JPH0922840A - Method and apparatus for forming outer electrode of electronic component - Google Patents

Abstract

PROBLEM TO BE SOLVED: To protect a chip component from the fall-off from a component holder by a method wherein a pasted surface is separated from the chip component while the chip component is supported by a support means and, when the pasted surface is completely separated from the chip component, the chip component is released from the support by the support means. SOLUTION: A base plate 1 is elevated with a support unit 2 and the upper surface of the base plate 1 is pressed against the end part of a chip component C which is held by a component holding plate. After that, while the support unit 2 is left at a pressing position, the base plate 1 only is made to descend and, when the base plate 1 is completely separated from the end part of the chip component C, the support unit 2 is made to descend and the chip component C is released from the support by support wires 2b. As the upper surface, which is to be a pasted surface, of the base plate 1 is coated with electrode paste P uniformly with a constant thickness, if the base plate 1 and the support unit 2 are made to descend in this order after the pressing, an electrode P' can be applied to the end part of the chip component C with a dimension corresponding to a coating thickness.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method and apparatus for forming external electrodes of electronic parts for forming external electrodes on chip parts.

[0002]

2. Description of the Related Art FIG. 7 shows a conventional external electrode forming apparatus of this type. In FIG. 7, 101 is a paste attaching base, P is an electrode paste, 102 is a component holding plate, and C is a chip component.

The paste attaching base 101 has a flat upper surface, and the electrode paste P is uniformly applied to the upper surface with a constant thickness by a method such as screen printing.

The component holding plate 102 is provided so as to cover a rigid plate having a large number of through holes in a predetermined arrangement and the upper and lower surfaces of the plate and the inside of the through holes, and has a diameter smaller than the through holes at the center position of the through holes. Made of elastic material with holes,
The columnar or prismatic chip component C pushed into the holding hole is elastically held in a vertical posture.

To form external electrodes on the chip component C, the component holding plate 102 is lowered from the state shown in FIG. 7 to press the end portion of the chip component C against the upper surface of the paste adhering base 101, and after pressing, the component holding plate 102. Is carried out by ascending and returning (see FIG. 8). Since the electrode paste P is uniformly applied to the upper surface of the paste adhering base 101 with a constant thickness, if the chip component C is lifted and restored after pressing, the electrode paste P will be dimensioned according to the applied thickness. Can be attached to the end of the.

[0006]

In the above conventional method,
When the chip component C is separated from the paste adhering base 101 after being pressed, a tensile force acts on the chip component C due to the paste viscosity, surface tension, etc.
However, there is a problem in that it comes out of the component holding plate 101.
In order to prevent this, when it is attempted to obtain a component holding force superior to the tensile force on the component holding plate 101 side, the component holding plate 1
It becomes extremely difficult to push the chip component C into the holding hole 01.

The present invention has been made in view of the above problems, and it is an object of the present invention to prevent the chip component from coming out of the component holder when the end of the chip component is separated from the paste adhering surface. An object of the present invention is to provide a method for forming an external electrode of an electronic component and an external electrode forming apparatus suitable for carrying out the method.

[0008]

In order to achieve the above object, the invention of claim 1 relates to an electronic component in which an electrode paste is attached to a predetermined portion of a chip component held by a component holder to form an external electrode. In the external electrode forming method, after the paste attachment surface coated with the electrode paste is pressed against the chip component held by the component holder, the paste attachment surface is separated from the chip component while supporting the chip component by the supporting means, It is characterized in that the support of the chip component by the supporting means is released when the paste adhering surface is completely separated from the chip component.

According to a second aspect of the present invention, there is provided a paste attaching base coated with the electrode paste and a component holder for holding the chip component in a protruding state, and the paste attaching base is pressed against the chip component, thereby the chip In an external electrode forming apparatus for an electronic component, wherein an electrode paste is attached to a predetermined part of a component to form an external electrode, a base plate having a large number of grooves on its surface, and a support wire insertable into the groove And a support having

According to a third aspect of the present invention, there is provided a paste attachment base coated with the electrode paste and a component holder for holding the chip component in a protruding state. In an external electrode forming apparatus for an electronic component, wherein an electrode paste is attached to a predetermined part of a component to form an external electrode, the paste attachment base has a base plate and a large number of through holes that can be placed on the base plate. It is characterized by being composed of a flat plate.

According to a fourth aspect of the present invention, there is provided a paste attachment base coated with an electrode paste and a component holder for holding the chip component in a protruding state, and the paste attachment base is pressed against the chip component, thereby the chip In an external electrode forming apparatus for an electronic component, wherein an electrode paste is attached to a predetermined part of a component to form an external electrode, the paste attachment base is a base plate having a large number of support protrusions on its surface, and the support protrusions can be inserted. It is characterized by comprising a flat plate having a through hole.

[0012]

In the external electrode forming method according to the invention of claim 1,
After pressing the paste attachment surface coated with the electrode paste against the chip component held by the component holder, the paste attachment surface is separated from the chip component while the chip component is supported by the supporting means, and the paste attachment surface is the chip component. By releasing the support of the chip component by the supporting means at a position completely separated from, the electrode paste is attached to a predetermined portion of the chip component to form the external electrode.

In the external electrode forming apparatus according to the second aspect of the present invention, the electrode paste is applied to the surface of the base plate with the support wire of the support inserted in the groove of the base plate, and the base plate is moved together with the support line. The surface of the base plate is pressed against the chip component held by the component holding plate, and the base plate is first separated while leaving the supporting wire in the pressed position after pressing, and it is supported when the base plate is completely separated from the chip component. The method according to claim 1 is carried out by releasing the support of the chip component by the wire.

In the external electrode forming apparatus according to the third aspect of the invention, the electrode paste is applied to the surface of the support plate with the support plate placed on the base plate, and the base plate is moved together with the support plate. The surface is pressed against the chip component held by the component holding plate, and after the pressing, the support plate is left at the pressing position and the base plate is first separated, and when the base plate is completely separated from the chip component, the support plate The method according to claim 1 is carried out by releasing the support of the chip component according to.

In the external electrode forming apparatus according to the fourth aspect of the present invention, the electrode paste is applied to the surface of the flat plate with the projection of the base plate inserted into the through hole of the flat plate such that the upper ends thereof are flush with each other. Then, move the base plate together with the flat plate and press the surface against the chip component held by the component holding plate.After pressing, the support protrusions of the base plate are left in the pressing position, and the flat plate is first separated. The method according to claim 1 is carried out by releasing the support of the chip component by the support protrusion of the base plate when it is completely separated from the chip component.

[0016]

【Example】

[First Embodiment] FIGS. 1 and 2 show a first embodiment of the present invention. FIG. 1 is a perspective view of a base plate and a support body forming a paste attachment base, and FIGS. 2 (a) and 2 (b). FIG. 6 is an explanatory diagram of a paste attaching operation.

The paste adhering base of this embodiment has a base plate 1 having a large number of linear grooves 1a on a flat upper surface at equal intervals, a rectangular frame 2a having an inner shape larger than the upper surface of the base plate, and an inner side of the rectangular frame 2a. A large number of support wires 2b installed at the same intervals as the linear grooves 1a
And a support 2 composed of Straight groove 1a
The width of each support line 2b is slightly larger than the diameter of the support line 2b.
b allows insertion into and removal from the linear groove 1a.
The depth of the linear groove 1a matches the diameter of the support wire 2b, and the upper surface of the base plate 1 and the upper edge of the support wire 2b are flush with each other in the inserted state. Further, both the width and the groove interval of the linear groove 1a are smaller than the end surface shape of the target chip component, and the plurality of linear grooves 1a face the end surface of the chip component.

To form the external electrodes on the chip component, first, the chip component is held by a component holding plate similar to that shown in FIG. 7, and the supporting wire 2b of the support 2 is inserted into the linear groove 1a of the base plate 1. Electrode paste P based on the upper surface of the base plate 1
Is evenly applied with a constant thickness.

Then, as shown in FIG. 2A, the base plate 1
Is raised together with the support body 2 (support wire 2b), and the upper surface of the base plate 1 is pressed against the end portion of the chip component C held by the component holding plate. After the pressing, as shown in FIG. 2B, the base plate 1 is first lowered while the support body 2 (support line 2b) is left in the pressing position, and the base plate 1 is an end portion of the chip component C. The support 2 is lowered when it is completely separated from the support line 2b to release the support of the chip component C.

Since the electrode paste P is uniformly applied with a constant thickness on the upper surface of the base plate 1 which is the paste adhering surface, if the base plate 1 and the support wire 2b are sequentially lowered after pressing,
The electrode paste P ′ can be attached to the end portion of the chip component C with a dimension according to the coating thickness.

As described above, according to this embodiment, after the upper surface of the base plate 1 coated with the electrode paste P is pressed against the end of the chip component C, the chip component C is still supported by the support wire 2b. Since the base plate 1 is separated from the chip component C first, even if a tensile force acts when separating the base plate 1 from the chip component C, the force may cause a positional variation in the chip component C. Therefore, it is possible to reliably prevent the chip component C from slipping out of the component holding plate and favorably form the desired external electrode.

In the above embodiment, the supporting wires and the grooves are arranged in parallel, but the supporting wires arranged in a grid pattern and the groove pattern corresponding to the supporting wires have the same effect. Obtainable. Further, although the one in which the electrode paste is adhered to the longitudinal end portion of the chip component is illustrated, the same effect can be obtained when the holding direction is changed to the chip component and the electrode paste is adhered to the side surface or the like.

[Second Embodiment] FIGS. 3 and 4 show a second embodiment of the present invention. FIG. 3 is a perspective view of a base plate and a support plate constituting a paste adhering base, FIG. 4 (a). (B) is an explanatory view of the paste attaching operation.

The paste adhering base of this embodiment is composed of a base plate 11 having a flat upper surface and a supporting plate 12 having a large number of rectangular through holes 12a arranged in a predetermined arrangement. Both the diameter and the hole interval of the through holes 12a are smaller than the end face shape of the target chip component, and the plurality of through holes 12a face each other on the end face of the chip component.

In forming the external electrodes on the chip component, first, the chip component is held by a component holding plate similar to that shown in FIG. 7, and the supporting plate 12 is placed on the upper surface of the base plate 11 to support the supporting plate 12. The electrode paste P is uniformly applied to the upper surface with a constant thickness.

Then, as shown in FIG. 4A, the base plate 1
1 is raised together with the support plate 12, and the upper surface of the support plate 12 is pressed against the end of the chip component C held by the component holding plate. After the pressing, as shown in FIG.
The base plate 11 is first lowered while leaving 2 in the pressed position, and when the base plate 11 is completely separated from the end of the chip component C, the support plate 12 is lowered to move the chip component C by the support plate 12. Release support.

Since the electrode paste P is uniformly applied to the upper surface of the support plate 12 serving as a paste adhering surface with a constant thickness, if the base plate 11 and the support plate 12 are lowered in order after pressing, the applied thickness will be reduced. The electrode paste P ′ can be attached to the end portion of the chip component C with a dimension according to the above.

As described above, according to this embodiment, the upper surface of the support plate 12 coated with the electrode paste P is pressed against the end of the chip component C, and then the support plate 12 is used to push the chip component C.
Since the base plate 11 is first separated from the chip part C while supporting the base plate, even if a pulling force acts when separating the base plate 11 from the chip part C, the position of the chip part C is changed by the force. It is possible to reliably prevent the chip component C from slipping out of the component holding plate without causing any trouble, and it is possible to favorably form the desired external electrode.

In the above embodiment, the through hole having the rectangular cross section is formed in the support plate, but the cross sectional shape of the through hole may be a polygon other than the rectangle, a circle, an ellipse or the like. Further, although the one in which the electrode paste is adhered to the longitudinal end portion of the chip component is illustrated, the same effect can be obtained when the holding direction is changed to the chip component and the electrode paste is adhered to the side surface or the like.

[Third Embodiment] FIGS. 5 and 6 show a third embodiment of the present invention. FIG. 5 is a perspective view of a base plate and a flat plate constituting a paste adhering base, and FIG. b) is an explanatory view of the paste attaching operation.

In the paste adhering base of this embodiment, a base plate 21 having a large number of cylindrical support protrusions 21a in a predetermined arrangement on a flat upper surface and a large number of circular through holes 22a into which the support protrusions 21a can be inserted are the same. It is composed of a flat plate 22 having a constant thickness in an array. The diameter of the support protrusion 21a is smaller than the end surface shape of the target chip component, and each support protrusion 21a faces the center of each chip component held by the component holding plate.

To form the external electrodes on the chip component, first, the chip component is held on the component holding plate similar to that shown in FIG. 7, and the supporting projection 21 of the base plate 21 is inserted into the through hole 22a of the flat plate 22.
The electrode paste P is uniformly applied with a constant thickness with the upper surface of the flat plate 22 as a reference in a state where a is inserted so that its upper end is flush.

Then, as shown in FIG. 6A, the base plate 2
1 is raised together with the flat plate 22, and the upper surface of the flat plate 22 is pressed against the end of the chip component C held by the component holding plate.
After the pressing, as shown in FIG. 6B, the flat plate 22 is lowered first while the supporting protrusions 21a of the base plate 21 are left in the pressing position, and the flat plate 22 is completely moved from the end of the chip component C. At a distance, the base plate 21 is lowered to release the support of the chip component C by the support protrusions 21a.

Since the electrode paste P is uniformly applied with a constant thickness on the upper surface of the flat plate 22 serving as the paste adhering surface,
If the flat plate 22 and the base plate 21 are sequentially lowered after the pressing, the electrode paste P ′ can be attached to the end portion of the chip component C with a dimension according to the coating thickness.

As described above, according to this embodiment, after the upper surface of the flat plate 22 coated with the electrode paste P is pressed against the end of the chip component C, the flat plate is held while the chip protrusion C is supported by the supporting protrusions 21a. Since 22 is separated from the chip component C first, even if a tensile force acts when separating the flat plate 22 from the chip component C, the chip component C does not change its position by the force, and Part C
It is possible to reliably prevent the metal from coming off from the component holding plate, and it is possible to favorably form the desired external electrode.

In the above embodiment, the columnar support protrusions are formed on the base plate and the circular through holes are formed on the flat plate. However, the cross-sectional shapes of the support protrusions and the through holes are polygonal or elliptical other than circular. May be In addition, the support protrusion has a sharp shape,
For example, it may be formed in a conical shape, a pyramid shape, a needle shape, or the like. In this case, at least three supporting protrusions may be brought into contact with the end surface of the chip component in order to stably support the chip component. Further, although the example in which the electrode paste is attached to the end portion in the longitudinal direction of the chip component is illustrated, the same effect can be obtained when the holding direction is changed to the chip component and the electrode paste is attached to the side surface or the like.

[0037]

As described above in detail, according to the external electrode forming method of the first aspect of the present invention, even if a pulling force acts when separating the paste-adhered surface from the chip component, the chip force is exerted by the force. There is no position change in the parts,
It is possible to reliably prevent the chip component from slipping out of the component holding plate and favorably perform the desired external electrode formation.

According to the external electrode forming apparatus of the second to fourth aspects of the present invention, the method according to the first aspect can be accurately performed by using the base plate, the support plate, and the like that form the paste attachment base.

[Brief description of drawings]

FIG. 1 is a perspective view of a base plate and a support body according to a first embodiment of the present invention.

FIG. 2 is an explanatory diagram of a paste attaching operation in the first embodiment.

FIG. 3 is a perspective view of a base plate and a support plate according to a second embodiment of the present invention.

FIG. 4 is an explanatory view of a paste attaching operation in the second embodiment.

FIG. 5 is a perspective view of a base plate and a flat plate according to a third embodiment of the present invention.

FIG. 6 is an explanatory view of a paste attaching operation in the third embodiment.

FIG. 7 is a view showing a conventional external electrode forming device.

FIG. 8 is an explanatory diagram of a conventional paste attaching operation.

[Explanation of symbols]

DESCRIPTION OF SYMBOLS 1 ... Base plate, 1a ... Groove, 2 ... Support body, 2a ... Frame, 2b ... Support wire, C ... Chip component, P ... Electrode paste, P '... Adhesive paste, 11 ... Base plate, 12 ... Support plate, 12a ... through hole, 21 ... base plate, 21a ... support protrusion, 22 ... flat plate, 22
a ... through hole.

Claims (4)

[Claims] 1. A method for forming an external electrode of an electronic component, wherein an electrode paste is attached to a predetermined portion of a chip component held by a component holder to form an external electrode. After pressing against the chip component held by the tool, the paste adhering surface is separated from the chip component while supporting the chip component by the supporting means, and when the paste adhering surface is completely separated from the chip component, A method of forming an external electrode of an electronic component, the method comprising: releasing support. 2. A paste attachment base to which an electrode paste is applied and a component holder for holding the chip component in a protruding state are provided, and the paste attachment base is pressed against the chip component so that a predetermined portion of the chip component is held. In an external electrode forming apparatus for an electronic component, which forms an external electrode by adhering an electrode paste, the paste attaching base comprises a base plate having a large number of grooves on its surface, and a support having a supporting wire insertable into the grooves. An external electrode forming device for an electronic component, comprising: 3. A paste attachment base coated with an electrode paste and a component holder for holding the chip component in a protruding state, and by pressing the paste attachment base against the chip component, a predetermined portion of the chip component is held. In an external electrode forming apparatus for an electronic component, wherein an electrode paste is adhered to form an external electrode, the paste adhering base is composed of a base plate and a flat plate having a large number of through holes mountable on the base plate. An external electrode forming device for electronic parts, characterized in that 4. A paste attachment base coated with an electrode paste and a component holder for holding the chip component in a protruding state, and by pressing the paste attachment base against the chip component, a predetermined portion of the chip component is held. An external electrode forming apparatus for an electronic component, wherein an electrode paste is attached to form an external electrode, wherein the paste attachment base is a flat plate having a base plate having a large number of supporting protrusions on its surface, and a through hole into which the supporting protrusions can be inserted. An external electrode forming apparatus for an electronic component, comprising: