JPH09262758A - Polishing level block, and polishing device using the same - Google Patents
Polishing level block, and polishing device using the sameInfo
- Publication number
- JPH09262758A JPH09262758A JP7388296A JP7388296A JPH09262758A JP H09262758 A JPH09262758 A JP H09262758A JP 7388296 A JP7388296 A JP 7388296A JP 7388296 A JP7388296 A JP 7388296A JP H09262758 A JPH09262758 A JP H09262758A
- Authority
- JP
- Japan
- Prior art keywords
- polishing
- platen
- surface plate
- polishing cloth
- plate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
Landscapes
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
Abstract
Description
【０００１】[0001]
【発明の属する技術分野】本発明は、半導体ウェハ、レ
ーザ用や光学用プリズム等の精密ポリッシングに用いら
れる研磨定盤およびそれを用いた研磨装置に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a polishing platen used for precision polishing of semiconductor wafers, laser and optical prisms, and a polishing apparatus using the same.
【０００２】[0002]
【従来の技術】従来から、半導体ウェハ、レーザ用プリ
ズムや光学用プリズム、さらには各種ガラス板や金属板
等を精密研磨する方法として、遊離砥粒と研磨クロスを
用いたポリッシングが使用されている。2. Description of the Related Art Conventionally, polishing using free abrasive grains and a polishing cloth has been used as a method for precisely polishing a semiconductor wafer, a laser prism, an optical prism, and various glass plates and metal plates. .
【０００３】研磨装置の代表例として、片面ポリッシン
グの場合で説明すると、水平面上で回転駆動される研磨
定盤の表面に張付けられた研磨クロスに、別の回転駆動
する平板に取付けられた被研磨物を摺接させ、これら研
磨クロスと被研磨物との間に供給される研磨液（研磨粒
子とポリッシング液とのスラリー）によって研磨を行う
ものである。従来は、ポリッシングに用いられる研磨定
盤の表面に研磨クロスを粘着剤で張付ける方式のものが
多用されてきた。As a typical example of the polishing apparatus, the case of single-side polishing will be described. To be polished, a polishing cloth attached to the surface of a polishing platen which is rotationally driven on a horizontal plane is attached to another flat plate which is rotationally driven. An object is brought into sliding contact with each other, and polishing is performed with a polishing liquid (slurry of polishing particles and polishing liquid) supplied between the polishing cloth and the object to be polished. Conventionally, a method of sticking a polishing cloth to the surface of a polishing platen used for polishing with an adhesive has been widely used.
【０００４】ところで、例えば半導体ウェハのポリッシ
ングの場合、半導体ウェハ表面での軟質な化学的生成物
の形成と、砥粒による機械的研磨の少なくとも一方のメ
カニズムにより精密な研磨面を形成するため、研磨定盤
表面は約 298〜323K程度の温度上昇が生じる。半導体ウ
ェハ面の均一な研磨を実現するためには、研磨クロスの
表面に残留する研磨材を清掃したり、また研磨クロスの
表面状態を維持する必要があり、このために研磨クロス
の張替えが日常管理として頻繁に行われる。By the way, in the case of polishing a semiconductor wafer, for example, since a precise polishing surface is formed by at least one mechanism of formation of a soft chemical product on the surface of the semiconductor wafer and mechanical polishing by abrasive grains, polishing is performed. Temperature rise of about 298-323K occurs on the surface of the surface plate. In order to achieve uniform polishing of the semiconductor wafer surface, it is necessary to clean the polishing material remaining on the surface of the polishing cloth and to maintain the surface condition of the polishing cloth. Frequent management.
【０００５】従来の一般的な研磨定盤は、研磨装置から
容易に取外すことができないと共に、研磨定盤を研磨装
置から取外した場合にはその後に寸法精度の調整が必要
となるため、研磨クロスの張替え作業は必然的にクリー
ンルーム内に設置された研磨装置上で行われる。よっ
て、研磨クロスの張替え作業は精度を確保するために、
熟練した技能と多大の労力および時間を必要としてい
た。さらに、クリーンルーム内での作業によって、クリ
ーンルーム内のクリーン度が低下するという問題も招い
ていた。The conventional general polishing surface plate cannot be easily removed from the polishing apparatus, and when the polishing surface plate is removed from the polishing apparatus, it is necessary to adjust the dimensional accuracy thereafter. The refilling work is inevitably performed on the polishing apparatus installed in the clean room. Therefore, in order to ensure the accuracy of the work of replacing the polishing cloth,
It required skilled skills and a great deal of labor and time. Further, the work in the clean room causes a problem that the degree of cleanliness in the clean room is lowered.
【０００６】一方、上述したような研磨クロスの張替え
作業の短縮化と精度の確保のために、研磨クロスを真空
吸引で研磨定盤に固定する方式が提案されている。例え
ば、実開昭 53-161395号公報には、研磨クロスの片面に
気密性層を形成し、この気密性層により真空吸引による
固定を実現した研磨クロスが記載されている。On the other hand, a method of fixing the polishing cloth to the polishing platen by vacuum suction has been proposed in order to shorten the work of replacing the polishing cloth as described above and ensure the accuracy. For example, Japanese Utility Model Application Laid-Open No. 53-161395 describes a polishing cloth in which an airtight layer is formed on one surface of the polishing cloth, and this airtight layer realizes fixation by vacuum suction.
【０００７】しかしながら、研磨クロスは研磨面の損耗
が進むと粗くなるため、被研磨物との摩擦が大きくな
り、場合によっては被研磨物が研磨クロスに引っ掛かっ
て破損が生じる。その際に、研磨クロスが破れるだけで
あれば、研磨クロスを交換して作業を続けることができ
るが、研磨定盤の表面を傷付けるおそれが大きい。研磨
定盤の表面が損傷してしまうと、それ以上精密研磨には
使用することができなくなってしまう。このような研磨
クロスの破損は、従来の粘着剤で接着した研磨クロスで
も生じていたが、真空吸引による固定方式を採用した場
合にはさらに頻繁に起こりやすくなっている。However, since the polishing cloth becomes rough as the abrasion of the polishing surface progresses, friction with the object to be polished becomes large, and in some cases, the object to be polished is caught by the polishing cloth and is damaged. At that time, if the polishing cloth is only broken, the polishing cloth can be exchanged and the work can be continued, but the surface of the polishing surface plate is likely to be damaged. If the surface of the polishing platen is damaged, it cannot be used for precision polishing any more. Such damage to the polishing cloth has also occurred in the conventional polishing cloth adhered with a pressure-sensitive adhesive, but when the fixing method by vacuum suction is adopted, it is more likely to occur.
【０００８】[0008]
【発明が解決しようとする課題】上述したように、真空
吸引による研磨クロスの固定方式は、研磨クロスの張替
え作業を短縮できるという利点を有するものの、被研磨
物と研磨クロスとの摩擦力の増大による研磨クロスの破
損が起こりやすく、この研磨クロスの破損に伴って研磨
定盤の表面が損傷しやすいという問題を有していた。As described above, the method of fixing the polishing cloth by vacuum suction has the advantage of shortening the work of replacing the polishing cloth, but increases the frictional force between the object to be polished and the polishing cloth. There is a problem that the polishing cloth is apt to be damaged due to, and the surface of the polishing platen is easily damaged due to the damage of the polishing cloth.
【０００９】このようなことから、従来の研磨クロス吸
引固定式の研磨定盤では、研磨クロスが破損した際にお
いても、研磨定盤の表面に傷がつかないようにすること
が課題とされていた。For these reasons, in the conventional polishing cloth suction-fixing type polishing platen, it is an object to prevent the surface of the polishing platen from being damaged even when the polishing cloth is broken. It was
【００１０】本発明は、このような課題に対処するため
になされたもので、研磨クロスに破損が生じた際の定盤
表面の損傷を防止することを可能にした研磨定盤、およ
びそのような研磨定盤を用いることによって、研磨作業
の安定化および高稼働率化を図った研磨装置を提供する
ことを目的としている。The present invention has been made to solve such a problem, and a polishing platen capable of preventing the surface plate from being damaged when the polishing cloth is damaged, and It is an object of the present invention to provide a polishing apparatus that stabilizes the polishing work and increases the operating rate by using a different polishing platen.
【００１１】[0011]
【課題を解決するための手段】本発明の研磨定盤は、請
求項１に記載したように、研磨装置の駆動部に接続さ
れ、上面側に吸引孔が設けられた定盤本体と、前記定盤
本体の上面側に配置され、前記定盤本体と一体回転可能
に、前記吸引孔を介して真空吸引により保持される研磨
クロスと、前記定盤本体と研磨クロスとの間に介挿さ
れ、前記真空吸引力を前記研磨クロスに伝え得ると共
に、前記研磨クロスに対する真空吸引力で前記定盤本体
に保持される定盤保護板とを具備することを特徴として
いる。According to a first aspect of the present invention, there is provided a polishing platen which is connected to a drive unit of a polishing apparatus and has a surface plate main body having a suction hole on an upper surface side thereof. A polishing cloth, which is disposed on the upper surface side of the surface plate main body and is held by vacuum suction through the suction holes so as to be rotatable integrally with the surface plate main body, and is interposed between the surface plate main body and the polishing cloth. And a platen protection plate that can transmit the vacuum suction force to the polishing cloth and that is held by the platen body by the vacuum suction force for the polishing cloth.
【００１２】また本発明の研磨装置は、請求項５に記載
したように、上述した本発明の研磨定盤と、前記研磨定
盤の研磨クロスおよび定盤保護シー卜を真空吸着し、前
記定盤本体に固定する真空系と、前記研磨定盤の定盤本
体に接続された駆動軸を介して、前記研磨定盤を回転駆
動させる駆動系とを具備することを特徴としている。本
発明の研磨定盤においては、定盤本体と研磨クロスとの
間に定盤保護板を介挿しており、被研磨物の破損に伴っ
て研磨クロスが破れても、定盤本体は定盤保護板で保護
されているため、研磨面の精度を担う定盤本体の上面が
損傷することはない。また、定盤保護板は研磨クロスに
対する真空吸引力で保持しているため、定盤保護板が損
傷した場合には容易に交換することができる。このよう
な研磨定盤を用いた本発明の研磨装置においては、定盤
本体の損傷に伴う研磨作業の長期中断を防止できること
から、研磨作業を安定かつ高稼働率で実施することが可
能となる。Further, according to a fifth aspect of the present invention, there is provided a polishing apparatus of the present invention, wherein the above-described polishing platen of the present invention, a polishing cloth of the polishing platen, and a platen protective sheet are vacuum-adsorbed, and the polishing plate. It is characterized by comprising a vacuum system fixed to the platen body and a drive system for rotationally driving the polishing platen via a drive shaft connected to the platen body of the polishing platen. In the polishing surface plate of the present invention, the surface plate protective plate is interposed between the surface plate body and the polishing cloth, and even if the polishing cloth is broken due to damage to the object to be polished, the surface plate body is Since it is protected by the protective plate, the upper surface of the surface plate body, which is responsible for the accuracy of the polishing surface, is not damaged. Further, since the surface plate protection plate is held by the vacuum suction force against the polishing cloth, if the surface plate protection plate is damaged, it can be easily replaced. In the polishing apparatus of the present invention using such a polishing platen, it is possible to prevent a long-term interruption of the polishing work due to damage to the platen body, and thus it is possible to carry out the polishing work stably and at a high operating rate. .
【００１３】[0013]
【発明の実施の形態】以下、本発明を実施するための形
態について説明する。Embodiments of the present invention will be described below.
【００１４】図１は、本発明の一実施形態による研磨定
盤およびそれを用いた研磨装置の要部構成を示す図であ
る。同図において、１は研磨定盤であり、この研磨定盤
１は定盤本体２に対して定盤保護板３を介して研磨クロ
ス４を吸引固定するクロス吸引固定式研磨定盤である。FIG. 1 is a diagram showing a main structure of a polishing platen and a polishing apparatus using the same according to an embodiment of the present invention. In the figure, reference numeral 1 is a polishing platen, and this polishing platen 1 is a cloth suction fixed type polishing platen for sucking and fixing a polishing cloth 4 to a platen body 2 via a platen protection plate 3.
【００１５】定盤本体２は、その内部に真空室５を有し
ており、この真空室５から上面２ａに達するように多数
の真空吸引孔６が形成されている。一方、定盤本体２の
下側には駆動軸７が固着されている。この駆動軸７内に
は真空通路８が設けられており、この真空通路８は図示
を省略したロータリージョイントを介して真空ポンプ９
側の真空配管１０と接続されている。駆動軸７は、駆動
系としての例えばモータ１１と駆動ベルト１２を介して
接続されており、この駆動系によりクロス吸引固定式研
磨定盤１は所定の回転速度で回転駆動される。The surface plate main body 2 has a vacuum chamber 5 therein, and a large number of vacuum suction holes 6 are formed so as to reach the upper surface 2a from the vacuum chamber 5. On the other hand, a drive shaft 7 is fixed to the lower side of the surface plate body 2. A vacuum passage 8 is provided in the drive shaft 7, and the vacuum passage 8 is connected to a vacuum pump 9 via a rotary joint (not shown).
It is connected to the vacuum pipe 10 on the side. The drive shaft 7 is connected to, for example, a motor 11 as a drive system via a drive belt 12, and the drive system drives the cross-suction fixed type polishing surface plate 1 to rotate at a predetermined rotation speed.
【００１６】最上面に位置する研磨クロス４は、下面側
に気密性膜が形成されており、この気密性膜によりシー
リング性を確保している。研磨クロス４は真空ポンプ９
により真空吸引されて定盤本体２に保持されており、こ
の研磨クロス４と定盤本体２との間には、研磨面の精度
を担う定盤本体２の上面２ａを保護する金属板等からな
る定盤保護板３が介挿されている。この定盤保護板３
は、真空ポンプ９による真空吸引力を研磨クロス４に伝
え得る構造、言い換えると真空度を透過する構造とされ
ており、具体的には図２に拡大して示すように、定盤本
体２に設けられた真空吸引孔６と重なる位置に少なくと
も設けられた孔１３を有している。An airtight film is formed on the lower surface side of the polishing cloth 4 located on the uppermost surface, and the airtight film ensures the sealing property. The polishing cloth 4 is a vacuum pump 9
It is vacuum-sucked by and is held by the surface plate body 2. Between the polishing cloth 4 and the surface plate body 2, there is a metal plate or the like for protecting the upper surface 2a of the surface plate body 2 which is responsible for the accuracy of the polishing surface. The platen protection plate 3 is inserted. This surface plate protection plate 3
Has a structure capable of transmitting a vacuum suction force from the vacuum pump 9 to the polishing cloth 4, in other words, a structure that allows the degree of vacuum to pass therethrough. Specifically, as shown in an enlarged view of FIG. It has a hole 13 provided at least at a position overlapping with the vacuum suction hole 6 provided.
【００１７】すなわち、定盤本体２の真空吸引孔６が穿
設された上面２ａ上には、真空吸引孔６と孔１３が重な
るように定盤保護板３が配置され、この定盤保護板３上
に下面側に気密性膜が形成された研磨クロス４が配置さ
れる。そして、真空室５、真空吸引孔６および孔１３を
介して真空ポンプ９で研磨クロス４を真空吸引し、この
研磨クロス４に対する真空吸引力で定盤本体２に定盤保
護板３と研磨クロス４とが保持される。このように、定
盤保護板３は研磨クロス４に対する真空吸引力で定盤本
体２に保持される。研磨クロス４に対する真空吸引力
は、定盤本体２、定盤保護板３および研磨クロス４が一
体回転可能なように設定されている。That is, on the upper surface 2a of the surface plate main body 2 in which the vacuum suction holes 6 are formed, the surface plate protection plate 3 is arranged so that the vacuum suction holes 6 and the holes 13 overlap each other. A polishing cloth 4 having an airtight film formed on the lower surface thereof is arranged on the upper surface 3. Then, the polishing cloth 4 is vacuum-sucked by the vacuum pump 9 through the vacuum chamber 5, the vacuum suction holes 6 and the holes 13, and the vacuum suction force for the polishing cloth 4 causes the surface plate body 2 to have the surface plate protection plate 3 and the polishing cloth. 4 and 4 are retained. In this way, the platen protection plate 3 is held by the platen body 2 by the vacuum suction force on the polishing cloth 4. The vacuum suction force for the polishing cloth 4 is set so that the surface plate body 2, the surface plate protection plate 3, and the polishing cloth 4 can rotate integrally.
【００１８】上述した定盤保護板３の孔１３は、真空吸
引により研磨クロス４が孔１３の部分で変形しないよう
に、比較的微小な孔径に設定されている。一方、定盤保
護板３は研磨クロス４に比べれば剛性が高いため、定盤
本体２側の真空吸引孔６は比較的大径とすることができ
る。このように、真空吸引孔６の径を孔１３の径より大
きく設定することによって、真空吸引孔６と孔１３との
位置合せが容易となる。また、孔１３は必ずしも全てが
定盤本体２側の真空吸引孔６と一致していなければなら
ないものではなく、定盤保護板３に多くの孔１３を形成
しておくことによって、真空吸引孔６と孔１３との位置
合せを容易にすることもできる。The hole 13 of the platen protection plate 3 described above is set to a relatively small hole diameter so that the polishing cloth 4 is not deformed at the hole 13 by vacuum suction. On the other hand, since the surface plate protection plate 3 has higher rigidity than the polishing cloth 4, the vacuum suction hole 6 on the surface plate body 2 side can have a relatively large diameter. In this way, by setting the diameter of the vacuum suction hole 6 to be larger than the diameter of the hole 13, it becomes easy to align the vacuum suction hole 6 and the hole 13. Further, all of the holes 13 do not necessarily have to coincide with the vacuum suction holes 6 on the surface plate body 2 side. By forming many holes 13 in the surface plate protection plate 3, the vacuum suction holes can be formed. It is also possible to facilitate the alignment between 6 and the hole 13.
【００１９】なお、真空ポンプ９による真空吸引力を研
磨クロス４に伝える構造としては、上記した孔１３の形
成に限らず、例えば多孔質板を使用することで真空度を
透過する構造とすることも可能である。The structure for transmitting the vacuum suction force of the vacuum pump 9 to the polishing cloth 4 is not limited to the above-mentioned formation of the holes 13, but for example, a porous plate may be used so as to transmit the vacuum degree. Is also possible.
【００２０】定盤保護板３は、研磨クロス４に対する真
空吸引力により定盤本体２に密着する程度の剛性を有す
るものであることが好ましい。すなわち、最近の半導体
ウェハ等のポリッシングにおいては、研磨面の平坦度が
数10μm 以下の精度を目指しており、定盤保護板３自体
でその形状精度を維持することは困難である。従って、
形状精度は定盤本体２で形成し、定盤保護板３は変形自
在に定盤本体２に倣うようにすることが好ましい。It is preferable that the platen protection plate 3 has such a rigidity that it is brought into close contact with the platen body 2 by a vacuum suction force to the polishing cloth 4. That is, in recent polishing of semiconductor wafers or the like, the flatness of the polished surface is aimed at an accuracy of several tens of μm or less, and it is difficult for the surface plate protection plate 3 itself to maintain its shape accuracy. Therefore,
It is preferable that the shape accuracy is formed by the surface plate main body 2, and the surface plate protection plate 3 is deformable and follows the surface plate main body 2.
【００２１】このように、定盤保護板３は変形自在性と
定盤本体２の損傷を防止する保護性とを有することが好
ましいことから、定盤保護板３の形成材料としては金属
の薄板が適当である。定盤保護板３が真空吸引により定
盤本体２の形状に正確に倣うためには、定盤保護板３の
剛性を適切な値とすることが重要であり、具体的には弾
性係数を考慮してその半径に応じた板厚を適正な値とす
る。例えば、変形量δとする場合の板厚Τは、次式で概
算できる。As described above, since it is preferable that the surface plate protection plate 3 has deformability and protection properties that prevent damage to the surface plate body 2, a thin metal plate is used as a material for forming the surface plate protection plate 3. Is appropriate. In order for the surface plate protection plate 3 to accurately follow the shape of the surface plate body 2 by vacuum suction, it is important to set the rigidity of the surface plate protection plate 3 to an appropriate value. Then, the plate thickness corresponding to the radius is set to an appropriate value. For example, the plate thickness T when the deformation amount is δ can be roughly estimated by the following equation.
【００２２】 δ≦ 0.7×Ｐ×Ｒ4 ／（Ｅ×Τ3 ） ……(1) （式中、Τは定盤保護板３の板厚、Ｐは研磨クロス４の
吸引圧力（大気圧×吸引孔総面積／クロス面積）、Ｒは
定盤保護板３の半径、Ｅは定盤保護板３の弾性係数、δ
は定盤保護板３の必要変形量である） (1)式から明らかなように、定盤保護板３の変形能に及
ぼす影響は、材料の弾性係数よりも板厚の方が大きい。
後述するＦｅ−Ｎｉ系合金やＦｅ−Ｃｒ−Ｎｉ系合金に
おいては、半径 500mmの定盤の場合、定盤保護板３の板
厚を数mm程度とすることが適当である。Δ ≦ 0.7 × P × R 4 / (E × T 3 ) ... (1) (where, T is the plate thickness of the surface plate protection plate 3 and P is the suction pressure of the polishing cloth 4 (atmospheric pressure × (Total area of suction holes / cross area), R is the radius of the platen protection plate 3, E is the elastic coefficient of the platen protection plate 3, and δ
Is the required deformation amount of the surface plate protection plate 3. As is clear from the equation (1), the plate thickness has a larger effect on the deformability of the surface plate protection plate 3 than the elastic modulus of the material.
In the Fe-Ni-based alloy and Fe-Cr-Ni-based alloy described later, in the case of a surface plate having a radius of 500 mm, it is appropriate that the surface plate protection plate 3 has a thickness of several mm.
【００２３】さらに、定盤保護板３が定盤本体２の形状
に正確に倣い、かつ定盤本体２の形状精度を正確に反映
させるために、定盤保護板３の板厚精度を定盤本体２に
要求される形状精度と同等ないしそれ以上とすることが
望ましい。例えば、半導体用研磨定盤において、定盤保
護板３の直径が 500〜1000mmである場合には、定盤保護
板３の板厚精度は50μm 以下とすることが好ましい。こ
のような点からも、定盤保護板３としては板厚精度の高
い金属板が好ましく用いられる。Further, in order that the platen protection plate 3 accurately follows the shape of the platen body 2 and accurately reflects the shape accuracy of the platen body 2, the platen thickness accuracy of the platen protection plate 3 is determined by the platen. It is desirable that the shape accuracy is equal to or higher than that required for the main body 2. For example, in the polishing platen for semiconductors, when the diameter of the platen protection plate 3 is 500 to 1000 mm, the platen thickness accuracy of the platen protection plate 3 is preferably 50 μm or less. From this point of view, a metal plate having a high plate thickness accuracy is preferably used as the surface plate protection plate 3.
【００２４】また、定盤保護板３の具体的な材質は、研
磨液としてアルカリ性もしくは酸性の化学液が使用され
る場合に対処できるように、これらの研磨液に対して耐
食性を有する材料を用いることが好ましい。半導体ウェ
ハの研磨液としては、ＳｉやＳｉＯ2 等のポリッシング
用にΚΟＨ溶液等のアルカリ性溶液が用いられ、また金
属配線のポリッシング用に酸性溶液が用いられるため、
定盤保護板３にはＦｅ−Ｎｉ系合金やＦｅ−Ｃｒ−Ｎｉ
系合金を使用することが好ましい。前者としてはＦｅ−
36重量% Ｎｉ（インバー）合金やＦｅ−30重量% Ｎｉ−
5重量% Ｃｏ（スーパーインバー）合金等が例示され、
後者としては SUS 316や SUS 304等のステンレス鋼が例
示される。これらは研磨液の種類に応じて適宜選択して
使用される。Further, as a specific material of the surface plate protection plate 3, a material having corrosion resistance to these polishing liquids is used so as to cope with the case where an alkaline or acidic chemical liquid is used as the polishing liquid. It is preferable. As a polishing liquid for a semiconductor wafer, an alkaline solution such as a KH solution is used for polishing Si or SiO 2 , and an acidic solution is used for polishing metal wiring.
The platen protection plate 3 is made of Fe-Ni alloy or Fe-Cr-Ni.
It is preferable to use a system alloy. Fe- as the former
36 wt% Ni (Invar) alloy and Fe-30 wt% Ni-
5 wt% Co (super invar) alloy etc. are exemplified,
Examples of the latter include stainless steel such as SUS 316 and SUS 304. These are appropriately selected and used according to the type of polishing liquid.
【００２５】定盤本体２には、真空が切れた場合におい
ても定盤保護板３と研磨クロス４が回転する定盤本体２
から外れないように、その中央部に外れ防止手段が設け
られている。具体的には、定盤本体２の上面２ａ中央部
に外れ防止用ピン１４が立設されており、この外れ防止
用ピン１４に定盤保護板３および研磨クロス４の中央部
に設けられたピン挿入孔が嵌め込まれている。さらに、
外れ防止用ピン１４に押えキャップ１５をねじ込んで取
付け、定盤保護板３と研磨クロス４を固定する構造とさ
れている。The surface plate body 2 has a surface plate protection plate 3 and a polishing cloth 4 which rotate even when the vacuum is cut off.
In order to prevent it from coming off, a detachment preventing means is provided at the central portion thereof. Specifically, a detachment prevention pin 14 is provided upright at the center of the upper surface 2a of the surface plate body 2, and the detachment prevention pin 14 is provided at the center of the surface plate protection plate 3 and the polishing cloth 4. The pin insertion hole is fitted. further,
The pressing cap 15 is screwed into the disengagement prevention pin 14 to attach it, and the surface plate protection plate 3 and the polishing cloth 4 are fixed.
【００２６】研磨クロス４上には、別に回転駆動される
平板（トップリング）１６に固定された被研磨物１７、
例えば半導体ウェハがセットされる。また、研磨クロス
４上には、図示を省略した研磨液供給装置から研磨液供
給管１８を介して、研磨粒子とポリッシング液との混合
スラリー等からなる研磨液が供給される。そして、上記
研磨液を供給しつつ、研磨クロス４を定盤保護板３を介
して定盤本体２に真空吸引により固定した研磨定盤１を
回転させると共に、被研磨物１７を所定の圧力で研磨ク
ロス４に押圧した状態で、研磨定盤１とは同方向あるい
は逆方向に自転させながら研磨定盤１上を回転移動させ
る。このようにして被研磨物１７の研磨作業が行われ
る。On the polishing cloth 4, an object to be polished 17 fixed to a flat plate (top ring) 16 which is separately driven to rotate,
For example, a semiconductor wafer is set. On the polishing cloth 4, a polishing liquid including a mixed slurry of polishing particles and a polishing liquid is supplied from a polishing liquid supply device (not shown) via a polishing liquid supply pipe 18. Then, while the polishing liquid is being supplied, the polishing surface plate 1 in which the polishing cloth 4 is fixed to the surface plate main body 2 by vacuum suction via the surface plate protection plate 3 is rotated, and at the same time the object to be polished 17 is pressed at a predetermined pressure. While being pressed against the polishing cloth 4, it is rotationally moved on the polishing surface plate 1 while rotating in the same direction as or opposite to the direction of the polishing surface plate 1. In this way, the work of polishing the object to be polished 17 is performed.
【００２７】上述した実施形態の研磨装置においては、
研磨クロス４の損耗が進んで被研磨物１７との摩擦が大
きくなり、被研磨物１７が研磨クロス４に引っ掛かって
破損して研磨クロス４が破れたとしても、研磨定盤１と
しての形状精度を担う定盤本体２の上面２ａは定盤保護
板３で保護しているため、定盤本体２の上面２ａが損傷
することはない。そして、上記研磨クロス４の破損に伴
って定盤保護板３が損傷した場合には、定盤保護板３の
みを交換すればよく、また定盤保護板３は真空吸引力で
保持しているために容易に交換できることから、研磨作
業を長時間にわたって中断することがなくなる。これら
によって、研磨作業を安定して行うことができ、被研磨
物１７の破損に伴う研磨装置の稼働率の低下を大幅に抑
制することが可能となる。In the polishing apparatus of the above embodiment,
Even when the abrasion of the polishing cloth 4 progresses and the friction with the object to be polished 17 increases, and the object to be polished 17 is caught by the polishing cloth 4 and is damaged and the polishing cloth 4 is broken, the shape accuracy of the polishing surface plate 1 is high. Since the upper surface 2a of the surface plate main body 2 that protects the surface plate is protected by the surface plate protection plate 3, the upper surface 2a of the surface plate body 2 is not damaged. When the surface plate protection plate 3 is damaged due to the damage of the polishing cloth 4, only the surface plate protection plate 3 needs to be replaced, and the surface plate protection plate 3 is held by a vacuum suction force. Therefore, the polishing operation is not interrupted for a long time because it can be easily replaced. As a result, the polishing operation can be performed stably, and it is possible to significantly suppress the reduction in the operating rate of the polishing apparatus due to the damage to the workpiece 17.
【００２８】また、定盤保護板３および研磨クロス４の
真空吸着は、定盤本体２側の真空吸引孔６の数や径を適
宜設定することによって、研磨クロス４全体に均等に力
を加えることができると共に、保持力自体を制御するこ
とができる。これらにより、定盤保護板３および研磨ク
ロス４の定盤本体２との一体回転を実現した上で、その
横方向に対する保持力を小さくすることができる。従っ
て、定盤本体２と定盤保護板３や研磨クロス４との間の
温度勾配や熱膨張率の差等に起因して、これらの間で熱
膨張量に差が生じたとしても、定盤保護板３および研磨
クロス４は膨張方向に比較的自由に伸びることができ
る。このように、定盤保護板３および研磨クロス４の膨
張方向への伸びの自由度を高めることによって、定盤保
護板３および研磨クロス４の熱変形を防止することがで
きることから、容易に研磨精度を維持することが可能と
なる。Further, in vacuum suction of the surface plate protection plate 3 and the polishing cloth 4, a force is uniformly applied to the entire polishing cloth 4 by appropriately setting the number and diameter of the vacuum suction holes 6 on the surface plate body 2 side. The holding force itself can be controlled. With these, the platen protection plate 3 and the polishing cloth 4 can be integrally rotated with the platen body 2, and the holding force in the lateral direction can be reduced. Therefore, even if there is a difference in the amount of thermal expansion between the surface plate main body 2 and the surface plate protection plate 3 or the polishing cloth 4 due to a difference in the temperature gradient or the coefficient of thermal expansion between them, The board protection plate 3 and the polishing cloth 4 can extend relatively freely in the expansion direction. In this way, by increasing the degree of freedom of expansion of the surface plate protection plate 3 and the polishing cloth 4 in the expansion direction, thermal deformation of the surface plate protection plate 3 and the polishing cloth 4 can be prevented, so that polishing is easily performed. It is possible to maintain accuracy.
【００２９】所定数の被研磨物１７の研磨作業を行い、
研磨クロス４の取換えが必要になった場合には、真空吸
引を停止もしくは遮断して研磨クロス４を容易に取換え
ることができるため、研磨クロス４の取換え作業を短時
間で実施することが可能となり、研磨クロス４の取換え
作業に伴う研磨装置の稼働率の低下を抑制することがで
きる。After polishing a predetermined number of objects to be polished 17,
When the polishing cloth 4 needs to be replaced, the vacuum suction can be stopped or interrupted to easily replace the polishing cloth 4. Therefore, the replacement work of the polishing cloth 4 must be performed in a short time. Therefore, it is possible to suppress a decrease in the operating rate of the polishing apparatus due to the replacement work of the polishing cloth 4.
【００３０】[0030]
【実施例】次に、本発明の具体的な実施例について説明
する。Next, specific examples of the present invention will be described.
【００３１】実施例１ まず、研磨クロス４としてポリウレタン系クロスの裏面
にペット樹脂を張付けた気密性研磨クロスを準備した。
一方、直径 600mmの SUS 316ステンレス鋼製の定盤本体
２を作製した。定盤本体２の上面２ａには、直径 5mmの
吸引孔６を 2個／cm2 の割合で全面にほぼ均等に設け
た。また、定盤保護板３としては、厚さ約1.0mmの SUS
316ステンレス鋼の圧延板を研磨して板厚精度± 5μm
に仕上げ、さらに直径 2mmの孔１３を定盤本体２と同位
置に設けたものを準備した。Example 1 First, as the polishing cloth 4, an airtight polishing cloth prepared by sticking PET resin on the back surface of a polyurethane cloth was prepared.
On the other hand, a surface plate body 2 made of SUS 316 stainless steel having a diameter of 600 mm was prepared. The upper surface 2a of the surface plate body 2 was provided with suction holes 6 having a diameter of 5 mm substantially uniformly over the entire surface at a rate of 2 holes / cm 2 . The surface plate protection plate 3 is made of SUS with a thickness of about 1.0 mm.
Polished 316 stainless steel rolled plate thickness accuracy ± 5 μm
After that, a hole 13 having a diameter of 2 mm was provided at the same position as the surface plate main body 2 was prepared.
【００３２】上述した研磨クロス４、定盤本体２および
定盤保護板３を用いて、図１に示した研磨定盤１を構成
すると共に、図１に示した研磨装置に搭載した。研磨ク
ロス４および定盤保護板３は、定盤本体２に真空吸引に
より固定されている。The polishing cloth 4, the surface plate body 2, and the surface plate protection plate 3 described above were used to construct the polishing surface plate 1 shown in FIG. 1 and to mount it on the polishing apparatus shown in FIG. The polishing cloth 4 and the platen protection plate 3 are fixed to the platen body 2 by vacuum suction.
【００３３】このような研磨装置によれば、研磨作業中
に研磨クロス４が破損しても、定盤本体２の上面２ａは
傷付くことはなく、平滑な定盤面を維持することがで
き、また定盤保護板３を取換えるだけで研磨作業を続け
ることが可能であった。また、研磨熱の発生により SUS
316ステンレス鋼板からなる定盤保護板３の熱膨張が生
じたが、この熱膨張は真空吸引に基く横方向への比較的
自由な伸びによって、研磨精度を低下させるような変形
は発生せず、良好な研磨精度を安定して得ることができ
た。According to such a polishing apparatus, even if the polishing cloth 4 is damaged during the polishing operation, the upper surface 2a of the surface plate body 2 is not scratched and a smooth surface plate surface can be maintained. Further, the polishing work could be continued only by replacing the platen protection plate 3. Also, due to the generation of polishing heat, SUS
Thermal expansion of the platen protection plate 3 made of 316 stainless steel plate occurred, but this thermal expansion was relatively free in the lateral direction based on vacuum suction, so that deformation that deteriorates polishing accuracy did not occur. Good polishing accuracy could be stably obtained.
【００３４】さらに研磨クロス４の取換え作業時間は 1
〜 2分程度と短く、また研磨クロスの張付け作業ではし
わの発生が無いように張付けるために熟練を要していた
が、真空吸引では研磨クロス４のしわを容易に修正する
ことが可能であるため、最適状態の研磨クロス４の設置
が個人差なく容易に行うことができるようになった。Further, the replacement work time of the polishing cloth 4 is 1
It was as short as ~ 2 minutes, and it required skill to apply the polishing cloth so that wrinkles did not occur during the application. However, vacuum suction can easily correct the wrinkles on the polishing cloth 4. Therefore, the polishing cloth 4 in the optimum state can be easily installed without any individual difference.
【００３５】[0035]
【発明の効果】以上説明したように、本発明の研磨定盤
によれば、研磨クロスに破損が生じた場合においても、
研磨面精度を担う定盤表面の損傷を確実に防止すること
が可能となる。従って、このような研磨定盤を用いた本
発明の研磨装置によれば、研磨作業の安定化を図ること
ができると共に、装置の高稼働率化を達成することが可
能となる。As described above, according to the polishing plate of the present invention, even when the polishing cloth is damaged,
It is possible to reliably prevent damage to the surface of the surface plate that is responsible for the accuracy of the polishing surface. Therefore, according to the polishing apparatus of the present invention using such a polishing platen, it is possible to stabilize the polishing operation and to achieve a high operating rate of the apparatus.
【図１】 本発明の一実施形態による研磨定盤および研
磨装置の要部構成を示す断面図である。FIG. 1 is a cross-sectional view showing a main configuration of a polishing platen and a polishing apparatus according to an embodiment of the present invention.
【図２】 図１に示す研磨定盤の要部拡大図である。FIG. 2 is an enlarged view of a main part of the polishing platen shown in FIG.
１……研磨定盤 ２……定盤本体 ３……定盤保護板 ４……研磨クロス ６……真空吸引孔 ７……駆動軸 ９……真空ポンプ １１…モータ １３…孔 1 ... Polishing surface plate 2 ... Surface plate body 3 ... Surface plate protection plate 4 ... Polishing cloth 6 ... Vacuum suction hole 7 ... Drive shaft 9 ... Vacuum pump 11 ... Motor 13 ... Hole
Claims (5)
吸引孔が設けられた定盤本体と、 前記定盤本体の上面側に配置され、前記定盤本体と一体
回転可能に、前記吸引孔を介して真空吸引により保持さ
れる研磨クロスと、 前記定盤本体と研磨クロスとの間に介挿され、前記真空
吸引力を前記研磨クロスに伝え得ると共に、前記研磨ク
ロスに対する真空吸引力で前記定盤本体に保持される定
盤保護板とを具備することを特徴とする研磨定盤。1. A platen body connected to a drive unit of a polishing apparatus and provided with suction holes on an upper surface side, and a platen body arranged on an upper surface side of the platen body and integrally rotatable with the platen body. A polishing cloth that is held by vacuum suction through a suction hole, is inserted between the surface plate body and the polishing cloth, and can transfer the vacuum suction force to the polishing cloth, and also a vacuum suction force for the polishing cloth. And a surface plate protection plate held by the surface plate body.
同じ位置に設けられた孔を有する金属板からなることを
特徴とする研磨定盤。2. The polishing platen according to claim 1, wherein the platen protection plate is made of a metal plate having at least a hole provided at the same position as a suction hole of the platen body. Surface plate.
で前記定盤本体に倣う剛性を有することを特徴とする研
磨定盤。3. The polishing surface plate according to claim 1, wherein the surface plate protection plate has a rigidity that follows the surface plate body by a vacuum suction force to the polishing cloth.
スおよび定盤保護板の外れ防止手段を有することを特徴
とする研磨定盤。4. The polishing surface plate according to claim 1, wherein the surface plate main body has a means for preventing the polishing cloth and the surface plate protection plate from coming off in a central portion thereof. .
し、前記定盤本体に固定する真空系と、 前記研磨定盤の定盤本体に接続された駆動軸を介して、
前記研磨定盤を回転駆動させる駆動系とを具備すること
を特徴とする研磨装置。5. The polishing platen according to claim 1, a vacuum system for vacuum-sucking a polishing cloth and a platen protection plate of the polishing platen and fixing the platen body to the platen body, and a platen for the polishing platen. Via the drive shaft connected to the main body,
A polishing apparatus, comprising: a drive system that rotationally drives the polishing platen.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7388296A JPH09262758A (en) | 1996-03-28 | 1996-03-28 | Polishing level block, and polishing device using the same |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7388296A JPH09262758A (en) | 1996-03-28 | 1996-03-28 | Polishing level block, and polishing device using the same |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH09262758A true JPH09262758A (en) | 1997-10-07 |
Family
ID=13531031
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP7388296A Withdrawn JPH09262758A (en) | 1996-03-28 | 1996-03-28 | Polishing level block, and polishing device using the same |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH09262758A (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2000296458A (en) * | 1999-02-25 | 2000-10-24 | Obsidian Inc | Polishing medium stabilizer |
| JP2007260870A (en) * | 2006-03-29 | 2007-10-11 | Ntn Corp | Lapping apparatus |
| CN103846788A (en) * | 2014-03-07 | 2014-06-11 | 湖南永创机电设备有限公司 | Polishing machine with improved polished piece adsorption mode |
| CN106926117A (en) * | 2017-03-08 | 2017-07-07 | 燕山大学 | Abrasive disk under a kind of one side precision lapping machine vacuum adsorption type |
-
1996
- 1996-03-28 JP JP7388296A patent/JPH09262758A/en not_active Withdrawn
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2000296458A (en) * | 1999-02-25 | 2000-10-24 | Obsidian Inc | Polishing medium stabilizer |
| JP2007260870A (en) * | 2006-03-29 | 2007-10-11 | Ntn Corp | Lapping apparatus |
| CN103846788A (en) * | 2014-03-07 | 2014-06-11 | 湖南永创机电设备有限公司 | Polishing machine with improved polished piece adsorption mode |
| CN106926117A (en) * | 2017-03-08 | 2017-07-07 | 燕山大学 | Abrasive disk under a kind of one side precision lapping machine vacuum adsorption type |
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| Date | Code | Title | Description |
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| A300 | Withdrawal of application because of no request for examination |
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