JPH09262557A - Thin disc cleaning apparatus, thin disc rinsing apparatus and thin disc cleaning and rinsing apparatus - Google Patents

Abstract

PROBLEM TO BE SOLVED: To simultaneously clean both faces of a thin disc by an apparatus wherein the thin disc being vertically arranged is supported rotatably in its horizontal face and a pair of rotating brushes are provided so as to pinch this thin disc and the surfaces of the thin disc are rubbed by means of these rotating brushes while a cleaning liq. is fed. SOLUTION: When a wafer 5 is cleaned, the wafer 5 is filled in a wafer cleaning apparatus 2 by means of a wafer transferring apparatus 4 and after the wafer 5 is cleaned in the wafer cleaning apparatus 2, the wafer 5 is transferred to a wafer rinsing apparatus by means of the wafer transferring apparatus 4 and the wafer 5 is rinsed and cleaned. The wafer cleaning apparatus 2 is constituted in such a way that four rotating brushes 9 are arranged on five rollers in a cleaning tank 7 and the wafer 5 is pinched by means of a pair of rotating brushes 9 by driving a mechanism 22 for moving horizontally the rotating brushes under a condition where the wafer 5 is stood on the rollers. Then, each rotating brush 9 is rotated and both faces of the wafer 5 is cleaned by spraying a cleaning liq. from a cleaning liq. feeding nozzle 11.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a thin disk cleaning device, a thin disk rinsing device, and a thin disk cleaning rinsing device. More specifically, the present invention relates to a thin disk body cleaning apparatus capable of efficiently cleaning a large amount of thin disk bodies such as silicon wafers, and to efficiently rinse a thin disk body cleaned by this thin disk body cleaning apparatus. The present invention relates to a thin disc body rinsing device, and a thin disc body cleaning and rinsing device capable of efficiently cleaning and rinsing a thin disc body by combining the thin washing device and the thin rinse device.

[0002]

2. Description of the Related Art Conventionally, a thin disk body such as a silicon wafer has been washed and dried as follows.

That is, a cleaning liquid is sprayed on the upper surface of a horizontally arranged silicon wafer, and the upper surface of the silicon wafer is rubbed with a cleaning brush. After a lapse of a certain period of time, the silicon wafer is turned over and the unwashed surface of the silicon wafer is rubbed with the cleaning brush on the upper surface of the silicon wafer while spraying the cleaning liquid in the same manner as described above.

After cleaning both sides of the silicon wafer, the silicon wafer is dried in a drying device by natural drying or by blowing nitrogen gas onto the surface of the silicon wafer.

However, in the cleaning and drying of the silicon wafer by the above-mentioned method, it is necessary to turn over the horizontally arranged silicon wafer, which complicates the apparatus structure, and the front and back surfaces of the silicon wafer are complicated. Since cleaning is performed separately, it takes extra cleaning time, which may damage the silicon wafer when turning it over, and when reversing the silicon wafer, it may contaminate the surface of the cleaned silicon wafer again. However, there is a problem in that the fibers of the cleaning brush may remain on the surface of the silicon wafer by rubbing with the cleaning brush.

[0006]

SUMMARY OF THE INVENTION An object of the present invention is to provide a thin disk cleaning device having a simple structure, which can clean both surfaces of a thin disk at once.

An object of the present invention is to make a thin disc body which can be cleaned without leaving fibers and solids of the brush on the surface of the thin disc body washed with a brush. To provide a disc body rinsing device.

An object of the present invention is to provide a thin disk body cleaning and rinsing apparatus capable of cleaning both sides of a thin disk body at one time without secondary contamination due to cleaning.

[0009]

According to a first aspect of the present invention for solving the above-mentioned problems, there is provided a rotation supporting means for rotatably supporting a vertically arranged thin disk body in a horizontal plane thereof, and the thin shape. A thin disc body rubbing means for rubbing the surface of the thin disc body with the rotating brush, and a cleaning liquid supply for spraying a cleaning liquid on the thin disc body. A thin disk body cleaning device comprising: a thin disk body housing means for housing a vertically arranged thin disk body; and both surfaces of the thin disk body. A rinse liquid spraying means for spraying the rinse liquid over the whole, a rinse liquid supply port provided at the bottom of the thin disk body housing means and for supplying the rinse liquid into the thin disk body housing means, and the rinse liquid supply Mouth A thin disc body rinsing device, comprising: a rinse liquid supply / discharge means having an openable / closable rinse liquid discharge port for discharging the rinse liquid filled in the thin disc body housing means to the outside of the thin disc body housing chamber. The invention according to claim 3 is provided with a first internal space formed so as to accommodate a vertically arranged thin disc body, and the rinse liquid can be uniformly sprayed on both surfaces of the thin disc body. A plurality of rinsing liquid spray ports, and a lower end having a first rinsing liquid supply port capable of supplying the rinsing liquid into the first internal space and a first discharge port formed to be openable and closable. An internal storage tank, a second rinse liquid supply port provided in an upper part of a second internal space formed by housing the internal storage tank in a sealed state, and Provided in the lower part of this second internal space A thin disk body rinsing device, comprising: an external storage tank having a second discharge port that can be opened and closed, wherein the invention according to claim 4 is the thin disk according to claim 1. A body washing device, the thin disc body rinsing device according to claim 2, and the thin disc body that is moved from the outside toward the rotation supporting means in the thin disc body washing device according to claim 1 to form the thin disc body. The first internal part of the thin disk rinsing device according to claim 2, wherein the body is loaded vertically on the rotary support means, and the thin disk body supported vertically on the rotary support means is taken out. A thin disk cleaning and rinsing apparatus comprising: a first thin disk body moving means to be housed in a space, wherein the invention according to claim 5 is the thin disk body cleaning apparatus according to claim 1; , Said claim 3 The thin disk body rinsing device and the thin disk body cleaning apparatus according to claim 1, wherein the thin disk body is moved from the outside toward the rotation supporting means, and the thin disk body is loaded perpendicularly to the rotation supporting means. And a second thin disk body moving means for taking out the thin disk body supported by the rotation supporting means and storing the thin disk body in the thin disk body housing means in the thin disk body rinse device according to claim 3. It is a characteristic thin disk cleaning rinse device.

[0010]

BEST MODE FOR CARRYING OUT THE INVENTION

(General Description) -Thin Disk Body Cleaning Device-A thin disk body cleaning device according to the present invention includes a rotation support means for rotatably supporting a vertically arranged thin disk body in its horizontal plane, and the thin disk body. Comprising at least a pair of rotating brushes that can be sandwiched, and a thin disk rubbing means for rubbing the surface of the thin disk body with the rotating brush,
A cleaning liquid supply unit for spraying the cleaning liquid onto the thin disk body is provided.

The thin disc body that is suitably washed by this thin disc body cleaning device may be any disc body having a small thickness, and a particularly preferable thin disc body is a silicon wafer. Is.

The rotation supporting means in this thin disk cleaning device is formed so as to rotatably support the vertically arranged thin disk in the vertical plane about the center of the thin disk. To be done. This rotation support means
It can be configured to have a base and at least two rollers rotatably provided on the base. The roller may be a free roller or may be a driving roller driven by an appropriate driving means such as a motor.

A preferred rotation supporting means comprises a base and at least five free rollers rotatably provided on the base, and the thin disk body is vertically arranged on the five free rollers. These five free rollers are formed so that they can be arranged.

It is preferable that these rollers are formed so that the thin disk bodies are stably arranged on the plurality of rollers, and for this reason, a groove into which the peripheral end face of the thin disk body fits is formed on the peripheral surface of the rollers. It is preferably formed so as to go around the peripheral surface. However, other means may be taken so that the thin disk body rotatably erected on the plurality of rollers is stably erected on the rollers.

The thin disk rubbing means has at least a pair of rotating brushes arranged so as to sandwich both sides of the thin disk body vertically erected by the rotation supporting means. Rubbing both sides of the disk body, at the same time to give a rotating force to this thin disk body by this rotating brush, so that this thin disk body rotates in a vertical plane on the rotation supporting means, especially on the roller, It is formed.

The rotating brush can take various forms as long as it is configured so that it can rub a thin disk body that is vertically erected and can apply a rotational force to the thin disk body. . A suitable rotary brush has, for example, a rotary shaft and a large number of brush fibers planted on the outer peripheral surface of a cylindrical drum mounted on the rotary shaft so that the overall shape is cylindrical. can do. The rotating brush can be arranged so that its rotation axis is horizontal or vertical.

The number of rotating brushes is at least two, and at least one rotating brush is provided on one side so that the thin disk body can be held.

The rotary shaft can be rotated by an appropriate driving means such as a motor.

A preferred thin disc rubbing means is such that a horizontal rotating shaft is slidable on one surface of the thin disc body which is vertically erected by the rotation supporting means and has two upper and lower stages. Having two rotating brushes having, and two rotating brushes having a horizontal rotating shaft so as to be slidable on the other surface of the thin disk body, and having two horizontal rotating shafts. A pair of rotating brushes in the upper part and a pair of rotating brushes in the lower part are arranged so as to sandwich the thin disk body. Further, this preferable thin disc body rubbing means is configured to be rotatable so that a pair of rotating brushes arranged with the thin disc body interposed therebetween approach each other and separate from each other. When the pair of rotating brushes are opened so that the distance between the pair of rotating brushes arranged so as to sandwich the thin disk body is increased, it becomes easy to insert the thin disk body between the pair of rotating brushes. When the rotating brushes of the above approach each other, the rotating brush can rub against the thin disc body inserted between the pair of rotating brushes, and the rotating brush rubs against the surface of the thin disc body to reduce the thickness of the thin disc body. It becomes possible to easily remove stains on the surface of.

The rotating directions of the pair of rotating brushes that sandwich the thin disk body may be opposite to each other, may be the same direction, or may be different in rotating speed. The same rotation speed may be used.

The cleaning liquid supply means is rotatably supported by the rotation supporting means and can be sprayed with the cleaning liquid on the thin disc body sandwiched by the rotating brush of the thin disc body rubbing means. Can be adopted.

A preferred cleaning liquid supply means is a plurality of cleaning liquid supply nozzles, which are arranged above a thin disk body sandwiched by rotary brushes and which can spray the cleaning solution toward the thin disk body, The cleaning liquid supply nozzle can be formed by including a cleaning liquid supply tank connected to the cleaning liquid supply nozzle via a pipe and storing the cleaning liquid, and a pump for pumping the cleaning liquid from the cleaning liquid supply tank toward the cleaning liquid supply nozzle.

The cleaning liquid supply nozzle can be arranged at an appropriate position so that the cleaning liquid can be sprayed on the thin disk body sandwiched by the rotating brushes.

The cleaning liquid may be an organic solvent,
It may also be pure water. When the thin disk body is a silicon wafer, the cleaning liquid is preferably an organic solvent, particularly a halogenated hydrocarbon.

In this thin disk cleaning device, usually, the rotation supporting means, the thin disk rubbing means,
The cleaning liquid supply means is arranged in the cleaning tank.

A preferred cleaning tank has a double structure for the cleaning tank and has a structure for preventing the vapor of the cleaning liquid in the cleaning tank from leaking to the outside. For example, a suitable cleaning tank is an internal space having a sufficient volume capable of accommodating the rotation supporting means, the thin disk body rubbing means, and the cleaning liquid supply nozzle in the cleaning liquid supply means, and a first part at the bottom. And a lower part of the first cleaning tank so as to be able to receive the waste liquid flowing out from the first liquid outlet of the first cleaning tank. A second liquid outlet on the bottom of itself,
Furthermore, it has a 2nd washing tank which equips the side with the duct which sucks gas. The second liquid outlet is connected to a waste liquid storage tank via a pipe so that the waste liquid after cleaning the thin disk body is finally stored in the waste liquid storage tank.

According to this preferable cleaning tank, the air in the second cleaning tank is exhausted by the duct to make the first cleaning tank.
Since the air in the cleaning tank is also exhausted, as a result, the vapor of the cleaning liquid does not leak to the outside of the first cleaning tank.

In this thin disk cleaning device, the thin disk is supported by the rotation supporting means so that it is vertical, and the thin disk is rubbed so as to sandwich the thin disk supported by the rotation supporting means. It is held by the rotating brush of the means, and in this state, when the rotating brush rotates, the thin disk body rotates on the rotation supporting means, and at the same time, the rotating brush rubs the surface of the thin disk body. As the rotary brush rotates, the cleaning liquid is sprayed from the cleaning liquid supply means onto the thin disk body. The surface of the thin disk body is cleaned by the spraying of the cleaning liquid and the rubbing of the rotary brush.

-Thin disk body rinsing device-This thin disk body rinsing device is a thin disk body housing means for housing a vertically arranged thin disk body, and a rinsing liquid is sprayed over both surfaces of the thin disk body. And a rinse liquid supply port provided at the bottom of the thin disk body housing means for supplying a rinse liquid into the thin disk body housing means, and the thin disk body housing means from the rinse liquid supply port. And a rinse liquid supply / discharge means having an openable / closable rinse liquid discharge port for discharging the rinse liquid filled in the outside of the thin disk body storage chamber, and the thin disk body vertically arranged in a vertical state. The operation of spraying the rinse liquid on both sides of
The thin disk housing means for housing the thin disk is filled with the rinse liquid, and then the rinse liquid is discharged all at once.

The thin disk body accommodating means is not particularly limited as long as it has a device structure capable of accommodating the thin disk body so that both surfaces thereof are vertical, but a suitable thin disk body accommodating means is A storage tank having an internal space sufficient to vertically store the thin disk body, and a support member provided at the bottom of the storage tank and vertically standing the thin disk body.

The thin disc body accommodating means is provided with a rinse liquid supplying / discharging means. The rinse liquid supply / discharge means has a rinse liquid supply port and a rinse liquid discharge port, and supplies the rinse liquid from the rinse liquid supply port into the thin disk body accommodating means while keeping the rinse liquid discharge port closed. It is possible to discharge the rinse liquid in the thin disk body accommodating means all at once by filling the thin disk body accommodating means with the rinse liquid and then opening the rinse liquid outlet while keeping the rinse liquid supply port closed. Is formed as.

The rinse liquid supply port and the rinse liquid discharge port are provided at the bottom of the thin disk accommodating means. The rinse liquid supply port and the rinse liquid discharge port are preferably formed so as to be openable and closable. Further, the rinsing liquid discharge port and the rinsing liquid supply port may have a common opening provided at the bottom of the thin disk accommodating means. In this case, for example, a three-way switching valve is provided in the middle of the pipe communicating with the opening provided at the bottom of the thin disk accommodating means, and one of the three-way switching valves is connected with the rinse liquid supply pipe for supplying the rinse liquid. A rinse liquid discharge pipe for discharging the rinse liquid is coupled to the other of the three-way switching valves. Therefore, the opening serves as a rinse liquid supply port and also as a rinse liquid discharge port. However, the rinse liquid supply port and the rinse liquid discharge port may be separately opened at the bottom of the thin disk accommodating means.

The rinse liquid spraying means is configured so that the rinse liquid is sprayed over the entire surfaces of the thin disk body vertically arranged in the thin disk housing means. For example, facing a thin disk vertically placed upside down on both sides of this thin disk, and facing the thin disk into the facing surface, A structure having a large number of rinse liquid supply holes arranged in a line and spraying the rinse liquid from the large number of rinse liquid supply holes toward the thin disk body can be mentioned. According to the rinse liquid spraying means having this structure, the rinse liquid can be sprayed uniformly on both surfaces of the thin disk body from the rinse liquid supply hole at one time.

In addition, as a rinse liquid spraying means having another structure, it is provided horizontally with a thin disc body sandwiched, has a plurality of rinse liquid supply holes which are closed at the tip and open toward the thin disc body, and which are thin. An example of the rinse liquid ejection pipe is one that is formed so as to be movable up and down across the disc body. According to this rinse liquid ejecting pipe, while ejecting the rinse liquid from the many rinse liquid supply holes toward the thin disc body, the rinse liquid ejecting pipe is moved from the upper side to the lower side or from the lower side along the surface of the thin disc body. By moving upward, both surfaces of the thin disk body can be washed with the washing liquid.

A preferred mode of this thin disk body rinsing device is provided with a first internal space formed so as to accommodate the vertically arranged thin disk body, and the rinse liquid is uniformly applied to both surfaces of the thin disk body. Equipped with multiple rinse liquid spray ports that can spray
In addition, an internal storage tank having a first rinse liquid supply port capable of supplying the rinse liquid into the first internal space and a first discharge port formed to be openable and closable at the lower end, and the internal storage tank A second rinse liquid supply port provided in an upper part in a second internal space formed by accommodating the internal accommodating tank in a sealed state and a lower part in the second internal space An external storage tank having a second discharge port that can be opened and closed is provided.

It is desirable that the cleaning solution spray port is opened in a grid pattern toward the surface of the thin disk body.

According to this preferable thin disk body rinse device, when the rinse liquid is supplied from the second rinse liquid supply port into the second internal space while the second discharge port is closed,
As the rinse liquid fills the second internal space,
The rinse liquid is sprayed from the rinse liquid spray port toward the surface of the thin disk body. The sprayed rinse liquid passes through the first internal space and is discharged from the first discharge port. After spraying the rinse liquid from the first rinse liquid supply port to the thin disk body over a predetermined time, the supply of the rinse liquid from the second rinse liquid supply port is stopped and the first discharge port is closed. And the second outlet is opened. Then, the rinse liquid is supplied into the first internal space from the first rinse liquid supply port.
A part of the rinse liquid filled in the first internal space overflows from the rinse liquid distribution port into the second internal space and is discharged from the second discharge port. Even if the adhered residue is present on the surface of the thin disk body, the adhered residue is washed away together with the overflow from the rinse liquid spraying port. When the rinse liquid is filled in the first internal space and a predetermined time has passed in that state, the first discharge port is opened and the rinse liquid existing in the first internal space is changed to the first liquid. Discharge from the discharge port of. By repeating the above operation, the thin disc body is rinsed.

-Thin Disc Cleaning Rinse Device-This thin disc cleaning rinse device is the thin disc cleaning device, the thin disc rinsing device, and the thin disc cleaning device to the thin disc rinsing device. And a thin disk body moving means for transferring the thin disk body.

A first example of a thin disk cleaning rinse device is
(1) comprising a rotation support means for rotatably supporting a vertically arranged thin disk body in its horizontal plane, and at least a pair of rotating brushes arranged so as to be able to sandwich the thin disk body,
A thin disk body cleaning device having a thin disk body rubbing means for rubbing the surface of the thin disk body with the rotating brush, and a cleaning liquid supply means for spraying a cleaning liquid on the thin disk body, (2) vertically arranged. And a thin disc body accommodating means for accommodating the thin disc body, a rinse liquid spraying means for sprinkling a rinse liquid over the entire surfaces of the thin disc body, and a thin disc body provided at the bottom of the thin disc body accommodating means. A rinse liquid supply port for supplying a rinse liquid into the body accommodating means, and an openable and closable rinse liquid discharge port for discharging the water filled in the thin disc body accommodating means to the outside of the thin disc body accommodating chamber from the rinse liquid supply port. A thin disc body rinsing device comprising a rinsing liquid supply / drainage means, and (3) moving the thin disc body from the outside toward the rotation supporting means in the thin disc body cleaning device to rotate the thin disc body. Supporter First thin disk body moving means for loading the thin disk body vertically supported by the rotation support means and storing the thin disk body in the first internal space of the thin disk body rinser. And having.

The second example of the thin disk cleaning and rinsing device is as follows: (1) A rotation supporting means for rotatably supporting a vertically arranged thin disk body in its horizontal plane and the thin disk body can be sandwiched. A thin type having at least a pair of rotating brushes arranged in the thin-type disc body, the thin-type disc body rubbing means for rubbing the surface of the thin-type disc body with the rotating brush, and the cleaning liquid supply means for spraying the cleaning liquid on the thin disc body. A disk cleaning device,
(2) A first internal space formed so as to accommodate a vertically arranged thin disc body, and a plurality of rinse liquid spray ports capable of uniformly spraying the rinse liquid on both sides of the thin disc body are provided. ,
In addition, an internal storage tank having a first rinse liquid supply port capable of supplying the rinse liquid into the first internal space and a first discharge port formed to be openable and closable at the lower end, and the internal storage tank A second rinse liquid supply port provided in an upper part in a second internal space formed by accommodating the internal accommodating tank in a sealed state and a lower part in the second internal space A thin disk body rinsing device comprising: an external storage tank having a second discharge port that can be opened and closed;
(3) The thin disk body is moved from the outside toward the rotation support means in the thin disk body cleaning device, the thin disk body is loaded in a state perpendicular to the rotation support means, and the thin disk body is supported by the rotation support means. It is characterized by further comprising a second thin disk body moving means for taking out the existing thin disk body and accommodating it in the thin disk body accommodating means in the thin disk body rinsing device.

The first and second thin disk body moving means include a disk body gripping means for gripping the thin disk body, an elevating means for moving the disk body gripping means up and down, and a thin disk body cleaning means for cleaning the disk body gripping means. Moving means for moving from the device to the thin disk rinse device.

(Detailed Description) A wafer cleaning rinsing apparatus incorporating a wafer cleaning apparatus which is an example of the thin disk body cleaning apparatus of the present invention and a wafer rinsing apparatus which is an example of the thin disk body rinsing apparatus of the present invention. explain.

As shown in FIG. 1, the wafer cleaning and rinsing apparatus 1 has a wafer cleaning apparatus 2, a wafer rinsing apparatus 3, and a wafer moving apparatus 4. The wafer moving device 4 corresponds to the thin disk moving device in this invention.

As shown in FIG. 1, the wafer cleaning device 2 and the wafer rinsing device 3 are provided adjacent to each other, and the wafer moving device 4 moves the wafer 5 above the wafer cleaning device 2 and the wafer rinsing device 3. It is provided so that it can.

As shown in FIGS. 1 and 2, the wafer cleaning apparatus 2 includes an outer case 6, a cleaning tank 7, five rollers 8, four rotating brushes 9, and three cleaning liquids. Six cleaning liquid supply pipes 11 having nozzles 10 are provided.

The outer case 6 has a substantially rectangular parallelepiped shape, and the cleaning tank 7 is disposed inside the outer case 6. The cleaning tank 7 is provided with an opening 12 at the top which has a width such that a holding arm of a wafer moving device 4 described later can be inserted while holding the wafer. The cleaning tank 7 is provided at its lower portion with a waste liquid opening 13 which is an opening for letting the waste liquid flow down, and on its peripheral side surface is provided with a vapor discharge opening 14 which is an opening for letting out steam. To be A duct 15 is provided outside the cleaning tank 7 and inside the outer case 6.
By forcibly exhausting the gas in the outer case 6, the gas in the cleaning tank 7, for example, the solvent vapor can be discharged to the outside. Since the gas in the cleaning tank 7 is exhausted through the duct 15 all the time, the pressure inside the cleaning tank 7 is slightly reduced, and the vapor of the cleaning liquid may leak from the opening 12 of the cleaning tank 7 to the outside of the cleaning tank 7. To be prevented.

Waste liquid opening 1 provided at the bottom of the washing tank 7
An opening / closing plate 16 that opens and closes the opening is attached to 3 so as to be vertically movable. The opening / closing plate 16 opens the waste liquid opening 13 to discharge the waste liquid from the waste liquid opening 13 to the bottom of the outer case 6.

The above-mentioned five rollers 8 are rotatably attached to the concave curved side of the base 17 which is provided at the bottom portion of the cleaning tank 7 and whose upper surface is formed into an arc-shaped concave curved side. It becomes. Furthermore, the upper part of the base 17 is formed into a concave curved side 18 forming an arc, and the concave curved side 1
Five rollers 8 are rotatably attached to the roller 8. One of the five rollers 8 is rotatably attached to the lowest position of the concave curved side 18, and two rollers 8 are provided on the left and right with the roller 8 attached to the lowest position as the center. Mounted rotatably. It should be noted that the distance between the first two rollers 8 in the rotation direction of the wafer 5 is set smaller than the distance between the last two rollers 8. In this way, the distance between the rollers 8 is not made uniform, and the distance between the first half rollers 8 is made smaller than the distance between the latter half rollers 8. Thus, the wafer 5 can be smoothly rotated.

The five rollers 8 have a narrow gap on the outer peripheral surface such that the edge portion of the wafer 5 is fitted therein.
It is formed so as to go around the outer circumference of the. And this 5
The edge portion of the wafer 5 is inserted into the gap between the individual rollers 8 and the wafer 5 is vertically erected by these five rollers 8 so that the wafer 5 is vertically arranged. The rollers 8 are rotatably supported as they are.

Inside the cleaning tank 7, four rotary brushes 9 are arranged above the five rollers 8.

Two of the four rotating brushes 9 form a set, and the two rotating brushes 9 forming one set have two rotation axes that are parallel to each other and horizontal to each other. The brushes 9 are arranged so as to face each other so as to have a gap into which the wafer 5 can be inserted. The two rotating brushes 9 are arranged at positions slightly below the horizontal diameter line of the wafer 5 when the wafer 5 is arranged vertically on the five rollers 8. On the other hand, the other two rotating brushes 9 forming another set have their rotation axes parallel to each other and horizontal, like the above-mentioned two rotating brushes 9, and the wafer 5 can be inserted between the three rotating brushes 9. Are arranged above the two rotating brushes 9 so as to face each other with a large gap.

When one disk surface of the wafer 5 vertically arranged so as to be rotatable by the five rollers 8 is viewed, one rotating brush 9 is provided above the horizontal diameter line of the wafer 5.
A rotary brush 9 is arranged below the horizontal diameter line of the wafer 5.

When a vertically arranged wafer 5 is rotatably supported by five rollers 8, a pair of rotating brushes 9 facing each other are arranged so as to sandwich the wafer 5. Moreover, the pair of rotating brushes 9 are arranged in two stages, upper and lower.

As shown in FIG. 2, each rotating brush 9
Is formed by having a rotary shaft 19 and a large number of brush fibers 21 planted on the outer peripheral surface of a cylindrical drum 20 on which the rotary shaft 19 is mounted so as to have an overall cylindrical shape. .
The rotating shaft 19 is driven by a motor 22 which is a driving means.

The pair of rotary brushes 9 arranged with the wafer 5 sandwiched therebetween can be horizontally moved so as to be separated from the wafer 5 or approach the wafer 5 by a rotary brush horizontal moving mechanism 22 shown in FIG. 3, for example. Has become.

Rotating brush horizontal moving mechanism 2 shown in FIG.
Reference numeral 2 denotes a motor 23, a rotating plate 24 connected to a rotation shaft of the motor 23, a connecting arm 25 rotatably connected to the periphery of the rotating plate 24, and a tip portion of the connecting arm 25. A base 26 (see FIG. 2) that is movably coupled and has a support hole that rotatably inserts the rotary shaft of the rotary brush 9.
Reference) and a slide 28 provided on the base 26 and guided by a guide 27 arranged in the horizontal direction. When the rotary plate 24 is rotated by the rotation of the rotary shaft that is driven by the motor 23, the connecting arm 25 pulls the base 26 in the radial direction, and the pulled base 26 is restricted by the slide 28. The rotary shaft 19 of the rotary brush 9 moves in the horizontal direction. Such a rotating brush horizontal moving mechanism 22 is provided in each rotating brush 9.

The six cleaning liquid supply pipes 11 are arranged parallel to each other above the four rotary brushes 9 and the wafer 5 sandwiched therebetween, and also parallel to the rotary shaft 19 of the rotary brush 9. . Each of the cleaning liquid supply pipes 11 is provided with three cleaning liquid supply nozzles 10 so that the cleaning liquid is sprayed toward the wafer 5 and the rotating brush 9. The cleaning liquid supply pipe 11 is connected to a cleaning liquid storage tank (not shown) via a pipe or the like, and the cleaning liquid is pressure-fed to the cleaning liquid supply pipe 11 by a pump or the like provided on the way.

As shown in FIG. 1 and FIG. 6, the wafer rinsing apparatus 3 has an opening 27 having a width such that the holding arm of the wafer moving apparatus 4 can be inserted while holding the wafer. It has a housing 29 on the plate 28.

A waste liquid discharge port 30 is provided at the bottom of the casing 29, and the waste liquid can flow out from the waste liquid discharge port 30 to a waste liquid tank (not shown) through a pipe. Further, a duct 31 is provided in the upper part of the housing 29 so that the air and steam in the housing 29 are discharged to the outside.

As shown in FIG. 6, a pair of upper slanting plates 31 and an upper slanting plate thereof facing the opening 27 formed in the upper plate 28 of the housing 29 and spreading in an inverted eight-shaped cross section. A pair of vertical face plates 32 vertically descending from the lower sides of the plates 31 and facing each other, and a pair of lower oblique plates 33 and lower oblique plates 33 that spread in an eight shape at the lower ends of the vertical plate 32. A wafer accommodating container 35 having a pair of lower descending plates 34 vertically descending from the lower side and facing each other, and an upper end connected to the upper oblique plate 31 in the wafer accommodating container 35 and a lower end accommodating the wafer. An external storage tank 37 having a pair of external oblique plates 36 connected to the lower oblique plate 33 in the container 35.

The wafer 5 which is a thin disk body is formed by the wafer accommodating container 35 formed by the pair of upper oblique plates 31, the pair of vertical plane plates 32, the lower oblique plate 33, and the lower descending plate 34. A first internal space 38 that can be accommodated is formed. Further, the inner wall of the outer storage tank 37 and the outer wall of the wafer storage container 35 form a second inner space 39.

In the wafer container 35, as shown in FIG. 1, the wafer is inclined in an inverted eight shape above the upper oblique plate 31 and below the upper plate 28 of the housing 29. A pair of second upper oblique plates 40 are provided, and two rinse liquid supply pipes 41 are parallel to each other above the second upper oblique plates 40 and below the upper plate 28 of the housing 29. And horizontally. A rinse liquid cleaning liquid supply nozzle (also called a rinse liquid supply port) is provided in the rinse liquid supply pipe 41 so that the rinse liquid can be sprayed toward the wafer 5 disposed between the pair of vertical surface plates 32. .) Are provided in plurality.

In this wafer container 35, two rinse liquid supply ports 42 for supplying the rinse liquid into the first internal space 38 are provided in the internal space defined by the lower oblique plate 33. Opened. This rinse liquid supply port 42
Is connected to a rinse liquid storage tank (not shown) through a pipe, and the rinse liquid is pressure-fed from the rinse liquid storage tank toward the rinse liquid supply port 42 via a pump or the like.

In this wafer container 35, a first discharge port 43 having the lower ends of the pair of lower descending plates 34 is formed. The first discharge port 43 is formed so as to be openable / closable by a lid member 45 formed by a solenoid 44 so as to be vertically movable.

In the wafer container 35, a large number of through holes for passing the rinse liquid, that is, a rinse liquid sprinkling port 46 are formed in a grid pattern on each of the pair of vertical surface plates 32.

In the wafer container 35, a support member 47 for vertically supporting the wafer 5 is interposed between the pair of vertical surface plates 32.

In the external storage tank 37, a second discharge port (not shown) opening to the second internal space 39 is opened in the lower portion of the external oblique plate 36, and the second discharge port is provided. An opening / closing valve (not shown) is provided at the outlet, and when the opening / closing valve is in an open state, the fluid flows out from the second outlet into the housing 29.

Further, in the external storage tank 37, a second rinse liquid supply port 48 opening to the second internal space 39 is opened above the external oblique plate 36, and the second rinse liquid is supplied to the external rinse tank 36. An opening / closing valve (not shown) is provided at the liquid supply port 48, and when the opening / closing valve is opened, the rinse liquid is supplied from the second rinse liquid supply port 48 to the second internal space 39.
It is supplied to.

In the wafer rinsing apparatus 3 according to this specific example, the wafer accommodating container 35 corresponds to a thin disc body accommodating means for accommodating a vertically arranged thin disc body wafer, and the pair of vertical face plates. A large number of rinse solution spray ports 32 provided in a checkerboard pattern correspond to rinse solution spraying means for spraying the rinse solution over both sides of the thin disk body, and the rinse solution supply port 42 is a thin disk body. Corresponding to the rinse liquid supply port 42 for supplying the rinse liquid into the containing means,
The second discharge port having the opening / closing valve corresponds to an openable / closable rinse liquid discharge port for discharging the rinse liquid filled in the thin disk body housing means to the outside of the thin disk body housing chamber. Further, in the wafer rinse apparatus 3 according to this specific example, the rinse liquid supply port 42 for supplying the rinse liquid into the first internal space 38 corresponds to the rinse liquid supply port 42 in the rinse liquid supply / discharge means. The second discharge port corresponds to the rinse liquid discharge port.

From a different point of view, in the wafer rinsing apparatus 3 according to this specific example, the wafer container 3
The internal space of 5 corresponds to a first internal space formed so as to accommodate a vertically arranged thin disk body, and the rinse liquid supply port 42 of the wafer storage container 35 is located inside the first internal space. Corresponding to a first rinse liquid supply port capable of supplying a rinse liquid, a large number of grid-like through holes provided in each of the pair of vertical surface plates 32 in the wafer storage container 35, that is, a rinse liquid spray port, A first discharge port 43, which corresponds to a plurality of rinse liquid spray ports capable of uniformly spraying the rinse liquid on both surfaces of the thin disk body and has the lower end portions of the pair of lower lowering plates 34 in the wafer storage container 35,
It corresponds to the first discharge port formed so as to be openable and closable. Therefore, this wafer container 35 corresponds to the internal container in the thin disk body rinser. In this wafer rinsing device 3, the wafer container 35 and the external container 3
The internal space formed by 7 and 7 corresponds to a second internal space formed by accommodating the internal storage tank in the thin disk body rinsing device in a sealed state and storing the internal storage tank. . In this wafer rinse device 3, the first rinse liquid supply port 42 corresponds to the second rinse liquid supply port provided in the upper part of the second internal space of the thin disk body rinse device, and this wafer rinse device The second discharge port that opens to the second internal space 39 of the rinse device 3 corresponds to the openable and closable second discharge port that is provided in the lower portion of the second internal space of the thin disk rinse device.

The wafer transfer device 4 is shown in FIGS. The wafer moving device 4 includes a wafer holding device 49 which is a disc holding device, an elevating device 50 which moves the wafer holding device 49 up and down, and the wafer holding device 49 from the wafer cleaning device 2 to the wafer rinsing device 3.
The moving means 51 for moving to.

The wafer gripping means 49 corresponds to the disc-shaped gripping means in the present invention, and in this embodiment, the first gripping arm 52 extending downward and the upper end of the first gripping arm 52 are arranged. A first horizontal support 53 that is coupled and extends horizontally; a second gripping arm 54 that extends downward so as to face the first gripping arm 52;
A second horizontal support 55, which is joined to the upper end portion of the second gripping arm 54 and extends horizontally along the first horizontal support 53, the first gripping arm 52 and the second gripping arm 54. And a drive box 56 that allows the first horizontal support body 53 and the second horizontal support body 55 to move back and forth horizontally so as to move away from each other and approach each other. A motor is built in this drive box 56, and when the first horizontal support body 53 moves forward by the drive of this motor,
When the second horizontal support body 55 moves backward by the forward movement distance of the first horizontal support body 53, and when the first horizontal support body 53 moves backward, the backward movement distance of the first horizontal support body 53 increases. So that the second horizontal support 55 moves forward,
A drive transmission mechanism for converting the rotational movement of the motor into the parallel movement movement of the first horizontal support body 53 and the second horizontal support body 55 is incorporated.

The elevating means 50 is the drive box 5
A vertical support 57 which is coupled to the lower surface of the vertical guide 6, extends vertically downward, and has a moving element 56 at its lower end, and a vertical rail 5 which guides the moving element 56 to move vertically.
8 and a vertical drive means (not shown) for driving the vertical support 57 so as to be vertically movable.

The moving means 51 includes the vertical rail 58.
A vertical support column 59 for holding the upper and lower guides 60a and 60b mounted above and below the vertical support column 59, and the upper guide 60a and the lower guide 60.
It has a pair of upper and lower horizontal rails 61 for guiding and moving b in the horizontal direction, and a horizontal driving means (not shown) for horizontally moving the vertical support columns 59.

Next, the operation of the above configuration will be described.

As an initial state, as shown in FIG. 4, it is assumed that the first gripping arm 52 and the second gripping arm 54 grip the edge of the wafer 5 above the wafer cleaning apparatus 2.

In the wafer cleaning and rinsing apparatus 1 of this embodiment, basically, the wafer 5 waiting above the wafer cleaning apparatus 2 is loaded into the wafer cleaning apparatus 2 by the wafer moving apparatus 4, and the loaded wafer 5 is loaded. The wafer is cleaned by the wafer cleaning device 2, and after cleaning, the wafer moving device 2 transfers the wafer 5 from the wafer cleaning device 2 to the wafer rinsing device 3, and the wafer rinsing device 3 rinses the wafer 5 through a series of steps. The wafer is cleaned and rinsed. This process will be described in more detail below.

The operation of placing the wafer 5 on the roller 8 is started. First, the elevating means 50 is driven. That is,
The mover 5 is driven by driving a vertical drive means (not shown).
By lowering 6 along the vertical rail 58, the drive box 56 supported by the vertical support column 59 is lowered. By lowering the drive box 56, the first gripping arm 5
The wafer 5 held by the second and second holding arms 54 is also lowered. When the lower edge of the descending wafer 5 comes into contact with the five rollers 8, the vertical drive means is stopped to stop the descent of the drive box 56.
Next, by driving the motor in the drive box 56, the first horizontal support body 53 and the second horizontal support body 55 are driven so as to separate the first gripping arm 52 and the second gripping arm 54 from each other. From first
The gripping arm 52 and the second gripping arm 54 are separated.

Next, the operation for cleaning the wafer 5 is performed with the wafer 5 being stably erected on the roller 8. At the same time that the first gripping arm 52 and the second gripping arm 54 are separated from the wafer 5, the rotating brush horizontal moving mechanism 22 is driven to move the rotating brushes 9 in the horizontal direction so as to approach each other. The wafer 5 is clamped with. The wafer 5 is sandwiched by the rotating brush 9, and the wafer 5 is placed on the five rollers 8.
The wafer 5 is stably erected with the disk surface in the vertical direction by placing the.

By driving the vertical drive means again, the vertical support column 59 is raised to return the first gripping arm 52 and the second gripping arm 54 to the original position above the wafer cleaning apparatus 2.

The four rotating brushes 9 are rotated, and at the same time,
The cleaning liquid is sprayed from the cleaning liquid supply nozzles 10 of the six cleaning liquid supply pipes 11. At this time, the pair of rotary brushes 9 arranged in parallel to each other in the horizontal direction among the four rotary brushes 9 rotate in opposite directions. By the rotation of the rotating brush 9, a force for rotating the wafer 5 in one direction is applied to the wafer 5. At the same time, the rotating brush 9 rubs the surface of the wafer 5. Since the wafer 5 is placed on the five rollers 8, the wafer 5 rotates on the five rollers 8. The cleaning liquid is poured from the cleaning liquid supply nozzle 10 onto the rotating wafer 5. The rubbing of the rotating brush 9 with respect to the wafer 5 and the spraying of the cleaning liquid cause the wafer 5
Surface is cleaned.

The rotation direction of each of the four rotary brushes 9 is the same as the rotation speed of one of the rotary brushes 9 of the pair of rotary brushes 9 arranged in parallel with each other in the horizontal direction. The rotation speed of the rotating brush 9 may be higher than that of the rotating brush 9. In short, each of the rotating brushes 9 is rotated so that the rotating force of the four rotating brushes 9 is applied to the wafer 5 and the surface of the wafer 5 is rubbed by the rotating brushes 9. It is preferable to appropriately determine the direction, rotation speed, and the like.

The cleaning liquid sprayed on the wafer 5 is discharged from the cleaning liquid tank 7 through the waste liquid opening 13 in the cleaning liquid tank 7.

After the rotation of the rotary brush 9 and the spray of the cleaning liquid from the cleaning liquid supply nozzle 10 are continued for a predetermined time, the rotation of the rotary brush 9 and the spray of the cleaning liquid are stopped.

Next, the operation for retrieving the wafer 5 is started.
That is, by driving the vertical driving means, the first
The gripping arm 52 and the second gripping arm 54 are lowered. When the first gripping arm 52 and the second gripping arm 54 descend to the position where the wafer 5 can be gripped, the driving by the vertical driving means is stopped, and the driving box 5 is stopped.
The motor in 6 is driven to drive the first horizontal support 53 and the second horizontal support 53.
The horizontal support body 55 is moved horizontally, which drives the first gripping arm 52 and the second gripping arm 54 so as to approach each other. By bringing the first gripping arm 52 and the second gripping arm 54 close to each other, the outer peripheral edge of the wafer 5 is gripped by the lower end portions of the first gripping arm 52 and the second gripping arm 54, respectively. First gripping arm 52 and second
When the grip arm 54 grips the wafer 5, the driving of the motor in the drive box 56 is stopped. Next, the vertical driving means is driven to raise the first gripping arm 52 and the second gripping arm 54. First gripping arm 5
When the second and second gripping arms 54 reach a predetermined position above the wafer cleaning device 2, the driving of the vertical driving means is stopped.

Next, the operation of transferring the wafer 5 from above the wafer cleaning device 2 to above the wafer rinsing device 3 is performed. The vertical support column 59 is horizontally moved along a pair of upper and lower horizontal rails 61 by driving a horizontal driving means (not shown), and the wafer 5 held by the first holding arm 52 and the second holding arm 54 is a wafer rinsing device. When it is located above 3, the driving of the horizontal drive means is stopped.

Next, the wafer 5 is loaded into the wafer rinsing device 3. That is, the wafer 5 placed above the wafer rinsing device 3 is housed in the wafer housing container 35 by the same operation as when the wafer 5 is placed on the five rollers 8 in the wafer cleaning device 2. , Support member 4
At 7, the wafer 5 is arranged so that the disk surface of the wafer 5 is vertical.

Next, the wafer 5 is rinsed as follows.

That is, the rinse liquid is supplied from the second rinse liquid supply port 48 into the second internal space 39. As the rinse liquid is filled in the second internal space 39, when the rinse liquid is filled again, the rinse liquid is sprayed onto the disk surface of the wafer 5 through the rinse liquid spray port 46. This rinse liquid spout 4
A large number of 6 are provided on the vertical face plate 32, and moreover, the vertical face plate 3
2 is formed in a grid pattern in a region corresponding to the disk surface of the wafer 5 facing 2. Therefore, the rinse liquid is sprayed from the rinse liquid spray port 46 as if it was sprayed from rain and dew, and the rinse liquid is evenly sprinkled on both disk surfaces of the wafer 5. The rinse liquid sprinkled on the wafer 5 is the first
Is discharged from the discharge port 43.

After the spray of the rinse liquid from the rinse liquid spray port 46 is continued for a predetermined time, the supply of the rinse liquid from the second rinse liquid supply port 48 is stopped. Then, the first discharge port 43 is closed by the lid member 45. Rinse liquid supply port 4
The rinse liquid is supplied into the first inner space 38 from the second position. The liquid level of the rinse liquid rises in the first internal space 38 due to the supply of the rinse liquid. The rinse liquid filled in the first space is discharged into the second internal space 39 through the rinse liquid spray port 46, and the rinse liquid discharged in the second internal space 39 is discharged through a discharge port (not shown). To be done. When the first internal space 38 is filled with the rinse liquid, the supply of the rinse liquid from the rinse liquid supply port is stopped, and the solenoid 44 is driven to move the lid member 45 downward. The discharge port 43 is opened. The rinse liquid filling the first internal space 38 is discharged from the first discharge port 43 at once. Due to the rapid discharge of the rinse liquid, the wafer 5
Surface is washed away.

When the rinse liquid in the first internal space 38 is completely discharged, the rinse liquid is supplied again from the second rinse liquid supply port 48 into the second internal space 39. As described above, the rinse liquid is sprayed from the rinse liquid spray port 46 onto the surface of the wafer 5. After spraying the rinse liquid from the rinse liquid spray port 46 for a predetermined time as described above, the first discharge port 43 is closed again by the lid member 45, and the rinse liquid is supplied from the rinse liquid supply port 42 to the first rinse liquid. After supplying the rinse liquid to the inner space 38 and filling the first inner space 38 with the rinse liquid, the lid member 4
5 is removed to open the first discharge port 43, whereby the rinse liquid in the first internal space 38 is discharged all at once.

In this way, the rinse liquid is sprayed from the rinse liquid spray port 46 toward the surface of the wafer 5, and
By repeating the two operations of filling the rinsing liquid into the internal space 38 of the rinsing liquid and then discharging the rinsing liquid all at once, and finally, the rinsing liquid is fed from the rinsing liquid supply officer 41. By spraying, the wafer 5 is rinsed.

When the rinsing is completed, the wafer moving device 4 is driven to take out the wafer 5 arranged in the first internal space 38. The operation of taking out the wafer 5 can be easily understood from the operation of taking out the wafer loaded in the wafer cleaning apparatus 2.

[0094]

According to the present invention, it is possible to provide a thin disk body cleaning device having a simple structure, which is capable of cleaning both surfaces of the thin disk body at once.

According to the present invention, the thin disc body can be cleaned without the fibers and solids of the brush remaining on the surface of the thin disc body washed with the brush. A body washing device can be provided.

According to the present invention, it is possible to provide a thin disk body cleaning and rinsing apparatus capable of cleaning both surfaces of the thin disk body at once without causing secondary contamination due to cleaning.

[Brief description of drawings]

FIG. 1 is a schematic explanatory view showing a wafer cleaning rinsing apparatus which is an embodiment of the present invention.

FIG. 2 is a schematic explanatory view showing a wafer cleaning apparatus in a wafer cleaning rinsing apparatus which is an embodiment of the present invention.

FIG. 3 is a schematic explanatory view showing a rotary brush horizontal moving mechanism in a wafer cleaning apparatus according to an embodiment of the present invention.

FIG. 4 is a schematic explanatory view showing a wafer moving device in a wafer cleaning device according to an embodiment of the present invention.

FIG. 5 is a schematic explanatory view showing a wafer moving device which is one embodiment of the present invention.

FIG. 6 is a schematic explanatory view showing a wafer cleaning device and a wafer rinsing device according to an embodiment of the present invention.

[Explanation of symbols]

1 ... Wafer cleaning rinsing device, 2 ... Wafer cleaning device, 3 ... Wafer rinsing device, 4 ... Wafer moving device, 5 ... Wafer, 6 ... External case,
7 ... Cleaning tank, 8 ... Roller, 9 ... Rotating brush, 10 ... Cleaning liquid supply nozzle, 11 ... Cleaning liquid supply pipe, 12 ... Opening part, 13 ... Waste liquid opening part , 14
... Vapor discharge openings, 15 ... ducts, 16 ...
Open / close plate, 17 ... Base, 18 ... Concave curved side, 19
... rotary shaft, 20 ... drum, 21 ... brush fiber, 22 ... rotary brush horizontal moving mechanism, 23 ... motor, 24 ... rotary plate, 25 ... connecting arm, 26
... Base, 27 ... Guide, 27A ... Opening, 28 ... Slide, 28A ... Top plate, 29 ...
..Housing, 30 ... Waste liquid discharge port, 31 ... Duct,
31A ... upper oblique plate, 32 ... vertical surface plate, 33 ...
..Lower inclined plate, 34 ... Lower descending plate, 35 ... Wafer container, 36 ... External inclined plate, 37 ... External container, 38 ... First internal space, 39 ... Second
Inner space, 40 ... second upper oblique plate, 41 ... rinse solution supply pipe, 42 ... rinse solution supply port, 43 ...
1st discharge port, 44 ... Solenoid, 45 ... Lid member, 46 ... Rinse liquid spray port, 47 ... Support member,
48 ... Second rinse liquid supply port, 49 ... Wafer holding means, 50 ... Lifting means, 51 ... Moving means,
52 ... First gripping arm, 53 ... First horizontal support, 54 ... Second gripping arm, 55 ... Second horizontal support, 56 ... Drive box, 57 ... Vertical Supports, 58 ... Vertical rails, 59 ... Vertical support columns, 60
a ... upper guide, 60b ... lower guide, 61 ...
..Horizontal rails

Claims (5)

[Claims] 1. A rotary brush comprising: a rotation supporting means for rotatably supporting a vertically arranged thin disc body in a horizontal plane thereof; and at least a pair of rotating brushes arranged so as to sandwich the thin disc body. 2. A thin disk body cleaning device comprising: a thin disk body rubbing means for rubbing the surface of the thin disk body; and a cleaning liquid supply means for spraying a cleaning liquid on the thin disk body. 2. A thin disk body accommodating means for accommodating a vertically arranged thin disk body, a rinse liquid spraying means for spraying a rinse liquid over both surfaces of the thin disk body, and the thin disk body accommodating means. And a rinse liquid supply port provided at the bottom of the thin disc body housing means for supplying the rinse liquid into the thin disc body housing means, and the rinse liquid filled in the thin disc body housing means from the rinse liquid supply port to the outside of the thin disc body housing chamber. A thin disk body rinsing device comprising: a rinse liquid supply / discharge means having an openable / closable rinse liquid discharge port. 3. A plurality of rinse liquid sprinkling ports, each of which has a first internal space formed so as to accommodate a vertically arranged thin disc body, and which can uniformly sprinkle the rinse liquid on both surfaces of the thin disc body. And an internal storage tank having a first rinse liquid supply port capable of supplying the rinse liquid into the first internal space and a first discharge port formed to be openable and closable at the lower end,
A second rinse liquid supply port provided in an upper part of a second internal space formed by accommodating the internal accommodating tank in a sealed state and accommodating the internal accommodating tank, and the second interior. A thin disk body rinsing device, comprising: an external storage tank having a second discharge port that is provided at a lower part of the space and can be opened and closed. 4. The thin disk body cleaning device according to claim 1, and the thin disk body rinse device according to claim 2.
The thin disc body is moved from the outside toward the rotation support means in the thin disc body cleaning apparatus according to claim 1, and the thin disc body is loaded in a state perpendicular to the rotation support means,
The first thin disk body moving means for taking out the thin disk body supported in a state perpendicular to the rotation supporting means and storing the thin disk body in the first internal space of the thin disk body rinse device according to claim 2. A thin disk cleaning and rinsing device having. 5. The thin disk body cleaning device according to claim 1, and the thin disk body rinse device according to claim 3.
The thin disc body is moved from the outside toward the rotation support means in the thin disc body cleaning apparatus according to claim 1, and the thin disc body is loaded in a state perpendicular to the rotation support means,
The second thin disk body moving means for taking out the thin disk body supported by the rotation supporting means and storing the thin disk body in the thin disk body housing means in the thin disk body rinse device according to claim 3. A thin disk cleaning rinse device.