JPH09273787A - Method for air conditioning in substrate-processing apparatus and substrate-processing apparatus - Google Patents

Abstract

PROBLEM TO BE SOLVED: To enable effecting an appropriate air conditioning inside an apparatus for processing a substrate. SOLUTION: In this air conditioning method in a substrate-processing apparatus 1 a current of air is passed from an upper part to lower part in a prescribed flow-down region 2 inside the apparatus 1. In this instance the flow-down region 2 is demarcated into a plurality of sub-flow-down regions 3a-3d. After flowing down through a first sub-flow-down region 3a, the current of air is supplied from the lower part of the sub-flow-down region 3a to the upper part of a second sub-flow-down region 3b and at the same time cleared of particles in the current and then made to flow down into another sub-flow-down region 3b. Thus reutilization of a current of air is done at least in part of the sub-flow- down regions 3a-3d provided in a plurality.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an air conditioning method in a substrate processing apparatus for performing air conditioning so that an air flow is made to flow downward from a predetermined flow-down area in the apparatus, and a method for suitably implementing the method. The present invention relates to a substrate processing apparatus.

[0002]

2. Description of the Related Art As a substrate processing apparatus of this type, for example, a spin coater for photoresist coating, a spin developer for development processing, a bake unit for performing various baking treatments (including a heating treatment section and a cooling treatment section). The substrate transfer device for transferring the substrate in the apparatus, the loading / unloading unit for loading / unloading the substrate to / from the apparatus, and the interface for transferring the substrate to / from the exposure unit for exposure processing attached to the apparatus ( An example of the substrate processing apparatus includes an IF) unit and the like and performs a series of substrate processing (photoresist coating, various baking processing, development processing, etc.) in the photoresist process.

In such an apparatus, when a substrate is carried in and out, it may be brought in from the outside, or particles (dust) generated from mechanical parts such as a substrate carrier may float inside the apparatus. Since it is a problem in manufacturing a substrate that such particles adhere to the substrate in the apparatus, in the conventional apparatus of this type, particles floating in the apparatus are caused to flow down and particles adhere to the substrate in the apparatus. For the purpose of preventing the above, the air flow is made to flow down to a predetermined flow-down area in the device (usually the entire device).

Further, in such a substrate processing apparatus of recent years, there are cases where chemical components such as alkali components and acid components adversely affect the production of substrates. In such a case, the chemical components are located above the flow-down region. A filter for removal is attached so that the air flow from which the chemical components have been removed flows down into the flow-down region, and the atmosphere in the flow-down region (apparatus) is controlled.

[0005]

However, in the conventional device, the airflow made to flow down to the downflow region (device) is used.
The particles are escaping from the lower side, and particles generated in the apparatus are diffused in a wide range from the lower side of the apparatus to the periphery of the apparatus. This type of device is usually installed in a clean room, but the conventional device has a problem that the cleanliness in the clean room is reduced over a wide range.

Further, in the conventional apparatus, the airflow that has flowed down to the downflow area is released from the lower side of the apparatus, and fresh air is always taken in from above the downflow area. Therefore, in the conventional apparatus equipped with a filter for removing chemical components, The chemical components contained in the fresh air taken in from above the flow-down area are constantly removed by a chemical component removal filter. Therefore, the life of the filter for removing chemical components is only about one year,
All the filters for removing the chemical components attached to the apparatus had to be replaced every year or so, resulting in high running costs.

The present invention has been made in view of such circumstances, and an air conditioning method and a substrate processing in a substrate processing apparatus capable of eliminating the inconvenience of the conventional apparatus and suitably performing air conditioning in the apparatus. The purpose is to provide a device.

[0008]

Means for Solving the Problems As one of the solutions to the above problems, the present inventor has installed filters such as a filter for removing particles and a filter for removing chemical components above the flow-down region to remove particles and chemicals. A configuration in which clean air from which components and the like have been removed is made to flow down to the downflow area, and that air is collected below the downflow area and supplied to the filters above the downflow area, so that air is circulated throughout the downflow area. I examined about.

According to the above construction, since the airflow that has flowed down to the downflow area is not released from the lower side of the apparatus to the outside of the apparatus, the disadvantage that the particles in the downflow area that have flowed down together with the airflow are diffused around the apparatus is eliminated. It

Further, in the case of an apparatus equipped with a filter for removing chemical components, since the air from which the chemical components have been once removed is circulated as described above, the chemical components are always filtered by the filter without circulating the air. It can be expected that the life of the filter for removing chemical components is longer than that of the conventional configuration for removing.

However, in the case of the structure in which the air is circulated, the following problems may occur. That is,
This type of device is generally equipped with a heat source such as a controller, power supply, and motor driver.In a device that performs a series of substrate processing in the photolithography process, a heat source such as a heat treatment unit is also included in the device. I have it. Therefore, when the air is warmed down by the heat source when flowing down the air in the downflow area, and the heated air is circulated again in the downflow area, the downflow area (device)
The temperature inside gradually rises.

As described above, the change (gradual increase) of the temperature in the apparatus with the passage of time becomes a problem in manufacturing the substrate. For example, in the case of a substrate processing apparatus that performs photoresist coating and development processing, in order to make the film thickness and development line width of the photoresist film that is coated on the substrate uniform, a photo film is supplied to a spin coater or spin developer that performs the above processing. A chemical solution temperature control unit is provided for adjusting a chemical solution such as a resist solution or a developing solution to a predetermined temperature. However, when a temperature change occurs such that the temperature inside the apparatus gradually rises as described above, it becomes impossible to supply the chemical solution whose temperature is regulated to a predetermined temperature to the spin coater or the spin developer, or the temperature around the substrate during the processing is reduced. Since the environmental temperature changes, the thickness of the photoresist film applied to the substrate becomes non-uniform and the development line width becomes non-uniform.

Therefore, it is conceivable to carry out temperature control so as to suppress the temperature rise in the entire apparatus, but if such temperature control is attempted to be realized, it will result in a considerably expensive system, which is cost-effective. It's not practical.

Further, a substrate processing apparatus for performing a series of substrate processing in the photolithography process includes a substrate processing unit (HMDS processing unit) for performing so-called HMDS processing in order to improve the adhesion between the photoresist film and the substrate. Although it may be provided, if a leak occurs from the HMDS processing part, ammonia (alkali component) will be diffused in the flow-down region. In such a case, if the air is circulated in the flow-down region as described above, the alkaline component generated in the flow-down region will be repeatedly removed by the filter for removing the chemical components, so that the chemical component removal The life of the filter is rather shortened.

Therefore, in order to achieve the above object, the present inventor has made the following invention in consideration of the above-mentioned examination result.

That is, the method invention according to claim 1 is
In an air conditioning method in a substrate processing apparatus for flowing an airflow downward from a predetermined flow-down area in the apparatus, the flow-down area is divided into a plurality of small flow-down areas, after flowing the airflow to a certain small flow-down area, It is characterized in that the airflow is supplied from the lower side of the small downflow area to the upper side of another small downflow area, particles in the airflow are removed, and the particles are made to flow down to the other small downflow area. is there.

Further, the method invention according to claim 2 is an air conditioning method in a substrate processing apparatus in which an air flow is made to flow down to a predetermined flow-down area in an apparatus from above to below, and the flow-down area is a plurality of small flow-down areas. Of the plurality of small flow-down regions, at least above the first small flow-down region that takes in the air outside the apparatus, after removing the chemical component including the alkali component or the acid component and flowing the small flow-down region. The airflow is supplied from the lower side of the small downflow area to the upper side of another small downflow area so as to flow down to the other small downflow area.

Further, the method invention according to claim 3 is the air conditioning method for a substrate processing apparatus according to claim 1, wherein at least the first small air-intake area of the plurality of small flow-down areas for taking in air outside the apparatus. It is characterized in that a chemical component including an alkaline component or an acid component is removed above the flow-down region.

Further, a method invention according to claim 4 is the air conditioning method in the substrate processing apparatus according to any one of claims 1 to 3, wherein at least one small downflow region of the plurality of small downflow regions is used. When the region is a region requiring temperature / humidity management, the temperature / humidity of the airflow to be flown down to the small flow-down region requiring temperature / humidity management is adjusted.

According to a fifth aspect of the present invention, there is provided a substrate processing apparatus configured such that an airflow is made to flow downward from a predetermined flow-down area in the apparatus to a predetermined flow-down area. Partitioning means for partitioning into two small flow-down areas and a flow of air that has flowed down to the i-th (i is a natural number less than or equal to (n-1)) small flow-down area from (i + 1) below the small flow-down area. ) Th small flow-down region, and one or more air flow supply means for making it flow down to the (i + 1) th small flow-down region; and (i + 1) -th from the i-th small flow-down region by the air flow supply device. Removal means for removing particles from the airflow supplied to the small downflow area, and air is drawn down from above the first small downflow area when the airflow is sequentially supplied between the plurality of small downflow areas. Air intake It is characterized in that it comprises a stage, a.

According to a sixth aspect of the present invention, there is provided a substrate processing apparatus configured to cause an air stream to flow down from a predetermined direction to a predetermined flow-down area in the apparatus. Partitioning means for partitioning into two small flow-down areas and a flow of air that has flowed down to the i-th (i is a natural number less than or equal to (n-1)) small flow-down area from (i + 1) below the small flow-down area. ) One or more air flow supply means for supplying the air flow above the (i + 1) th small flow-down area and the air flow supply means for sequentially supplying the air flow between the plurality of small flow-down areas. In this case, an air intake means for taking in air from the upper side of the first small flow-down area and a flow-down means, and an alkaline component or an acid component from the air flow attached to the upper side of the first small flow-down area to flow down the small flow-down area. Exclude chemical components A chemical component removing means for, is characterized in that it comprises a.

According to a seventh aspect of the present invention, in the substrate processing apparatus according to the fifth aspect, the apparatus is installed above at least the first small flow-down area and is made to flow down to the small flow-down area. It is characterized by comprising a chemical component removing means for removing a chemical component including an alkali component or an acid component.

Further, the apparatus invention according to claim 8 is the substrate processing apparatus according to any one of claims 5 to 7, wherein at least one small downflow area of the n small downflow areas is It is a region requiring temperature / humidity management, and is characterized by including temperature / humidity adjusting means for adjusting the temperature / humidity of the airflow to be flown into the small flow-down region requiring temperature / humidity management.

[0024]

The operation of the method according to the first aspect is as follows. The inside of the downflow area is divided into a plurality of small downflow areas so that the downflow of the airflow in the downflow area can be divided into a plurality of small downflow areas. Then, first, the airflow is made to flow down to a certain small flow-down area, and then the airflow is supplied from below the small flow-down area to above another small flow-down area, and particles in the supplied airflow are removed, and An air stream from which particles (particles generated in the previous small flow area and included in the supplied air stream) are removed is flowed down to the other small flow area. When a small downflow area to which the airflow is to be flowed down is defined, the other small downflow area is defined as the above-mentioned small downflow area, and further downflow is performed in another small downflow area. It will be reused in sequence between the small spill areas.

The apparatus invention according to claim 5 is an apparatus for suitably carrying out the method invention according to claim 1. That is, the flow-down area is n by the partitioning means,
That is, it is divided into two or more small flow-down areas. Then, the air intake means takes in air from above the 1 (i = 1) th small flow-down region when the airflow is sequentially supplied between the plurality of small flow-down regions, and causes the air to flow down to the first small flow-down region. Next, the first small flow-down area and 2 ((i = 1)
The airflow supply means for supplying the airflow between the (+1) th small downflow area supplies the airflow that has flowed down to the first small downflow area to above the second small downflow area from below the small downflow area. The removing means removes particles (particles generated in the first small flow-down area and included in the supplied airflow) and causes the particles to flow down to the second small flow-down area. In addition, when a small downflow area for letting the airflow fall is further partitioned, i (i is a natural number not more than (n-1)) is similarly applied to a plurality of small downflow areas in which the airflow is reused. ) The airflow supplied to the i-th small flow-down area is supplied from below the small flow-down area to the (i + 1) th small flow-down area. The particles are supplied to the upper part of the (n + 1) th small flow-down region and particles are removed by the removing means to flow down to the (i + 1) th small flow-down region.

The i-th small downflow area (the above-mentioned small downflow area) is one small downflow area, and the (i + 1) th small downflow area (the above other small downflow area) is two or more small downflow areas. However, the airflow made to flow down in the i-th small downflow area may be reused in two or more (i + 1) th small downflow areas, or the i-th small downflow area may be reused. In one or more small downflow areas, the (i + 1) th small downflow area is one small downflow area, and the airflow made to flow down in the two or more ith small downflow areas is changed to the one (i + 1) th downflow area. It may be reused in the small flow-down area. Further, the airflow is reused for a part of a plurality of partitioned small downflow areas (for example, three small downflow areas partitioned into four small downflow areas). May be.

In the method invention according to the second aspect, among the plurality of small flow-down regions, at least the first small flow-down region for taking in the air outside the apparatus is removed to remove the chemical component including the alkaline component or the acid component. After that, the air stream containing no chemical component flows down the small downflow area, and the airflow is further supplied from below the small downflow area to above the other small downflow area to pass through the other small downflow area. Run down. If there is another small downflow area where the airflow is to flow down, the airflow that has flowed down to the other small downflow area is allowed to flow down to another small downflow area. It will be reused in sequence between the runoff areas.

The apparatus invention according to claim 6 is an apparatus for suitably carrying out the method invention according to claim 2. That is, the flow-down area is divided into n small flow-down areas by the dividing means. Then, the air intake means is used when the airflow is sequentially supplied between the plurality of small flow-down areas.
Intake air from above the (i = 1) th small flow-down region,
It is made to flow down to the first small flow-down area. At this time, before the air flow is made to flow down to the first small flow-down region, the chemical component including an alkaline component or an acid component is removed by the chemical component removing means installed above the small flow-down region. Next, the air flow supply means for supplying the air flow between the first small flow-down area and the 2 ((i = 1) +1) th small flow-down area removes the chemical components to the first small flow-down area. The downflowing airflow is supplied to the upper side of the second small downflow area from the lower side of the small downflow area, and is made to flow down to the second small downflow area. In addition, when a small downflow area for letting the airflow fall is further partitioned, i (i is a natural number not more than (n-1)) is similarly applied to a plurality of small downflow areas in which the airflow is reused. ) The airflow supplied to the i-th small flow-down area is supplied from below the small flow-down area to the (i + 1) th small flow-down area. It is supplied above the (n + 1) th small flow-down region to flow down to the (i + 1) th small flow-down region.

At this time, the chemical component is taken into at least the first small flow-down area that takes in air outside the apparatus among the plurality of small flow-down areas (above the first small flow-down area).
If it is removed, that is, the chemical component removing means (such as a filter for removing the chemical component) may be attached above at least the first small flow-down region.

When the air is taken into the first small flow-down region, if the chemical components are removed, the air flow is reused in the plurality of small flow-down regions where the air flow is reused. A substrate processing unit (HMDS processing unit or the like) that handles the chemical component is included in any one of the plurality of small flow-down regions, and is limited only when a leak occurs in the substrate processing unit. It will occur only under the condition. In addition, the flow of the airflow in the plurality of small downflow regions where the airflow is reused is 1
The second small flow-down area, the second small flow-down area, the third small flow-down area, ... Are vertically connected in series (the first small flow-down area,
It is equivalent to stacking the second small flow-down region, the third small flow-down region, ... In the vertical direction) and flowing down from above the first small flow-down region to below the last small flow-down region. Therefore, if there is no substrate processing unit that handles chemical components, if the chemical components are removed before the air flow is made to flow down to the first small flow-down region, the chemical components will be included in the air flow to be flowed down to the second and subsequent small flow-down regions. Is not included and the chemical component removing means may not be attached above the second and subsequent small flow-down regions. In addition, even if the substrate processing unit that handles chemical components is included in any of the small downflow regions of the multiple airflow reuse regions, that substrate processing unit is used as the last small downflow region that reuses the airflow. In the same manner as above, the chemical component removing means need not be attached above the second and smaller small flow-down regions.

Of course, for safety, the chemical component removing means may be attached above the second and subsequent small flow-down areas, but the chemical component removing means attached to the second and subsequent small flow-down areas (for removing chemical components) The air flow passing through the filter, etc.) does not contain chemical components or the amount of chemical components is very small. Therefore, the life of the chemical component removing means installed above the second and subsequent small flow-down regions is considerably long. Become.

The inventions described in claims 3 and 7 are the same as the inventions described in claims 1 and 4, wherein an air stream from which a chemical component including an alkali component or an acid component is further removed is made to flow down to a flow-down region, The invention according to claims 2 and 6 for controlling the atmosphere in the flow-down area (apparatus) is added. According to the present invention, after the chemical component including the alkali component or the acid component is removed at least above the first small flow-down region that takes in the air flow outside the apparatus, the air flow not containing the chemical component becomes the small flow-down region. , And the airflow is further supplied from below the small downflow area to above the other small downflow area to flow down the other small downflow area. Further, the particles in the airflow supplied from the small downflow area to the other small downflow area are removed, and the airflow from which the particles have been removed flows down into the other small downflow area.

Further, according to the inventions of claims 4 and 8, at least one small downflow area of the plurality of partitioned small downflow areas is an area requiring temperature and humidity control, and the temperature and humidity adjusting means comprises: The temperature and humidity of the airflow flowing down from above the small flow-down area that requires temperature and humidity control is adjusted. At this time, for example, if the region requiring temperature / humidity management is the second or smaller small flow-down region when the airflow is reused in a plurality of small flow-down regions,
The temperature / humidity adjusting means adjusts the temperature / humidity of the airflow supplied by the airflow supplying means from the small flow-down area in the preceding stage.

[0034]

BEST MODE FOR CARRYING OUT THE INVENTION An embodiment of the present invention will be described with reference to FIGS. FIG. 1 is a perspective view for explaining a section of the present invention, FIG. 2 is a plan view showing a schematic configuration of some embodiments of the present invention, and FIG. 3 is each embodiment of FIG. FIG. 4 is a vertical cross-sectional view in which the small flow-down regions are drawn in parallel for easy understanding, and FIG. 4 shows the small flow-down regions arranged in the vertical direction in order to make the flow of the air flow in each embodiment of FIG. 2 easy to understand. FIG. 5 is a vertical cross-sectional view drawn instead of the above, FIG. 5 is a schematic configuration diagram of an example in which the temperature and humidity adjusting means is attached to each of the embodiments of FIG. 2, and FIG. 6 is a vertical cross section showing an example of the temperature and humidity adjusting means. It is a figure. In order to make the configuration easy to understand,
In each figure, the sizes of the fan unit and the filter unit are appropriately changed.

As shown in FIG. 1, the substrate processing apparatus 1 shown by a solid line has a flow-down region 2 shown by a chain line, and the air flow is made to flow downward from this flow-down region 2. In the present invention, the flow-down region 2 is divided into four small flow-down regions 3a to 3d in the figure by the partitioning means (such as a partition) indicated by a chain double-dashed line.

The term "compartment" used in the present invention means that each of the small flow-down areas 3a to 3d is divided to such an extent that the airflow can flow down independently. Therefore, for example, an opening for transferring the substrate between the small flow-down regions 3a to 3d,
An opening or the like that does not greatly affect the flow of the air flow in each of the small flow-down regions 3a to 3d may be provided between the small flow-down regions 3a to 3d. Further, in order to perform the air conditioning of the present invention more accurately, a shutter or the like that can be opened and closed is provided at the opening for transferring the substrate between the small flow-down areas 3a to 3d, and the shutter is opened only when the substrate is transferred. It may be configured as follows.

Although the flow-down area 2 shown in FIG. 1 is taken over the entire apparatus 1, the flow-down area 2 may be a partial area of the apparatus 1 or even in such a case. The invention is likewise applicable.

Hereinafter, some embodiments in which the flow-down area 2 is divided into four small flow-down areas 3a to 3d as shown in FIG. 1 will be described.

The first embodiment will be described with reference to FIGS. 2 (a) and 3 (a). In the first embodiment, the small downflow area 3a is the first small downflow area, and a fan unit 4a having a fan (not shown) therein and a filter (not shown) are provided above the first small downflow area 3a. An internal filter unit 5a is provided, and air (air outside the device 1) is taken in by a fan in the fan unit 4a, and a predetermined amount of air taken in when passing through the filter in the filter unit 5a is provided. The removal component is removed, and clean air is flown into the small flow-down area 3a.

In the substrate processing apparatus 1 for processing a substrate in an atmosphere from which chemical components such as alkali components or acid components have been removed, a filter for removing chemical components (such as a chemical adsorption filter) is provided in the filter unit 5a. Although the chemical components are removed from the airflow that is installed and flows down into the small flow-down region 3a, the filter for removing the chemical components is omitted in the apparatus 1 that does not need to maintain the atmosphere in which the chemical components have been removed.

The substrate processing apparatus 1 of this type is installed in a clean room, and in the clean room,
Since clean air from which particles having a comma number of μm or more have been removed is supplied, the clean air is supplied to the small flow-down area 3a.
If it is taken in, it is not necessary to remove the particles above the small flow-down region 3a, but if necessary, the small flow-down region 3a can be removed.
Particles may be removed from the air taken in above the filter. In such a case, a ULPA (ulpa) filter for removing particles, a HEPA (hepa) filter or the like is internally provided in the filter unit 5a. .

That is, above both the first small flow-down region 3a, when both a chemical component removing filter and a particle removing filter are attached, when either one of the filters is attached, both are attached. In some cases, the filter unit 5a may be omitted if no filters are attached.

Further, clean air is constantly flowing down in the clean room. Therefore, the fan unit 4a is omitted, and an opening, a punching hole, or a net is provided above the first small flow-down area 3a so that the clean air that has flowed down is simply taken in and flowed down to the small flow-down area 3a. May be. In such a configuration, the opening, punching hole, net, etc. above the first small flow-down area 3a form the air intake means of the first small flow-down area.

The first small flow-down area (3
The description of the fan unit (4a) and the filter unit (5a) in a) is the same for the fan unit and the filter unit in the first small flow-down area in other embodiments described later.

Below the small flow-down area 3a, a fan unit 4a 'in which a fan (not shown) is installed is provided.
Above the small downflow area 3b as the second small downflow area,
A fan unit 4b having a fan (not shown) installed therein and a filter unit 5b (not shown) having a filter (at least a particle removing filter) installed therein are provided, and air is provided between the fan unit 4a ′ and the fan unit 4b. A flow path 6 is provided. The airflow that has flowed down to the small flow-down region 3a is collected by the fan in the fan unit 4a 'below the small flow-down region 3a and is supplied to the upper side of the small flow-down region 3b via the air flow path 6 and inside the fan unit 4b. Is sent into the small flow-down area 3b by a fan of
At that time, particles etc. generated in the first small flow-down area 3a are removed by the filter in the filter unit 5b, and clean air is flowed down to the small flow-down area 3b.

Similarly, a fan unit 4 in which a fan (not shown) is provided below the second small flow-down area 3b is similarly provided.
b'is a fan unit 4c in which a fan (not shown) is installed above the third small flow-down area 3c, and a filter unit 5c in which a filter (not least a filter for removing particles) is installed inside the fan. An air flow path 6 is provided between the unit 4b 'and the fan unit 4c.
However, below the third small flow-down area 3c, a fan unit 4c 'in which a fan (not shown) is installed is located above the fourth small flow-down area 3d and in a fan unit 4d in which a fan (not shown) is installed. A filter unit 5d having a filter (not shown) (at least a filter for removing particles) therein is provided, and an air flow path 6 is provided between the fan unit 4c ′ and the fan unit 4d. Then, the airflow that has flowed down to the second small flow-down area 3b is the third small flow-down area 3 from the bottom of the small flow-down area 3b.
The particles, etc. generated in the second small flow-down area 3a are removed from the second small flow-down area 3a and are flowed down to the small flow-down area 3c. The particles are supplied above the fourth small flow-down area 3d from below, particles and the like generated in the third small flow-down area 3a are removed, and the particles are flowed down to the small flow-down area 3d.

In the first embodiment, the filter units 5b to 5d (filters) correspond to the removing means. Further, the fan units 4a ', 4b', 4c '(fans) below the front-side flow-down regions 3a to 3c, the respective air flow paths 6, and the fan units 4b, 4c, 4d above the rear-side small flow-down regions 3b to 3d. (Fan) is in each small flow area 3
They correspond to air flow supply means between a, 3b, 3b, 3c, 3c and 3d. Furthermore, the fan unit 4a
The (fan) corresponds to the air intake means in the first small flow-down area.

Next, a second embodiment will be described with reference to FIGS. 2 (b) and 3 (b). The same components as those in the first embodiment are designated by the same reference numerals as those in FIGS. 2A and 3A, and detailed description thereof will be omitted.

In the second embodiment, the airflow made to flow down to one small downflow area 3a as the first small downflow area is divided into two small downflow areas 3 as the second small downflow area.
b and 3c, and the airflow that has flowed into the second small flow-down area 3c is the small flow-down area 3 as the third small flow-down area.
It is configured to flow down into d.

Therefore, in the second embodiment, as compared with the first embodiment, the fan unit 4b 'below the small flow-down area 3b and the air passage 6 between the small flow-down areas 3b and 3c. The fan unit 4a ″ is provided below the small flow-down area 3a, and the air passage 6 is provided between the fan unit 4a ″ and the fan unit 4c above the second small flow-down area 3c.

Next, a third embodiment will be described with reference to FIGS. 2 (c) and 3 (c). The same components as those in the first embodiment are designated by the same reference numerals as those in FIGS. 2A and 3A, and detailed description thereof will be omitted.

In the third embodiment, the air currents made to flow down to the two small flow-down areas 3a and 3b as the first small flow-down area are supplied to one small flow-down area 3c as the second small flow-down area. The airflow that is made to flow down and is made to flow down to the second small flow-down area 3c is made to flow down to the small flow-down area 3d as the third small flow-down area.

Therefore, in the third embodiment, the air flow path 6 between the small flow-down regions 3a and 3b is omitted from the first embodiment, and the air flow between the small flow-down regions 3a and 3c is eliminated. A path 6 is provided.

Next, a fourth embodiment will be described with reference to FIGS. 2 (d) and 3 (d). The same components as those in the first embodiment are designated by the same reference numerals as those in FIGS. 2A and 3A, and detailed description thereof will be omitted.

In the fourth embodiment, the small flow-down area 4d
A plurality of small downflow areas (3a to 3c) for reusing the airflow
It is configured such that the airflow is independently taken in, and a predetermined removal component is removed to flow down.

Therefore, in the fourth embodiment, as compared with the first embodiment, the fan unit 4c 'below the small flow-down area 3c and the air flow path 6 between the small flow-down areas 3c and 3d. Is omitted.

The fan unit 4 in the small flow-down area 3d
The same can be said for the d and the filter unit 5d as described above for the fan unit 4a and the filter unit 5a in the first small flow-down area 3a.

The embodiments shown in FIGS. 2 and 3 are merely examples, and can be realized by other configurations.
The present invention is characterized in that the downflow area 2 in the substrate processing apparatus 1 is divided into a plurality of small downflow areas, and the airflow is reused in at least a part of the small downflow areas. It is a thing. Therefore, it is possible to appropriately reuse the airflow so that the airflow is optimally flown down to each small flow-down area according to the substrate processing unit included in each small flow-down area. Further, the number of compartments is not limited to four, but may be two or more, and the manner of compartments may be set in the substrate processing unit or the like included in the downflow area 2 (apparatus 1) so that the airflow can be reused optimally. You may divide suitably according to it.

Further, in the above embodiment, the air flow supply means is composed of the fan unit below the front small flow-down area, the air flow path, and the fan unit above the rear small flow-down area. If it is possible to supply the airflow that has been made to flow down to the upper part of the small flow-down region of the latter stage from the lower part of the small flow-down region of the first stage, and to make it flow down to the small flow-down region of the second stage, it is possible to configure either one fan unit and the air flow path. You can
The fan unit may be arranged at an appropriate place. Further, the location of each filter unit is not limited to the location shown in the figure (above the downstream small-flowing area) as long as the particles and the like generated in the upstream small-flowing area can be removed from the airflow flowing into the respective small downstream areas.

According to the present invention, the downflow area 2 in the apparatus 1 is divided into a plurality of small downflow areas (3a to 3d), and the airflow is reused in at least a part of the small downflow areas. Since the air including the particles is partially included in the small downflow area (in the first and third embodiments, the small downflow area 3
d, in the second embodiment, the small flow-down regions 3b, 3d, the fourth
In this embodiment, it is only discharged from the small flow-down regions 3c, 3d). On the other hand, in the conventional apparatus, air containing particles is discharged from the entire lower side of the apparatus 1 (corresponding to all of the small flow-down areas 3a to 3d). Therefore, as is apparent from a comparison between the two, the range in which the particles outside the apparatus 1 are diffused is smaller in the present invention.

Further, the air discharged from the lower side of the apparatus 1 is collected and made to flow to an exhaust source or the air discharged from the lower side of the apparatus 1 is collected and made into a clean air through a filter for removing particles, and the like. When it is configured to be discharged to the outside, in the configuration of the conventional device, the airflow must be collected under the entire device 1 (all of the small flow-down regions 3a to 3d), whereas in the present invention, a part of the airflow is collected. Since it is sufficient to collect the airflow in the small flow-down area, the airflow can be easily collected.

Further, when the airflow is circulated in the entire downflow area 2, the same air repeatedly flows in the entire downflow area 2, so that the air flowing down in the entire downflow area 2 is gradually warmed, and the inside of the apparatus 1 is gradually heated. However, according to the present invention, since the same airflow flows only once in the same small downflow area (3a to 3d), in each small downflow area (apparatus 1). Temperature changes due to heat sources are unlikely to occur. In order to further prevent the thermal effect, a plurality of small flow-down regions (3a to 3d) for reusing the air flow.
The last small flow-down area (the small flow-down area 3d in the first and third embodiments, and the small flow-down areas 3b, 3 in the second embodiment).
d, in the fourth embodiment, the heat source may be provided in the small flow-down region 3c).

By the way, in the case of removing the chemical components such as the alkali component or the acid component from the air flow flowing down to all or a part of each of the small flow-down regions 3a to 3d (for example, a substrate to which a chemically amplified photoresist is applied). In the case where treatment is performed), it is necessary to equip the filter unit with a filter for removing chemical components (such as a chemical adsorption filter).

Here, the flow of the airflow in the plurality of small downflow areas where the airflow is reused is such that the first small downflow area, the second small downflow area, the third small downflow area, ... Are vertically connected in series. (The first small flow-down area, the second small flow-down area, the third small flow-down area, and so on are stacked in the vertical direction), and flow down from above the first small flow-down area to below the last small flow-down area. Is equivalent to being done. This is illustrated in FIG. 4 (FIGS. 4A to 4D correspond to FIGS. 2 and 3A to 3D) when the first to fourth embodiments are illustrated.

When the air is taken into the device 1, after the chemical component is removed, the chemical component to be removed is the device 1
A substrate processing unit (HMDS processing unit or the like) that handles the above chemical components is included in the inside, and it occurs in the apparatus 1 only under limited conditions such as when a leak occurs in the substrate processing unit.

In view of the above point, in the plurality of small flow-down regions for reusing the air flow, when there is no substrate processing section for handling chemical components, the filter unit (first, second, The filter unit 5a in the fourth embodiment and the filter unit 5 in the third embodiment.
a) and 5b), if the chemical components are removed, the filter units in the second and subsequent small flow-down regions (the filter units 5b to 5d in the first and second embodiments, the filter unit 5c in the third embodiment, 5d, in the fourth embodiment, the chemical components need not be removed by the filter units 5b, 5c). Therefore, it is not necessary to include a chemical component removal filter in the second and subsequent small flow-down region filter units. Good.

Further, even if the substrate processing section that handles chemical components is included in any one of the small downflow areas of the plurality of small downflow areas for reusing the airflow, the substrate processing section is the last to reuse the airflow. Small downflow area (small downflow area 3d in the first and third embodiments, small downflow areas 3b and 3b in the second embodiment).
d, in the fourth embodiment, if it is included in the small flow-down region 3c), the filter for removing the chemical component may not be included in the filter units in the second and subsequent small flow-down regions as in the above.

Of course, for safety, each of the filter units in the second and smaller small flow-down areas may include a filter for removing chemical components, but the air flow passing through the filters for removing chemical components does not contain chemical components. Is not included,
Even if it is included, since it is extremely small, the life of the chemical component removing filter in the filter unit in the second and subsequent small flow-down regions becomes considerably long.

In the fourth embodiment, when the chemical component is removed in the small downflow region 3d (small downflow region not included in the plurality of small downflow regions for reusing the airflow), the small downflow region is removed. If the filter unit 5d in the region 3d includes a filter for removing chemical components and it is not necessary to remove the chemical components, the filter unit 5d in the small flow-down region 3d does not include a filter for removing chemical components.

For example, in the case of removing chemical components from the air flow flowing down the entire apparatus 1 by the conventional apparatus, if the filter units 5a to 5d are provided at the same locations as the filter units 5a to 5d in FIG. It is necessary to include a filter for removing chemical components in each of the filter units 5a to 5d, and all the filters for removing chemical components must be periodically replaced.

On the other hand, when the chemical components are removed under the same conditions in the present invention, a part of the small flow-down region (the small flow-down region 3a in the first and second embodiments, and the small flow-down region 3a in the first and second embodiments). It is sufficient to include a filter for removing chemical components in the filter units of the small downflow regions 3a and 3b, and in the fourth embodiment, the small downflow regions 3a and 3d). Even if the filters for removing chemical components are included in 5a to 5d, the filters for removing chemical components that are regularly exchanged have some small flow-down regions (first,
In the second embodiment, the small flow-down region 3a, in the third embodiment, the small flow-down regions 3a, 3b, and in the fourth embodiment, the small flow-down regions 3a, 3d) are included in the filter unit. As compared with the conventional device, the number of filters (removal area) used for removing chemical components or the number of filters that need to be replaced periodically is reduced, so that the running cost can be reduced accordingly.

The life of the filter for removing particles is usually as long as the life of the apparatus 1, and it is not necessary to consider replacement of the filter. Further, as long as the generation of particles in the flow-down region 2 does not cause a problem, each of the filter units 5a to 5d may not include a filter for removing particles.

By the way, in this type of substrate processing apparatus 1,
For substrate processing, a substrate processing unit that requires temperature and humidity control (for example,
Spin coater for coating photoresist etc.)
Although it may be provided inside, it is necessary to adjust the temperature and humidity of the air flow to be flown into the small flow-down area including such a substrate processing section.

In this case, the temperature and humidity of the airflow may be adjusted before the airflow is flown into the small flow-down area.

For example, in the case of adjusting the temperature and humidity of the air flow to be flown into the small flow-down area 3d, FIG. 5 (FIGS. 5 (a) to (d) correspond to FIGS. 2 to 4 (a) to (d)). The temperature and humidity adjusting means (thermal chamber or the like) 7 may be provided in the portion indicated by.

As shown in FIG. 6, the thermal chamber 7 includes, for example, a suction fan 7a, a cooling section 7b with a refrigerant gas, a heating section 7c composed of an electric heater, an ultrasonic type, a vapor blowing type, and a vaporizing type. Humidification unit 7d such as a formula, air supply fan 7e, temperature sensor 7f, humidity sensor 7g, control unit 7h
The cooling unit 7b cools and dehumidifies the air taken in by the intake fan 7a, and the heating unit 7c heats it to the set temperature, and then the humidifying unit 7d humidifies it to the set humidity to adjust the temperature and humidity. The air thus blown is sent out by the air supply fan 7e. At this time, the temperature sensor 7f and the humidity sensor 7g detect the temperature and humidity of the air sent out, and while monitoring the detection results, the controller 7h controls the cooling unit so that the temperature and humidity of the air sent out is maintained at the set temperature and humidity. 7b, the heating part 7c, the humidification part 7d, etc. are controlled.

In FIGS. 5A to 5C (first to third embodiments), the temperature and humidity of the air flow supplied from the small flow-down area in the preceding stage are adjusted by the thermal chamber 7, and the small flow-down is performed. In FIG. 5D (fourth embodiment), the temperature and humidity of the air taken in from outside the apparatus 1 are adjusted by the thermal chamber 7 to flow down to the small flow-down area 3d. Also, the same configuration is applied when adjusting the temperature and humidity of the airflow to be made to flow into the small flow-down areas 3a to 3c.

Next, an embodiment in which the present invention is applied to a substrate processing apparatus for performing a series of substrate processing in a photolithography process will be described with reference to the drawings.

[0079]

FIG. 7 is an overall perspective view of the apparatus of the embodiment as seen from the back side, FIG. 8 is a plan sectional view thereof, FIG. 9 is a longitudinal sectional view of the IF unit as seen from the exposure unit side, and FIG. Is the second
FIG. 11 is a vertical sectional view of the bake unit and the spin coater portion as viewed from the exposure unit side, and FIG. 11 is a vertical sectional view of the spin coater as viewed toward the second bake unit.

In the apparatus 1 of this embodiment, the loading / unloading section 11 for loading / unloading the substrate W into / from the apparatus 1, the first and second bake units 12, 13, the spin coater 14, the spin developer 15, and the first , The second substrate transfer device 16, 17,
The IF unit 18 and the like are provided. The flow-down area (2) is provided in the entire apparatus 1, and the IF unit 18 is used as the small flow-down area 3A, the second bake unit 13, and the second substrate transfer device 17 (substrate transfer path TR2). The portion including the small flow-down area 3B, the spin coater 14 portion including the small flow-down area 3C, the first bake unit 12, the first substrate transfer device 16 (substrate transfer path TR1),
The part including the spin developer 15 is a small flow-down area 3D,
The carrying-in / carrying-out part 11 is divided into small flow-down areas 3E by partitions or the like. Incidentally, in the partition, a portion for delivering the substrate W is appropriately provided with an aperture for delivering the substrate, and a shutter that can be opened and closed is also provided as necessary.

In the loading / unloading section 11, a carrier mounting table 11a for mounting a carrier C capable of accommodating a plurality of substrates W, and
The unprocessed substrates W stored in the carrier C placed on the carrier mounting table 11a are taken out one by one and transferred to the first substrate transfer device 16 to carry the substrates W into the device 1 and Processed substrate W from the substrate transfer device 16
Receive the substrate W and store the substrate W in the carrier C
The substrate loading / unloading device 11b for unloading the device 1 is provided. In addition, the carrying-in / carrying-out part 11 of this embodiment takes in the airflow that is constantly flowing down into the clean room in which the present apparatus 1 is installed, and causes it to flow down into the carrying-in / carrying-out part 11. A fan unit or a filter unit may be provided above 11.

Each of the first and second bake units 12 and 13 has a plurality of heat treatment units and cooling treatment units (hereinafter, for convenience sake, not shown, a heat treatment unit of the first bake unit 12 not shown), as shown in FIG. 12a, a cooling treatment unit (not shown) 12b, a heating treatment unit 13a and a cooling treatment unit 13b of the second bake unit 13) are stacked and arranged in parallel.

The spin coater 14 uses a photoresist (in this embodiment, a chemically amplified photoresist) on the substrate W.
An air flow of which temperature and humidity are adjusted is flowed down to the small flow-down region 3C including the spin coater 14.

The spin developer 15 is for performing a development process for obtaining an exposed pattern after the substrate W coated with the photoresist is exposed by the exposure unit 20.

The IF unit 18 is a unit for transferring the substrate W before and after exposure between the second substrate transfer device 17 and the exposure unit 20, and the substrate before exposure received from the second substrate transfer device 17. One or a plurality of substrates (only one is drawn in the drawing) for delivering W to the exposure unit 20 and delivering the exposed substrate W taken out from the exposure unit 20 to the second substrate transfer device 17. The delivery robot 18a is provided.

The first substrate transfer device 16 includes (the respective heat treatment sections 12a and the respective cooling treatment sections 1 of the first bake unit 12).
2b) and loading / unloading the substrate W to / from the spin developer 15, and transferring the substrate W to / from the substrate loading / unloading device 11b and the second substrate transfer device 17.
It is configured so that it can be moved, turned, moved up and down along the transport path TR1, and moved in and out of the arm 16a that supports the substrate W.

The second substrate transfer device 17 includes (each heat treatment section 13a of, and each cooling treatment section 1 of the second bake unit 13).
3b) and loading / unloading of the substrate W to / from the spin coater 14 and movement of the substrate W between the substrate delivery device 18a and the first substrate transport device 16 along the transport path TR2. The arm 17a supporting the substrate W can be rotated, moved up and down, and moved back and forth.

The exposure unit 20 is a unit for performing exposure processing and is provided with a reduction projection exposure machine (stepper) and the like.

A controller, a power source, a motor driver, a chemical liquid temperature adjusting unit, etc., which are not shown, are provided below the first and second bake units 12 and 13, the spin coater 14, the spin developer 15, and the transport paths TR1 and TR2. It is provided in. When the HMDS processing unit is provided, it is provided in the small flow-down area 3B or 3D.

In this embodiment, the substrate W is taken out of the carrier C by the substrate loading / unloading device 11b and transferred to the first substrate transporting device 16 so that the first bake unit 12 can be operated.
After being heated in the heat treatment unit 12a of the
(Hereinafter, a series of heat treatments consisting of the heat treatment and the cooling treatment is referred to as a bake treatment), and is transferred to the second substrate transfer device 17, and the spin coater 14 applies a photoresist to the second bake unit. After being subjected to the baking process in 13, the exposure unit 2 is passed through the IF unit 18.
Passed to 0 to receive exposure processing. And the substrate W after exposure
Is transferred to the second substrate transfer device 17 via the IF unit 18, undergoes a baking process in the second bake unit 13, and then transferred to the first substrate transfer device 16 and developed by the spin developer 15. After undergoing a baking process in the first bake unit 12, it is transferred to the substrate loading / unloading device 11 b and stored in the carrier C.

In this embodiment, the small flow-down area 3A is the first small flow-down area and the small flow-down areas 3B and 3C are the second small flow-down areas. It is supplied from below the region 3A to above the small flow-down region 3B and is made to flow down to the small flow-down region 3B, and is also supplied from below the small flow-down region 3A to above the small flow-down region 3C to adjust the temperature and humidity to control the small flow-down region. It is configured to flow down to 3C.

Therefore, above the small flow-down area 3A, there is a fan unit 4A equipped with a fan Fa for taking in air and causing the air to flow down to the small flow-down area 3A, and a filter for removing chemical components such as alkali components or acid components. A first filter unit 5Ak provided with Fk and a second filter unit 5Ap provided with a filter Fp for particle removal are provided in a stacked manner, and below the small downflow region 3A, in the small downflow region 3A. Fan units 4A ′ and 4A ″ provided with a fan Fa for collecting the flowed-down airflow below the small flow-down region 3A are provided. In this embodiment, the spin coater 14 in the apparatus 1 chemically amplifies. Since a photoresist of a mold is applied, an atmosphere in which a chemical component such as an alkali component or an acid component has been removed is provided in a predetermined small flow-down region (details will be described later). In order to maintain the atmosphere, a filter Fk for removing chemical components is provided above the first small flow-down area 3A.
It has. Also, in this embodiment, the small flow-down area 3A
In order to suitably suppress the inflow of particles into the inside, a filter F for removing particles is provided above the small flow-down area 3A.
It also has k.

Above the small flow-down area 3B, a fan unit 4B equipped with a fan Fa and a first filter unit 5Bk equipped with a filter Fk for removing chemical components,
A second filter unit 5Bp having a filter Fp for removing particles is laminated and provided. Then, the fan unit 4A ′ below the small flow-down area 3A and the fan unit 4B above the small flow-down area 3B.
An air flow path 6 is provided between and. The fan Fa provided below the small flow-down area 3B (below the transfer path TR2) prevents the smooth flow-down of the air flow due to an obstacle (the second substrate transfer device 17 or the like) in the small flow-down area 3B. In order to prevent the airflow, the airflow is provided so as to be sucked from below the small flow-down region 3B.

A second filter unit 5Cp having a filter Fp for removing particles is provided above the small flow-down area 3C, and the fan unit 4A ″ and the small flow-down area 3C below the small flow-down area 3A are provided. An air flow path 6 is provided between the upper second filter unit 5Cp and a thermal chamber 7 and a first filter unit 5Ck having a chemical component removing filter Fk are provided in the air flow path 6. In addition, this small downflow area 3
The air flow path 6 between A and 3C is arranged from the back surface of the apparatus 1 to the second filter unit 5Cp above the small flow-down area 3C via the lower side of the small flow-down area 3B and the side of the spin coater 14. There is.

In this embodiment, a filter Fk for removing chemical components is provided above the small downflow region 3B and between the small downflow regions 3A and 3C (small downflow regions 3B and 3C).
(The first filter units 5Bk and 5Ck of C are provided.) However, as described above, this is provided for safety, and the filter Fk for removing these chemical components hardly gets dirty, Period of regular replacement becomes extremely long.

In this embodiment, the small flow-down area 3D,
3E is not included in a plurality of small downflow regions for reusing the airflow. As for the downflow of the airflow to the small downflow area 3E, as described above, the airflow that is constantly flowing down in the clean room is taken in and flowed down as it is. In addition, air is taken in above the small flow-down region 3D and the small flow-down region 3D is obtained.
A fan unit 4D provided with a fan (not shown) for flowing down to D and a filter unit 5Dp provided with a filter for particle removal (not shown) are laminated and provided. In addition, this small flow-down area 3D (3E
() Also does not have a filter Fk for removing chemical components, but this is for the following reason. That is, in this embodiment, the chemical components to be removed (alkali components, etc.) affect the production of the substrate when the post-exposure bake treatment is completed after the chemically amplified photoresist is applied to the substrate W. In the configuration of this embodiment, since the substrate W does not exist in the small flow-down regions 3D and 3E during the steps from the photoresist coating to the post-exposure bake treatment, the flow of air from the small flow-down regions 3D and 3E is reduced. No chemical components have been removed. In addition, in order to suitably suppress the inflow of the air current from the small flow-down region 3D to the small flow-down region 3B, in this embodiment, a partition between the small flow-down regions 3C and 3D is provided with an opening (not shown) for substrate transfer. An openable and closable shutter (not shown) that is opened only when the substrate W is transferred is provided. Of course, for the sake of safety, a filter Fk (first filter unit) for removing chemical components may be provided above the small flow-down regions 3D, 3E (particularly 3D).

In the above embodiment, the small flow-down area 3A,
Although the airflow is reused in 3B and 3C, the small downflow areas 3D and / or 3E may be included in the plurality of small downflow areas in which the airflow is reused.

The present invention is not limited to the configuration of the above-described embodiment, but the method of partitioning, the method of reusing the air flow, etc. can be designed appropriately according to the configuration of each substrate processing unit in the apparatus 1. Is.

Further, the present invention can be applied not only to the substrate processing apparatus according to the above-mentioned embodiment but also to the substrate processing apparatus of other processes, and the method of partitioning, the method of reusing the air flow, etc. can be applied. It can be appropriately designed according to the configuration inside the device.

[0100]

As is apparent from the above description, according to the invention described in claims 1 and 5, the downflow area is divided into a plurality of small downflow areas, and at least a part of the small downflow areas is downflowed. Since the airflow is configured to be reused in the area, the air containing particles will be discharged from a part of the small downflow area, and the air containing particles will be discharged from the entire lower part of the device as in the conventional device. The range in which the particles are diffused can be reduced as compared with.

Further, according to the second and sixth aspects of the invention, in the case of the substrate processing apparatus which performs the substrate processing in the atmosphere in which the chemical components are removed, the number of filters (removal area) used for removing the chemical components, or Since the number of regularly replaced units is smaller than that of the conventional device, the running cost can be reduced accordingly.

According to the inventions described in claims 3 and 7, as in the case of claims 1 and 5, the range in which the particles are diffused can be reduced, and in addition, a filter for removing chemical components can be provided. Number of used (removed area), or
Since it is possible to reduce the number of pieces to be replaced periodically as compared with the conventional apparatus, the running cost can be reduced accordingly.

According to the invention described in claims 4 and 8, the invention described in any one of claims 1 to 3, 5 to 7 is applied to a substrate processing apparatus including a substrate processing unit or the like which requires temperature and humidity control. A method and apparatus that can be suitably implemented can be realized.

[Brief description of drawings]

FIG. 1 is a perspective view for explaining a compartment of the present invention.

FIG. 2 is a plan view showing a schematic configuration of some embodiments of the present invention.

FIG. 3 is a vertical cross-sectional view in which each small flow-down region is drawn in parallel for easy understanding of the respective embodiments of FIG.

FIG. 4 is a vertical cross-sectional view in which the small flow-down regions are rearranged in the vertical direction in order to facilitate understanding of the flow of the air flow in each embodiment of FIG.

5 is a schematic configuration diagram of an example in which a temperature / humidity adjusting means is added to each of the embodiments of FIG.

FIG. 6 is a vertical cross-sectional view showing a schematic configuration of an example of temperature and humidity adjusting means.

FIG. 7 is an overall perspective view of the apparatus of the embodiment as viewed from the back side.

FIG. 8 is a plan sectional view of an apparatus according to an embodiment.

FIG. 9 is a vertical sectional view of the IF unit as seen from the exposure unit side.

FIG. 10 is a vertical cross-sectional view of a second bake unit and a spin coater portion as viewed from the exposure unit side.

FIG. 11 is a vertical cross-sectional view of the spin coater as viewed toward the second bake unit.

[Explanation of symbols]

DESCRIPTION OF SYMBOLS 1 ... Substrate processing apparatus 2 ... Downflow area 3a-3d, 3A-3E in substrate processing apparatus ... Small downflow areas 4a-4d, 4A-4D ... Fan units 4a'-4d ', 4a "above each small downflow area 4A ', 4A "... Fan units 5a to 4d, 5Ak to 5Ck, 5Ap to 5Dp below each small flow-down area ... Filter unit 6 ... Air flow path 7 ... Thermal chamber W ... Substrate Fa ... Fan Fk ... Chemical component removal Filter for Fp ... Filter for removing particles

Claims (8)

[Claims] 1. A method for air conditioning in a substrate processing apparatus, wherein an air flow is made to flow down from a predetermined direction to a predetermined flow-down area in the apparatus, wherein the flow-down area is divided into a plurality of small flow-down areas, and the air flow is supplied to a certain small flow-down area. After flowing down, the airflow is supplied from the lower part of the small downflow area to the upper part of another small downflow area, and the particles in the airflow are removed so that it is made to flow down to the other small downflow area. A method for air conditioning in a substrate processing apparatus having a feature. 2. A method for air conditioning in a substrate processing apparatus, wherein an air flow is made to flow down from a predetermined direction to a predetermined flow-down area in the apparatus, wherein the flow-down area is divided into a plurality of small flow-down areas. Of these, at least above the first small flow-down area that takes in air outside the device, after removing the chemical components including the alkali component or the acid component to make the small flow-down area flow down, the air flow is made below the small flow-down area. Is supplied from above to another small flow-down area, and is made to flow down to the other small flow-down area. 3. The air conditioning method for a substrate processing apparatus according to claim 1, wherein an alkali component or an acid component is provided above at least a first small flow-down area that takes in air outside the apparatus among the plurality of small flow-down areas. An air conditioning method in a substrate processing apparatus, characterized in that a chemical component contained therein is removed. 4. The air conditioning method for a substrate processing apparatus according to claim 1, wherein at least one small downflow area of the plurality of small downflow areas is an area requiring temperature and humidity management. The air conditioning method in the substrate processing apparatus is characterized in that the temperature and humidity of the air flow to be made to flow down to the small flow-down area requiring the temperature and humidity control are adjusted. 5. A substrate processing apparatus configured to flow an air stream downward from a predetermined flow-down area in the apparatus, wherein the flow-down area is n (n is a natural number of 2 or more) small flow-down areas. Partitioning means for partitioning into (1) an i-th (i is a natural number equal to or less than (n-1)) small flow-down area from below the small flow-down area (i + 1)
One or more air flow supply means for supplying the gas above the (i + 1) th small flow-down area and supplying it above the (i + 1) th small flow-down area;
+1) removal means for removing particles from the airflow supplied to the small downflow area, and air from above the first small downflow area when the airflow is sequentially supplied between the plurality of small downflow areas by the airflow supply means. A substrate processing apparatus, comprising: an air intake means for taking in and flowing down. 6. A substrate processing apparatus configured to cause an air stream to flow down from a predetermined direction to a predetermined flow-down area in the apparatus, wherein the flow-down area is n (n is a natural number of 2 or more) small flow-down areas. Partitioning means for partitioning into (1) an i-th (i is a natural number equal to or less than (n-1)) small flow-down area from below the small flow-down area (i + 1)
At least one air flow supply means for supplying the air flow above the second small flow-down area and causing it to flow down to the (i + 1) th small flow-down area; and for supplying the air flow sequentially between the plurality of small flow-down areas by the air flow supply means. An air intake means for taking in and flowing air from above the first small flow-down area, and a chemical containing an alkaline component or an acid component from an air flow attached to above the first small flow-down area and flowing down to the small flow-down area. A substrate processing apparatus comprising: a chemical component removing unit that removes a component. 7. The substrate processing apparatus according to claim 5, wherein a chemical component containing an alkaline component or an acid component is removed from an air flow attached to at least the first small flow-down region and flowing down into the small flow-down region. A substrate processing apparatus, comprising: 8. The substrate processing apparatus according to claim 5, wherein at least one small downflow area out of the n small downflow areas is an area requiring temperature and humidity control. A substrate processing apparatus comprising: a temperature / humidity adjusting means for adjusting the temperature / humidity of an airflow to be made to flow into a small flow-down area that requires humidity management.