JPH09229873A - Method and apparatus for detecting abnormality of bite - Google Patents

Method and apparatus for detecting abnormality of bite

Info

Publication number
JPH09229873A
JPH09229873A JP8059997A JP5999796A JPH09229873A JP H09229873 A JPH09229873 A JP H09229873A JP 8059997 A JP8059997 A JP 8059997A JP 5999796 A JP5999796 A JP 5999796A JP H09229873 A JPH09229873 A JP H09229873A
Authority
JP
Japan
Prior art keywords
bite
image
steel pipe
cutting
measurement
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP8059997A
Other languages
Japanese (ja)
Inventor
Yasuyuki Furukawa
恭之 古川
Akihiro Yamada
明弘 山田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nippon Steel Corp
Original Assignee
Sumitomo Metal Industries Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sumitomo Metal Industries Ltd filed Critical Sumitomo Metal Industries Ltd
Priority to JP8059997A priority Critical patent/JPH09229873A/en
Publication of JPH09229873A publication Critical patent/JPH09229873A/en
Pending legal-status Critical Current

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  • Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
  • Machine Tool Sensing Apparatuses (AREA)
  • Image Processing (AREA)
  • Image Analysis (AREA)

Abstract

PROBLEM TO BE SOLVED: To surely detect an abnormal missing or abrasion state of chips in any case. SOLUTION: A CCD camera 5 for photographing a bevel-worked face 1a of a steel pipe 1 and a controller 7 for processing an image obtained by the CCD camera 5 are provided. After the state of a good face and a state of a defective face are converted to be at, for instance, a white level and a black level respectively, an instrumentation window is set, e.g. at the central part within a detected instrumentation screen, ad an area ration of the white level reduced by influences of the black level is calculated. The area ratio is compared with a reference area ratio preliminarily set for the state of the good face. When the deviation is not smaller than a predetermined value, the face is judged to be abnormal by the controller 7.

Description

【発明の詳細な説明】Detailed Description of the Invention

【0001】[0001]

【発明の属する技術分野】本発明は、例えば鋼管を切断
する管切り機等における切削工具であるバイトに取り付
けたチップの欠損や摩耗等の異常を間接的に検出する方
法及びこの方法に適用する装置に関するものである。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention is applied to a method for indirectly detecting abnormalities such as chipping or wear of a chip attached to a cutting tool which is a cutting tool in a pipe cutting machine for cutting a steel pipe and the like. It relates to the device.

【0002】[0002]

【従来の技術】例えば鋼管の製造過程においては、鋼管
を所定の長さに仕上げるための切断装置や、管端部にベ
ベル面を切削加工するために、周方向に回転させた鋼管
にバイトのチップ部分を押し付け、切断及び表面加工す
る装置がある。このような装置においては、自動運転が
行われているために、チップが欠損したり摩耗した場合
には、直ちにその状態を検知し、切断や表面加工を中止
させる必要がある。
2. Description of the Related Art For example, in the process of manufacturing a steel pipe, a cutting device for finishing the steel pipe to a predetermined length, or a steel pipe rotated in the circumferential direction for cutting a beveled surface at the pipe end is provided with a cutting tool. There is a device for pressing, cutting and surface-treating a chip part. In such a device, since automatic operation is performed, when the chip is damaged or worn, it is necessary to immediately detect the state and stop cutting or surface processing.

【0003】そこで、現在では、チップの欠損や摩耗を
検知する方法として、チップ欠損時に発生する弾性波
(超音波)をエコースティックエミッション(AE)セ
ンサーによって検出する方法や、チップ欠損時に発生
する振動を振動センサーによって検出する方法や、ロ
ードセルによって切削抵抗の増加を検出する方法や、
バイト送り用の油圧シリンダの背圧の変化率の増加を検
出する方法、等が実施されている。
Therefore, at present, as a method of detecting chipping or wear of a chip, a method of detecting an elastic wave (ultrasonic wave) generated when the chip is broken by an echo stick emission (AE) sensor, or a vibration generated when the chip is broken. The vibration sensor, the load cell to detect an increase in cutting resistance,
A method of detecting an increase in the rate of change of the back pressure of a hydraulic cylinder for feeding the bite has been implemented.

【0004】[0004]

【発明が解決しようとする課題】しかしながら、上記し
たやの方法では、正常な切削時に被切削物の塑性変
形域から発生する信号と、チップ欠損時等に発生する信
号との出力差が小さく、欠損の有無等を判定するための
比較基準値を正確に設定できないという問題がある。
However, in the above-mentioned method, the output difference between the signal generated from the plastic deformation area of the object to be cut at the time of normal cutting and the signal generated at the time of chip loss is small, There is a problem that a comparison reference value for determining the presence or absence of a defect cannot be set accurately.

【0005】また、の方法では、バイトの送り機構中
にロードセルを組み込む必要があるので、装置構成が複
雑になるという問題がある。さらに、の方法では、継
目無し鋼管製造用ビレットの下穴加工の様に、切削中の
切削面積が増加して切削抵抗が増加し、背圧が減少する
様な加工に適用する場合には有効であるが、鋼管の切削
加工の様に、切削中の切削面積が一定で背圧変化がない
ような場合には、チップの欠損等を検出するのが困難で
ある。
In addition, the method (1) has a problem that the device configuration becomes complicated because it is necessary to incorporate the load cell in the bite feeding mechanism. Furthermore, the method is effective when applied to the processing such as the pilot hole drilling for seamless steel pipe manufacturing, in which the cutting area during cutting increases the cutting resistance and the back pressure decreases. However, when the cutting area during cutting is constant and there is no change in back pressure as in the case of cutting steel pipes, it is difficult to detect chipping of the chip.

【0006】本発明は、上記した従来の問題点に鑑みて
なされたものであり、どのような場合でも、確実にチッ
プの欠損や摩耗状態の異常を検出できるバイト異常検出
方法及びこの方法に適用する装置を提供することを目的
としている。
The present invention has been made in view of the above-mentioned conventional problems, and is applied to a bite abnormality detecting method and a method for surely detecting a chip defect or wear state abnormality in any case. The purpose of the present invention is to provide a device.

【0007】[0007]

【課題を解決するための手段】上記した目的を達成する
ために、本発明は、バイトによる切削終了部分をカメラ
で撮像し、その映像をコントローラで画像処理して二値
化変換した後、二値化変換後の計測画面内に計測ウイン
ドウを設け、計測ウインドウ内における輝度の低い点又
は高い点を面積として集計し、この集計値と、予め基準
としている正常値を比較することとしている。そして、
この比較によりその偏差が一定量以上となる場合には、
バイト異常と判断する。
In order to achieve the above-mentioned object, according to the present invention, after a cutting end portion by a cutting tool is imaged by a camera, the image is processed by a controller and binarized and converted, A measurement window is provided in the measurement screen after the binarization conversion, and points with low or high brightness in the measurement window are aggregated as an area, and this aggregated value is compared with a normal value that is a reference in advance. And
If the deviation exceeds a certain amount by this comparison,
Judge that it is a byte error.

【0008】[0008]

【発明の実施の形態】本発明のバイト異常検出方法は、
バイトによる切削終了部分に例えばハロゲン光を照射
し、この照射部分を例えばCCDカメラで撮像した後、
その映像を画像処理し二値化変換して二値化変換後の計
測画面内に計測ウインドウを設け、その後、この計測ウ
インドウ内における例えば輝度の低い点を面積として集
計し、この集計値と、予め基準としている正常値を比較
するのである。
BEST MODE FOR CARRYING OUT THE INVENTION
After irradiating, for example, a halogen light on the cutting end portion by the cutting tool and imaging the irradiated portion with, for example, a CCD camera,
A measurement window is provided in the measurement screen after binarizing the image by image processing and binarizing the image, and then, for example, a point having a low brightness in the measurement window is aggregated as an area, and the aggregated value, The normal value which is the reference in advance is compared.

【0009】また、本発明のバイト異常検出装置は、例
えばバイトによる切削終了部分を照射するハロゲン光源
と、このハロゲン光源による照射部分を撮像する例えば
CCDカメラと、このCCDカメラによる映像を画像処
理して二値化変換した後、その計測画面内に設けた計測
ウインドウ内の例えば輝度の低い点を面積として集計
し、この集計値と、予め基準としている正常値を比較処
理するコントローラを備えているのである。
Further, the bite abnormality detecting device of the present invention, for example, a halogen light source for irradiating a cutting end portion by a bite, a CCD camera for imaging the irradiation portion by the halogen light source, and an image processing of an image by this CCD camera. After binarizing and converting it, the controller is equipped with a controller that totalizes, for example, points with low brightness in the measurement window provided in the measurement screen as an area, and compares the aggregated value with a normal value that is a reference in advance. Of.

【0010】このように構成したバイト異常検出装置で
は、CCDカメラにより撮像されたバイトによる切削終
了部分を画像処理によって、例えば良品面性状を白レベ
ル、不良品面性状を黒レベルに二値化変換した後、検出
したその計測画面内の例えば中央部に計測ウインドウを
設定し、黒レベルの影響で減少する白レベルの占める面
積又は面積比(以下、この値を「特徴量」という。)を
算出する。そして、この特徴量を、予め基準として設定
している良品面性状の特徴量と比較し、その偏差が所定
量以上となる場合に異常と判断し、例えばアラームを出
力してバイトの交換を促する。
In the bite anomaly detecting apparatus having the above-mentioned structure, the cutting end portion of the bite imaged by the CCD camera is image-processed, and for example, the good product surface texture is binarized into the white level and the defective product surface texture into the black level. After that, a measurement window is set in, for example, the central portion of the detected measurement screen, and the area or area ratio occupied by the white level that is reduced by the influence of the black level (hereinafter, this value is referred to as "feature amount") is calculated. To do. Then, this feature amount is compared with the feature amount of the good quality surface property set as a reference in advance, and when the deviation is equal to or more than a predetermined amount, it is determined to be abnormal, and for example, an alarm is output to prompt the exchange of the tool. To do.

【0011】[0011]

【実施例】以下、本発明のバイト異常検出装置を添付図
面に示す一実施例に基づいて説明し、この本発明のバイ
ト異常検出装置を用いてバイトの異常を検出する方法に
及ぶ。図1は鋼管ベベル切削装置に適用した場合の本発
明のバイト異常検出装置の制御ブロック図、図2(a)
は鋼管ベベル切削装置の概略平面図、(b)は鋼管ベベ
ル加工面における測定視野の説明図、図3(a)は本発
明方法による基準とすべき良品ベベル加工面の計測生画
像の説明図、(b)は同じく二値化画像の説明図、図4
は設定表示画面の説明図、図5は本発明方法による計測
画面の説明図で、(a)は正常なベベル加工面の場合、
(b)は異常なベベル加工面の場合を示す図、図6は鋼
管のベベル加工面性状の説明図で、(a)はベベル加工
面切削中に切粉がチップ内に噛み込んでスリ疵を発生し
たもの、(b)はバイトのセット不良や鋼管の回転速度
不良等の操業条件不良により発生した疵、(c)はベベ
ル加工面切削中にチップが欠損して未切削部が発生した
場合、図7〜図9は夫々図6の(a)〜(c)を検出し
た場合の画像を示したもので、夫々(a)は生画像、
(b)は二値化画像、(c)は計測画面を示す図、図1
0(a)〜(c)は正常なベベル加工面の場合の図7〜
図9の(a)〜(c)と同様の図である。
DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS A bite abnormality detecting device of the present invention will be described below with reference to an embodiment shown in the accompanying drawings, and covers a method of detecting an abnormality of a bite using the bite abnormality detecting device of the present invention. FIG. 1 is a control block diagram of the bite abnormality detection device of the present invention when applied to a steel pipe bevel cutting device, FIG.
Is a schematic plan view of a steel pipe bevel cutting device, (b) is an explanatory view of a measurement field of view on a steel pipe bevel processing surface, and FIG. 3 (a) is an explanatory view of a measurement raw image of a non-defective bevel processing surface to be a reference according to the method of the present invention. , (B) are explanatory views of a binarized image, FIG.
Is an explanatory view of a setting display screen, FIG. 5 is an explanatory view of a measurement screen by the method of the present invention, and (a) is a normal beveled surface,
6B is a diagram showing a case of an abnormally beveled surface, FIG. 6 is an explanatory view of a beveled surface property of a steel pipe, and FIG. 6A is a scratch caused by chips being caught in a chip during cutting of the beveled surface. (B) Defects caused by defective operating conditions such as defective bit setting and defective rotation speed of the steel pipe. (C) Chips were missing during cutting of the beveled surface, resulting in uncut parts. In this case, FIGS. 7 to 9 show images when detecting (a) to (c) of FIG. 6, respectively, where (a) is a raw image,
1B is a binarized image, FIG. 1C is a diagram showing a measurement screen, and FIG.
0 (a) to (c) are the results shown in FIG.
It is a figure similar to (a)-(c) of FIG.

【0012】図1及び図2において、1は鋼管ベベル切
削装置のベベル加工用バイトに取り付けられたチップ2
によってその端面をベベル加工される鋼管であり、本発
明はこのような鋼管ベベル切削装置のチップ2の欠損や
摩耗等の異常を検出する装置であり、以下のような構成
である。なお、図1及び図2中の10は鋼管切断用の突
切りバイトを示す。
In FIGS. 1 and 2, reference numeral 1 is a tip 2 attached to a beveling tool of a steel pipe bevel cutting device.
The present invention is a steel pipe whose end surface is beveled by the present invention. The present invention is a device for detecting abnormality such as chipping or wear of the tip 2 of such a steel pipe bevel cutting device, and has the following configuration. In addition, 10 in FIGS. 1 and 2 indicates a parting tool for cutting the steel pipe.

【0013】3は鋼管1のチップ2によるベベル加工終
了部分を照射すべく、例えば鋼管端部のベベル加工面1
aの前方上方に配置されたハロゲンランプ、4はこのハ
ロゲンランプ3を照射させる光源装置である。また、5
は前記ハロゲンランプ3によって照射された鋼管端部の
ベベル加工面1a〔図2(b)中に長方形で囲んだ部
分〕を撮像すべく、ベベル加工面1aの前方における例
えば20〜30°上側に配置されたCCDカメラであ
る。
Reference numeral 3 denotes a beveled surface 1 at the end of the steel pipe, for example, to irradiate the end portion of the beveling by the tip 2 of the steel pipe 1.
A halogen lamp 4 arranged in the upper front of a is a light source device for irradiating the halogen lamp 3. Also, 5
Is an image of the beveled surface 1a of the steel pipe end illuminated by the halogen lamp 3 [the portion surrounded by a rectangle in FIG. 2 (b)]. It is a CCD camera arranged.

【0014】そして、このCCDカメラ5による映像
は、例えば画像メモリ6を経てコントローラ7に送信さ
れる。コントローラ7では、この画像メモリ6を経て送
信されてきた映像を画像処理して良品面性状を白レベル
に、また、不良品面性状を黒レベルに二値化変換し、こ
の二値化変換した画像に基づいて以下に説明するように
してチップ2の摩耗等の異常を検出する。
The image captured by the CCD camera 5 is transmitted to the controller 7 via the image memory 6, for example. In the controller 7, the image transmitted through the image memory 6 is subjected to image processing to binarize the good product surface quality to a white level and the bad product surface property to a black level, and perform this binarization conversion. Abnormalities such as wear of the tip 2 are detected based on the image as described below.

【0015】先ず、図3に示すように、予め基準とすべ
き良品レベルのベベル加工面1aをCCDカメラ5で撮
像し、得られた生画像〔図3(a)参照〕をコントロー
ラ7で二値化画像〔図3(b)参照〕に変換しておく。
そして、この変換した二値化画像に、図4に示すよう
に、計測ウインドウ8を描き、ソフトウェア処理によっ
て計測ウインドウ8内の白レベルが占める例えば面積比
(特徴量)を求め、この特徴量を基準特徴量ASとして
コントローラ7内の演算比較部に登録しておく。
First, as shown in FIG. 3, a bevel processed surface 1a of a non-defective level to be used as a reference is imaged by a CCD camera 5, and the obtained raw image [see FIG. It is converted into a binarized image [see FIG. 3 (b)].
Then, a measurement window 8 is drawn on the converted binarized image as shown in FIG. 4, and for example, an area ratio (feature amount) occupied by the white level in the measurement window 8 is obtained by software processing, and this feature amount is calculated. The reference feature amount AS is registered in the arithmetic comparison unit in the controller 7.

【0016】さらに、このコントローラ7内の演算比較
部には、前記基準特徴量ASを100%とし、その値に
対して下限値係数を%の単位で設定し、登録しておく。
そして、このような状態下において、実際のベベル加工
面1aをCCDカメラ5で撮像し、得られた生画像をコ
ントローラ7で二値化画像に変換した後、この変換した
二値化画像に計測ウインドウ8を描き、前記したのと同
様に特徴量ARを求め、この特徴量ARを前記基準特徴
量ASと比較するのである。比較した結果は、例えばモ
ニター9の画面上に“OK”又は“NG”と表示され、
NGの場合にはアラームを出力する。図5に計測画面に
おけるベベル加工面1aの正常時〔(a)図〕と、異常
時〔(b)図〕の場合の表示例を示す。
Further, the reference characteristic amount AS is set to 100%, and the lower limit coefficient is set and registered in the unit of% with respect to the value in the arithmetic comparison unit in the controller 7.
Then, under such a state, the actual bevel processed surface 1a is imaged by the CCD camera 5, the obtained raw image is converted into a binary image by the controller 7, and then the converted binary image is measured. The window 8 is drawn, the characteristic amount AR is obtained in the same manner as described above, and the characteristic amount AR is compared with the reference characteristic amount AS. The comparison result is displayed as “OK” or “NG” on the screen of the monitor 9,
In case of NG, an alarm is output. FIG. 5 shows a display example on the measurement screen when the beveled surface 1a is normal [(a) figure] and when it is abnormal [(b) figure].

【0017】本発明は上記したように、例えば鋼管1の
ベベル加工面1aをCCDカメラ5で撮像し、その映像
をコントローラ7で画像処理して白レベルと黒レベルの
二値化に変換した後、二値化変換後の計測画面内に計測
ウインドウ8を設け、計測ウインドウ8内における特徴
量ARと、予め基準としている基準特徴量ASを比較
し、その偏差が一定量以上となる場合には、バイト異常
と判断するものである。
According to the present invention, as described above, for example, the beveled surface 1a of the steel pipe 1 is imaged by the CCD camera 5, and the image is processed by the controller 7 to be converted into the binarization of the white level and the black level. The measurement window 8 is provided in the measurement screen after the binarization conversion, the feature amount AR in the measurement window 8 is compared with the reference feature amount AS that is a reference in advance, and when the deviation is a certain amount or more, It is determined that the bite is abnormal.

【0018】次に、本発明により実際のベベル加工面を
計測した結果を図7〜図10に示す。図7は図6(a)
に示すように、切削中に切粉がチップ内に噛み込んでベ
ベル加工面1aにスリ疵1b’を発生したものを、図8
は図6(b)に示すように、バイトのセット不良や鋼管
の回転速度不良等の操業条件不良によりベベル加工面1
aに疵1bが発生したものを、図9は図6(c)に示す
ように、切削中にチップ2が欠損してベベル加工面1a
に未切削部1cが発生したものを、図10は正常なベベ
ル加工面を示し、それぞれ(a)図は生画面、(b)図
は二値化画面、(c)図は計測画面を示す。
Next, FIGS. 7 to 10 show the results of measuring the actual beveled surface according to the present invention. FIG. 7 shows FIG. 6 (a).
As shown in FIG. 8, a chip in which chips are caught in the chip during cutting to cause a scratch 1b ′ on the beveled surface 1a is shown in FIG.
As shown in FIG. 6 (b), the beveled surface 1 is caused by defective operating conditions such as defective setting of the bite and defective rotation speed of the steel pipe.
As shown in FIG. 6 (c), when the flaw 1b is generated in a, the chip 2 is damaged during cutting and the beveled surface 1a is cut.
FIG. 10 shows a normal beveled surface, in which the uncut portion 1c has occurred, in which (a) is a raw screen, (b) is a binarization screen, and (c) is a measurement screen. .

【0019】ベベル加工面1aに図6(a)〜(c)に
示すようなスリ疵1b’,疵1bや未切削部1cが発生
した場合には、図10(c)に示す正常なベベル加工面
1aにおける計測画面と比較して、図7〜図9の(c)
に示すように、計測ウインドウ8内における黒レベル
(不良部分)の占める面積比が多くなって、白レベル
(正常部分)の占める面積比すなわち特徴量が少なくな
るのが判る〔図7〜図10の(a)〜(c)に対応する
参考写真を参考写真1〜参考写真4の(a)〜(c)と
して添付する〕。
When the beveled surface 1a has scratches 1b ', flaws 1b and uncut portions 1c as shown in FIGS. 6 (a) to 6 (c), the normal bevel shown in FIG. 10 (c) is obtained. Compared with the measurement screen on the processed surface 1a, (c) of FIGS.
As shown in FIG. 7, it is understood that the area ratio occupied by the black level (defective portion) in the measurement window 8 increases and the area ratio occupied by the white level (normal portion), that is, the feature amount decreases [FIGS. Reference photographs corresponding to (a) to (c) of No. 1 are attached as (a) to (c) of reference photographs 1 to 4].

【0020】なお、本実施例ではベベル加工面1aにハ
ロゲン光を照射してCCDカメラ5で撮像したものを開
示したが、カメラによる撮像が良好に行えるのであれ
ば、特に照明は必要ではない。またカメラもCCDカメ
ラに限らない。
Although the beveled surface 1a is irradiated with halogen light and imaged by the CCD camera 5 in the present embodiment, no particular illumination is required as long as the image can be captured well by the camera. Also, the camera is not limited to the CCD camera.

【0021】[0021]

【発明の効果】以上説明したように、本発明によれば、
チップの欠損や損耗等によるバイトの異常を早期にしか
も高精度に検出できる。従って、チップの再使用率が向
上するとともに、鋼管端部のベベル加工面性状の不良発
生を可及的に防止でき、品質の向上が図れる。
As described above, according to the present invention,
Abnormalities of the bite due to chip loss or wear can be detected early and with high accuracy. Therefore, the reuse rate of the tip can be improved, and the occurrence of defects in the beveled surface property of the steel pipe end can be prevented as much as possible, and the quality can be improved.

【図面の簡単な説明】[Brief description of drawings]

【図1】鋼管ベベル切削装置に適用した場合の本発明の
バイト異常検出装置の制御ブロック図である。
FIG. 1 is a control block diagram of a bite abnormality detection device of the present invention when applied to a steel pipe bevel cutting device.

【図2】(a)は鋼管ベベル切削装置の概略平面図、
(b)は鋼管ベベル加工面における測定視野の説明図で
ある。
2A is a schematic plan view of a steel pipe bevel cutting device, FIG.
(B) is explanatory drawing of the measurement visual field in the beveling surface of a steel pipe.

【図3】(a)は本発明方法による基準とすべき良品ベ
ベル加工面の計測生画像の説明図、(b)は同じく二値
化画像の説明図である。
3A is an explanatory diagram of a measurement raw image of a non-defective bevel processed surface to be used as a reference according to the method of the present invention, and FIG. 3B is an explanatory diagram of a binarized image of the same.

【図4】設定表示画面の説明図である。FIG. 4 is an explanatory diagram of a setting display screen.

【図5】本発明方法による計測画面の説明図で、(a)
は正常なベベル加工面の場合、(b)は異常なベベル加
工面の場合を示す図である。
FIG. 5 is an explanatory diagram of a measurement screen according to the method of the present invention, (a)
FIG. 3B is a diagram showing a normal bevel processed surface, and FIG. 7B is a diagram showing an abnormal bevel processed surface.

【図6】鋼管のベベル加工面性状の説明図で、(a)は
ベベル加工面切削中に切粉がチップ内に噛み込んでスリ
疵を発生したもの、(b)はバイトのセット不良や鋼管
の回転速度不良等の操業条件不良により発生した疵、
(c)はベベル加工面切削中にチップが欠損して未切削
部が発生した場合を示す。
FIG. 6 is an explanatory view of the beveled surface properties of a steel pipe, where (a) shows chips that were caught in the chip during cutting of the beveled surface and caused scratches, and (b) shows a bite setting failure and Defects caused by poor operating conditions such as poor rotation speed of steel pipes,
(C) shows a case where a chip is missing and an uncut portion is generated during cutting of a beveled surface.

【図7】図6(a)に示す疵を検出した場合の画像を示
したもので、(a)は生画像、(b)は二値化画像、
(c)は計測画面を示す。
7A and 7B show images when the flaw shown in FIG. 6A is detected, where FIG. 7A is a raw image and FIG. 6B is a binarized image.
(C) shows a measurement screen.

【図8】図6(b)に示す疵を検出した場合の画像を示
したもので、(a)は生画像、(b)は二値化画像、
(c)は計測画面を示す。
8A and 8B show images when the flaw shown in FIG. 6B is detected, where FIG. 8A is a raw image and FIG. 8B is a binarized image.
(C) shows a measurement screen.

【図9】図6(c)に示す疵を検出した場合の画像を示
したもので、(a)は生画像、(b)は二値化画像、
(c)は計測画面を示す。
9A and 9B show images when the flaw shown in FIG. 6C is detected, where FIG. 9A is a raw image, and FIG. 9B is a binarized image.
(C) shows a measurement screen.

【図10】正常なベベル加工面の場合の画像を示したも
ので、(a)は生画像、(b)は二値化画像、(c)は
計測画面を示す。
10A and 10B show images of a normal beveled surface, FIG. 10A shows a raw image, FIG. 10B shows a binarized image, and FIG. 10C shows a measurement screen.

【符号の説明】[Explanation of symbols]

1 鋼管 1a ベベル加工面 2 チップ 5 CCDカメラ 7 コントローラ 8 計測ウインドウ 1 Steel pipe 1a Beveled surface 2 Chip 5 CCD camera 7 Controller 8 Measurement window

Claims (2)

【特許請求の範囲】[Claims] 【請求項1】 バイトの異常を検出する方法であって、
バイトによる切削終了部分を撮像した後、その映像を画
像処理し二値化変換して二値化変換後の計測画面内に計
測ウインドウを設け、その後、この計測ウインドウ内に
おける輝度の低い点又は高い点を面積として集計し、こ
の集計値と、予め基準としている正常値を比較すること
を特徴とするバイト異常検出方法。
1. A method for detecting an abnormality in a bite, comprising:
After imaging the cutting end part with the bite, image processing the image and binarizing and converting it to provide a measurement window in the measurement screen after the binarization, and then the point of low brightness or high brightness in this measurement window A method for detecting a bite abnormality, which is characterized by totalizing points as an area and comparing the total value with a normal value that is a reference in advance.
【請求項2】 請求項1記載のバイト異常検出方法に適
用する装置であって、バイトによる切削終了部分を撮像
するカメラと、このカメラによる映像を画像処理して二
値化変換した後、その計測画面内に設けた計測ウインド
ウ内の輝度の低い点又は高い点を面積として集計し、こ
の集計値と、予め基準としている正常値を比較処理する
コントローラを備えたことを特徴とするバイト異常検出
装置。
2. An apparatus applied to the bite abnormality detection method according to claim 1, wherein a camera for picking up a cutting end portion by a bite, and an image processed by the camera are binarized and converted. Byte anomaly detection characterized by including a controller that aggregates low or high brightness points in a measurement window provided in the measurement screen as an area and compares this total value with a normal value that is a reference in advance. apparatus.
JP8059997A 1996-02-21 1996-02-21 Method and apparatus for detecting abnormality of bite Pending JPH09229873A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP8059997A JPH09229873A (en) 1996-02-21 1996-02-21 Method and apparatus for detecting abnormality of bite

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP8059997A JPH09229873A (en) 1996-02-21 1996-02-21 Method and apparatus for detecting abnormality of bite

Publications (1)

Publication Number Publication Date
JPH09229873A true JPH09229873A (en) 1997-09-05

Family

ID=13129326

Family Applications (1)

Application Number Title Priority Date Filing Date
JP8059997A Pending JPH09229873A (en) 1996-02-21 1996-02-21 Method and apparatus for detecting abnormality of bite

Country Status (1)

Country Link
JP (1) JPH09229873A (en)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102152164A (en) * 2010-02-05 2011-08-17 新明和工业株式会社 Isolator switching device
JP2011206899A (en) * 2010-03-30 2011-10-20 Institute Of Physical & Chemical Research Machining device and method for driving the same
JP2012047454A (en) * 2010-08-24 2012-03-08 Ihi Corp Method and device for inspecting pipe end beveling processed part
JP2013162000A (en) * 2012-02-07 2013-08-19 Disco Abrasive Syst Ltd Tool cutting device
CN104385059A (en) * 2014-09-12 2015-03-04 浙江海洋学院 Knife face abrasion detecting method and device

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102152164A (en) * 2010-02-05 2011-08-17 新明和工业株式会社 Isolator switching device
JP2011161531A (en) * 2010-02-05 2011-08-25 Shinmaywa Industries Ltd Opening/closing device of safety cover
JP2011206899A (en) * 2010-03-30 2011-10-20 Institute Of Physical & Chemical Research Machining device and method for driving the same
JP2012047454A (en) * 2010-08-24 2012-03-08 Ihi Corp Method and device for inspecting pipe end beveling processed part
JP2013162000A (en) * 2012-02-07 2013-08-19 Disco Abrasive Syst Ltd Tool cutting device
CN104385059A (en) * 2014-09-12 2015-03-04 浙江海洋学院 Knife face abrasion detecting method and device

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