JPH05317774A - Nozzle for coating ag paste and its manufacture method - Google Patents

Nozzle for coating ag paste and its manufacture method

Info

Publication number
JPH05317774A
JPH05317774A JP15562092A JP15562092A JPH05317774A JP H05317774 A JPH05317774 A JP H05317774A JP 15562092 A JP15562092 A JP 15562092A JP 15562092 A JP15562092 A JP 15562092A JP H05317774 A JPH05317774 A JP H05317774A
Authority
JP
Japan
Prior art keywords
paste
discharge holes
nozzle
horizontally
large number
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP15562092A
Other languages
Japanese (ja)
Inventor
Akio Sakihara
明男 先原
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Tanaka Kikinzoku Kogyo KK
Original Assignee
Tanaka Kikinzoku Kogyo KK
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tanaka Kikinzoku Kogyo KK filed Critical Tanaka Kikinzoku Kogyo KK
Priority to JP15562092A priority Critical patent/JPH05317774A/en
Publication of JPH05317774A publication Critical patent/JPH05317774A/en
Pending legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/741Apparatus for manufacturing means for bonding, e.g. connectors
    • H01L24/743Apparatus for manufacturing layer connectors
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/741Apparatus for manufacturing means for bonding, e.g. connectors
    • H01L2224/743Apparatus for manufacturing layer connectors

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Coating Apparatus (AREA)
  • Die Bonding (AREA)
  • Electrical Discharge Machining, Electrochemical Machining, And Combined Machining (AREA)
  • Nozzles (AREA)

Abstract

PURPOSE:To provide a nozzle for coating Ag paste which can form a film of uniform thickness when Ag past is discharged and applied on an IC lead frame, and its manufacturing method. CONSTITUTION:A nozzle 10 for applying Ag paste is provided with fine discharge holes 7 formed vertically and horizontally at the given interval on a stainless body, and the peripheries of a large number of fine discharge holes 7 are formed into the square pillar-shaped projections. A large number of fine discharge holes 7 are bored and disposed vertically and horizontally at the given interval of a stainless body, and then slits 8 are formed vertically and horizontally among a large number of fine discharge holes 7 respectively by wire cut discharge, and the peripheries of the discharge holes 7 are formed into the square pillar shape and projections are formed to manufacture the nozzle 10 for applying Ag paste.

Description

【発明の詳細な説明】Detailed Description of the Invention

【0001】[0001]

【産業上の利用分野】本発明は、ICリードフレーム上
にシリコンペレットを載せる前にAgペーストを吐出塗
布する為のノズル及びその製造方法に関する。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a nozzle for discharging and applying an Ag paste before placing a silicon pellet on an IC lead frame, and a manufacturing method thereof.

【0002】[0002]

【従来の技術】従来のAgペースト塗布用ノズルは、図
6に示すステンレス鋼ボディ1に、図7に示すように一
定間隔に碁盤の目状に穴2を穿設し、然る後図8に示す
ように穴2にステンレス鋼パイプ3を挿入してなるもの
である。
2. Description of the Related Art A conventional Ag paste coating nozzle is a stainless steel body 1 shown in FIG. 6 in which holes 2 are formed in a grid pattern at regular intervals as shown in FIG. The stainless steel pipe 3 is inserted into the hole 2 as shown in FIG.

【0003】ところで、かかるAgペースト塗布用ノズ
ル4は、ステンレス鋼ボディ1の穴2に、ステンレス鋼
パイプ3を挿入する際、穴2の内径よりもステンレス鋼
パイプ3の外径を僅かに(0.005〜0.01mm)大きくして打
ち込む為、ステンレス鋼パイプ3の外径が細かったり、
肉厚が薄かったりすると、打ち込み時に曲がってしま
う。従って、ステンレス鋼パイプ3の外径を太く肉厚も
厚くしていたので、狭いピッチのステンレス鋼パイプ3
を有するAgペースト塗布用ノズル4を作ることができ
なかった。この為、ICリードフレームにシリコンペレ
ットを載せる際に、ノズル4にてICリードフレーム上
にAgペーストを吐出塗布すると、ステンレス鋼パイプ
3のピッチが広く、外径を大きくしている分内径が大き
いことから、Agペーストの吐出量が多く、図9に示す
ように隣り同志の吐出されたAgペースト5に重なる部
分5aが発生し、その表面が図10に示すように波状とな
り、均一な厚さの薄膜を形成できなかった。
By the way, such an Ag paste coating nozzle 4 makes the outer diameter of the stainless steel pipe 3 slightly smaller than the inner diameter of the hole 2 (0.005) when the stainless steel pipe 3 is inserted into the hole 2 of the stainless steel body 1. ~ 0.01mm) Because it is driven in a large size, the outer diameter of the stainless steel pipe 3 is small,
If the wall is thin, it will bend when driving. Therefore, since the outer diameter of the stainless steel pipe 3 is large and the wall thickness is large, the stainless steel pipe 3 with a narrow pitch is used.
It was not possible to make the Ag paste coating nozzle 4 having the above. For this reason, when the silicon pellet is placed on the IC lead frame, if the Ag paste is discharged and applied onto the IC lead frame by the nozzle 4, the pitch of the stainless steel pipes 3 is wide and the inner diameter is large due to the large outer diameter. Therefore, the discharge amount of the Ag paste is large, and as shown in FIG. 9, a portion 5a overlapping the discharged Ag pastes 5 of adjacent ones is generated, and its surface becomes wavy as shown in FIG. 10 and has a uniform thickness. Could not be formed.

【0004】[0004]

【発明が解決しようとする課題】そこで本発明は、IC
リードフレーム上にAgペーストを吐出塗布した際、均
一な厚さの薄膜を形成できるAgペースト塗布用ノズル
とその製造方法を提供しようとするものである。
Therefore, the present invention is an IC
It is an object of the present invention to provide an Ag paste coating nozzle capable of forming a thin film having a uniform thickness when a Ag paste is discharged and coated on a lead frame, and a manufacturing method thereof.

【0005】[0005]

【課題を解決するための手段】上記課題を解決するため
の本発明のAgペースト塗布用ノズルは、ステンレス鋼
材のボディに、細い吐出孔が一定間隔に縦、横に多数配
列穿設され、この多数の細い吐出孔の周囲が夫々角柱状
の突起に形成されてなるものである。かかるAgペース
ト塗布用ノズルを作る本発明の製造方法は、ステンレス
鋼材のボディに、多数の細い吐出孔を一定間隔に、縦、
横に配列穿設し、次にこの多数の細い吐出孔同志の間を
ワイヤーカット放電により縦、横にスリットを形成し、
吐出孔の周囲を角柱状に残して突起を形成することを特
徴とする。
The Ag paste coating nozzle of the present invention for solving the above-mentioned problems has a large number of thin discharge holes vertically and horizontally arranged in a body of a stainless steel material at regular intervals. The periphery of a large number of thin discharge holes is formed by prism-shaped projections, respectively. The manufacturing method of the present invention for making such an Ag paste coating nozzle is such that a large number of thin discharge holes are formed in a stainless steel body at regular intervals in the vertical direction.
The holes are arranged side by side, and then slits are formed vertically and horizontally by wire cut discharge between the many thin discharge holes.
It is characterized in that the projection is formed while leaving the periphery of the discharge hole in a prismatic shape.

【0006】[0006]

【作用】上記構造の本発明のAgペースト塗布用ノズル
は、細い吐出孔が各々独立して角柱状の突起となって密
集配列されているので、ICリードフレーム上にAgペ
ーストを吐出した際、各吐出孔から吐出されたAgペー
スト量が少なく、従ってICリードフレーム上のAgペ
ーストは平坦になり、むらが無くなって、均一な厚さの
薄膜が形成される。また上記のAgペースト塗布用ノズ
ルの製造方法によれば、均一な厚さの薄膜を形成できる
優れたAgペースト塗布用ノズルを容易に且つ精度良く
製造できる。
In the Ag paste coating nozzle of the present invention having the above-described structure, since the thin discharge holes are independently arranged densely as prismatic projections, when the Ag paste is discharged onto the IC lead frame, The amount of Ag paste ejected from each ejection hole is small, so that the Ag paste on the IC lead frame becomes flat and uniform, and a thin film having a uniform thickness is formed. Further, according to the above method for manufacturing the Ag paste coating nozzle, an excellent Ag paste coating nozzle capable of forming a thin film having a uniform thickness can be manufactured easily and accurately.

【0007】[0007]

【実施例】本発明のAgペースト塗布用ノズル及びその
製造方法の一実施例を図によって説明する。図1に示す
直径25mm、高さ10mmのステンレス鋼ボディ1の先端面に
突設した高さ5mm、一辺10mmの角形の突起6の全面に、
図2に示すように 0.6mmピッチに縦、横に内径 0.3mmの
吐出孔7を 266本配列穿設し、次にこの多数の細い吐出
孔7同志の間をワイヤーカット放電により図3に示すよ
うに縦、横に幅 0.1mmのスリット8を形成し、吐出孔7
の周囲を図4に示すように一辺 0.5mmの角形で高さ5mm
の角柱状突起9となした。前記の角形の突起6は丸形の
場合もある。
DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of the Ag paste coating nozzle and manufacturing method of the present invention will be described with reference to the drawings. As shown in FIG. 1, on the entire surface of a square projection 6 having a height of 5 mm and a side of 10 mm protruding from the tip surface of a stainless steel body 1 having a diameter of 25 mm and a height of 10 mm,
As shown in FIG. 2, 266 discharge holes 7 having an inner diameter of 0.3 mm are arranged vertically and horizontally at a pitch of 0.6 mm. Next, as shown in FIG. Slits 8 with a width of 0.1 mm are formed vertically and horizontally, and the discharge holes 7
As shown in Fig. 4, the surrounding area is a square with a side of 0.5 mm and a height of 5 mm.
The prismatic protrusions 9 are formed. The rectangular protrusion 6 may be round.

【0008】このようにして製造したAgペースト塗布
用ノズル10は、細い吐出孔7が各々独立して角柱状突起
9をなして密集配設されているので、図5に示すように
ICリードフレーム11上にAgペースト12を吐出した
際、各吐出孔7から吐出されたAgペースト量が少な
く、従ってICリードフレーム11上のAgペースト12は
平坦になり、むらが無くなって、均一な厚さの薄膜が形
成される。
In the Ag paste coating nozzle 10 manufactured in this manner, the thin discharge holes 7 are individually arranged densely in the form of prismatic projections 9, so that as shown in FIG. When the Ag paste 12 is discharged onto the surface 11, the amount of the Ag paste discharged from each of the discharge holes 7 is small. Therefore, the Ag paste 12 on the IC lead frame 11 becomes flat, has no unevenness, and has a uniform thickness. A thin film is formed.

【0009】[0009]

【発明の効果】以上の通り本発明のAgペースト塗布用
ノズルによれば、ICリードフレーム上にAgペースト
を吐出した際、多数の角柱状突起の細い吐出孔から吐出
されたAgペースト量が少なく、従ってAgペーストは
平坦になり、むらが無くなって、均一な厚さの薄膜が形
成される。また、本発明のAgペースト塗布用ノズルの
製造方法によれば、上記の優れた効果のあるAgペース
ト塗布用ノズルを容易に且つ精度良く製造できる。
As described above, according to the Ag paste coating nozzle of the present invention, when the Ag paste is discharged onto the IC lead frame, the amount of the Ag paste discharged from the small discharge holes of the many prismatic projections is small. Therefore, the Ag paste becomes flat and uniform, and a thin film having a uniform thickness is formed. Further, according to the method for manufacturing the Ag paste coating nozzle of the present invention, the Ag paste coating nozzle having the above-mentioned excellent effects can be manufactured easily and accurately.

【図面の簡単な説明】[Brief description of drawings]

【図1】本発明のAgペースト塗布用ノズルの製造方法
の一実施例の工程を示す図である。
FIG. 1 is a diagram showing steps of an embodiment of a method for manufacturing an Ag paste coating nozzle of the present invention.

【図2】本発明のAgペースト塗布用ノズルの製造方法
の一実施例の工程を示す図である。
FIG. 2 is a diagram showing steps of an embodiment of a method for manufacturing a nozzle for applying Ag paste of the present invention.

【図3】本発明のAgペースト塗布用ノズルの製造方法
の一実施例の工程を示す図である。
FIG. 3 is a diagram showing steps of an embodiment of a method for manufacturing a nozzle for applying Ag paste of the present invention.

【図4】図3における吐出孔の要部拡大縦断面図であ
る。
FIG. 4 is an enlarged vertical sectional view of a main part of a discharge hole in FIG.

【図5】本発明のAgペースト塗布用ノズルよりAgペ
ーストをICリードフレーム上に吐出塗布して薄膜を形
成した状態を示す図である。
FIG. 5 is a view showing a state in which a thin film is formed by discharging Ag paste onto an IC lead frame from a nozzle for applying Ag paste of the present invention.

【図6】従来のAgペースト塗布用ノズルの製造方法の
工程を示す図である。
FIG. 6 is a diagram showing steps of a method for manufacturing a conventional Ag paste coating nozzle.

【図7】従来のAgペースト塗布用ノズルの製造方法の
工程を示す図である。
FIG. 7 is a diagram showing a step of a method for manufacturing a conventional Ag paste coating nozzle.

【図8】従来のAgペースト塗布用ノズルの製造方法の
工程を示す図である。
FIG. 8 is a diagram showing a step in a method for manufacturing a conventional Ag paste coating nozzle.

【図9】従来のAgペースト塗布用ノズルにより形成さ
れた薄膜の欠陥を示す要部平面図である。
FIG. 9 is a plan view of relevant parts showing defects in a thin film formed by a conventional Ag paste coating nozzle.

【図10】図9のA−A線側断面図である。10 is a sectional side view taken along the line AA of FIG. 9.

【符号の説明】[Explanation of symbols]

1 ステンレス鋼ボディ 7 吐出孔 8 スリット 9 角柱状突起 10 Agペースト塗布用ノズル 1 Stainless steel body 7 Discharge hole 8 Slit 9 Square columnar protrusion 10 Ag paste coating nozzle

Claims (2)

【特許請求の範囲】[Claims] 【請求項1】 ステンレス鋼材のボディに、細い吐出孔
が一定間隔に縦、横に多数配列穿設され、この多数の細
い吐出孔の周囲が夫々角柱状の突起に形成されてなるA
gペースト塗布用ノズル。
1. A body made of stainless steel is provided with a large number of thin discharge holes arranged vertically and horizontally at regular intervals, and the periphery of each of these thin discharge holes is formed as a prismatic projection.
Nozzle for paste application.
【請求項2】 ステンレス鋼材のボディに、多数の細い
吐出孔を一定間隔に縦、横に配列穿設し、次にこの多数
の細い吐出孔同志の間をワイヤーカット放電により縦、
横にスリットを形成し、吐出孔の周囲を角柱状に残して
突起を形成することを特徴とするAgペースト塗布用ノ
ズルの製造方法。
2. A body made of a stainless steel material is provided with a large number of thin discharge holes arranged vertically and horizontally at regular intervals, and then the plurality of thin discharge holes are vertically cut by wire cut discharge,
A method for manufacturing a Ag paste coating nozzle, characterized in that a slit is formed laterally, and a protrusion is formed while leaving the periphery of the discharge hole in a prismatic shape.
JP15562092A 1992-05-22 1992-05-22 Nozzle for coating ag paste and its manufacture method Pending JPH05317774A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP15562092A JPH05317774A (en) 1992-05-22 1992-05-22 Nozzle for coating ag paste and its manufacture method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP15562092A JPH05317774A (en) 1992-05-22 1992-05-22 Nozzle for coating ag paste and its manufacture method

Publications (1)

Publication Number Publication Date
JPH05317774A true JPH05317774A (en) 1993-12-03

Family

ID=15609992

Family Applications (1)

Application Number Title Priority Date Filing Date
JP15562092A Pending JPH05317774A (en) 1992-05-22 1992-05-22 Nozzle for coating ag paste and its manufacture method

Country Status (1)

Country Link
JP (1) JPH05317774A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE4123120A1 (en) * 1991-07-12 1993-01-21 Abb Patent Gmbh HV switch contact speed measuring appts. - has magnetic transmitter magnetising component, receiver detecting magnetised region and signal comparator deriving acceleration and hence speed
JP2005062886A (en) * 2003-08-14 2005-03-10 Fci Ferrule assembly for optical fibers

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE4123120A1 (en) * 1991-07-12 1993-01-21 Abb Patent Gmbh HV switch contact speed measuring appts. - has magnetic transmitter magnetising component, receiver detecting magnetised region and signal comparator deriving acceleration and hence speed
JP2005062886A (en) * 2003-08-14 2005-03-10 Fci Ferrule assembly for optical fibers

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