JPH09237808A - Ｔａｂ用接着剤付きテープおよび半導体接続基板並びに半導体装置 - Google Patents

Ｔａｂ用接着剤付きテープおよび半導体接続基板並びに半導体装置

Info

Publication number
JPH09237808A
JPH09237808A JP8348492A JP34849296A JPH09237808A JP H09237808 A JPH09237808 A JP H09237808A JP 8348492 A JP8348492 A JP 8348492A JP 34849296 A JP34849296 A JP 34849296A JP H09237808 A JPH09237808 A JP H09237808A
Authority
JP
Japan
Prior art keywords
adhesive
tape
tab
semiconductor device
crosslinked polymer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP8348492A
Other languages
English (en)
Japanese (ja)
Other versions
JPH09237808A5 (https=
Inventor
Shoji Kigoshi
将次 木越
Yukitsuna Konishi
幸綱 小西
Hiroshi Hatano
拓 波多野
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toray Industries Inc
Original Assignee
Toray Industries Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toray Industries Inc filed Critical Toray Industries Inc
Priority to JP8348492A priority Critical patent/JPH09237808A/ja
Publication of JPH09237808A publication Critical patent/JPH09237808A/ja
Publication of JPH09237808A5 publication Critical patent/JPH09237808A5/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/701—Tape-automated bond [TAB] connectors

Landscapes

  • Laminated Bodies (AREA)
  • Adhesive Tapes (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Wire Bonding (AREA)
JP8348492A 1995-12-26 1996-12-26 Ｔａｂ用接着剤付きテープおよび半導体接続基板並びに半導体装置 Pending JPH09237808A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP8348492A JPH09237808A (ja) 1995-12-26 1996-12-26 Ｔａｂ用接着剤付きテープおよび半導体接続基板並びに半導体装置

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP33867395 1995-12-26
JP7-338673 1995-12-26
JP8348492A JPH09237808A (ja) 1995-12-26 1996-12-26 Ｔａｂ用接着剤付きテープおよび半導体接続基板並びに半導体装置

Publications (2)

Publication Number Publication Date
JPH09237808A true JPH09237808A (ja) 1997-09-09
JPH09237808A5 JPH09237808A5 (https=) 2004-07-22

Family

ID=26576168

Family Applications (1)

Application Number Title Priority Date Filing Date
JP8348492A Pending JPH09237808A (ja) 1995-12-26 1996-12-26 Ｔａｂ用接着剤付きテープおよび半導体接続基板並びに半導体装置

Country Status (1)

Country Link
JP (1) JPH09237808A (https=)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011042730A (ja) * 2009-08-20 2011-03-03 Hitachi Chem Co Ltd 接着剤組成物、フィルム状接着剤、接着シート及び半導体装置

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011042730A (ja) * 2009-08-20 2011-03-03 Hitachi Chem Co Ltd 接着剤組成物、フィルム状接着剤、接着シート及び半導体装置

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