JPH09246722A - Glass ceramic multilayer wiring substrate and manufacture thereof - Google Patents

Abstract

PROBLEM TO BE SOLVED: To remove the warpage of a substrate without increasing the electric resistivity of an inner layer conductor wiring by a method wherein a glass film, which prevents the diffusion of conductor metal, is provided around the inner layer conductor wiring. SOLUTION: The conductive paste for an inner layer conductor wiring is formed by mixing a small quantity of binder and an organic solvent to a conductive metal powder, and it is desirable that the conductive metal is formed by the metal such as Ag or Ag-Pd which can be fired in the atmosphere. In order to form a film, which stops the diffusion of conductive metal by springing out from the conductive metal when fired, on the conductive paste, a glass powder is added. This glass powder has the softening point lower than that of the glass powder contained in a green sheet, and the content of alkaline earth metal oxide is relatively high. As a result, warpage can be alleviated or removed without increasing the electric resistance of the inner layer conductor.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a glass-ceramic multilayer wiring board for mounting a package on which electronic parts are mounted and a method for manufacturing the same.

[0002]

2. Description of the Related Art A ceramic multilayer wiring board having an inner conductor wiring between a plurality of ceramic layers is far superior in heat resistance, dimensional stability and heat dissipation to a resin multilayer wiring board. Therefore, it has come to be used in large quantities as a high-density wiring board for computers and the like.

As a method for manufacturing a ceramic multilayer wiring board, a thick film multilayer printing method in which a conductor paste for forming an inner layer conductor wiring and an insulating paste are alternately printed on a fired thick film ceramic substrate and then fired, and an inner layer There is a green sheet multi-layer lamination method in which a plurality of ceramic green (unfired) sheets in which a conductor paste for forming a conductor wiring is printed in a predetermined wiring pattern are laminated, and then the laminate is fired to simultaneously sinter the substrate and the conductor. . Of these, the green sheet multi-layer lamination method, which excels in the accuracy of conductor wiring and requires only one firing, has become the mainstream.

When a conventional alumina ceramics multilayer wiring board is manufactured by the green sheet multilayer stacking method, a high firing temperature of about 1550 ° C. is required to sinter the alumina. As the conductor metal of the conductor paste, a metal having a high melting point such as W or Mo that withstands the firing temperature is used. However, since W and Mo are easily oxidized and have a thin oxide film on the surface, they have a large specific resistance (electrical resistivity), and a package using a multilayer wiring board using this as an inner layer conductor has a signal transmission loss. Grows larger.
Furthermore, the relative dielectric constant of the alumina itself that constitutes the substrate is high.
Since (ε = 9.0), there is also a problem that the delay of signal propagation is large, and the alumina-based ceramic multilayer wiring board is unsatisfactory in terms of electrical characteristics.

In order to solve this point, a glass-ceramic multilayer wiring board utilizing the characteristics of glass which is softened and sintered at a low temperature has been developed. The glass-ceramic multilayer wiring board uses a mixture of glass and ceramic aggregate as a ceramic material for the substrate instead of alumina, and acts as an inorganic binder that binds the aggregate by softening the glass during firing. By doing so, sintering is performed.

The glass-ceramic multilayer wiring board is 1000
Since it can be fired at low temperature around ℃ or lower, Ag, C
A low melting point metal having a low resistivity and a good conductor, such as u, Ag-Pd, or Au, can be used for the conductor paste for forming the inner layer conductor. Therefore, the signal transmission loss due to the electric resistance of the inner layer conductor is suppressed. Further, if the glass composition is selected, it is possible to make the dielectric constant lower than that of alumina. As a result, it is possible to manufacture a substrate with dramatically improved electrical characteristics compared to an alumina-based ceramics multilayer wiring board, and therefore, the glass-ceramics multilayer wiring board has already been put into practical use as a low-temperature fired ceramics substrate. It is expected that demand will increase in the future.

[0007]

Generally, when a ceramic multilayer wiring board is manufactured by a green sheet multilayer laminating method, the warpage of the board which occurs during firing becomes a serious problem. As a cause of the warpage, it is conceivable that the ceramic material in the green sheet forming the substrate and the contraction of the conductor metal in the conductor paste forming the inner layer conductor wiring do not match during firing. In this case, if the composition is adjusted so that the firing shrinkage of the ceramic material and the conductor metal match,
The problem of warpage is solved.

However, it has been recognized that in a multilayer wiring board using glass ceramics, warpage occurs even if the board ceramics material is adjusted to have the same firing shrinkage as the conductor metal. This is because the conductor metal diffuses from the conductor layer into the softened / melted glass in the substrate material during firing, and the glass softening point, glass crystallinity, etc. of the glass around the conductor change, causing the glass to shrink. This is because it changes locally. Therefore, it is very difficult to prevent warpage in the glass-ceramic multilayer wiring board.

The firing shrinkage behavior of the substrate and the conductor metal in the glass ceramics substrate is made to coincide with each other, the diffusion of the conductor metal into the glass during the simultaneous firing of the green sheet and the conductor paste is prevented, and the warp of the substrate after the simultaneous firing is prevented. As an attempt to reduce the content, in the conductor paste for forming the inner layer conductor, in addition to the conductor metal component, it is possible to add additives such as glass powder and metal oxides (eg, CaO), for example, JP-A-7-122113. Has been proposed to.

The reason why glass powder is added to the conductor paste is to match the firing shrinkage of the inner layer conductor with that of the glass ceramic material. That is, the addition of the glass powder is not for suppressing the diffusion of the conductor metal into the surroundings.
On the other hand, the metal oxide is added in order to suppress the diffusion of the conductor metal into the substrate and the reaction with the substrate by reacting with a part of the substrate material around the conductor. However, the conventional additives have a problem that these additives remain in the inner layer conductor after firing, the electric resistivity of the inner layer conductor increases, and the signal transmission loss increases.

An object of the present invention is to provide a glass-ceramic multilayer wiring board in which the warp is remarkably reduced or substantially eliminated without increasing the electrical resistivity of the inner layer conductor, and a method for producing the same by a green sheet multilayer laminating method. To provide.

[0012]

Means for Solving the Problems The present inventors have found that when a glass powder of a certain kind is added to a conductor paste while repeating a manufacturing experiment of a glass-ceramic multilayer wiring board by a green sheet multilayer laminating method, the electrical resistivity is increased. Without increasing
It was found that a substrate in which warpage was significantly suppressed was obtained.

Upon exploring the reason, the glass powder added to the conductor paste during the simultaneous firing of the laminated green sheet and the conductor paste was softened and melted before the glass powder in the glass ceramic material of the substrate, It was found that the molten glass was repelled on the surface of the conductor metal and gathered around the inner conductor wiring, and this functioned as a film for preventing the conductor metal from diffusing into the surrounding glass.

The present invention described in the following (1) to (3) has been completed based on the above findings. A glass-ceramic multilayer wiring board having an inner-layer conductor wiring, wherein a glass coating for preventing diffusion of a conductor metal is provided around the inner-layer conductor wiring.

The glass coating for preventing the diffusion of the conductor metal is formed by the glass powder added to the conductor paste being softened before firing the glass in the substrate during firing to be ejected from the conductor metal. The above glass-ceramic multilayer wiring board, which is a glass film having a softening point lower than that of glass.

The glass in the substrate is borosilicate glass, the conductor metal is Ag or Ag-Pd, and the glass coating is formed from borosilicate glass having a higher content of alkaline earth metal oxide than the glass ceramic substrate. The glass ceramic multilayer wiring board as described above.

A method of manufacturing a glass-ceramic multilayer wiring board having inner-layer conductor wiring, comprising laminating a plurality of glass-ceramic green sheets having a wiring pattern of a conductor paste printed on the surface and firing the laminated layers.
A method characterized in that the conductor paste contains glass powder having a lower softening point than the glass powder contained in the glass ceramic green sheet.

In the above, the content of the alkaline earth metal oxide in the glass-ceramic substrate is calculated based on the compounding amounts of the glass and the ceramics constituting the substrate and the content of those alkaline earth metal oxides. Calculated as an average value. For example, when the substrate is composed of 60% glass and 40% ceramics and the content of the alkaline earth metal oxides is 20% glass and 0% ceramics, the alkaline earth metal oxide of the substrate is The content rate is [20
X (60/100)] = 12%.

The glass-ceramic multilayer wiring board of the present invention has a glass coating around the inner conductor wiring to prevent diffusion of the conductor metal. When the conductive metal is prevented from diffusing into the surrounding glass, this diffusion causes the glass (and hence the substrate) to
The warp caused by the change in the shrinkage behavior of the is prevented.
The glass film for preventing the diffusion of the conductor metal is not limited as long as this function is achieved, but, for example, an alkaline earth metal oxide (eg, CaO, M
It can be formed from glass having a high content of gO).
It is speculated that the glass having a high content of alkaline earth metal oxide may react with a part of the components of the substrate to prevent the diffusion or reaction of the conductive metal into the substrate.

The film for preventing the diffusion of the conductor metal is formed by adding glass powder having a softening point lower than that of the glass in the substrate to the conductor paste in the production of the glass-ceramic multilayer wiring substrate by the green sheet multilayer laminating method. be able to. By heating during firing, the solvent, organic binder, and other organic additives are first evaporated from the green sheet and conductor paste, and then the glass with a low softening point contained in the conductor layer is softened prior to the melting of the glass of the substrate.
Melted and ejected from the conductor metal, around the conductor layer,
A glass coating having a composition different from that of the glass in the substrate is formed. The glass film formed around the conductor layer functions as a film for preventing the diffusion of the conductor metal into the substrate when the content of the alkaline earth oxide is higher than that of the substrate as described above. .

However, the "glass film for preventing the diffusion of the conductor metal" in the glass-ceramic multilayer wiring board of the present invention is not limited to the one formed by this method, and the composition is also an alkaline earth metal oxide. The content of is not limited to that higher than that of the substrate. Any glass coating that is arranged around the inner conductor wiring of the glass-ceramic multilayer wiring board and has a function of preventing diffusion of the conductor metal of the inner conductor wiring may be used.

Conventionally, there has been no idea of arranging such a coating around the conductive metal. In the present invention, a novel structure in which a glass coating for preventing diffusion of a conductor metal is arranged around the conductor metal prevents diffusion of the conductor metal into the surrounding glass, and a glass ceramic multilayer wiring substrate caused by this diffusion. The change in the contraction behavior of is eliminated.
As a result, it becomes possible to solve the problem of warpage of the glass-ceramic multilayer wiring substrate substantially completely.

According to the above or other aspects of the invention,
Even if glass powder that causes an increase in electrical resistivity is added to the conductor paste, the glass powder added to the conductor paste is different from the prior art described in JP-A-7-122113 and the like during firing. Since most of it is extruded on the surface of the conductor layer, the inner layer conductor wiring formed after firing contains almost no glass component. Therefore, the inner-layer conductor wiring having the same electrical resistivity as that when the conductor paste containing no glass is used is formed. Therefore, it is possible to obtain a glass-ceramic multilayer wiring board having no warp without increasing its electrical resistivity.

[0024]

BEST MODE FOR CARRYING OUT THE INVENTION The glass-ceramic multilayer wiring board and the method for manufacturing the same according to the present invention will be described in detail below. The glass-ceramic multilayer wiring board of the present invention,
As described below, it can be manufactured by the green sheet multilayer lamination method.

First, glass powder, which is a raw material powder of glass ceramics, and ceramic powder of aggregates are mixed well while being crushed if necessary, and a glass ceramics green sheet is produced from the obtained mixed powders by a conventional method. To do.

The types of glass powder and ceramic powder used may be the same as those conventionally used for glass-ceramic multilayer wiring boards. As glass powder,
Borosilicate glass having a low thermal expansion coefficient close to that of silicon and a low relative dielectric constant of about 5 or less is preferable. Borosilicate glass has a basic composition of SiO ₂ -Al ₂ O ₃ -XO-B ₂ O ₃ (X is an alkaline earth metal such as Ca, Mg, Ba), and if necessary, an alkali metal oxide. (Li ₂ O, Na ₂ O, K ₂ O), ZrO ₂ , ZnO, TiO ₂ and other metal oxides are added in small amounts (total 10% by weight or less). The composition (wt%) of borosilicate glass is
For _{example, SiO 2: 40~65%, Al} 2 O 3: 5~20%, XO ( alkaline earth metal _{oxides): 10~30%, B 2 O} 3: 5~30%, K 2 O: 0
It is preferably about 5%.

As the aggregate ceramic powder, alumina powder alone or a mixture of the alumina powder and other ceramic (eg, cordierite) powder is generally used. The raw material powders (glass powder and ceramics powder) preferably have an average particle size of about 1 to 5 μm, particularly 1.5 to 3.5 μm. The mixing ratio of the glass powder and the ceramic powder is preferably 1 to 60%, particularly 10 to 50% by weight based on the total amount of the both.

Organic powder resin (eg, acrylic resin, butyral resin, vinyl acetate copolymer, vinyl chloride resin, polyvinyl alcohol, etc.), dispersant (acrylic acid oligomer, sorbitan monooleate, etc.), plasticizer (Phthalates, polyalkylene glycols, etc.), organic solvents (aromatic hydrocarbons, ketones, esters,
Addition of an additive such as alcohol) into a slurry, the slurry is formed into a sheet by a doctor blade method, etc., and most of the solvent is removed by leaving it to obtain a glass ceramic green sheet. On this green sheet,
Drill via holes (through holes) if necessary.

On the other hand, the conductor paste for the inner layer conductor wiring is
Generally, a small amount of binder (organic resin) is added to conductive metal powder.
And a mixture of an organic solvent. As described above, since the glass-ceramic multilayer wiring board is fired at a low temperature, the conductive metal used for the conductive paste is Ag, Cu, Ag-
A metal material having a relatively low melting point such as Pd or Au may be used. Of these, Cu is easily oxidized and requires firing in an inert atmosphere, and Au is expensive. Therefore, Ag or Ag-Pd, which is a relatively inexpensive metal that can be fired in the atmosphere, is preferable as the conductor metal. Except that glass powder is added to the conductor paste as described below, the materials and blending ratio used for the conductor paste may be the same as those of the conventional conductor paste for low temperature firing.

According to the present invention, glass powder is added to this conductor paste in order to form a film that prevents the conductor metal from diffusing by being repelled from the conductor metal during firing. This glass powder is made of glass ceramics
It has a lower softening point than the glass powder contained in the green sheet and a relatively high content of alkaline earth metal oxides.
(In particular, the content is higher than the alkaline earth metal oxide content of the substrate after firing).

Since this glass powder has a lower softening point than the glass in the substrate, it softens prior to the glass in the glass-ceramic material during firing and is repelled from the conductor metal.
A glass film is formed around the wiring pattern of the conductor metal and has a composition different from that of the glass component of the glass ceramics. Since the formed glass film has a relatively high content of alkaline earth metal oxides, some of the components in the glass-ceramic material during firing (e.g., aggregate or glass
Reacts with acidic components such as Al ₂ O ₃ and SiO ₂ )
It is thought to prevent the diffusion of (eg, Ag or Ag-Pd) into the substrate.

The glass powder added to the conductor paste is also preferably borosilicate glass powder from the viewpoint of the relative dielectric constant and expansion coefficient. However, the softening point is lower than that of the glass used for the glass-ceramic substrate, and the content of XO (alkaline earth metal oxide) is relatively high (for example, at least about 5% by weight, preferably Is 10% by weight or more, more preferably 15% by weight or more). However, the inclusion of PbO 2 which lowers the softening point is not preferable.

The amount of the glass powder added to the conductor paste is preferably 3 to 18%, particularly preferably 9 to 15% by weight based on the total amount of the conductor powder and the conductor metal in the conductor paste. The glass powder and the conductor metal powder contained in the conductor paste each preferably have an average particle size in the range of 0.2 to 4 μm.

Using the conductor paste containing this glass powder, a glass-ceramic multilayer wiring board is manufactured in the same manner as the conventional green sheet laminating method. That is, first, this conductor paste is printed (usually screen printing) so as to form a predetermined wiring pattern on the surface of the green sheet. At the same time, the via holes are usually filled with a conductive paste. It is not necessary to add glass powder for forming a film for preventing diffusion of the conductor metal to the conductor paste filled in the via hole, but this glass powder may be added. The composition of the conductor paste used for wiring printing and the conductor paste used for filling via holes
(Conductor metal, binder, organic solvent type and compounding amount) may be different.

Two or more green sheets on which the wiring pattern of the conductor paste is printed are prepared, these are laminated (usually pressure bonded by hot pressing), and the obtained laminate is fired. The wiring pattern printed on the green sheet other than the uppermost layer becomes an inner layer conductor wiring after lamination and firing. The firing conditions may be the same as in the case of the conventional glass-ceramic multilayer wiring board. Usually, before firing, low-temperature heating is first performed to remove organic components (remove binder).
The firing temperature is in the range of about 850-1000 ° C.

As described above, at the time of this firing, the glass powder in the conductor paste having a lower softening temperature than the glass powder in the glass ceramic material is softened first, and the glass film for preventing the diffusion of the above-mentioned conductor metal has a wiring pattern. Formed around the. Therefore, the glass-ceramic multilayer wiring board obtained after firing has a glass coating around the inner-layer conductor wiring to prevent the diffusion of the conductor metal.

The glass-ceramic multilayer wiring board of the present invention is mounted with appropriate electronic components (eg, semiconductor chips) by various known methods, external connection leads are soldered, and the board is formed with an appropriate sealing material. The glass-ceramic package is manufactured by sealing the periphery and packaging.

[0038]

The present invention will be described below in detail with reference to examples. In Examples,% is% by weight unless otherwise specified.

Glass powder and ceramic powder (aggregate) having the compositions shown in Table 1 were put in a wet ball mill in the proportions shown in Table 1, pulverized and mixed until the average particle size became 2 to 3 μm, and the obtained mixed powder was obtained. Organic solvent (xylene), binder (acrylic resin), dispersant (acrylic acid oligomer)
, A plasticizer (dioctyl phthalate) is added to form a slurry, and the slurry is used to obtain a thickness of 180
A μm green sheet was created.

[0040]

[Table 1]

The conductor paste for forming the inner layer conductor is a powder of a conductor metal composed of Ag or Ag-20% Pd (average particle size: 1.5 μm).
m), glass powder of SiO ₂ -B ₂ O ₃ -Al ₂ O ₃ -BaO glass powder (softening temperature 780 ℃, BaO: 20%, average particle size 2.5μ)
m) were mixed in the proportions shown in Table 2, and an appropriate amount of resin (ethyl cellulose) and organic solvent (α-terpineol) were added to this mixed powder and kneaded. The conductor paste for comparison was prepared in the same manner as above except that glass powder was not added.

In order to prepare a glass-ceramic multilayer substrate for measuring the amount of warp, each conductor paste was solidly printed on a square of 30 mm on one surface of the green sheet cut into a square of 40 mm, and the solid printed surface was printed. Further, two 40 mm square square green sheets were further laminated on each other and pressure-bonded by hot pressing to obtain a laminate shown in FIG. This laminated body was heated in air at 900 ° C. for 30 minutes, and the green sheet and the conductor paste were simultaneously fired to produce a glass-ceramic multilayer substrate. As shown in FIG. 1, the height of the warp of the fired substrate was measured as the warp amount.

Separately, in order to prepare a glass-ceramic multilayer substrate for measuring the electrical resistivity, each conductor paste was applied to one side of the green sheet cut into a square of 50 mm square.
After the firing, the wiring is printed by calculating from the firing shrinkage rate of the green sheet so that the wiring will have a total length of 300 mm and a width of 100 μm, and a green of the same size with holes to expose the wiring terminals on this printed surface. After laminating one sheet and hot pressing, firing was performed under the same conditions as above. The cross-sectional area of the inner-layer conductor wiring was measured by observing the cross-section SEM of the glass-ceramic multilayer wiring board obtained by firing, and the electrical resistivity of the inner-layer conductor was calculated from the measured electrical resistance at 25 ° C.

Table 2 below shows the types of green sheets (substrate numbers) used and the composition of the conductor paste, as well as the measurement results of the amount of warpage and the electrical resistivity of the inner layer conductor.

Further, in the cross section of the fired substrates of Comparative Example 1 and Examples 1 to 5, EPMA line analysis results showing the diffusion state of Ag from the inner layer conductor wiring to the glass ceramic substrate are shown in FIG. EP showing the distribution of the glass component added to the inner conductor paste in the cross section of the fired substrate
The MA line analysis results are shown in FIG. 3, respectively. These EP
The MA ray analysis was performed using EPM-810 manufactured by Shimadzu Corporation.

[0046]

[Table 2]

From Table 2, according to the method of the present invention, when glass powder having a higher alkaline earth metal content than the substrate and a lower softening point than the glass in the substrate is added to the conductor paste,
As the amount added increases, the amount of warpage of the fired substrate decreases,
It can be seen that when the content is 10% or more, a glass-ceramic multilayer wiring board in which warpage is substantially eliminated can be obtained. In addition, even if the glass powder is added to the conductor paste in this way, and the amount of addition increases to 10% or more, the electric resistivity of the inner conductor wiring does not increase at all or hardly increases. There is no increase and thus no increase in signal transmission loss.

As can be seen from FIG. 2, if the above glass powder was not added to the conductor paste (Comparative Example 1), the conductor metal (Ag) was transferred from the inner layer conductor to the glass ceramic substrate during firing.
Spread. As a result, as shown in Table 2, the warpage of the fired substrate increased. However, when the above glass powder was added to the conductor paste according to the method of the present invention (Examples 1 to 5), the diffusion of Ag during firing decreased as the amount of glass powder added increased. Along with this, the change in the shrinkage behavior of the glass in the fired substrate was reduced, and as shown in Table 2, the warpage of the substrate was reduced.

FIG. 3 shows the distribution of Ag (conductor metal) and Ba (elements contained in the glass powder added to the conductor paste) in the inner-layer conductor wiring and the surrounding substrate in the glass-ceramic multilayer wiring board of Example 4. Show. Since Ba is an element not contained in the glass for forming the substrate used in the examples, the distribution of Ba shows the distribution of the glass added to the conductor paste.

As can be seen from FIG. 3, the inner layer conductor wiring is substantially composed of the conductor metal (Ag), and the glass (Ba) added to the conductor paste is concentrated around the conductor wiring. That is, most of the glass component added to the conductor paste is repelled on the surface of the conductor metal during firing and gathers around the conductor wiring, which prevents the diffusion of the conductor metal into the substrate during firing. It became. Therefore, the inner conductor wiring after firing contained almost no insulating glass powder, and its electrical resistivity was almost the same as that of Comparative Example 1 in which no glass powder was added to the conductor paste.

[0051]

According to the present invention, when a glass-ceramic multilayer wiring board is manufactured by the green sheet multilayer laminating method, the conductor paste used for forming the inner-layer conductor wiring has a softening point lower than that of the glass powder in the glass-ceramic substrate. Add a glass powder that is low and has a higher alkaline earth metal content than the substrate. Thereby, when simultaneously firing the laminated green sheet and the conductor paste printed on it,
Before the metal of the conductor layer diffuses to the surroundings, the glass powder softens and melts from the conductor layer and is ejected to the surface of the conductor metal, which gathers around the conductor layer and prevents the diffusion of the conductor metal to the substrate. A glass coating is formed.

By forming this glass film around the conductor metal, the warp of the fired substrate, which has been a problem in the conventional glass-ceramic multilayer wiring board, is reduced or eliminated as shown in the embodiment, and moreover, the conductor is not formed. Despite the addition of insulating glass to the paste, it is repelled from the conductor layer during firing so that no increase in the electrical resistivity of the inner layer conductor wiring occurs. Therefore, it is possible to obtain a glass-ceramic multilayer wiring board without warping without increasing signal transmission loss.

[Brief description of drawings]

FIG. 1 is an explanatory diagram showing a method of measuring a warp amount used in Examples.

FIG. 2 is an EPM showing a distribution state of Ag in a substrate (a diffusion state of Ag from a conductor to a substrate) at a boundary portion with an inner conductor wiring of a glass-ceramic multilayer wiring substrate obtained in an example.
It is an A line analysis figure.

FIG. 3 is an EPMA line analysis diagram showing the distribution of Ag and Ba around the inner conductor wiring of the glass-ceramic multilayer wiring board obtained in the example.

Claims (4)

[Claims] 1. A glass-ceramic multilayer wiring board having an inner-layer conductor wiring, wherein:
A glass-ceramic multilayer wiring board having a glass coating for preventing diffusion of a conductor metal. 2. The glass coating for preventing the diffusion of the conductor metal is formed by the glass powder added to the conductor paste being softened prior to the glass in the substrate during firing and being repelled from the conductor metal. The glass-ceramic multilayer wiring board according to claim 1, which is a glass film having a softening point lower than that of the glass in the board. 3. The borosilicate glass wherein the glass in the substrate is borosilicate glass, the conductor metal is Ag or Ag-Pd, and the glass coating film has a higher content of alkaline earth metal oxide than the glass ceramic substrate. The glass-ceramic multilayer wiring board according to claim 1, which is formed from 4. A method of manufacturing a glass-ceramic multilayer wiring board having inner-layer conductor wiring, comprising laminating a plurality of glass-ceramic green sheets having a wiring pattern of a conductor paste printed on the surface and firing the laminated layers.
A method for manufacturing a glass-ceramic multilayer wiring board, wherein the conductor paste contains glass powder having a softening point lower than that of the glass powder contained in the glass-ceramic green sheet.