JPH09274121A - Optical semiconductor device and its production - Google Patents

Abstract

PROBLEM TO BE SOLVED: To obtain an optical semiconductor device which allows easy production and has versatility. SOLUTION: A substrate 40 mounted with an optical element 20, a coupling means 80 for light transmittably coupling this optical element 20 and an external optical waveguide and a semiconductor chip 30 for driving the optical element is housed in a package 90 in the state where its side edge is fitted and detained into a recessed part 94 on the inner side of the side wall of a package 90. The coupling means 80 is inserted into a window 100 of the side wall of the package 90 to expose the external optical waveguide juncture 82 of the coupling means 80 to the outer side of the window 100. The electrodes of the optical element 20 and the semiconductor chip 30 are electrically connected to the inner end of leads 120 for connecting the external electronic circuits disposed on the side wall of the package 90. The apertures 92, 96 of the package 70 are closed by a cap 130. The optical element 20 and the semiconductor chip 30 for driving the optical element form the built-in optical semiconductor device.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an optical semiconductor device having a built-in optical element such as an LED (laser diode) or PD (photodiode) and a semiconductor chip for driving the optical element, and manufacturing of the device. With respect to the method.

[0002]

2. Description of the Related Art A conventional optical semiconductor device is generally shown in FIG.
As shown in FIG. 0, in the metal package 10 made of metal, the optical element 20 and the semiconductor chip 3 for driving the optical element 3 are provided.
A substrate 40 on which 0 and 0 are mounted is accommodated.

On the front side wall of the metal package 10,
A cylindrical window 12 is provided. An optical waveguide (not shown) such as an optical fiber is inserted through the window 12, and the inner end of the optical waveguide is inserted into the metal package 10.

The optical axes of the inner end of the optical waveguide and the optical element 20 inserted in the metal package 10 are on the same straight line so that light can be transmitted between the inner end of the optical waveguide and the optical element 20. It is located in.

On the left and right side walls of the metal package 10,
A plurality of leads 50 for connecting an external electronic circuit penetrate the side wall of the metal package 10 to form the metal package 10.
They are arranged inside and outside of the car at a predetermined pitch. The lead 50 is inserted into the through hole 14 formed in the side wall of the metal package 10 and hermetically sealed in the through hole via the glass 60. The electrodes of the optical element 20 and the semiconductor chip 30 are electrically connected to the inner ends of the leads 50 via wires 70.

[0006]

However, in the above-described optical semiconductor device, the metal end of the optical waveguide inserted into the metal package 10 and the optical axis of the optical element 20 are arranged on the same straight line. The side wall of the package 10 got in the way, making it extremely difficult.

Further, the metal package 10 has the leads 50 sealed on the left and right side walls thereof via the glass 60,
It had a complicated structure in which the cylindrical window 12 was provided on the side wall of the front part thereof, and it took a great deal of labor and time to manufacture the metal package 10.

The present invention can solve such problems.
An optical semiconductor device and an optical semiconductor device manufacturing method for manufacturing the optical semiconductor device are provided.

[0009]

In order to achieve the above object, the first optical semiconductor device of the present invention comprises an optical element and a coupling between the optical element and an external optical waveguide so that light can be transmitted. A board on which the coupling means for connecting and the semiconductor chip for the optical element drive are mounted is accommodated in a package, and the side edge of the board is fitted and locked in a recess provided inside the side wall of the package. The coupling means is inserted into a window provided on the side wall of the package, the external optical waveguide connecting portion of the coupling means is exposed outside the window, and the electrodes of the optical element and the semiconductor chip pass through the side wall of the package. It is characterized in that it is electrically connected to an inner end of a lead for connecting an external electronic circuit provided inside and outside the package, and an opening of the package is sealed with a cap.

A first optical semiconductor device manufacturing method of the present invention is characterized by including the following steps. a. A step of mounting an optical element, a coupling means for coupling light between the optical element and an external optical waveguide so that light can be transmitted, and a semiconductor chip for driving the optical element on a substrate. b. A substrate on which the optical element, the coupling means, and the semiconductor chip are mounted is housed in a package, and a side edge of the substrate is fitted and locked in a concave portion provided inside a side wall of the package. Through a window provided on the package side wall to expose the external optical waveguide connection portion of the coupling means to the outside of the window. c. A step of electrically connecting the electrodes of the optical element and the semiconductor chip to inner ends of leads for connecting external electronic circuits, which penetrate through sidewalls of the package and are provided inside and outside the package. d. The step of sealing the opening of the package with a cap.

In a second optical semiconductor device of the present invention, the optical axes of the optical element and the inner end of the outer optical waveguide are arranged on the same straight line, and the optical element, the inner end of the outer optical waveguide, and A substrate on which the semiconductor chip for the optical element drive is mounted is accommodated in a package, and a side edge of the substrate is fitted and locked in a recess provided inside a side wall of the package, and the external optical waveguide is , An external electronic circuit connection extending outside the package through a window provided in the package side wall, and the electrodes of the optical element and the semiconductor chip penetrating the side wall of the package and provided inside and outside the package. It is characterized in that it is electrically connected to the inner ends of the leads and the opening of the package is sealed with a cap.

A second optical semiconductor device manufacturing method of the present invention is characterized by including the following steps. a. A step of arranging the optical axes of the optical element and the inner end of the external optical waveguide on the same straight line, and mounting the optical element, the inner end of the external optical waveguide, and the semiconductor chip for driving the optical element on a substrate. . b. A substrate on which the optical element, an inner end of an external optical waveguide, and a semiconductor chip are mounted is housed in a package, and a side edge of the substrate is fitted and locked in a recess provided inside a side wall of the package. And a step of extending the external optical waveguide to the outside of the package through a window provided on the side wall of the package. c. A step of electrically connecting the electrodes of the optical element and the semiconductor chip to inner ends of leads for connecting external electronic circuits, which penetrate through sidewalls of the package and are provided inside and outside the package. d. The step of sealing the opening of the package with a cap.

In the first or second optical semiconductor device and the method for manufacturing the first or second optical semiconductor device,
The optical element, the inner end of the coupling means or the external optical waveguide, and the semiconductor chip are automatically placed on the substrate placed in a wide open space before being accommodated in the package without being disturbed by the side wall of the package. It can be mounted using a mounting device.

Further, when the optical element and the inner end of the external optical waveguide are mounted on the substrate placed in a wide open space, the optical axes of the inner end of the external optical waveguide and the optical element are aligned at the same time. The work of placing on the line is not disturbed by the side wall of the package,
Easy and accurate.

In the first or second optical semiconductor device of the present invention, the optical element is mounted on the substrate through the PLC made of silicon, and the cap made of silicon is capped around the upper portion of the optical element. It is preferable that the structure has a different structure.

In the first or second method for manufacturing an optical semiconductor device of the present invention, an optical element is mounted on a substrate through a PLC made of silicon, and a cap made of silicon is provided around the optical element. It is preferable to include the step of crowning.

In the first or second optical semiconductor device and the first or second optical semiconductor device formed by the method for manufacturing the first or second optical semiconductor device, the periphery of the optical element is formed. It can be airtightly surrounded by a highly airtight silicon PLC and a cap. Then, it is possible to prevent dust and moisture from adhering to the optical element.

In the first or second optical semiconductor device of the present invention, instead of sealing the opening of the package with a cap, the optical element and a part of the coupling means or the inner end of the external optical waveguide are used. It is preferable that the space inside the package in which the semiconductor chip is housed is sealed with an insulating material.

In the first or second optical semiconductor device manufacturing method of the present invention, instead of the step of sealing the opening of the package with a cap, the optical element and a part of the coupling means or the external optical waveguide are formed. It is preferable to include a step of sealing an inner space and a package inner space accommodating the semiconductor chip with an insulating material.

In the first or second optical semiconductor device and the first or second optical semiconductor device formed by the method for manufacturing the first or second optical semiconductor device, an optical element or coupling means is provided. A part or the inner end of the external optical waveguide can be hermetically sealed inside the insulating material. Then, it is possible to prevent dust or moisture from adhering to a part of the optical element or the coupling means housed in the package or the inner end of the outer optical waveguide.

In the first or second optical semiconductor device of the present invention, the gap between the window and the coupling means inserted in the window or the external optical waveguide is sealed with a caulking material. Is preferred.

In the first or second method for manufacturing an optical semiconductor device of the present invention, a step of sealing the gap between the window and the coupling means inserted in the window or the external optical waveguide with a caulking material is included. That is preferable.

In the first or second optical semiconductor device and the first or second optical semiconductor device formed by the method for manufacturing the first or second optical semiconductor device, the window and the window are It is possible to prevent dust and moisture from entering the space inside the package through the gap between the inserted coupling means or the external optical waveguide. Then, it is possible to prevent dust or moisture from adhering to a part of the optical element or the coupling means housed in the package internal space or the inner end of the external optical waveguide.

[0024]

DESCRIPTION OF THE PREFERRED EMBODIMENTS Next, embodiments of the present invention will be described with reference to the drawings. 1 and 2 show a preferred embodiment of a first optical semiconductor device of the present invention, FIG. 1 is a front sectional view thereof, and FIG. 2 is a side sectional view thereof. The first optical semiconductor device will be described below.

In this first optical semiconductor device, the optical element 2 is used.
0, a coupling means 80 including an optical waveguide 80a and a ferrule 80b for coupling light between the optical element and an external optical waveguide, and a semiconductor chip 30 for driving the optical element 20 on a substrate 40. It is installed. The substrate 40 has a flat plate shape and is made of a metal such as copper having a high heat dissipation property.

The optical element 20 is an abbreviation for a PLC (planar light wave circuit) made of silicon, and a substrate on which an optical waveguide for connecting the optical element 20 and a wiring circuit for electrically connecting the electrodes of the optical element 20 are formed. ) 170, and is mounted on the surface of the substrate 40.

The optical element 20 is coupled to the inner end of an optical waveguide 80a forming a part of the coupling means 80 formed in the PLC 170 so that light can be transmitted between them. The electrodes of the optical element 20 are connected to the PLC 17 via wires.
It is electrically connected to the wiring circuit (not shown) formed in 0. A cap 180 made of silicon is capped on the upper periphery of the optical element 20. The periphery of the optical element 20 is airtightly surrounded by the PLC 170 and the cap 180 to prevent dust and moisture from adhering to the optical element 20.

A package 90 is made of an insulating material such as liquid crystal polymer or thermosetting resin. The package 90 includes left and right side walls 90a and 90b standing in parallel,
It is formed of a front end side wall 90c connecting the front ends of the left and right side walls. At the inner lower portions of the left and right side walls 90a and 90b of the package, recesses 94 having a U-shaped cross section for fitting and locking the left and right side edges of the substrate 40 are provided by vertically cutting the side walls 90a and 90b. .

The substrate 40 on which the optical element 20, the semiconductor chip 30, and the coupling means 80 are mounted is accommodated in the package 90 through the opening 92 at the rear end of the package. The left and right side edges of the substrate 40 are fitted and locked in the recesses 94 provided in the inner lower portions of the left and right side walls 90a and 90b of the package 90.

A cylindrical window 100 is provided on the front end side wall 90c of the package 90. And that window 100
The coupling means 80 mounted on the substrate 40 is inserted into
The external optical waveguide connection portion 82 of the coupling means is exposed to the outside of the window 100. The external optical waveguide connecting portion 82 of the coupling means is configured so that the external optical waveguide can be coupled so that light can be transmitted between them.

As shown in FIG. 2, on the left and right side walls 90a and 90b of the package, a plurality of leads 120 for connecting an external electronic circuit are passed through the side walls 90a and 90b of the package, and inside and outside the package 90. They are arranged side by side at a predetermined pitch. Specifically, the leads 120 made of a strip-shaped plating layer are used to form side walls 90a, 90 of the package by using a plating method for plating the plastic surface.
It is continuously formed on the outer peripheral surface of the lower side wall 98 of the package made of an insulating material such as a liquid crystal polymer or a thermosetting resin so as to penetrate the middle part of b.

When the lead 120 is formed on the outer peripheral surface of the lower side wall 98 of the package, the recess 94 is formed inside.
The lower side wall 98 formed with is formed by an injection molding method or the like, and leads 120 made of a plating layer such as copper plating are formed in a strip shape on the outer peripheral surface of the lower side wall 98. Next, on the upper end of the lower side wall 98, the side wall 9 of the package made of an insulating material such as liquid crystal polymer or thermosetting resin is used.
The upper side walls of 0a and 90b are formed in series using an injection molding method or the like.

The optical element 20 and the semiconductor chip 30 mounted on the substrate 40 housed in the package 90 are provided at the inner ends of the leads 120 formed on the upper end surface portions of the lower side walls 98 protruding in the middle of the package 90. Are electrically connected to each other via wires (not shown). Specifically, the PLC 17 in which the electrodes of the optical element 20 are electrically connected
The terminal portion of the wiring circuit formed in 0, through the wire,
It is electrically connected to the inner end of the lead 120, or the electrode of the semiconductor chip 30 is electrically connected to the inner end of the lead 120 via a wire.

Lower side wall 9 exposed at the lower end of the package 90
The outer ends of the leads 120 formed on the lower end surface portion of 8 are configured so that they can be soldered to connection terminals formed on the surface of a board for mounting an optical semiconductor device.

The opening 96 at the upper end and the opening 92 at the rear end of the package 90 are continuously sealed by an L-shaped band-shaped cap 130, as shown in FIG. Then, the optical element 20, the semiconductor chip 30, and the coupling means 80
Is a part of the package side walls 90a, 90b, 90c
And is enclosed in the space inside the package 90 surrounded by the cap 130 and the substrate 40.

The first optical semiconductor device shown in FIGS. 1 and 2 is configured as described above.

Next, a preferred embodiment of the first method for manufacturing an optical semiconductor device, which is the first method for manufacturing an optical semiconductor device according to the present invention, will be described.

In the first method for manufacturing a semiconductor device for optical use, as shown in FIG. 3, light can be transmitted between the optical element 20 and the optical element and an external optical waveguide (not shown). The coupling means 80 including the optical waveguide 80a and the ferrule 80b to be coupled, and the semiconductor chip 30 for driving the optical element 20 are mounted on the metal substrate 40 having high heat dissipation using an automatic mounting device or the like. There is.

The optical element 20 is mounted on the surface of the substrate 40 via the PLC 170. The optical element 20 is PL
The light is coupled to the inner end of the optical waveguide 80a forming a part of the coupling means 80 formed in C170 so that light can be transmitted between them. The electrode of the optical element 20 is electrically connected to a wiring circuit (not shown) formed in the PLC 170 via a wire. A cap 180 made of silicon is capped on the upper periphery of the optical element 20. The PLC 170 and the cap 180 hermetically surround the optical element 20 to prevent dust and moisture from adhering to the optical element 20.

Next, as shown in FIGS. 1 and 2, the substrate 40 on which the optical element 20, the semiconductor chip 30, and the coupling means 80 are mounted is inserted into the package 90 through the opening 92 at the rear end of the package. It is housed. And the substrate 4
The left and right side edges of 0 are fitted and locked in the recesses 94 provided in the inner lower portions of the left and right side walls 90a and 90b of the package.

When the substrate 40 on which the optical element 20, the semiconductor chip 30, and the coupling means 80 are mounted is accommodated in the package 90, at the same time, the coupling means 8 mounted on the substrate 40 is mounted.
0 is inserted into the window 100 provided on the side wall 90c of the package. Then, the external optical waveguide connection portion 82 of the coupling means is exposed to the outside of the window 100.

Next, the electrodes of the optical element 20 and the semiconductor chip 30 mounted on the substrate 40 housed in the package 90 are formed on the upper surface of the lower side wall 98 projecting in the middle of the package 90 near the leads. The inner end of 120 is electrically connected via a wire (not shown). Specifically, the terminal portion of the wiring circuit formed on the PLC 170 to which the electrode of the optical element 20 is electrically connected is electrically connected to the inner end of the lead 120 via the wire, or the semiconductor chip 30. The electrode is electrically connected to the inner end of the lead 120 via a wire.

After that, the opening 9 at the upper end of the package 90 is formed.
6, and the opening 92 at the rear end thereof, as shown in FIG.
The L-shaped cap 130 continuously seals.
The optical element 20, the semiconductor chip 30, and a part of the coupling means 80 are connected to the side walls 90a, 90b, 9 of the package.
0c, the cap 130, and the substrate 40 are enclosed in the space.

The first optical semiconductor device shown in FIG. 1 is formed by the above steps.

FIG. 4 shows a preferred embodiment of the second optical semiconductor device of the present invention, more specifically, a front sectional view thereof. The second optical semiconductor device will be described below.

In this second optical semiconductor device, the inner end 142 of the external optical waveguide and the optical element 20 are replaced with the coupling means 80.
So that light can be transmitted between the inner end 142 of the outer optical waveguide and the optical element 20.
The optical axes of the optical element 20 and the optical element 20 are arranged on the same straight line and mounted on the substrate 40. Specifically, the optical axis of the optical element 20 and the inner end 14 of the external optical waveguide formed in the PLC 170 are used.
The two optical axes are arranged on the same straight line, and the optical element 20
Are mounted on the surface of the substrate 40 via the PLC 170. The optical waveguide 140 near the inner end 142 of the external optical waveguide
A tubular guide 144 is crowned around the portion. The portion of the optical waveguide 140 near the inner end 142 of the external optical waveguide is mounted on the surface of the substrate 40 via the guide 144.

The external optical waveguide 140 extends to the outside of the package 90 through the cylindrical window 100 provided on the side wall 90c of the package. Specifically, the guide 14
The portion of the external optical waveguide 140 which is capped with 4 is inserted into the window 100, and the external optical waveguide 140 is extended to the outside of the package 90.

Others are the same as those of the first optical semiconductor device shown in FIG.

Next, a preferred embodiment of the second method for manufacturing an optical semiconductor device, which is the second method for manufacturing an optical semiconductor device according to the present invention, will be described.

In the second method for manufacturing a semiconductor device for optical use, as shown in FIG. 5, instead of the coupling means 80, the inner end 142 of the external optical waveguide and the optical element 20 are replaced with each other. The optical axes of the inner end 142 and the optical element 20 of the outer optical waveguide are arranged on the same straight line so that light can be transmitted between the inner end 142 and the optical element 20, and the optical waveguide is mounted on the substrate 40. There is. Specifically, the optical axis of the optical element 20 and the optical axis of the inner end 142 of the external optical waveguide formed in the PLC 170 are arranged on the same straight line, and the optical element 20 is placed on the substrate via the PLC 170. It is mounted on 40 surfaces. A cylindrical guide 144 is provided around the outer optical waveguide 140 portion near the inner end 142 of the outer optical waveguide. Then, the portion of the external optical waveguide 140 near the inner end 142 of the external optical waveguide is mounted on the surface of the substrate 40 via the guide 144.

The optical element 20 and the inner end 142 of the external optical waveguide.
When housing the substrate 40 on which the semiconductor chip 30 is mounted in the package 90, as shown in FIG. 4, instead of the coupling means 80, the portion of the external optical waveguide 140 covered with the guide 144 is It is inserted through the window 100 provided on the side wall 90c of the package. Then, the external optical waveguide 140
Are extended to the outside of the package 90.

Other than that, the second optical semiconductor device shown in FIG. 4 is formed by following the same steps as the manufacturing method of the first optical semiconductor device.

FIG. 6 and FIG. 7 show other preferred embodiments of the first and second optical semiconductor devices of the present invention, and are their front sectional views in detail. Below, these first or second
The semiconductor device for light will be described.

In the first and second optical semiconductor devices shown in the figures, the optical element 20 and the coupling means 80 or the external light guide are used instead of the openings 96 and 92 at the upper end and the rear end of the package 90 being sealed with the cap 130. Side walls 90a, 9 of the package in which the inner end 142 of the waveguide and the semiconductor chip 30 are housed
Package 90 surrounded by 0b and 90c and substrate 40
The inner space is tightly sealed with an insulating material 150 such as resin. Then, the optical element 20, the semiconductor chip 30, a part of the coupling means 80 or the inner end 142 of the external optical waveguide are
It is hermetically sealed inside the insulating material 150.

Others are the same as those of the first optical semiconductor device shown in FIG. 1 and the second optical semiconductor device shown in FIG.

Next, another preferred embodiment of the first and second optical semiconductor device manufacturing methods, which are the first and second optical semiconductor device manufacturing methods of the present invention, will be described. explain.

In the first and second optical semiconductor device manufacturing methods, as shown in FIGS. 6 and 7, the upper and rear openings 96 and 92 of the package 90 are sealed with the cap 130. Instead of the optical element 20, the semiconductor chip 30
And a part of the coupling means 80 or the inner end 142 of the outer optical waveguide.
And side walls 90a, 90b, 90 of the package containing
In the space inside the package 90 surrounded by c and the substrate 40,
The package 90 is filled with an insulating material 150 such as resin.
The inner space is tightly sealed with the insulating material 150. And
The optical element 20, the semiconductor chip 30, and a part of the coupling means 80 or the inner end 142 of the outer optical waveguide are hermetically sealed inside the insulating material 150.

Other than that, the first and second optical semiconductor devices shown in FIGS. 6 and 7 are formed by performing the same steps as the manufacturing method of the first and second optical semiconductor devices. There is.

Incidentally, in the first optical semiconductor device shown in FIG. 1 or the second optical semiconductor device shown in FIG. 4, the window 100 and the coupling means 80 or the guide 14 inserted through the window 100.
It is preferable that the gap between the outer optical waveguide 140 and the outer optical waveguide 140 is sealed with a caulking material 160. Then, it is preferable to prevent dust and moisture from entering the package 90 through the gaps. Then, it is preferable to prevent dust and moisture from adhering to a part of the optical element 20 and the coupling means 80 housed in the package 90 or the inner end 142 of the external optical waveguide and causing them to malfunction.

Also in the above-described first or second method for manufacturing a semiconductor device for optical use, the window 100 and the coupling means 80 inserted through the window or the external optical waveguide 1 having the guide 144 is capped.
It is advisable to include a step of sealing the gap between the 40 part and the caulking material 160. Then, dust or moisture enters the package 90 through these gaps, and dust or moisture adheres to the optical element 20 housed in the package 90, a part of the coupling means 80, or the inner end 142 of the external optical waveguide. It is good to be able to prevent.

Further, in the first or second optical semiconductor device and the method for manufacturing the first or second optical semiconductor device, the external optical waveguide near the optical element 20 or the inner end 142 of the external optical waveguide is used. 140 parts of the PLC 170 and the guide 144
It may be directly mounted on the surface of the substrate 40 without the interposition. In addition, the external optical waveguide 14 near the inner end 142 of the external optical waveguide
The 0 portion is not covered with the guide 144, and the outer optical waveguide 140 portion is directly used as the window 100 of the package.
You may insert it in. Further, when the optical element 20 has a structure that is resistant to dust and moisture, it is not necessary to cover the cap 180 on the upper periphery of the optical element 20, and even in such a case, the first or second light It is possible to provide or form an optical semiconductor device having an action substantially similar to that of the semiconductor device.

In addition, in the first and second optical semiconductor devices shown in FIGS. 6 and 7 or in the method of manufacturing the first and second optical semiconductor devices described above for manufacturing the device, FIG. As shown in FIG.
A side wall 90a of the package penetrates through the middle portion of 90b,
It is also possible to use a package 90 formed in a strip shape continuously on the outer peripheral surface of the upper portion of 90b.

Alternatively, as shown in FIG.
Are formed of a plastically deformable metal, and the lead 120 is
Is provided over the inside and outside of the package 90 by penetrating the middle portions of the side walls 90a and 90b of the package, and the outer ends of the leads 120 extending outward of the package 90 have a gull wing ( It is also possible to use a package 90 bent in a GALL-WING shape.

Then, the side walls 90a, 90b of the package
The outer end of the lead 120 formed on the upper end surface portion of the lead 120 or the outer end of the lead 120 extended outward of the package 90 and bent upward in a gull wing shape is used as a board surface for mounting an optical semiconductor device. You may make it possible to make a soldering connection to the connection terminal formed in. Then, the substrate 40 may be directed upward of the board so that the optical semiconductor device can be surface-mounted on the board. A heat radiation fin (not shown) for enhancing the heat radiation performance of the substrate 40 may be attached to the surface of the substrate 40 facing the upper side of the board.

Further, in the first and second optical semiconductor devices shown in FIG. 9 or the above-mentioned first and second optical semiconductor device manufacturing methods for manufacturing the device, the space inside the package 90 is Instead of sealing with the insulating material 150, as shown in FIG. 1, the opening portions 92 and 96 of the package may be continuously sealed with an L-shaped cap 130.

[0066]

As described above, according to the first or second optical semiconductor device of the present invention and the manufacturing method of the first or second optical semiconductor device of the present invention, the substrate is widely opened. In an empty space, the work of mounting the optical element, the coupling means or the inner end of the external optical waveguide, and the semiconductor chip on the substrate is performed by using an automatic mounting device or the like without being disturbed by the side wall of the package. Easy and quick to do.

When the optical element, the inner end of the external optical waveguide, and the semiconductor chip are mounted on the substrate placed in a wide open space, the optical element and the inner end of the external optical waveguide are simultaneously formed. The work of arranging the optical axes on the same straight line can be performed easily and accurately without being disturbed by the side wall of the package.

Further, since it is not necessary to use a metal package which has a complicated structure and requires a great deal of labor and time for its manufacture, it is possible to provide or form a versatile and inexpensive optical semiconductor device.

[Brief description of drawings]

FIG. 1 is a front sectional view of a first optical semiconductor device of the present invention.

FIG. 2 is a side sectional view of a first optical semiconductor device of the present invention.

FIG. 3 is an explanatory diagram of the first method for manufacturing an optical semiconductor device of the present invention.

FIG. 4 is a front sectional view of a second optical semiconductor device of the present invention.

FIG. 5 is an explanatory diagram of a second method for manufacturing an optical semiconductor device of the present invention.

FIG. 6 is a front sectional view of a first optical semiconductor device of the present invention.

FIG. 7 is a front sectional view of a second optical semiconductor device of the present invention.

FIG. 8 is a side sectional view of the first or second optical semiconductor device of the present invention.

FIG. 9 is a side sectional view of the first or second optical semiconductor device of the present invention.

FIG. 10 is a perspective view showing a structure of a conventional optical semiconductor device.

[Explanation of symbols]

 10 Metal Package 12 Window 14 Through Hole 20 Optical Element 30 Semiconductor Chip 40 Substrate 50 Lead 60 Glass 80 Coupling Means 82 External Optical Waveguide Connection of Coupling Means 90 Packages 90a, 90b, 90c Side Walls 92, 96 Package Openings 94 Recesses 98 Lower side wall of package 100 Window 120 Lead 130 Cap 140 External optical waveguide 142 Inner end of external optical waveguide 144 Guide 150 Insulating material 160 Caulking material 170 PLC 180 Cap

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[Procedure amendment]

[Submission date] June 12, 1996

[Procedure amendment 1]

[Document name to be amended] Statement

[Correction target item name] 0001

[Correction method] Change

[Correction contents]

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an optical semiconductor device in which an optical element such as an LD (laser diode) or a PD (photodiode) and a semiconductor chip for driving the optical element are built in, and manufacturing of the device. With respect to the method.

Claims (10)

[Claims] 1. A substrate on which an optical element, a coupling means for coupling light between the optical element and an external optical waveguide so as to transmit light, and a semiconductor chip for driving the optical element are mounted in a package. The housing is accommodated, the side edge of the substrate is fitted and locked in a recess provided inside the side wall of the package, the coupling means is inserted into a window provided in the package side wall, and the coupling means is provided outside the window. Of the external optical waveguide connecting portion is exposed, and the electrodes of the optical element and the semiconductor chip are electrically connected to the inner end of the lead for external electronic circuit connection which is provided inside and outside the package by penetrating the side wall of the package. And an opening portion of the package is sealed with a cap. 2. A method for manufacturing an optical semiconductor device, which includes the following steps. a. A step of mounting an optical element, a coupling means for coupling light between the optical element and an external optical waveguide so that light can be transmitted, and a semiconductor chip for driving the optical element on a substrate. b. A substrate on which the optical element, the coupling means, and the semiconductor chip are mounted is housed in a package, and a side edge of the substrate is fitted and locked in a concave portion provided inside a side wall of the package. Through a window provided on the package side wall to expose the external optical waveguide connection portion of the coupling means to the outside of the window. c. A step of electrically connecting the electrodes of the optical element and the semiconductor chip to inner ends of leads for connecting external electronic circuits, which penetrate through sidewalls of the package and are provided inside and outside the package. d. The step of sealing the opening of the package with a cap. 3. The optical element and the inner end of the outer optical waveguide are arranged on the same straight line so that the optical element, the inner end of the outer optical waveguide and the semiconductor chip for driving the optical element are The mounted board is accommodated in a package, and the side edge of the board is fitted into a recess provided inside the side wall of the package,
The external optical waveguide is locked and extends to the outside of the package through a window provided in the side wall of the package, and the electrodes of the optical element and the semiconductor chip penetrate the side wall of the package to extend inside and outside the package. An optical semiconductor device, characterized in that it is electrically connected to an inner end of a lead for connecting an external electronic circuit provided and an opening of the package is sealed with a cap. 4. A method of manufacturing an optical semiconductor device, which comprises the following steps. a. A step of arranging the optical axes of the optical element and the inner end of the external optical waveguide on the same straight line, and mounting the optical element, the inner end of the external optical waveguide, and the semiconductor chip for driving the optical element on a substrate. . b. A substrate on which the optical element, an inner end of an external optical waveguide, and a semiconductor chip are mounted is housed in a package, and a side edge of the substrate is fitted and locked in a recess provided inside a side wall of the package. And a step of extending the external optical waveguide to the outside of the package through a window provided on the side wall of the package. c. A step of electrically connecting the electrodes of the optical element and the semiconductor chip to inner ends of leads for connecting external electronic circuits, which penetrate through sidewalls of the package and are provided inside and outside the package. d. The step of sealing the opening of the package with a cap. 5. The optical semiconductor device according to claim 1, wherein the optical element is mounted on a substrate via a PLC made of silicon, and a cap made of silicon is capped around the upper portion of the optical element. 6. The optical semiconductor according to claim 2, further comprising a step of mounting an optical element on a substrate via a PLC made of silicon and capping a cap made of silicon on an upper periphery of the optical element. Device manufacturing method. 7. The package inner space, in which the optical element, a part of the coupling means or the inner end of the external optical waveguide, and the semiconductor chip are accommodated, instead of the opening of the package being sealed with a cap, is insulated. The optical semiconductor device according to claim 1, which is sealed with a material. 8. A package inner space accommodating an optical element, a part of a coupling means or an inner end of an external optical waveguide, and a semiconductor chip is replaced with an insulating material instead of the step of sealing the opening of the package with a cap. 5. The method for manufacturing an optical semiconductor device according to claim 2, further comprising a step of sealing with. 9. The optical semiconductor device according to claim 1, wherein a gap between the window and the coupling means or the external optical waveguide inserted through the window is sealed with a caulking material. 10. The method for manufacturing an optical semiconductor device according to claim 2, further comprising the step of sealing a gap between the window and the coupling means inserted through the window or the external optical waveguide with a caulking material.