JPH09255933A - Sheetlike adhesive material and its cured item - Google Patents

Abstract

PROBLEM TO BE SOLVED: To obtain a sheetlike adhesive material which has low moisture absorption properties, an excellent persistence of adhesion at a high temp. and humidity and under the conditions of thermal cycle, a high adhesive stregnth at a high temp. by compounding a specific epoxy resin with two thermoplastic resins. SOLUTION: This adhesive material contains a biphenyl epoxy resin (A) represented by formula I (R1 to R4 are each a 1-4C alkyl group), a thermoplastic resin (B) of which the peak of tan δ is at 50 deg.C or lower in the temp. -tan δcurve obtd. by the dynamic viscoelasticity measurement, and a thermoplastic resin (C) of which the peak of tan δ is at 150 deg.C or higher in the temp. -tan δcurve obtd. as above in a wt. ratio of A/B/C of (10-96)/(2-70)/(2-70) and is formed by sheeting.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a sheet-like adhesive material which is preferably used for fixing processing of electric and electronic parts such as semiconductors, and a cured product thereof.

[0002]

2. Description of the Related Art Conventionally, an adhesive mainly composed of a material such as an epoxy resin or an imide resin has been used for fixing electric and electronic parts such as semiconductors. These materials are widely used because they have a good balance of workability and various characteristics and are relatively inexpensive.

[0003]

However, the trend toward higher performance and higher functionality in the field of semiconductors is remarkable, and even the above-mentioned materials such as epoxy resin and imide resin have more severe characteristics, for example, the hygroscopicity of the material. There is a demand for lowering of the adhesive strength, durability of the adhesive strength under high temperature and high humidity, under heat and cold cycles, and adhesive strength under high temperature.

The present invention has been made in view of the above circumstances, and exhibits low hygroscopicity and excellent adhesive strength durability under high temperature and high humidity and cold / heat cycles in applications such as fixing of electric and electronic parts. It is an object of the present invention to provide a sheet-shaped adhesive material that can be provided with high reliability even at high temperatures and can give high reliability to electric and electronic parts and the like, and a cured product thereof.

[0005]

In order to achieve the above object, the sheet-like adhesive material of the present invention comprises the following (A) to (A).
It is configured to contain the component (C). (A) A biphenyl type epoxy resin represented by the following general formula (1).

Embedded image (B) Temperature-tan δ obtained by dynamic viscoelasticity measurement
A thermoplastic resin in which the temperature at the peak of tan δ in the curve is 50 ° C. or lower. (C) Temperature-tan δ obtained by dynamic viscoelasticity measurement
A thermoplastic resin in which the temperature at the point where tan δ of the curve reaches a peak is 150 ° C. or higher.

Further, the cured product obtained by curing the sheet-like adhesive material containing at least the above-mentioned component (A) in the present invention has the following characteristic (X). (X) Temperature-tan δ obtained by dynamic viscoelasticity measurement
The curve has two points where tan δ has a peak.

The dynamic viscoelasticity measurement for the above-mentioned components (B), (C) and characteristic (X) is carried out by a dynamic viscoelasticity measuring device (DMS) (DMS210, manufactured by Seiko Instruments Inc.). Then, the point at which tan δ of the temperature-tan δ curve obtained by the dynamic viscoelasticity measurement becomes a peak (hereinafter referred to as “tan δ peak point”) is the temperature-tan δ curve obtained by this dynamic viscoelasticity measuring device. ,
The temperature at the point where tan δ of the temperature-tan δ curve obtained by the dynamic viscoelasticity measurement has a peak (hereinafter referred to as “tan δ peak point temperature”) means the point where the value of tan δ becomes the largest. In the temperature-tan δ curve obtained by elasticity measurement, it means the temperature at the point where the value of tan δ becomes the largest.

Also, tan δ means the dynamic tangent loss,
This is calculated by the following formula. In this formula, G
₁ (ω) is the storage elastic modulus, and G ₂ (ω) is the loss elastic modulus.

[0009]

## EQU1 ## tan δ = G ₂ (ω) / G ₁ (ω)

The present inventors have conducted a series of studies in order to obtain a material capable of satisfying the properties required for a sheet-shaped adhesive material used for fixing electric and electronic parts.
As a result, a biphenyl type epoxy resin represented by the above general formula (1) [component (A)], a thermoplastic resin having a tan δ peak point temperature of 50 ° C. or lower [component (B)], and ta
If it contains a thermoplastic resin [(C component) component] having an nδ peak point temperature of 150 ° C. or higher, it can be used for fixing electric and electronic parts under low hygroscopicity, under high temperature and high humidity and under heat and cold cycles. It was found that the excellent adhesive strength durability can be exhibited and the adhesive strength is high even at high temperatures, and the present invention has been achieved.

Further, the sheet-like adhesive material of the present invention has the following general formula (2) in addition to the above [components (A) to (C)].
It has been found that when a specific phenolic resin [component (D)] represented by is included, the adhesive strength and low hygroscopicity will be even more excellent in applications such as fixing of electric and electronic parts.

[0012]

[Chemical 6]

The cured product obtained by curing the sheet-like adhesive material has the following characteristic (X), that is, tan in the temperature-tan δ curve obtained by dynamic viscoelasticity measurement.
By having the characteristic (X) that it has two δ peak points, it exhibits low hygroscopicity, excellent adhesive strength durability under high temperature and high humidity and under heat and cold cycles, and is high even under high temperature. They have found that they have adhesive strength and have reached the present invention.

[0014]

Next, embodiments of the present invention will be described in detail.

The sheet-like adhesive material of the present invention comprises a specific biphenyl type epoxy resin (component A), a thermoplastic resin (component B) having a tan δ peak point temperature of 50 ° C. or lower, and t
and a thermoplastic resin (C component) having an an δ peak point temperature of 150 ° C. or higher.

In addition to being contained in the sheet-like adhesive material of the present invention
The specific biphenyl type epoxy resin (component A) is as follows.
Is represented by the general formula (1). This biphenyl
The type epoxy resin (component A) is a resin having a glycidyl group.
In the phenyl ring, the following R₁~ R _Four1 to 4 carbon atoms represented by
The alkyl group of is added. So this
The sheet-shaped adhesive material of the present invention containing component A is
Provides water repellency and low hygroscopicity for fixing applications such as child parts
Can be demonstrated.

[0017]

Embedded image

Examples of the alkyl group having 1 to 4 carbon atoms represented by R _{1 to} R ₄ in the above general formula (1) include methyl group, ethyl group, propyl group, isopropyl group, butyl group, isobutyl group, sec. Examples thereof include linear or branched lower alkyl groups such as -butyl group and tert-butyl group, particularly preferably methyl group, and R _{1 to} R ₄ may be the same or different. Above all, as the above-mentioned component A,
A biphenyl type epoxy resin represented by the following formula in which R _{1 to} R ₄ are all methyl groups is particularly preferable.

[0019]

Embedded image

The above-mentioned biphenyl type epoxy resin (component A)
Especially, the epoxy equivalent is 177 to 240 g / e.
q, those having a softening point of 80 to 130 ° C. are preferable, and those having an epoxy equivalent of 177 to 220 g / eq and a softening point of 80 to 120 ° C. are particularly preferable.

The blending ratio of the above-mentioned biphenyl type epoxy resin (component A) in all the organic components of the sheet-like adhesive material of the present invention is particularly 10 to 96% by weight (hereinafter abbreviated as "%").
Is preferable, and the range of 20 to 94% is particularly preferable. That is, the above-mentioned biphenyl type epoxy resin (A
This is because if the blending ratio of (Component) is less than 10%, water repellency and low hygroscopicity cannot be exhibited in fixing applications such as electrical and electronic parts. Conversely, if it exceeds 96%, the sheet becomes brittle and the handling becomes difficult. Because it will not be easy.

In the sheet-shaped adhesive material of the present invention, an epoxy resin other than this, for example, a cresol novolac type, a phenol novolac type, a bisphenol A type epoxy resin, etc., is added to the above biphenyl type epoxy resin (A component). They may be used alone or in combination of two or more. When the epoxy resin is used in combination as described above, it is preferable to set the amount of the biphenyl type epoxy resin (A component) to be 20% or more of the whole epoxy resin component. , 50% or more is more preferable.

If desired, an epoxy resin curing agent can be added to the sheet-like adhesive material of the present invention. Examples of such a curing agent include a phenol resin, an acid anhydride, an amine compound, and the like. From the viewpoint of reliability and the like, a phenol resin is particularly preferable, and from the viewpoint of adhesiveness, a novolac type phenol resin is further preferable. preferable.
Among them, the phenol resin (component D) represented by the following general formula (2) is particularly preferable in terms of adhesive strength, hygroscopicity, and the like.

[0024]

Embedded image

In the above general formula (2), m represents 0 or a positive integer. In particular, m is preferably 0-10, and more preferably m is 0-8. .

As the above-mentioned phenol resin (component D),
Particularly, those having a hydroxyl group equivalent of 147 to 250 g / eq and a softening point of 60 to 120 ° C. are preferable, and above all, a hydroxyl group equivalent of 147 to 220 g / eq and a softening point of 60 to 110 ° C.
Are preferred.

The blending ratio of the phenol resin (component D) to the biphenyl type epoxy resin (component A) is such that the amount of the hydroxyl group in the phenol resin (component D) is 1 equivalent of the epoxy group in the biphenyl type epoxy resin (component A). Is preferably 0.7 to 1.3 equivalents, and more preferably 0.9 to 1.1 equivalents.

Such a phenol resin (component D) is
For example, it can be obtained by reacting aralkyl ether and phenol with a Friedel-Crafts catalyst.

In the sheet-like adhesive material of the present invention, a curing accelerator for an epoxy resin can be blended in addition to the above curing agent for an epoxy resin. As such a curing accelerator, various curing accelerators conventionally known as epoxy resin curing accelerators can be used, for example, amine-based, phosphorus-based, boron-based, phosphorus-boron-based and the like. Curing accelerators. Among them, triphenylphosphine,
Diazabicycloundecene and the like are preferable. These may be used alone or in combination of two or more.

The thermoplastic resin (component B) contained in the sheet-shaped adhesive material of the present invention must have a tan δ peak point temperature of 50 ° C. or lower. That is, ta
This is because if the nδ peak point temperature exceeds 50 ° C., excellent adhesion strength durability cannot be exhibited under a cooling / heating cycle or under high temperature / high humidity in applications such as fixing of electric / electronic parts. Above all, as the thermoplastic resin (component B), tan
The δ peak point temperature is preferably in the range of −120 to 30 ° C., and particularly preferably in the range of −100 to 20 ° C. The sheet-like adhesive material of the present invention containing such a component B can exhibit excellent adhesive strength durability under a cold-heat cycle, under high temperature and high humidity, in a fixing application of electric and electronic parts and the like.

Examples of the thermoplastic resin (component B) include acrylonitrile-butadiene type copolymers, hydrogenated acrylonitrile-butadiene type copolymers obtained by hydrogenating a part of this acrylonitrile-butadiene type copolymer, and butadiene. Examples thereof include rubber, isoprene rubber, styrene-butadiene rubber, silicone rubber, fluororubber, acrylic rubber, styrene-butadiene block copolymer, and styrene-isoprene block copolymer. Among them, acrylonitrile-butadiene-based copolymers are preferable in that they have low hygroscopicity and excellent adhesion to metals and plastics, and hydrogenation reduces the double bond portion in the molecule. A hydrogenated acrylonitrile-butadiene-based copolymer is preferable in that the heat resistance can be improved.

The acrylonitrile-butadiene copolymer mentioned above means an acrylonitrile-butadiene copolymer (N
Not only in the case where the content of BR) is 100% but also in the case where at least NBR is contained, which is a broad meaning including the case where other copolymerization component is contained in this NBR. Other copolymerization components include, for example, acrylic acid,
Acrylic acid esters, styrene, methacrylic acid and the like can be mentioned, and among them, methacrylic acid is preferable because of its excellent adhesion to metals and plastics. The above N
The amount of acrylonitrile bonded in BR is particularly preferably 10 to 10.
50% is preferable, and 15-40% is especially preferable.

The blending ratio of the thermoplastic resin (component B) in the total organic components of the sheet-shaped adhesive material of the present invention is particularly preferably in the range of 2 to 70%, and particularly preferably in the range of 3 to 50%. is there. That is, when the blending ratio of the thermoplastic resin (component B) is less than 2%, excellent adhesion strength durability cannot be exhibited under a cold heat cycle, high temperature and high humidity in fixing applications such as electric and electronic parts. On the contrary, if it exceeds 70%, the adhesive strength at high temperature decreases.

It is essential that the tan δ peak point temperature is 150 ° C. or higher as the thermoplastic resin (C component) contained in the sheet-shaped adhesive material of the present invention. That is, t
This is because if the an δ peak point temperature is lower than 150 ° C., excellent adhesive strength at high temperatures cannot be exhibited in fixing applications such as electric and electronic parts. Among them, the thermoplastic resin (C component) has a tan δ peak point temperature of 160
To 350 ° C. is preferable, and 180 to 3 is particularly preferable.
The range of 50 ° C. is more preferable. The sheet-shaped adhesive material of the present invention containing such a C component can exhibit an excellent adhesive force at high temperature in fixing applications such as electric and electronic parts.

Examples of the thermoplastic resin (C component) include polyetherimide, polyether sulfone,
Examples thereof include polyarylate and polyphenylene ether. Among them, polyetherimide is more preferable from the viewpoint of adhesive strength at high temperature, compatibility with epoxy resin, and the like.

The blending ratio of the thermoplastic resin (component C) in the total organic components of the sheet-like adhesive material of the present invention is particularly preferably in the range of 2 to 70%, and particularly preferably in the range of 3 to 50%. is there. That is, when the blending ratio of the thermoplastic resin (component C) is less than 2%, excellent adhesive strength at high temperature cannot be exhibited in fixing applications such as electric and electronic parts, and conversely 70%. If it exceeds, the wettability at the time of adhesion will deteriorate and the adhesion will require a high temperature.

The compounding ratio (weight) of the biphenyl type epoxy resin (A component), the thermoplastic resin (B component), and the thermoplastic resin (C component) among all the organic components of the sheet-like adhesive material of the present invention. The ratio is (A component) / (B component) / (C
Component) = (10-96) / (2-70) / (2-70)
Are preferred, and above all, (A component) / (B component) / (C
Component) = (20 to 94) / (3 to 50) / (3 to 50)
Is preferred. That is, if the compounding ratio (weight ratio) of the biphenyl type epoxy resin (component A) is less than 10%,
This is because water repellency and low hygroscopicity cannot be exhibited in fixing applications such as electric and electronic parts, and conversely, when it exceeds 96%, the sheet becomes brittle and handling becomes difficult. Further, when the blending ratio (weight ratio) of the thermoplastic resin (B component) is less than 2%, excellent adhesive strength durability is exhibited in a fixing application such as electric / electronic parts under a cooling / heating cycle, under high temperature and high humidity. This is because it is not possible, and conversely, when it exceeds 70%, the adhesive strength at high temperature is reduced. The blending ratio (weight ratio) of the thermoplastic resin (C component) is 2%.
If it is less than 70%, excellent adhesive strength at high temperature cannot be exerted in fixing applications such as electric and electronic parts. On the other hand, if it exceeds 70%, wettability at the time of bonding becomes poor and high temperature is required for bonding. Because they will need it.

Further, other materials (organic material, inorganic material) can be added to the sheet-like adhesive material of the present invention as required. Examples of organic materials include silane coupling agents, titanium coupling agents, surface modifiers, antioxidants, and the like, and examples of inorganic materials include various fillers such as alumina, silica, and silicon nitride, silver, copper, aluminum, Examples thereof include metal particles such as nickel and the like, as well as pigments and dyes.

In the sheet-shaped adhesive material of the present invention,
If necessary, a fiber material such as glass, nylon or polyester may be provided.

The sheet-like adhesive material of the present invention can be manufactured, for example, as follows. That is, a predetermined amount of each of the above-mentioned biphenyl type epoxy resin (component A), thermoplastic resin (component B), and thermoplastic resin (component C) is blended, and if necessary, various components, for example, phenol resin ( The composition containing a predetermined amount of a curing accelerator such as D component) is mixed with methylene chloride, chloroform, dioxane,
It is mixed and dissolved in a solvent such as tetrahydrofuran, and this mixed solution is applied onto a base material film such as a polyester film which has been subjected to a release treatment. Next, the coated base film is dried at 50 to 160 ° C. to remove the solvent such as methylene chloride, whereby the intended sheet-shaped adhesive material can be produced on the base film. In addition, as another method, the target sheet-shaped adhesive material can be manufactured by a method of heating and melting and extruding without using a solvent such as methylene chloride.

The cured product obtained by curing the sheet-shaped adhesive material of the present invention can be manufactured, for example, as follows. That is, the sheet-like adhesive material obtained by the above method is treated at 125 to 225 ° C., preferably 1
50 to 200 ° C., 5 to 300 minutes, preferably 10 to
The desired cured product can be produced by heat curing for 180 minutes.

Most of the cured products obtained by curing the thus obtained sheet-shaped adhesive material of the present invention have a special characteristic (X). That is, since it has two tan δ peak points in the temperature-tan δ curve obtained by the dynamic viscoelasticity measurement, it exhibits excellent adhesive strength durability under cooling and heating cycles and has high adhesive strength even at high temperatures.

The peak interval between the two tan δ peak points in the temperature-tan δ curve is not particularly limited, but is preferably within the range of 5-250 ° C, particularly preferably 10-240 ° C. Within the range of. That is, if the peak interval between the two tan δ peak points in the temperature-tan δ curve is outside the range of 5 to 250 ° C, the adhesive strength at high temperature under cooling / heating cycle may become insufficient.

Next, examples will be described together with comparative examples.

First, prior to Examples and Comparative Examples, the following biphenyl type epoxy resin (component A), phenol resin (component D), phenol novolac resin b, and curing accelerator were prepared.

[Biphenyl type epoxy resin (component A)]
A biphenyl type epoxy resin represented by the following formula (epoxy equivalent: 195 g / eq, softening point: 105 ° C.).

[0047]

Embedded image

[Phenol Resin (Component D)] A phenol resin represented by the following formula (hydroxyl equivalent: 175 g / e)
q, softening point: 75 ° C).

[0049]

Embedded image

[Phenol novolac resin b] Hydroxyl equivalent is 106 g / eq and softening point is 65 ° C.

[Curing Accelerator] Triphenylphosphine.

[0052]

Examples 1 to 5 and Comparative Examples 1 to 6 Tables 1 and 2 below.
A composition prepared by mixing the components shown in 1) in the proportions shown in the same table was mixed and dissolved in methylene chloride, and this mixed solution was applied on a release-treated polyester film. Next, the polyester film coated with the mixed solution was dried at 80 ° C. to remove methylene chloride, thereby producing a target sheet-shaped adhesive material having a thickness of 50 μm on the polyester film.

[0053]

[Table 1]

[0054]

[Table 2]

The shear adhesive strength and moisture absorption of the thus obtained example products and comparative product were measured according to the following test methods. The results are shown in Table 3 below.
And shown in Table 4.

[Shear Adhesive Force] First, a sample for shear adhesive force measurement was prepared under the following conditions using the sheet-like adhesive materials of Example products and Comparative Example products. Next, the shear adhesive strength of the produced sample for measuring shear adhesive strength was measured using a universal tensile tester (Autograph, manufactured by Shimadzu Corporation) according to the following conditions.

(Preparation condition of sample for measuring shear adhesive strength) Adherend: Two 42 alloys were used. And two 42
A sample for shear adhesive strength measurement was prepared by adhering the alloy through a sheet-shaped adhesive material (note that T
In the case of room temperature shear adhesive strength measurement after CT, one 42 alloy and one copper were used. ). Bonding area: 5 mm × 5 mm Temporary fixing temperature: 150 ° C., Temporary fixing pressure: 1 kgf / cm ² Main fixing conditions: Hold at 175 ° C. for 60 minutes.

(Conditions for measuring shear adhesive strength) Measurement temperature: Normal temperature was 23 ° C and high temperature was 150 ° C. Tensile speed: It was pulled at a speed of 50 mm / min. Pressure cooker test (PCT test): 121
It was carried out at 100 ° C. and RH for 168 hours. Thermal cycle test (TCT test): -55 ° C (30
Min) to 120 ° C. (30 min) for 500 cycles.

[Hygroscopicity] First, the sheet-like adhesive materials of the example product and the comparative example product were heated and cured at 175 ° C. for 60 minutes to prepare a cured product obtained by curing the sheet-like adhesive material. Then, the obtained cured product is subjected to 85 ° C. and 85% RH.
After being left to stand for 168 hours, the moisture absorption rate was measured by a trace moisture analyzer (Hiranuma moisture analyzer AQ-5, manufactured by Hiranuma Sangyo Co., Ltd.).

[0060]

[Table 3]

[0061]

[Table 4]

From the above Tables 3 and 4, the example products have a balance of evaluation results in each item of initial room temperature shear adhesive strength, room temperature shear adhesive strength after PCT, room temperature shear adhesive strength after TCT and initial high temperature shear adhesive strength. In addition to being good, it was confirmed that the moisture absorption rate was lower than that of the comparative example product. On the other hand, it was confirmed that the comparative example product had variations in evaluation results in each item, and the moisture absorption rate was higher than that of the example product. Therefore, it is confirmed that the product of the example exhibits low hygroscopicity, excellent adhesive strength durability under high temperature and high humidity and under heat and cold cycles, and has high adhesive power even at high temperature, as compared with the comparative example product. Was done.

1 to 4 are cured products obtained by heat curing the sheet-like adhesive materials of Example 1, Example 5, Comparative Example 2 and Comparative Example 3 at 175 ° C. for 60 minutes. It is a figure which shows the temperature-tan delta curve of. From FIGS. 1 to 4, in the temperature-tan δ curve of the cured product obtained by curing the sheet-shaped adhesive materials of Example 1 and Example 5, tan
δ peak point (86 ° C and 129 ° C: see Fig. 1), tanδ
Peak points (35 ° C and 179 ° C: see Fig. 2) are 2 each
On the other hand, the temperature of the cured product obtained by curing the sheet-like adhesive materials of Comparative Example 2 and Comparative Example 3 is −ta.
It was confirmed that only one tan δ peak point (152 ° C .: see FIG. 3) and one tan δ peak point (71 ° C .: see FIG. 4) were observed in the nδ curve.

[0064]

As described above, the sheet-like adhesive material of the present invention comprises the specific biphenyl type epoxy resin (component A),
It contains a thermoplastic resin (component B) having a tan δ peak point temperature of 50 ° C. or lower, and a thermoplastic resin (component C) having a tan δ peak point temperature of 150 ° C. or higher. Therefore, it has low hygroscopicity and is used in fixing applications such as electrical and electronic parts.
It is a very excellent sheet-shaped adhesive material that can exhibit excellent adhesive strength durability under high temperature and high humidity and under cold and thermal cycles, and has high adhesive strength even under high temperature. Therefore, if the sheet-shaped adhesive material is used to fix electrical and electronic components, the reliability of electrical and electronic components can be improved.

Furthermore, when the sheet-like adhesive material of the present invention contains a specific phenolic resin (D component) in addition to the above (A to C components), the adhesive strength in fixing applications such as electric and electronic parts is improved. Also, the hygroscopicity is further improved, which is preferable.

A cured product obtained by curing the sheet-like adhesive material containing at least the above component (A) in the present invention has the following characteristic (X), that is, the temperature-tan δ obtained by dynamic viscoelasticity measurement. If it has the characteristic (X) that it has two tan δ peak points in the curve, it exhibits low hygroscopicity, excellent adhesive strength durability under high temperature and high humidity and under cold and heat cycles, and under high temperature. Also has an excellent effect of having high adhesive strength.

[Brief description of drawings]

FIG. 1 is a diagram showing a temperature-tan δ curve of a cured product obtained by curing the sheet-shaped adhesive material of Example 1.

FIG. 2 is a diagram showing a temperature-tan δ curve of a cured product obtained by curing the sheet-shaped adhesive material of Example 5.

FIG. 3 is a diagram showing a temperature-tan δ curve of a cured product obtained by curing the sheet-shaped adhesive material of Comparative Example 2.

FIG. 4 is a diagram showing a temperature-tan δ curve of a cured product obtained by curing the sheet-shaped adhesive material of Comparative Example 3.

Continuation of front page (51) Int.Cl. ⁶ Identification number Office reference number FI technical display location C09J 7/02 JHJ C09J 7/02 JHJ

Claims (7)

[Claims] 1. A sheet-shaped adhesive material comprising the following components (A) to (C). (A) A biphenyl type epoxy resin represented by the following general formula (1). Embedded image (B) Temperature-tan δ obtained by dynamic viscoelasticity measurement
A thermoplastic resin in which the temperature at the peak of tan δ in the curve is 50 ° C. or lower. (C) Temperature-tan δ obtained by dynamic viscoelasticity measurement
A thermoplastic resin in which the temperature at the point where tan δ of the curve reaches a peak is 150 ° C. or higher. 2. The component (B) is acrylonitrile-
The sheet-shaped adhesive material according to claim 1, which is at least one of a butadiene-based copolymer and a hydrogenated acrylonitrile-butadiene-based copolymer. 3. The sheet-like adhesive material according to claim 1, wherein the component (C) is polyetherimide. 4. A composition comprising the following component (D):
The sheet-shaped adhesive material according to any one of 3 above. (D) A phenol resin represented by the following general formula (2). Embedded image 5. A cured product obtained by curing a sheet-shaped adhesive material containing the following component (A) has the following characteristic (X). (A) A biphenyl type epoxy resin represented by the following general formula (1). Embedded image (X) Temperature-tan δ obtained by dynamic viscoelasticity measurement
The curve has two points where tan δ has a peak. 6. A cured product obtained by curing a sheet-shaped adhesive material containing the following component (A) and a thermoplastic resin has the following characteristic (X). (A) A biphenyl type epoxy resin represented by the following general formula (1). Embedded image (X) Temperature-tan δ obtained by dynamic viscoelasticity measurement
The curve has two points where tan δ has a peak. 7. A cured product obtained by curing the sheet-shaped adhesive material according to any one of claims 1 to 4 having the following characteristic (X). (X) Temperature-tan δ obtained by dynamic viscoelasticity measurement
The curve has two points where tan δ has a peak.