JPH09265835A - Composite thermoplastic resin sheet and container for packing electronic parts - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a packing material with ICs placed capable of performing inspection smoothly in IC image recognition by providing a sheet of which the surface specific resistance value of a sheet being within a specified range and the degree of surface luster is below the specified value. SOLUTION: IC packing material requires giving proper conductivity so that static electricity is not charged with the packing material and container themselves in order to prevent IC from being damaged due to static electricity, and the specific resistance value is preferably in the range of 10<2> to 10<10> Ω. If the surface specific resistance value is 10<10> Ω, sufficient charging prevention effect cannot be obtained, and if it is less than 10<2> Ω, IC may be broken because the power generation capacity is too good. If a precise image cannot be obtained such as duplicated images or blurred image when IC bending or intervals are image-recognized, packing material, container, or the like reflects light. To prevent this, it is necessary to reduce reflection from packing materials, containers, or the like, when the surface luster is below 30% the inspection failures due to the reflection is substantially reduced.

Description

Detailed Description of the Invention

[0001]

The present invention has a low surface gloss, and
TECHNICAL FIELD The present invention relates to a composite thermoplastic resin sheet and a container for packaging electronic parts in which an inspection error does not occur due to reflection on the surface of the packaging container in the process of optical inspection of the contents when used as a packaging container for electronic components such as C.

[0002]

2. Description of the Related Art Conventionally, various packaging materials have been used for packaging and transporting ICs and electronic parts using ICs.
These packaging materials are required to have strict performance in order to maintain the performance of IC. One of the major problems is the destruction of ICs due to static electricity, and in order to prevent this, a means for lowering the surface specific resistance value of the packaging material is generally used.
There are various methods therefor, and a typical example thereof is a method of dispersing carbon black in a thermoplastic resin, which is widely used.

In recent years, as the integration of ICs has become higher, the intervals between the leads of the ICs have become narrower, and it is now necessary to inspect whether the leads are bent before mounting the ICs on a substrate. As a method therefor, a CCD camera or the like is used. Optical inspections including image recognition inspections are being performed. In this optical inspection, if the IC is tested while it is placed on the packaging container, there is a problem that the image of the inspection object is dub or blurred and a characteristic image cannot be obtained and an inspection error occurs, and this solution is strongly demanded. Was there.

[0004]

SUMMARY OF THE INVENTION The present invention is intended to solve the above-mentioned problems, and in the image recognition inspection of the IC, the IC
It is intended to provide a packaging material and a packaging container that do not hinder the inspection even when they are put on.

[0005]

That is, the first aspect of the present invention is a thermoplastic resin sheet having a skin layer made of a conductive thermoplastic resin composition, the surface resistivity of which is 10 ² Ω. 10 is a ¹⁰ Omega, and an electronic component packaging composite thermoplastic sheet which is characterized in that the surface glossiness is 30% or less. A second invention is that a polystyrene resin, an ABS resin or a polyphenylene ether resin is provided on both sides of a base material layer made of a thermoplastic resin made of at least one selected from polystyrene resin, ABS resin or polyphenylene ether resin. Thermoplastic resin 1 comprising at least one selected from resins
Conductive resin consisting of 5 parts by weight to 50 parts by weight of carbon black and 2 parts by weight to 40 parts by weight of conjugated diene-based polymer rubber with respect to 00 parts by weight, and the conjugated diene-based polymer rubber is vulcanized. It is a composite thermoplastic resin sheet for packaging electronic parts, in which the composition is laminated as a skin layer. The third invention is that the conjugated diene of the conjugated diene polymer rubber is butadiene,
A composite thermoplastic resin sheet for electronic parts packaging according to the first invention, which is at least one selected from isoprene, and the fourth invention comprises the sheet according to the first, second or third invention, Surface resistivity of 10 ² Ω ~ 1
The container for electronic parts is characterized in that it has a resistance of 0 ¹⁰ Ω and a surface gloss of 30% or less.

Hereinafter, the present invention will be described in detail. In order to prevent the IC from being destroyed by static electricity, it is necessary for the packaging material for IC to have appropriate conductivity so that the packaging material and the container itself are not charged with static electricity, and the surface resistivity is 10 ² Ω. The range of 10 to 10 ¹⁰ Ω is preferable. If the surface resistivity exceeds 10 ¹⁰ Ω, a sufficient antistatic effect cannot be obtained,
If it is less than 10 ² Ω, the power generation capability is too good and the IC may be destroyed.

An image cannot be obtained because an image is dub or blurred when performing an image recognition inspection of the bending or the interval of the leads of the IC. The main reason is that the packaging material, the container and the like reflect light. It is the cause. In order to prevent this, it is necessary to reduce the reflection from the packaging material, the container, etc. If the surface glossiness is 30% or less, the inspection failure due to the reflection is significantly reduced.

In order to impart such a performance to the packaging material, since the surface resistivity and the gloss are related to the physical properties of the surface, a conductive thermoplastic resin is applied to the surface of the base material layer made of the thermoplastic resin. Covering is desirable. When only a single layer of the base material layer is used without coating, it is necessary to use the conductive thermoplastic resin for the entire base material layer, which is disadvantageous in terms of cost.

As such a material, a polystyrene resin,
A heat treatment made of at least one selected from polystyrene resin, ABS resin or polyphenylene ether resin is provided on both surfaces of the base material layer made of at least one thermoplastic resin selected from ABS resin or polyphenylene ether resin. 5 parts by weight to 50 parts by weight of carbon black and 2 parts by weight to 40 parts by weight of conjugated diene-based polymer rubber per 100 parts by weight of the plastic resin, and the conjugated diene-based polymer rubber is vulcanized. A composite thermoplastic resin sheet for packaging electronic parts is preferably used, in which a conductive resin composition is laminated as a skin layer.

At least one kind of thermoplastic resin selected from polystyrene resin, ABS resin and polyphenylene ether resin is used for the conductive resin composition for the base layer and the skin layer, respectively. Polystyrene-based resin refers to a general polystyrene resin or impact-resistant polystyrene resin and a material containing a mixture thereof as a main component. ABS
The system resin is a resin containing a copolymer mainly composed of three components of acrylonitrile-butadiene-styrene as a main component. Further, the polyphenylene ether resin means a resin having a polyphenylene ether resin and the polystyrene resin as main components, and the content of the polyphenylene ether resin in the total amount of 100 parts by weight of the polyphenylene ether resin and the polystyrene resin is 28 to It is preferably 86 parts by weight, and when it is less than 28 parts by weight, sufficient mechanical properties as a polyphenylene ether resin cannot be obtained, and when it exceeds 86 parts by weight, the fluidity is lowered and the molding process becomes difficult. As the polyphenylene ether resin, there is US Pat. No. 3,383.
Homopolymers or copolymers described in No. 435 are shown.

The carbon black contained in the conductive resin composition in the present invention is furnace black, channel black, acetylene black, etc., and preferably has a large specific surface area and a small amount added to the resin to provide high conductivity. Is obtained. For example, C. F. (Super
Conductive Furnace), E.C. C.
F. (Electric Conductive Fu
rnace), Ketjen Black (Lion-AKZ)
O company name) and acetylene black. The amount of carbon black added is such that the surface resistivity can be 10 ² Ω to 10 ¹⁰ Ω when laminated on the base material layer, and the amount is the thermoplastic resin in the conductive resin composition. 5 to 50 parts by weight of carbon black is preferable for 100 parts by weight. The addition amount can be adjusted within the range of 5 to 50 parts by weight depending on the type of carbon black and the composition of the polymer. If the addition amount is less than 5 parts by weight, sufficient conductivity cannot be obtained and the surface resistivity value increases, and if it exceeds 50 parts by weight, the uniform dispersibility with the resin deteriorates, the molding processability remarkably decreases, and the mechanical property is deteriorated. The characteristic values such as strength are reduced.

The conjugated diene polymer rubber used in the present invention may be any vulcanizable rubber such as a sulfur compound or an organic compound such as an aromatic vinyl-conjugated diene polymer rubber or a conjugated diene polymer rubber. Typical examples include styrene-butadiene rubber, polybutadiene rubber, polyisoprene rubber, and natural rubber. These rubber components may be used alone or in combination of two or more. The rubber component is preferably dispersed in the conductive resin composition as particles having a particle size of 10 μm or less, and there is no particular limitation on the method of dispersing the particles as particles having a particle size of 10 μm or less, but typically, a Banbury mixer, a twin-screw extruder, or the like is generally used. The technique used when mechanically kneading a thermoplastic resin can be used. Particles in resin are 10μ
When it exceeds m, the surface becomes uneven when formed into a sheet or a container, resulting in a poor appearance.

When the conductive resin composition is laminated on the base material layer, the conjugated diene polymer rubber in the resin composition must be vulcanized. Vulcanization may be performed before being dispersed in the conductive resin composition in the form of particles, or may be performed simultaneously with kneading. In order to disperse particles having a particle size of 10 μm or less in the conductive resin composition, a method of performing melt kneading with all or part of the raw material of the conductive resin composition in advance and then adding a vulcanizing agent to vulcanize preferable.

The amount of the conjugated diene polymer rubber added is preferably 2 to 40 parts by weight with respect to 100 parts by weight of the thermoplastic resin in the conductive resin composition. If the amount added is less than 2 parts by weight, the surface glossiness is not sufficiently low and the desired performance cannot be obtained. If the amount added exceeds 40 parts by weight, uniform kneading becomes difficult, and it becomes impossible to uniformly disperse particles having a size of 10 μm or less in the conductive resin composition, and when the rubber component is vulcanized, it becomes a thermoplastic resin. And the melt processing becomes difficult.

The resin composition constituting the base material layer and the skin layer of the present invention contains a lubricant and a plasticizer, if necessary, in order to improve the flow characteristics in the manufacturing process and the mechanical characteristics of the obtained sheet and container. It is possible to add processing aids such as agents and antioxidants, and other resin components having a reinforcing effect, such as ethylene-ethyl acrylate copolymer.

To produce the composite thermoplastic resin sheet of the present invention, first, all or part of the raw material of the conductive resin composition is kneaded and pelletized by a known method such as a Banbury mixer or an extruder. When kneading the conductive resin composition, it is possible to knead the raw materials all at once,
Also, for example, polystyrene resin and carbon black,
It is also possible to knead and pelletize the polystyrene-based resin and the conjugated diene-based polymer rubber separately, and knead the obtained two kneaded products all together at the same time. On the other hand, it is also possible to mix and use the above-obtained two types of pellets when forming a sheet by an extruder. The conjugated diene-based polymer rubber is vulcanized by adding a sulfur-based vulcanizing agent, an organic peroxide-based vulcanizing agent or the like before or simultaneously with the above-mentioned kneading.

Next, the conductive resin composition to be the skin layer and the thermoplastic resin composition to be the base material layer obtained are molded into a sheet or film by an extruder or the like and laminated. Lamination can be performed by a known method such as a heat laminating method, a dry laminating method, an extrusion laminating method. It is also possible to collectively form and laminate sheets or films by a coextrusion method using a feed block, a multi-manifold die or the like.

The total thickness of the sheet of the present invention is 0.1 mm to 3.0 mm, and the ratio of the skin layer to the total thickness is 2% or more on each side and 80% or less on both sides. Preferably there is. If the total thickness is less than 0.1 mm, the strength as a packaging container obtained by molding a sheet is insufficient, and if it exceeds 3.0 mm, molding by pressure molding, vacuum molding, hot plate molding, etc. becomes difficult. If the skin layer on one side is less than 2%, the surface resistivity of the sheet or the packaging container obtained by molding the sheet will be remarkably high and a sufficient antistatic effect cannot be obtained.
When it exceeds the above range, the effect of laminating it on the base material is lowered, and the mechanical properties such as molding processability and mechanical strength at the time of molding into a packaging container are deteriorated.

The container for packaging electronic parts referred to in the present invention is an IC
A vacuum forming tray for packaging, a magazine, an embossed carrier tape, and a vacuum forming tray for packaging electronic parts, electronic devices, etc. using an IC. For obtaining the packaging container from a sheet, pressure molding, vacuum forming, heat A known sheet forming method such as plate forming can be used.

[0020]

The present invention will be described in more detail with reference to the following examples. Example The raw materials shown in Table 1 were used, the raw material composition ratios shown in Table 2 were each weighed, and uniformly mixed with a high-speed mixer.
The mixture was kneaded using a 5 mm vent type twin-screw extruder and pelletized by a strand cut method to obtain a conductive resin composition. Then, the combination of the base material layer and the conductive resin composition layer shown in Table 4 and extrusion of φ65 mm so that the thicknesses of the conductive resin composition layers on both sides are approximately equal in proportion to the total thickness of the base material layer. Machine (L / D = 28), φ40mm extruder (L / D = 26)
And a laminated sheet having a total thickness of 0.3 mm was obtained by the feed block method using a 500 mm wide T die. Furthermore, the obtained sheet is vacuum-formed and QFP 14 mm x 20 mm-64
A pin vacuum packaging tray for IC packaging and the same embossed carrier tape were obtained.

[0021]

[Table 1]

[0022]

[Table 2]

[0023]

[Table 3]

[0024]

[Table 4]

Comparative Example In the same manner as in the examples, the raw materials shown in Table 1 were used to obtain conductive resin compositions having the raw material composition ratios shown in Table 3. Table 4
A laminated sheet, a vacuum forming tray, and an embossed carrier tape were obtained in the same manner as in the examples with the combination of the base material layer and the conductive resin composition shown in 1 and the ratio of the total thickness of the base material layer to the total thickness.

Table 5 shows the evaluation results of each example and comparative example.

[0027]

[Table 5]

The sheet samples of the respective examples had good surface resistivity and surface gloss, and had thermoformability suitable as a packaging material for electronic parts. Also,
The surface resistivity and surface gloss of each vacuum forming tray and embossed carrier tape are also good.
Even in the lead bending inspection, no inspection error occurred.

On the other hand, in each of the comparative examples, the sheet sample, the vacuum forming tray and the embossed carrier tape had high surface gloss, and an inspection error occurred in the IC lead bending inspection.

Each evaluation was carried out by the following method. (1) Surface specific resistance value The distance between the electrodes was set to 10 mm using a Lorester surface resistance meter (manufactured by Mitsubishi Yuka), and any 10 points on the surface of the sheet sample were measured, and for the vacuum forming tray and embossed carrier tape. The central portion of the inner bottom surface of the pocket portion was measured at 10 points and the logarithmic average value of each was taken as the surface specific resistance value. (2) Strength at Break, Tensile Elastic Modulus Sheet No. 4 test pieces were measured at a pulling speed of 10 mm / min according to JIS-K-7127. (3) Glossiness According to JIS-Z-8741, a surface glossiness meter Mode
Using IG-310 (manufactured by Horiba Ltd.), the sheet sample was measured at arbitrary 10 points on the surface thereof, and the vacuum forming tray and the embossed carrier tape were measured at 10 points at the center of the inner bottom surface of the pocket. The average value of each was defined as the gloss level. (4) IC lead bending inspection test QFP 14mm x 20mm-64pin inserted in each vacuum forming tray and pocket part of embossed carrier tape
The lead bending inspection was performed on 100 ICs by image recognition by a CCD camera, and those having no inspection error were marked with ◯, and those having an inspection error were marked with x.

EFFECT OF THE INVENTION A polystyrene resin, an ABS resin or a polyphenylene ether resin is selected on both sides of a thermoplastic resin substrate made of at least one selected from polystyrene resin, ABS resin or polyphenylene ether resin. In a conductive composite thermoplastic resin sheet in which a conductive resin composition containing at least one kind of thermoplastic resin and carbon black is laminated, the conductive resin composition contains a conjugated diene-based polymer rubber to improve the conductivity. Of the surface gloss of the flexible composite thermoplastic resin sheet to 3
By setting the content to 0% or less, a composite thermoplastic resin sheet and container for packaging electronic parts that does not cause an inspection error due to reflection even when used as a packaging container during optical inspection of electronic parts such as ICs is obtained. Is possible.

Claims (4)

[Claims] 1. A thermoplastic resin sheet having a skin layer made of a conductive thermoplastic resin composition, the sheet having a surface specific resistance of 10 ² Ω to ^{10 10} Ω and a surface gloss of 30. % Or less, a composite thermoplastic resin sheet for packaging electronic parts. 2. Both sides of a base material layer made of a thermoplastic resin of at least one selected from polystyrene resin, ABS resin or polyphenylene ether resin,
Carbon black 5 to 100 parts by weight of a thermoplastic resin composed of at least one selected from polystyrene resin, ABS resin or polyphenylene ether resin.
1 part by weight to 50 parts by weight and 2 parts by weight to 40 parts by weight of the conjugated diene polymer rubber, and the conjugated diene polymer rubber is vulcanized, and a conductive resin composition is laminated as a skin layer. A composite thermoplastic resin sheet for packaging electronic parts according to claim 1. 3. The composite thermoplastic resin sheet for packaging electronic parts according to claim 2, wherein the conjugated diene of the conjugated diene polymer rubber is at least one selected from butadiene and isoprene. 4. A container for packaging electronic parts, characterized in that it has a surface specific resistance value of 10 ² Ω to ^{10 10} Ω and a surface glossiness of 30% or less. .