JPH09276777A - Substrate holding member and coating applicator - Google Patents

Abstract

PROBLEM TO BE SOLVED: To make it possible to surely hold substrates according to their sizes and to form uniform coating films by sucking and holding a resin flat plate of the area smaller than the area of a base part on the base part and the substrate of a large area thereon and forming plural suction holes communicable with each other at the base part and the resin flat plate. SOLUTION: The substrate holding member has the base part 2 and the resin flat plate. The substrate of the area larger than the area of the resin flat plate is sucked and held on the resin flat plate. The front surface of the base part 2 is flat and is formed with the plural suction mouth parts 5 and suction holes 6. The suction mouth parts 5 are connected to suction paths 5a formed in the base part 2. The suction holes 6 are formed to generate the suction holding effect for holding the substrate to the resin flat plate and the suction paths are connected to a suction device. As a result, the resin flat plate is sucked and held to the base part 2 and the suction holding effect is acted on the suction holes of the resin flat plate via the suction holes 6 of the base part 2, by which the holding of the substrate is made possible.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention comprises a substrate holding member, and more particularly, a substrate holding member for surely holding a single-wafer type substrate such as a large glass substrate according to its area, and such a substrate holding member. The present invention relates to a coating device for uniformly and efficiently coating a substrate with a coating liquid.

[0002]

2. Description of the Related Art In general, a spin coating method is often used as a method for applying a coating liquid to a large glass substrate such as an LCD color filter.

[0003] The spin coating method includes an open air type and a closed cup type. However, both methods have a drawback that the coating efficiency is as low as about 10% and the coating thickness at the corner portion of the substrate becomes too thick. With the expected increase in substrate size, the amount of coating liquid used,
Problems have been pointed out with respect to film thickness distribution, throughput, and the like.

As a method for solving the drawbacks of the spin coating method as described above, there are a knife coating method, a roll coating method and a die coating method.

In each of these systems, a coating clearance is provided on a substrate, and the coating film thickness is determined by the set value to obtain the smoothness of the coating surface. It is difficult to obtain a uniform film thickness when the smoothness (degree of unevenness) is lower than the coating accuracy (the degree of unevenness is large).

A dip coating method is generally known as a method of applying a coating liquid which is hardly affected by irregularities on the surface of the substrate. In this method, however, it is essential to cover a non-coated portion and work is required. It becomes complicated.

Therefore, the bead coating method capable of forming a uniform coating film in a stable state on the single-wafer substrate by eliminating the drawbacks of the coating methods as described above and without being affected by the physical properties of the coating liquid. Is proposed (Japanese Patent Application No. 5-146757).

In this coating apparatus, a coating head having a linear slit that opens upward is provided, and a substrate held by a substrate holding member has a tip portion directly above the slit of the coating head via a predetermined clearance. It is located to face. When the application liquid is supplied to the application head, the application liquid is discharged from the slit to form a bead,
It adheres to the lower surface of the tip of the substrate to be coated. From this state, the substrate holding member is slid obliquely upward at a constant speed, and the coating liquid is sequentially adhered to the lower surface of the substrate from the beads to form a layer of the coating liquid. At this time, the coating liquid is continuously supplied to the coating head, and the amount of the coating liquid in the bead is kept constant. When the substrate rises obliquely upward and its rear end reaches the slit of the coating head, the slide of the substrate holding member is stopped, the coating liquid forming the bead is sucked into the coating head, and the bead disappears. You. This separates the coating head from the coating liquid layer on the substrate.

[0009]

FIG. 25 is a diagram for explaining the positional relationship between the coating head and the substrate in such a bead coating method. In FIG. 25, the coating head 101 discharges the coating liquid from a slit (not shown) to form a bead B having a thickness of about 800 to 900 μm, and the substrate S held by the substrate holding member 102 is the same as the coating head 101. Clearance C (for example, 500μ
The coating is carried out by slantingly upward (in a direction substantially vertical to the drawing) at a constant speed so as to maintain the same.

Generally, the width of the coating head 101 is set larger than that of the substrate S in order to accommodate various substrate sizes. Therefore, the peripheral portion of the substrate holding member 102 holding the substrate S faces the beads B,
In this state, the distance between the substrate holding member 102 and the bead B surface is about 300 to 400 μm. However, bead B
Has a meniscus formed on its contact surface with the substrate S,
For example, when the amount of the coating liquid supplied to the coating head increases due to a voltage change in the supply pump, the coating liquid may come into contact with the substrate holding member 102. Even if this phenomenon is temporary, the applied coating liquid contaminates the substrate holding surface of the substrate holding member 102, or the substrate holding member 102 and the substrate S
There is a problem that the substrate S is contaminated by being permeated between and.

In order to solve this, as shown in FIG. 26, the substrate holding member 102 can be made smaller than the size of the substrate S so that the substrate holding member 102 does not face the bead B. However, when a large-sized substrate S is held, the substrate holding member 1 among the substrates S is held.
When the area not held by 02 becomes large, the substrate S in this area hangs toward the coating head 101. When such a drooping phenomenon of the substrate occurs, it becomes difficult to maintain the clearance C between the substrate S and the coating head 101 at a constant level, which hinders the uniformity of the coating film thickness. On the other hand, it is also possible to replace the substrate holding member with an appropriate size according to the size of the substrate S to prevent the sagging phenomenon of the substrate S as described above. However, there is a problem that the substrate holding member having high rigidity is heavy and the replacement work is complicated.

The present invention has been made in view of the above circumstances, and a substrate holding member capable of reliably holding a single-wafer type substrate such as a large glass substrate according to its size, An object of the present invention is to provide a coating apparatus including such a substrate holding member and capable of forming a uniform coating film.

[0013]

In order to achieve the above object, the substrate holding member of the present invention holds a resin flat plate having an area smaller than that of the base by suction, and sucks it on the resin flat plate by suction. A substrate holding member for holding a substrate having an area larger than that of the resin flat plate, wherein the base has a flat upper surface and a plurality of suction port portions for sucking and holding the resin flat plate on the upper surface. With suction holes of
The resin flat plate has a flat holding plane, and has a plurality of suction holes penetrating from the front surface to the back surface of the holding plane, the suction holes being capable of communicating with the suction holes of the base portion.

The substrate holding member of the present invention holds a resin flat plate having an area smaller than that of the base on the base by suction, and holds a substrate having an area larger than the resin flat on the resin flat by suction. A substrate holding member, wherein the base portion has a flat upper surface and a suction groove portion for sucking and holding the resin flat plate on the upper surface, and has a plurality of suction holes, and the resin flat plate holds the flat surface. The structure is such that it has a flat surface and a plurality of suction holes that can communicate with the suction holes of the base portion are provided so as to penetrate from the front surface to the back surface of the holding flat surface.

In such a substrate holding member of the present invention, the resin flat plate is brought into close contact with the upper surface of the base portion and sucked and held by the suction port portion or the suction groove portion, and the resin flat plate sucked and held by the base portion has the suction hole. To the suction hole through the suction hole at the base, and the suction-holding action occurs on the surface of the resin flat plate through the suction hole, which makes it possible to hold the substrate on the resin flat plate. By having a holding plane having another shape and size, it is possible to appropriately change the area of the resin flat plate that comes into contact with the substrate when holding the substrate.

The coating apparatus according to the present invention has a coating head having a strip-shaped slit that opens upward and extends in the horizontal direction, and moves the substrate to be coated diagonally upward through the upper portion of the coating head. A substrate holding member is provided, a coating liquid is supplied to the coating head, and a bead is formed between the substrate to be coated held by the substrate holding member and the coating head by the coating liquid discharged from the slit. A bead coating apparatus for coating the coating liquid on the coating substrate by adhering the coating liquid from the bead to the coating surface of the coating substrate with relative movement of the coating head and the substrate to be coated, The holding member is configured to be the substrate holding member as described above.

In such a coating apparatus of the present invention, coating with high coating efficiency is performed on the substrate. At this time, the resin flat plate of the substrate holding member holding the substrate has a smaller area than the substrate, Since it does not exist, the distance between the bead not in contact with the substrate and the substrate holding member becomes sufficiently large, and the coating liquid is prevented from coming into contact with the substrate holding member even if the bead surface fluctuates.

[0018]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS The preferred embodiments of the present invention will be described below.

FIG. 1 is a front view showing an embodiment of the substrate holding member of the present invention. In FIG. 1, a substrate holding member 1 of the present invention includes a base portion 2 and a resin flat plate 3 suction-held on the base portion 2. Then, this substrate holding member 1
Is for sucking and holding the substrate S having an area larger than the area of the resin flat plate 3 on the resin flat plate 3.

FIG. 2 is a plan view of the base portion 2, and FIG.
FIG. 3 is a vertical sectional view taken along line III-III of the base portion 2 shown in FIG. 2 and 3, the base 2 has a rectangular planar shape and a flat upper surface, and a plurality of suction port portions 5 and a plurality of suction holes 6 are formed on the upper surface. The suction port 5 is for holding the resin flat plate 3 by suction, and the suction port 5 is formed substantially perpendicular to the thickness direction of the base 2 and is formed inside the base 2 substantially parallel to the upper surface. It is connected to the path 5a. The suction path 5a is connected to a suction device (not shown), and the suction action can be generated in the suction port portion 5 by driving the suction device. The suction holes 6 are the suction holes 8 of the resin flat plate 3 described later.
And a suction holding action for holding the substrate S on the resin flat plate 3 by communicating with the resin flat plate 3,
The suction hole 6 is formed substantially perpendicular to the thickness direction of the base 2, and the suction passage 6 is formed inside the base 2 substantially parallel to the upper surface.
a. The suction path 6a is connected to a suction device (not shown), and the suction action can be generated in the suction hole 6 by driving this suction device. In this way, the base portion 2 has the suction port portion 5 → the suction passage 5a.
And a suction system consisting of the suction hole 6 and the suction passage 6a.

The base 2 can be made of aluminum, stainless steel, iron, brass, copper or the like, and the thickness can be about 5 to 50 mm. The suction port portion 5 provided in the base portion 2 has, for example, an inner diameter of 1 to 30.
mm, and the formation interval is 5 to 10
It can be about 0 mm. Further, the suction holes 6 provided in the base portion 2 may have an inner diameter of about 2 to 10 mm, for example, and the formation interval may be about 5 to 30 mm.

In the illustrated example, the suction port portions 5 are formed over the entire upper surface of the base portion 2 at a predetermined interval, but the invention is not limited to this, and the suction and holding of the resin flat plate 3 is stable. It can be formed in any pattern that can be performed by

FIG. 4 is a sectional view for explaining the resin flat plate 3. In FIG. 4, the resin flat plate 3 is a flat plate having a good planarity and having a rectangular planar shape corresponding to the formation region of the suction port 5 of the base 2. This resin flat plate 3 is provided with a plurality of suction holes 8 penetrating from the front surface (holding flat surface 3a) to the back surface. The suction holes 8 are sucked onto the base portion 2 by the suction action of the resin flat plate 3 by the suction port portion 5. Base 2 when held
Is formed at a location communicating with the suction hole 6. Such suction holes 8 can be formed, for example, with an inner diameter of 0.5 to 5 mm and a formation interval of 5 to 20 mm.

Such a resin flat plate 3 can be made of polypropylene, Teflon (polytetrafluoroethylene) resin, Duracon resin or the like, and has a thickness of 5
It can be set to about 20 mm.

The positioning of the resin flat plate 3 on the base portion 2 when sucking and holding it as described above is performed, for example, by providing a positioning pin at a predetermined position of the base portion 2 and contacting the resin flat plate with this pin. This can be done by

In such a substrate holding member 1, the resin flat plate 3 is positioned and placed on the upper surface of the base 2, and the suction path 5a is formed.
When suction is performed via the suction port 5, a suction holding function is generated in the suction port 5 on the upper surface of the base 2, and the resin flat plate 3 is suction-held on the base 2. Next, when suction is performed through the suction passage 6a, a suction holding action is generated in the suction hole 8 of the resin flat plate 3 through the suction hole 6 of the base portion 2. The suction holding action in the suction holes 8 enables the holding flat surface 3a of the resin flat plate 3 to hold the substrate S. In this case, the resin flat plate 3 has a slightly smaller area than the substrate S to be held, as shown in FIG. 1, and the peripheral portion of the substrate S is not held by the resin flat plate 3. The dimensions of the resin flat plate 3 to be used can be set in consideration of the material, thickness, etc. of the substrate S within a range in which no sagging phenomenon occurs in the non-holding region of the substrate S. For example,
In the glass substrate S for the color filter, it is preferable that the protrusion width W of the substrate S from the resin flat plate 3 is in the range of 5 to 50 mm.

The substrate S can be removed from the substrate holding member 1 by keeping the substrate holding member 1 in a horizontal state and stopping the suction by the suction passage 6a.

In the substrate holding member 1 of the present invention as described above, when holding a substrate S'having a size smaller than the substrate S or a substrate having a different shape, the suction by the suction passage 5a is stopped. The resin flat plate 3 is removed, and the resin flat plate 3'corresponding to the substrate S'is suction-held on the base 2. FIG. 5 is a plan view showing an example of the resin flat plate 3 ′, and FIG. 6 is a vertical sectional view taken along line VI-VI of the resin flat plate 3 ′ shown in FIG. In FIGS. 5 and 6, the resin flat plate 3 ′ is a flat plate having a planar shape that is a rectangle corresponding to the formation region of the suction port portion 5 of the base 2, and has a notch 4 at the peripheral portion of the surface. And a holding plane 3'a corresponding to the substrate S'is formed in a region surrounded by the cutout portion 4. The holding plane 3'a is provided with a plurality of suction holes 8 penetrating from the front surface to the back surface. The suction holes 8 are formed on the base 2 by the suction action of the resin flat plate 3'by the suction port portion 5. It is formed at a location communicating with the suction hole 6 of the base portion 2 when suction-held.

Like the resin plate 3, the resin plate 3'can be made of polypropylene, Teflon (polytetrafluoroethylene) resin, Duracon resin, or the like, and has a thickness on the holding plane 3'a. 5-30m
The cutout portion 4 may have a length of about 1 to 10 mm. Further, the alignment of the resin flat plate 3 ′ on the base portion 2 when sucking and holding it can be performed in the same manner as the resin flat plate 3.

FIG. 7 is a front view showing a state where the substrate holding member 1 of the present invention having the resin flat plate 3'holds the substrate S '. As shown in FIG. 7, the holding plane 3'a of the resin flat plate 3'has a slightly smaller area than the substrate S'to be held, and the peripheral portion of the substrate S'is the resin flat plate 3 '.
It will not be held in. Holding plane 3 for resin flat plate 3 '
The dimension of ′ a can be set in consideration of the material and thickness of the substrate S ′ within a range in which the phenomenon of sagging does not occur in the non-holding region of the substrate S ′. For example, in the glass substrate S ′ for a color filter, it is preferable that the protrusion width W of the substrate S ′ from the holding plane 3′a to the upper side of the cutout 4 is in the range of 5 to 50 mm.

As described above, the substrate holding member of the present invention is
By exchanging the resin flat plate held on the base with a resin flat plate having an optimum holding flat surface, it is possible to securely hold the substrate so that the sagging phenomenon of the substrate does not occur in response to changes in the size and shape of the substrate. In addition to being possible, it is possible to deal with changes in the size and shape of the substrate only by exchanging a lightweight resin flat plate, so that workability becomes extremely good.

In the above embodiment, the plurality of suction port portions 5 provided in the base portion 2 simultaneously generate a suction action on the resin flat plate by one suction system by the suction passage 5a. It is not limited to this. For example, as shown in FIG. 8, the formation region of the suction port portion (not shown) of the base portion 2 ′ is divided into regions A1, A2, A3 (regions surrounded by broken lines), and each region is independent. A suction path may be provided to have three suction systems. By using such a base 2 ', the area A
The area where the suction holding action is generated can be appropriately changed by the combination of 1, A2 and A3. Therefore, for example, a resin flat plate corresponding to the size and shape of the substrate S is formed without forming a notch, and the resin flat plate is used as the area A1.
Any desired area of A2, A3 can be used to hold to the base 2 '.

In the above-described embodiment, the two types of substrates S and S'shown in FIGS. 1 and 7 are applicable, but the substrate holding member of the present invention is not limited thereto. Instead, it goes without saying that it is possible to support two or more sizes.

Next, another embodiment of the substrate holding member of the present invention will be described.

FIG. 9 is a front view showing another embodiment of the substrate holding member of the present invention. In FIG. 9, the substrate holding member 11 of the present invention includes a base portion 12 and a resin flat plate 13 suction-held on the base portion 12. The substrate holding member 11 sucks and holds the substrate S having an area larger than that of the resin flat plate 13 on the resin flat plate 13.

FIG. 10 is a plan view of the base portion 12, and FIG.
FIG. 11 is a vertical sectional view taken along line XI-XI of the base portion 12 shown in FIG. 10. 10 and 11, the base portion 12 has a rectangular planar shape and a flat upper surface. The base portion 12 has a peripheral edge portion of the upper surface and a suction groove portion 15 formed in a cross shape inside the peripheral portion, and has a plurality of suction portions. The hole 16 is provided in a region where the suction groove 15 is not formed. The suction groove portion 15 is for holding the resin flat plate 13 by suction on the base portion 12, and the suction groove portion 15 has a depth of about 3 to 10 mm and a width of 3 to 10 mm.
However, the cross-sectional shape of the suction groove portion 15 is not particularly limited and may be rectangular or semicircular. The suction groove portion 15 is connected to a suction passage 15 a formed inside the base portion 12. The suction passage 15a is connected to a suction device (not shown),
By driving the suction device with the resin flat plate 13 placed on the base portion 12 so as to cover the suction groove portion 15, the suction action can be generated in the suction groove portion 15. Also,
The suction hole 16 is for communicating with a suction hole 18 of the resin flat plate 13 described later to cause a suction holding action for holding the substrate S on the resin flat plate 13, and the suction hole 16 is the base 12. Is formed substantially perpendicular to the thickness direction and is connected to a suction passage 16a formed inside the base 12 substantially parallel to the upper surface. The suction passage 16a is connected to a suction device (not shown), and a suction action can be generated in the suction hole 16 by driving this suction device. In this way, the base 12 has the suction groove 15 →
Two suction systems are provided: a suction system including the suction passage 15a and a suction system including the suction hole 16 → the suction passage 16a.

The base portion 12 can be made of aluminum, stainless steel, iron, brass, copper or the like, like the base portion 2, and the thickness thereof can be about 5 to 50 mm. Suction groove portion 1 provided in the base portion 12
The formation pattern of 5 is not limited to the example shown in the drawing, and may be any pattern capable of stably holding the resin flat plate 13 by suction. Further, the suction holes 16 provided in the base portion 12 can have, for example, an inner diameter of approximately 2 to 10 mm, and the formation interval can be approximately 5 to 30 mm.

FIG. 12 is a sectional view for explaining the resin flat plate 13. In FIG. 12, the resin flat plate 13 is a flat plate having a good planarity in which the planar shape is a rectangle corresponding to the formation region of the suction groove portion 15 of the base portion 12. This resin flat plate 13
Has a plurality of suction holes 18 penetrating from the front surface (holding plane 13a) to the back surface. The suction holes 18 are formed when the resin flat plate 13 is sucked and held on the base portion 12 by the suction action of the suction groove portions 15. It is formed at a location communicating with the suction hole 16 of the base 12. Such suction holes 18 can be formed, for example, with an inner diameter of 0.5 to 5 mm and a formation interval of 5 to 20 mm.

The resin flat plate 13 can be made of polypropylene, Teflon (polytetrafluoroethylene) resin, Duracon resin or the like, like the above-mentioned resin flat plate 3, and has a thickness of about 5 to 20 mm. be able to.

Resin flat plate 13 on base 12 as described above
The positioning at the time of suction holding can be performed by, for example, providing a positioning pin at a predetermined position of the base 12 and bringing a resin flat plate into contact with this pin.

In such a substrate holding member 11, when the resin flat plate 13 is positioned and placed on the upper surface of the base 12 and suction is performed through the suction passage 15a, a suction holding action is generated in the suction groove portion 15 on the upper surface of the base 12. Then, the resin plate 13 is attached to the base 12.
Are sucked and held. Next, when suction is performed through the suction passage 16a, a suction holding action is generated in the suction hole 18 of the resin substrate 13 through the suction hole 16 of the base portion 12. This suction hole 18
By the suction holding action in (3), the substrate S can be held by the holding flat surface 13a of the resin flat plate 13. In this case, the resin flat plate 13 has a slightly smaller area than the substrate S to be held, as shown in FIG. 9, and the peripheral portion of the substrate S is not held by the resin flat plate 13. The size of the resin flat plate 13 to be used can be set in consideration of the material, thickness, etc. of the substrate S within a range in which the sagging phenomenon does not occur in the non-holding region of the substrate S. For example, in the glass substrate S for the color filter, it is preferable that the protrusion width W of the substrate S from the resin flat plate 13 is in the range of 5 to 50 mm.

To remove the substrate S from the substrate holding member 11, the substrate holding member 11 is placed in a horizontal state and the suction path 16a is removed.
It can be performed by stopping the suction by.

In the substrate holding member 11 of the present invention as described above, when holding a substrate S'having a smaller size than the substrate S or a substrate having a different shape, suction by the flow path 15a is stopped. The resin flat plate 13 is removed, and the resin flat plate corresponding to the substrate S ′ is suction-held on the base portion 12. In this case, similarly to the embodiment shown in FIGS. 5 and 6 in the description of the above-described embodiment, the flat plate is a flat plate having a good planarity and having a rectangular shape corresponding to the formation region of the suction groove portion 15 of the base portion 12, It is possible to use a resin flat plate having a notch portion in the peripheral portion, and a holding plane and a suction hole 18 corresponding to the substrate S ′ are formed in a region surrounded by the notch portion.

FIG. 13 is a plan view showing another embodiment of the base portion which constitutes the substrate holding member 11 of the present invention. In FIG. 13, the base portion 12 'has a rectangular planar shape, has a flat upper surface, and is provided with a suction groove portion 15' shown by a solid line on the upper surface. The suction holes 16 are not shown. The suction groove portion 15 'is composed of five independent suction groove portions and forms five types of areas B1, B2, B3, B4, and B5 (total nine areas). Then, the region B1,
An independent suction path (indicated by a broken line in the illustrated example) is provided for each of the areas B2, B3, B4 and B5.
It has five suction systems b2, b3, b4 and b5. By using such a base 12 ',
The area where the suction holding action is generated can be appropriately changed by combining the regions B1, B2, B3, B4, and B5.
Therefore, for example, a resin flat plate corresponding to the size and shape of the substrate S is formed without forming a cutout portion, and this resin flat plate is used in a desired region among the regions B1, B2, B3, B4, B5. Can be held on the base 12 '.

Next, the coating apparatus of the present invention will be described.

FIG. 14 is a block diagram showing an example of the embodiment of the coating apparatus of the present invention. In FIG. 14, the coating device 30 of the present invention includes a pair of support frames 31A of the device main body 31.
A linear guide frame 32 mounted in an inclined state such that the downstream end of the substrate S in the sliding direction is high, and a substrate holding member 33 slidably mounted on the guide frame 32. This slit 34a has a linear slit 34a that opens upward.
The coating head 34 is disposed below the guide frame 32 so that a extends in a direction orthogonal to the axial direction of the guide frame 32.

The substrate holding member 33 is the substrate holding member of the present invention as shown in FIGS. 1 to 13, and is screwed into a ball screw 35 installed along the guide frame 32. When the screw 35 is rotated by the motor M, the screw 35 slides along the guide frame 32. Then, the substrate holding member 3
The suction passage of the base portion of 3 is connected to the suction pipe connecting portion 33A, and the substrate S is sucked and held on the downward resin flat plate 3 by the operation of a suction mechanism (not shown). Further, the coating head 34 is adapted to discharge the coating liquid supplied from a coating liquid supply mechanism (not shown) upward from the slit 34a.

Here, an example of the coating head 34 will be described with reference to FIGS.

15 to 18, the coating head 3
The main body 34A of No. 4 has a length a which is equal to or larger than the width of the substrate S on which the coating liquid is applied, and a slit 34a which extends along the axial direction and opens upward is formed in the central portion of the upper surface. There is. A pair of slopes 34B and 34C are formed on both sides of the slit 34a so as to sandwich the slit 34a.

Inside the main body 34A, a hollow liquid pool 34D is formed which extends parallel to the slit 34a and communicates with the slit 34a over the entire axial direction thereof. A coating liquid supply pipe 34E attached to a lower portion of the slit 34a is connected to the liquid pool 34D,
The coating liquid introduced from the coating liquid supply pipe 34E is discharged from the slit 34a through the liquid reservoir 34D.

In the figure, 34F is a pair of slit length adjusting packings that are detachably fitted to both ends of the slit 34a. The slit length adjusting packings 34F have different lengths. The width of the coating liquid discharged from the slit 34a can be adjusted by changing the slit length adjusting packing.

The following dimensions are possible as an example of the dimensions of each part of the coating head 34 shown in the drawing.

Length a of main body 34A = 400 mm Width of main body 34A b = 50 mm Height of main body 34A c = 80 mm Length d of slit 34a (width after adjustment by slit length adjusting packing 34F) = 350 mm Slit 34a Width e = 2 mm Depth of slit 34a f = 27 mm Depth of liquid pool 34D g = 40 mm As a coating liquid supply mechanism for supplying the coating liquid to the coating head 34, a mechanism as shown in FIG.

This coating liquid supply mechanism is used in the pressure tank barrel 40.
The coating liquid contained therein is pushed out by the air pressure supplied through the manual valve 41, and the coarse adjustment needle valve 42, the filter 43, the flow meter 44, the fine adjustment needle valve 45, the air actuated valve 46 and the suck back. It is supplied to the coating head 44 via the valve 47.

The air actuating valve 46 automatically operates by air pressure when the application of the coating liquid to the substrate S is completed, and stops the supply of the coating liquid to the coating head 44. Further, in the suck back valve 47, at the same time when the air operated valve 46 is closed, the piston 47a is slid in the direction of the arrow shown in FIG. 19 to generate a negative pressure in the cylinder 47b, and thereby the supply head 44 is supplied. Suction and collect the coating liquid.

FIG. 20 shows the state when the bead coating device 30 starts coating. The substrate S sucked by the resin flat plate of the substrate holding member 33 has the tip S1 at the coating head 34.
Is located directly above the slit 34a so as to face each other with a predetermined clearance. At this time, since the substrate holding member 33 is the substrate holding member of the present invention described above, the sagging phenomenon does not occur in the non-holding region in the peripheral portion of the substrate S, and therefore, the predetermined clearance with respect to the slit 34a is maintained. Is possible.

When the coating liquid R is supplied to the coating head 34 from the coating liquid supply mechanism, the supplied coating liquid R is discharged from the slits 34a to form the beads B, as shown in an enlarged view in FIG. It is formed and attached to the lower surface of the tip of the substrate S. At this time, the minimum clearance C1 between the opening of the slit 34a and the lower surface of the substrate S held by the substrate holding member 33 has a viscosity and a surface of the coating liquid R so that the coating liquid R does not spill from the bead B. Set in consideration of physical properties such as tension.

In FIG. 21, a meniscus L1 is formed on the rear end side (left side in the drawing) of the substrate S of the bead B, and a meniscus L2 is formed on the front end side (right side in the drawing). The height dimension of this meniscus L1 is shown. h1 and meniscus L
The height dimension h2 of 2 has a relationship of h1 <h2 because the guide frame 22 is inclined at the angle θ.

When the motor M is driven and the ball screw 35 is rotated from the state shown in FIG. 20, the substrate holding member 33 is slid upward at a constant speed along the guide frame 32.

As a result, as shown in FIGS. 22 and 23, the coating liquid R is sequentially attached to the lower surface of the substrate S from the bead B to form a layer Ra of the coating liquid R. At this time, the coating liquid R is continuously supplied to the coating head 34, and the amount of the coating liquid R in the bead B is kept constant. At the time of this coating, even if the supply amount of the coating liquid fluctuates and the surface of the bead B rises, there is a sufficient distance between the surface of the bead B and the substrate holding member 33, and the coating liquid holds the substrate. It does not contact the member 33.

Then, as shown in FIG. 24, the substrate S
Rises along the guide frame 32 and its rear end S2
When the coating liquid R reaches the slit 34a of the coating head 34, the slide of the substrate holding member 33 is stopped, and the coating liquid R forming the bead B is moved inside the coating head 34 by the operation of the suck back valve 37 connected to the coating head 34. Bead B is extinguished. As a result, the coating head 34 and the layer Ra of the coating liquid R on the substrate S are separated. Although not shown in the illustrated example, such a layer Ra of the coating liquid R is thin in the region of 20 to 30 mm from the front end S1 of the substrate S and thick in the region of 20 to 30 mm from the rear end S2 of the substrate S. However, the uniformity of the coating film thickness is insufficient.

The coating liquid used in the coating apparatus of the present invention is not particularly limited, and may be, for example, a solvent-based photosensitive resin having a viscosity of about 3 to 50 cps, an aqueous photosensitive resin, or a pigment or the like in these photosensitive resins. It is possible to use a photosensitive resin such as a photosensitive resin having the colorant dispersed therein, various adhesives, a resin for forming a protective film, various inks and the like.

[0063]

As described in detail above, the substrate holding member of the present invention has a flat upper surface, a plurality of suction ports or suction groove portions on the upper surface, and a base portion having a plurality of suction holes. On this base portion, a resin flat plate having a plurality of suction holes which are smaller in area than the base portion and can communicate with the suction holes of the base portion is formed by penetrating from the front surface to the back surface of the holding plane, and the suction port portion or the suction groove portion is provided. It is suction-held through, the substrate having a larger area than the holding plane of the resin flat plate can be held by suction on the resin flat plate so that the resin flat plate does not exist around the substrate, and the base portion remains as it is.
The contact area between the substrate holding member and the substrate can be changed by changing the size of the resin flat plate sucked and held by the base to various sizes, and the appropriate area corresponding to the size of the substrate to be held, that is, Since it is possible to hold the substrate in a slightly smaller area, the peripheral area of the substrate that is not suction-held by the resin flat plate becomes small, and the substrate can be reliably held without sagging of the substrate. Corresponding to the change of board size,
It is possible only by exchanging the lightweight resin flat plate described above, and the workability is greatly improved as compared with exchanging the entire substrate holding member.

Further, in the coating apparatus of the present invention, the coating liquid is discharged from the slit between the coating head having a strip-shaped slit extending in the upward direction and extending in the horizontal direction and the substrate to be coated to form a bead. While supplying the coating liquid, the substrate held by the substrate holding member as described above is moved obliquely upward through the upper part of the coating head, and the coating liquid is attached to the coating surface of the substrate from the bead to coat the substrate. Since the resin is applied, and the resin flat plate of the substrate holding member that holds the substrate has a smaller area than the substrate, the distance between the bead that is not in contact with the substrate and the substrate holding member is large, and the bead surface does not fluctuate. Even if it occurs, the coating liquid is prevented from contacting the substrate holding member, and uniform coating can be performed without causing contamination of the substrate holding member and the back surface of the substrate by the coating liquid. It becomes easily cope to changes.

[Brief description of drawings]

FIG. 1 is a front view showing an embodiment of a substrate holding member of the present invention.

FIG. 2 is a plan view for explaining a base portion of the substrate holding member shown in FIG.

FIG. 3 is a vertical cross section taken along line III-III of the base portion shown in FIG.

FIG. 4 is a vertical sectional view showing an example of a resin flat plate.

FIG. 5 is a plan view showing another example of the resin flat plate.

6 is a vertical cross section taken along line VI-VI of the resin flat plate shown in FIG.

FIG. 7 is a front view showing a state where a substrate holding member of the present invention holds a substrate.

FIG. 8 is a plan view showing another example of the base portion.

FIG. 9 is a front view showing another embodiment of the substrate holding member of the present invention.

FIG. 10 is a plan view for explaining a base portion of the substrate holding member shown in FIG.

11 is a vertical cross section taken along line XI-XI of the base portion shown in FIG.

12 is a vertical cross-sectional view showing an example of a resin flat plate of the substrate holding member shown in FIG.

FIG. 13 is a plan view showing another example of the base portion.

FIG. 14 is a side view showing the configuration of the coating apparatus of the present invention.

15 is a perspective view showing an example of a coating head used in the coating apparatus shown in FIG.

FIG. 16 is a front view of the coating head.

FIG. 17 is a plan view of the coating head.

FIG. 18 is a side view of the coating head.

19 is a view showing a coating liquid supply mechanism used in the coating apparatus shown in FIG.

20 is a schematic side view showing the relationship between the substrate and the beads at the start of coating in the coating apparatus shown in FIG.

FIG. 21 is an explanatory view showing an enlarged bead state at the start of coating in the coating apparatus shown in FIG.

22 is a schematic side view showing a relationship between a substrate and a bead during coating in the coating apparatus shown in FIG.

23 is an explanatory view showing an enlarged state of a bead during coating in the coating apparatus shown in FIG. 14. FIG.

24 is a schematic side view showing the relationship between the substrate and the bead at the end of coating in the coating apparatus shown in FIG.

FIG. 25 is a diagram for explaining a positional relationship between a coating head in a bead coating method and a substrate held by a conventional substrate holding member.

FIG. 26 is a diagram for explaining the positional relationship between the coating head in the bead coating method and the substrate held by the conventional substrate holding member.

[Explanation of symbols]

 1, 11 ... Substrate holding member 2, 2 ', 12, 12' ... Base portion 3, 3 ', 13 ... Resin flat plate 4 ... Notch portion 5 ... Suction port portion 6, 16 ... Suction hole 8, 18 ... Suction hole 15 , 15 '... Suction groove portions 5a, 6a, 15a, 16a ... Suction path 30 ... Coating device 32 ... Guide frame 34 ... Coating head 34a ... Slit B ... Beads S, S' ... Substrate

 ─────────────────────────────────────────────────── ─── Continuation of the front page (72) Inventor Shunji Miyagawa 1-1, 1-1 Ichigaya-Kagacho, Shinjuku-ku, Tokyo Within Dai Nippon Printing Co., Ltd. (72) Inventor Takashi Yaguchi 1-chome, Ichigaya-Kagacho, Shinjuku-ku, Tokyo No. 1 within Dai Nippon Printing Co., Ltd. (72) Inventor Masayuki Murata 1-1-1 Ichigayakamachi, Shinjuku-ku, Tokyo Within Dai Nippon Printing Co., Ltd.

Claims (3)

[Claims] 1. A substrate holding member for holding a resin flat plate having an area smaller than that of the base by suction on a base, and holding a substrate having an area larger than the resin flat plate by suction on the resin flat plate, The base portion has a flat upper surface and a plurality of suction port portions for sucking and holding the resin flat plate on the upper surface, and has a plurality of suction holes, and the resin flat plate has a flat holding plane, A substrate holding member, comprising: a plurality of suction holes that can communicate with the suction holes of the base portion, penetrating from the front surface to the back surface of the holding plane. 2. A substrate holding member for holding a resin flat plate having an area smaller than that of the base by suction on the base, and holding a substrate having an area larger than the resin flat plate by suction on the resin flat plate, The base portion has a flat upper surface and a suction groove portion for sucking and holding the resin flat plate on the upper surface, and has a plurality of suction holes, and the resin flat plate has a flat holding flat surface, and A substrate holding member, comprising: a plurality of suction holes that can communicate with the suction holes, penetrating from the front surface to the back surface of the holding plane. 3. A coating head having a strip-shaped slit that opens upward and extends in the horizontal direction, and a substrate holding member for moving the substrate to be coated in an obliquely upward direction passing above the coating head. A coating liquid is supplied to the coating head, and a bead is formed between the substrate to be coated held by the substrate holding member and the coating head by the coating liquid discharged from the slit, In a bead coating device that applies a coating liquid to the coating substrate by applying a coating liquid from a bead to the coating surface of the coating substrate with relative movement with the substrate to be coated, the substrate holding member, An application device, which is the substrate holding member according to claim 1 or 2.