at predetermined positions thereof. Also, the mounting member 71
A circular recess 77 (see FIG. 13B) is provided at the center of the lower surface of the.

Reference numerals 79 and 79 denote attachment members. The attachment members 79 and 79 have a substantially cylindrical shape, and screw holes 81 and 81 are provided on the upper end surface thereof, and the outer diameter thereof is widened in a tapered shape at the lower portion thereof. It is configured by providing locking portions 83, 83.

Reference numerals 85 and 85 are vacuum suction mechanisms, and the vacuum suction mechanisms 85 and 85 are constructed by attaching joints 88 and 88 to the tips of the vacuum pipes 87 and 87. At the tips of the joints 88, 88, the mounting member 71 described above is provided.
Screws 89, 89 that are screwed into the screw holes 73, 73 are cut.

To assemble this hand 50,
A spring receiver 63 is provided in the circular recess 53 of the hand body member 51.
The spring member 61 and the spring receiver 63 are placed, and the placing member 71 to which the joints 88, 88 of the vacuum suction mechanisms 85, 85 are attached is placed thereon.

Next, the mounting members 79, 79 are inserted into the circular holes 55, 55 of the hand body member 51 from the lower surface side thereof, and the screw holes 81, 81 at the upper end thereof are inserted into the through holes 75 of the mounting member 71.
The screws 200, 200 inserted from the upper side into 75 are screwed together. The circular holes 55, 55 are formed to be larger than the circumference of the mounting member 79, so that the x-axis and y-axis can be set when the wafer is placed.
It is designed to have some play in the axial direction. This makes it possible to follow tilting during delivery.

Then, using this hand 50, the hand 5
When transferring a semiconductor wafer from 0 to the top ring,
As shown in FIG. 5, the semiconductor wafer 100 sucked by the vacuum suction mechanisms 85, 85 on the upper surface of the mounting member 71 of the hand 50 is brought into contact with the lower surface of the top ring 90.

At this time, the mounting member 71 is slightly lowered by the spring member 61, and the load exceeding the elastic force of the spring member 61 is not applied to the hand 50 or the top ring 90, so that the top ring 90 is not damaged and An excessive load is not applied to the joint part of the robot arm to which the hand 50 is attached.

Then, the semiconductor wafer 100 is sucked by the top ring 90, and at the same time, the vacuum suction mechanism 85, 85
To stop the hand 50 and lower the hand 50.

As described above, since the semiconductor wafer 100 is delivered while being elastically contacted with the top ring 90 by a predetermined elastic force, there is no possibility that the semiconductor wafer 100 will come out.

[0049]

As described in detail above, the present invention has the following excellent effects. Since the damper is provided around the storage part of the hand, the damper can be brought into contact with the top ring, the semiconductor wafer does not come out to the outside, and the polishing target is kept between the hand and the top ring. It does not put an excessive burden on the joint part of the robot arm to which the hand is attached when delivering. Further, it becomes unnecessary to adjust the position between the hand and the top ring when transferring the polishing object, so that the adjustment work becomes easy.

When the guide side of the damper is positioned so as to project to the inside of the inner peripheral side surface of the storage part of the hand, the orientation of the storage part of the hand is improved even if the polishing target has an orientation flat. Even if the flat is not aligned with a specific position, the corners at both ends of the orientation flat can be reliably stored in the storage unit without being caught by the upper end sides of the inner peripheral side surfaces of the storage unit.

[Brief description of drawings]

FIG. 1 is a perspective view showing a hand 1 according to a first embodiment of the present invention.

FIG. 2 is a plan view of the hand 1 (however, the handle 13 is omitted).

FIG. 3 is a cross-sectional view taken along the line AA of FIG.

FIG. 4 is an enlarged perspective view of an essential part showing a method of attaching the damper 21 to the hand 1.

FIG. 5 is a diagram showing a delivery state of the semiconductor wafer 100 between the hand 1 and the top ring 90.

FIG. 6 is a perspective view showing a semiconductor wafer 100.

FIG. 7 is an enlarged view of a main part showing an engagement state between the semiconductor wafer 100 and the hand 1.

FIG. 8 is a perspective view showing a hand 1-2 according to the second embodiment of the present invention.

FIG. 9 is a plan view of the hand 1-2 (however, the handle 15 is omitted).

10 is a cross-sectional view taken along the line BB of FIG.

FIG. 11 is an enlarged view of a main part showing an engaged state of the semiconductor wafer 100 and the hand 1-2.

FIG. 12 is a view showing a delivery state of a semiconductor wafer between a conventional top ring and a hand.

13A and 13B are diagrams showing a hand 50 according to a third embodiment of the present invention, FIG. 13A is a plan view, and FIG. 13B is a side sectional view.

FIG. 14 is an exploded perspective view showing a hand 50 according to a third embodiment of the present invention.

FIG. 15 is a diagram illustrating the operation of the hand 50.

[Explanation of symbols]

 1, 1-2 hand 11 storage part 17 taper surface 21 damper 23 guide side 90 top ring 100 semiconductor wafer (object to be polished) 50 hand 51 hand body member 61 spring member 71 mounting member 85, 85 vacuum suction mechanism

Claims (4)

[Claims] 1. A hand for transporting a polishing object, wherein a polishing object is placed on an upper surface and approaches or abuts a lower surface of a top ring to transfer the polishing object to and from the top ring. A hand for transporting a polishing object, wherein the hand is provided with a cushioning member for cushioning a vertical impact when the polishing object is delivered to a top ring. 2. A concave storage portion for storing a polishing object is formed on an upper surface, and the storage object is transferred to and from the top ring by approaching or abutting the storage portion to a lower surface of the top ring. In a hand for carrying out a polishing object to be carried out, a damper made of a plate having flexibility is attached around the storage section so as to project upward,
Further, the surface of the damper is inclined at a predetermined angle with respect to the upper surface of the hand, and one side of the damper on the side of the storage portion is used as a guide side for storing the polishing target in the storage portion. Transporting hand. 3. The guide side of the damper is formed in a tapered shape, and the tapered guide side is positioned so as to project inside the inner peripheral side surface of the storage portion. Hand for transporting the described polishing object. 4. A hand for transporting a polishing target object which picks up or mounts a polishing target object on an upper surface thereof and approaches or abuts a lower surface of a top ring to transfer the polishing target object to or from the top ring. In the above polishing, the hand is composed of a mounting member for mounting the polishing target object, and a hand body member mounted below the mounting member with a spring member interposed therebetween. Hand for conveying objects.