CN111045163A - TX packaging structure of optical module - Google Patents

TX packaging structure of optical module Download PDF

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Publication number
CN111045163A
CN111045163A CN201911315533.8A CN201911315533A CN111045163A CN 111045163 A CN111045163 A CN 111045163A CN 201911315533 A CN201911315533 A CN 201911315533A CN 111045163 A CN111045163 A CN 111045163A
Authority
CN
China
Prior art keywords
circuit board
base
cover body
optical module
package
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201911315533.8A
Other languages
Chinese (zh)
Inventor
叶涛涛
罗建洪
洪琪琳
丁吉增
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Global Technology Inc China
Original Assignee
Global Technology Inc China
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Global Technology Inc China filed Critical Global Technology Inc China
Priority to CN201911315533.8A priority Critical patent/CN111045163A/en
Publication of CN111045163A publication Critical patent/CN111045163A/en
Pending legal-status Critical Current

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Classifications

    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4251—Sealed packages
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4256—Details of housings
    • G02B6/4257—Details of housings having a supporting carrier or a mounting substrate or a mounting plate
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4266—Thermal aspects, temperature control or temperature monitoring
    • G02B6/4268—Cooling
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4274—Electrical aspects
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4274—Electrical aspects
    • G02B6/428—Electrical aspects containing printed circuit boards [PCB]

Abstract

A TX packaging structure of an optical module comprises a base, a first cover body and a circuit board, and is characterized in that: the middle of circuit board is equipped with a first through-hole, the upper end of base from bottom to top passes the first through-hole of circuit board and is airtight fixed with the circuit board, be equipped with optical device on the base, be equipped with electronic component on the circuit board, optical device on the base passes through the gold thread and is connected with the electronic component electricity on the circuit board, the airtight lid of first lid closes on the upper surface of circuit board for seal optical device and electronic component in the first airtight cavity that circuit board, base and first lid formed. The TX packaging structure of the optical module does not need a silicon substrate assembly and a soft board, is simple to manufacture and has low cost.

Description

TX packaging structure of optical module
Technical Field
The invention relates to the technical field of optical communication, in particular to a TX packaging structure of an optical module.
Background
As shown in fig. 1, a conventional TX package structure of an optical module includes a metal base upper cover 1a, a metal base housing 2a, a circuit board 3a, a flexible board 4a, a silicon substrate assembly 5a, a metal base 6a, and an adapter 7 a; the metal base upper cover 1a, the metal base shell 2a, the metal base 6a and the silicon substrate assembly 5a are sealed into a cavity; optical devices such as a light emitting source 8a and a lens 9a are arranged on the metal base 6a, and electronic elements such as a driving chip are arranged on the silicon substrate assembly 5 a; the circuit board 3a and the adapter 7a are both arranged outside the cavity, and the circuit board 3a is also electrically connected with the electronic element on the silicon substrate component 5a through the flexible board 4 a.
However, the existing TX packaging structure of the optical module has the following technical problems: the silicon substrate assembly 5a needs to be manufactured, and the manufacturing of the silicon substrate assembly 5a is complex and high in cost; the flexible board 4a needs to be added to electrically connect the circuit board 3a and the electronic components on the silicon substrate assembly 5a, which complicates the work and increases the cost.
Disclosure of Invention
The technical problem to be solved by the invention is as follows: provided is a TX packaging structure of an optical module, which does not need a silicon substrate assembly and a soft board, is simple to manufacture and has low cost.
The technical solution of the invention is as follows: a TX packaging structure of an optical module comprises a base, a first cover body and a circuit board, and is characterized in that: the middle of circuit board is equipped with a first through-hole, the upper end of base from bottom to top passes the first through-hole of circuit board and is airtight fixed with the circuit board, be equipped with optical device on the base, be equipped with electronic component on the circuit board, optical device on the base passes through the gold thread and is connected with the electronic component electricity on the circuit board, the airtight lid of first lid closes on the upper surface of circuit board for seal optical device and electronic component in the first airtight cavity that circuit board, base and first lid formed.
After adopting the structure, the invention has the following advantages:
the TX packaging structure of the optical module directly assembles the base in the first through hole of the circuit board without a silicon substrate assembly and a soft board, and has simple manufacture and low cost; after the soft board is cancelled, the optical device on the base is connected with the electronic element on the circuit board through a gold thread, the high-speed wiring is shorter, and the high-speed characteristic is better.
Preferably, the optical device further comprises a second cover body arranged on the circuit board and located in the first cover body, wherein the second cover body is hermetically covered on the base and used for sealing the optical device on the base in a second sealed cavity formed by the circuit board, the metal base and the second cover body. The first seal is formed by the circuit board, the base and the second cover body, the second seal is formed by the circuit board and the first cover body, and the sealing performance is good.
Preferably, a positioning structure is arranged between the first cover body and the second cover body. This setting can make the installation of product inner structure more firm stable.
Preferably, the first cover and the base are both made of metal materials. The arrangement can make the product housing more firm, and has the functions of heat dissipation and shielding.
Preferably, the second cover body is made of plastic. This setting can rationally lighten the whole weight of product on the basis of guaranteeing the shell firmness to can guarantee optical property of optical device better.
Preferably, a first copper exposing area is arranged at a position, butted with the first cover body, of the circuit board, and the circuit board is hermetically welded with the first cover body through soldering tin at the first copper exposing area. The arrangement can reliably connect the first cover body and the circuit board in a sealing way.
Preferably, the base is narrow at the top and wide at the bottom for forming a step surface butted with the lower surface of the circuit board, the circuit board is provided with a second copper exposing area at the position butted with the base, and the circuit board is hermetically welded with the base through soldering tin at the second copper exposing area. The arrangement can reliably connect the base and the circuit board in a sealing way, thereby ensuring the sealing performance of the bottom.
Preferably, the optical fiber cable cover further comprises an optical fiber cable, a first groove for allowing the optical fiber cable to pass through is formed in the first cover body, a second groove for allowing the optical fiber cable to pass through is also formed in the base, one end of the optical fiber cable extends into the first sealed cavity through the first groove and is fixed in the second groove of the base, and the other end of the optical fiber cable is located outside the first sealed cavity. The arrangement can facilitate the arrangement of the optical fiber wires, and the whole structure is simpler.
Preferably, the inner side wall of the first groove of the first cover body is further provided with a plurality of glue dispensing grooves, and the optical fiber is fixed on the first cover body through glue dispensing of the glue dispensing grooves in the first groove. This arrangement ensures reliable fixing and sealing of the optical fiber line.
Preferably, the surface of the optical fiber is metalized and soldered to the outer wall of the first cover by solder. This arrangement ensures reliable fixing and sealing of the optical fiber line.
Description of the drawings:
fig. 1 is a half-sectional view of a TX package structure of a conventional optical module;
FIG. 2 is an exploded view of a TX package structure of an optical module according to the present invention;
FIG. 3 is a half-sectional view of a TX package structure of an optical module of the present invention;
FIG. 4 is a schematic view of a first copper exposing area on the upper surface of the circuit board according to the present invention;
FIG. 5 is a schematic view of a second copper exposing area on the lower surface of the circuit board according to the present invention;
in the prior art figures: 1 a-metal base upper cover, 2 a-metal base shell, 3 a-circuit board, 4 a-soft board, 5 a-silicon substrate component, 6 a-metal base, 7 a-adapter, 8 a-luminous source and 9 a-lens;
in the figure of the invention: the manufacturing method comprises the following steps of 1-a base, 2-a first cover body, 3-a circuit board, 4-a first through hole, 5-an optical device, 6-a light emitting source, 7-a lens, 9-a first closed cavity, 10-a second cover body, 11-a second closed cavity, 12-a positioning structure, 13-a clamping groove, 14-a positioning block, 15-a first copper exposure area, 16-a step surface, 17-a second copper exposure area, 18-an optical fiber line, 19-a first groove, 22-a second groove and 23-a glue dispensing groove.
Detailed Description
The invention is further described with reference to the following embodiments in conjunction with the accompanying drawings.
Example (b):
as shown in fig. 2 and 3, a TX packaging structure of an optical module includes a substrate 1, a first cover 2, and a circuit board 3, where a first through hole 4 is disposed in the middle of the circuit board 3, the upper end of the substrate 1 penetrates through the first through hole 4 of the circuit board 3 from bottom to top and is hermetically fixed to the circuit board 3, an optical device 5 is disposed on the substrate 1, the optical device 5 is, for example, a light source 6 and a lens 7, an electronic component, for example, a driving chip, is disposed on the circuit board 3, the optical device 5 on the substrate 1 is electrically connected to the electronic component on the circuit board 3 through a gold wire, and the first cover 2 is hermetically covered on the upper surface of the circuit board 3 to seal the optical device 5 and the electronic component in a first hermetic chamber 9 formed by the circuit board 3, the substrate 1, and the first cover 2.
The TX packaging structure of the optical module directly assembles the base 1 in the first through hole 4 of the circuit board 3 without a silicon substrate assembly and a soft board, and has simple manufacture and low cost; after the soft board is cancelled, the optical device 5 on the base 1 is connected with the electronic element on the circuit board 3 through a gold thread, the high-speed wiring is shorter, and the high-speed characteristic is better.
Preferably, the optical device further comprises a second cover 10 arranged on the circuit board 3 and positioned in the first cover 2, wherein the second cover 10 is hermetically covered on the base 1 and is used for sealing the optical device 5 on the base 1 in a second sealed cavity 11 formed by the circuit board 3, the metal base 1 and the second cover 10; in this embodiment, a part of the bottom of the second cover 10 contacts the substrate 1, and the other part contacts the circuit board 3, and the bottom of the second cover 10 can be hermetically connected with the substrate 1 and the circuit board 3 by dispensing; in practice, it is also possible to provide the bottom of the second cover 10 entirely in contact with the base 1 or entirely in contact with the circuit board 3, but both cases are less compact than the first case. According to the arrangement, the circuit board 3, the base 1 and the second cover body 10 form a first seal, and the circuit board 3 and the first cover body 2 form a second seal, so that the sealing performance is good.
Preferably, a positioning structure 12 is provided between the first cover 2 and the second cover 10, and as shown in fig. 3, the positioning structure 12 may be a structure in which a locking groove 13 and a positioning block 14 are provided. This setting can make the installation of product inner structure more firm stable.
Preferably, the first cover 2 and the base 1 are made of metal materials. The arrangement can make the product housing more firm, and has the functions of heat dissipation and shielding.
Preferably, the second cover 10 is made of plastic. This setting can rationally lighten the whole weight of product on the basis of guaranteeing the shell firmness to can guarantee optical property of optical device 5 better.
Preferably, a first copper exposing area 15 is provided at a position where the circuit board 3 is abutted with the first cover 2, and as shown in fig. 4, the circuit board 3 is hermetically soldered to the first cover 2 at the first copper exposing area 15 by solder. This arrangement can reliably hermetically connect the first cover body 2 and the circuit board 3 together.
Preferably, the base 1 is narrow at the top and wide at the bottom for forming a step surface 16 abutting against the lower surface of the circuit board 3, the circuit board 3 is provided with a second copper exposed area 17 at the position abutting against the base 1, as shown in fig. 5, and the circuit board 3 is hermetically welded with the base 1 at the second copper exposed area 17 by soldering tin. This arrangement reliably connects the base 1 and the wiring board 3 hermetically, thereby ensuring the sealing performance of the bottom.
Preferably, the optical fiber connector further comprises an optical fiber 18, a first groove 19 for allowing the optical fiber 18 to pass through is formed in the first cover 2, a second groove 22 for allowing the optical fiber 18 to pass through is also formed in the base 1, one end of the optical fiber 18 extends into the first closed cavity 9 through the first groove 19 and is fixed in the second groove 22 of the base 1, and the other end of the optical fiber is located outside the first closed cavity 9. This arrangement facilitates the arrangement of the optical fiber wires 18, making the overall structure simpler.
Preferably, the inner side wall of the first groove 19 of the first cover 2 is further provided with a plurality of glue dispensing grooves 23, and the optical fiber 18 is fixed on the first cover 2 through glue dispensing of the glue dispensing grooves 23 in the first groove 19. In this embodiment, three glue dispensing grooves 23 are provided. This arrangement ensures reliable fixing and sealing of the optical fiber line 18.
Preferably, the optical fiber 18 is metalized and soldered to the outer wall of the first cover 2 by solder. This arrangement ensures reliable fixing and sealing of the optical fiber line 18.

Claims (10)

1. A TX packaging structure of an optical module comprises a base (1), a first cover body (2) and a circuit board (3), and is characterized in that: the middle of circuit board (3) is equipped with a first through-hole (4), the upper end of base (1) is from bottom to top passed first through-hole (4) of circuit board (3) and is airtight fixed with circuit board (3), be equipped with optical device (5) on base (1), be equipped with electronic component on circuit board (3), optical device (5) on base (1) are connected through the gold thread and the electronic component electricity on circuit board (3), airtight lid of first lid (2) closes on the upper surface of circuit board (3) for seal optical device (5) and electronic component in first airtight cavity (9) that circuit board (3), base (1) and first lid (2) formed.
2. A TX package of an optical module according to claim 1, wherein: the optical device packaging structure is characterized by further comprising a second cover body (10) which is arranged on the circuit board (3) and located in the first cover body (2), wherein the second cover body (10) is hermetically covered on the base (1) and used for sealing the optical device (5) on the base (1) in a second closed cavity (11) formed by the circuit board (3), the metal base (1) and the second cover body (10).
3. A TX package of an optical module according to claim 2, wherein: a positioning structure (12) is arranged between the first cover body (2) and the second cover body (10).
4. A TX package of an optical module according to claim 1, wherein: the first cover body (2) and the base (1) are both made of metal materials.
5. A TX package of an optical module according to claim 2, wherein: the second cover body (10) is made of plastic.
6. A TX package of an optical module according to claim 1, wherein: the position department of butt joint with first lid (2) sets up first dew copper district (15) on circuit board (3), circuit board (3) are in the same place through soldering tin and first lid (2) airtight welding in first dew copper district (15) department.
7. A TX package of an optical module according to claim 1, wherein: base (1) narrow width down is used for forming one and step face (16) that butt joint with the lower surface of circuit board (3), circuit board (3) set up second dew copper district (17) in the position department of butt joint with base (1), circuit board (3) are in the same place through soldering tin and base (1) airtight welding in second dew copper district (17).
8. A TX package of an optical module according to claim 1, wherein: still include optic fibre line (18), be equipped with first recess (19) that make optic fibre line (18) pass through on first lid (2), also be equipped with second recess (22) that make optic fibre line (18) pass through on base (1), the one end of optic fibre line (18) is passed through first recess (19) and is stretched into in first airtight cavity (9) and fix in second recess (22) of base (1), and the other end is located outside first airtight cavity (9).
9. A TX package of an optical module according to claim 8, wherein: the inner side wall of the first groove (19) of the first cover body (2) is further provided with a plurality of glue dispensing grooves (23), and the optical fiber line (18) is fixed on the first cover body (2) through glue dispensing grooves (23) in the first groove (19) in a dispensing mode.
10. A TX package of an optical module according to claim 8, wherein: the surface of the optical fiber wire (18) is metalized and welded on the outer side wall of the first cover body (2) through soldering tin.
CN201911315533.8A 2019-12-19 2019-12-19 TX packaging structure of optical module Pending CN111045163A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201911315533.8A CN111045163A (en) 2019-12-19 2019-12-19 TX packaging structure of optical module

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201911315533.8A CN111045163A (en) 2019-12-19 2019-12-19 TX packaging structure of optical module

Publications (1)

Publication Number Publication Date
CN111045163A true CN111045163A (en) 2020-04-21

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ID=70237271

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201911315533.8A Pending CN111045163A (en) 2019-12-19 2019-12-19 TX packaging structure of optical module

Country Status (1)

Country Link
CN (1) CN111045163A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113671639A (en) * 2021-07-16 2021-11-19 武汉英飞光创科技有限公司 Optical module structure and manufacturing method thereof

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113671639A (en) * 2021-07-16 2021-11-19 武汉英飞光创科技有限公司 Optical module structure and manufacturing method thereof

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