JP3483102B2 - Optical element mounting body - Google Patents

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an optical element mounting body in which an optical module having a semiconductor laser, an optical fiber and the like mounted on a planar optical waveguide circuit board is mounted on a mounting substrate.

[0002]

2. Description of the Related Art In an optical module in which an optical element such as a semiconductor laser (laser diode) or a light receiving element, or an optical fiber is mounted on an optical element mounting substrate, sealing (packaging) is important from the viewpoint of reliability. In particular, in the case of a semiconductor laser, the life of the device is shortened due to thermal damage on the emitting surface that emits the laser light, so sealing is more important.

Therefore, conventionally, when an optical module is mounted on a mounting board having a wiring board structure and used, the packaged optical module is mounted on the mounting board.

As a conventional main optical module sealing structure, a hermetically sealing structure for hermetically sealing an optical element, an optical fiber or the like in a special container (package), or a resin is used for the optical element, the optical fiber or the like. A simple sealing structure for enclosing is known.

FIG. 7 shows an example of an optical module having a hermetically sealed structure. In the hermetically sealed optical module 1, the package 2 is composed of a flat box type package body 3 and a lid 4 which is hermetically fixed to the upper surface side of the package body 3.

An optical element mounting substrate 5 made of silicon is fixed to the upper surface of the package body 3. This optical element mounting substrate 5 is generally called a silicon platform, and a conductor layer 6 and grooves 7 having a predetermined pattern are formed on the upper surface thereof.

A semiconductor laser 1 is formed on the part of the conductor layer 6.
0 is fixed, and the optical fiber 11 is inserted into the groove 7. The groove 7 is formed so as to face the emitting surface which is one end surface of the semiconductor laser 10.

The optical fiber 11 is guided into the package 2 through a guide hole 12 provided at one end of the package body 3, is placed in the groove 7, and the tip thereof is the semiconductor laser 10.
It faces one of the emitting surfaces. As a result, the laser light emitted from the semiconductor laser 10 is emitted from the optical fiber 11
Is taken into the optical fiber 11 from the tip of the.

The upper electrode of the semiconductor laser 10 and the predetermined conductor layer 6 are electrically connected by a conductive wire 13.

On the other hand, the tip of the electric cable 14 for transmitting an electric signal is guided into the package 2 through a hole provided at the other end of the package body 3, and although not shown, predetermined conductors of the electric cable 14 are predetermined. Is electrically connected to the conductor layer 6.

Further, the semiconductor laser 10 on the optical element mounting substrate 5, the tip portion of the optical fiber 11 and the wire 13 are provided.
Etc. are covered with the pressing plate 15.

The lid 4 is hermetically sealed to the package body 3 by resistance heating welding after the assembly in the package body is completed.

Such a hermetically sealed structure is disclosed in "Electronic Information Communication Society 1995 Electronics Society Conference Proceedings" published by The Institute of Electronics, Information and Communication Engineers, C-187 "Consideration of automatic assembly of unadjusted mounting type module". ing.

FIG. 8 shows an example of an optical module having a simple sealing structure. In the semiconductor module 1 having a simple sealing structure, the semiconductor laser 10 and the optical fiber 11 are attached to the stem 21 to which the electric terminals (leads) 20 are attached, and the insulating transparent resin 22 formed on the stem 21 is used. The structure is such that the tip portions of the semiconductor laser 10 and the optical fiber 11 are integrally sealed.

That is, a support portion 23 made of a rectangular body is projected at approximately the center of the flat surface of the stem 21, and a heat sink 24 made of silicon or the like is provided on one side surface of the support portion 23.
Is fixed. Then, the semiconductor laser 10 is fixed to one end side (the right end side in the drawing) of the heat sink 24, and the optical fiber 1 extending from the optical fiber cable 25 so that its tip faces one emission surface of the semiconductor laser 10.
1 is fixed. The optical module 1 having the simple sealing structure is used for a CD, for example.

In the optical module 1 having the simple sealing structure,
The stem 21 is used as a frame for accumulating the resin 22 around the semiconductor laser 10, and the resin is supplied by potting.

Such a simple encapsulation structure is disclosed in "Electronic Information Communication Society 1995 Electronics Society Conference Proceedings 1" published by The Institute of Electronics, Information and Communication Engineers, C-212 "Resin-encapsulated pigtail LD module". There is.

[0018]

In the conventional optical module 1 having a hermetically sealed structure, a special container (package) is required, and the volume of the optical module (module volume) becomes large. As a result, the mounting volume for the mounting board increases.

Further, in the hermetically sealed structure, the electric cable 1
Since the structure using No. 4 is used, the transmission distance is likely to be long, and the structure is such that it is difficult to cope with high frequencies due to electrical characteristics.

On the other hand, even in the conventional optical module 1 having a simple sealing structure, since the resin 22 is accumulated on the stem 21, the module volume becomes large.

Further, in the simple sealing structure, since the electric terminal 20 is joined to the driving board, that is, the mounting board, it is difficult to cope with high frequency due to electrical characteristics due to the wiring layout.

An object of the present invention is to provide an optical element mounting body capable of reducing the sealing volume. Another object of the present invention is to provide an optical element mounting body which does not require a special container. Another object of the present invention is to provide an optical element mounting body capable of realizing high speed operation. The above and other objects and novel features of the present invention will become apparent from the description of this specification and the accompanying drawings.

[0023]

The outline of the representative ones of the inventions disclosed in the present application will be briefly described as follows. Exchanges of light between the predetermined optical element and the semiconductor chip is provided an electrode that both projects the main surface when the semiconductor chip is fixed with at least one or more light elements (1) main surface An optical element mounting substrate to which an optical fiber is attached, a mounting substrate having a land corresponding to the electrode on a main surface, and the optical element mounting substrate being fixed to the land via the electrode, the semiconductor chip And the implementation
Insulating and transparent resin that fills the space between the board and
Insulating resin covering the surface of the transparent resin,
When the surface of the mounting board having the land is depressed one step lower,
Through holes that communicate with the recesses in the mounting board
Is provided, and the inlet of the through hole is filled with solder.
Block the inside of the solder with the transparent
Akira resin is filled, the semiconductor chip is characterized that it is non-contact with the mounting substrate. At least before
A conductor layer is provided on the entire rear surface of the optical element mounting substrate, and the conductor layer is electrically connected to a ground provided on the mounting substrate by fixing the optical element mounting substrate to the mounting substrate. Is configured. The optical element mounting substrate has an optical waveguide in its surface layer portion, and the optical element and the optical fiber are optically connected via the optical waveguide. External terminals are provided on the mounting board to form a single product as a whole.

[0024]

[0025]

[0026]

According to the above-mentioned means (1), (a) sealing does not use the package body (container body), but the optical element mounting substrate is fixed to the mounting substrate by face-down bonding,
Moreover, since the optical element mounting substrate is covered with the lid, the sealing volume can be reduced and the sealing cost can be reduced.

(B) Since the optical element mounting substrate is fixed to the mounting substrate by face-down bonding, the routing of wiring is shortened and the optical element mounting body can operate at high speed.
As a result, it is possible to handle high frequencies.

(C) Since the optical element mounting substrate is fixed to the land via the protruding electrode, the semiconductor chip does not come into contact with the mounting substrate, and damage to the semiconductor chip can be prevented.

(D) Since the optical element mounting substrate is fixed to the land via the electrodes, heat of the optical element mounting substrate can be released to the mounting substrate, and stable operation of the optical element can be obtained.

(E) All over the back surface of the optical element mounting substrate
Is provided with a conductor layer , and the conductor layer is electrically connected to the ground of the mounting board to form an electromagnetic shield structure,
It is possible to stabilize the potential of the optical element mounting substrate.

(F) The optical element mounting substrate has an optical waveguide in the surface layer portion thereof, and the optical element and the optical fiber are optically connected via the optical waveguide, so that the optical element and the optical fiber are good. Optical connection is obtained.

(G) The optical element mounting body having external terminals on the mounting substrate can be miniaturized by reducing the sealing volume.

(H) The sealing means is made of a mounting substrate, an optical element mounting substrate, a transparent resin, and an insulating material that covers the transparent resin.
Since it is made of resin , a special container such as a package body or a lid is not required, and it is possible to achieve a reduction in sealing volume and a reduction in sealing cost.

[0035]

(I) Since the semiconductor chip is sealed by covering it with an insulating transparent resin, the moisture resistance of the semiconductor chip is maintained.

(J) In the structure in which the semiconductor chip is covered with the insulating transparent resin and the space between the semiconductor chip and the mounting substrate is filled with the insulating resin for sealing, the sealing effect is It is further increased, and sealing characteristics such as moisture resistance are enhanced. Further, the fixing strength of the optical element mounting substrate and the reliability with respect to the heat cycle are enhanced.

(K) The space between the optical element mounting substrate and the mounting substrate is filled with an insulative and transparent resin, and the surface of the resin is covered with an insulative resin to enhance the sealing property. To be done.

(L) Since the transparent resin is filled through the through holes facing the semiconductor chip, the semiconductor chip is surely covered. Further, the sealing characteristics are further enhanced by filling the inlet of the through hole with solder.

[0040]

DETAILED DESCRIPTION OF THE INVENTION Embodiments of the present invention will be described in detail below with reference to the drawings. In all the drawings for explaining the embodiments, parts having the same functions are designated by the same reference numerals, and repeated description thereof will be omitted.

(Embodiment 1) FIG. 1 is a schematic sectional view showing an outline of an optical element mounting body which is an embodiment (Embodiment 1) of the present invention, and FIG. 2 is an exploded perspective view.

In the first embodiment, an optical element mounting body in which an optical element mounting substrate having a semiconductor laser as an optical element is face-down bonded to a mounting substrate and the optical element mounting substrate is covered with a lid will be described. That is, the structure is such that the package body is not used as a package.

The optical element mounting body 30 of the first embodiment is shown in FIG.
As shown in FIG. 2 and FIG. 2, the mounting substrate 31, the optical element mounting substrate 32 mounted on the upper surface (main surface) of the mounting substrate 31 by face-down bonding, and the lower side that covers the optical element mounting substrate 32 are open. Box-shaped lid 33
It consists of

The electrodes 34 of the optical element mounting substrate 32 are also provided.
The semiconductor chip 35 is fixed to the main surface on which the lower part is partially embedded in the optical element mounting substrate 32.

The optical element mounting substrate 32 is made of, for example, a silicon plate, and a linear optical waveguide 36 is provided in a portion extending from one end of the semiconductor chip 35 to the end of the optical element mounting substrate 32. The end of the optical element mounting substrate 32, which is the end of the optical waveguide 36, is optically connected to the tip of an optical fiber 37 that is composed of a core and a clad that wraps the core. The structure in which the semiconductor chip 35 and the optical fiber 37 are optically connected to the optical waveguide 36 of the optical element mounting substrate 32 is described in, for example, “Electronics Information and Communication Society 1996 General Conference Proceedings Electronics 1” published by The Institute of Electronics, Information and Communication Engineers, C-277 "W using PLC platform
The structure is similar to that disclosed in "Reception Characteristics of DM Optical Circuit".

The semiconductor chip 35 is not particularly limited, but a semiconductor laser (not shown) as an optical element and a modulator (not shown) that is connected to the semiconductor laser and modulates the laser light of the semiconductor laser. No.) has a monolithically formed structure. Therefore, the number of the electrodes 34 provided on the optical element mounting substrate 32 is also four. On the surface of the electrode 34, a protruding electrode (bump electrode) 34a is provided.

The protruding electrodes 34a are made of solder bumps, for example, but may be ball electrodes made of a metal other than solder.

That is, in the first embodiment, the mounting substrate 31
The optical element mounting board 32 may be connected to the mounting board 31 so that the mounting board 31 and the optical element mounting board 32 can be electrically connected to each other and fixed to the mounting board 31. As such a connection method, there is also a method of fixing with a conductive adhesive using a ball portion of ball bonding other than the solder bump.

As an example of monolithically incorporating another optical element into a semiconductor chip, there are a semiconductor laser and a monitor. Further, when more optical elements are incorporated, the number of electrodes is correspondingly increased.

The bump electrode 34a is fixed to a land 40 provided on the main surface of the mounting substrate 31 and corresponding to the bump electrode 34a. The mounting substrate 31 and the optical element mounting substrate 3 are formed by the bump electrodes 34a or the thicknesses of the bump electrodes 34a and the lands 40.
A predetermined gap is formed between the semiconductor chip 35 and the semiconductor chip 35.
Between the mounting board 31 and the mounting board 31 (see FIG. 1)
Are formed. This is to prevent the semiconductor chip 35 made of fragile silicon from being damaged by coming into contact with the mounting substrate 31.

The mounting board 31 is formed of a multilayer wiring board, and is formed of a multilayer ceramic wiring board or a multilayer printed wiring board made of glass epoxy resin.

In the first embodiment, since the optical element mounting body 30 is a single product, the mounting board 31 is as small as possible, and the main surface is provided with the external terminal 42. A ground layer (ground) 43 is provided on the entire middle layer of the mounting substrate 31. In addition, the ground layer 43
Above the above, the predetermined land 40 and the predetermined external terminal 4 are provided.
An embedded wiring 44 for electrically connecting the two is provided. The embedded wiring 44, the land 40, and the external terminal 42 are electrically connected via the conductors 45 and 46 filled in the via hole.

Further, on the main surface of the mounting substrate 31, a lid fixing metallization layer 47 having a rectangular frame shape is provided so as to surround the fixing region of the optical element mounting substrate 32. The lid fixing metallization layer 47 is electrically connected to the ground layer 43 through a conductor 48 filled in the via hole.

The box-shaped lid 33 is hermetically fixed to the lid-fixing metallization layer 47 via a bonding material 49 such as solder (see FIG. 1).

The portion of the lid 33 corresponding to the optical fiber 37 is the optical fiber 3 when the lid 33 is placed on the mounting substrate 31.
7 is cut out in a V shape so as not to contact 7 (notch portion 5
0), the void formed by the cutout 50 is closed by the bonding material 49.

As shown in FIG. 1, the lid 33 is formed by a lid main body 51 made of, for example, a high heat resistant resin, and a metallized layer 52 covering the entire surface of the lid main body 51. The lid 33 is connected to the conductor 4 via a conductive bonding material 49.
Since it is electrically connected to the ground layer 43 by being fixed to 8, the optical element mounting substrate 32 has an electromagnetic shield structure, is not influenced by external electromagnetic waves, and does not oscillate outside the lid 33.

The optical element mounting body 30 of the first embodiment has the following effects. (1) Sealing does not use the package body (container body),
The structure that uses only the lid 33, and the lid 33
Has a structure that covers a short portion in which the optical element mounting substrate 32 is fixed to the mounting substrate 31 by face-down bonding, the size and height of the lid 33 can be reduced.
The sealing volume can be reduced.

(2) Sealing does not use the package body,
Since the structure uses the lid 33, the number of parts is reduced, and the sealing cost can be reduced.

(3) Mount the optical element mounting substrate 32 on the mounting substrate 31
Since the structure is fixed by face-down bonding, wiring can be shortened and high-speed operation of the optical element mounting body becomes possible. As a result, it is possible to handle high frequencies.

(4) Since the optical element mounting substrate 32 is fixed to the land 40 via the protruding electrode 34a,
Since a gap 41 is generated between the mounting board 31 and the semiconductor chip 35, and the semiconductor chip 35 does not contact the mounting board 31, damage can be prevented. As a result, the manufacturing yield of the optical element mounting body 30 is improved.

(5) Since the optical element mounting substrate 32 is fixed to the land 40 via the bump electrodes 34a made of solder, the heat of the optical element mounting substrate 32 can be released to the mounting substrate 31, and the optical element A stable operation of a semiconductor laser or the like can be obtained.

(6) Since at least the surface of the lid 33 serves as a conductor (metallized layer 52) and the conductor is electrically connected to the ground layer 43 of the mounting substrate 31 to have an electromagnetic shield structure, the potential of the optical element mounting substrate 32 is reduced. Can be stabilized. The metallized layer 52 may be only on the front surface or the back surface of the lid 33.

(7) The optical element mounting substrate 32 has the optical waveguide 36 in the surface layer portion thereof, and the optical element (semiconductor laser) and the optical fiber 37 are optically connected via the optical waveguide 36. A good optical connection can be obtained between the optical element and the optical fiber 37.

(8) The optical element mounting body 30 having the external terminals 42 on the mounting substrate 31 can be downsized by reducing the sealing volume.

(Embodiment 2) FIG. 3 is a schematic sectional view showing the outline of an optical element mounting body according to another embodiment (Embodiment 2) of the present invention, and FIG. 4 is an exploded perspective view.

The optical element mounting body 30 of the second embodiment is the same as the optical element mounting body 30 of the first embodiment, except that no special container such as a package body or a lid 33 is used for forming a package (sealing body). In this example, the optical element mounting substrate 32 is used as a package lid.

The optical element mounting body 30 includes a mounting board 31 and an optical element mounting board 3 hermetically fixed to the mounting board 31.
2 and.

Since the optical element mounting substrate 32 is hermetically fixed to the mounting substrate 31, a frame-shaped sealing bonding layer 60 is formed along the periphery of the main surface of the optical element mounting substrate 32 to which the semiconductor chip 35 is fixed. And the sealing bonding layer 60 is provided.
The bonding layer 61 for sealing is provided corresponding to. These sealing bonding layers 60 and 61 are made of a metallized layer, and the surface thereof is formed of at least a metal that is easily wetted by solder.

The sealing bonding layer 61 of the mounting substrate 31 and the sealing bonding layer 60 of the optical element mounting substrate 32 are hermetically fixed by a bonding material (not shown) such as solder.

The bonding layer 61 for sealing is electrically connected to the ground layer 43 through the conductor 62 filled in the via hole.

A metal coat layer 63 is provided on the entire back surface of the optical element mounting substrate 32. Further, the metallized layer 64 is provided from the side surface of the optical element mounting substrate 32 to the peripheral portion of the main surface. The metallized layer 64 is electrically connected to the metal coat layer 63. The sealing bonding layer 60 is formed on the metallized layer 64.

Thus, the optical element mounting substrate 32 and the mounting substrate 31 form an electromagnetic shield structure.

Further, in order to prevent the semiconductor chip 35 fixed to the optical element mounting substrate 32 from coming into contact with the main surface of the mounting substrate 31, the main surface portion of the mounting substrate 31 inside the sealing bonding layer 61 has a single step. It is depressed low (recess 65). Therefore, the peripheral portion of the optical element mounting substrate 32 is hermetically fixed to the raised portion of the peripheral portion of the recess 65 of the mounting substrate 31.

In the optical element mounting body 30 of the second embodiment, not only the package body but also the dedicated lid is not used, so that the sealing volume can be made small. In particular, since the optical element mounting substrate 32 forming the optical element mounting body 30 is used as a lid and the optical element mounting substrate 32 is fixed to the mounting substrate 31 by face down bonding, the optical element mounting body 30 is It becomes thin. Moreover, the reduction of the sealing components can reduce the cost of sealing the optical element mounting body 30.

(Third Embodiment) FIG. 5 shows a third embodiment of the present invention.
FIG. 3 is a schematic cross-sectional view showing the outline of the optical element mounting body that is.
The optical element mounting body 30 of the third exemplary embodiment has a structure in which, in the optical element mounting body 30 of the second exemplary embodiment, the optical element mounting substrate 32 is fixed by bonding the protruding electrode 34a and the land 40 of the mounting substrate 31. ing.

Further, in order to electrically connect the metallization layer 64 electrically connected to the metal coat layer 63 of the optical element mounting substrate 32 and the ground layer 43 of the mounting substrate 31, the ground layer 43 is electrically connected. A pad 70 is formed on the upper end of the conductor 62 connected to the pad 62, and the pad 70 and the metallized layer 64 are connected by the bump electrode 34d. Thereby, the electromagnetic shield structure is formed.

In the third embodiment, the semiconductor chip 35 fixed to the main surface of the optical element mounting substrate 32 is covered with the insulating and transparent resin 71. The semiconductor chip 35 is made of transparent resin 7.
By covering with 1, the moisture resistance is improved.

Further, the mounting substrate 31 and the optical element mounting substrate 32
Insulating resin (underfill resin) in the gap between
72 is filled to enhance the sealing characteristics. Further, the underfill resin 72 improves the fixing strength of the optical element mounting substrate and the reliability with respect to the heat cycle.

In the optical device mounting body 30 of the fourth embodiment, since the sealing bonding layer 60 and the sealing bonding layer 61 for fixing the optical device mounting substrate 32 to the mounting substrate 31 are not necessary, The size of the device mounting board 32 can be minimized, and the optical device mounting body 30 can be further downsized.

(Fourth Embodiment) FIG. 6 shows a fourth embodiment of the present invention.
FIG. 3 is a schematic cross-sectional view showing the outline of the optical element mounting body that is.
The optical element mounting body 30 of the fourth embodiment has a structure in which the main surface side of the mounting substrate 31 is partially recessed by one step in the optical element mounting body 30 of the third embodiment. The optical element mounting substrate 3 having the electrode 34a protruding by the recess 80
2 can be brought closer to the mounting substrate 31, and the optical element mounting body 30 can be made thinner.

Main surface of mounting board 31 and optical element mounting board 32
Since the gap between the mounting substrate 3 and the underfill resin 72 becomes difficult to enter, the mounting substrate 3
1 through hole 81 is formed, and this through hole 81
Through to fill the underfill resin 72. The underfill resin 72 according to the fourth embodiment is formed of a transparent resin.

The inlet of the through hole 81 is closed by filling the solder 82.

The surface of the underfill resin 72 is covered with an insulating resin 83.

In the optical element mounting body 30 of the fourth embodiment, the space between the optical element mounting substrate 32 and the mounting substrate 31 is filled with an insulating transparent resin (underfill resin 72), and Since the surface of the resin 72 is covered with the insulating resin 83, the sealing property is enhanced.

Since the underfill resin 72 covering the semiconductor chip 35 is filled through the through holes,
The semiconductor chip 35 is surely covered and the moisture resistance is improved. Further, since the inlet of the through hole is filled with the solder 82, the sealing characteristic is further enhanced.

Although the invention made by the present inventor has been specifically described based on the embodiments, the present invention is not limited to the above embodiments, and various modifications can be made without departing from the scope of the invention. Needless to say, for example, the optical element mounting substrate 32 has a silicon platform structure, the optical fiber is guided to the V-shaped groove, and the tip of the optical fiber is fixed to the silicon platform so as to face the emitting surface of the semiconductor laser. Even with such a structure, the same effect as the above embodiment can be obtained.

Further, the optical element may be another optical element such as a light receiving element other than the semiconductor laser.

Further, in each of the above-described embodiments, a single product is described, but the configuration of the present invention can be applied to a general optoelectronic device. That is, by directly applying the structure of the present invention to the mounting substrate of the optoelectronic device, the optoelectronic device can obtain many of the above-described effects including the reduction of the mounting volume.

[0089]

The effects obtained by the typical ones of the inventions disclosed in the present application will be briefly described as follows. (1) A substrate on which an optical element is mounted (optical element mounting substrate) is directly mounted on an electric wiring board with the optical element mounting side facing each other, and a sealing lid or an optical element mounting substrate is used as a lid. It is possible to realize mounting with a small number of members, short-range electrical connection capable of high-frequency operation, and mounting with a large electromagnetic shielding effect while having sufficient sealing characteristics. (2) This is a very effective configuration for promoting the reliability and high functionality of a module equipped with an optical element and for promoting economic efficiency.

[Brief description of drawings]

FIG. 1 is a schematic cross-sectional view showing an outline of an optical element mounting body that is an embodiment (Embodiment 1) of the present invention.

FIG. 2 is an exploded perspective view showing an optical element mounting body of the first embodiment.

FIG. 3 is a schematic cross-sectional view showing an outline of an optical element mounting body that is another embodiment (Embodiment 2) of the present invention.

FIG. 4 is an exploded perspective view showing an optical element mounting body of the second embodiment.

FIG. 5 is a schematic sectional view showing an outline of an optical element mounting body that is Embodiment 3 of the present invention.

FIG. 6 is a schematic cross-sectional view showing an outline of an optical element mounting body that is Embodiment 4 of the present invention.

FIG. 7 is an exploded perspective view showing a conventional optical module having a hermetically sealed structure.

FIG. 8 is a cross-sectional view showing a conventional optical module having a simple sealing structure.

[Explanation of symbols]

1 ... Optical module, 2 ... Package, 3 ... Package body, 4 ... Lid, 5 ... Optical element mounting substrate, 6 ... Conductor layer, 7 ...
Grooves, 10 ... Semiconductor laser, 11 ... Optical fiber, 12 ... Guide hole, 13 ... Wire, 14 ... Electric cable, 15 ... Holding plate, 20 ... Electric terminal (lead), 21 ... Stem, 2
2 ... Resin, 23 ... Support part, 24 ... Heat sink, 25 ...
Optical fiber cable, 30 ... Optical element mounting body, 31 ... Mounting substrate, 32 ... Optical element mounting substrate, 33 ... Lid, 34 ... Electrode (protruding electrode, bump electrode), 35 ... Semiconductor chip,
36 ... Optical waveguide, 37 ... Optical fiber, 40 ... Land, 4
1 ... Gap, 42 ... External terminal, 43 ... Ground layer, 44 ...
Embedded wiring, 45, 46 ... Conductor, 47 ... Lid fixing metallization layer, 48 ... Conductor, 49 ... Bonding material, 50 ... Notch,
51 ... Lid body, 52 ... Metallization layer, 60, 61 ... Sealing bonding layer, 62 ... Conductor, 63 ... Metal coat layer, 64 ...
Metallized layer, 65 ... Dimple, 70 ... Pad, 71 ... Transparent resin, 72 ... Resin (underfill resin), 73 ... Transparent resin, 80 ... Dimple, 81 ... Through hole, 82 ... Solder, 83 ... Resin.

─────────────────────────────────────────────────── ─── Continuation of the front page (72) Inventor Yuji Akahori 3-19-2 Nishishinjuku, Shinjuku-ku, Tokyo Inside Nippon Telegraph and Telephone Corporation (72) Inventor Ikuo Ogawa 3-19-3 Nishishinjuku, Shinjuku-ku, Tokyo No. 2 Nihon Telegraph and Telephone Corporation (72) Inventor Noboru Ishihara 3-19-2 Nishishinjuku, Shinjuku-ku, Tokyo Nihon Telegraph and Telephone Corporation (56) Reference JP-A-8-153935 (JP, A) ) JP-A-7-86693 (JP, A) JP-A-9-26530 (JP, A) JP-A-63-271207 (JP, A) (58) Fields investigated (Int.Cl. ⁷ , DB name) H01S 5/00-5/50 G02B 6/42 H04B 10/00

Claims (4)

(57) [Claims] 1. A transfer of light between the at least one or more when the semiconductor chip is fixed electrode which protrudes both into the main surface is provided with an optical device and the semiconductor chip of predetermined light elements on the main surface and the optical element mounting substrate comprising an optical fiber mounted to perform a mounting substrate on which the optical element mounting substrate via the electrode to the corresponding land is provided and the land to the electrode on the main surface is fixed, the The space between the semiconductor chip and the mounting board is filled.
And an insulating resin that covers the surface of the transparent resin, and the surface of the mounting board having the land is recessed lower.
Both of the mounting boards have through holes that communicate with the recesses.
And the inlet of the through hole is filled with solder.
It is blocked by filling, and the transparent resin is filled inside the solder filling part.
An optical element mounting body , wherein the semiconductor chip is not in contact with the mounting substrate. 2. A conductor layer is provided on at least the entire back surface of the optical element mounting substrate, and the conductor layer is electrically connected to a ground provided on the mounting substrate by fixing the optical element mounting substrate to the mounting substrate. The optical element mounting body according to claim 1 , wherein the optical element mounting body is configured to be electrically connected. 3. The optical element mounting substrate has an optical waveguide in a surface layer portion thereof, and the optical element and the optical fiber are optically connected through the optical waveguide.
The optical element mounting body according to claim 1 . 4. The optical element mounting member according to any one of claims 1 to 3, characterized in that on the mounting substrate constitutes a single product on the whole is provided with external terminals.