JPH0927675A - Structure of soldering diode - Google Patents
Structure of soldering diodeInfo
- Publication number
- JPH0927675A JPH0927675A JP17635095A JP17635095A JPH0927675A JP H0927675 A JPH0927675 A JP H0927675A JP 17635095 A JP17635095 A JP 17635095A JP 17635095 A JP17635095 A JP 17635095A JP H0927675 A JPH0927675 A JP H0927675A
- Authority
- JP
- Japan
- Prior art keywords
- diode
- soldering
- diode chip
- soldered
- terminal
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
- H05K3/3421—Leaded components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
- H05K3/3431—Leadless components
Abstract
Description
【０００１】[0001]
【発明の属する技術分野】本発明は、例えばダイオード
内蔵コネクタにおける端子とダイオードの接合部に適用
されるダイオードの半田付け構造に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a diode soldering structure applied to a junction between a terminal and a diode in a connector with a built-in diode, for example.
【０００２】[0002]
【従来の技術】実開平１−１１５１８３号公報に、ダイ
オード内蔵コネクタの例が示されている。図４はそのコ
ネクタの製作工程毎の構成を示す。このコネクタでは、
図４（ａ）、（ｂ）に示すように、コネクタ端子１、
２、３の基端部間にダイオードチップ４を接続してい
る。端子１、２、３は同一平面上に並んでいるので、ダ
イオードチップ４を一方の端子１、２上に半田付けする
と共に、ダイオードチップ４と他方の端子２、３間を、
ダイオードチップ４の厚み分の段差を有した導体片５で
橋渡して半田付けしている。そして、図４（ｃ）に示す
ように、その状態で樹脂６でモールドすることにより、
コネクタを完成している。2. Description of the Related Art An example of a connector with a built-in diode is shown in Japanese Utility Model Laid-Open No. 1-115183. FIG. 4 shows a structure of the connector for each manufacturing process. With this connector,
As shown in FIGS. 4A and 4B, the connector terminal 1,
The diode chip 4 is connected between the two base ends. Since the terminals 1, 2, and 3 are arranged on the same plane, the diode chip 4 is soldered onto one of the terminals 1 and 2, and the distance between the diode chip 4 and the other terminals 2 and 3 is
The conductor pieces 5 having steps corresponding to the thickness of the diode chip 4 are bridged and soldered. Then, as shown in FIG. 4C, by molding with the resin 6 in that state,
The connector is completed.
【０００３】[0003]
【発明が解決しようとする課題】ところで、ダイオード
チップ４と導体片５の半田接合部や、ダイオードチップ
４と端子１、２の半田接合部では、半田塗布量のばらつ
き等により、ダイオードチップ４の側面部（側方部）へ
余剰半田がはみ出すことがある。図３はその状態を示し
ている。このような半田８のはみ出し（はみ出し部８
Ｈ）が生じた場合、ダイオードチップ４の両極間の絶縁
距離不足が発生し、耐電圧の低下等の問題を生じるおそ
れがある。By the way, at the solder joint portion of the diode chip 4 and the conductor piece 5 or at the solder joint portion of the diode chip 4 and the terminals 1 and 2, due to variations in the amount of solder coating, etc. Excess solder may squeeze out to the side surface (side). FIG. 3 shows the state. Such a protrusion of the solder 8 (the protrusion portion 8
If H) occurs, the insulation distance between both electrodes of the diode chip 4 may be insufficient, which may cause a problem such as a decrease in withstand voltage.
【０００４】本発明は、上記事情を考慮し、余剰半田の
はみ出しを防止することにより、接合の信頼性の向上を
図れるようにしたダイオードの半田付け構造を提供する
ことを目的とする。In view of the above circumstances, it is an object of the present invention to provide a diode soldering structure capable of improving the reliability of junction by preventing the excess solder from squeezing out.
【０００５】[0005]
【課題を解決するための手段】請求項１の発明は、ダイ
オードチップを金属板に半田付けした構造において、ダ
イオードチップと金属板の半田付け面に多数の細溝を形
成したことを特徴とする。According to a first aspect of the invention, in a structure in which a diode chip is soldered to a metal plate, a large number of fine grooves are formed on the soldering surface of the diode chip and the metal plate. .
【０００６】請求項２の発明は、請求項１記載のダイオ
ードの半田付け構造であって、前記細溝が半田付け面に
格子状に形成されていることを特徴とする。A second aspect of the present invention is the diode soldering structure according to the first aspect, wherein the fine grooves are formed in a grid pattern on the soldering surface.
【０００７】請求項３の発明は、請求項１記載のダイオ
ードの半田付け構造であって、前記細溝が半田付け面に
放射状に形成されていることを特徴とする。A third aspect of the present invention is the diode soldering structure according to the first aspect, wherein the fine grooves are radially formed on the soldering surface.
【０００８】請求項４の発明は、請求項１〜３のいずれ
かに記載のダイオードの半田付け構造であって、前記金
属板側の半田付け面に細溝が形成されていることを特徴
とする。The invention of claim 4 is the diode soldering structure according to any one of claims 1 to 3, characterized in that a fine groove is formed on the soldering surface of the metal plate side. To do.
【０００９】請求項５の発明は、請求項４記載のダイオ
ードの半田付け構造であって、ダイオードチップの両極
面に２枚の金属板が半田付けされ、小面積側の極面に対
向する金属板の半田付け面に前記細溝が形成されている
ことを特徴とする。A fifth aspect of the present invention is the diode soldering structure according to the fourth aspect, wherein two metal plates are soldered to both polar surfaces of the diode chip, and the metal faces the polar surface on the small area side. The narrow groove is formed on the soldering surface of the plate.
【００１０】請求項６の発明は、請求項５記載のダイオ
ードの半田付け構造であって、前記２枚の金属板のう
ち、一方がコネクタの端子であり、他方がコネクタの別
の端子またはコネクタの別の端子に接合される導体片で
あることを特徴とする。A sixth aspect of the present invention is the diode soldering structure according to the fifth aspect, wherein one of the two metal plates is a terminal of the connector and the other is another terminal of the connector or the connector. Is a conductor piece that is joined to another terminal.
【００１１】請求項１の発明では、半田付け面の半田塗
布量が必要量を越えた場合、その余剰半田が毛細管現象
によって細溝に吸収され、ダイオードチップの側面部に
半田がはみ出さなくなる。According to the first aspect of the invention, when the amount of solder applied on the soldering surface exceeds the required amount, the excess solder is absorbed by the narrow groove due to the capillary phenomenon, and the solder does not protrude to the side surface of the diode chip.
【００１２】請求項２の発明では、格子状に形成された
細溝に余剰半田が吸収されるので、半田付け面全体にわ
たり均一に半田が分布することになる。According to the second aspect of the invention, since the excess solder is absorbed by the fine grooves formed in a grid pattern, the solder is uniformly distributed over the entire soldering surface.
【００１３】請求項３の発明では、放射状に形成された
細溝にに沿って余剰半田が吸収されるので、半田付け面
全体にわたり均一に半田が分布することになる。According to the third aspect of the invention, since the excess solder is absorbed along the radially formed narrow grooves, the solder is uniformly distributed over the entire soldering surface.
【００１４】請求項４の発明では、金属板側の半田付け
面に細溝を形成したので、ダイオードチップ側に細溝を
加工する必要がなくなる。According to the invention of claim 4, since the fine groove is formed on the soldering surface on the metal plate side, it is not necessary to process the fine groove on the diode chip side.
【００１５】請求項５の発明では、余剰半田が生じやす
い小面積側極面の金属板に細溝を形成しているので、余
剰半田のはみ出しを有効に防ぐことができる。According to the fifth aspect of the present invention, since the fine groove is formed in the metal plate on the side of the small-area side where excess solder is likely to occur, excess solder can be effectively prevented from protruding.
【００１６】請求項６の発明では、コネクタ端子とダイ
オードの接合部に適用したので、コネクタの信頼性が高
まる。According to the invention of claim 6, since it is applied to the joint portion between the connector terminal and the diode, the reliability of the connector is enhanced.
【００１７】[0017]
【発明の実施の形態】以下、本発明の一実施形態を図面
に基づいて説明する。DESCRIPTION OF THE PREFERRED EMBODIMENTS One embodiment of the present invention will be described below with reference to the drawings.
【００１８】図１（ａ）〜（ｃ）は実施形態の構成図、
図２はその要部断面図である。FIGS. 1A to 1C are block diagrams of the embodiment,
FIG. 2 is a sectional view of the main part.
【００１９】この実施形態では、図１（ａ）に示すよう
に、同一平面上に配置されたコネクタ端子１、２の基端
部間に、ダイオードチップ４を半田付けして接続する場
合に、一方の端子１の表面に薄板状のダイオードチップ
４の大面積側の極面４ａを半田付けすると共に、小面積
側の極面４ｂに、橋渡し役の導体片５の一端を半田付け
し、該導体片５の他端を他方の端子２の表面に半田付け
することで、両端子１、２間にダイオードチップ４を介
装している。In this embodiment, as shown in FIG. 1A, when the diode chip 4 is soldered and connected between the base end portions of the connector terminals 1 and 2 arranged on the same plane, The large-area side pole surface 4a of the thin plate-shaped diode chip 4 is soldered to the surface of one terminal 1, and one end of the conductor piece 5 serving as a bridge is soldered to the small-area side pole surface 4b. The diode chip 4 is interposed between the terminals 1 and 2 by soldering the other end of the conductor piece 5 to the surface of the other terminal 2.
【００２０】そして、この場合、ダイオードチップ４の
小面積側の極面４ｂに対向する導体片５側の半田付け面
５ａに、図１（ｂ）に示すような格子状の細溝１０、あ
るいは図（ｃ）に示すような放射状の細溝１０を形成し
て半田付けを行っている。Then, in this case, on the soldering surface 5a on the conductor piece 5 side facing the pole surface 4b on the small area side of the diode chip 4, the grid-like fine grooves 10 as shown in FIG. Radial narrow grooves 10 as shown in FIG. 3C are formed and soldering is performed.
【００２１】従って、導体片５とダイオードチップ４の
半田付け部に余剰半田が生じても、図２に示すように、
その余剰半田が毛細管現象によって細溝１０に吸収さ
れ、ダイオードチップ４の側面部に半田がはみ出さなく
なる（図３と比較）。特に、細溝１０が格子状または放
射状に形成されているので、半田付け面全体にわたり均
一に半田が分布することになる。Therefore, even if excess solder is produced in the soldering portions of the conductor piece 5 and the diode chip 4, as shown in FIG.
The excess solder is absorbed by the narrow groove 10 due to the capillary phenomenon, and the solder does not protrude to the side surface portion of the diode chip 4 (compare with FIG. 3). In particular, since the fine grooves 10 are formed in a lattice shape or a radial shape, the solder is uniformly distributed over the entire soldering surface.
【００２２】よって、ダイオードチップ４の両極間の絶
縁距離が適正に保たれて、絶縁距離不足による耐電圧の
低下等が未然に防止され、その結果、信頼性の高いダイ
オード内蔵コネクタを提供することが可能となる。Therefore, the insulation distance between the two electrodes of the diode chip 4 is properly maintained, and a decrease in withstand voltage and the like due to a short insulation distance is prevented in advance. As a result, a highly reliable diode built-in connector is provided. Is possible.
【００２３】なお、細溝１０は、金型に凸条を設けてプ
レス加工する等の方法で簡単に形成することができる。The narrow groove 10 can be easily formed by a method such as providing a convex ridge on a mold and press working.
【００２４】また、細溝１０は、端子１側の半田付け面
に設けてもよいし、ダイオードチップ４側の半田付け面
に設けてもよい。The narrow groove 10 may be provided on the soldering surface on the terminal 1 side or on the soldering surface on the diode chip 4 side.
【００２５】[0025]
【発明の効果】以上説明したように、請求項１の発明に
よれば、余剰半田が生じた場合でも半田付け面に形成し
た細溝に吸収されるので、ダイオードチップの側面部に
半田がはみ出さなくなり、ダイオードの両極間の絶縁距
離を適正に保ことができる。従って、絶縁距離不足によ
る耐電圧の低下等を未然に防ぐことができ、接合部の信
頼性の向上が図れる。As described above, according to the first aspect of the invention, even if excess solder is generated, it is absorbed by the fine groove formed on the soldering surface, so that the solder protrudes to the side surface of the diode chip. Therefore, the insulation distance between the two electrodes of the diode can be properly maintained. Therefore, it is possible to prevent a decrease in withstand voltage and the like due to insufficient insulation distance, and improve the reliability of the joint.
【００２６】請求項２の発明によれば、細溝を格子状に
形成したので、半田付け面全体にわたり均一な半田層を
作ることができ、接合部の信頼性が高まる。According to the second aspect of the invention, since the fine grooves are formed in a grid pattern, a uniform solder layer can be formed over the entire soldering surface, and the reliability of the joint portion is improved.
【００２７】請求項３の発明によれば、細溝を放射状に
形成したので、半田付け面全体にわたり均一な半田層を
作ることができ、接合部の信頼性が高まる。According to the third aspect of the invention, since the fine grooves are formed radially, a uniform solder layer can be formed over the entire soldering surface, and the reliability of the joint portion is improved.
【００２８】請求項４の発明によれば、金属板をプレス
するときに細溝を加工することができ、実施容易であ
る。According to the fourth aspect of the invention, the fine groove can be processed when the metal plate is pressed, which is easy to carry out.
【００２９】請求項５の発明によれば、余剰半田の生じ
る可能性のある側に細溝を設けているので、余剰半田の
はみ出し防止を有効に行うことができる。According to the invention of claim 5, since the fine groove is provided on the side where the excess solder may occur, the excess solder can be effectively prevented from protruding.
【００３０】請求項６の発明によれば、ダイオード両極
間の絶縁距離不足による耐電圧低下等の問題点を改善す
ることができ、信頼性の高いダイオード内蔵コネクタを
提供することが可能となる。According to the invention of claim 6, it is possible to solve the problems such as withstand voltage drop due to insufficient insulation distance between both electrodes of the diode, and it is possible to provide a highly reliable connector with a built-in diode.
【図１】本発明の一実施形態の構成図であり、（ａ）は
ダイオードの半田付け部の分解斜視図、（ｂ）は図
（ａ）のＸ矢視で示す半田付け面の平面図、（ｃ）は同
半田付け面の他の例を示す平面図である。1A and 1B are configuration diagrams of an embodiment of the present invention, in which FIG. 1A is an exploded perspective view of a soldering portion of a diode, and FIG. 1B is a plan view of a soldering surface as seen from an arrow X in FIG. , (C) are plan views showing other examples of the soldering surface.
【図２】本発明の一実施形態の要部構成を示す断面図で
ある。FIG. 2 is a cross-sectional view showing a configuration of a main part of an embodiment of the present invention.
【図３】従来の半田付け部の構成を示す断面図である。FIG. 3 is a sectional view showing a configuration of a conventional soldering portion.
【図４】従来のダイオード内蔵コネクタの製作工程毎の
構成を示し、（ａ）は半田付け前の斜視図、（ｂ）は半
田付け後の斜視図、（ｃ）はモールド後の斜視図であ
る。4A and 4B show a configuration of each conventional manufacturing process of a connector with a built-in diode, wherein FIG. 4A is a perspective view before soldering, FIG. 4B is a perspective view after soldering, and FIG. 4C is a perspective view after molding. is there.
１，２ 端子 ４ ダイオードチップ ４ａ 極面（小面積側の極面） ４ｂ 極面 ５ 導体片（金属板） ５ａ 半田付け面 １０ 細溝 1, 2 terminals 4 diode chip 4a pole face (pole face on the small area side) 4b pole face 5 conductor piece (metal plate) 5a soldering face 10 narrow groove
─────────────────────────────────────────────────────
─────────────────────────────────────────────────── ───
【手続補正書】[Procedure amendment]
【提出日】平成７年１１月２２日[Submission date] November 22, 1995
【手続補正１】[Procedure amendment 1]
【補正対象書類名】明細書[Document name to be amended] Statement
【補正対象項目名】特許請求の範囲[Correction target item name] Claims
【補正方法】変更[Correction method] Change
【補正内容】[Correction contents]
【特許請求の範囲】[Claims]
Claims (6)
けした構造において、ダイオードチップ４と金属板５の
半田付け面５ａに多数の細溝１０を形成したことを特徴
とするダイオードの半田付け構造。1. A structure for soldering a diode chip 4 to a metal plate 5, wherein a large number of fine grooves 10 are formed in a soldering surface 5a of the diode chip 4 and the metal plate 5, and a diode soldering structure. .
造であって、前記細溝１０が半田付け面５ａに格子状に
形成されていることを特徴とするダイオードの半田付け
構造。2. The diode soldering structure according to claim 1, wherein the fine grooves 10 are formed in a grid pattern on the soldering surface 5a.
造であって、前記細溝１０が半田付け面５ａに放射状に
形成されていることを特徴とするダイオードの半田付け
構造。3. The diode soldering structure according to claim 1, wherein the fine grooves 10 are radially formed on the soldering surface 5a.
ードの半田付け構造であって、前記金属板５側の半田付
け面５ａに細溝１０が形成されていることを特徴とする
ダイオードの半田付け構造。4. The diode soldering structure according to claim 1, wherein a fine groove 10 is formed on a soldering surface 5a on the metal plate 5 side. Soldering structure.
造であって、ダイオードチップ４の両極面４ａ、４ｂに
２枚の金属板１、５が半田付けされ、小面積側の極面４
ｂに対向する金属板５の半田付け面５ａに前記細溝１０
が形成されていることを特徴とするダイオードの半田付
け構造。5. The diode soldering structure according to claim 4, wherein two metal plates 1 and 5 are soldered to both pole faces 4a and 4b of the diode chip 4, and the pole face 4 on the small area side.
The narrow groove 10 is formed on the soldering surface 5a of the metal plate 5 facing b.
A soldering structure for a diode, characterized in that
造であって、前記２枚の金属板１、５のうち、一方がコ
ネクタの端子１であり、他方がコネクタの別の端子また
はコネクタの別の端子２に接合される導体片５であるこ
とを特徴とするダイオードの半田付け構造。6. The diode soldering structure according to claim 5, wherein one of the two metal plates 1 and 5 is a terminal 1 of the connector, and the other is another terminal of the connector or a connector. A soldering structure for a diode, which is a conductor piece 5 joined to another terminal 2.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP17635095A JPH0927675A (en) | 1995-07-12 | 1995-07-12 | Structure of soldering diode |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP17635095A JPH0927675A (en) | 1995-07-12 | 1995-07-12 | Structure of soldering diode |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0927675A true JPH0927675A (en) | 1997-01-28 |
Family
ID=16012073
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP17635095A Pending JPH0927675A (en) | 1995-07-12 | 1995-07-12 | Structure of soldering diode |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0927675A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2009187931A (en) * | 2008-01-10 | 2009-08-20 | Yazaki Corp | Diode connector, its design device, and its design method |
| JP2014007039A (en) * | 2012-06-22 | 2014-01-16 | Shinko Electric Ind Co Ltd | Connection terminal structure, interposer, and socket |
-
1995
- 1995-07-12 JP JP17635095A patent/JPH0927675A/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2009187931A (en) * | 2008-01-10 | 2009-08-20 | Yazaki Corp | Diode connector, its design device, and its design method |
| JP2014007039A (en) * | 2012-06-22 | 2014-01-16 | Shinko Electric Ind Co Ltd | Connection terminal structure, interposer, and socket |
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