JPH09260879A - Case for heat releasing body - Google Patents

Abstract

PROBLEM TO BE SOLVED: To enable a heat releasing body inside a heat insulating vessel to be efficiently cooled down by a method wherein a cooler is provided inside a circulating flow path so as to cool down the air in the circulation flow path, and a fan which circulates the air in the circulation flow path is also provided. SOLUTION: A heat insulating vessel 15 is separated into a circulation flow path 18 and a heat releasing body housing room 19 with a partition 16 of heat insulating material wall and a sub-partition 17 which serves as a guide wall for making all circulation routes equal in length. A fan 20 which circulates the air inside the circulation flow path 18 is provided to the upper part of the circulation flow path 18, the flow of the air is made to descend along the inner wall of the vessel 15 and flow into cooling holes 23 to cool down heat releasing bodies 22, and the flow 24 of the warm air heated by thermal energy released from the heat releasing bodies 22 is cooled down by a cooler 28 provided to the side of a case 11. By this setup, the heat releasing bodies 22 inside the heat insulating vessel 15 can be efficiently cooled down.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a heating element housing for accommodating a heating element such as an electronic device, and particularly to an electronic device such as a power source or a control device which is used together with a telescope for observing those emitting infrared rays. The present invention relates to a housing for a heating element that houses a heating element and does not have an influence of heat on the outside.

[0002]

2. Description of the Related Art FIG.
9 shows a sealed electronic device housing described in JP-A-9-152793. The housing 1 includes a device housing chamber 4 for housing a heating element 3 such as an electronic device and a ventilation path 5 which are formed by providing a partition wall 2 inside. Furthermore, this housing 1
Communication ports 6 and 7 are provided on the upper and lower parts of the partition wall 2,
7, fans 8 and 9 are provided, and a heat exchanger 10 such as a heat pipe is provided above the ventilation path 5. In the case 1 having such a structure, by rotating the fans 8 and 9, it is possible to obtain an air flow as indicated by an arrow in the figure. The air cooled by the heat exchanger 10 moves to the device accommodating chamber 4 through the communication port 7 in the lower part of the ventilation path 5 to move to the heating element 3
The air heated by the heating element 3 moves from the device accommodating chamber 4 to the ventilation passage 5 through the communication port 6 and is cooled by the heat exchanger 10 such as a heat pipe located above the ventilation passage 5. , Always cools the heating element 3 of electronic devices,
It can be protected from harmful effects such as fever.

[0003]

However, in the sealed electronic equipment housing described in Japanese Utility Model Laid-Open No. 59-152793, the air cooled by the heat exchanger 10 is compared with the width and the depth. Since the heating element 3 having a relatively large height moves from the lower part to the upper part, the lower part of the heating element 3 is sufficiently cooled by the low temperature air, but the middle part of the heating element 3 takes heat from the lower part. Since the air whose temperature has risen cools it, sufficient cooling is not performed, and the upper portion of the heating element 3 comes into contact with the air whose temperature has risen further due to the heat of the intermediate portion, resulting in low cooling efficiency. Therefore, the temperature of the heating element 3 was relatively high along the direction of the flow of the cooling air, and the temperature distribution was poor. This is one of the problems to be solved by the present invention

Further, since the heat inside the housing 1 is directly transferred to the outer wall (particularly the outer wall portion of the heat exchanger 3) and becomes high in temperature, there is a problem that the temperature difference between the outer wall temperature and the outside air temperature becomes large. It was

Further, because of these problems, when the conventional electronic equipment housing is used together with an observation and measurement device for observing an observation object that emits infrared rays, it is originally observed by the infrared rays emitted from the electronic equipment casing. There was a problem that it became unobservable due to the buried infrared rays.

Therefore, an object of the present invention is to provide a heating element housing that solves the above-mentioned problems, and particularly to provide a heating element housing that can be used in a measuring device for observing infrared rays. It is to be.

[0007]

A housing for a heating element according to claim 1 is a heat-insulated container which is hollow and hermetically sealed for housing a heating element such as an electronic device having an outer shape having a long dimension and a short dimension.
It is provided in the heat insulation container to circulate the air in the heat insulation container,
A circulation flow path that has a substantially uniform flow distribution over substantially the entire length of the heating element housed in the heat insulating container and generates a flow of air at a substantially right angle to the heating element to the heating element. A cooling device is provided in the circulation flow passage to cool the air in the circulation flow passage, and a fan is provided in the circulation flow passage to circulate the air in the circulation flow passage.

In the case for the heating element according to claim 2,
The circulation flow path includes a plurality of parallel flow paths in the longitudinal direction of the heating element.

In the case for the heating element according to claim 3,
The circulation flow path has a guide wall for equalizing the path lengths of all circulation paths.

In the heating element casing according to claim 4,
The circulation flow path includes a fan on the upstream side or the downstream side of the heating element.

In the heating element casing according to claim 5,
At least one of the inner wall and the outer wall of the heat insulating container is provided with a heat conductive material.

In the heating element casing according to claim 6,
The cooler is water-cooled.

In the heating element casing according to claim 7,
The wall surface forming the circulation channel is provided with a heat insulating material.

[0014]

BEST MODE FOR CARRYING OUT THE INVENTION

Embodiment 1. FIG. 1 shows a heating element casing 11 of the present invention. The heating element housing 11 includes a partition 16 which is a wall surface made of a heat insulating material and all of a partition 16 which is a wall surface made of a heat insulating material, which is a hollow and closed heat insulating container 15 in which an inner wall 12 and an outer wall 13 are covered with a heat conductive material 14. The circulation passage 18 and the heating element storage chamber 19 are partitioned by a sub partition 17 which is a guide wall for equalizing the path length of the circulation passage. In addition, air is circulated in the upper part of the circulation flow path 18
A fan 20 is provided for circulation inside. Heating element 2
When the fan 20 on the upstream side of 2 rotates, an air flow 21 as shown by a white arrow is generated, the air flow 21 descends along the inner wall 12, and a C for telescope control installed in the heating element storage chamber 19 is installed.
It flows into a plurality of cooling holes 23 provided in the longitudinal direction of the heating element 22 such as PU and a power source, and further in a short dimension direction perpendicular to the longitudinal dimension of the heating element in the drawing (here, For example, width x height x depth is 200 mm x 97 mm x
When 300 mm-thick electronic devices are piled up at a pitch of about 100 mm to form a 1200 mm high heating element, the long dimension is 1200 mm and the short dimension is 300 mm. In addition, if the number of electronic devices is further increased, the long dimension is 18
It may be 00 mm). Then, the air flow 21 flowing into the cooling holes 23 passes through the plurality of parallel flow paths to generate the heating element 22.
Is cooled and heat energy is received to form a warm airflow 24 indicated by a black arrow, which is exhausted from the exhaust hole 25. Therefore, the partition 16 passes the warm airflow 24 through the circulation flow path 1
The communication hole 26 for guiding to 8 and the fan 27 on the downstream side of the heating element 22 provided in the communication hole 26 are provided. It should be noted that such a partition 16 is provided with a plurality of communication holes 26 and a plurality of fans 27 (three in this embodiment) according to the number and size of the heating elements 22, so that There is no temperature difference between the top and bottom. Further, a cooler 28 for cooling the warm airflow 24 flowing along the circulation flow path 18 is provided on a side portion inside the heating element casing 11. The cooler 28 is an aluminum endothermic device having fins on the outside and a water channel 29 for flowing cooling water inside, and via a heat insulating pipe 30 penetrating the heat insulating container 15 of the heating element casing 11. And is connected to a radiator (not shown) provided outside the heating element casing 11. It should be noted that the heat generated from the radiator does not affect the measurement or the like performed by the device using the heat-generating body casing 11 of the present invention.

In the heating element casing 11 having such a structure, the fans 20, 27 and the cooler 28 are caused to function as described above, so that the heating element such as an electronic device in the heating element casing 11 is heated. 22 can be kept cool at all times. Also,
Since the heating element casing 11 includes the heat insulating container 15, heat is not conducted to the outside of the heating element casing 11, and the heat conductive material 14 that covers the inner wall 12 and the outer wall 13 of the heat insulating container 15 is provided.
Thus, it is possible to suppress the occurrence of temperature distribution on the inner and outer wall surfaces of the heating element casing 11. Further, since the heating element casing 11 having the above characteristics does not emit infrared rays due to the heat inside to the outside of the heat insulating container 15, such as an electronic device of a measuring instrument for observing weak infrared rays. Suitable for storing heating elements.

Embodiment 2 FIG. 2 shows a heating element casing 31 according to another embodiment of the present invention. As described above, the heating element housing 31 in which the positions of the fan 20 and the cooler 28 of the heating element housing 11 shown in FIG. 1 are interchanged is similar to the heating element housing 11 of the first embodiment. The effect can be obtained.

[0017]

According to the first aspect of the present invention, there is provided a housing for a heating element in which a hollow and heat-insulated container for housing a heating element such as an electronic device having an outer shape having a long dimension and a short dimension is provided. An air flow is provided that circulates the air in the heat insulation container, has a substantially uniform flow distribution over the entire length of the heating element housed in the heat insulation container, and is substantially perpendicular to the direction of the length. For generating heat to the heating element, a cooler provided in the circulation passage for cooling the air in the circulation passage, and a cooling passage provided in the circulation passage for circulating the air in the circulation passage. Since it is provided with a fan for heating, the heat generating element in the heat insulating container can be efficiently cooled, and the heat inside is not conducted to the outside of the heat insulating container,
That is, since infrared rays are not radiated to the outside of the heat insulating container, it can be used as a heating element housing for accommodating a heating element of an electronic device that observes weak infrared rays.

In the case for the heating element according to claim 2,
Since the circulation flow path includes a plurality of parallel flow paths in the longitudinal direction of the heating element, it is possible to cool the heating element without generating a temperature distribution in the longitudinal direction of the heating element.

In the case for the heating element according to claim 3,
Since the circulation flow path is provided with the guide wall for equalizing the path lengths of all the circulation paths, the entire heating element can be cooled uniformly and efficiently.

In the case for the heating element according to claim 4,
Since the circulation passage is provided with the fan on the upstream side or the downstream side of the heating element, the air flow around the heating element can be rectified and the heating element can be cooled efficiently.

In the heating element casing according to claim 5,
Since at least one of the inner wall and the outer wall of the heat insulating container is provided with the heat conductive material, the occurrence of temperature distribution on the wall surface can be suppressed.

In the case for the heating element according to claim 6,
Since the cooler is a water-cooled type, the heating element can be cooled efficiently.

In the case for the heating element according to claim 7,
Since the wall surface forming the circulation channel is provided with the heat insulating material, the cooling efficiency can be improved.

[Brief description of drawings]

FIG. 1 is an example of a conventional housing, which is actually used as a housing.
It is a figure which shows the sealed electronic device housing | casing of the 793 publication.

FIG. 2 is a side conceptual view showing a heating element casing of the present invention.

FIG. 3 is a side conceptual view showing a heating element casing according to another embodiment of the present invention.

[Explanation of symbols]

11 housing for heating element, 12 inner wall, 13 outer wall, 14
Heat conductive material, 15 heat insulation container, 16 partitions,
17 sub-partitions, 18 circulation passages, 19 heating element storage chamber, 20 fan, 21 air flow, 22 heating element, 23 cooling hole, 24 warm air flow, 25 exhaust hole, 26
Communication hole, 27 fan, 28 cooler, 29 water channel,
30 piping, 31 heating element housing.

Claims (7)

[Claims] 1. A hollow and hermetically sealed heat-insulating container for accommodating a heating element such as an electronic device having an external shape having a long dimension and a short dimension, and circulates air in the heat-insulating vessel provided in the heat-insulating vessel. The heating element contained in the heat insulating container has a substantially uniform flow rate distribution over the entire length of the heating element, and generates an air flow substantially perpendicular to the heating element with respect to the heating element. A circulation flow path that allows the air to flow in the circulation flow path; a cooler that cools the air in the circulation flow path; and a fan that causes the air to circulate in the circulation flow path. Case for heating element. 2. The heating element casing according to claim 1, wherein the circulation flow path includes a plurality of parallel flow paths in a longitudinal direction of the heating element. 3. The circulation passage is provided with a guide wall for equalizing the path lengths of all circulation passages.
The casing for the heating element described. 4. The heating element casing according to claim 1, wherein the circulation flow path includes a fan on the upstream side or the downstream side of the heating element. 5. The heating element casing according to claim 1, wherein at least one of an inner wall and an outer wall of the heat insulating container comprises a heat conductive material. 6. The heating element casing according to claim 1, wherein the cooler is a water cooling type. 7. The housing for a heating element according to claim 1, wherein the wall surface forming the circulation flow path is provided with a heat insulating material.