JPH02158118A - Supporting plate for chip parts - Google Patents

Abstract

PURPOSE:To enable an external electrode to be given precisely by providing characteristics that the main face of a seat material is recessed form the main face of a plate for attraction by magnetism. CONSTITUTION:The supporting plate 10 of a chip parts includes laminated structure composed of a sheet material 12 consisting of elastic member and plates 14 for attraction by magnetic force consisting of material which is iron alloy having flexibility and capable of attraction by a magnetic force. And, the main face of the sheet material 12 is so made as to be recessed from the main face of the plate 14 for attraction by magnetic force. In the longitudinal direction and lateral direction of this sheet material 12, plural through holes 16 are formed, respectively. The inside diameter of the cross section of the through hole 16 is formed in almost the same or a little smaller square shape as or than the outside shape of a chip part. This way, in the plate 14, a round through hole 17, which is larger than the inside diameter of the through hole 16, is opened in correspondence with the through hole 16 at every position of plural through holes of the sheet member 12, and this surrounds the square through hole 16. The plate 14 is used for supporting the supporting plate 10 by the magnetic force of a magnet plate 38.

Description

[Detailed Description of the Invention] [Industrial Application Field] The present invention relates to a holding plate for chip components, and is particularly used for handling, for example, applying external electrodes to chip components such as micro multilayer capacitors and resistors. This invention relates to a holding plate for chip components.

[Prior art]

An example of a conventional holding plate for chip components is disclosed in Japanese Patent Application Laid-open No. 1983-1991, published on November 22, 1986.
No. 264,787. As shown in FIG. 7, this chip component holding plate 1 includes a sheet member 2 made of an elastic material, and the sheet member 2 has a large number of through holes 3 formed therein. A magnetic attraction plate 4 made of a material capable of magnetic attraction is integrally formed on one side of the sheet member 2, and a magnetic attraction plate 4 is provided at a position corresponding to each through hole 3 of the sheet member 2. A through hole 5 larger than the through hole 3 is formed. and,
The magnetic attraction plate 4 is integrally molded with the sheet member 2 so that its main surface and the main surface of the sheet member 2 are flush with each other.

[Problem to be solved by the invention]

In order to apply an external electrode to a chip component using such a holding plate 1, first, as shown in FIG. 8, the chip component 6 is press-fitted into the through hole 3 of the holding plate 1, and then The magnetic force of the plate 7 attracts the magnetic attraction plate 4 to support the holding plate 1. Since the magnetic attraction plate 4 is thus attracted by the magnetic force of the magnet plate 7, it is most desirable that the two be in close contact with each other.

However, since the respective main surfaces are formed flush with each other, when the chip component 6 is press-fitted into the through hole 3 of the sheet member 2, the sheet member 2 undergoes elastic deformation as shown in FIG. The main surface may protrude slightly. This phenomenon is particularly noticeable in high-temperature conditions because the coefficients of thermal expansion are different between the two. When the sheet member 2 is deformed in this way, the adhesion between the magnet plate 7 and the magnetic attraction plate 4 deteriorates, and the attraction of the magnetic attraction plate 4 becomes unstable.As a result, the attached external electrode There was a problem that the accuracy was not good.

Therefore, the main object of the present invention is to provide a holding plate for chip components on which external electrodes can be applied with high precision.

[Means to solve the problem]

The present invention comprises a sheet member made of an elastic material, a large number of through holes formed in the sheet member and capable of elastically holding chip components, and a material formed on at least one side of the sheet member and capable of magnetic attraction. In a holding plate for a chip component, the main surface of the sheet member is connected to the main surface of the magnetic adsorption plate, and the holding plate is provided with a magnetic adsorption plate in which a through hole larger than the through hole is formed at a position corresponding to each through hole of the sheet member. This is a holding plate for chip components, characterized by being formed concave from the surface.

[Effect]

Even if the sheet member is deformed by press-fitting a chip component into the through-hole of the sheet member or due to thermal expansion of the sheet member, the main surface of the sheet member is pre-concave than the main surface of the magnetic attraction plate. , the sheet member does not protrude from the main surface of the magnetic attraction plate.

〔Effect of the invention〕

According to this invention, since the sheet member does not protrude beyond the main surface of the magnetic attraction plate, the magnetic attraction plate and the attraction magnet plate are in complete contact with each other. Therefore, since the magnetic attraction plate can be supported stably and reliably, handling operations such as attaching external electrodes to chip components, marking them, and measuring the characteristics of chip components are facilitated. Therefore, an improvement in accuracy can be expected.

The above objects, other objects, features and advantages of the present invention will become more apparent from the following detailed description of embodiments with reference to the drawings.

〔Example〕

Referring to FIGS. 1, 2, and 3, a chip component holding plate 10 includes a sheet member 12 made of an elastic material such as silicone rubber, and a flexible material such as stainless steel (SUS430). Magnetic attraction plate 1 made of an iron-based alloy having a material capable of magnetic attraction
4 and a laminate structure. At this time, the sheet member 12
The main surface of the sheet member 12 is formed to be recessed by, for example, about 0.1 mm from the main surface of the magnetic attraction plate 14, that is, the main surface of the sheet member 12 and the main surface of the magnetic attraction plate 14 have a step difference. .

A plurality of through holes 16 are formed in the vertical and horizontal directions of this sheet member 12, respectively. The inner diameter of the through hole 16 is formed into a rectangular cross section that is approximately the same as or slightly smaller than the outer shape of the chip component (not shown). The reason why the slightly small through holes 16 are formed in this way is to hold the chip components by the elastic force of the sheet member 120 by pushing (press fitting) the chip components into the through holes 16.

A circular through hole 17 larger than the inner diameter of the through hole 16 is formed in the magnetic attraction plate 14 corresponding to each position of the plurality of through holes 16 in the sheet member 12. This magnetic attraction plate 14, which surrounds the rectangular through hole 16, is attracted by the magnetic force of a magnet plate 38, which will be described later, to hold the holding plate IO.
used to support.

Positioning holes 18a and 18b may be formed near both ends of the holding plate 10 in the longitudinal (or lateral) center.

Next, a method for manufacturing the holding plate IO will be briefly explained with reference to FIG. 4. A recess having a shape corresponding to the planar shape of the holding plate 10 is formed in the first mold (lower mold) 20, and the depth of the recess is selected to be approximately equal to the thickness of the holding plate 10. A rectangular column-shaped molding bottle 22 is formed upright on the bottom surface of the recess to form each through-hole 16 of the sheet member 12. Then, a mold release agent 24 is applied to the bottom surface of the recess of the first mold 20.

On the other hand, a magnetic attraction plate 14 is prepared in which circular through holes 17 are formed at positions corresponding to the plurality of through holes 16 by, for example, press molding or etching. This magnetic attraction plate 14 is coated with a braker 26 on its upper surface, positioned so that each circular through hole 17 is inserted into the molding bottle 22, and its lower surface is placed on the bottom surface of the recess (releasing agent 24). ) into the first mold 20 so as to be in contact with each other. Then, liquid silicone rubber, which is the material of the sheet member 12, is injected into the first mold 20.

A second mold 28 whose lower surface is coated with a mold release agent 24 is placed on top of the first mold 20, and the silicone rubber is cured by heating the entire mold. As a result, as shown in FIGS. 1 to 3, each through hole 1
The sheet member 12 made of silicone rubber and the magnetic attraction plate 14 are integrally molded.

Next, an example of the process of applying external electrodes to chip components using the holding plate 10 of this embodiment will be described with reference to FIGS. 5A to 5E.

First, as shown in FIG. 5A, the holding plate 10 is appropriately positioned with the magnetic attraction plate 14 facing downward;
A transfer plate 30 is placed on the upper surface of the sheet member 12. The transfer plate 30 has funnel-shaped guide holes 32 formed at positions corresponding to the plurality of through holes 16 in the holding plate 10 , that is, the sheet member 12 . Then, a large number of chip components 34 such as multilayer capacitors are supplied to the upper surface of the transfer plate 30, and the holding plate 10 and the transfer plate 30 are rocked back and forth from side to side. At this time, the chip component 34 fits into each guide hole 32,
It is brought to the upper position of each through hole 16.

Subsequently, as shown in FIG. 5B, press bottles 36 are inserted through the guide holes 32 from above each guide hole 32. By inserting this press pin 36, the chip component 34
One end (the lower end in FIG. 5B) of the chip component 34 is press-fitted into the through hole 16 of the sheet member 12, and the chip component 34 is inserted into the through hole 16, that is, the sheet member 12, with the other end protruding from the surface of the sheet member 12. It is held elastically by. At this time, if the insertion stroke of the press pin 36 is made constant, the lengths of the other ends (the upper ends in FIG. 5B) of the chip components 34 protruding from the surface of the sheet member 12 will be uniform.

Subsequently, as shown in FIG. 5C, the holding plate 10 elastically holding the plurality of through-holes 16 and the hep parts 34 is turned upside down, so that the magnetic attraction plate 14 faces upward. In this state, the attraction plate 14 is attracted by the magnetic force of the magnet plate 38. At this time, since the magnetic attraction plate 14 is flexible, if the attraction surface of the magnetic plate 38 is a flat surface, the chip component holding plate 10 will not be warped, and therefore the sheet The other end (5th C) of the plurality of chip components 34 protruding downward from the member 12
(lower end in the figure) will be flush with each other.

Further, as shown in FIG. 5D, the main surface of the sheet member 12 is recessed from the main surface of the magnetic attraction plate 14, that is, the sheet member 12 and the magnetic attraction plate 14 are formed with a step. Therefore, even if the sheet member 12 is deformed due to elastic deformation or thermal expansion, the magnetic attraction plate 1
It does not protrude beyond the main surface of 4. Therefore, the magnet plate 38 and the magnetic attraction plate 14 are completely pressed together, and the magnetic attraction plate 14 is stably and reliably attracted by the magnetic force of the magnet plate 38, thereby supporting the holding plate 10.

The magnet plate 38 is supported in a suspended state by the support member 40. Magnet plate 3
A flat plate 42 on which a paste-like conductive paint such as silver, which is a material for the external electrodes, is spread thinly is placed below the electrodes 8 . Then, the support member 40 is lowered downward,
The tips of the plurality of chip components 34 held by the holding plate 10 are pressed against the flat plate 42. Therefore, the conductive paint adheres to the other end of each chip component 34. Thereafter, the support member 40, ie, the magnet plate 38, is pulled up and heated and dried. As a result, external electrodes are provided on the other ends of the plurality of held chip components 34 that are exposed from the sheet member 12.

Subsequently, as shown in FIG. 5E, another holding plate 10' having the same structure is prepared with the magnetic attraction plate 14 facing downward. Above another holding plate 10', a holding plate 10 holding a chip component 34 on which an external electrode was formed on the other end in the previous step is provided via a spacer 44, and a through hole 16 is provided above another holding plate 10'. and 16' are positioned to correspond to each other. After that, the press bin 36 is press-fitted from the top, and the plurality of chip parts 34
is transferred to another holding plate 10'. Therefore, the other end provided with the external electrode is inserted into each through hole 16' of another holding plate 10', and the one end not provided with the external electrode is kept away from the surface of the sheet member 12'. In the protruding state, the chip component 34 is elastically held by the holding plate 10'. This holding plate 1
0' is again brought to the step shown in FIG. 5C, and an external electrode is applied to one end of the chip component 34 to which no external electrode is applied. After heating and drying the external electrode at one end, the chip component 34 is pushed out from the holding plate 10' with a press pin, and the external electrode of the chip component 34 is subjected to a baking process. The integration with the plate 14 is not limited to the method using a mold as in the above-mentioned embodiment, but may also be performed by bonding with an adhesive or the like. Furthermore, in the above embodiment,
Although the through hole 16 that holds the chip component 34 is described as having a rectangular cross section, other shapes such as a round shape may also be used. Furthermore, the chip component 34 is not limited to the upright state as in the above-mentioned embodiments, but may be held horizontally.

Further, with reference to FIG. 6, a holding plate 50 according to another embodiment of the present invention includes a plate-shaped magnetic attraction plate 52 made of the same material as in the previous embodiment but having a thick wall.
A plurality of through holes 54 are formed in this plate 52 for magnetic attraction. Inside each through hole 54 is a rubber 5 having a through hole 56 of a size corresponding to the size of the chimp part.
The sun is formed. At this time, a step is formed between the main surface of the rubber 58 and the main surface of the magnetic attraction plate 52 so that the main surface of the rubber 58 is recessed. Even if the rubber 58 having the through hole 56 is arranged independently as in this embodiment, since the main surface of the rubber 58 is recessed than the main surface of the magnetic attraction plate 52, this embodiment In this example as well, the same effects as in the previous embodiment can be obtained.

In any of the above embodiments, the magnetic attraction plates 14 and 52 may have their own magnetic force, and in this case, the magnetic plate 38
may be a simple support plate without magnetic force.

[Brief explanation of the drawing]

FIG. 1, FIG. 2, and FIG. 3 are illustrative views showing one embodiment of the present invention, and in particular, FIG. 1 shows an enlarged sectional view of the main part,
FIG. 2 shows an enlarged plan view of the main parts, and FIG. 3 shows a plan view of the whole. FIG. 4 is a sectional view showing a method of manufacturing the holding plate of the embodiment shown in FIGS. 1 to 3. FIGS. 5A to 5E are diagrams showing the process of forming external electrodes on chip components using the holding plate of this embodiment, and in particular, FIG. 5A shows the process of positioning the chip components on each through hole of the holding plate. Fig. 5B shows the process of press-fitting the positioned chip component into the through hole, Fig. 5C shows the process of magnetically attracting the holding plate to the magnet plate and providing external electrodes, and Fig. 5D shows the process of press-fitting the positioned chip component into the through hole. An enlarged sectional view of the main part of FIG. 5C is shown, and FIG. 5E shows a process of transferring the chip component to another holding plate. FIG. 6 is a partially cutaway illustrative view showing another embodiment of the invention. Figure 7 is an enlarged sectional view of the main part showing the prior art17.5
4.56 indicates a through hole, 34 indicates a chip component, and 5th indicates a rubber. Patent Applicant Murata Manufacturing Co., Ltd. Representative Patent Attorney Yama 1) Yoshihiro Figure 8 is an enlarged cross-sectional view of the main part showing a state in which a holding plate is magnetically attracted to a magnet plate in the prior art. FIG. 9 is an enlarged sectional view of a main part showing the state of a conventional sheet member. In the figure, °lO is the holding plate, 12 is the sheet member, 14.52 is the magnetic attraction plate, 16°.

Claims (1)

[Scope of Claims] A sheet member made of an elastic material, a large number of through holes formed in the sheet member and capable of elastically holding chip components, and a plurality of through holes formed on at least one surface of the sheet member so that they can be magnetically attracted. A holding plate for a chip component, comprising a magnetic attraction plate made of a material and having through holes larger than each through hole formed at a position corresponding to each through hole of the sheet member, wherein the main surface of the sheet member is A holding plate for a chip component, characterized in that the plate is recessed from the main surface of the magnetic attraction plate.