JPH09243704A - Inspecting device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To press an IC to a socket by the elastic repulsive force on an attachment and detachment device side. SOLUTION: In an inspecting device having a socket 6 for electrically connecting IC 1 to a tester, and an attachment and detachment device 20 for attaching and detaching the IC to the socket 6 to execute an electric inspection for the IC installed to the socket by the attachment and detachment device through the socket, the attachment and detachment device 20 has a holding plate 24 moved to the socket 6, and a positioning plate 21 suspended from the holding plate to position the holding plate to the socket 6. A collet 30 for attractively holding the IC 1 is slidably supported by the holding plate in the state energized down by a pressing spring 32, and a lead pressing member 36 is slidably supported on the outside of the collet in the state energized down by the elastic repulsive force of a pad 34. Since the pushing quantity of the socket can be reduced, thus, incidental capacity and inductance can be reduced, and the inspection of an IC showing high frequency characteristic can be realized.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention
The present invention relates to an inspection technique for executing an electrical characteristic test on a desired object to be inspected, and for example, to an effective technique used for performing a selective inspection of a semiconductor integrated circuit device (hereinafter referred to as an IC) for non-defective products and defective products.

[0002]

2. Description of the Related Art In a manufacturing process of an IC, there is a so-called IC auto handler which is generally called as an IC auto-handler as a screening inspection device for carrying out a screening inspection for good products and defective products. That is, this IC auto-handler is a tester that performs an electrical characteristic test on the IC, and a measuring device (hereinafter referred to as a socket) that is a connecting portion between the IC and the tester.
And an attach / detach operation device for attaching / detaching the IC to / from the IC, the IC as an object to be inspected is attached to the socket by the attach / detach operation device to electrically connect the IC and the tester,
The electrical characteristic test is performed by exchanging a test signal between the IC and the tester.

Incidentally, as an example in which an IC sorting / inspecting device (IC auto handler) is described, Japanese Patent Application Laid-Open No. 4-1866 is available.
48 publication.

[0004]

However, in the above-mentioned prior art, since the attachment / detachment operation device does not consider the so-called pushing amount of the socket, the setup time becomes long when the pushing amount of the socket decreases. It was revealed by the present inventors that there are points. That is, when the electrical characteristics of an IC exhibiting high-frequency characteristics used in communication equipment and the like are implemented, the use of springs in the socket is restricted in order to avoid the effects of parasitic capacitance and inductance components in the socket. As a result, the pushing amount of the socket is reduced. If the pushing amount on the socket side is reduced, the impact at the time of mounting the IC in the socket must be absorbed by the attachment / detachment operation device side, and thus the impact absorption mechanism on the attachment / detachment operation device side must be strictly adjusted. As a result, a longer setup time is inevitable.

It is an object of the present invention to provide an inspection technique capable of pressing an object to be inspected against a socket by means of an attachment / detachment operation device.

The above and other objects and novel features of the present invention will become apparent from the description of the present specification and the accompanying drawings.

[0007]

The outline of a typical invention among the inventions disclosed in the present application is as follows.

That is, a socket for electrically connecting an object to be inspected to a tester and an attachment / detachment operating device for attaching / detaching the object to be inspected to / from the socket are provided. In an inspection device in which an electrical inspection is performed on an object by a tester via a socket, the attachment / detachment operation device positions the holding plate with respect to the socket by being suspended by the holding plate that moves with respect to the socket. A holding plate, and an object-to-be-inspected device holding the object to be inspected is slidably supported by a holding spring while being constantly urged in the socket side direction. Is characterized by.

In the above-mentioned means, when the object to be inspected is mounted on the socket by the attachment / detachment operation device, the positioning plate suspended by the holding plate is positioned on the socket.
When the holding plate is moved toward the socket in this positioning state, the inspection object held by the inspection object holding device is attached to the socket. At this time, the pressing spring that constantly urges the inspection object holding device urges the inspection object toward the socket, so that the inspection object is pressed against the socket. It will be securely connected to the socket.

[0010]

1 is an enlarged partial cross-sectional view showing a main part of an IC auto-handler according to an embodiment of the present invention. (A) shows a state immediately before mounting and (b) shows a state during inspection. Shows. FIG. 2 is a partially cutaway front view showing the IC auto handler, where (a) shows a holding state of the IC, (b) shows just before mounting, and (c) shows an inspection. FIG. 3 is a partially omitted plan view showing the IC handler, and FIG.
FIG. 5 is a partially cut side view showing the C handler, and FIG.
It is a bottom view which follows a line.

In this embodiment, the inspection apparatus according to the present invention is an IC auto-handler for executing a selection inspection on a QFP / IC (hereinafter simply referred to as an IC), which is an example of an IC having a surface mount type package. It is configured. A quad flat package (hereinafter referred to as a package) of IC1 as an inspection object includes a resin sealing body 2 transfer-molded into a substantially square flat plate shape using an insulating resin. A plurality of outer leads 3 are arranged in a line on the four side surfaces of the resin encapsulation body 2 and project outwardly in the radial direction. Each outer lead 3 is bent into a gull wing shape, and the lower surfaces of its terminal portions are aligned so as to be located in the same plane.

In this embodiment, the IC auto handler 10 is provided with a machine base 11, the test head 4 is installed on the machine base 11, and the test head 4 is provided with a socket 6.
A plurality of units (only two units are shown in the figure for convenience), and they are detachably mounted via the parent socket 5. Although detailed description is omitted, the socket 6 is configured so that the IC 1 as the inspection object is inserted from above, and the IC 1 and the test head 4 are electrically connected to each other. Parasitic capacitance and inductance components are suppressed to cope with the inspection. Therefore, the socket 6 is in a state in which the so-called pushing amount is reduced. Further, the socket 6 is prepared with a plurality of types of standards corresponding to the type of IC to be inspected, and is replaced every time the type of IC is changed.

The socket 6 mounted on the test head 4 is surrounded by a temperature-controlled room 7 installed on the machine base 11, and the temperature-controlled room 7 is constructed so that the temperature inside the room can be adjusted. . An inlet / outlet opening 8 is opened just above the socket 6 of the temperature-controlled room 7 so that the IC 1 can be inserted / removed.

Outside the temperature-controlled room 7 on the upper surface of the machine base 11, a set of four positioning pins 12 are arranged at the four corners of the rectangle and are installed vertically upward.
Although not shown, a robot moving along a guide rail is installed on the machine base 11, and as shown in FIG. 4, an air cylinder device 14 is vertically attached to the arm 13 at the final stage of the robot. It is installed downwards.
A beam 16 is horizontally arranged and suspended on a piston rod 15 of the air cylinder device 14, and a plurality of attachment / detachment operating devices 20 (two units in the illustrated example) are installed on the beam 16.

The attachment / detachment operating device 20 includes four positioning pins 1.
A positioning plate 21 formed in a rectangular plate shape slightly larger than the rectangle formed by 2 and a holding plate 24 formed in a rectangular plate shape smaller than the positioning plate 21 and fixed to the lower surface of the beam 16. I have it. Positioning plate 21
Four positioning cylinders 22 are vertically penetrated and fixed to the four corners of the positioning cylinder 22. The inner diameter of the positioning cylinder 22 is set to be substantially equal to the outer diameter of the positioning pin 12. Guide shafts 23 are vertically projectingly provided at positions inside the positioning cylinders 22 of the positioning plate 21. The four guide shafts 23 have guide holes 25 formed at four corners of a holding plate 24. Are slidably inserted in the vertical direction. A spacer 26 formed in a truncated cone shape is fixed to the outside of the guide hole 25 of the guide shaft 23 by a nut 27, and the spacer 26 is arranged such that the smaller diameter side of the truncated cone is on the lower side. A suspension spring 28 is installed on the guide shaft 23 between the positioning plate 21 and the holding plate 24 in a stored state in an accumulated state, and is mounted on the guide shaft 23.
Is always urged downward.

The insertion hole 2 is formed at a substantially central portion of the holding plate 24.
9 is provided so as to vertically penetrate therethrough, and a collet 30 as an inspection object holding device for holding the IC 1 by suction on the upper surface of the resin sealing body 2 is slidable in the insertion hole 29 in the vertical direction. Has been inserted into. A hose connection port portion 31 for fluidly connecting a hose (not shown) as a negative pressure supply means is provided at the upper end of the collet 30 so as to project therefrom. At the lower end of the collet 30, a pressing spring 32 is interposed between the holding plate 24 and the collar portion of the collet in a stored state, and the spring 32 takes a reaction force to the holding plate 24 to move the collet 30. It always urges downward.

A storage hole 3 for storing a pad 34 as an elastic member is provided outside the insertion hole 29 in the holding plate 24.
Reference numeral 3 denotes a square, which is recessed vertically downward in the shape of a hole having a constant depth, and a pad 34 formed of an elastic member made of rubber or resin is housed in the inner portion of the housing hole 33. The length of one side of the square of the storage hole 33 is set to be slightly larger than the maximum outer diameter dimension of the package of the IC 1. Four lead pressing members 3 are provided in the opening of the storage hole 33.
The upper end of 6 is arranged and inserted on each of the four sides, and each lead pressing member 36 is prevented from coming off by a cap 35 that is fixed by being covered with the opening of the storage hole 33. That is, the held portion 37 is bent at a right angle to the upper end portion of the lead pressing member 36, and the cap 35 is attached to the lower surface of the held portion 37 while the upper end portion of the lead pressing member 36 is inserted into the storage hole 33. Has been applied. When the lower end of the lead pressing member 36 hits an object, the pad 34 made of an elastic member is compressed and deformed to separate from the contact surface of the cap 35. It is supposed to be urged. The lead pressing member 36 is IC1
Is formed in a rectangular plate shape having a width slightly larger than the width of the outer lead 3 group row, and the escape portion 38 is formed on the inner end surface of the tip end thereof so as to avoid interference with the shoulder portion of the outer lead 3. It is formed to be inclined.

Next, the operation will be described. The beam 16 on which a plurality of attachment / detachment operation devices 20 are suspended is transferred by a robot directly above an actual tray (not shown) in which ICs to be inspected are stored. When the beam 16 is lowered by the air cylinder device 14 suspended by the final stage arm 13 of the robot, the collet 30 of each attachment / detachment operation device 20 holds the IC 1 in the actual tray by vacuum suction. After the beam 16 is lifted by the air cylinder device 14, the group of ICs 1 held by each collet 30 is transferred by the robot together with the beam 16 to a place where a plurality of sockets 6 are arranged.
In this state, as shown in FIG. 2A, each attachment / detachment operation device 20 faces directly above each socket 6. Hereinafter, for convenience, the operation of one attachment / detachment operation device 20 will be described.

Next, when the beam 16 is lowered by the extension operation of the piston rod 15 of the air cylinder device 14, as shown in FIG. 2A, the positioning plate 21 is moved.
The respective positioning pins 12 of the machine base 11 are relatively fitted into the respective positioning cylinders 22 from below, and the positioning plate 21 is positioned and supported by the machine base 11 by the respective positioning pins 12. In this positioning and supporting state, FIG.
As shown in FIGS. 1A and 1A, the IC 1 held by the collet 30 is inserted into the temperature-controlled room 7 through the inlet / outlet opening 8 and is aligned with the socket 6 from above. That is, each outer lead 3 of the IC 1 has a socket 6
The terminals (contacts) 6a are accurately aligned with each other.

Subsequently, as shown in FIGS. 2C and 1B, when the piston rod 15 of the air cylinder device 14 is further extended, the holding plate 24 is moved relative to the positioning plate 21. To descend. That is, the holding plate 24, which is floatingly supported by the positioning plate 21 by the plurality of suspension springs 28,
When the piston rod 15 of the air cylinder device 14 is extended, the piston rod 15 is lowered against the suspension springs 28.
At this time, the holding plate 24 has the guide hole 25 and the guide shaft 23.
Since it is guided by the collet 30, the collet 30 held by the holding plate 24 does not shift laterally with respect to the positioning plate 21 and is precisely lowered vertically. Therefore, the I held by the collet 30 even after the holding plate 24 descends.
The matching state of C1 with the socket 6 will be accurately maintained.

When the holding plate 24 is vertically lowered with respect to the positioning plate 21 as described above, the collet 30 held by the holding plate 24 is also vertically lowered.
The IC 1 held by is vertically lowered, and the lower surface of the terminal portion of each outer lead 3 is accurately pressed onto the upper surface of each terminal 6a of the socket 6. Each outer lead 3 has each terminal 6a
When pressed against the collet 30, the collet 30 is relatively pushed back from the socket 6 side, so that the pressing spring 32 is compressed as the holding plate 24 descends. That is, the IC 1 is in a state of being pressed against the socket 6 by the elastic force of the pressing spring 32.

When the holding plate 24 is lowered with respect to the positioning plate 21, the lead pressing members 36 held by the holding plate 24 are lowered and abut against the lower surfaces of the terminal portions of the outer leads 3, respectively. When you hit each outer lead 3,
Since each lead pressing member 36 is pushed back from the socket 6 side, the pad 34 formed of an elastic body is compressed and deformed as the holding plate 24 descends.
That is, the terminal portion of each outer lead 3 of the IC 1 is pressed against each terminal 6 a of the socket 6 by the elastic force of the pad 34 via the lead pressing member 36.

As described above, the terminal portion of each outer lead 3 is pressed against each terminal 6a of the socket 6, whereby the IC 1 is electrically connected to the test head 4 via the socket 6. And IC1
And the tester communicate with the tester via the socket 6 and the test head 4 to perform the electrical characteristic test. At the time of this communication, since each outer lead 3 is pressed against each terminal 6a of the socket 6 by the elastic force of the pressing spring 32 and the pad 34, even if the pushing amount on the socket 6 side is small, the IC 1 and the tester The electrical connection state with is reliably maintained. Therefore, the communication between IC1 and the tester is properly executed,
The inspection will be performed properly.

Incidentally, during the electrical characteristic test for the IC1, the temperature-controlled room 7 is appropriately adjusted to a preset temperature, so that the IC1 is subjected to the electrical characteristic test at a predetermined temperature.

When the predetermined electrical characteristic test on the IC 1 is completed, the attachment / detachment operation device 20 is operated by the air cylinder device 14
The beam 16 is raised together with the shortening operation of the piston rod 15. With the rise of the attachment / detachment operating device 20,
The IC 1 held by the collet 30 of the attachment / detachment operation device 20 is detached from the socket 6 and pulled up from the temperature-controlled room 7. After that, the attachment / detachment operation device 20 is moved by the robot directly above the empty tray (not shown) together with the beam 16, and the IC1 held by the collet 30 is transferred to the empty tray.

Thereafter, by repeating the above-mentioned operation, the inspection is carried out for the IC1 stored in the actual tray.

According to the above embodiment, the following effects can be obtained. (1) The collet holding the IC is supported by the holding plate of the attachment / detachment operation device so as to be slidable in the vertical direction, and the collet is constantly urged downward by the spring so that each IC can be mounted in the socket. Since the outer lead can be pressed against each terminal of the socket by the pressing spring, the IC can be surely electrically connected to the socket regardless of the pushing amount on the socket side.

(2) By suspending the positioning plate on the holding plate of the attachment / detachment operation device, the IC held by the collet can be aligned with the socket while the holding plate is positioned by the positioning plate with respect to the socket. Therefore, each outer lead of the IC can be properly electrically connected to each terminal of the socket.

(3) A lead pressing member is supported on the holding plate slidably in four directions of the collet in the vertical direction, and
By constantly urging each lead pressing member downward by the elastic force of the pad made of an elastic member, each outer lead can be pressed from above by each lead pressing member to each terminal of the socket when the IC is mounted in the socket. Therefore, each outer lead of the IC can be more surely brought into contact with each terminal of the socket regardless of the pushing amount on the socket side.

(4) By the above (1) and (3),
Since the parasitic capacitance and the inductance component of the socket can be reduced, an appropriate inspection can be ensured even for an IC exhibiting high frequency characteristics.

(5) By configuring a plurality of attachment / detachment operation devices to be simultaneously moved by the robot,
Since a plurality of ICs can be attached to and detached from each socket at the same time, the work efficiency of inspection can be improved.

Although the invention made by the inventor has been specifically described based on the embodiment, the invention is not limited to the above embodiment, and various modifications can be made without departing from the gist of the invention. Needless to say.

For example, the attachment / detachment operation device is not limited to the configuration in which two units are simultaneously moved by the robot, and may be in the configuration in which one unit or three or more units are simultaneously moved.

The elastic member for urging the lead pressing member is not limited to rubber or resin, but may be a spring such as a leaf spring.

The lead pressing member may be omitted.

In the above description, the invention made mainly by the present inventor is the field of application which is the background of the invention.
Although the case where the invention is applied to the inspection technology for the IC has been described, the invention is not limited thereto. The SOP IC and the outer lead include a transistor having a gull-wing shape package, a power IC, a power transistor, and other electronic components. Also, it can be applied to general inspection technology for electronic devices and the like.

[0037]

The effects obtained by typical aspects of the invention disclosed in the present application will be briefly described as follows.

Since the object to be inspected can be pressed against the socket by the attachment / detachment operation device, the amount of pressing of the socket can be reduced, and as a result, the parasitic capacitance and the inductance component of the socket can be reduced.

[Brief description of drawings]

FIG. 1 is each an enlarged partial sectional view showing a main part of an IC auto handler according to an embodiment of the present invention, in which (a) shows a state immediately before mounting and (b) shows a state under inspection.

FIG. 2 is a partially cut front view showing the IC auto handler, where (a) shows a holding state of an IC, (b) shows just before mounting, and (c) shows an inspection.

FIG. 3 is a partially omitted plan view.

FIG. 4 is a partially cut side view of the same.

5 is a bottom view taken along the line VV of FIG.

[Description of sign]

1 ... QFP / IC (inspection object), 2 ... resin encapsulant, 3 ...
Outer leads, 4 ... Test head, 5 ... Parent socket, 6
… Socket, 6a… Terminal (contact), 7… Constant temperature room, 8…
In / out port, 10 ... IC auto handler (inspection device),
11 ... Machine stand, 12 ... Positioning pin, 13 ... Arm, 14
... Air cylinder device, 15 ... Piston rod, 16 ... Beam, 20 ... Attachment / detachment operation device, 21 ... Positioning plate, 22 ...
Positioning tube, 23 ... Guide shaft, 24 ... Holding plate, 25 ... Guide hole, 26 ... Spacer, 27 ... Nut, 28 ... Suspension spring, 29 ... Insertion hole, 30 ... Collet (inspection object holding device), 31 ... Hose connection part, 32 ... Pressing spring, 33 ... Storage hole, 34 ... Pad (elastic member),
35 ... Cap, 36 ... Lead pressing member (pressing member), 37 ... Held part, 38 ... Relief part.

 ─────────────────────────────────────────────────── ─── Continuation of the front page (72) Inventor Hiroyuki Kobayashi 3-3 Fujibashi 2-3, Ome City, Tokyo Inside Hitachi Tokyo Electronics Co., Ltd. (72) Tomiji Suda 3-3 2 Fujibashi, Ome-shi, Tokyo Hitachi Higashi Inside Kyo Electronics Co., Ltd.

Claims (3)

[Claims] 1. A socket for electrically connecting an object to be inspected to a tester, and an attachment / detachment operation device for attaching and detaching the object to be inspected to and from the socket, the object to be inspected attached to the socket by the attachment / detachment operation device. In an inspection device in which an electrical inspection is performed on an object by a tester via a socket, the attachment / detachment operation device positions the holding plate with respect to the socket by being suspended by the holding plate that moves with respect to the socket. A holding plate, and an object-to-be-inspected device holding the object to be inspected is slidably supported by a holding spring while being constantly urged in the socket side direction. Inspection device characterized by. 2. A state in which a holding member for pressing a part of the inspection object against the socket is constantly urged to the outside of the inspection object holding device in the holding plate in the socket side direction by the elastic force of the elastic member. The inspection device according to claim 1, wherein the inspection device is slidably supported by. 3. The inspection device according to claim 1, wherein a plurality of the attachment / detachment operation devices are configured to be simultaneously transferred by a robot.