JPH09253566A - Substrate holding member and coating device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To surely hold a single substrate correspondingly to its size by forming a base of the member for holding the substrate with suction so as to have a flat holding surface and also, forming a groove section having prescribed patterns corresponding to the peripheral shape of the substrate to be held, in the flat holding surface. SOLUTION: This member 1 for sucking and holding a single substrate such as large size glass substrate is provided with a groove section 4 formed in a flat holding surface of the base 2 and plural suction holes 5 formed in regions of the flat holding surface, that are surrounded by the groove section 4. The groove section 4 consists of patters 4a to 4c formed correspondingly to the peripheral shape of a substrate to be held with the member 1 and the plural suction holes 5 are formed in a region A surrounded by the pattern 4a and in regions B each of which is located outside the pattern 4b and surrounded by the pattern 4c, respectively. Thus, at the time of holding the substrate through the suction holes 5, since the peripheral part of the substrate is positioned in the groove section 4, the substrate is surely held without allowing its peripheral part to contact with the member 1.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention comprises a substrate holding member, and more particularly, a substrate holding member for surely holding a single-wafer type substrate such as a large glass substrate according to its area, and such a substrate holding member. The present invention relates to a coating device for uniformly and efficiently coating a substrate with a coating liquid.

[0002]

2. Description of the Related Art In general, a spin coating method is often used as a method for applying a coating liquid to a large glass substrate such as an LCD color filter.

[0003] The spin coating method includes an open air type and a closed cup type. However, both methods have a drawback that the coating efficiency is as low as about 10% and the coating thickness at the corner portion of the substrate becomes too thick. With the expected increase in substrate size, the amount of coating liquid used,
Problems have been pointed out with respect to film thickness distribution, throughput, and the like.

As a method for solving the drawbacks of the spin coating method as described above, there are a knife coating method, a roll coating method and a die coating method.

In each of these systems, a coating clearance is provided on a substrate, and the coating film thickness is determined by the set value to obtain the smoothness of the coating surface. It is difficult to obtain a uniform film thickness when the smoothness (degree of unevenness) is lower than the coating accuracy (the degree of unevenness is large).

A dip coating method is generally known as a method of applying a coating liquid which is hardly affected by irregularities on the surface of the substrate. In this method, however, it is essential to cover a non-coated portion and work is required. It becomes complicated.

Therefore, the bead coating method capable of forming a uniform coating film in a stable state on the single-wafer substrate by eliminating the drawbacks of the coating methods as described above and without being affected by the physical properties of the coating liquid. Is proposed (Japanese Patent Application No. 5-146757).

In this coating apparatus, a coating head having a linear slit that opens upward is provided, and a substrate held by a substrate holding member has a tip portion directly above the slit of the coating head via a predetermined clearance. It is located to face. When the application liquid is supplied to the application head, the application liquid is discharged from the slit to form a bead,
It adheres to the lower surface of the tip of the substrate to be coated. From this state, the substrate holding member is slid obliquely upward at a constant speed, and the coating liquid is sequentially adhered to the lower surface of the substrate from the beads to form a layer of the coating liquid. At this time, the coating liquid is continuously supplied to the coating head, and the amount of the coating liquid in the bead is kept constant. When the substrate rises obliquely upward and its rear end reaches the slit of the coating head, the slide of the substrate holding member is stopped, the coating liquid forming the bead is sucked into the coating head, and the bead disappears. You. This separates the coating head from the coating liquid layer on the substrate.

[0009]

FIG. 18 is a diagram for explaining the positional relationship between the coating head and the substrate in such a bead coating method. In FIG. 18, the coating head 101 discharges the coating liquid from a slit (not shown) to form a bead B having a thickness of about 800 to 900 μm, and the substrate S held by the substrate holding member 102 is the same as the coating head 101. Clearance C (for example, 500μ
The coating is carried out by slantingly upward (in a direction substantially vertical to the drawing) at a constant speed so as to maintain the same.

Generally, the width of the coating head 101 is set larger than that of the substrate S in order to accommodate various substrate sizes. Therefore, the peripheral portion of the substrate holding member 102 holding the substrate S faces the beads B,
In this state, the distance between the substrate holding member 102 and the bead B surface is about 300 to 400 μm. However, bead B
Has a meniscus formed on its contact surface with the substrate S,
For example, when the amount of the coating liquid supplied to the coating head increases due to a voltage change in the supply pump, the coating liquid may come into contact with the substrate holding member 102. Even if this phenomenon is temporary, the applied coating liquid contaminates the substrate holding surface of the substrate holding member 102, or the substrate holding member 102 and the substrate S
There is a problem that the substrate S is contaminated by being permeated between and.

In order to solve this, as shown in FIG. 19, the substrate holding member 102 can be made smaller than the size of the substrate S so that the substrate holding member 102 does not face the bead B. However, when a large-sized substrate S is held, the substrate holding member 1 among the substrates S is held.
When the area not held by 02 becomes large, the substrate S in this area hangs toward the coating head 101. When such a drooping phenomenon of the substrate occurs, it becomes difficult to maintain the clearance C between the substrate S and the coating head 101 at a constant level, which hinders the uniformity of the coating film thickness. On the other hand, it is also possible to replace the substrate holding member with an appropriate size according to the size of the substrate S to prevent the sagging phenomenon of the substrate S as described above. However, there is a problem that the substrate holding member having high rigidity is heavy and the replacement work is complicated.

The present invention has been made in view of the above circumstances, and a substrate holding member capable of reliably holding a single-wafer type substrate such as a large glass substrate according to its size, An object of the present invention is to provide a coating apparatus including such a substrate holding member and capable of forming a uniform coating film.

[0013]

In order to achieve the above object, the substrate holding member of the present invention is a substrate holding member for holding a substrate on a base by suction, and the base has a flat holding plane. While having a groove portion of a predetermined pattern corresponding to the peripheral shape of the substrate to be held in the holding plane, and for holding the substrate by suction in a predetermined position of the area surrounded by the groove portion of the holding plane The structure has a plurality of suction holes.

In such a substrate holding member of the present invention, by sucking through the suction holes in the base portion, a suction holding action occurs in the holding flat surface of the base portion through the suction holes, whereby the substrate can be held. At this time, the peripheral portion of the substrate is located in the groove provided on the holding plane and is held without contacting the substrate holding member, and is substantially held by the substrate holding member smaller in size than the substrate. Will be the same.

The coating apparatus according to the present invention has a coating head having a strip-shaped slit that opens upward and extends in the horizontal direction, and moves the substrate to be coated obliquely upward through the upper portion of the coating head. A substrate holding member is provided, a coating liquid is supplied to the coating head, and a bead is formed between the substrate to be coated held by the substrate holding member and the coating head by the coating liquid discharged from the slit. A bead coating apparatus for coating the coating liquid on the coating substrate by adhering the coating liquid from the bead to the coating surface of the coating substrate with relative movement of the coating head and the substrate to be coated, The holding member is configured to be the substrate holding member as described above.

In the coating apparatus of the present invention as described above, coating with high coating efficiency is performed on the substrate, and at this time, the peripheral portion of the substrate is located in the groove portion of the base and is not in contact with the substrate holding member. The distance between the groove and the bead in the groove of the substrate holding member is sufficiently large, and even if the surface of the bead fluctuates, the coating liquid is prevented from coming into contact with the substrate holding member.

[0017]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS The preferred embodiments of the present invention will be described below.

FIG. 1 is a front view showing a state where a substrate holding member of the present invention holds a substrate. In FIG. 1, a substrate holding member 1 of the present invention holds a substrate S on a holding plane 3 of a base 2 by suction.

FIG. 2 is a plan view showing an embodiment of the substrate holding member of the present invention. In FIG. 2, the substrate holding member 1
Includes a base portion 2, a flat holding flat surface 3 of the base portion 2, a groove portion 4 formed in the holding flat surface 3, and a plurality of suction holes 5 formed in a region of the holding flat surface 3 surrounded by the groove portions 4. I have it.

The base 2 is made of aluminum, stainless steel,
It can be manufactured using resin, ceramics, etc., and the thickness can be set to about 10 to 30 mm.

The groove portion 4 formed in the base portion 2 is formed with patterns 4a, 4b and 4c corresponding to the peripheral shape of the substrate to be held by the substrate holding member 1. And the groove 4
The plurality of suction holes 5 are formed in the area A surrounded by the pattern 4a, and the plurality of suction holes 5 are formed in the area B surrounded by the pattern 4c outside the pattern 4b of the groove portion 4.

The formation pattern of the groove portion 4 will be described with reference to FIGS. In FIG. 3, the pattern 4a of the groove portion 4 is a rectangular pattern corresponding to the peripheral shape of the substrate Sa (shown by a two-dot chain line in the illustrated example), and the peripheral edge portion of the substrate Sa is located substantially in the center of the groove portion 4. It is a thing.
The suction holding of the substrate Sa using this pattern 4a is performed as shown in FIG.
Is performed by the suction action of the suction holes 5 in the area A in FIG.
Further, in FIG. 4, the pattern 4b of the groove portion 4 is the substrate Sb.
Is a rectangular pattern corresponding to the peripheral shape (indicated by a chain double-dashed line in the illustrated example) of the substrate Sb.
The peripheral edge portion of is located. The suction holding of the substrate Sb using the pattern 4b is performed by the suction action of the suction holes 5 in the area A in FIG. Further, in FIG. 5, the pattern 4c of the groove portion 4 is a rectangular pattern corresponding to the peripheral shape of the substrate Sc (shown by a two-dot chain line in the illustrated example), and the peripheral edge portion of the substrate Sc is substantially at the center of the groove portion 4. It is located. The suction holding of the substrate Sc using this pattern 4c is performed by the suction action of the suction holes 5 in the regions A and B in FIG. In addition, in FIGS. 3 to 5, other patterns except the pattern to be described are shown by chain lines for convenience.

FIG. 6 shows VI of the substrate holding member 1 shown in FIG.
FIG. 6 is a partial vertical cross-sectional view taken along the line VI. As shown in FIG. 6, a groove 4 is formed in the holding plane 3 of the base 2, and a plurality of suction holes 5 are formed in the holding plane 3. The illustrated example shows a state in which the substrate Sb is suction-held by the suction holes 5 using the pattern 4b of the groove portion 4. The peripheral edge portion S ′ of the substrate Sb is located substantially in the center of the groove portion 4 and is not in contact with the base portion 2.

The opening width W ₁ of the groove 4 is 2 to 10 mm, preferably about 3 to 6 mm, and the depth D of the groove 4 is 0.5.
It is preferably about 3 mm. The opening width W _{1 of the} groove 4 is 2 mm
If the depth D of the groove 4 is less than 0.5 mm or less than 0.5 mm, a meniscus formed on the contact surface of the substrate in contact with the bead B of the coating liquid as shown in FIG. The phenomenon that the coating liquid soaks in between is likely to occur, which is not preferable. Further, when the opening width W ₁ of the groove portion 4 exceeds 10 mm, the temperature of the region located on the groove portion of the substrate Sb (region located on the pattern 4a of the groove portion 4 in FIG. 6) becomes lower than that of the other region of the substrate Sb. Unlike the temperature, the uniformity of the substrate temperature decreases and the groove 4
In the area located on the pattern 4a, the substrate may be sucked into the groove and may be deformed, which is not preferable.

Further, the pattern forming interval of the groove portion 4 (see FIG. 6).
Then, the formation interval between the pattern 4a and the pattern 4b) W ₂
Can be set in consideration of the material, thickness, etc. of the substrate within a range in which the portion (non-holding region) of the substrate Sb located between the patterns 4a and 4b does not sag. That is, there is no problem in the portion of the substrate Sb held by the suction holes 5 in the area A surrounded by the pattern 4a, but if the portion (non-holding area) located between the patterns 4a and 4b is large, The sagging phenomenon occurs due to the weight of the substrate. For example, in the glass substrate S for a color filter, the pattern formation interval W of the groove portion 4 is
It is preferable to set ₂ within the range of 50 mm at maximum.

In the illustrated example, the cross-sectional shape of the groove 4 is a semicircle, but the present invention is not limited to this. If the opening width W ₁ and the depth D are in the above ranges, The shape may be square, trapezoidal, triangular, or any other shape.

Further, in the illustrated example, each pattern 4 of the groove portion 4 is
The corner portions of a, 4b, and 4c have a shape that is difficult to be inserted inward according to the corner cut of the substrate, and in this case, the biting amount can be set to about 3 to 7 mm.

In the illustrated example, the suction hole 5 is bored substantially perpendicularly to the holding plane 3 of the base 2, and is connected to a suction passage 6 formed inside the base 2 substantially parallel to the holding plane 3. The suction passage 6 is connected to a suction device (not shown), and the suction action can be generated in the suction hole 5 by driving this suction device. Such a suction hole 5 can have, for example, an inner diameter of about 0.5 to 3 mm,
The formation interval can be about 3 to 50 mm.

In this embodiment, two suction systems can be provided: the suction hole 5 formed in the area A of FIG. 1 and the suction hole 5 formed in the area B. As a result, as shown in FIGS. 3 to 5, depending on the substrate to be held, only the suction holes 5 in the region A have a suction action, or all the suction holes 5 in the regions A and B have a suction action. You can

The substrate holding member of the present invention as described above is capable of holding substrates of various sizes and shapes corresponding to the groove portions formed in advance. In any case, the peripheral edge portion of the substrate is the groove portion of the base portion. Is not in contact with the substrate holding member,
The distance between the groove of the substrate holding member and the bead becomes sufficiently large, and the coating liquid is prevented from contacting the substrate holding member even if the bead surface fluctuates.

For the alignment when the substrate is sucked and held on the base 2 as described above, for example, a positioning pin is provided at a predetermined position of the base 2 and the substrate is brought into contact with this pin. It can be done by

Further, in the above-mentioned embodiment, the suction holes 5 are formed at the predetermined formation intervals in the entire area A and area B shown in FIG. 2, but the invention is not limited to this, and the suction holes 5 of the substrate are not limited thereto. It can be formed in any pattern that allows stable suction and holding. Further, the location where the suction holes 5 are formed is shown in FIG.
Are not limited to the areas A and B shown in
It can be set in consideration of the material, weight, etc. of the substrate so that the suction and holding of the substrate are surely performed, and for example, it may be formed in all regions surrounded by the groove portion 4.

Further, in the above-described embodiment, the suction in the suction hole 5 can be performed by two suction systems of the area A and the area B, but the suction system is not limited to this. That is, when only one suction system is used and the substrate is suction-held only in the area A, the resin sheet or the like may be suction-held in the area B.
Further, the suction system may be three or more.

In the above-described embodiment, the three types of substrates Sa, Sb, Sc shown in FIGS. 3 to 5 are applicable, but the substrate holding member of the present invention is not limited to this. It is needless to say that it is possible to correspond to four or more sizes. Further, according to the present invention, holes for lift pins used when the substrate is removed from the base may be provided in the base.

Next, the coating apparatus of the present invention will be described.

FIG. 7 is a block diagram showing an example of the embodiment of the coating apparatus of the present invention. In FIG. 7, the coating apparatus 30 of the present invention is a linear guide attached between a pair of support frames 31A of the apparatus main body 31 in an inclined state such that the downstream end in the sliding direction of the substrate S is high. A frame 32, a substrate holding member 33 slidably attached to the guide frame 32, and a linear slit 34a that opens upward are provided so that the slit 34a extends in a direction orthogonal to the axial direction of the guide frame 32. And a coating head 34 disposed below the guide frame 32.

The substrate holding member 33 is the substrate holding member of the present invention as shown in FIGS. 1 to 6, and is screwed into a ball screw 35 installed along the guide frame 32. When the screw 35 is rotated by the motor M, the screw 35 slides along the guide frame 32. Then, the substrate holding member 33
The suction path at the base of the substrate is connected to the suction pipe connecting portion 33A, and the substrate S is sucked and held on the downward holding plane by the operation of a suction mechanism (not shown). Further, the coating head 34 is adapted to discharge the coating liquid supplied from a coating liquid supply mechanism (not shown) upward from the slit 34a.

Here, an example of the coating head 34 will be described with reference to FIGS. 8 to 11.

In FIGS. 8 to 11, the coating head 34 is used.
The main body 34A has a length a which is equal to or larger than the width of the substrate S on which the coating liquid is applied, and a slit 34a which extends in the axial direction and opens upward is formed in the central portion of the upper surface thereof. . A pair of slopes 34B and 34C are formed on both sides of the slit 34a so as to sandwich the slit 34a.

Inside the main body 34A, a hollow liquid pool 34D is formed which extends parallel to the slit 34a and communicates with the slit 34a over the entire area in the axial direction. A coating liquid supply pipe 34E attached to a lower portion of the slit 34a is connected to the liquid pool 34D,
The coating liquid introduced from the coating liquid supply pipe 34E is discharged from the slit 34a through the liquid reservoir 34D.

In the figure, 34F is a pair of slit length adjusting packings that are detachably fitted to both ends of the slit 34a, and the slit length adjusting packings 34F have different lengths. The width of the coating liquid discharged from the slit 34a can be adjusted by changing the slit length adjusting packing.

The following dimensions are possible as an example of the dimensions of each part of the coating head 34 shown in the drawing.

Length a of main body 34A = 400 mm Width of main body 34A b = 50 mm Height of main body 34A c = 80 mm Length d of slit 34a (width after adjustment with slit length adjusting packing 34F) = 350 mm Slit 34a Width e = 2 mm Depth of slit 34a f = 27 mm Depth of liquid pool 34D g = 40 mm As a coating liquid supply mechanism for supplying the coating liquid to the coating head 34, a mechanism as shown in FIG. 12 can be mentioned.

This coating liquid supply mechanism is used in the pressure tank barrel 40.
The coating liquid contained therein is pushed out by the air pressure supplied through the manual valve 41, and the coarse adjustment needle valve 42, the filter 43, the flow meter 44, the fine adjustment needle valve 45, the air actuated valve 46 and the suck back. It is supplied to the coating head 44 via the valve 47.

The air actuated valve 46 is automatically operated by air pressure when the application of the coating liquid to the substrate S is completed, and stops the supply of the coating liquid to the coating head 44. Further, in the suck back valve 47, the piston 47a is slid in the direction of the arrow shown in FIG. 12 at the same time as the air-operated valve 46 is closed to generate a negative pressure in the cylinder 47b, and thereby the supply head 44 is supplied. Suction and collect the coating liquid.

FIG. 13 shows the state when the bead coating device 30 starts coating. The substrate S adsorbed by the resin flat plate of the substrate holding member 33 has a tip S1 at the coating head 34.
Is located directly above the slit 34a so as to face each other with a predetermined clearance. At this time, since the substrate holding member 33 is the substrate holding member of the present invention described above, the sagging phenomenon does not occur in the non-holding region in the peripheral portion of the substrate S, and therefore, the predetermined clearance with respect to the slit 34a is maintained. Is possible.

When the coating liquid R is supplied to the coating head 34 from the coating liquid supply mechanism, the supplied coating liquid R is discharged from the slit 34a to form the bead B as shown in an enlarged view in FIG. It is formed and attached to the lower surface of the front end of the substrate S. At this time, the minimum clearance C1 between the opening of the slit 34a and the lower surface of the substrate S held by the substrate holding member 33 has a viscosity and a surface of the coating liquid R so that the coating liquid R does not spill from the bead B. Set in consideration of physical properties such as tension.

In FIG. 14, a meniscus L1 is formed on the rear end side (left side in the figure) of the substrate S of the bead B, and a meniscus L2 is formed on the front end side (right side in the figure). The height dimension of this meniscus L1 is shown. h1 and meniscus L
The height dimension h2 of 2 has a relationship of h1 <h2 because the guide frame 22 is inclined at the angle θ.

When the motor M is driven and the ball screw 35 is rotated from the state shown in FIG. 13, the substrate holding member 33 is slid upward at a constant speed along the guide frame 32.

As a result, as shown in FIGS. 15 and 16, the coating liquid R is sequentially deposited from the bead B onto the lower surface of the substrate S to form a layer Ra of the coating liquid R. At this time, the coating liquid R is continuously supplied to the coating head 34, and the amount of the coating liquid R in the bead B is kept constant. At the time of this coating, even if the supply amount of the coating liquid fluctuates and the surface of the bead B rises, a sufficient distance is provided between the surface of the bead B and the substrate holding member 33 at the peripheral portion of the substrate S. The coating liquid does not come into contact with the substrate holding member 33.

Then, as shown in FIG. 17, the substrate S
Rises along the guide frame 32 and its rear end S2
When the coating liquid R reaches the slit 34a of the coating head 34, the slide of the substrate holding member 33 is stopped, and the coating liquid R forming the bead B is moved inside the coating head 34 by the operation of the suck back valve 37 connected to the coating head 34. Bead B is extinguished. As a result, the coating head 34 and the layer Ra of the coating liquid R on the substrate S are separated. Although not shown in the illustrated example, such a layer Ra of the coating liquid R is thin in the region of 20 to 30 mm from the front end S1 of the substrate S and thick in the region of 20 to 30 mm from the rear end S2 of the substrate S. However, the uniformity of the coating film thickness is insufficient.

The coating liquid used in the coating apparatus of the present invention is not particularly limited and has, for example, a viscosity of 1 to 100 cps.
To form a solvent-based photosensitive resin, an aqueous photosensitive resin, or a photosensitive resin such as a photosensitive resin in which a coloring material such as a pigment is dispersed in these photosensitive resins, various adhesives, a protective film, etc. The resin, various inks, etc. can be targeted.

[0053]

As described above in detail, in the substrate holding member of the present invention, a groove portion having a predetermined pattern corresponding to the peripheral shape of the substrate to be held is formed in the holding plane of the base portion having a flat holding plane. In addition to having a plurality of suction holes for sucking and holding the substrate at a predetermined position in a region surrounded by the groove of the holding plane, the holding plane of the base is obtained by sucking through the suction holes of the base. The substrate can be held by the suction holding action via the suction holes, and thus various substrates corresponding to the groove pattern can be held by one substrate holding member, and the substrate can be changed in size. The holding member does not need to be replaced, and workability is greatly improved. Further, the peripheral portion of the substrate held by the substrate holding member of the present invention is located in the groove portion provided on the holding plane and is held without coming into contact with the substrate holding member, but is surrounded by the groove portion. Since the substrate is held by the plurality of suction holes in the area, the substrate can be held reliably without causing the substrate to hang down.

Further, in the coating apparatus of the present invention, the coating liquid is discharged from the slit between the coating head having a strip-shaped slit extending upward and extending horizontally and the substrate to be coated to form a bead. While supplying the coating liquid, the substrate held by the substrate holding member as described above is moved obliquely upward through the upper part of the coating head, and the coating liquid is attached to the coating surface of the substrate from the bead to coat the substrate. The liquid is applied, and the peripheral edge of the substrate held by the substrate holding member is located in the groove provided on the holding plane and is held without contacting the substrate holding member. Even if the bead surface fluctuates while the meniscus is formed on the surface, the coating liquid is prevented from coming into contact with the substrate holding member, and the substrate holding member and the back surface of the substrate are contaminated by the coating liquid. As well as a possible had uniform coating becomes shall easily cope with the change of the substrate size.

[Brief description of drawings]

FIG. 1 is a front view showing a state where a substrate holding member of the present invention holds a substrate.

FIG. 2 is a plan view showing an embodiment of a substrate holding member of the present invention.

FIG. 3 is a surface for explaining a groove pattern of a base portion of the substrate holding member shown in FIG.

4 is a surface for explaining a groove pattern of a base portion of the substrate holding member shown in FIG.

5 is a surface for explaining a groove pattern of a base portion of the substrate holding member shown in FIG.

6 is a partial vertical cross section taken along line VI-VI of the substrate holding member shown in FIG.

FIG. 7 is a side view showing the configuration of the coating apparatus of the present invention.

8 is a perspective view showing an example of a coating head used in the coating apparatus shown in FIG.

FIG. 9 is a front view of the coating head.

FIG. 10 is a plan view of the coating head.

FIG. 11 is a side view of the coating head.

12 is a view showing a coating liquid supply mechanism used in the coating apparatus shown in FIG.

13 is a schematic side view showing the relationship between the substrate and the bead at the start of coating in the coating apparatus shown in FIG.

14 is an explanatory diagram showing an enlarged view of a bead state at the start of coating in the coating apparatus shown in FIG. 7. FIG.

15 is a schematic side view showing the relationship between the substrate and the bead during coating in the coating apparatus shown in FIG.

16 is an explanatory view showing an enlarged state of a bead during coating in the coating apparatus shown in FIG.

17 is a schematic side view showing the relationship between the substrate and the bead at the end of coating in the coating apparatus shown in FIG.

FIG. 18 is a diagram for explaining a positional relationship between a coating head in a bead coating method and a substrate held by a conventional substrate holding member.

FIG. 19 is a diagram for explaining a positional relationship between a coating head in a bead coating system and a substrate held by a conventional substrate holding member.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 ... Substrate holding member 2 ... Base part 3 ... Holding plane 4 ... Groove part 5 ... Suction hole 6 ... Suction path 30 ... Coating device 32 ... Guide frame 34 ... Coating head 34a ... Slit B ... Bead S, Sa, Sb, Sc ... Substrate

 ─────────────────────────────────────────────────── ─── Continuation of the front page (72) Inventor Shunji Miyagawa 1-1, 1-1 Ichigaya-Kagacho, Shinjuku-ku, Tokyo Within Dai Nippon Printing Co., Ltd. (72) Inventor Takashi Yaguchi 1-chome, Ichigaya-Kagacho, Shinjuku-ku, Tokyo No. 1 within Dai Nippon Printing Co., Ltd. (72) Inventor Masayuki Murata 1-1-1 Ichigayakamachi, Shinjuku-ku, Tokyo Within Dai Nippon Printing Co., Ltd.

Claims (2)

[Claims] 1. A substrate holding member for holding a substrate by suction on a base, wherein the base has a flat holding flat surface and has a groove portion having a predetermined pattern corresponding to the peripheral shape of the substrate to be held. A substrate holding member provided on the holding plane and having a plurality of suction holes for sucking and holding the substrate at predetermined positions in a region surrounded by the groove portion of the holding plane. 2. A coating head having a strip-shaped slit that opens upward and extends in the horizontal direction, and a substrate holding member for moving the substrate to be coated obliquely upward through the upper portion of the coating head. A coating liquid is supplied to the coating head, and a bead is formed between the substrate to be coated held by the substrate holding member and the coating head by the coating liquid discharged from the slit, In a bead coating device that applies a coating liquid to the coating substrate by applying a coating liquid from a bead to the coating surface of the coating substrate with relative movement with the substrate to be coated, the substrate holding member, Item 2. A coating apparatus, which is the substrate holding member described in Item 1.